KR102542281B1 - 이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 - Google Patents
이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 Download PDFInfo
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- KR102542281B1 KR102542281B1 KR1020217005460A KR20217005460A KR102542281B1 KR 102542281 B1 KR102542281 B1 KR 102542281B1 KR 1020217005460 A KR1020217005460 A KR 1020217005460A KR 20217005460 A KR20217005460 A KR 20217005460A KR 102542281 B1 KR102542281 B1 KR 102542281B1
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- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/32—Carbides
- C23C16/325—Silicon carbide
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/04—Coating on selected surface areas, e.g. using masks
- C23C16/045—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/36—Carbonitrides
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- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- C23C16/448—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for generating reactive gas streams, e.g. by evaporation or sublimation of precursor materials
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
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- C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
- C23C16/507—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges using external electrodes, e.g. in tunnel type reactors
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020237019109A KR20230088843A (ko) | 2018-07-24 | 2019-07-22 | 이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US16/044,357 US20180347035A1 (en) | 2012-06-12 | 2018-07-24 | Conformal deposition of silicon carbide films using heterogeneous precursor interaction |
US16/044,357 | 2018-07-24 | ||
PCT/US2019/042821 WO2020023385A1 (en) | 2018-07-24 | 2019-07-22 | Conformal deposition of silicon carbide films using heterogeneous precursor interaction |
Related Child Applications (1)
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KR1020237019109A Division KR20230088843A (ko) | 2018-07-24 | 2019-07-22 | 이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 |
Publications (2)
Publication Number | Publication Date |
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KR20210024673A KR20210024673A (ko) | 2021-03-05 |
KR102542281B1 true KR102542281B1 (ko) | 2023-06-13 |
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KR1020217005460A KR102542281B1 (ko) | 2018-07-24 | 2019-07-22 | 이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 |
KR1020237019109A KR20230088843A (ko) | 2018-07-24 | 2019-07-22 | 이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 |
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KR1020237019109A KR20230088843A (ko) | 2018-07-24 | 2019-07-22 | 이종 전구체 상호 작용을 사용한 탄화 실리콘 막의 컨포멀한 증착 |
Country Status (3)
Country | Link |
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KR (2) | KR102542281B1 (zh) |
CN (2) | CN117660941A (zh) |
WO (1) | WO2020023385A1 (zh) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018063825A1 (en) * | 2016-09-30 | 2018-04-05 | Lam Research Corporation | Remote plasma based deposition of graded or multi-layered silicon carbide film |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
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US6699784B2 (en) * | 2001-12-14 | 2004-03-02 | Applied Materials Inc. | Method for depositing a low k dielectric film (K>3.5) for hard mask application |
US7749563B2 (en) * | 2002-10-07 | 2010-07-06 | Applied Materials, Inc. | Two-layer film for next generation damascene barrier application with good oxidation resistance |
US7172792B2 (en) * | 2002-12-20 | 2007-02-06 | Applied Materials, Inc. | Method for forming a high quality low temperature silicon nitride film |
US7018560B2 (en) * | 2003-08-05 | 2006-03-28 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Composition for polishing semiconductor layers |
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