KR102540992B1 - Apparatus for treating substrate - Google Patents

Abstract

A substrate processing apparatus is provided. A substrate processing apparatus includes a substrate support unit for supporting a substrate, a support drive unit for rotating the substrate support unit with respect to a central axis of the substrate, and a long slit parallel to the surface of the substrate, and a liquid chemical for spraying a chemical solution onto the substrate. It includes a spraying unit and a spray driving unit for rotating the liquid chemical spraying unit based on a central axis of the substrate.

Description

Substrate treatment device {Apparatus for treating substrate}

The present invention relates to a substrate processing apparatus for applying a chemical liquid to a substrate.

When manufacturing a semiconductor device or a display device, various processes such as photography, etching, ashing, ion implantation, thin film deposition, and cleaning are performed. Here, the photo process includes coating, exposure, and developing processes. A photoresist is applied on a substrate (ie, application process), a circuit pattern is exposed on the substrate on which the photoresist film is formed (ie, exposure process), and the exposed area of the substrate is selectively developed (ie, development process).

Coating of the photoresist during the coating process may be performed by injecting the photoresist into the rotating substrate. At this time, some of the photoresist applied to the surface of the substrate may be separated from the substrate by centrifugal force. Scattered photoresist can be recovered by a separate means.

The problem to be solved by the present invention is to provide a substrate processing apparatus for applying a chemical liquid to a substrate.

The tasks of the present invention are not limited to the tasks mentioned above, and other tasks not mentioned will be clearly understood by those skilled in the art from the following description.

One aspect of the substrate processing apparatus of the present invention for achieving the above object is a substrate support for supporting a substrate, a support driver for rotating the substrate support with respect to a central axis of the substrate, and a surface of the substrate It includes a chemical spraying unit having parallel and long slits and spraying a chemical liquid onto the substrate, and a spray driving unit rotating the chemical liquid spraying unit with respect to a central axis of the substrate.

The injection driver moves the chemical liquid injection unit in a vertical direction.

The slits include a plurality of partial slits separated from each other by partition walls.

The plurality of partial slits are formed along one edge of the center of the chemical liquid spraying part in the length direction of the chemical liquid spraying part, or along the opposite edge from one edge of the chemical liquid spraying part in the longitudinal direction of the chemical liquid spraying part.

The amount of chemical liquid injected from the plurality of partial slits is differently determined according to a distance from the center of the chemical liquid spraying part in the longitudinal direction.

The amount of the liquid chemical sprayed from the plurality of partial slits is determined to be proportional to the linear velocity of the point where the chemical liquid is applied on the rotating surface of the substrate.

The plurality of partial slits have the same shape and size.

The plurality of partial slits have the same shape and different sizes.

The plurality of partial slits have a shape in which a width increases as the distance from the center of the chemical liquid injection unit in the longitudinal direction increases.

At least some of the plurality of partial slits include a plurality of fine slits separated from each other by fine barrier ribs, and the number of the fine slits increases as the distance from the center of the chemical liquid injection unit in the longitudinal direction increases.

The slit has a shape in which the width increases as the distance from the center of the chemical liquid injection unit in the longitudinal direction increases.

The chemical spraying unit starts spraying the chemical liquid to the substrate after the rotational speed of the substrate supporter increases and then changes to a constant speed.

The injection driver rotates the liquid chemical spraying unit from a predetermined time before the rotation of the substrate supporter stops to the time the rotation of the substrate supporter stops.

Another aspect of the substrate processing apparatus of the present invention for achieving the above object is a substrate support portion for supporting a substrate, a chemical component for spraying a chemical solution to the substrate, and having a long slit parallel to the surface of the substrate. and a spray driver configured to rotate the chemical spray unit with respect to a central axis of the substrate.

The injection driver moves the chemical liquid injection unit in a vertical direction.

The slits include a plurality of partial slits separated from each other by partition walls.

The amount of chemical liquid injected from the plurality of partial slits is differently determined according to a distance from the center of the chemical liquid spraying part in the longitudinal direction.

The slit has a shape in which the width increases as the distance from the center of the chemical liquid injection unit in the longitudinal direction increases.

The chemical liquid spraying unit starts spraying the chemical liquid to the substrate after the rotational speed of the spray driving unit increases and then changes to a constant speed.

Another aspect of the substrate processing apparatus of the present invention for achieving the above object is a substrate support for supporting a substrate, a support driver for rotating the substrate support with respect to a central axis of the substrate, and a surface of the substrate. a chemical liquid spraying unit having a long slit parallel to and spraying a chemical liquid to the substrate after the rotational speed of the substrate supporter increases and then changes to a constant speed until the rotation of the substrate supporter stops; and the substrate supporter A spray driver configured to rotate the liquid chemical injection unit in the same direction as or opposite to the direction of rotation of the substrate support unit with respect to the central axis of the substrate from a predetermined time before the rotation stop point to the stop rotation of the substrate support unit. The slits include a plurality of partial slits separated from each other by barrier ribs, and the shape, size, and spray amount of the chemical solution of the plurality of partial slits are determined such that the height of the chemical solution applied to the substrate is uniform.

Details of other embodiments are included in the detailed description and drawings.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a view for explaining that the chemical liquid spraying unit shown in FIG. 1 moves in the vertical direction.
FIG. 3 is a view for explaining rotation of the chemical liquid injection unit shown in FIG. 1 .
4 and 5 are diagrams for explaining slits of the chemical liquid ejection unit shown in FIG. 1 .
6 is a view for explaining that a slit of a chemical liquid ejection unit is formed from one edge to the opposite edge.
7 to 12 are diagrams for explaining a chemical liquid injection unit having slits of various shapes.
13 and 14 are diagrams for explaining that a chemical liquid is sprayed onto a substrate by a chemical liquid ejection unit.
15 is a diagram for explaining the rotational speed of the chemical liquid ejection unit and the chemical liquid injection amount according to the rotational speed of the substrate.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. Advantages and features of the present invention, and methods for achieving them, will become clear with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various different forms, only the present embodiments make the disclosure of the present invention complete, and the common knowledge in the art to which the present invention belongs It is provided to fully inform the holder of the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numbers designate like elements throughout the specification.

When an element or layer is referred to as being "on" or "on" another element or layer, it is not only directly on the other element or layer, but also when another layer or other element is intervening therebetween. All inclusive. On the other hand, when an element is referred to as “directly on” or “directly on”, it indicates that another element or layer is not intervened.

The spatially relative terms "below", "beneath", "lower", "above", "upper", etc. It can be used to easily describe the correlation between elements or components and other elements or components. Spatially relative terms should be understood as encompassing different orientations of elements in use or operation in addition to the orientations shown in the figures. For example, when flipping elements shown in the figures, elements described as “below” or “beneath” other elements may be placed “above” the other elements. Thus, the exemplary term “below” may include directions of both below and above. Elements may also be oriented in other orientations, and thus spatially relative terms may be interpreted according to orientation.

Although first, second, etc. are used to describe various elements, components and/or sections, it is needless to say that these elements, components and/or sections are not limited by these terms. These terms are only used to distinguish one element, component or section from another element, component or section. Accordingly, it goes without saying that the first element, first element, or first section referred to below may also be a second element, second element, or second section within the spirit of the present invention.

Terminology used herein is for describing the embodiments and is not intended to limit the present invention. In this specification, singular forms also include plural forms unless specifically stated otherwise in a phrase. As used herein, "comprises" and/or "comprising" means that a stated component, step, operation, and/or element is present in the presence of one or more other components, steps, operations, and/or elements. or do not rule out additions.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used in a meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless explicitly specifically defined.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, the same or corresponding components regardless of reference numerals are given the same reference numerals, Description is omitted.

1 is a view showing a substrate processing apparatus according to an embodiment of the present invention, FIG. 2 is a view for explaining that the chemical liquid spraying unit shown in FIG. 1 moves in the vertical direction, and FIG. It is a drawing for explaining the rotation of the chemical liquid ejection unit.

1 to 3 , a substrate processing apparatus 10 according to an embodiment of the present invention includes a substrate support unit 100, a support driving unit 200, a recovery unit 300, a chemical spraying unit 400, and a spraying unit. It is configured to include a driving unit 600.

The substrate support 100 serves to support the substrate W. In addition, the substrate support 100 may be rotated so that the liquid chemical sprayed on the substrate W is applied to the substrate W. In the present invention, the substrate W may be provided in the shape of a circular plate. The chemical solution may be sprayed in a straight line along one edge from the center of the substrate W. As the substrate W rotates by the substrate support 100, the chemical solution may be applied over the entire area of the substrate W. . Meanwhile, as will be described later, the chemical liquid may be sprayed and applied to the substrate W in a state in which the substrate support 100 does not rotate. In this case, the support driver 200 to be described later may be removed from the substrate processing apparatus 10 .

In the present invention, the chemical solution may be a photoresist used in a photographic process, but is not limited thereto.

The substrate support 100 may include a support plate 110 and a rotation shaft 120 . The support plate 110 may be provided in the shape of a disk. In the present invention, the support plate 110 may be an electrostatic chuck that fixes the substrate W with electrostatic force, but the support plate 110 of the present invention is not limited to the electrostatic chuck.

The support plate 110 may have a seating surface for seating the substrate W thereon. A support pin 130 may be provided at the edge of the seating surface. The support pin 130 may support the edge of the substrate (W) during a process for the substrate (W) so that the substrate (W) is fixed to the support plate (110). One end of the rotating shaft 120 may be coupled to the lower center of the support plate 110 and the other end may be coupled to the support driving unit 200 . The rotating shaft 120 may transfer the rotational force of the support drive unit 200 to the support plate 110 .

The support drive unit 200 serves to rotate the substrate support unit 100 based on the central axis Ax of the substrate W. The rotational force of the support driver 200 is transmitted along the rotation shaft 120 so that the support plate 110 can rotate. Accordingly, the substrate W fixed to the support plate 110 may rotate. As the substrate (W) rotates together with the support plate 110, the liquid chemical sprayed onto the substrate (W) may be applied to the upper surface of the substrate (W).

The recovery unit 300 serves to recover the liquid chemical separated from the substrate (W). To this end, the recovery unit 300 may be provided in an annular shape to surround the side surface of the substrate support unit 100 and may include a recovery film 310 . The liquid chemical separated from the substrate W collides with the recovery film 310 so that it can be accommodated in the recovery unit 300 .

For accommodating the liquid medicine, the recovery unit 300 may include an accommodating box 320 . The receiving box 320 may be formed by connecting the inner plate 321 and the outer plate 322 to the lower plate 323 . The inner plate 321 and the outer plate 322 may be provided in a cylindrical shape having the same central axis and having different diameters. The outer plate 322 may be provided on the outside of the inner plate 321, and the receiving box 320 may be formed by a combination of the inner plate 321, the outer plate 322 and the lower plate 323. .

An outlet 330 for discharging the contained liquid may be connected to the container 320 . For example, the outlet 330 may be provided on the lower plate 323 . The chemical solution discharged from the discharge port 330 may move along the discharge line 340 and be removed from the recovery unit 300 .

The chemical liquid spraying unit 400 serves to spray the chemical liquid to the substrate (W). The chemical liquid spraying unit 400 may be provided in a long shape. In particular, the chemical spraying unit 400 may have a long slit 410 parallel to the surface of the substrate W. The length of the slit 410 may be the same as the diameter of the substrate W or the same as the radius of the substrate W. The slit 410 may be provided on the lower surface of the chemical liquid ejection unit 400, and the chemical liquid may be injected through the slit 410.

The chemical liquid ejection unit 400 may spray the chemical liquid to the substrate (W) when the substrate (W) rotates. Specifically, after the rotational speed of the substrate supporter 100 increases and then changes to a constant speed, the chemical liquid may be sprayed onto the substrate W until the rotation of the substrate supporter 100 stops. Meanwhile, according to some embodiments of the present invention, the chemical liquid spraying unit 400 may spray the chemical liquid to the substrate (W) in a state in which the rotation of the substrate (W) is stopped. In this case, the chemical liquid injection unit 400 may spray the chemical liquid while being rotated by the spray driving unit 600 to be described later.

A driving shaft 500 may be connected to the liquid chemical injection unit 400 . The driving shaft 500 may be formed long in the upward direction in the liquid chemical spraying unit 400 . The driving force of the injection driving unit 600 may be transmitted to the liquid chemical spraying unit 400 through the driving shaft 500 . In addition, a chemical solution supply pipe 510 for supplying a chemical solution may be provided inside the driving shaft 500 . The chemical solution transported through the chemical solution transfer line 520 is supplied to the chemical solution ejection unit 400 through the chemical solution supply pipe 510 , and the chemical solution ejection unit 400 may inject the supplied chemical solution into the slit 410 .

The injection driver 600 may generate a driving force to move or rotate the liquid chemical injection unit 400 . As shown in FIG. 2 , the injection driving unit 600 may move the liquid chemical spraying unit 400 in a vertical direction. In addition, as shown in FIG. 3 , the injection driver 600 may rotate the chemical liquid injection unit 400 based on the central axis Ax of the substrate W.

After the chemical spraying unit 400 moves upward, the substrate W may be seated on the substrate supporter 100 or the substrate W seated on the substrate supporter 100 may be removed. In addition, after the chemical liquid spraying unit 400 moves downward and is disposed adjacent to the substrate W, the chemical liquid may be sprayed from the chemical liquid spraying unit 400 .

While the chemical liquid spraying unit 400 is rotated by the spray driving unit 600 , the chemical liquid may be ejected from the chemical liquid spraying unit 400 . Meanwhile, the rotation of the chemical liquid spraying unit 400 and the chemical liquid spraying by the chemical liquid spraying unit 400 may be independently performed. For example, the chemical liquid may be sprayed from the chemical liquid spraying unit 400 while the chemical liquid spraying unit 400 is not rotating, and the chemical liquid may be sprayed from the chemical liquid spraying unit 400 while the chemical liquid spraying unit 400 is rotating. It could be.

4 and 5 are views for explaining the slits of the chemical spraying unit shown in FIG. 1, and FIG. 6 is a view for explaining that the slits of the chemical spraying unit are formed from one edge to the opposite edge.

Referring to FIGS. 4 and 5 , the chemical spraying unit 400 may include a slit 410 having a long shape in one direction.

The slit 410 may include a plurality of partial slits 411 separated from each other by partition walls 412 . As shown in FIGS. 4 and 5 , a plurality of partial slits 411 may be formed along one side edge of the center Bx of the chemical spray unit 400 in the longitudinal direction. Alternatively, as shown in FIG. 6 , the plurality of partial slits 411 may be formed along the opposite edge from one edge of the chemical solution spraying unit 401 in the longitudinal direction. Hereinafter, the plurality of partial slits 411 formed along one edge of the center Bx in the longitudinal direction of the chemical spray unit 400 will be mainly described.

The injection amount of the chemical solution of the plurality of partial slits 411 may be determined such that the height of the chemical solution applied to the substrate W is uniform.

In detail, the amount of chemical liquid injected from the plurality of partial slits 411 may be differently determined according to the distance from the center Bx of the chemical liquid spraying unit 400 in the longitudinal direction. For example, the amount of chemical liquid injected from the partial slit 411 decreases as it is closer to the center Bx of the chemical liquid spraying unit 400, and the partial slit ( 411) may increase the amount of the chemical liquid injected. To this end, the chemical solution supply pipe 510 may include a plurality of partial supply pipes for individually supplying the chemical solution to each partial slit 411 . Each partial slit 411 may receive and spray different amounts of chemical solution per hour through different partial supply pipes.

The shape and size of the plurality of partial slits 411 may be determined such that the height of the chemical solution applied to the substrate W is uniform. Hereinafter, various forms of the slit 410 will be described with reference to FIGS. 7 to 12 .

7 to 12 are diagrams for explaining a chemical liquid injection unit having slits of various shapes.

Referring to FIG. 7 , a slit 410 including a plurality of partial slits 411 may be provided in the chemical solution spraying unit 400 .

Adjacent partial slits 411 among the plurality of partial slits 411 may be separated by partition walls 412 . Each of the plurality of partial slits 411 may have a long shape parallel to the longitudinal direction of the liquid chemical spraying unit 400 and may have the same length and width. Each of the plurality of partial slits 411 may have the same width along the longitudinal direction.

Referring to FIG. 8 , a slit 430 including a plurality of partial slits 431 may be provided in the chemical spray unit 402 .

Adjacent partial slits 431 among the plurality of partial slits 431 may be separated by partition walls 432 . The plurality of partial slits 431 may have the same shape and different sizes. Each of the plurality of partial slits 431 may have a long shape parallel to the longitudinal direction of the chemical solution spraying unit 402 . Each of the plurality of partial slits 431 may have the same width along the longitudinal direction. Meanwhile, the plurality of partial slits 431 may have different sizes. For example, the plurality of partial slits 431 may have the same length and different widths. Alternatively, although not shown, the plurality of partial slits 431 may have different lengths and the same width, or may have different lengths and widths.

The size of the partial slit 431 may be differently determined according to the distance from the center Bx of the liquid chemical spraying unit 402 . For example, the size of the partial slit 431 is reduced as it is closer to the center (Bx) of the chemical liquid spraying unit 402, and the size of the partial slit 431 is reduced as it is farther from the center (Bx) of the chemical liquid spraying unit 402. Size may increase. Here, the size of the partial slit 431 may mean the width of the partial slit 431 .

The amount of chemical solution supplied to each partial slit 431 increases as the distance from the center Bx of the chemical liquid spraying unit 402 increases. As the size of ) increases, each partial slit 431 can easily spray the supplied chemical solution.

Referring to FIG. 9 , a slit 440 including a plurality of partial slits 441 may be provided in the chemical solution spraying unit 403 .

Adjacent partial slits 441 among the plurality of partial slits 441 may be separated by partition walls 442 . The plurality of partial slits 441 may have a shape in which the width increases as the distance from the center Bx of the chemical liquid spraying unit 440 in the longitudinal direction increases.

The plurality of partial slits 441 have the same or similar shapes, and each partial slit 441 may have a different width along the length direction. That is, the width of each partial slit 441 may increase as the distance from the center Bx of the chemical liquid ejection unit 403 increases. Accordingly, the amount of chemical liquid injected from each partial slit 441 may be greater at the edge of the chemical liquid spraying unit 403 than at the center Bx of the chemical liquid spraying unit 403 .

Spraying of the chemical liquid through the partial slit 441 may be performed when the substrate W is relatively rotated with respect to the liquid chemical spraying unit 403 . For example, when the substrate W rotates while the chemical spraying unit 403 is stopped, the chemical liquid may be sprayed from the slits 441 of each part of the chemical spraying unit 403 . At this time, the linear velocity at each point on the surface of the substrate (W) varies depending on the distance from the center of the substrate (W). That is, the linear velocity decreases as the distance from the center of the substrate W decreases, and the linear velocity increases as the distance from the center of the substrate W increases. When the same amount of chemical liquid is injected into a part having a relatively small linear velocity and a part having a relatively large linear velocity, a step may be formed between the respective parts. As shown in FIG. 9 , since the width of each partial slit 441 increases as the distance from the center (Bx) of the chemical spraying unit 403 increases, the amount of chemical applied to the substrate W is the center of the substrate W. The edge side of the substrate W may be larger than the edge side. Due to this, the chemical solution on the substrate W by each partial slit 441 can have a uniform height on the surface of the substrate W.

In addition, when the change in the width of each partial slit 441 is appropriately determined, the level difference between the chemical liquids caused by the adjacent partial slit 441 can be eliminated. For example, the change in the width of each partial slit 441 may be all the same, partially different, or all different.

Referring to FIGS. 10 and 11 , a slit 450 including a plurality of partial slits 451 may be provided in the chemical spray unit 404 .

Adjacent partial slits 451 among the plurality of partial slits 451 may be separated by partition walls 452 . At least some of the plurality of partial slits 451 may include a plurality of fine slits 451a separated from each other by fine partition walls 451b.

FIG. 11 is an enlarged view of A shown in FIG. 10 . Referring to this description, the partial slit 451 may include a plurality of fine slits 451a separated by fine partition walls 451b. Here, the shape and size of the fine slit 451a may all be the same. That is, the shape and size of the fine slits 451a included in one partial slit 451 may all be the same, and all the shapes and sizes of all the fine slits 451a included in the plurality of partial slits 451 may be identical. may be the same

The number of fine slits 451a included in each partial slit 451 may be determined differently depending on the distance from the center Bx of the chemical solution spraying unit 404 . That is, the number of fine slits 451a decreases as it approaches the center Bx of the chemical liquid spraying unit 404, and the number of fine slits 451a decreases as it moves away from the center Bx of the chemical liquid spraying unit 404. can increase The amount of chemical solution supplied to each partial slit 451 increases as the distance from the center Bx of the chemical liquid spraying unit 404 increases. As the number of fine slits 451a included in ) increases, each partial slit 451 can easily spray the supplied chemical solution.

Referring to FIG. 12 , a slit 460 may be provided in the chemical solution spraying unit 405 .

The slit 460 may have a shape in which the width increases as the distance from the center Bx of the chemical liquid ejection unit 405 in the longitudinal direction increases.

The chemical liquid spraying unit 405 may include one slit 460, and the slit 460 may be provided in a long single shape along the edge from the center Bx of the chemical liquid spraying unit 405. At this time, the width of the slit 460 may increase as the distance from the center (Bx) of the chemical liquid ejection unit 405 increases. Thus, the amount of chemical liquid sprayed from the slit 460 may increase as the distance from the center Bx of the chemical liquid spraying unit 405 increases. The amount of change in the width of the slit 460 may be determined such that the height of the liquid chemical applied to the substrate W is uniform over the entire area of the substrate W.

Hereinafter, spraying of the chemical liquid to the substrate W through the chemical liquid spraying unit 400 shown in FIG. 7 will be described.

13 and 14 are diagrams for explaining that a chemical liquid is sprayed onto a substrate by a chemical liquid ejection unit.

Referring to FIG. 13 , while the substrate W is rotating, the chemical spray unit 400 may spray the chemical liquid FL onto the substrate W.

In a state in which the rotation of the liquid chemical spraying unit 400 by the spray driving unit 600 is stopped, the support driving unit 200 may rotate the substrate support unit 100 . At this time, the non-rotating chemical liquid ejection unit 400 may spray the chemical liquid FL to the rotating substrate W. The chemical liquid FL sprayed from the adjacent partial slit 411 may spread widely on the surface of the substrate W and fuse with each other to form a uniform height. Thus, the chemical liquid FL can be applied to the entire area of the substrate W.

As the substrate (W) rotates, the linear velocity at each point of the substrate (W) may be formed differently depending on the distance from the center (C) of the substrate (W). The amount of the chemical liquid FL sprayed from the plurality of partial slits 411 provided in the chemical liquid spraying unit 400 may be determined to be proportional to the linear velocity of the point where the chemical liquid FL is applied on the surface of the rotating substrate W. there is. Referring to FIG. 13 , the first linear velocity LV1 of the first point SP1 may be greater than the second linear velocity LV2 of the second point SP2. Accordingly, the partial slit 411 corresponding to the second point SP2 may inject a larger amount of the chemical liquid FL than the partial slit 411 corresponding to the first point SP1. As the plurality of partial slits 411 spray the chemical liquid FL in proportion to the linear speed of each point of the substrate W, the chemical liquid FL may be applied at a uniform height over the entire area of the substrate W. there will be

Referring to FIG. 14 , in a state where the substrate W is stationary, the chemical liquid ejection unit 400 may spray the chemical liquid FL onto the substrate W.

In a state in which the rotation of the substrate supporter 100 by the support driving unit 200 is stopped, the injection driving unit 600 may rotate the liquid chemical spraying unit 400 . At this time, in a state where the substrate W is stationary, the chemical liquid ejection unit 400 may spray the chemical liquid FL while rotating. Thus, the chemical liquid FL can be applied to the entire area of the substrate W.

The linear velocity of the plurality of partial slits 411 provided in the chemical liquid spraying unit 400 may be formed differently depending on the distance from the center Bx of the chemical liquid spraying unit 400 . The amount of the chemical liquid FL sprayed from the plurality of partial slits 411 provided in the chemical liquid ejection unit 400 may be determined to be proportional to the linear velocity of each partial slit 411 . As the plurality of partial slits 411 spray the chemical liquid FL in proportion to the linear speed of each partial slit 411, the chemical liquid FL can be applied at a uniform height over the entire area of the substrate W. do.

In the above, it has been described that the chemical liquid FL is sprayed onto the substrate W in a state in which one of the substrate support 100 and the chemical spraying unit 400 rotates and the other stops. Meanwhile, according to some embodiments of the present invention, when a process of applying a chemical solution to one substrate W is performed, rotations of the substrate supporter 100 and the chemical solution spraying unit 400 may be individually determined for each time interval.

15 is a diagram for explaining the rotational speed of the chemical liquid ejection unit and the chemical liquid injection amount according to the rotational speed of the substrate.

In order to apply the chemical liquid FL to the substrate W, first, the substrate W may be rotated by the rotational force of the support driver 200 . As the rotation of the substrate W starts, the rotation speed of the substrate W may increase over the period 0 to t1. In addition, when the rotational speed of the substrate (W) reaches a preset constant speed, the support driver 200 may maintain the rotational speed of the substrate (W) constant.

The chemical liquid spraying unit 400 may start spraying the chemical liquid FL onto the substrate W after the rotational speed of the substrate supporter 100 increases and then changes to a constant speed. That is, the chemical liquid ejection unit 400 may inject the chemical liquid FL from the time t1 or after a certain time has elapsed from the time t1. Spraying of the chemical liquid FL by the chemical liquid spraying unit 400 may be performed until t4 when the rotational speed of the substrate W becomes zero.

While maintaining the rotational speed of the substrate (W) constant, the support driving unit 200 may decrease the rotational speed of the substrate (W) and eventually stop the rotation of the substrate (W). For example, when a certain amount of time has elapsed from the time t1 or when the amount of the liquid chemical FL sprayed onto the substrate W reaches a certain amount, the support driving unit 200 reduces the rotational speed of the substrate W. can

The spray driving unit 600 may rotate the chemical solution spraying unit 400 from a predetermined time before the rotation of the substrate supporter 100 stops to the time when the rotation of the substrate supporter 100 stops. That is, the injection driving unit 600 starts the rotation of the chemical liquid spraying unit 400 at the time point t3, and after continuing the rotation of the chemical liquid spraying unit 400 for the time dt, the rotation of the chemical liquid spraying unit 400 at the time point t4 can stop At this time, the injection driving unit 600 may rotate the liquid chemical spraying unit 400 in the same direction as or opposite to the rotational direction of the substrate support 100 with respect to the central axis Ax of the substrate W.

When the rotation of the substrate (W) is stopped while the chemical liquid (FL) is sprayed by the chemical liquid ejection unit 400, the outline of the chemical liquid (FL) in a long line corresponding to the shape of the slit 410 is formed on the substrate (W). can be formed in Before the rotation of the substrate W is stopped, as the chemical spray unit 400 rotates together with the substrate W, the outline of the chemical liquid FL corresponding to the shape of the slit 410 may be removed or reduced.

Although the embodiments of the present invention have been described with reference to the above and accompanying drawings, those skilled in the art to which the present invention pertains can implement the present invention in other specific forms without changing the technical spirit or essential features. You will understand that there is Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting.

10: substrate processing device 100: substrate support
110: support plate 120: rotation shaft
130: support pin 200: support driving unit
300: recovery unit 310: recovery film
320: receiving box 330: outlet
340: discharge line
400, 401, 402, 403, 404, 405: chemical injection unit
410, 420, 430, 440, 450, 460: slots
411, 431, 441, 451 partial slit 451a fine slit
451b: fine partition wall 412, 432, 442, 452: partition wall
500: drive shaft 510: chemical solution supply pipe
520: chemical transfer line 600: injection drive unit

Claims (20)

a substrate support that supports the substrate;
a support drive unit rotating the substrate support unit with respect to the central axis of the substrate;
a chemical spraying unit having a long slit parallel to the surface of the substrate and spraying a chemical liquid onto the substrate; and
A spray driver configured to rotate the liquid chemical spray unit with respect to the central axis of the substrate;
The substrate processing apparatus of claim 1 , wherein the injection driver rotates the liquid chemical injection unit from a predetermined time before the rotation of the substrate supporter is stopped to the time the rotation of the substrate supporter is stopped. According to claim 1,
The spray driving unit moves the chemical liquid spraying unit in a vertical direction. According to claim 1,
The slits include a plurality of partial slits separated from each other by barrier ribs. According to claim 3,
The plurality of partial slits,
It is formed along one edge from the center of the longitudinal direction of the chemical liquid spraying part,
A substrate processing apparatus formed along an opposite edge from one edge of the chemical liquid ejection unit in the longitudinal direction. According to claim 3,
The substrate processing apparatus of claim 1 , wherein an amount of the chemical liquid injected from the plurality of partial slits is differently determined according to a distance from a center of the chemical liquid spraying part in a longitudinal direction. According to claim 5,
The substrate processing apparatus of claim 1 , wherein an amount of the liquid chemical sprayed from the plurality of partial slits is determined to be proportional to a linear speed of a point where the chemical liquid is applied on the surface of the rotating substrate. According to claim 3,
The plurality of partial slits have the same shape and size. According to claim 3,
The plurality of partial slits have the same shape and different sizes. According to claim 3,
The plurality of partial slits have a shape in which a width increases as the distance from the center of the chemical liquid injection unit in the longitudinal direction increases. According to claim 3,
At least some of the plurality of partial slits include a plurality of fine slits separated from each other by fine partition walls,
The substrate processing apparatus of claim 1 , wherein the number of the fine slits increases as the distance from the center of the chemical injection unit in the longitudinal direction increases. According to claim 1,
The substrate processing apparatus of claim 1 , wherein the slit has a shape in which a width increases as the distance from the center of the chemical injection unit in the longitudinal direction increases. According to claim 1,
The chemical liquid spraying unit starts spraying the chemical liquid to the substrate after the rotational speed of the substrate support unit increases and then changes to a constant speed. delete a substrate support that supports the substrate;
a chemical spraying unit having a long slit parallel to the surface of the substrate and spraying a chemical liquid onto the substrate; and
A spray driver configured to rotate the liquid chemical spray unit with respect to the central axis of the substrate;
The substrate processing apparatus of claim 1 , wherein the injection driver rotates the liquid chemical injection unit from a predetermined time before the rotation of the substrate supporter is stopped to the time the rotation of the substrate supporter is stopped. According to claim 14,
The spray driving unit moves the chemical liquid spraying unit in a vertical direction. According to claim 14,
The slits include a plurality of partial slits separated from each other by barrier ribs. According to claim 16,
The substrate processing apparatus of claim 1 , wherein an amount of the chemical liquid injected from the plurality of partial slits is differently determined according to a distance from a center of the chemical liquid spraying part in a longitudinal direction. According to claim 14,
The substrate processing apparatus of claim 1 , wherein the slit has a shape in which a width increases as the distance from the center of the chemical injection unit in the longitudinal direction increases. According to claim 14,
The chemical liquid spraying unit starts spraying the chemical liquid to the substrate after the rotational speed of the spray driving unit increases and then changes to a constant speed. a substrate support that supports the substrate;
a support drive unit rotating the substrate support unit with respect to the central axis of the substrate;
a chemical spraying unit having a long slit parallel to the surface of the substrate and spraying a liquid chemical onto the substrate after the rotational speed of the substrate supporter increases and then changes to a constant speed until rotation of the substrate supporter stops; and
Rotation of the liquid chemical ejection unit in the same direction as or opposite to the rotational direction of the substrate supporter with respect to the central axis of the substrate from a predetermined time before the rotation of the substrate supporter is stopped to the time when the rotation of the substrate supporter is stopped Including an injection drive unit to do,
the slits include a plurality of partial slits separated from each other by partition walls;
The substrate processing apparatus of claim 1 , wherein the shape, size, and spray amount of the chemical solution of the plurality of partial slits are determined such that the height of the chemical solution applied to the substrate is uniform.

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