KR102549224B1 - Epoxy Resin Composition for Sealing Semiconductor - Google Patents
Epoxy Resin Composition for Sealing Semiconductor Download PDFInfo
- Publication number
- KR102549224B1 KR102549224B1 KR1020160137498A KR20160137498A KR102549224B1 KR 102549224 B1 KR102549224 B1 KR 102549224B1 KR 1020160137498 A KR1020160137498 A KR 1020160137498A KR 20160137498 A KR20160137498 A KR 20160137498A KR 102549224 B1 KR102549224 B1 KR 102549224B1
- Authority
- KR
- South Korea
- Prior art keywords
- epoxy resin
- resin composition
- weight
- semiconductor
- semiconductor encapsulation
- Prior art date
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 66
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 66
- 239000000203 mixture Substances 0.000 title claims abstract description 47
- 239000004065 semiconductor Substances 0.000 title claims abstract description 47
- 238000007789 sealing Methods 0.000 title claims description 3
- 238000005538 encapsulation Methods 0.000 claims abstract description 20
- 239000007822 coupling agent Substances 0.000 claims abstract description 17
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000000945 filler Substances 0.000 claims abstract description 11
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 229920005989 resin Polymers 0.000 claims description 13
- 239000011347 resin Substances 0.000 claims description 13
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000000377 silicon dioxide Substances 0.000 claims description 7
- 150000001875 compounds Chemical class 0.000 claims description 6
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 5
- 229920003986 novolac Polymers 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 3
- 235000010290 biphenyl Nutrition 0.000 claims description 3
- 239000004305 biphenyl Substances 0.000 claims description 3
- 239000003086 colorant Substances 0.000 claims description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 claims description 3
- 230000000996 additive effect Effects 0.000 claims 1
- -1 silane compound Chemical class 0.000 abstract description 5
- 229910000077 silane Inorganic materials 0.000 abstract description 2
- 125000000217 alkyl group Chemical group 0.000 abstract 1
- 230000000052 comparative effect Effects 0.000 description 24
- 238000000034 method Methods 0.000 description 13
- 238000010330 laser marking Methods 0.000 description 8
- 238000010521 absorption reaction Methods 0.000 description 6
- 239000008393 encapsulating agent Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000001721 transfer moulding Methods 0.000 description 5
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical group C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 230000007547 defect Effects 0.000 description 4
- 229920006336 epoxy molding compound Polymers 0.000 description 4
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical group CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 4
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 4
- 125000004169 (C1-C6) alkyl group Chemical group 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000001993 wax Substances 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 238000001879 gelation Methods 0.000 description 2
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 2
- 150000004668 long chain fatty acids Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- FUIQBJHUESBZNU-UHFFFAOYSA-N 2-[(dimethylazaniumyl)methyl]phenolate Chemical compound CN(C)CC1=CC=CC=C1O FUIQBJHUESBZNU-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- WPQPMUCUCNOIKJ-UHFFFAOYSA-N cyclohexa-2,4-dien-1-ylbenzene Chemical group C1C=CC=CC1C1=CC=CC=C1 WPQPMUCUCNOIKJ-UHFFFAOYSA-N 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- GPAYUJZHTULNBE-UHFFFAOYSA-N diphenylphosphine Chemical compound C=1C=CC=CC=1PC1=CC=CC=C1 GPAYUJZHTULNBE-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 239000000383 hazardous chemical Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 1
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 1
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 239000012188 paraffin wax Chemical class 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- RPGWZZNNEUHDAQ-UHFFFAOYSA-N phenylphosphine Chemical compound PC1=CC=CC=C1 RPGWZZNNEUHDAQ-UHFFFAOYSA-N 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5435—Silicon-containing compounds containing oxygen containing oxygen in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/52—Mounting semiconductor bodies in containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2190/00—Compositions for sealing or packing joints
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
본 발명은 에폭시 수지, 경화제, 충진제 및 커플링제를 포함하며, 상기 커플링제는 알킬기를 갖는 실란 화합물, 아미노실란 및 에폭시실란을 포함하는 반도체 봉지용 에폭시 수지 조성물을 제공한다.The present invention provides an epoxy resin composition for semiconductor encapsulation including an epoxy resin, a curing agent, a filler, and a coupling agent, wherein the coupling agent includes a silane compound having an alkyl group, aminosilane, and epoxysilane.
Description
본 발명은 반도체 봉지용 에폭시 수지 조성물에 관한 것이다.The present invention relates to an epoxy resin composition for semiconductor encapsulation.
반도체 봉지재는 반도체 소자를 밀봉시켜 반도체 회로를 외부의 충격 및 오염물질로부터 보호하는 역할을 하는 재료로서, 반도체의 생산성 및 신뢰성에 중대한 영향을 미치는 바, 반도체 제조공정에 있어 큰 비중을 차지하고 있다. 현재 반도체 봉지방법으로는 에폭시 몰딩 컴파운드(Epoxy Molding Compound, EMC)를 이용한 이송성형법이 주류를 이루고 있으며, EMC는 다른 재료에 비해 가격이 저렴하고 생산성이 월등하다는 장점을 지닌다.A semiconductor encapsulant is a material that serves to seal a semiconductor device to protect a semiconductor circuit from external impact and contaminants, and has a significant impact on productivity and reliability of semiconductors, and thus occupies a large proportion in the semiconductor manufacturing process. Currently, as a semiconductor encapsulation method, the transfer molding method using an epoxy molding compound (EMC) is the mainstream, and EMC has the advantage of being inexpensive and superior in productivity compared to other materials.
EMC 등으로 밀봉된 반도체 소자에는 제조회사, 제품명, 제조번호, 로트번호, 로고 또는 사용자의 요구에 따른 각종 문자 및 그림 등의 정보를 성형된 수지 봉지재 표면에 기록하는 마킹(Marking) 공정이 행하여 진다. 이러한 마킹 방법의 하나로 수지 조성물로 봉지된 반도체 소자의 표면에 자외선 경화성 잉크 등을 사용하여 마킹하는 잉크 마킹(Ink Marking)이 있다. 그러나, 잉크 마킹은 잉크 성분의 환경 유해 문제와 잉크 번짐 등 공정상 어려움이 존재하며, 마킹 후 잉크를 건조, 경화시키는 공정을 거쳐야 하므로 반도체 제조에 장시간이 소요되는 문제가 있다.For semiconductor devices sealed with EMC, etc., a marking process is performed to record information such as manufacturer, product name, manufacturing number, lot number, logo, or various characters and pictures according to the user's request on the surface of the molded resin encapsulant. lose One such marking method is ink marking, in which a surface of a semiconductor element sealed with a resin composition is marked using an ultraviolet curable ink or the like. However, ink marking presents difficulties in the process, such as environmental hazards of ink components and ink smearing, and requires a process of drying and curing the ink after marking, so there is a problem that it takes a long time to manufacture a semiconductor.
이러한 잉크 마킹의 문제점을 해결하기 위해, 레이저 빔(CO2 레이저, Nd:YAG 레이저 등)을 사용하여 반도체 소자의 봉지재 표면을 마킹하는 레이저 마킹(Laser Marking)이 도입되었다[대한민국 공개특허 제10-2011-0020382호 참조]. 이 방법은 처리 속도가 빠르고, 마킹이 반영구적이며, 비용이 저렴하다는 등의 장점이 있다. 레이저 마킹은 레이저가 수지 조성물로 형성된 표면에 조사될 때 빛을 받은 부분의 온도가 급격히 상승하고, 가열된 부분의 구성 성분 중에서 수지(유기물) 등 열에 약한 성분이 분해되어 일정 깊이로 파이게 되어 원래의 봉지재 표면과는 다른 새로운 표면이 드러나게 되는 현상을 이용한다. 이때 레이저 마킹으로 인해 새로 드러나게 된 표면(예컨대, 남아 있는 백색의 실리카)은 마킹되지 않은 주변 표면과는 다른 특성을 보여 마킹을 인식할 수 있게 된다.In order to solve the problem of such ink marking, laser marking for marking the surface of an encapsulant of a semiconductor device using a laser beam (CO 2 laser, Nd:YAG laser, etc.) has been introduced [Republic of Korea Patent Publication No. 10 -2011-0020382]. This method has advantages such as fast processing speed, semi-permanent marking, and low cost. In laser marking, when a laser is irradiated on a surface formed of a resin composition, the temperature of the part receiving the light rises rapidly, and among the components of the heated part, components that are weak to heat such as resin (organic matter) are decomposed and dug to a certain depth. It uses a phenomenon in which a new surface different from the surface of the encapsulant is revealed. At this time, the newly exposed surface (eg, remaining white silica) due to the laser marking shows different characteristics from the unmarked surrounding surface, so that the marking can be recognized.
그러나, 최근 반도체 장치의 두께 감소로 반도체 내부의 칩(Chip)과 상판 표면 간의 거리가 100㎛ 내외로 가까워지면서, 반도체 봉지 후 레이저 마킹시 레이저에 의한 분해로 발생하는 내부 보이드에 의해 직접적으로 칩이 손상되는 문제가 발생하게 되었다. 또한, 보이드가 위치한 부위의 마킹 후 표면은 활자의 인식율이 낮아지는 문제도 존재한다.However, as the thickness of the semiconductor device has recently decreased, the distance between the chip inside the semiconductor and the surface of the upper plate has become closer to around 100㎛. A damage problem has occurred. In addition, there is also a problem that the recognition rate of the type is lowered on the surface after marking the area where the void is located.
이에, 레이저 마킹 후 반도체 내부 보이드에 의한 칩의 손상 및 표면 인식 불량을 방지할 수 있는 반도체 봉지용 에폭시 수지 조성물에 대한 개발이 요구되는 실정이다.Therefore, there is a demand for development of an epoxy resin composition for semiconductor encapsulation capable of preventing chip damage and surface recognition defects caused by voids inside the semiconductor after laser marking.
본 발명은 레이저 마킹 후 반도체 내부 보이드에 의한 칩의 손상 및 표면 마킹 인식 불량을 방지할 수 있는 반도체 봉지용 에폭시 수지 조성물을 제공한다.The present invention provides an epoxy resin composition for semiconductor encapsulation capable of preventing chip damage and surface marking recognition defects due to voids inside semiconductors after laser marking.
본 발명은 상기 반도체 봉지용 에폭시 수지 조성물을 이용하여 봉지된 반도체 소자를 제공한다.The present invention provides a semiconductor device sealed using the epoxy resin composition for semiconductor encapsulation.
한편으로, 본 발명은 에폭시 수지, 경화제, 충진제 및 커플링제를 포함하며, 상기 커플링제는 하기 화학식 1로 표시되는 화합물, 아미노실란 및 에폭시실란을 포함하는 반도체 봉지용 에폭시 수지 조성물을 제공한다.On the other hand, the present invention provides an epoxy resin composition for semiconductor encapsulation including an epoxy resin, a curing agent, a filler, and a coupling agent, wherein the coupling agent includes a compound represented by Formula 1, aminosilane, and epoxysilane.
[화학식 1][Formula 1]
상기 식에서, In the above formula,
R1 및 R2는 각각 독립적으로 C1 내지 C6의 알킬기이다.
R 1 and R 2 are each independently a C 1 to C 6 alkyl group.
본 발명의 일 실시형태에서, 상기 커플링제는 에폭시 수지 조성물 전체 100 중량%에 대하여 0.05 내지 0.5 중량%로 포함될 수 있다.In one embodiment of the present invention, the coupling agent may be included in an amount of 0.05 to 0.5% by weight based on 100% by weight of the total epoxy resin composition.
본 발명의 일 실시형태에서, 상기 커플링제는 커플링제 전체 100 중량%에 대하여 화학식 1로 표시되는 화합물 10 내지 40 중량%, 아미노실란 10 내지 40 중량% 및 에폭시실란 40 내지 60 중량%를 포함할 수 있다.
In one embodiment of the present invention, the coupling agent may include 10 to 40% by weight of the compound represented by Formula 1, 10 to 40% by weight of aminosilane, and 40 to 60% by weight of epoxysilane, based on 100% by weight of the total coupling agent. can
다른 한편으로, 본 발명은 상기 반도체 봉지용 에폭시 수지 조성물을 이용하여 봉지된 반도체 소자를 제공한다.On the other hand, the present invention provides a semiconductor device encapsulated using the epoxy resin composition for semiconductor encapsulation.
본 발명에 따른 반도체 봉지용 에폭시 수지 조성물은 레이저 마킹 후 반도체 내부 보이드에 의한 칩의 손상 및 표면 마킹 인식 불량을 방지할 수 있다.The epoxy resin composition for semiconductor encapsulation according to the present invention can prevent chip damage and surface marking recognition defects due to voids inside semiconductors after laser marking.
이하, 본 발명을 보다 상세히 설명한다.
Hereinafter, the present invention will be described in more detail.
본 발명의 일 실시형태는 에폭시 수지, 경화제, 충진제 및 커플링제를 포함하며, 상기 커플링제는 하기 화학식 1로 표시되는 화합물, 아미노실란 및 에폭시실란을 포함하는 반도체 봉지용 에폭시 수지 조성물에 관한 것이다.An embodiment of the present invention relates to an epoxy resin composition for semiconductor encapsulation including an epoxy resin, a curing agent, a filler, and a coupling agent, wherein the coupling agent includes a compound represented by Formula 1 below, aminosilane, and epoxysilane.
[화학식 1][Formula 1]
상기 식에서, In the above formula,
R1 및 R2는 각각 독립적으로 C1 내지 C6의 알킬기이다.
R 1 and R 2 are each independently a C 1 to C 6 alkyl group.
본 명세서에서 사용되는 C1-C6의 알킬기는 탄소수 1 내지 6개로 구성된 직쇄형 또는 분지형의 1가 탄화수소를 의미하며, 예를 들어 메틸, 에틸, n-프로필, i-프로필, n-부틸, i-부틸, t-부틸, n-펜틸, n-헥실 등이 포함되나 이에 한정되는 것은 아니다.
As used herein, the C 1 -C 6 alkyl group refers to a straight-chain or branched monovalent hydrocarbon having 1 to 6 carbon atoms, and examples thereof include methyl, ethyl, n-propyl, i-propyl, and n-butyl. , i-butyl, t-butyl, n-pentyl, n-hexyl, and the like, but are not limited thereto.
본 발명의 일 실시형태에서, R1은 n-프로필이고, R2는 메틸일 수 있다.
In one embodiment of the invention, R 1 may be n-propyl and R 2 may be methyl.
본 발명의 일 실시형태에서, 상기 아미노실란으로는 N-페닐-3-아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필디메톡시메틸실란, 3-아미노프로필트리메톡시실란, 3-아미노프로필트리에톡시실란, 3-아미노프로필디메톡시메틸실란, N-메틸-3-아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필트리메톡시실란 등을 예로 들 수 있으며, 특히 N-페닐-3-아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필디메톡시메틸실란 또는 이들의 조합일 수 있다.In one embodiment of the present invention, the aminosilane is N-phenyl-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyldimethoxymethylsilane, 3-aminopropyltrimethoxysilane Toxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-methyl-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxy Silane and the like may be exemplified, particularly N-phenyl-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyldimethoxymethylsilane, or a combination thereof.
본 발명의 일 실시형태에서, 상기 에폭시실란으로는 트리메톡시[2-(7-옥사비시클로[4.1.0]헵트-3-일)에틸]실란, 3-글리시딜옥시프로필트리메톡시실란, 3-글리시딜옥시프로필트리에톡시실란, 3-글리시딜옥시프로필(디메톡시)메틸실란, 2-(3,4-에폭시사이클로헥실)에틸트리메톡시실란 등을 예로 들 수 있으며, 특히 트리메톡시[2-(7-옥사비시클로[4.1.0]헵트-3-일)에틸]실란일 수 있다.
In one embodiment of the present invention, the epoxysilane is trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane, 3-glycidyloxypropyltrimethoxy Examples include silane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy)methylsilane, 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and the like. , especially trimethoxy[2-(7-oxabicyclo[4.1.0]hept-3-yl)ethyl]silane.
상기 커플링제는 에폭시 수지 조성물 전체 100 중량%에 대하여 0.05 내지 0.5 중량%로 포함될 수 있으며, 상기 범위를 만족할 때 적절한 밀착성을 확보할 수 있다.
The coupling agent may be included in an amount of 0.05 to 0.5% by weight based on 100% by weight of the total epoxy resin composition, and proper adhesion can be secured when the above range is satisfied.
본 발명의 일 실시형태에서, 상기 커플링제는 커플링제 전체 100 중량%에 대하여 화학식 1로 표시되는 화합물 10 내지 40 중량%, 아미노실란 10 내지 40 중량% 및 에폭시실란 40 내지 60 중량%를 포함할 수 있다.In one embodiment of the present invention, the coupling agent may include 10 to 40% by weight of the compound represented by Formula 1, 10 to 40% by weight of aminosilane, and 40 to 60% by weight of epoxysilane, based on 100% by weight of the total coupling agent. can
상기 화학식 1로 표시되는 화합물의 함량이 10 중량% 미만인 경우, 내부 보이드 발생을 방지하고 표면 마킹 불량을 최소화하기 어려울 수 있고, 40 중량% 초과인 경우 경화성이 저하될 수 있다. 또한, 상기 아미노실란의 함량이 10 중량% 미만인 경우 내흡습성이 떨어질 수 있고, 40 중량% 초과인 경우 보이드가 발생할 수 있다. 아울러, 상기 에폭시실란의 함량이 40 중량% 미만인 경우, 내열성이 떨어질 수 있고, 60 중량% 초과인 경우 강도가 저하될 수 있다.
When the content of the compound represented by Formula 1 is less than 10% by weight, it may be difficult to prevent generation of internal voids and minimize surface marking defects, and when the content is greater than 40% by weight, curability may be reduced. In addition, when the content of the aminosilane is less than 10% by weight, moisture absorption resistance may be deteriorated, and when the content of aminosilane is greater than 40% by weight, voids may occur. In addition, when the content of the epoxysilane is less than 40% by weight, heat resistance may be deteriorated, and when the content of the epoxysilane is greater than 60% by weight, strength may be reduced.
본 발명의 일 실시형태에서, 상기 에폭시 수지는 열에 의해 경화제와 반응하여 경화되며, 경화 후 삼차원 망상구조를 가짐으로써 피착제에 강하고 견고하게 접착하는 성질과 내열성을 부여한다.In one embodiment of the present invention, the epoxy resin is cured by reacting with a curing agent by heat, and has a three-dimensional network structure after curing, thereby imparting properties of strongly and firmly adhering to an adherend and heat resistance.
이러한 에폭시 수지의 예로는 당해 분야에서 통상적으로 사용되고 있는, 비스페놀 A형, 지환형, 선형 지방족, (오르쏘)크레졸 노볼락형, 나프톨 노볼락형, 비페닐형, 다관능형, 나프탈렌형 및 디사이클로펜타디엔형 에폭시 수지를 단독으로 또는 2종 이상 혼합하여 사용할 수 있으며, 특히 비페닐형 에폭시 수지 및 다관능형 에폭시 수지 중 1종 이상을 포함할 수 있으나, 반드시 이에 한정되는 것은 아니다. 예를 들어, 1 분자 중에 에폭시기를 2개 이상 함유하는 에폭시 수지를 사용하며, 이들의 에폭시 당량은 150 내지 280이고, 연화점은 50 내지 120℃일 수 있다.Examples of such epoxy resins include bisphenol A type, alicyclic type, linear aliphatic type, (ortho)cresol novolak type, naphthol novolak type, biphenyl type, polyfunctional type, naphthalene type, and dicyclo type commonly used in the art. Pentadiene-type epoxy resins may be used alone or in combination of two or more, and in particular, at least one of a biphenyl-type epoxy resin and a multifunctional epoxy resin may be included, but is not necessarily limited thereto. For example, an epoxy resin containing two or more epoxy groups in one molecule is used, and the epoxy equivalent may be 150 to 280, and the softening point may be 50 to 120 °C.
상기 에폭시 수지는 에폭시 수지 조성물의 전체 중량에 대하여 2 내지 20 중량%, 특히 5 내지 10 중량%로 포함될 수 있다. 상기 에폭시 수지의 함량이 2 중량% 미만이면 접착성, 전기절연성, 흐름성 및 성형성이 저하될 수 있으며, 그 함량이 20 중량%를 초과하면 흡습량 증가로 반도체의 신뢰성이 불량해지고, 충진제의 상대적 함량 감소로 강도가 저하될 수 있다.
The epoxy resin may be included in an amount of 2 to 20% by weight, particularly 5 to 10% by weight, based on the total weight of the epoxy resin composition. If the content of the epoxy resin is less than 2% by weight, adhesion, electrical insulation, flowability and formability may be deteriorated, and if the content exceeds 20% by weight, the reliability of the semiconductor is poor due to an increase in moisture absorption, and the filler A decrease in relative content may result in a decrease in strength.
본 발명의 일 실시형태에서, 상기 경화제는 상기 에폭시 수지와 반응하여 조성물의 경화를 진행시키는 성분으로서, 내습성, 내열성, 보존성 등의 물성이 우수한 페놀 수지를 사용할 수 있으나, 이에 한정되는 것은 아니다. 상기 페놀 수지의 예로는 페놀 노볼락형 수지, 크레졸 노볼락형 수지, 페놀 알킬 수지, 페놀 자일록형 수지, 비스페놀 A로부터 합성된 각종 노볼락형 수지 및 디하이드로 비페닐로 이루어진 그룹에서 선택되는 적어도 하나 이상의 다가 페놀 화합물로서, 분자구조 내에 상기 에폭시 수지 성분과 반응하고 경화를 진행시키는 페놀성 하이드록시기를 2개 이상 함유할 수 있다. 일 예로서, 성형성 면에서 페놀 노볼락형 수지 및 페놀 자일록형 수지 중 1종 이상을 포함할 수 있다.In one embodiment of the present invention, the curing agent is a component that reacts with the epoxy resin to advance curing of the composition, and a phenol resin having excellent physical properties such as moisture resistance, heat resistance, and storage stability may be used, but is not limited thereto. Examples of the phenol resin include at least one selected from the group consisting of phenol novolak-type resins, cresol novolak-type resins, phenol alkyl resins, phenol xylok-type resins, various novolak-type resins synthesized from bisphenol A, and dihydrobiphenyl As the above polyhydric phenolic compound, two or more phenolic hydroxyl groups that react with the epoxy resin component and advance curing may be contained in the molecular structure. For example, in terms of moldability, at least one of a phenol novolac-type resin and a phenol xylock-type resin may be included.
상기 경화제는 에폭시 수지 조성물의 전체 중량에 대하여 1 내지 20 중량%, 특히 2 내지 6 중량%로 포함될 수 있다. 상기 경화제의 함량이 1 중량% 미만이면 경화성 및 성형성에 문제가 생길 수 있으며, 그 함량이 20 중량%를 초과하면 흡습량 증가로 신뢰성이 저하되고, 상대적으로 강도가 낮아질 수 있다.
The curing agent may be included in an amount of 1 to 20% by weight, particularly 2 to 6% by weight, based on the total weight of the epoxy resin composition. If the content of the curing agent is less than 1% by weight, problems may arise in curability and moldability, and if the content exceeds 20% by weight, reliability may decrease due to an increase in moisture absorption, and strength may be relatively low.
본 발명의 일 실시형태에서, 상기 충진제는 봉지재의 강도를 향상시키고 흡습량을 낮추기 위한 성분으로, 예를 들어 실리카, 실리카 나이트라이드, 알루미나, 알루미늄 나이트라이드, 보론 나이트라이드 등의 무기 충진제를 단독으로 또는 2종 이상을 조합하여 사용할 수 있다. 일 예로, 상기 충진제로서 평균 구형화도가 0.92 이상이고, 평균 입경이 0.1 내지 18㎛인 용융 또는 합성 실리카를 사용할 때 기계적 강도를 향상시킬 수 있고 저흡습을 통한 신뢰성을 향상시킬 수 있다.In one embodiment of the present invention, the filler is a component for improving the strength of the encapsulant and lowering the moisture absorption amount, for example, inorganic fillers such as silica, silica nitride, alumina, aluminum nitride, boron nitride, etc. alone Or it can use in combination of 2 or more types. For example, when fused or synthetic silica having an average sphericity of 0.92 or more and an average particle diameter of 0.1 to 18 μm is used as the filler, mechanical strength can be improved and reliability can be improved through low moisture absorption.
본 발명의 일 실시형태에서, 상기 충진제는 에폭시 수지 조성물 전체 중량에 대해 88 내지 91 중량%로 포함될 수 있다. 상기 충진제의 함량이 88 중량% 미만인 경우, 흡습량 증가로 강도가 저하되고, 리플로우 솔더링 과정후 밀착성이 떨어질 수 있으며, 충진제의 함량이 91 중량%를 초과하면 점도 증가 및 흐름성 저하로 성형성이 불량해질 수 있다.
In one embodiment of the present invention, the filler may be included in 88 to 91% by weight based on the total weight of the epoxy resin composition. When the content of the filler is less than 88% by weight, strength decreases due to an increase in moisture absorption, and adhesion after the reflow soldering process may decrease. this can go bad
본 발명의 일 실시형태에 따른 에폭시 수지 조성물은 그 목적을 벗어나지 않는 범위에서 반도체용 봉지재에 일반적으로 사용되는 첨가제를 추가적으로 포함할 수 있다. 예컨대, 상기 에폭시 수지와 경화제의 경화반응을 촉진시키기 위해 경화촉진제를 첨가할 수 있다. The epoxy resin composition according to an embodiment of the present invention may additionally include additives generally used in encapsulants for semiconductors within a range that does not deviate from its purpose. For example, a curing accelerator may be added to promote a curing reaction between the epoxy resin and the curing agent.
상기 경화촉진제는 당해 분야에서 통상적으로 사용되는 것이라면 특별한 제한은 없으나, 예를 들어, 2-메틸이미다졸, 2-에틸-4-메틸이미다졸, 2-페닐이미다졸 등의 이미다졸 화합물; 트리에틸아민, 트리부틸아민, 벤질디메틸아민 등의 아민 화합물; 2-(디메틸아미노메틸)페놀, 2,4,6-트리스(디메틸아미노메틸) 페놀, 1,8-디아자비사이클로(5,4,0)운덱-7-엔 등의 삼급 아민 화합물; 및 페닐포스핀, 디페닐포스핀, 트리페닐포스핀, 트리부틸포스핀, 트리(p-메틸페닐)포스핀 등의 유기 포스핀 화합물을 단독으로 또는 2종 이상 혼합하여 사용할 수 있다.The curing accelerator is not particularly limited as long as it is commonly used in the field, but examples thereof include imidazole compounds such as 2-methylimidazole, 2-ethyl-4-methylimidazole, and 2-phenylimidazole. ; amine compounds such as triethylamine, tributylamine, and benzyldimethylamine; tertiary amine compounds such as 2-(dimethylaminomethyl)phenol, 2,4,6-tris(dimethylaminomethyl)phenol, and 1,8-diazabicyclo(5,4,0)undec-7-ene; And organic phosphine compounds such as phenylphosphine, diphenylphosphine, triphenylphosphine, tributylphosphine, and tri(p-methylphenyl)phosphine may be used alone or in combination of two or more.
상기 경화촉진제는 에폭시 수지 조성물의 전체 중량에 대하여 0.05 내지 5 중량%의 함량으로 포함될 수 있다. 상기 경화촉진제의 함량이 0.05 중량% 미만이면 경화성이 저하될 수 있으며, 그 함량이 5 중량%를 초과하면 과경화로 인해 흐름성이 저하될 수 있다.
The curing accelerator may be included in an amount of 0.05 to 5% by weight based on the total weight of the epoxy resin composition. If the content of the curing accelerator is less than 0.05% by weight, curability may be reduced, and if the content exceeds 5% by weight, flowability may be reduced due to overcuring.
또한, 본 발명의 일 실시형태에 따른 에폭시 수지 조성물은 장쇄지방산, 장쇄지방산의 금속염, 파라핀 왁스, 카나바 왁스, 실리콘 오일 등의 이형제 및 카본블랙, 산화철, 벵갈라 등의 착색제 중에서 선택되는 하나 이상의 첨가제를 에폭시 수지 조성물의 전체 중량에 대하여 0.1 내지 10 중량%의 범위로 포함할 수 있다.
In addition, the epoxy resin composition according to an embodiment of the present invention includes one or more additives selected from release agents such as long-chain fatty acids, metal salts of long-chain fatty acids, paraffin wax, carnabar wax, and silicone oil, and colorants such as carbon black, iron oxide, and bengala. It may include in the range of 0.1 to 10% by weight based on the total weight of the epoxy resin composition.
본 발명에 따른 반도체 봉지용 에폭시 수지 조성물은 당해 분야에 통상적인 방법, 예를 들어 반바리 믹서, 니더, 롤, 단축 또는 이축의 압출기 및 코니더 등을 이용하는 용융 혼련 방법으로 제조될 수 있다. 예를 들어, 상술한 바와 같은 각 성분들을 균일하게 섞은 후, 용융 혼합기(heat kneader)를 이용하여 100 내지 130℃의 온도에서 용융 혼합하고, 상온으로 냉각시킨 다음, 분말 상태로 분쇄한 후, 블렌딩함으로써 에폭시 수지 조성물을 수득할 수 있다.
The epoxy resin composition for semiconductor encapsulation according to the present invention can be prepared by a conventional method in the art, for example, a melt-kneading method using a Banbari mixer, a kneader, a roll, a single- or double-screw extruder, and a conneader. For example, after uniformly mixing each component as described above, melting and mixing at a temperature of 100 to 130 ° C using a heat kneader, cooling to room temperature, pulverizing into powder, and blending By doing so, an epoxy resin composition can be obtained.
본 발명의 일 실시형태는 상기 반도체 봉지용 에폭시 수지 조성물을 이용하여 봉지된 반도체 소자를 제공한다. One embodiment of the present invention provides a semiconductor device sealed using the epoxy resin composition for semiconductor encapsulation.
본 발명의 일 실시형태에서, 상기 반도체 소자는 트랜지스터, 다이오드, 마이크로프로세서, 반도체 메모리 등일 수 있다.In one embodiment of the present invention, the semiconductor device may be a transistor, diode, microprocessor, semiconductor memory, and the like.
본 발명의 에폭시 수지 조성물을 이용하여 반도체 소자를 봉지하는 방법은 당해 분야에서 통상적인 방법, 예컨대 트랜스퍼 몰드, 컴프레션 몰드, 인젝션 몰드 등의 성형방법에 따라 수행될 수 있다.
A method of encapsulating a semiconductor device using the epoxy resin composition of the present invention may be performed according to a conventional method in the art, such as a transfer mold, a compression mold, an injection mold, or the like.
이하, 실시예, 비교예 및 실험예에 의해 본 발명을 보다 구체적으로 설명하고자 한다. 이들 실시예, 비교예 및 실험예는 오직 본 발명을 설명하기 위한 것으로, 본 발명의 범위가 이들에 국한되지 않는다는 것은 당업자에게 있어서 자명하다.
Hereinafter, the present invention will be described in more detail by Examples, Comparative Examples and Experimental Examples. These Examples, Comparative Examples and Experimental Examples are only for explaining the present invention, and it is obvious to those skilled in the art that the scope of the present invention is not limited thereto.
실시예Example 1 내지 4 및 1 to 4 and 비교예comparative example 1 내지 5: 반도체 봉지용 에폭시 수지 조성물의 제조 1 to 5: Preparation of epoxy resin composition for semiconductor encapsulation
하기 표 1에 제시한 바와 같은 조성으로 각 성분을 혼합한 후(단위: 중량%), 용융 혼합, 냉각, 분쇄 및 블렌딩 공정을 거쳐 반도체 봉지용 에폭시 수지 조성물을 수득하였다.
After mixing each component with the composition shown in Table 1 below (unit: weight%), melt mixing, cooling, grinding, and blending processes were performed to obtain an epoxy resin composition for semiconductor encapsulation.
1) Mitsubishi Chemical, YX-4000K(에폭시 당량 192, 녹는점 107℃)1) Mitsubishi Chemical, YX-4000K (epoxy equivalent 192, melting point 107℃)
2) Nippon Kayaku, NC-3000(에폭시 당량 278, 연화점 57℃)2) Nippon Kayaku, NC-3000 (epoxy equivalent 278, softening point 57℃)
3) Kolon, KPH-F2001(OH당량 103, 연화점 86℃)3) Kolon, KPH-F2001 (OH equivalent 103, softening point 86℃)
4) Meiwa Kasei, MEH-7800SS(OH당량 175, 연화점 66℃)4) Meiwa Kasei, MEH-7800SS (OH equivalent weight 175, softening point 66℃)
5) Denka, FB-975FD(비표면적 3.4m2/g, 평균입경 15.5㎛)5) Denka, FB-975FD (specific surface area 3.4m 2 /g, average particle diameter 15.5㎛)
6) Admatecs, FB-975FD(평균입경 0.5㎛)6) Admatecs, FB-975FD (average particle diameter 0.5㎛)
7) ShinEtsu, KBM-573(분자량 255.4)7) ShinEtsu, KBM-573 (molecular weight 255.4)
8) ShinEtsu, KBM-303(분자량 246)8) ShinEtsu, KBM-303 (molecular weight 246)
9) Dow Corning, 11-1009) Dow Corning, 11-100
10) ShinEtsu, KBM-602(분자량 206.4)10) ShinEtsu, KBM-602 (molecular weight 206.4)
11) Clariant, PED-522(Drop point 102℃)11) Clariant, PED-522 (Drop point 102℃)
12) Clariant, Wax-E(Drop point 81℃)12) Clariant, Wax-E (Drop point 81℃)
13) Mitsubishi Chemical, MA-600(평균입경 19nm)13) Mitsubishi Chemical, MA-600 (average particle diameter 19nm)
14) Hokko Chemical, TPP(녹는점 82℃)
14) Hokko Chemical, TPP (melting point 82℃)
실험예Experimental example 1: One:
상기 실시예 및 비교예에서 제조된 에폭시 수지 조성물의 물성을 하기의 방법으로 측정하고, 그 결과를 하기 표 2에 나타내었다.
The physical properties of the epoxy resin compositions prepared in the Examples and Comparative Examples were measured by the following method, and the results are shown in Table 2 below.
(1) 스파이럴 플로우(spiral flow)(1) Spiral flow
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물을 스파이럴 플로우 몰드를 이용하여 가열이송성형기(압력=70kg/㎠, 온도=175℃, 경화시간=120초)에서 몰딩한 후 제조물의 흐름성을 측정하였다.
After molding the epoxy resin composition prepared according to each Example and Comparative Example in a heat transfer molding machine (pressure = 70 kg / cm 2, temperature = 175 ° C, curing time = 120 seconds) using a spiral flow mold, the flowability of the product was measured. measured.
(2) 겔 타임(gelation time)(2) gelation time
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물을 소량으로 겔 타이머에 넓고 고르게 펴서, 제조물의 겔화 소요시간을 측정하였다.
A small amount of the epoxy resin composition prepared according to each Example and Comparative Example was spread widely and evenly on a gel timer, and the gelation time of the product was measured.
(3) 유리전이온도(Tg)(3) Glass transition temperature (Tg)
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물을 가열이송 성형기에서 몰딩한 후, TMA(Thermomechanical Analyser)(승온 속도 10℃/분, 온도변화 범위 20~270℃)를 이용하여 유리전이온도를 측정하였다.
After molding the epoxy resin composition prepared according to each Example and Comparative Example in a heat transfer molding machine, the glass transition temperature was measured using a thermomechanical analyzer (TMA) (heating rate 10 ° C / min, temperature change range 20 ~ 270 ° C). measured.
(4) 선팽창계수(4) Coefficient of linear expansion
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물을 가열이송 성형기에서 몰딩한 후, TMA(Thermomechanical Analyser)를 이용하여 유리전이온도 이전의 선팽창 계수 α1 및 유리전이온도 이후의 선팽창 계수 α2를 측정하였다.
After molding the epoxy resin composition prepared according to each Example and Comparative Example in a heat transfer molding machine, the linear expansion coefficient α1 before the glass transition temperature and the linear expansion coefficient α2 after the glass transition temperature were measured using a thermomechanical analyzer (TMA). .
(5) 휨성(warpage)(5) Warpage
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물을 이용하여 FBGA(fine pitch ball grid array) 패키지를 트랜스퍼 몰딩 방식(175℃, 70 kgf/cm2, 100초)으로 봉지시킨 후, 패키지 상하부의 위치 편차를 휨성 측정장비(AXP, Akrometrix, Inc.)로 측정하여 휘는 현상을 확인하였다
After sealing the FBGA (fine pitch ball grid array) package by transfer molding method (175 ℃, 70 kgf / cm 2 , 100 seconds) using the epoxy resin composition prepared according to each Example and Comparative Example, the top and bottom of the package The bending phenomenon was confirmed by measuring the positional deviation with a bending measurement equipment (AXP, Akrometrix, Inc.)
(6) 경화성(cure-ability)(6) cure-ability
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물을 이용하여 경화거동측정기(curelastometer, Curelastometer7, A&D Company Ltd)로 경화성을 평가하였다(온도: 180℃, 경화시간=300초, 최대 toque 측정).
Curing properties were evaluated using a curing behavior measuring instrument (curelastometer, Curelastometer7, A & D Company Ltd) using the epoxy resin composition prepared according to each Example and Comparative Example (temperature: 180 ° C, curing time = 300 seconds, maximum torque measurement).
(7) 내부 보이드(기공)(7) Internal voids (pores)
각 실시예 및 비교예에 따라 제조된 에폭시 수지 조성물에 대해 BGA(ball grid array) 반도체 패키지를 이용하여 레이저 마킹 이후 내부 보이드 발생 여부를 확인하였다.
For the epoxy resin composition prepared according to each Example and Comparative Example, it was confirmed whether internal voids were generated after laser marking using a BGA (ball grid array) semiconductor package.
상기 표 2의 결과에서 알 수 있는 바와 같이, 실시예 1 내지 4의 에폭시 수지 조성물은 레이저 마킹 후 반도체 내부 보이드의 발생이 비교예 1, 2 및 4에 비해 감소되고, 이에 따라 내부 보이드에 의한 칩의 손상 및 표면 마킹 인식 불량을 방지할 수 있는 것으로 나타났다. 또한, 실시예 1 내지 4의 에폭시 수지 조성물은 휨성 및 경화성도 우수한 것으로 나타났으나, 비교예 3의 에폭시 수지 조성물은 휨성이 떨어지고 비교예 5의 에폭시 수지 조성물은 경화성이 떨어지는 것으로 나타났다.
As can be seen from the results of Table 2, the epoxy resin compositions of Examples 1 to 4 have a reduced generation of semiconductor internal voids after laser marking compared to Comparative Examples 1, 2 and 4, and accordingly, chips caused by internal voids. It has been shown that it can prevent damage and poor recognition of surface markings. In addition, the epoxy resin compositions of Examples 1 to 4 were found to have excellent warpage and curability, but the epoxy resin composition of Comparative Example 3 had poor warpage and the epoxy resin composition of Comparative Example 5 had poor curability.
이상으로 본 발명의 특정한 부분을 상세히 기술하였는 바, 본 발명이 속한 기술분야에서 통상의 지식을 가진 자에게 있어서 이러한 구체적인 기술은 단지 바람직한 구현예일 뿐이며, 이에 본 발명의 범위가 제한되는 것이 아님은 명백하다. 본 발명이 속한 기술분야에서 통상의 지식을 가진 자라면 상기 내용을 바탕으로 본 발명의 범주 내에서 다양한 응용 및 변형을 행하는 것이 가능할 것이다.Having described specific parts of the present invention in detail above, it is clear that these specific techniques are only preferred embodiments for those skilled in the art to which the present invention belongs, and the scope of the present invention is not limited thereto. do. Those skilled in the art to which the present invention pertains will be able to make various applications and modifications within the scope of the present invention based on the above information.
따라서, 본 발명의 실질적인 범위는 첨부된 특허청구범위와 그의 등가물에 의하여 정의된다고 할 것이다.Accordingly, the substantial scope of the present invention will be defined by the appended claims and equivalents thereof.
Claims (9)
상기 커플링제는 커플링제 전체 100 중량%에 대하여, 하기 화학식 1로 표시되는 화합물 10 내지 40 중량%, 아미노실란 10 내지 40 중량% 및 에폭시실란 40 내지 60 중량%를 포함하는 반도체 봉지용 에폭시 수지 조성물:
[화학식 1]
상기 식에서,
R1은 n-프로필이고, R2는 메틸이다.Including an epoxy resin, a curing agent, a filler and a coupling agent,
The coupling agent is an epoxy resin composition for semiconductor encapsulation comprising 10 to 40% by weight of a compound represented by Formula 1, 10 to 40% by weight of aminosilane, and 40 to 60% by weight of epoxysilane, based on 100% by weight of the total coupling agent. :
[Formula 1]
In the above formula,
R 1 is n-propyl and R 2 is methyl.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160137498A KR102549224B1 (en) | 2016-10-21 | 2016-10-21 | Epoxy Resin Composition for Sealing Semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020160137498A KR102549224B1 (en) | 2016-10-21 | 2016-10-21 | Epoxy Resin Composition for Sealing Semiconductor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20180043986A KR20180043986A (en) | 2018-05-02 |
| KR102549224B1 true KR102549224B1 (en) | 2023-06-30 |
Family
ID=62183624
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020160137498A KR102549224B1 (en) | 2016-10-21 | 2016-10-21 | Epoxy Resin Composition for Sealing Semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR102549224B1 (en) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100616213B1 (en) * | 2004-12-22 | 2006-08-25 | 제일모직주식회사 | Epoxy resin composition for encapsulating a semiconductor device |
| KR20110020382A (en) | 2009-08-24 | 2011-03-03 | 세미텍 주식회사 | Epoxy resin molding compound with superior marking resolution |
| KR101279973B1 (en) * | 2009-12-31 | 2013-07-05 | 제일모직주식회사 | Epoxy resin composition for encapsulating semiconductor element and semiconductor element package using the same |
-
2016
- 2016-10-21 KR KR1020160137498A patent/KR102549224B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| KR20180043986A (en) | 2018-05-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101076977B1 (en) | Resin composition for encapsulating semiconductor chip and semiconductor device | |
| KR950005309B1 (en) | Epoxy resin composition for encapsulating semi-conductors | |
| TWI388620B (en) | Epoxy resin composition for encapsulating semiconductors, and semiconductor device | |
| WO2019131095A1 (en) | Encapsulating epoxy resin composition for ball grid array package, cured epoxy resin object, and electronic component/device | |
| JP2015174874A (en) | Resin composition for encapsulating semiconductor and semiconductor device | |
| JP5386836B2 (en) | Semiconductor sealing resin composition and semiconductor device | |
| JP3562565B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
| KR20030008142A (en) | Semiconductor encapsulating epoxy resin composition and semiconductor device | |
| JP5386837B2 (en) | Semiconductor sealing resin composition and semiconductor device | |
| JP2006265415A (en) | Epoxy resin composition and semiconductor device | |
| KR102549224B1 (en) | Epoxy Resin Composition for Sealing Semiconductor | |
| KR100585945B1 (en) | Epoxy Resin Composition for Encapsulation of Semiconductor Device | |
| JP5057015B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
| KR20170013644A (en) | Epoxy Resin Composition for Sealing Semiconductor | |
| JP2006213849A (en) | Sealing resin composition and semiconductor sealing apparatus | |
| KR20140133178A (en) | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated by using the same | |
| KR101997349B1 (en) | Epoxy resin composition | |
| JP4835851B2 (en) | Epoxy resin composition for semiconductor encapsulation and semiconductor device | |
| JP2007262384A (en) | Epoxy resin composition for sealing semiconductor and semiconductor device | |
| KR101289302B1 (en) | Epoxy resin composition for sealing semiconductor and semiconductor device sealed using the same | |
| KR102545654B1 (en) | Epoxy Resin Composition for Sealing Semiconductor | |
| CN111492009A (en) | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same | |
| KR101114470B1 (en) | Epoxy resin composition | |
| KR20190081995A (en) | Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated using the same | |
| JP2001247652A (en) | Epoxy resin composition and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal | ||
| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |