KR102521759B1 - Liquid crystal display device - Google Patents

Abstract

In order to provide a liquid crystal display device capable of implementing a narrow bezel and protecting a thin film transistor from static electricity flowing in from the outside, a first substrate including a display area and a non-display area and a first substrate crossing each other A gate wire and data wire disposed in the display area, a thin film transistor connected to the gate wire and data wire, and a first ground extending along the display area in the non-display area and having both ends located on one side of the non-display area. wiring, a second ground wire spaced apart from the first ground wire and disposed in the non-display area along the first ground wire, and a ground pad connected to both ends of the first and second ground wires and disposed on one side of the non-display area It provides a liquid crystal display device comprising a.

Description

Liquid crystal display device {Liquid crystal display device}

The present invention relates to a liquid crystal display device, and more particularly, to a liquid crystal display device capable of implementing a narrow bezel and protecting a thin film transistor from static electricity introduced from the outside.

In line with the recent information age, the display field has also developed rapidly, and in response to this, as a flat panel display device (FPD) with advantages of thinning, light weight, and low power consumption, liquid crystal display devices (LCDs) have been developed. : LCD), plasma display panel device (PDP), electroluminescence display device (ELD), field emission display device (FED), etc. tube : It is rapidly replacing CRT) and is in the limelight.

Among them, liquid crystal displays are most actively used in fields such as notebooks, monitors, and TVs due to their excellent display of moving images and their high contrast ratio.

1 is a plan view showing a conventional liquid crystal display device.

As shown in the drawing, the conventional liquid crystal display device includes a first substrate 11 including a display area AA and a non-display area NAA surrounding the display area AA, and the first substrate 11 First printed through a flexible circuit board 20 connected to and mounted with a driving integrated circuit 21, a first printed circuit board 30 connected to the flexible circuit board 20, and a flexible circuit cable 35 It includes a second printed circuit board 40 connected to the circuit board 30 .

Specifically, a plurality of gate lines GL and data lines DL are disposed to cross each other in the display area AA on the first substrate 11, and a ground line 15 is displayed in the non-display area NAA. It extends along the area AA, and both ends thereof are located on one side, for example, the upper side of the non-display area NAA.

In addition, first and second GIP circuit parts GIP1 and GIP2 are disposed on the left and right sides of the non-display area NAA, respectively. The first and second GIP circuit parts GIP1 and GIP2 are connected to each gate line GL to generate gate signals. are supplied sequentially.

For example, the first GIP circuit part GIP1 sequentially supplies gate signals to odd-numbered gate lines GL, and the second GIP circuit part GIP2 sequentially supplies gate signals to even-numbered gate lines GL.

In addition, a data pad DP connected to each data line DL and a ground pad 16 connected to both ends of the ground line 15 are disposed on one side, for example, on the upper side of the non-display area NAA.

Here, the data pad DP and the ground pad 16 are connected to the output terminal of the flexible circuit board 20, and the input terminal of the flexible circuit board 20 is connected to the output terminal of the first printed circuit board 30.

In addition, the driving integrated circuit 21 is disposed between the input terminal and the output terminal of the flexible circuit board 20, and the driving integrated circuit 21 and the input terminal and the output terminal are connected to each other through a plurality of signal wires (not shown).

In addition, the second printed circuit board 40 is connected to the first printed circuit board 30 through a flexible circuit cable 35 . At this time, a timing control unit 41 and a power supply unit 42 are mounted on the second printed circuit board 40 and supply control signals and power to the input terminal of the first printed circuit board 30 .

On the other hand, although not shown in the drawings, a second substrate (not shown) bonded to the first substrate 11 is further included.

At this time, since the data pad DP and the ground pad 16 are disposed on one side of the first substrate 11, for example, on the upper side and connected to the output terminal of the flexible circuit board 20, the second substrate (not shown) The upper side of the first substrate 11 is exposed and bonded to the first substrate 11 oppositely.

In addition, although not shown in the drawings, the first and second GIP circuit units GIP1 and GIP2 disposed in the non-display area NAA include a plurality of thin film transistors (not shown), and each gate wiring is provided in the display area AA. A thin film transistor (not shown) connected to (GL) and data line (DL) is disposed.

At this time, the ground wire 15 serves to protect the thin film transistor (not shown) from static electricity introduced from the outside.

Specifically, static electricity introduced from the outside to the side of the first substrate 11 flows through the ground wire 15 disposed in the non-display area NAA, and the ground pad 16 connected to the ground wire 15, Discharge occurs through the ground terminal of the second printed circuit board 40 as a result of sequentially passing through the flexible circuit board 20 connected thereto and the first printed circuit board 30 connected thereto.

In recent years, liquid crystal display devices have pursued light weight and thinness while forming a smaller bezel defined as the width of the non-display area (NAA) outside the display area to implement a slim design of the final product, such as a monitor or TV. It is being requested to do.

In this way, when a narrow bezel is implemented, the distance between the ground wire 15 disposed in the non-display area NAA and the first and second GIP circuits GIP1 and GIP2 becomes closer, so that the external The static electricity introduced from the ground wire 15 is not discharged through the ground terminal of the second printed circuit board 40 electrically connected to the ground wire 15, but rather to the first and second GIP circuits GIP1 and GIP2 adjacent to the ground wire 15. A problem occurs in that a plurality of thin film transistors (not shown) provided and a plurality of thin film transistors (not shown) connected to the first and second GIP circuits GIP1 and GIP2 and disposed in the display area AA are damaged. do.

The present invention is to solve the above problems, and an object of the present invention is to provide a liquid crystal display capable of implementing a narrow bezel and protecting a plurality of thin film transistors.

In order to achieve the above object, the present invention provides a first substrate including a display area and a non-display area surrounding the display area, a gate line and a data line intersecting each other and disposed in the display area, a gate line and A thin film transistor connected to the data line, a first ground wire extending along the display area in the non-display area and both ends of the first ground wire located on one side of the non-display area, and spaced apart from the first ground wire along the first ground wire. A liquid crystal display device including a second ground wire disposed in the non-display area and a ground pad connected to both ends of the first and second ground wires and disposed on one side of the non-display area.

In addition, a protective layer disposed in a region spaced apart from the first and second ground wires is further included.

In addition, it further includes a flexible circuit board connected to the ground pad, a first printed circuit board connected to the flexible circuit board, and a second printed circuit board connected to the first printed circuit board through a flexible circuit cable, and the ground pad Is electrically connected to the ground terminal of the second printed circuit board.

Also, the first and second ground wires are disposed on the same layer or on different layers.

In addition, it further includes a second substrate oppositely bonded to the first substrate, a transparent conductive film disposed on the second substrate, and a conductive member electrically connecting the transparent conductive film and the second ground wire.

The present invention not only implements a narrow bezel, but also has an effect of protecting a plurality of thin film transistors disposed in a display area by separating a ground wire and discharging static electricity to the outside.

1 is a plan view showing a conventional liquid crystal display device.
2 is a plan view illustrating a liquid crystal display device according to an exemplary embodiment of the present invention.
3 is an upper cross-sectional view of a liquid crystal display device according to an embodiment of the present invention.
4 is a cross-sectional view of a liquid crystal display device according to an embodiment of the present invention, and is a cross-sectional view of a side different from that of FIG. 3 .

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

2 is a plan view illustrating a liquid crystal display device according to an exemplary embodiment of the present invention.

As shown in the drawing, the liquid crystal display device according to an embodiment of the present invention includes a first substrate 101 including a display area AA and a non-display area NAA surrounding the display area AA, and A flexible circuit board 120 connected to the first board 101 and having a driving integrated circuit 121 mounted thereon, a first printed circuit board 130 connected to the flexible circuit board 120, and a flexible circuit cable 135 It includes a second printed circuit board 140 connected to the first printed circuit board 130 through.

Specifically, in the display area AA on the first substrate 101, a plurality of gate lines GL and data lines DL are disposed to cross each other, and in the non-display area NAA, first and second gate lines GL and data lines DL are spaced apart from each other. Two ground wires 115a and 115b are disposed extending along the display area AA, and both ends of the two ground wires 115a and 115b are located on one side, for example, the upper side of the non-display area NAA.

At this time, the first ground wire 115a is disposed closer to the display area AA than the second ground wire 115b, thereby supplying a ground voltage to the display area AA and simultaneously supplying the inside of the display area AA. It plays a role in discharging static electricity generated in the first substrate 101 to the outside.

In addition, the second ground wire 115b is disposed at the outermost portion of the non-display area NAA, thereby blocking static electricity flowing from the outside of the first substrate 101 from entering the display area AA and at the same time preventing the first substrate 101 from flowing into the display area AA. It serves to emit to the outside of the substrate 101.

In addition, first and second GIP circuit parts GIP1 and GIP2 are disposed on the left and right sides of the non-display area NAA, respectively. The first and second GIP circuit parts GIP1 and GIP2 are connected to each gate line GL to generate gate signals. are supplied sequentially.

For example, the first GIP circuit part GIP1 sequentially supplies gate signals to odd-numbered gate lines GL, and the second GIP circuit part GIP2 sequentially supplies gate signals to even-numbered gate lines GL.

In addition, on the upper side of the non-display area NAA, for example, a data pad DP connected to each data line DL and a ground pad connected to both ends of the first and second ground lines 115a and 115b, respectively ( 116a, 116b) are arranged.

At this time, as shown in the drawing, both ends of the first ground wire 115a may be connected to the first ground pad 116a and both ends of the second ground wire 115b may be connected to the second ground pad 116b. Unlike the drawings, both ends of the first and second ground wires 115a and 115b may be connected to one ground pad.

In addition, the data pad DP and the first and second ground pads 116a and 116b are connected to the output terminal of the flexible circuit board 120, and the input terminal of the flexible circuit board 120 is connected to the first printed circuit board 130. connected to the output of

In addition, the driving integrated circuit 121 is disposed between the input terminal and the output terminal of the flexible circuit board 120, and the driving integrated circuit 121 and the input terminal and the output terminal are connected to each other through a plurality of signal wires (not shown).

In addition, the second printed circuit board 140 is connected to the first printed circuit board 130 through a flexible circuit cable 135 . At this time, a timing control unit 141 and a power supply unit 142 are mounted on the second printed circuit board 140 and supply control signals and power to the input terminal of the first printed circuit board 130 .

Meanwhile, a second substrate ( 102 in FIG. 3 ) that is oppositely bonded to the first substrate 101 is further included.

At this time, since the data pad DP and the first and second ground pads 116a and 116b are disposed on one side, for example, the upper side of the first substrate 101, and are connected to the output terminal of the flexible printed circuit board 120, The second substrate ( 102 in FIG. 3 ) is bonded opposite to the first substrate 101 while exposing the upper side of the first substrate 101 .

In addition, although not shown in the drawings, the first and second GIP circuit units GIP1 and GIP2 disposed in the non-display area NAA include a plurality of thin film transistors (not shown), and each gate wiring is provided in the display area AA. A thin film transistor (Tr in FIG. 3) connected to (GL) and the data line (DL) is disposed.

At this time, the first ground wire 115a is disposed closer to the display area AA than the second ground wire 115b, thereby supplying a ground voltage to the display area AA and simultaneously supplying the inside of the display area AA. It serves to protect the thin film transistor (Tr in FIG. 3) disposed in the display area AA by discharging static electricity generated in the first substrate 101 to the outside.

Specifically, static electricity generated inside the display area AA flows through the first ground wire 115a adjacent to the display area AA, and is connected to the first ground pad 116a connected to the first ground wire 115a. , through the flexible circuit board 120 connected thereto and the first printed circuit board 130 connected thereto in sequence, and as a result discharged through the ground terminal of the second printed circuit board 140.

In addition, the second ground wire 115b is disposed at the outermost portion of the non-display area NAA, thereby blocking static electricity flowing from the outside of the first substrate 101 from entering the display area AA and at the same time preventing the first substrate 101 from flowing into the display area AA. It is emitted to the outside of the substrate 101 to protect the thin film transistors (not shown) provided in the first and second GIP circuit parts GIP1 and GIP2 and the thin film transistors (Tr in FIG. 3) disposed in the display area AA. Do it.

Specifically, static electricity flowing from the outside to the side of the first substrate 101 flows through the second ground wire 116b disposed at the outermost part of the non-display area NAA, and the second ground wire 116b connected to the second ground wire 115b. Discharge occurs sequentially through the second ground pad 116b, the flexible printed circuit board 120 connected thereto, and the first printed circuit board 130 connected thereto, and consequently through the ground terminal of the second printed circuit board 140.

In particular, even if the distance between the first ground wire 115a and the first and second GIP circuits GIP1 and GIP2 becomes closer due to the narrowing of the non-display area NAA, the first and second first and second GIP circuits GIP1 and GIP2 are closer to each other in the non-display area NAA. By disposing the second ground wires 115a and 115b apart and discharging static electricity introduced from the outside through the second ground wire 115b disposed at the outermost part of the non-display area NAA, static electricity is removed from the display area ( AA) It can block the inflow into the interior.

Accordingly, even if a narrow bezel is implemented, the plurality of thin film transistors (not shown) provided in the first and second GIP circuits GIP1 and GIP2 and the first and second GIP circuits GIP1 and GIP2 It is possible to prevent damage to the plurality of thin film transistors (Tr in FIG. 3 ) connected and disposed in the display area AA.

3 is a cross-sectional view of an upper side of a liquid crystal display device according to an exemplary embodiment of the present invention, and FIG. 4 is a cross-sectional view of a side different from that of FIG. 3 .

As shown in FIGS. 3 and 4 , the liquid crystal display device according to the exemplary embodiment of the present invention includes first and second substrates 101 and 102 bonded to each other.

At this time, the first substrate 210 is divided into a display area AA and a non-display area NAA outside the display area AA.

First, looking at the display area AA, a thin film transistor Tr is disposed on the first substrate 101, and the thin film transistor Tr has a gate electrode 105 and a gate insulating film 103 covering the gate electrode 105. ) and the semiconductor layer 106, which corresponds to the gate electrode 105 on the gate insulating film 103 and includes the active layer 106a and the ohmic contact layer 106b, and the semiconductor layer 106, which is spaced apart from each other It consists of a source electrode 107 and a drain electrode 108.

Also, although not shown in the drawing, a gate line (GL in FIG. 2 ) and a data line (DL in FIG. 2 ) connected to the thin film transistor Tr are disposed on the first substrate 101 .

At this time, the gate line (GL in FIG. 2) is connected to the gate electrode 105 of the thin film transistor Tr, and the data line (DL in FIG. 2) is connected to the source electrode 107 of the thin film transistor Tr. there is.

In addition, the protective layer 109 is disposed to cover the thin film transistor Tr, and the pixel electrode 111 is disposed on the protective layer 109 and electrically connected to the drain electrode 108 of the thin film transistor Tr. do.

At this time, the pixel electrode 111 is made of a transparent conductive material such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO).

Next, looking at the non-display area NAA, the first and second electrodes 107 and 108 of the thin film transistor Tr of the display area AA are formed on the same layer and made of the same material on the top of the gate insulating film 103. The second ground wires 115a and 115b are disposed spaced apart from each other.

In this case, the first ground wire 115a is disposed closer to the display area AA than the second ground wire 115b.

At this time, the first ground wire 115a supplies a ground voltage to the display area AA and simultaneously discharges static electricity generated inside the display area AA to the outside of the first substrate 101, so that the display area AA ), and the second ground wire 115b is disposed at the outermost part of the non-display area NAA, thereby displaying static electricity flowing from the outside of the first substrate 101. It serves to protect the thin film transistor Tr disposed in the display area AA by blocking the inflow into the area AA and emitting it to the outside of the first substrate 101 at the same time.

Accordingly, even if a narrow bezel is implemented, damage to the plurality of thin film transistors Tr disposed in the display area AA can be prevented.

Meanwhile, unlike the drawings, the first and second ground wires 115a and 115b may be formed of different layers and materials.

For example, the first ground wire 115a is made of the same layer and the same material as the source and drain electrodes 107 and 108 of the thin film transistor Tr in the display area AA, and the second ground wire 115b The silver gate electrode 105 may be made of the same layer and the same material.

In addition, the protective layer 109 is disposed covering the first and second ground wires 115a and 115b, and is made of an organic insulating material such as benzocyclobutene (BCB) and photo acryl, or silicon nitride and silicon oxide. made of inorganic insulating materials such as

At this time, as the protective layer 109 is also disposed in the area where the first and second ground wires 115a and 115b are spaced apart, static electricity introduced from the outside is transmitted from the second ground wire 115b to the first ground wire 115a. ) can be effectively prevented.

Next, a black matrix 112 covering non-display elements such as the thin film transistor Tr of the display area AA is disposed on the lower portion of the second substrate 102 that is oppositely bonded to the first substrate 101, and the black matrix ( 112) A color filter 113, which is separately disposed for each pixel, is disposed at the bottom.

In addition, a transparent conductive film 114 is disposed on the second substrate 102. At this time, the transparent conductive film 114 is a transparent conductive material such as indium-tin-oxide (ITO) or indium-zinc-oxide (IZO). made up of

By disposing the transparent conductive film 114 as described above on one surface of the second substrate 102 , static electricity generated in the second substrate 102 may be discharged to the outside. This will be described later.

In addition, as shown in FIG. 3, a data pad (DP in FIG. 2) and first and second ground pads (116a, 116b in FIG. 2) are disposed on one side of the first substrate 101, for example, on the upper side. Since it is connected to the output end of the flexible printed circuit board (120 in FIG. 2), the second substrate 102 exposes the upper side of the first substrate 101 and is bonded to the first substrate 101 oppositely.

At this time, the protective layer 109 of the non-display area NAA of the first substrate 101 exposed by the second substrate 102 has a contact hole 152 exposing a part of the second ground wire 115b. have

In addition, a conductive member 151 is disposed on the outer surface of the second substrate 260 exposing the first substrate 101 and on the first substrate 101 exposed by the second substrate 102 .

The conductive member 151 may be made of silver (Ag) dots, and electrically connects the transparent conductive film 114 on the second substrate 102 and the second ground wire 115b exposed through the contact hole 152. connect with

Accordingly, static electricity generated in the second substrate 102 may be discharged to the outside through the second ground wire 115b.

Specifically, static electricity generated in the second substrate 102 flows through the second ground wire 116b, and the second ground pad 116b connected to the second ground wire 115b and the flexible circuit board connected thereto ( 120) and the first printed circuit board 130 connected thereto, and consequently discharged through the ground terminal of the second printed circuit board 140.

The present invention is not limited to the above-described embodiments, and various changes and modifications are possible without departing from the spirit of the present invention.

101, 102: first and second substrates
114: transparent conductive film
120: flexible circuit board
130, 140: first and second printed circuit boards
115a, 115b: first and second ground wires
116a, 116b: first and second ground pads

Claims (10)

a first substrate including a display area and a non-display area surrounding the display area;
gate wires and data wires crossing each other and disposed in the display area;
a thin film transistor connected to the gate line and the data line;
a first ground wire extending along the display area in the non-display area and having both ends located on one side of the non-display area;
a second ground wire spaced apart from the first ground wire and disposed in the non-display area along the first ground wire; and
first and second ground pads connected to both ends of the first and second ground wires and disposed on one side of the non-display area;
The first and second ground wires are electrically isolated from each other, and the first and second ground pads are electrically isolated from each other.
According to claim 1,
The liquid crystal display device further comprises a protective layer disposed in a region spaced apart from the first and second ground wires.
According to claim 1,
The first ground wire is closer to the display area than the second ground wire.
According to claim 1,
a flexible circuit board connected to the ground pad;
a first printed circuit board connected to the flexible circuit board;
Further comprising a second printed circuit board connected to the first printed circuit board through a flexible circuit cable,
The first ground pad and the second ground pad are each electrically connected to a ground terminal of the second printed circuit board.
delete According to claim 1,
The first and second ground wires are arranged on the same layer or on different layers.
According to claim 1,
a second substrate facing and bonded to the first substrate;
a transparent conductive film disposed on the second substrate; and
A conductive member electrically connecting the transparent conductive film and the second ground wire
A liquid crystal display device further comprising a.
According to claim 7,
Wherein the conductive member is a silver (Ag) dot. According to claim 7,
The non-display area is formed by protruding from the outer surface of the first substrate and the second substrate;
The conductive member is formed on an outer surface of the second substrate and an upper surface of the first substrate in the non-display area.
delete

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