KR102526840B1 - Chemical-mechanical polishing pad including protruding pattern with increased circumference length and method for preparing the same - Google Patents

Abstract

A manufacturing method using a chemical-mechanical polishing pad and a pattern mold capable of improving polishing rate and simultaneously reducing manufacturing cost by including a protruding pattern having porosity are provided. The polishing pad may include a support layer; And a pattern layer disposed on one surface of the support layer, including a pattern layer including a base and a plurality of protruding patterns disposed on the base, wherein the base has a plurality of pores exposed on the upper surface, The average diameter is in the range of 80 μm to 150 μm.

Description

Chemical-mechanical polishing pad including protrusion pattern having increased circumferential length and manufacturing method thereof

The present invention relates to a polishing pad including a protrusion pattern formed on a polishing surface and a manufacturing method thereof. Specifically, it relates to a chemical-mechanical polishing pad capable of reducing manufacturing cost while improving polishing rate by including a protruding pattern having porosity and a manufacturing method using a pattern mold.

In general, a chemical-mechanical polishing (CMP) process is involved in the manufacture of highly integrated circuit devices such as semiconductors and displays. In the chemical-mechanical polishing process, a substrate to be polished, such as a wafer substrate, is brought into pressure contact with a rotating polishing pad, and polishing is performed using a chemical reaction with slurry. Chemical-mechanical polishing processes are primarily aimed at planarizing the surface to be polished or removing unnecessary layers.

The characteristics of the polishing process may be expressed as a removal rate (RR), non-uniformity (NU), scratch and planarization of the polishing target. Among them, the polishing rate is one of the most important characteristics of the polishing process, and the polishing surface shape (morphology, topography) of the polishing pad, the composition of the slurry, and the temperature of the polishing plate are known as major factors.

A conventional polishing apparatus includes a conditioner to maintain the characteristics of the surface of a polishing pad, that is, the polishing surface. The conditioner may be positioned eccentrically with respect to the rotation axis of the polishing pad, and the conditioner may be configured to contact the polishing surface of the polishing pad. Cutting particles made of diamond or the like are disposed on a surface of the conditioner in contact with the polishing pad, and a concave-convex structure may be formed or maintained on the surface of the polishing pad by the cutting particles. That is, while the polishing process is in progress, the conditioner continuously polishes the polishing surface of the polishing pad to maintain the surface roughness of the polishing pad at a certain level or higher, and the polishing device including the polishing pad has a substantially constant polishing rate. can be displayed.

However, as the polishing process is performed, the polishing pad is continuously worn, and the uneven surface structure and surface roughness may be inconsistent. If the surface roughness is too small, there is a problem in that the real contact area actually contacting the substrate to be polished increases or the flow of the polishing liquid slurry becomes difficult. On the other hand, if the surface roughness is too large, the required flatness may not be satisfied due to non-uniform contact with the polishing target substrate, and scratches may occur on the polishing target. The non-uniformity of the polishing surface is a factor that shortens the life and durability of the polishing pad.

In particular, as pattern substrates such as semiconductors are highly integrated, the above problems may be intensified. For example, in order to form a Shallow Trench Isolation (STI) structure for high integration of semiconductors, planarization at the level of global planarization is required, and the polishing process can directly affect semiconductor characteristics.

However, conventional polishing pads are vulnerable to defects such as dishing and erosion due to durability problems, and when the surface of a wafer has fine curves, these problems are very serious process defects can cause Therefore, there is an urgent need to develop a polishing pad that can be applied even when a high level of planarity is required, such as in a shallow trench isolation process.

Accordingly, an object to be solved by the present invention is to provide a polishing pad capable of exhibiting a stable morphology or topography of a polished surface despite the continuous polishing process. Another object of the present invention is to provide a polishing pad capable of improving the efficiency of use of the polishing liquid slurry with excellent polishing rate and uniformity.

Furthermore, it is to provide a polishing pad capable of controlling a polishing rate according to a polishing target based on a newly discovered factor that can affect the polishing rate.

At the same time, it is to provide a polishing pad that can be manufactured at a lower cost despite the above improvement in polishing properties.

Another problem to be solved by the present invention is to provide a method for manufacturing a polishing pad including a porous protruding pattern having porosity in a simpler way.

The tasks of the present invention are not limited to the technical tasks mentioned above, and other technical tasks not mentioned will be clearly understood by those skilled in the art from the following description.

A polishing pad according to an embodiment of the present invention for solving the above problems includes a support layer; and a pattern layer disposed on one surface of the support layer, including a base and a plurality of protruding patterns disposed on the base, wherein the base has a plurality of pores exposed on an upper surface thereof, and a predetermined base The ratio of the area occupied by the pores of the base to the inspection area is 10% to 40%.

The support layer may have a plurality of pores exposed on the one surface, and the base may at least partially fill the pores of the support layer.

The support layer has porosity, and the porosity of the support layer may be greater than that of the pattern layer.

In addition, the base may have a trench, and an inner wall and a basal surface of the trench may each have exposed pores.

For a predetermined inspection area, surface skewness of a bottom surface of the trench of the base may be greater than surface skewness of an upper surface of the base.

In addition, the base has a first trench at least partially exposing the one surface of the supporting layer, and the surface skewness of the exposed surface of the supporting layer with respect to a predetermined inspection area is that of an inner wall of the first trench. may be greater than the surface skewness.

The support layer may have a second trench connected to the trench of the base, and a surface roughness of an inner wall of the first trench may be smaller than a surface roughness of an inner wall of the second trench.

The upper surface of the protruding pattern has pores contributing to an increase in the circumferential length on a plane, and the circumferential length of the polishing surface formed by the protruding pattern may be in the range of 8.0 mm/mm ² to 24.0 mm/mm ² .

A polishing pad according to another embodiment of the present invention for solving the above problems is a support layer; and a pattern layer directly disposed on the support layer, the pattern layer comprising a protruding pattern having a plurality of pores, wherein the pores contribute to an increase in a circumferential length of the protruding pattern on a plane, and the protruding pattern per unit area. The circumferential length of the polished surface to be formed is in the range of 1.0 mm/mm ² to 50.0 mm/mm ² .

The stiffness of the pattern layer may be greater than that of the support layer.

In a plan view, a ratio of the area occupied by the pores to the total area of the top surface of any one protruding pattern may be 10% to 50%.

In addition, the circumferential length of any one protruding pattern may be 4 to 50 times the minimum width of any one protruding pattern.

The circumferential length of the polishing surface formed by the protrusion pattern per unit area may be in the range of 0.1 to 1.0 times the reciprocal of the minimum width of any protrusion pattern.

A circumferential length of any protruding pattern may be increased by 1.5 to 3.5 times compared to the circumferential length when the first pores do not exist.

The minimum width of the protruding pattern is 20 μm or more, and the average diameter of the pores may be in the range of 10 μm to 150 μm.

In a plan view, an area occupied by the pores per unit area may be 0.5% to 20%.

In a plane view, the actual polished area of the protrusion pattern per unit area may be 5% to 30%.

In addition, the pores may include a third pore located on a side surface of the protruding pattern to form a side groove of the protruding pattern, contributing to an increase in the area of the side surface, and affecting the flow of the slurry during the polishing process.

The average diameter of the third pores may be in the range of 20 μm to 150 μm.

The porosity of the support layer may be different from the porosity of the pattern layer.

A method of manufacturing a polishing pad according to an embodiment of the present invention for solving the above other problems includes forming a pattern layer disposed on a support layer, including forming a pattern layer including a plurality of protruding patterns spaced apart from each other. In this step, the ratio of the area occupied by the pores of the base to the predetermined base inspection area is 10% to 40%.

The forming of the pattern layer may include filling a curable composition into a recessed pattern of a pattern mold, and forming a porous projecting pattern by curing the curable composition in the recessed pattern.

At this time, the step of filling and curing the curable composition may be performed under conditions of a relative humidity of 40% to 70%.

In addition, the support layer may have pores exposed on a surface thereof, and the curable composition may at least partially fill the pores of the support layer.

The porosity of the support layer may be greater than that of the porous protrusion pattern.

A method of manufacturing a polishing pad according to another embodiment of the present invention for solving the above other problems includes determining a contact pressure required for polishing and a planar shape and a length element of a protruding pattern; determining a polishing area of the protruding pattern in contact with the substrate to be polished in consideration of the contact pressure; determining a circumferential length per unit area of the protrusion pattern in consideration of the contact pressure and the determined polishing area; and manufacturing a pattern layer including the protrusion pattern.

The pattern layer may include a protruding pattern having a plurality of pores, and the pores may contribute to increasing a circumferential length of the protruding pattern. The pores can contribute to an increase in the circumferential length of the protruding pattern, and also play a role in reducing the polishing area, so that the real contact pressure can be improved in the case of the same polishing load.

In addition, in the step of manufacturing the pattern layer, a length factor of the manufactured protruding pattern may be greater than the determined length factor.

Before the step of manufacturing the pattern layer, a step of determining the size of pores included in the protruding pattern may be further included.

A polishing apparatus according to an embodiment of the present invention for solving the above another problem is configured to rotate the polishing platen; and a polishing pad disposed on the polishing platen.

Other embodiment specifics are included in the detailed description.

According to the embodiments of the present invention, surface roughness or topography of the polished surface can be stably maintained and polishing rate and polishing uniformity can be improved even if the polishing process continues. In addition, even if the surface of the object to be polished has fine curves, it is possible to follow the curve in the vertical direction along the curve of the object surface, thereby improving the polishing rate and polishing uniformity.

In addition, the polishing rate can be controlled from factors such as the pattern structure of the surface of the polishing pad, the length of the pattern, the contact surface of the pattern, and the use of the slurry through the shape and arrangement of the unique protrusion pattern according to the embodiments of the present invention can improve efficiency

Moreover, while the elements such as the structure, length and/or contact area of the protruding pattern are configured to satisfy a predetermined range as described above, the protruding pattern has a pore size of a specific size, so that the portion where the pore is located is the circumferential length of the protruding pattern. can contribute to an increase in Accordingly, it is possible to simplify process equipment for forming protruding patterns and contribute to reducing manufacturing costs of polishing pads and polishing devices.

Effects according to the embodiments of the present invention are not limited by the contents exemplified above, and more diverse effects are included in the present specification.

1 is a perspective view of a polishing device according to an embodiment of the present invention.
2 is a planar layout of the polishing pad of FIG. 1;
3 is an enlarged perspective view showing an enlarged portion A of FIG. 2 .
FIG. 4 is a plan view illustrating an arrangement of protruding patterns of FIG. 2 .
FIG. 5 is an enlarged perspective view showing a certain protruding pattern of FIG. 2 .
6 is a cross-sectional view taken along line BB′ of FIG. 3 .
FIG. 7 is a schematic diagram showing a state in which the polishing pad of FIG. 2 is in contact with a substrate to be polished, and FIG. 8 is a schematic diagram compared with FIG. 7 .
FIG. 9 is another schematic diagram showing a state in which the polishing pad of FIG. 2 is in contact with a substrate to be polished, and FIG. 10 is a schematic diagram compared with FIG. 9 .
11 is a planar layout of a polishing pad according to another embodiment of the present invention.
12 is an enlarged perspective view showing part A of FIG. 11 by enlarging it.
13 is a cross-sectional view taken along line BB′ of FIG. 12 .
14 to 16 are cross-sectional views of a polishing pad according to still other embodiments of the present invention.
17 is a schematic diagram illustrating a method of manufacturing a polishing pad according to an embodiment of the present invention.
18 is a schematic diagram showing a method of manufacturing a polishing pad according to another embodiment of the present invention.
19 is a schematic cross-sectional view of the manufactured polishing pad.
FIG. 20 is a schematic diagram illustrating a process of forming a trench in the polishing pad of FIG. 19 .
21 is an image showing the results according to Experimental Example 1.
22 and 23 are images showing the results according to Experimental Example 2.

Advantages and features of the present invention, and methods of achieving them, will become clear with reference to the detailed description of the following embodiments taken in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, and only the embodiments make the disclosure of the present invention complete, and those skilled in the art in the art to which the present invention belongs It is provided to fully inform the person of the scope of the invention, and the invention is only defined by the scope of the claims. That is, various changes may be made to the embodiments provided by the present invention. The embodiments described below are not intended to be limiting on the embodiments, and should be understood to include all modifications, equivalents or substitutes thereto.

The size, thickness, width, length, etc. of the components shown in the drawings may be exaggerated or reduced for convenience and clarity of explanation, so the present invention is not limited to the illustrated form.

Unless otherwise defined, all terms (including technical and scientific terms) used in this specification may be used in a meaning commonly understood by those of ordinary skill in the art to which the present invention belongs. In addition, terms defined in commonly used dictionaries are not interpreted ideally or excessively unless explicitly specifically defined.

The spatially relative terms 'above', 'upper', 'on', 'below', 'beneath', 'lower', etc. are not included in the drawings. As shown, it can be used to easily describe the correlation between one element or component and another element or component. Spatially relative terms should be understood as encompassing different orientations of elements in use in addition to the orientations shown in the figures. For example, when elements shown in the figures are turned over, elements described as 'below' or 'below' other elements may be placed 'above' the other elements. Accordingly, the exemplary term 'below' may include directions of both down and up.

In this specification, 'and/or' includes each and every combination of one or more of the recited items. In addition, singular forms also include plural forms unless otherwise specified in the text. As used herein, 'comprises' and/or 'comprising' does not exclude the presence or addition of one or more other elements other than the recited elements. A numerical range expressed using 'to' indicates a numerical range including the values listed before and after it as the lower limit and the upper limit, respectively. 'About' or 'approximately' means a value or range of values within 20% of the value or range of values set forth thereafter.

In this specification, the first direction (X) means any direction in the plane, and the second direction (Y) means another direction that crosses or is perpendicular to the first direction (X) in the plane. In addition, the third direction (Z) means a direction perpendicular to the plane. Unless otherwise defined, 'plane' means a plane to which the first direction (X) and the second direction (Y) belong. In addition, unless otherwise defined, 'overlapping' means that components overlap in the third direction (Z) from the planar viewpoint.

In this specification, the term 'protrusion pattern' refers to a structure protruding from a certain reference plane. The planar arrangement of the pattern may be regular or irregular. Even when a plurality of protruding patterns gather to form a cluster pattern having a specific shape and the cluster patterns are substantially regularly arranged, the term protruding pattern refers to any one of a plurality of protruding patterns forming one cluster pattern. can be used as

In the present specification, surface roughness or surface skewness, which is defined as skewness, may refer to a characteristic value indicating a direction and degree of asymmetry with respect to an average value. That is, in the surface roughness, when the surface skewness (Rsk) has a negative value, it means that the tendency of the surface on which the recessed part is formed from the substantially or relatively flat surface is high. On the other hand, in terms of surface roughness, when the surface skewness has a positive value, it means that the tendency of the surface on which protruding parts are formed from the approximately or relatively flat surface is large. In addition, when the surface skewness is 0, it means that the roughness is symmetric up and down from the average value. For example, a waveform such as a cosine function or a sine function may have a skewness value of 0. For skewness, you can refer to the image below.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view of a polishing device according to an embodiment of the present invention.

Referring to FIG. 1 , a polishing apparatus 1 according to the present embodiment includes a polishing platen 10 connected to a rotating shaft and a polishing pad 11 disposed on the polishing platen 10, and the polishing pad 11 ) It may further include a nozzle 60 and/or a carrier 40 for supplying the slurry 70 on the polishing surface. Although the present invention is not limited thereto, in the polishing apparatus 1 according to the present embodiment, a conditioner for adjusting the surface roughness of the polishing surface of the polishing pad 11 may be unnecessary.

The abrasive platen 10 may be configured in a substantially disc shape and may rotate, for example, in a counterclockwise direction. In addition, the polishing platen 10 can stably support the polishing pad 11 thereon. That is, the abrasive platen 10 may provide the same function as a rotary table.

The polishing pad 11 may be disposed on the polishing platen 10 . An upper surface of the polishing pad 11 in contact with the substrate 50 to be polished may form a polishing surface. Although not shown in FIG. 1 , fine-sized patterns and/or trenches may be formed on the polishing surface, that is, the upper surface of the polishing pad 11 . The shape, morphology or topology of the polishing surface of the polishing pad 11 will be described later in detail along with FIG. 2 and the like.

The substrate 50 to be polished may be eccentric with the rotational axis of the polishing platen 10 or the rotational axis of the polishing pad 11 to be in a fixed position. The substrate 50 to be polished may be in a state of being fixed by the carrier 40 connected to the rotating shaft and being rotated by the carrier 40 . The rotation direction of the substrate 50 to be polished may be the same as that of the polishing pad 11, but the present invention is not limited thereto, and the rotation directions of the substrate 50 and the polishing pad 11 are opposite. could be a direction. The substrate 50 to be polished by contacting with the polishing pad 11 may be a semiconductor wafer substrate, a display substrate, etc., but the present invention is not limited thereto.

The nozzle 60 may be disposed on the polishing pad 11 to supply the slurry 70 to the polishing surface of the polishing pad 11 . In this specification, the term 'slurry' may be used in the same meaning as an abrasive liquid or abrasive particles. The slurry 70 flows on the polishing surface of the polishing pad 11 by the centrifugal force generated by the rotation of the polishing pad 11, and at least partially penetrates between the polishing pad 11 and the substrate 50 to be polished. It can contribute to polishing through a chemical reaction.

Hereinafter, the polishing pad 11 will be described in more detail with reference to FIGS. 2 to 6 . 2 is a planar layout of the polishing pad of FIG. 1; 3 is an enlarged perspective view showing an enlarged portion A of FIG. 2 . FIG. 4 is a plan view illustrating an arrangement of protruding patterns of FIG. 2 . FIG. 5 is an enlarged perspective view showing a certain protruding pattern of FIG. 2 . 6 is a cross-sectional view taken along line BB′ of FIG. 3 .

Further referring to FIGS. 2 to 6 , the polishing pad 11 according to the present embodiment may have a substantially circular shape when viewed from a plan view. In addition, the polishing pad 11 may include a support layer 100 and a pattern layer 200 disposed on the support layer 100 . An upper surface of the protrusion pattern 230 of the pattern layer 200 may form a polishing surface as a whole. Each of the support layer 100 and the pattern layer 200 may include a material having predetermined flexibility.

In an exemplary embodiment, strength, rigidity, and/or hardness of the support layer 100 may be smaller than that of the patterned layer 200 . That is, the support layer 100 may have greater flexibility and a lower modulus of elasticity than the pattern layer 200 . The elastic modulus is meant to include a loss modulus and/or a storage modulus.

Through this, even when the surface of the substrate 50 to be polished has a fine curve, when the planarization characteristic required for the substrate 50 to be polished is high, and/or when the polishing pad 11 has a fine curve, the polishing pad The protruding pattern 230 formed on the upper surface of (11) may adhere to the curved surface of the substrate 50 to be polished to perform polishing. That is, the polishing pad 11 may follow the surface of the substrate 50 to be polished. This will be described later together with FIG. 7 and the like.

The support layer 100 and the pattern layer 200 may be made of the same or different materials. As a non-limiting example, the support layer 100 and the pattern layer 200 may include substantially the same polymer material. Examples of the polymer material include (poly)urethane (PU), (poly)(meth)acrylate, (poly)epoxy, and acrylo Nitrile Butadiene Styrene (ABS), (poly)etherimide, (poly)amide, (poly)propylene, (poly)butadiene ), polyalkylene oxide, (poly) ester ((poly) ester), (poly) isoprene ((poly) isoprene), (poly) styrene ((poly) styrene), (poly) ethylene ( (poly)ethylene), (poly)carbonate, polyfluorene, polyphenylene, polyazulene, polypyrene, polynaphthalene, poly-p-phenylenevinylene, polypyrrole, polycarbazole, poly indole, polyaniline, or a combination thereof.

The stiffness of the support layer 100 and the pattern layer 200 may be controlled through the degree of crosslinking of the polymer material, but the present invention is not limited thereto.

The support layer 100 has a substantially circular shape when viewed from a plan view, and may provide a function of supporting the pattern layer 200 thereon. A lower limit of the minimum thickness T1 of the support layer 100 may be about 1 mm or more, about 2 mm or more, or about 3 mm or more. If the thickness of the support layer 100 is less than the above range, the support layer 100 may not exhibit sufficient elasticity or deformation rate, and it may be difficult for the polishing pad 11 to follow the curve of the substrate 50 to be polished. The upper limit of the thickness T1 of the support layer 100 is not particularly limited, but may be, for example, about 5 mm or less or about 4 mm or less. In this specification, when a plurality of upper and lower limits of a certain numerical range are described, the numerical range disclosed in this specification is a numerical range between the upper limit of any one arbitrarily selected among the plurality of upper limits and the lower limit of any one arbitrarily selected among the plurality of lower limits. It should be understood as initiating.

In some embodiments, the porosity of the support layer 100 may be different from that of the pattern layer 200 to be described later. As a non-limiting example, the support layer 100 may have a larger porosity than that of the pattern layer 200 to be described later, and more specifically, than that of the protruding pattern 230 . For example, the porosity of the support layer 100 may be about 1.3 times or more, about 1.4 times or more, or about 1.5 times or more of the porosity of the pattern layer 200 . As described above, the support layer 100 may have greater flexibility than the pattern layer 200 . In order to implement this, the type of material, physical properties, etc. may be controlled, but it may also be controlled using the porosity. However, the present invention is not limited thereto, of course, and in another embodiment, the porosity of the support layer 100 may be smaller than the porosity of the pattern layer 200 .

The pattern layer 200 may be disposed on the support layer 100 . In an exemplary embodiment, the pattern layer 200 may be directly disposed on the support layer 100 without a separate bonding layer. The pattern layer 200 may include a base 210 and a plurality of protruding patterns 230 disposed on the base 210 . The protruding patterns 230 may be spaced apart from each other on the base 210 and plural.

The base 210 and the protruding pattern 230 are integrally and continuously formed without a physical boundary, and may be made of the same material. In another embodiment, the base 210 and the protruding pattern 230 may have physical boundaries and may be made of different materials. In this case, the strength, stiffness, and/or hardness of the base 210 may be smaller than that of the protruding pattern 230 .

The base 210 may be a portion overlapping the plurality of protruding patterns 230 spaced apart from each other in the third direction (Z). In addition, the base 210 may be a portion covering the support layer 100 and occupying most of the area corresponding to that of the polishing pad 11 in a plan view. Alternatively, the base 210 may refer to the rest of the pattern layer 200 except for the protruding pattern 230 to be described later.

The lower limit of the maximum thickness T2 of the base 210 may be about 0.01 mm or more, or about 0.05 mm or more, or about 0.1 mm or more, or about 0.5 mm or more, or about 1.0 mm or more. When the thickness of the base 210 is less than the above range, it may be difficult for the polishing pad 11 to follow the curve of the substrate 50 to be polished. The upper limit of the thickness T2 of the base 210 is not particularly limited, but may be, for example, about 3.0 mm or less, about 2.5 mm or less, about 2.0 mm or less, or about 1.5 mm or less.

A plurality of protruding patterns 230 may be disposed on one base 210 . The protruding pattern 230 forms the uppermost level of the polishing pad 11 and may form a polishing surface. That is, even when the pattern layer 200 has a multi-level structure, the protruding pattern 230 may refer to a protruding portion contributing to actual polishing.

In an exemplary embodiment, the protruding pattern 230 may have a substantially rectangular shape when viewed from a plan view. In another embodiment, the protruding pattern 230 may have a substantially '+' shape or an approximately 'X' shape when viewed from a plan view. In another embodiment, the plurality of protruding patterns form clusters with a predetermined regularity, and the cluster patterns may be arranged regularly or irregularly.

2 and the like illustrate a state in which a plurality of protruding patterns 230 are substantially regularly arranged in a plan view, but in another embodiment, a plurality of protruding patterns 230 are substantially irregularly arranged, or may have a random arrangement of In another embodiment, a plurality of protruding patterns 230 may be gathered to form one cluster pattern, and the cluster patterns may be substantially regularly arranged. In this case, the plurality of protruding patterns 230 within a certain cluster pattern may be arranged with regularity.

In this embodiment, the protruding patterns 230 may be repeatedly arranged along at least two directions to form a regular arrangement. For example, the protruding patterns 230 may be repeatedly arranged with substantially the same spacing along the first direction (X) and the second direction (Y) to form a matrix arrangement.

The size and the like of the protruding pattern 230 may be a major factor affecting the polishing rate and polishing unevenness (NU) of the polishing pad 11 . The inventors of the present invention have confirmed that the polishing rate can be controlled by the circumferential length and/or area of the protruding pattern 230 and have completed the present invention.

In an exemplary embodiment, the polishing area or actual polishing area occupied by the protruding pattern 230, that is, the area occupied by the upper surface of the protruding pattern 230, from a planar perspective is about 1.0% or more and 80% or less of the total area, or About 1.0% or more and 70% or less, or about 1.0% or more and 60% or less, or about 1.0% or more and 50% or less, or about 1.0% or more and 45.0% or less, or about 1.0% or more and 40% or less, or about 1.0% or more 35 % or less, or greater than or equal to about 1.0% and less than or equal to 30%, or greater than or equal to about 3.0% and less than or equal to 30.0%, or greater than or equal to about 5.0% and less than or equal to 30.0%, or greater than or equal to about 10.0% and less than or equal to 30.0%. That is, the lower limit of the polished area relative to the total area may be about 1.0%, or about 3.0%, or about 5.0%. The upper limit of the polished area relative to the total area may be about 80%, or about 70%, or about 60%, or about 50%, or about 45%, or about 40%, or about 35%, or about 30% .

In this specification, the term 'polishing area' or 'actual polishing area' refers to an area where the upper end of the protrusion pattern 230 comes into contact with the substrate 50 to be polished and contributes to polishing. That is, it refers to an area occupied by a portion forming the maximum height in the pattern layer 200 of the polishing pad 11 . The polishing area may be calculated as the sum of the upper areas of the protruding patterns 230 with respect to the entire area of the polishing pad 11, but for a portion of the unit area, the upper areas of the protruding patterns 230 positioned within the unit area. The sum of can also be used with substantially the same meaning.

Also, as will be described later, the protruding pattern 230 may have first pores P1 and second pores P2 contributing to an increase in the circumferential length of the edge. In this case, the area occupied by the above-described protruding pattern 230 may mean an area excluding areas occupied by the first pores P1 and the second pores P2. The first pore P1 and the second pore P2 will be described in detail later.

For example, as shown in FIG. 4 , when the planar shape of a protruding pattern 230 is approximately a square shape with one side length W, the planar area occupied by the protruding pattern 230 is W × W It may be an area excluding the area occupied by the first pore P1 and the second pore P2. Therefore, the area S occupied by the protruding pattern 230 may be slightly smaller than W×W. Specifically, the polishing area S formed by any one protruding pattern 230 may be (W×W)-(area occupied by the first pores + area occupied by the second pores).

For another example, when the planar area occupied by any one protrusion pattern 230 is expressed as S, the ratio occupied by the polishing area may be expressed as S×n with respect to the total planar area of the polishing pad 11. there is. Here, n is the total number of protruding patterns 230 included in the polishing pad 11 .

For another example, the ratio of the polishing area may be expressed as an area occupied by protruding patterns 230 belonging to an area to be confirmed with respect to a certain area to be confirmed of the polishing pad 11 . In this case, when the area to be confirmed (eg, inspection area) is the x-axis and the area occupied by the protruding pattern 230 in that case is the y-axis, the ratio of the polished area is expressed as the slope of the graph may be

An excellent polishing rate is exhibited when the ratio (%) of the above-described polishing area is within the above range, and polishing characteristics such as a polishing rate can be controlled through modification of the arrangement, shape, and/or size of the protruding pattern 230 . In addition, when the polishing area is too large, the polishing rate may decrease due to the decrease in the real contact pressure and the restriction of the flow of the slurry.

On the other hand, in a unit area of a planar viewpoint, for example, 1 mm ² , the lower limit of the circumferential length per unit area formed by the planar circumference of the projecting pattern 230 is about 1.0 mm/mm ² or more, or about 3.0 mm/mm ² or more, or about 5.0 mm/mm ² or greater, or about 8.0 mm/mm ² or greater.

In addition, the upper limit of the circumference per unit area formed by the planar periphery of the projecting pattern 230 is about 250.0 mm/mm ² or less, or about 200.0 mm/mm ² or less, or about 150.0 mm/mm ² or less, or about 100.0 mm/mm ² or less, or about 50.0 mm/mm ^{2 or} less, or about 30.0 mm/mm ^{2 or} less, or about 24.0 mm/mm ² or less, or about 20.0 mm/mm ² or less, or about 16.0 mm/mm ² or less , or about 10.0 mm/mm ² or less.

The term 'circumferential length per unit area' used herein refers to an outer length formed by the polishing area of the protruding patterns 230 per unit area (1 mm ² ).

For example, assuming that the entire rectangle shown in FIG. 4 has an area of 1 mm ² , the circumferential length per unit area may be expressed as 4 protruding patterns×L. Here, L means the circumferential length formed by any one protruding pattern 230 . For example, L may be slightly larger than 4 x W. This is because, as described above, the first pore P1 and the second pore P2 cause an increase in the circumferential length of the protruding pattern 230 . That is, in the present specification, the circumferential length of the protruding pattern 230 is a closed curve formed not only by the outer edge but also by the edge including the first pores P1 of the protruding pattern 230 having an arbitrary shape on a plane. It is formed including the circumferential length of the second pore (P2) located inside the.

For another example, the circumferential length per unit area may be expressed as a circumferential length formed by protruding patterns 230 belonging to an area to be confirmed with respect to a certain area to be confirmed of the polishing pad 11 . In this case, when the area to be checked (eg, inspection area) is the x-axis and the total circumference formed by the protruding pattern 230 in that case is the y-axis, the circumference per unit area is the slope of the graph can also be expressed as

When the circumferential length per unit area (mm/mm ² ) is in the above range, an excellent polishing rate may be exhibited. This will be described later along with experimental examples.

In an exemplary embodiment in which the protruding pattern 230 has a substantially rectangular shape on a plane, the maximum width Wmax of the protruding pattern 230 may be formed in a substantially diagonal direction. On the other hand, the minimum width (W) of the protruding pattern 230 may correspond to the length of any one side. In this specification, the minimum width of a protruding pattern means the width of the part having the smallest length among the length, width, or width of any one protruding pattern 230 that is physically separated and spaced apart from other protruding patterns on a plane. do. In addition, the minimum width means the minimum length required to be controlled in the process and/or process equipment for forming the protruding pattern 230, and may mean the shortest distance between one point and another point, excluding the length increased by the pores. there is.

The maximum width (Wmax) of the protruding pattern 230 may vary depending on the planar shape of the protruding pattern 230, but for example, the maximum width (Wmax) of the protruding pattern 230 is about 1.0 mm or less, or about 0.8 mm or less. , or about 0.5 mm or less, or about 0.3 mm or less.

The minimum width of the protruding pattern 230 may correspond to the length (W) of any one side. The lower limit of the minimum width W of the protrusion pattern 230 is about 20 μm or more, or about 30 μm or more, or about 40 μm or more, or about 50 μm or more, or about 60 μm or more, or about 70 μm or more, or about 80 μm or greater, or about 90 μm or greater, or about 100 μm or greater. The upper limit of the minimum width (W) is not particularly limited, but may be less than the maximum width (Wmax). As a non-limiting example, the minimum width of the protruding pattern 230 may be in the range of about 40 μm to 70 μm, or about 50 μm to 60 μm.

The height H of the protrusion pattern 230 may affect polishing characteristics and durability of the polishing pad 11 . The minimum height H of the protruding pattern 230 means the shortest vertical distance from the top surface 210s of the base 210 to the top of the protruding pattern 230 .

The height H of the protruding pattern 230 may be correlated with the minimum width W of the protruding pattern 230 . That is, when the long width ratio of the protruding pattern 230 on the vertical cross section becomes too large, the polishing pad 11 rotates, and in the process of being in close contact with the substrate 50 to be polished, the plane direction, for example, the first direction (X) and the second direction (Y) Inclination or distortion in any direction within the plane to which it belongs may occur, and designed polishing may not be fully performed. On the other hand, if the height H of the protrusion pattern 230 is too small, the lifetime of the polishing pad 11 may be excessively shortened due to damage or abrasion occurring at the upper end of the protrusion pattern 230 as the polishing process is repeated.

From the above point of view, the minimum height H of the protruding pattern 230 is about 0.5 to 2.5 times, or about 0.6 to 2.0 times, or about 0.7 to 1.8 times the minimum width of the protruding pattern 230, or about It may range from 0.8x to 1.7x, or from about 0.9x to 1.6x, or from about 1.0x to 1.5x.

As described above, the pattern layer 200 including the protruding pattern 230 may have porosity and may have a plurality of pores P. The plurality of pores P includes a first pore P1 , a second pore P2 , and a third pore P3 , and may further include a fourth pore P4 . In the present specification, the term 'pore' may be used interchangeably with terms such as 'void' and 'pore'.

The first pore P1 is exposed on the upper surface of the protruding pattern 230 and is positioned at an edge of the protruding pattern 230 when viewed from a plan view, and means a pore contributing to an increase in the circumferential length L. That is, the first pore P1 may form a recessed portion of the flat edge of the protruding pattern 230 . The first pore P1 may have a shape such as a circular arc or an elliptical arc when viewed from a plan view.

The second pore P2 is exposed on the upper surface of the protruding pattern 230, that is, the polishing surface, and contributes to the increase in the circumferential length L of the polishing surface formed by the protruding pattern 230. P1) may be the same. On the other hand, the second pore P2 is not shaped to form an indentation like the first pore P1, but has a shape of a closed curve such as a circle, an ellipse, or a distorted circle or ellipse in a plane view point. is different from

In an exemplary embodiment, the area occupied by the pores exposed on the top of the protruding pattern 230 with respect to the entire area of the upper surface of any one protruding pattern 230 when viewed from a plan view, that is, the first pore P1 and the second pore ( P2) is about 10% to 80%, or about 10% to 70%, or about 10% to 60%, or about 10% to 50%, or about 20% to 40%, or about 25% % to 35%.

In other words, in any one protruding pattern 230, the polishing area S formed by the one protruding pattern described above is about 20% to 90% of the apparent area of any one protruding pattern, for example (W×W). %, or about 30% to 90%, or about 40% to 90%, or about 50% to 90%, or about 60% to 80%, or about 65% to 75%.

The first pores P1 and the second pores P2 may be substantially uniformly distributed. If too many first pores P1 and second pores P2 are formed, that is, if the arrangement density is too high, too many first pores P1 located at the edge may be formed. In this case, the upper surface of the protruding pattern 230, that is, the polishing surface, may not have a perfect shape, and durability may decrease, such as the protruding pattern 230 collapsing during the polishing process. On the other hand, when the first pores P1 and the second pores P2 are formed too small, an increase in the circumferential length of the edge of the protruding pattern 230 may be insignificant.

In the process of manufacturing the polishing pad 11 including the protruding pattern 230 having porosity according to the present embodiment, first, the contact pressure necessary for polishing and the planar shape and length of the protruding pattern 230 are determined, , the size of the pores P included in the protruding pattern 230 may be determined. In addition, the polishing area of the protruding pattern 230, that is, the upper area may be determined in consideration of the contact pressure. Next, a circumferential length per unit area of the protruding pattern 230 is determined in consideration of the determined contact pressure and polishing area, and accordingly, the polishing pad 11 including the pattern layer 200 including the protruding pattern 230 is manufactured. can do.

In this case, as described above, it is not easy to simultaneously control the factors affecting the polishing rate, that is, the ratio of the polished area of the protruding pattern 230 and the circumferential length per unit area. In particular, there is a limit to increasing the circumferential length per unit area in a state where the required polishing area is determined. When the circumferential length is increased by changing the pattern shape, the polishing area may be reduced, or at least the minimum width of the pattern may be reduced, resulting in an increase in manufacturing cost.

However, according to the present embodiment, it is possible to relatively easily increase the circumferential length per unit area while substantially maintaining the polishing area by using the pores P of the protruding pattern 230 . In the case of having the area ratio of the first pore P1 and the second pore P2 as described above, when the first pore P1 and the second pore P2 that cause an increase in circumferential length do not exist The circumferential length of the protruding pattern 230 according to the present embodiment having the first pores P1 may be increased by about 1.5 to 3.5 times, about 2.0 to 3.0 times, or about 2.2 to 2.7 times.

In addition, although a slight difference may occur depending on the planar shape of the protruding pattern 230, as in the present embodiment, the protruding pattern 230 has edges extending in the first direction (X) and the second direction (Y). In this case, the total circumferential length of any one protruding pattern 230 is about 4 times to 50 times, about 5 times to 50 times, or about 8 times to 40 times the minimum width (W) of the protruding pattern 230. , or about 10 to 30 times, or about 15 to 25 times.

Alternatively, the circumferential length formed by the protruding pattern 230 per unit area is about 0.1 to 1.0 times, about 0.2 to 0.9 times, or about 0.3 times the reciprocal of the minimum width (W) of any one protruding pattern 230. times to 0.8 times.

Meanwhile, as described above, the lower limit of the ratio of the polishing area occupied by the protrusion patterns 230 to the total area of the polishing pad 11 is about 1.0%, about 3.0%, or about 5.0%, or about 10%, and the upper limit is about 1.0%. may be about 80%, or about 70%, or about 60%, or about 50%, or about 45%, or about 40%, or about 35%, or about 30%.

In this case, the ratio of the area occupied by the first pores P1 and the second pores P2 on the upper surface of the protrusion pattern to the total area of the polishing pad 11, or the first pores P1 and the second pores per unit area ( The proportion of the area occupied by P2) may be between about 0.01% and 25%, or between about 0.5% and 20%, or between about 1.0% and 15%.

In addition to the ratio of the upper area of the protruding pattern 230 (ie, the actual polishing area) and the circumferential length per unit area, the inventors of the present invention have determined that the protruding pattern 230 has a predetermined The present invention has been completed by discovering elements in the case of having pores (P) larger than the size. That is, the area occupied by the pores P as described above, the area occupied by the pores P to the total area, and the area ratio of the upper area of the protruding pattern 230 excluding the area occupied by the pores P are When within the above range, excellent polishing properties may be exhibited.

The first pore P1 and the second pore P2 may have substantially the same size. Since the first pore P1 is located at the edge of the protruding pattern 230 and does not have a perfect circular or elliptical shape, the size (eg, diameter, particle size) of the first pore P1 is ) can be understood as a size corresponding to twice the radius of curvature of the circular arc formed, but the present invention is not limited thereto. If the first pore P1 and the second pore P2 do not have a perfect circular shape but have an elliptical or distorted shape, the size of the pore is the diameter of a virtual circle corresponding to the area of the elliptical shaped pore, that is, Means equivalent diameter.

Both the size of the pores P, that is, the diameter distribution range and the average diameter, may affect the removal rate, but the average diameter may be a very important factor. As described above, the arrangement density or density of the pores P may also affect the edge shape and durability of the protruding pattern 230, but the average diameter of the pores P may also have an effect.

In an exemplary embodiment, the average diameter of the pores P may be in the range of about 5 μm to 50 μm, or about 10 μm to 45 μm, or about 15 μm to 40 μm, or about 20 μm to 35 μm. .

When the average diameter of the pores P is too large, for example, a plurality of first pores P1 are not located on any one side forming the minimum width of the protruding pattern 230, but one on any one side. Only three levels of first pores P1 may be located, or even the size of the first pores P1 may be greater than the length of any one side of the protruding pattern 230 . In this case, it is difficult to show the effect of substantially increasing the circumferential length, and rather, the polishing area of the protruding pattern 230 may be reduced. In addition, the difference between the area of the upper part of the protruding pattern 230 excluding the area of the first pores P1 and the area of the upper part of the protruding pattern 230 excluding the area of the entire pores P increases, and the first The designed polishing rate may not be displayed.

On the other hand, if the average diameter of the pores P is too fine, durability of the protruding pattern 230 may deteriorate due to the first pores P1 located at the edge of the protruding pattern 230 and may cause polishing defects.

In spite of the difference in the average diameter of the pores P, the desired polishing characteristics may be improved by configuring the arrangement density and distribution of the pores, such as the area occupied by the pores P, as described above.

Although the present invention is not limited thereto, the diameter distribution of the pores P including the first pores P1 and the second pores P2 is about 1 μm to 500 μm, or about 1 μm to 400 μm, or It may be in the range of about 1 μm to 300 μm.

In some embodiments, a side surface of the protruding pattern 230 may have a third pore P3. That is, the third pores P3 refer to pores exposed only on the side surface of the protruding pattern 230 , not on the top surface. At least some of the plurality of pores included in the protruding pattern 230 may be exposed to a side surface of the protruding pattern 230 to form a recessed groove.

The first pores in that the grooves on the side surfaces of the protruding pattern 230, that is, the third pores P3, are not exposed to the upper surface of the protruding pattern 230, that is, the polishing surface, and do not affect the increase in the circumferential length of the upper edge ( It is different from P1) and the second pore P2.

A predetermined separation distance may be provided between protruding patterns 230 adjacent to each other. Polishing liquid, that is, the slurry 70 flows through the separation space and may affect polishing characteristics. If the slurry flow path between the protruding patterns 230 is too small, problems such as partial agglomeration of the slurry 70 may occur. There is a limit to controlling the separation distance between the protruding patterns 230 having a predetermined shape, and a reduction in the area of the upper portion of the protruding patterns 230 may occur.

The side surface of the protruding pattern 230 according to the present embodiment has a predetermined groove formed by the third pores P3, and can contribute to increasing the flow of the slurry 70 using the groove. The size of the third pore P3 may be substantially the same as that of the first pore P1 and the second pore P2, and overlapping descriptions will be omitted.

Meanwhile, although the present invention is not limited thereto, when the polishing process is performed using the polishing pad 11 according to the present embodiment, the protruding pattern 230 is shaved from the upper end, and the height H of the protruding pattern 230 gradually increases. can be lowered At this time, the height of the protruding pattern 230 is lowered, and the third pores P3 are exposed, and may change to the aforementioned first pores P1.

As described above, the size of the pores (P) is a very important factor in that it affects the polishing efficiency by causing an increase in the circumferential length on the polishing surface and a change in the polishing area by the pores (P1, P2) in the plan view. am. In addition, in particular, in the case of the third pore P3, it may be exposed to the side surface of the protruding pattern 230 and affect durability of the protruding pattern 230.

From this point of view, on any cross section, the ratio of the sum of the heights occupied by the third pores P3 to the vertical height H of the protruding pattern 230 is about 10% to 50%, or about 15% to 50%, or about 20% to 50%, or about 20% to 45%, or about 20% to 40%. Also, the average diameter of the third pores P3 may be in a range of about 5% to 15%, or about 10% to 15% of the height H of the protrusion pattern 230 .

If the diameter of one third pore P3 or the sum of the diameters of the third pores P3 is too large, the protruding pattern 230 has too great fluidity in the third direction Z, and/or the protruding pattern ( 230) may deteriorate. Therefore, it is preferable to set the sum of the diameter of one third pore P3 and the length in the third direction Z occupied by the plurality of third pores P3 arranged in the third direction Z to be within the above range. can

As described above, the first pores P1 and the second pores P2 contribute to an increase in the circumferential length of the edge of any protruding pattern 230 and may also affect the polishing area formed by the protruding pattern 230. there is. In addition, the third pores P3 may be exposed on the side of the protruding pattern 230 to affect the flow of the slurry 70 .

In manufacturing the polishing pad 11, for example, when the circumferential length of the protruding pattern 230 is controlled after determining the polishing area in design, the size of the protruding pattern 230, such as the width, is very limited. In addition, when the protruding pattern 230 is formed in detail to secure a sufficient circumferential length, manufacturing cost increases.

However, when the protruding pattern 230 forms pores as in the present embodiment, a circumferential length greater than the calculated one may be formed. Accordingly, when the protruding pattern 230 is precisely formed, a greater increase in the circumferential length can be achieved even though the manufacturing cost is increased as in the prior art. For example, the circumferential length of the protruding pattern 230 of the polishing pad 11 actually manufactured may be greater than the initially determined circumferential length per unit area. On the other hand, even if a larger protruding pattern 230 is formed than in the prior art, that is, even if the manufacturing cost is reduced, there is an advantage in securing a circumferential length of the conventional level.

In some embodiments, the remaining portion of the pattern layer 200 except for the protruding pattern 230, that is, the upper surface 210s of the base 210 may have exposed pores. A pore exposed through the upper surface 210s of the base 210 may be defined as a fourth pore P4. The fourth pore P4 may form a groove recessed toward the base 210 .

Unlike the pores on the upper surface of the protrusion pattern 230, that is, the first pores P1 and the second pores P2, the fourth pores P4 exposed through the upper surface of the base 210 are not located on the polishing surface. There is a difference in That is, the fourth pores P4 may not be located on the polishing surface and may not contact the substrate to be polished. The size of the fourth pore P4 may be substantially the same as that of the first pore P1 and the second pore P2, and overlapping descriptions will be omitted.

In an exemplary embodiment, the fourth pore P4 may have an occupied area within a predetermined range. For example, the ratio of the area occupied by the pores exposed on the base 210, that is, the fourth pores P4, to a predetermined inspection area, for example, the inspection area of the base 210, is about 10% to 50%, or about 10% to 40%, or about 15% to 40%, or about 20% to 40%, or about 25% to 40%, or about 30% to 40%.

When the fourth pores P4 having the same average size as described above are located on the upper surface 210s of the base 210 that does not contribute to yarn polishing, when the fourth pores P4 occupy an excessively large area. Abrasive particles or polishing by-products may be stagnant in the fourth pores P4. On the other hand, if the occupied area of the fourth pore P4 is too small, it may not contribute to improving the flow efficiency of the slurry.

In addition to the aforementioned pores, that is, the first to fourth pores P1 to P4 exposed through the surface of the pattern layer 200 , pores may also be formed inside the pattern layer 200 .

Also, in some embodiments, the support layer 100 may also have pores. The pores of the support layer 100 may be defined as fifth pores P5. The fifth pores P5 are at least partially located inside the support layer 100, and at least partially exposed through a surface of the support layer 100, for example, one surface of the support layer 100 on which the pattern layer 200 is disposed.

In this case, as will be described later, in the manufacturing method of the polishing pad 11, when the pattern layer 200 is directly cured on the support layer 100, at least a part of the composition constituting the pattern layer is exposed on the support layer 100. 5 pores (P5) can penetrate. That is, the base 210 of the pattern layer 200 may at least partially fill or penetrate the fifth pores P5. Through this, a strong bond can be formed between the support layer 100 and the pattern layer 200 even without interposing a separate adhesive layer between the support layer 100 and the pattern layer 200 . Although the present invention is not limited thereto, when the support layer 100 and the pattern layer 200 are separately manufactured and arranged, the pattern layer 200 may not be located within the fifth pores P5 of the support layer 100. may be

Also, as described above, the porosity of the support layer 100 may be greater than that of the pattern layer 200 . That is, the porosity of the pores formed by the fifth pores P5 of the support layer 100 is the first pores P1, the second pores P2, the third pores P3 and the fourth pores P5 of the pattern layer 200. It may be greater than the porosity formed by the pores including the pores P4.

As a non-limiting example, the average diameter of the pores including the first to fourth pores P1 to P4 may be smaller than the average diameter of the fifth pores P5.

As another non-limiting example, the distribution density of the pores including the first to fourth pores P1 to P4 may be smaller than the distribution density of the fifth pores P5.

As another non-limiting example, with respect to a predetermined inspection area, the surface roughness of the surface of the pattern layer 200, for example, the top and side surfaces of the protruding pattern 230 and/or the top surface of the base 210, is the support layer 100. ) may be less than the surface roughness of

In this way, using the difference between the first pore P1 to the fifth pore P5 , tracking characteristics as described below may be more efficiently displayed. Hereinafter, follow characteristics and polishing characteristics of the polishing pad 11 according to the present embodiment will be described with further reference to FIGS. 7 to 10 .

7 is an exemplary schematic diagram showing a state in which the polishing pad 11 is in contact with the substrate 50 to be polished, and FIG. 8 is a state in which the polishing pad polished by a conventional conditioner is in contact with the substrate 50 to be polished. It is an exemplary schematic diagram shown.

Referring first to FIG. 7 , when the surface of the lower surface of the substrate 50 to be polished has fine curves, the polishing pad 11 according to the present embodiment has sufficient flexibility so that the support layer 100 can be bent in the vertical direction, for example, by gravity. Elastic deformation in the direction may be possible. Through this, the upper surface of the protruding pattern 230 forming the polishing surface can adhere to the curved surface of the substrate 50 to be polished, and the slurry is evenly distributed between the pattern layer 200 and the substrate 50 to be polished, resulting in excellent polishing rate can be achieved.

In addition, the portion where the polishing target substrate 50 protrudes relatively downward and contacts the polishing pad 11 is where the polishing target substrate 50, which is relatively concave upward, contacts the polishing pad 11. A pressure that is relatively greater than that of the part may be applied, and accordingly, polishing non-uniformity (NU) may be minimized and uniform polishing may be achieved.

In particular, in the polishing pad 11 according to the present embodiment, the rigidity of the pattern layer 200 is greater than that of the support layer 100, so that when the polishing pad 11 is pressed against the substrate 50 to be polished, the pattern layer 200 The degree of deformation of the support layer 100 may be greater than the degree of deformation of the protrusion pattern 230 and the base 210 of ). As a non-limiting example, the pattern layer 200 may be substantially undeformed or cause only minimal deformation, and only the support layer 100 may be flexibly deformed. If the protruding pattern 230 has excessive flexibility and is easily deformed by vertical pressure, the polished area of the protruding pattern 230 is deformed and the intended polishing rate is not displayed due to shape deformation such as tilting in the horizontal direction. may not be

Therefore, the support layer 100, not the pattern layer 200, is deformed so that it follows the curve of the surface of the substrate 50 to be polished, and at the same time, an excellent polishing rate can be exhibited. The present invention is not limited thereto, but as a non-limiting example, the pattern layer 200 including the protrusion pattern 230, or the maximum rate of change in the plane direction with respect to the pressure in the vertical direction of the material constituting the pattern layer 200 The material may be selected to be about 20.0% or less, or about 15.0% or less, or about 10.0% or less, or about 5.0% or less.

On the other hand, further referring to FIG. 8, in the case of the conventional polishing pad 11', even though the surface roughness is maintained by a conditioner (not shown), the polishing pad 11' shows a uniform roughness over the entire surface. It is substantially difficult to perform the polishing, and thus cannot adhere to the substrate 50 to be polished having a curved surface, increasing polishing non-uniformity and even causing scratch defects.

9 is another exemplary schematic diagram showing a state in which the polishing pad 11 is in contact with the substrate 50 to be polished, and FIG. 10 is a state in which the polishing pad polished by a conventional conditioner is in contact with the substrate 50 to be polished. It is an exemplary schematic diagram showing. 9 and 10 illustrate a case in which the substrate 50 to be polished includes a device pattern 50b disposed on a base substrate 50a and an overcoating layer 50c thereon. The device pattern 50b may be a wiring pattern made of metal or the like, an active pattern made of a semiconductor material, or the like, but is not particularly limited.

Referring first to FIG. 9 , when an overcoating layer 50c having a very fine degree of curvature or step is located on the lower surface of a substrate 50 to be polished, the polishing pad 11 according to the present embodiment is An upper end of the pattern layer 200 may have a uniform height, and the overcoating layer 50c may be uniformly planarized. That is, by selectively polishing only the overcoating layer 50c that protrudes relatively convexly downward and minimizing physical pressure on the overcoating layer 50c that is relatively concavely indented upward, thereby damaging the elements of the substrate 50 to be polished. It is possible to achieve global planarization without Therefore, the polishing pad 11 according to the present embodiment may be applicable to an STI structure process or the like. This will be described later along with experimental examples.

On the other hand, further referring to FIG. 10, in the case of the conventional polishing pad 11', it is substantially difficult to exhibit uniform roughness over the entire surface, and in some cases, polishing to the overcoating layer 50c, which is relatively concavely recessed upward. can be done Accordingly, since damage may occur to elements of the substrate 50 to be polished or only partial planarization may be achieved, it is not suitable for use in a precision planarization process.

Hereinafter, other embodiments of the present invention will be described. However, a description of the same or extremely similar configuration as the above-described embodiment will be omitted, and this will be clearly understood by those skilled in the art from the accompanying drawings.

11 is a planar layout of a polishing pad according to another embodiment of the present invention. 12 is an enlarged perspective view showing part A of FIG. 11 by enlarging it. FIG. 13 is a cross-sectional view taken along line BB' of FIG. 12 .

Referring to FIGS. 11 to 13 , the polishing pad 12 according to the present embodiment is different from the previous embodiment in that it has a trench 300 formed in the pattern layer 202 .

The trench 300 may function as a channel for transporting and discharging slurry or the like dropped on the upper surface of the polishing pad 12 . If necessary, the term 'trench' used in this specification may be used interchangeably with terms such as a channel, a groove, and a groove.

The trench 300 may include a straight radiation trench 310 extending in the first direction (X), the second direction (Y), and/or the diagonal direction. The radiation trench 310 may have a shape extending substantially in a radial direction from the center of the circular polishing pad 12 . FIG. 11 illustrates a case in which eight radiation trenches 310 inclined in the first direction X, the second direction Y, and the direction of 45 degrees are formed.

Accordingly, the polishing pad 12 may be partitioned into eight fan-shaped areas with a central angle of approximately 45 degrees. At least some of the radiation trenches 310 of the polishing pad 12 according to the present embodiment may extend in the arrangement direction of the protrusion pattern 230, that is, in the first direction X and the second direction Y. . However, the present invention is not limited thereto.

The radiation trench 310 may induce the slurry to move or flow in a radial direction of the polishing pad 12 due to centrifugal force generated as the polishing pad 12 rotates. Through this, even when the nozzle of the polishing device does not move and the slurry is dropped, the slurry can be applied to the entire surface of the polishing pad 12, and excessive aggregation is prevented to improve the utilization efficiency of the slurry can make it In some embodiments, the radiation trench 310 may be configured to become deeper in an outer direction.

In addition, the trench 300 may further include concentric trenches 320 arranged in a concentric circle with respect to the center of the circular polishing pad 12 . Although FIG. 11 illustrates a case in which there are three concentric trenches 320, it goes without saying that the present invention is not limited thereto.

Any concentric trench 320 may be provided to cross the plurality of radiation trenches 310 . The concentric trenches 320 may induce the slurry to move or flow in the rotational direction of the polishing pad 12, that is, in the circumferential direction, by centrifugal force or the like generated as the polishing pad 12 rotates.

Although the present invention is not limited thereto, the slurry preferentially flowing in the outer direction of the polishing pad 12 by the radiation trench 310 may flow in the rotational direction of the polishing pad 12 by the concentric trench 320. there is. Therefore, forming the maximum width of the radiation trench 310 greater than the maximum width of the concentric trench 320 may be advantageous in terms of preventing aggregation of the slurry. By way of non-limiting example, the width of the radiating trench 310 ranges from about 0.1 mm to 3.0 mm, or from about 0.3 mm to 2.5 mm, or from about 0.5 mm to 2.0 mm, or from about 1.0 mm to 1.5 mm. can be in

In an exemplary embodiment, an inner wall of the trench 300 formed in the pattern layer 202 may have exposed pores. A pore exposed through an inner wall or a basal surface within the trench 300 , particularly a pore exposed through the inner wall, may be defined as a sixth pore P6 . The average diameter of the sixth pores P6 may be in the range of about 5 μm to 50 μm, or about 10 μm to 45 μm, or about 15 μm to 40 μm, or about 20 μm to 35 μm.

Meanwhile, unlike those shown in the drawings, substantially no pores, relatively few pores, or relatively small pores may be present in the bottom surface 310s of the trench 300 . Although the present invention is not limited thereto, when the trench 300 is formed using a laser or the like, at least a portion of the pores may be melted or collapsed in the process of irradiating the basal surface 310s of the trench 300 with the laser.

For example, the surface roughness defined as the skewness of the basal surface 310s of the trench 300, that is, the surface skewness, is greater than the surface roughness defined as the skewness of the inner wall of the trench 300, that is, the surface skewness. can be big The surface skewness of the inner wall may have a negative value, and the surface skewness of the base surface 310s may have a negative value, 0, or a positive value. The surface skewness may be measured for an inspection area of about 0.1 mm ² or greater. The upper limit of the inspection area is not particularly limited, but may be, for example, about 5.0 mm ² .

Accordingly, when the surface skewness of the inner wall is subtracted from the surface skewness of the base surface 310s, it may have a positive value of 0 or more. That is, the difference may be greater than zero in the surface state of the polishing pad 12 before polishing, or during processing after polishing.

As another example, the arrangement density of the sixth pores P6 positioned on the inner wall of the trench 300 may be greater than the arrangement density of the sixth pores P6 positioned on the basal surface 310s of the trench 300 . . Specifically, the ratio of the area occupied by the sixth pores P6 on the inner wall of the trench 300 may be about 5% to 50%, or about 10% to 30% of the area of the inner wall to be inspected. .

Similarly, the surface skewness of the bottom surface 310s of the trench 300 may be greater than the surface skewness of the top surface 210s of the base 210 and/or the surface skewness of the protrusion pattern 230 . The surface skewness of the upper surface 210s of the base 210 is based on the fourth pores P4, and the surface skewness of the protrusion pattern 230 is based on the first pores P1, the second pores P2 and/or the second pores P2. It may be based on 3 pores (P3).

The depth D1 of the trench 300 may be smaller than the thickness of the base 210, for example, the maximum thickness. Accordingly, the supporting layer 100 may not be visible through the trench 300 and may be covered by the remaining pattern layer 202 . In this specification, the depth D1 of the trench 300 means the vertical shortest length from the reference plane, that is, the upper surface of the base 210 to the lowermost base surface of the trench 300 .

In some embodiments, a depth of the trench 300 , eg, a depth D1 of the radiation trench 310 may be greater than a maximum height of the protrusion pattern 230 . As will be described later, the trench 310 may contribute to the fluidity of the pattern layer 202 . Accordingly, it may be desirable for the trench 310 to have a sufficient depth in view of fluidity of the pattern layer 202 and follow-up of the substrate to be polished.

FIG. 14 is a cross-sectional view of a polishing pad according to another embodiment of the present invention, showing the same position as those of FIGS. 6 and 13 described above.

Referring to FIG. 14 , the polishing pad 13 according to the present embodiment is different from the above-described embodiment such as FIG. 13 in that the upper surface of the support layer 103 is partially visible through the trench 313 .

The depth of the trench, eg, the radiation trench 313 , may be substantially equal to the thickness of the base 210 , eg, the maximum thickness. Accordingly, the upper surface of the support layer 103 may be exposed through the trench 313 .

In this embodiment, the trench including the radiation trench 313 and/or concentric trenches (not shown) imparts a predetermined fluidity to the pattern layer 203, and as described above, the protruding pattern 230 of the polishing pad 13 ) can follow the curve of the substrate to be polished. That is, the upper surface of the support layer 103 may be partially exposed by the trench 313, and the base 210 of the pattern layer 203 may be physically separated and partitioned by being spaced apart from each other based on the radiation trench. It is the same as described above that any one of the pattern layers 203 spaced apart from each other has a substantially fan-shaped planar shape.

By the pressure in the third direction (Z) applied to the pattern layer 203 by the bases 210 separated from each other and spaced apart based on the radiation trench 313 on one support layer 103, etc. It can be made to have fluidity in the plane direction, and vertical tracking along the curved surface of the substrate to be polished can be made more flexible.

Since the other first pores P1 to sixth pores P6 have been described above, duplicate descriptions will be omitted.

FIG. 15 is a cross-sectional view of a polishing pad according to another embodiment of the present invention, showing the same position as those of FIGS. 6 and 13 described above.

Referring to FIG. 15 , the polishing pad 14 according to the present embodiment is different from the embodiment of FIG. 14 in that the support layer 104 also has a partially recessed trench 414 .

In an exemplary embodiment, the pattern layer 204 may have a first trench 314 and the support layer 104 may have a second trench 414 . A depth of the first trench 314 may be substantially the same as a thickness of the base 210 . A depth D2 of the second trench 414 may be smaller than a thickness of the support layer 104 .

The first trench 314 and the second trench 414 may overlap each other in the third direction Z and be connected to each other. The first trench 314 and the second trench 414 may each include the aforementioned radiation trench and/or the concentric trench.

The support layer 104 may have a second trench 414 and provide a channel through which the slurry flows. In some embodiments, the inner wall of the second trench 414 of the support layer 104 may also have exposed pores. A pore exposed through the inner wall of the second trench 414 may be defined as a seventh pore P7 . The average diameter of the seventh pores P7 may be in the range of about 10 μm to 200 μm, or about 20 μm to 150 μm, or about 30 μm to 100 μm.

On the other hand, substantially no pores, a relatively small number of pores, or relatively small pores may exist in the bottom surface 414s of the second trench 414 . Although the present invention is not limited thereto, after disposing the pattern layer 204 having or not having the first trench 314 on the support layer 104, the second trench 414 of the support layer 104 is formed using a laser or the like. ), at least some of the pores may be melted or collapsed in the process of irradiating the laser to the basal surface 414s of the second trench 414 .

For example, the surface skewness of the basal surface 414s of the second trench 414 may be greater than the surface skewness formed by the seventh pores P7 of the inner wall of the second trench 414 . The surface skewness of the inner wall may have a negative value, and the surface skewness of the base surface 414s may have a negative value, 0, or a positive value. Accordingly, when the surface skewness of the inner wall is subtracted from the surface skewness of the base surface 414s, it may have a positive value of 0 or greater.

For another example, the arrangement density of the seventh pores P7 positioned on the inner wall of the second trench 414 may be greater than the arrangement density of the pores positioned on the bottom surface 414s of the second trench 414 . Specifically, the ratio of the area occupied by the seventh pores P7 on the inner wall of the second trench 414 is about 10% to 60%, or about 20% to 50% of the area of the inner wall to be inspected. can

In some embodiments, the surface skewness of the base surface 414s of the second trench 414 is surface skewness formed by the surface of the pattern layer 204, for example, the fourth pores P4 on the upper surface of the base 210, and/or the surface skewness formed by the first to third pores P1 to P3 on the surface of the protruding pattern 230 may be greater. The surface skewness of the surface of the pattern layer 204 may have a negative value, and the surface skewness of the base surface 414s may have a negative value, 0, or a positive value.

Since the upper part of the protruding pattern 230 forming the polishing surface is manufactured to have negative skewness, the protruding pattern 230 except for the pores is flat, so that the device pattern formed on the surface of the wafer to be polished and the overcoating layer pattern thereon are It is possible to improve the characteristics of flat polishing. At the same time, by increasing the skewness of the second trench 414 in a relatively positive direction, the slurry flow is not stagnant due to too deep pores in the second trench 414 or residual abrasive particles and polishing byproducts are not stagnant in the deep pores. Can be configured for easy removal.

In some embodiments, in the first trench 314 and the second trench 414 connected to each other, the surface roughness formed by the seventh pores P7 of the inner wall of the second trench 414 is The inner wall of the trench 314 may have a surface roughness greater than that formed by the sixth pores P6 .

Compared to the relatively deep second trench 414 , the shallow first trench 314 may have a relatively greater effect on the slurry flow. Accordingly, the flow of the slurry may be stagnant by the sixth pores P6 of the first trench 314 or the remaining abrasive particles and polishing byproducts may be easily removed in the deep pores without being stagnant.

Since the other first pores P1 to sixth pores P6 have been described above, duplicate descriptions will be omitted.

FIG. 16 is a cross-sectional view of a polishing pad according to another embodiment of the present invention, showing the same position as those of FIGS. 6 and 13 described above.

Referring to FIG. 16 , the polishing pad 15 according to the present embodiment is different from the embodiment of FIG. 15 in that the supporting layer 105 is penetrated by a trench.

The pattern layer 205 has the first trench 315 and the support layer 100 has the second trench 415, and the first trench 315 and the second trench 415 overlap each other and are connected to each other as described above. same. In this embodiment, the second trench 415 may completely penetrate the supporting layer 105 . That is, the depth of the second trench 415 may be substantially the same as the thickness of the support layer 105 . Accordingly, other components (not shown) under the polishing pad 15 may be viewed through the trenches 315 and 415 .

Since the other first pores P1 to seventh pores P7 have been described above, duplicate descriptions will be omitted.

Hereinafter, a method for manufacturing a polishing pad according to an embodiment of the present invention will be described.

17 is a schematic diagram illustrating a method of manufacturing a polishing pad according to an embodiment of the present invention. 18 is a schematic diagram showing a manufacturing method of a polishing pad according to another embodiment of the present invention.

Referring first to FIG. 17 , the method of manufacturing a polishing pad according to the present embodiment may include forming a pattern layer 200 on the support layer 100 . For example, the support layer 100 may be transferred roll-to-roll from the unwinding roll 1001 to a winding roll (not shown) in the form of a film. A plurality of transfer rolls 1002 may be suitably used for this purpose. The support layer 100 may be in a state in which pores having a predetermined size are formed therein.

A curable composition (S) may be applied on the transferred support layer 100 . The curable composition S may fill the recessed pattern of the pattern mold 1003 on the support layer 100 . The curable composition (S) may use the application unit 1005, but the present invention is not limited thereto.

Also, the curable composition S filled in the recessed pattern may be at least partially cured by the curing unit 1007 . The curing unit 1007 may be a light irradiation device or the like. The light irradiation device may be appropriately selected according to the curing conditions of the curable composition (S).

Accordingly, the pattern layer 200 may be formed on the support layer 100 . In the polishing pad according to the present embodiment, the pattern layer 200 may be directly formed on the support layer 100 . That is, in the process of initially applying the curable composition (S) on the support layer 100 , the curable composition (S) may at least partially fill or penetrate the exposed pores of the support layer 100 .

Although not shown in detailed drawings, the cured pattern layer 200 may have pores. Since the shape, structure, and other pores of the pattern layer 200 have been described above, duplicate descriptions will be omitted. The size of pores in the pattern layer 200 may be controlled using light irradiation conditions, for example, the amount of light irradiated, the wavelength of light, the direction of light, and the like. The size of the pores of the cured pattern layer 200 is smaller than that of the support layer 100 as described above.

Referring next to FIG. 18, in a method of manufacturing a polishing pad according to another embodiment of the present invention, a pattern layer 200 is formed by filling and curing a curable composition S in a recessed pattern of a pattern mold 1003, It may be prepared by disposing the manufactured pattern layer 200 on the support layer. That is, unlike FIG. 17 in which the pattern layer is cured on the support layer, the pattern layer 200 may be disposed on the support layer after curing the cured pattern layer 200 .

18 illustrates a case in which the curable composition (S) is filled in the depression pattern in the same manner as slit coating, but the present invention is not limited thereto. The pattern layer 200 cured by the curing unit 1007 may have pores P therein. The average diameter of the pores P may be in the range of about 5 μm to 50 μm, or about 10 μm to 45 μm, or about 15 μm to 40 μm, or about 20 μm to 35 μm.

Since the shape, structure, and other pores (P) of the pattern layer 200 have been described above, duplicate descriptions will be omitted.

17 and 18, forming the pattern layer 200, specifically filling the curable composition (S) and/or curing the curable composition (S) using the curing unit (1007). It may be preferable that the step is performed under conditions of about 30% to 70% relative humidity, or about 40% to 70% relative humidity. When the curable composition (S) includes urethane or the like, it may be easy to fill the curable composition (S) in a fine-sized depression pattern within the above humidity range. Although the present invention is not limited thereto, if the pattern layer 200 is formed under conditions higher than the above humidity range, the curable composition S may not be completely filled in the recessed pattern due to the surface tension of the pattern mold 1003. can In this case, as described above, it may be difficult to achieve the purpose of increasing the circumferential length of the protruding pattern using the fine pores on the surface of the protruding pattern of the pattern layer 200, for example, the first pores P1 and the second pores P2.

19 is a schematic cross-sectional view of the manufactured polishing pad. FIG. 20 is a schematic diagram illustrating a process of forming a trench in the polishing pad of FIG. 19 .

Referring further to FIG. 19 , the polishing pad manufactured according to FIG. 17 or 18 may include a pattern layer 200 disposed on the support layer 100 . The pattern layer 200 may include a base 210 and protruding patterns 230 . The pattern layer 200 includes a first pore P1 and a second pore P2 positioned on the upper surface of the protruding pattern 230, a third pore P3 positioned on the side surface of the protruding pattern 230, and a base. Having the fourth pore (P4) located on the upper surface (210s) of (210) is as described above. Also, the support layer 100 may have a fifth pore P5.

Although not shown in the drawings, in another embodiment, the pattern mold used for manufacturing the pattern layer 200 further has a depression pattern having a shape corresponding to the trench, and accordingly, the cured pattern layer 200 has a trench (not shown). ) may be formed.

Subsequently, further referring to FIG. 20 , the pattern layer 200 is at least partially removed using a laser L to form a first trench 314 in the pattern layer 200 . In addition, the second trench 414 may be formed in the support layer 100 by at least partially removing the support layer 100 using a laser L.

The sixth pores P6 and seventh pores P7 exposed during the formation of the trenches 314 and 414, the surface of the pattern layer 200 and the inner wall of the first trench 314, and the supporting layer 100 Since the surface roughness of the inner wall and the base surface of the second trench 414 has been previously described, overlapping descriptions will be omitted.

Hereinafter, the present invention will be described in more detail with reference to specific production examples, comparative examples, and experimental examples.

Production Example 1: Production of a polishing pad having a protrusion pattern

A protruding pattern having an approximate 'x' shape was formed in a plan view. At this time, the area occupied by the protrusion pattern was made to be about 10.0% of the total area. The minimum width of the protrusion pattern was about 20 μm. A method of forming the protrusion pattern used laser processing. In addition, the pattern layer had porosity, and the average particle size of the pores was 10 μm and the volume ratio was about 25%. In addition, various polishing pads were prepared by adjusting the pattern size to control the circumferential length.

Production Example 2: Production of a polishing pad having a protruding pattern

A polishing pad having the same shape as in Preparation Example 1 was manufactured except that the minimum width of the protrusion pattern was formed to be about 60 μm. In addition, various polishing pads were prepared by adjusting the pattern size to control the circumferential length.

Production Example 3: Production of a polishing pad having a protrusion pattern

A polishing pad having the same shape as in Preparation Example 2 was manufactured except that the pores had an average particle size of 20 μm and a volume ratio of about 40%. In addition, various polishing pads were prepared by adjusting the pattern size to control the circumferential length.

Production Example 4: Production of a polishing pad having a protrusion pattern

A polishing pad having the same shape as in Preparation Example 2 was manufactured except that the pores had an average particle size of 40 μm and a volume ratio of about 40%. In addition, various polishing pads were prepared by adjusting the pattern size to control the circumferential length.

Production Example 5: Production of a polishing pad having a protrusion pattern

A polishing pad having the same shape as in Preparation Example 2 was manufactured except that the pores had an average particle size of 100 μm and a volume ratio of about 30%.

Production Example 6: Production of a polishing pad having a protrusion pattern

A polishing pad having the same shape as in Preparation Example 2 was manufactured except that the pores had an average particle size of 200 μm and a volume ratio of about 20%.

Experimental Example 1: Polishing rate according to circumferential length per unit area

The effect of the circumferential length per unit area on the polishing rate characteristics was confirmed using the polishing pads according to Preparation Examples 1 to 4. By adjusting the size of the pattern while maintaining about 10% of the polishing area, it is about 1 mm/mm ² , about 2 mm/mm ² , about 3 mm/mm 2 , about 4 mm/mm ² , about 5 mm/mm ^{2 ,} about 6 mm /mm ² , about 7 mm/mm ² , about 8 mm/mm ² , about 10 mm/mm ² , about 15 mm/mm ² , and about 25 mm/mm ^{2 ,} and various polishing pads having circumferential lengths were prepared. At this time, the minimum width and pore conditions of the pattern maintained the conditions presented in Preparation Examples 1 to 4.

For the polishing experiment, an 8-inch oxide wafer and TSO-12 (Soulbrain), a slurry for oxide, were used. The apparent contact pressure was 150 g/cm ² . The apparent contact pressure (Pa) may be defined as a value obtained by dividing the total load applied to the substrate to be polished by the carrier by the area of the substrate to be polished. The rotational speed of the polishing pad was fixed at 61 rpm.

And the results are shown in FIG. 21 . Referring to FIG. 21 , it can be seen that the polishing rate increases as the circumferential length per unit area of the protrusion pattern increases. However, it can be seen that the increase in the polishing rate is not linear, and as the circumferential length increases, the increase gradually decreases and slows down to converge to a predetermined value. For example, polishing efficiency is expected to converge within about 50 mm/mm ² .

Through this, it was confirmed that the polishing rate can be controlled according to the area ratio and the circumferential length.

In particular, comparing Preparation Examples 2 to 4 in which the minimum width of the protrusion pattern is about 60 μm, it can be seen that the removal rate gradually increases as the average particle size of the pores increases even when the circumferential length is the same. Comparing Production Example 1 with Production Example 3 and Production Example 4, it can be seen that Production Example 3 and Production Example 4 show higher polishing rates than Production Example 1, in which the minimum width of the protruding pattern is smaller.

Experimental Example 2: Polishing rate according to pores

Using the polishing pads according to Preparation Examples 1 to 5, the effect of the average pore size on the polishing rate and characteristics was confirmed. The circumferential length of the polishing pad was fixed at 15 mm/mm ² . As a comparative example, a commercial abrasive pad IC1010 from Dow was used.

The polishing conditions were set to one of 61 rpm and 93 rpm for the rotation speed of the pad, and one of 150 g/cm ² and 300 g/cm ² for the polishing pressure, and the horizontal axis was expressed as the product of the rotation speed and the pressure. And the results are shown in Figures 22 and 23.

Referring to FIGS. 22 and 23 , it can be seen that the polishing rate increases as the pore size increases when the protruding pattern has the same minimum width. In particular, comparing Preparation Example 1 and Preparation Example 3, in the case of Preparation Example 3, despite having a larger minimum width, a high level of polishing rate was exhibited. Meanwhile, it was confirmed that the polishing efficiency of the polishing pads according to Preparation Examples 3 to 5 of the present invention further increased as the polishing conditions at higher levels, that is, the polishing rate and the polishing pressure increased.

In the case of Preparation Example 6 in which the average particle size of the pores was 200 μm, the pattern shape collapsed due to the pores, and it was difficult to maintain the polishing area at 10%. In addition, in the case of Preparation Example 6, it was determined that the polishing was not performed because the measured polishing rate was low and damage was observed on the polishing substrate.

Although the above has been described with reference to the embodiments of the present invention, this is only an example and does not limit the present invention, and those skilled in the art in the field to which the present invention belongs will It will be appreciated that various modifications and applications not exemplified above are possible.

Therefore, it should be understood that the scope of the present invention includes modifications, equivalents, or substitutes of the technical ideas exemplified above. For example, each component specifically shown in the embodiment of the present invention can be modified and implemented. And differences related to these modifications and applications should be construed as being included in the scope of the present invention as defined in the appended claims.

1: polishing device
11: polishing pad
100: support layer
200: pattern layer
210: base
230: extrusion pattern

Claims (11)

support layer; And a pattern layer disposed on one surface of the support layer, comprising a pattern layer including a base and a plurality of protruding patterns disposed on the base,
The base has a plurality of pores exposed on the upper surface, and the ratio of the area occupied by the pores of the base to the predetermined base inspection area is 10% to 40%,
The support layer has porosity, but the porosity of the support layer is greater than the porosity of the pattern layer. According to claim 1,
The polishing pad of claim 1 , wherein the support layer has a plurality of pores exposed on the one surface, and the base at least partially fills the pores of the support layer. a support layer having porosity; and
A pattern layer disposed on the support layer and having porosity, including a pattern layer including a plurality of protruding patterns,
The porosity of the support layer is greater than the porosity of the pattern layer polishing pad. According to claim 1,
The polishing pad of claim 1 , wherein the base has a trench, and an inner wall and a bottom surface of the trench each have exposed pores. According to claim 4,
For a predetermined inspection area, surface skewness of the bottom surface of the trench of the base is greater than surface skewness of the upper surface of the base. support layer; And a pattern layer disposed on one surface of the support layer, comprising a pattern layer including a base and a plurality of protruding patterns disposed on the base,
The base has a plurality of pores exposed on the upper surface, and the ratio of the area occupied by the pores of the base to the predetermined base inspection area is 10% to 40%,
The base has a first trench at least partially exposing the one surface of the support layer,
With respect to a predetermined inspection area, surface skewness of one surface of the exposed support layer is greater than surface skewness of the inner wall of the first trench. According to claim 6,
The support layer has a second trench connected to the trench of the base,
The surface roughness of the inner wall of the first trench is smaller than the surface roughness of the inner wall of the second trench. support layer; And a pattern layer disposed on one surface of the support layer, comprising a pattern layer including a base and a plurality of protruding patterns disposed on the base,
The base has a first trench at least partially exposing the one surface of the support layer,
With respect to a predetermined inspection area, surface skewness of one surface of the exposed support layer is greater than surface skewness of the inner wall of the first trench. Forming a pattern layer disposed on the support layer, including forming a pattern layer including a plurality of protruding patterns spaced apart from each other on a base,
With respect to the predetermined base inspection area, the ratio of the area occupied by the pores of the base is 10% to 40%,
The porosity of the support layer is greater than the porosity of the protruding pattern having porosity. According to claim 9,
Forming the pattern layer,
Filling the curable composition into the recessed pattern of the pattern mold, and
Forming a porous protrusion pattern by curing the curable composition within the depression pattern,
The method of manufacturing a polishing pad, wherein the filling and curing of the curable composition are performed under conditions of a relative humidity of 40% to 70%. Forming a pattern layer disposed on the support layer, including forming a pattern layer including a plurality of protruding patterns,
The porosity of the support layer is greater than the porosity of the protruding pattern having porosity.

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