JP2008046278A - Liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal display device that can prevent malfunction due to discharge. <P>SOLUTION: The liquid crystal display device 50 is equipped with a liquid crystal panel 60 and an external circuit 80 connected to the liquid crystal panel 60. The liquid crystal panel 60 has a laminated structure of a circuit substrate and a counter substrate opposing to each other with a sealing material 310 provided along the rim of the counter substrate. The circuit substrate includes a wiring 122 laid in a peripheral region, an insulating part covering the wiring 122, and a conductive overhang part 126 connected to the wiring 122 and overhanging outward over the sealing material 310. The wiring 122 and the overhang part 126 are disposed independent from the circuit that drives the liquid crystal panel 60. The overhang part 126 is connected to a ground potential of the external circuit through the wiring 122. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a liquid crystal display device, and more particularly to a liquid crystal display device capable of preventing an operation failure due to discharge.

  13 and 14 are partially enlarged plan views (layout diagrams) of a conventional liquid crystal panel 560, and FIG. 15 is a cross-sectional view taken along line 15-15 in FIG. 13 and FIG. In order to make the drawing easier to understand, elements of the counter substrate 700 are omitted in FIG. 13, elements such as the circuit board 600 are omitted in FIG. 14, and a seal 810 and an Au (gold) paste 820 are omitted in FIGS. Is indicated by a thick line, and the counter electrode pad electrode 620 is indicated by a thick broken line.

  In the conventional panel 560, a circuit substrate 600 in which a TFT (Thin Film Transistor) or the like is formed and the counter substrate 700 are bonded by a seal 810, thereby forming a container for enclosing the liquid crystal 800. Generally, a metal common wiring 616 is disposed on the outermost periphery of the circuit board 600. In order to suppress corrosion of the metal due to moisture or the like, the common wiring 616 is generally laid out so as to enter the seal 810. The common wiring 616 is provided with a pad electrode 620 for establishing conduction with the counter electrode 716 of the counter substrate 700. The pad electrode 620 is provided outside the seal 810 at a diagonal portion of the panel. . The counter electrode 716 has a lead-out portion that is led out of the seal 810 so as to face the pad electrode 620, and the lead-out portion and the pad electrode 620 are connected through Au particles 830 in the Au paste 820. . A black matrix (BM) 714 made of chromium (Cr) or the like is provided in contact with the counter electrode 716, and the black matrix 714 extends to the outside of the seal 810.

JP 2001-108958 A Japanese Patent Laid-Open No. 9-329796

  Liquid crystal panels, organic EL (Electro Luminescence) panels, and the like have been reduced in size, thickness, and frame size, and functions such as touch panels have been added. As a result, static electricity (air discharge) from the outside of the panel such as the human body may cause malfunction of the panel. The mechanism of the malfunction of the panel due to static electricity will be described below.

  The air discharge test for the liquid crystal panel can be performed by the configuration shown in FIG. 16, for example. That is, for example, an acrylic insulating plate 904 is placed on the conductive plate 902, and the liquid crystal panel 560 is placed thereon, for example. The liquid crystal panel 560 is mounted with an FPC (Flexible Printed Circuit) 570 and is grounded via the FPC 570. The discharge generator 906 is brought close to the liquid crystal panel 560 in such a state.

  When an air discharge test is performed on a liquid crystal panel, static electricity tends to be easily discharged to a conductor portion of the liquid crystal panel. That is, it is easy to be discharged to the conductor part which has come out of the seal | sticker (insulator) among a circuit board and a counter substrate, and it is hard to discharge to the part covered with the seal | sticker. For this reason, in the case of the liquid crystal panel 560, specifically, the discharge 900 occurs in the black matrix 714 outside the lead-out portion of the counter electrode 716 and the seal 810.

  The electric charge due to the discharge 900 is mounted on a COG (Chip on Glass) mounting or COF (Chip on Film) mounting or an external circuit from the black matrix 714 and the counter electrode 716 through the Au paste 820 and the common wiring 616. In addition, it may flow to a driver IC (Integrated Circuit) and cause a malfunction or failure of the driver IC.

  The objective of this invention is providing the liquid crystal display device which can prevent the malfunctioning by discharge.

  The liquid crystal display device according to the present invention includes a liquid crystal panel formed by bonding a circuit board and a counter substrate facing the circuit board by a seal provided along a peripheral edge of the counter substrate, and connected to the liquid crystal panel The circuit board includes a wiring provided in a peripheral region, an insulating portion covering the wiring, and an outside connected to the wiring and projecting outside the seal. A conductive projecting portion, wherein the wiring and the projecting portion are provided independently of a circuit for driving the liquid crystal panel, and the projecting portion is connected to the ground of the external circuit via the wiring. It is connected to a potential.

  The seal adheres to the overhanging portion and the insulating portion, the insulating portion has higher adhesiveness to the seal than the overhanging portion, and the overhanging portion is a plurality of conductive films arranged discretely. It is preferable to be configured.

  The wiring is preferably arranged without overlapping the circuit.

  Moreover, it is preferable that the said wiring and the said overhang | projection part are respectively comprised with the same material as one of the electrically conductive films in the said circuit board.

  Moreover, it is preferable that the said opposing board | substrate is comprised without including an electroconductive element outside the said seal | sticker.

  Moreover, it is preferable that the said opposing board | substrate is comprised including an electroconductive element outside the said seal | sticker, and the said overhang | projection part is extended to the outer side rather than the said electroconductive element.

  Further, the counter substrate is configured to include a conductive counter conductive layer facing the seal and extending inside and outside the seal, and conductive particles are mixed in the seal, The counter conductive layer has a slit at a position facing the seal, and a portion of the counter conductive layer outside the slit is connected to the protruding portion of the circuit board via the conductive particles. It is preferable.

  The slit preferably has a width equal to or larger than a gap between the circuit board and the counter substrate.

  The slits are preferably provided intermittently.

  Moreover, it is preferable that the circuit board further includes a light-shielding film facing the slit.

  Further, the counter conductive layer has a counter electrode provided on the counter substrate so as to oppose the pixel electrode, and the counter electrode is connected to the circuit via the conductive particles in the seal inside the slit. It is preferably connected to the substrate.

  Moreover, it is preferable that the said overhang | projection part is provided in the outer side rather than the said slit.

  According to the above configuration, it is possible to obtain a liquid crystal display device that can prevent malfunctions due to discharge.

  Embodiments according to the present invention will be described below in detail with reference to the drawings.

  1 and 2 are schematic diagrams illustrating a liquid crystal display device 50 according to the first embodiment. FIG. 2 shows a state where a counter substrate 200 described later is removed. 3 and 4 are enlarged views (layout diagrams) of a portion 3 surrounded by a chain line in FIG. 1 and FIG. In order to make the drawings easy to understand, the components are divided into FIG. 3 and FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 3 and FIG. 4, and FIG. 6 is an enlarged view (layout diagram) of a portion 6 surrounded by a one-dot chain line in FIG. 1 and FIG.

  The liquid crystal display device 50 includes a liquid crystal panel 60, an FPC 70 connected to the external connection terminal area of the liquid crystal panel 60, and an external circuit 80 connected to the liquid crystal panel 60 via the FPC 70. The external circuit 80 is a general term for various circuits provided outside the liquid crystal panel 60 for driving the liquid crystal panel 60.

  The liquid crystal panel 60 includes a circuit board 100, a counter substrate 200, a liquid crystal 300, a seal 310, an inter-substrate connection layer 320, a sealing portion 340, and a driver IC (Integrated Circuit) 152. Yes. In order to make the drawings easy to understand, the seal 310 and the inter-substrate connection layer 320 are shown by thick solid lines in FIG.

  The circuit board 100 is a board on which a part of a circuit for driving the liquid crystal panel 60 is provided, and includes, for example, a pixel electrode, a pixel TFT (Thin Film Transistor), and the like in the display area. The counter substrate 200 is disposed so as to face the circuit substrate 100 and is disposed so as to avoid facing the external connection terminal region of the circuit substrate 100. In addition, the board | substrates 100 and 200 illustrate the case where it is square on planar view.

  The seal 310 is disposed between the two substrates 100 and 200, and the two substrates 100 and 200 are bonded (bonded) by the seal 310. The seal 310 is disposed along the periphery of the counter substrate 200, and is provided by forming a liquid crystal injection port in a part of the periphery (in the illustrated example, on the side opposite to the external connection terminal region). . This liquid crystal injection port is closed by a sealing portion 340. Various sealants used for the liquid crystal panel can be used as the seal 310. Here, the seal 310 itself is made of an insulating material.

  Note that a spacer (not shown) that defines a gap between the substrates 100 and 200, for example, insulating particles, is mixed in the seal 310, and the spacer is kneaded in the paste-like seal 310 before coating and curing, for example. Can be introduced.

  The liquid crystal 300 is sealed in a container composed of the substrates 100 and 200, the seal 310, and the sealing portion 340.

  The inter-substrate connection layer 320 can be constituted by, for example, a layer in which conductive particles 330 are mixed in a resin, and can be formed by curing, for example, a paste in which the conductive particles 330 are kneaded. The inter-substrate connection layer 320 is disposed between the two substrates 100 and 200 and supplies a potential from the circuit substrate 100 to the counter substrate 200 via the conductive particles 330. The conductive particles 330 can be constituted by, for example, a gold (Au) sphere or a resin sphere whose surface is coated with gold.

  The driver IC 152 is mounted on the external connection terminal region of the circuit board 100 with a COG (Chip On Glass) structure. The driver IC 152 may be mounted on the FPC 70 with a COF (Chip on Film) structure, or a plurality of driver ICs 152 may be provided separately on both the circuit board 100 and the FPC 70.

  Various configurations can be applied to the display area of the liquid crystal panel 60, and a peripheral area (also referred to as a frame area) outside the display area will be described below.

  The circuit board 100 includes an insulating substrate 112 made of, for example, glass. In the peripheral region of the substrate 112, an insulating layer 114, a common wiring 116, an inter-substrate connection electrode 120, a wiring 122, and a conductive protruding portion 126 are formed. It is comprised including. For easy understanding of the drawing, the common wiring 116 and the wiring 122 are shown by thick lines in FIG. 1 and the like, and the inter-substrate connection electrode 120 and the conductive protrusion 126 are shown by thick broken lines in FIG.

  The insulating layer 114 is disposed on the surface of the substrate 112 on the counter substrate 200 side, and can be configured by a stacked body such as a gate insulating film, an interlayer insulating film, a passivation film, and a planarization film. FIG. 5 illustrates a case where the insulating layer 114 is composed of four layers.

  In the peripheral region, the common wiring 116 extends so as to surround the display region along the three sides of the periphery of the counter substrate 200 (the region facing the common substrate) excluding the side portion close to the external connection terminal region. (See FIG. 2). The common wiring 116 is led out to the external connection terminal region and connected to the ground potential (terminal thereof) of the driver IC 152.

  The wiring 122 is located outside the common wiring 116, that is, on the outer peripheral end side of the substrate 100 or the liquid crystal panel 60, and is located on the outermost side among the various wirings in the liquid crystal panel 60. In the peripheral region, the wiring 122 extends so as to surround the display region along the three sides of the periphery of the counter substrate 200 (region facing the substrate), and is extended to the external connection terminal region (FIG. 2). reference). The wiring 122 is connected to the wiring 72 of the FPC 70 via the terminal 158 in the external connection terminal region, and is electrically (circuit-wise) connected to the ground potential of the external circuit 80 via the wiring 72 (FIG. 2). And FIG. 6). In FIG. 1 and the like, the specific configuration of the external circuit 80 is not shown. 2 and the like illustrate the case where both ends of the wiring 122 are drawn out to the external connection terminal region and the both ends are connected to the ground potential of the external circuit 80 via the FPC 70, but only one end of the wiring 122 is illustrated. May be connected to the ground potential of the external circuit 80. 2 and the like illustrate a case where both ends of the wiring 122 are combined into one wiring in the external circuit 80 and then connected to the ground potential. However, the ground potential is supplied in the external circuit 80. You may comprise so that it may connect to a different location.

  The wiring 122 is provided in the liquid crystal display device 50 and is provided independently of various circuits for driving the liquid crystal panel 60. That is, the wiring 122 is not connected to the various circuits in any of the liquid crystal panel 60, the FPC 70, and the external circuit 80. Further, the wiring 122 does not overlap the above various circuits (and thus does not intersect) in any of the liquid crystal panel 60, the FPC 70, and the external circuit 80.

  Here, the various circuits in which connection and overlap with the wiring 122 are avoided include the pixel electrode provided in the display area of the liquid crystal panel 60, the pixel TFT connected to the pixel electrode, and the pixel TFT. Wiring, a driver IC 152 mounted on the liquid crystal panel 60, a circuit in the external circuit 80, and the like, and an IC (not shown) mounted by a COF structure are also included. In the liquid crystal panel 60, the wiring 122 is not connected to the inspection circuit 154 and the terminal 156 provided in the external connection terminal region (see FIG. 6).

  The wiring 122 and the common wiring 116 are covered with the insulating layer 114 in the peripheral region. In FIG. 5, the wiring 122 and the common wiring 116 are covered with the insulating layer 114 from both the counter substrate 200 side and the substrate 112 side by being embedded in the insulating layer 114. The case is shown as an example. FIG. 5 illustrates the case where the wirings 122 and 116 are arranged between the second layer and the third layer from the substrate 112 side, but the arrangement position is not limited to this, and both wirings 122 are arranged. 116 need not be arranged between the same layers. In addition, the wirings 122 and 116 can be covered with the substrate 112 and the insulating layer 114 by arranging the wirings 122 and 116 between the substrate 112 and the insulating layer 114. Further, the wiring 122 and the common wiring 116 are covered with, for example, an insulating resin (not shown) including the terminal 158 connected to the wiring 72 of the FPC 70 in the external connection terminal region. As described above, the wirings 122 and 116 are covered with, for example, an insulating portion including the insulating layer 114 and the insulating resin, or an insulating portion including the insulating substrate 112, for example. Thus, exposure of the liquid crystal panel 60 to the external space (or outside air) is avoided.

  The wiring 122 does not extend beyond the outer edge of the seal 310 (the edge on the outer peripheral end side of the liquid crystal panel 60), that is, does not extend outside the seal 310 (does not protrude). In FIG. 5 and the like, the case where the entire wiring 122 is stored below the seal 310 is illustrated. However, the wiring 122 overlaps with the inner edge of the seal 310 (the edge on the center side of the liquid crystal panel 60) or the seal. The wiring 122 may be disposed on the inner side of the inner edge of 310 (that is, on the inner side of the seal 310). The positional relationship between the common wiring 116 located on the inner side of the wiring 122 and the seal 310 is the same as described above, and FIG. The case where it arrange | positions inside 310 is illustrated.

  The wirings 122 and 116 can be made of, for example, a metal such as aluminum or molybdenum (Mo). For example, a portion facing the counter substrate 200 is made of aluminum, and a portion in the external connection terminal region is more resistant to corrosion than aluminum. For example, the wirings 122 and 116 may be made of different materials, such as being made of molybdenum having high properties (see FIG. 6). Further, the wirings 122 and 116 may be made of different materials. The wirings 122 and 116 can be made of the same material as other elements in the circuit board 100, for example, various conductive films constituting the pixel. In this case, the pixel structure is formed by patterning a single conductive film. The wirings 122 and 116 can be formed in parallel. Therefore, it can be formed without increasing the number of processes.

  In the insulating layer 114, a contact hole 118 extending from the surface on the counter substrate 200 side to the common wiring 116 and a contact hole 124 extending from the surface to the wiring 122 are provided. Although the contact holes 118 and 124 are illustrated as squares in FIG. 3 and the like, they are not limited to this shape.

  The inter-substrate connection electrode 120 is provided, for example, in at least one corner of the peripheral region. The inter-substrate connection electrode 120 is disposed on the surface of the insulating layer 114 and connected to the common wiring 116 through the contact hole 118. The inter-substrate connection electrode 120 does not extend outward from the seal 310, and extends inward from the seal 310 to contact the inter-substrate connection layer 320, more specifically, the conductive particles 330. ing. FIG. 5 and the like illustrate the case where a part of the inter-substrate connection electrode 120 is in contact with the seal 310.

  The conductive overhang 126 is disposed on the surface of the insulating layer 114 and is connected to the wiring 122 through the contact hole 124. Similar to the wiring 122, the conductive overhanging portion 126 is provided independently of various circuits that are provided in the liquid crystal display device 50 and drive the liquid crystal panel 60. As a result, the conductive overhanging portion 126 is electrically connected to the ground potential of the external circuit 80 via the wiring 122. Further, the conductive overhanging portion 126 does not overlap the above various circuits (and therefore does not intersect).

  The conductive overhanging portion 126 is located outside the inter-substrate connection electrode 120, extends outward (overhangs) from the seal 310, and is exposed to the external space of the liquid crystal panel 60. FIG. 5 and the like illustrate a case where a part of the conductive overhanging portion 126 is in contact with the seal 310.

  A plurality of conductive overhang portions 126 are provided discretely with respect to the wiring 122. Although FIG. 2 illustrates the case where these conductive protrusions 126 are provided at the corners of the peripheral region, the present invention is not limited to this arrangement position. It is also possible to extend a single conductive overhang 126 along the three sides.

  The conductive overhang 126 and the inter-substrate connection electrode 120 can be made of various conductive materials, and are made of the same material (ITO (Indium Tin Oxide) or the like) as other elements in the circuit board 100, for example, the pixel electrode. In this case, the conductive overhanging portion 126 and the inter-substrate connection electrode 120 can be formed in parallel with the pixel structure by patterning a single transparent conductive film. Therefore, it can be formed without increasing the number of processes. The conductive overhang 126 and the inter-substrate connection electrode 120 may be made of different materials.

  Here, it is assumed that the circuit board 100 does not have a conductive element extending outside the seal 310 other than the conductive protruding portion 126.

  The seal 310 is in contact with the surface of the insulating layer 114, and is also in contact with each of the parts of the inter-substrate connection electrode 120 and the conductive overhanging portion 126 as illustrated above, thereby being adhered to the circuit board 100. ing. Here, for the portion where the seal 310 contacts, when the inter-substrate connection electrode 120 and the conductive overhanging portion 126 are made of, for example, ITO, and the film having the surface of the insulating layer 114 is a planarizing film made of acrylic resin or the like, The adhesiveness of the seal 310 is higher with respect to the insulating layer 114 than with respect to the inter-substrate connection electrode 120 and the conductive overhanging portion 126. For this reason, since the contact area between the seal 310 and the insulating layer 114 is increased by providing the plurality of conductive protrusions 126 discretely as described above, the adhesive strength between the circuit board 100 and the seal 310 is increased. Increase.

  The counter substrate 200 includes an insulating substrate 212 made of, for example, glass, and includes a light shielding film 214 and a counter electrode 216 in a peripheral region of the substrate 212. In order to make the drawing easy to understand, the light shielding film 214 is also hatched in the layout diagram (plan view) of FIG. 4 and the like, and the counter electrode 216 is illustrated by a thick broken line in FIG.

  The light shielding film 214 is disposed on the surface of the substrate 212 on the circuit board 100 side. The light shielding film 214 is provided in the peripheral region of the liquid crystal panel 60 without having an opening, and shields light from the backlight. Note that the light shielding film 214 is provided with an opening corresponding to each pixel in the display area, and constitutes a so-called black matrix or the like. The light shielding film 214 can be constituted by, for example, a chromium film or a laminated film of a chromium film and a chromium oxide film. In the case of the laminated film, a chromium oxide film is provided on the substrate 212 side. Further, the light shielding film 214 may be made of resin.

  The counter electrode 216 is disposed so as to face the pixel electrode in the display area, and extends to the peripheral area so as to face the inter-substrate connection electrode 120. The counter electrode 216 is stacked on the light shielding film 214 in the peripheral region. The counter electrode 216 contacts the inter-substrate connection layer 320, more specifically, the conductive particles 330, and is thereby electrically connected to the inter-substrate connection electrode 120 via the conductive particles 330. The counter electrode 216 can be made of a transparent conductive material such as ITO.

  The counter electrode 216 and the light shielding film 214 do not extend to the outside of the seal 310. For this reason, the conductive overhanging portion 126 extends outward than the counter electrode 216 and the light shielding film 214. 5 and the like illustrate the case where the counter electrode 216 and the light shielding film 214 are in contact with the seal 310, but one or both may be arranged so as not to contact the seal 310.

  5 and the like illustrate the case where the light shielding film 214 projects outward from the counter electrode 216. However, the counter electrode 216 may project outward, or the counter electrode 216 and the light shielding film 214 may be projected outward. The edge position may be aligned with. Here, in view of the adhesiveness between the seal 310 and ITO or the like, it is preferable that the contact area between the seal 310 and the counter electrode 216 made of ITO is small.

  Here, it is assumed that various conductive elements (including the light shielding film 214 and the counter electrode 216) of the counter substrate 200 do not extend outward from the seal 310.

  With the above configuration, even if static electricity in the external space is discharged to the liquid crystal panel 60, the discharge is not caused by the conductive overhanging portion 126 because the counter substrate 200 does not have a conductive element outside the seal 310. To the ground potential of the external circuit 80 via the wiring 122 and the wiring 72 of the FPC 70. For this reason, the circuit that drives the liquid crystal panel 60, for example, the driver IC 152, is not damaged by the discharged electric charge, and the malfunction of the liquid crystal panel 60 can be prevented. In addition, although the case where the electroconductive overhang | projection part 126 is exposed to external space was illustrated, even if it is a case where the surface (equivalent to the above-mentioned exposed surface) of the said overhang | projection part 126 is covered with the insulating film etc. It is possible to induce discharge to the conductive overhanging portion 126 outside the seal 310.

  Here, the pressure resistance (insulation performance) of the seal 310 is set to a level at which the discharge to the conductive overhanging portion 126 can be prevented from being transmitted through the seal 310 to the counter substrate 200 side. Such a withstand voltage can be realized, for example, by selecting a material or setting a thickness.

  Since the wiring 122 does not overlap with various circuits that drive the liquid crystal panel 60 as described above, capacitance (parasitic capacitance) with the circuit is suppressed. For this reason, it is possible to prevent the discharge to the conductive overhanging portion 126 from affecting the various circuits via the capacitance, thereby preventing problems such as malfunctions.

  Here, since the conductive overhanging portion 126 is provided on the side surface portion of the liquid crystal panel 60, it is effective for discharging from the lateral direction of the liquid crystal panel 60. For this reason, a circuit or the like can be disposed in the vicinity of the side surface portion, and can be disposed close to each other. As a result, the liquid crystal display device 50 can be reduced in size.

  As described above, the wiring 122 can be made of, for example, the same material as the various conductive films constituting the pixel. Examples of the various conductive films include a transparent conductive film such as ITO and a semiconductor film. In order to lead to the ground potential of the external circuit 80, it is more preferable to use the above metal having a low resistance.

  In the above, the case where the counter substrate 200 does not have a conductive element extending outward from the seal 310 is illustrated. However, for example, the counter electrode 216 and the conductive light shielding film 214 extend outward from the seal. The conductive overhanging portion is more than the counter electrode 216 and the conductive light-shielding film 214 even if it is exposed to the external space (the surface is covered with an insulating film or the like). By extending 126 toward the outside, the discharge can be attracted to the conductive overhang 126.

  FIG. 7 is a partially enlarged plan view (layout diagram) of the liquid crystal panel 61 according to the second embodiment. In the liquid crystal panel 61, the wiring 122 is made of molybdenum or the like having higher corrosion resistance than aluminum. Therefore, even if moisture or the like enters from the outer surface of the insulating layer 114 or from between the laminated films constituting the insulating layer 114, corrosion of the wiring 122 is suppressed.

  By improving the corrosion inhibition effect, the distance between the wiring 122 and the edge of the insulating layer 114, and further the distance between the wiring 122 and the edge (end surface) of the liquid crystal panel 61 can be made shorter than that of the liquid crystal panel 60. As a result, the liquid crystal panel 61 and the liquid crystal display device 50 to which the liquid crystal panel 61 is applied can be reduced in size. FIG. 7 illustrates the case where the wiring 122 protrudes outside the seal 310 as the distance is shortened.

  In the liquid crystal panel 61, a relay electrode 128 made of, for example, aluminum is laminated between the wiring 122 and the conductive overhanging portion 126. The conductive overhanging portion 126 is connected to the wiring 122 through the relay electrode 128. Yes. Note that the relay electrode 128 is hatched for easy understanding of the drawing. When the relay electrode 128 is formed of a material having lower corrosion resistance than the wiring 122, the relay electrode 128 is preferably provided at a position far from the edge of the insulating layer 114 or the like. In FIG. The case where it provides in the position is illustrated. FIG. 7 illustrates the case where the entire relay electrode 128 overlaps the seal 310. Note that the conductive overhanging portion 126 can be directly connected to the wiring 122 without providing the relay electrode 128.

  The other configuration of the liquid crystal panel 61 is the same as that of the liquid crystal panel 60.

  FIG. 8 is a plan view of the liquid crystal panel 62 according to the third embodiment, and FIGS. 9 and 10 are enlarged views (layout diagrams) of a portion 9 surrounded by a one-dot chain line in FIG. In order to make the drawings easy to understand, the components are divided into FIG. 9 and FIG. FIG. 11 is a cross-sectional view taken along line 11-11 in FIG. 9 and FIG.

  The liquid crystal panel 62 has a configuration in which slits 220 are provided in the light shielding film 214 and the counter electrode 216 with respect to the liquid crystal panel 60, the inter-substrate connection layer 320 is removed, and the conductive particles 330 are mixed in the seal 310. Yes. The liquid crystal panel 62 can be applied to the liquid crystal display device 50 in place of the liquid crystal panel 60.

  In the liquid crystal panel 62, the light shielding film 214 and the counter electrode 216 face the seal 310 and extend not only inside the seal 310 but also outside the seal 310. Here, the case where the light shielding film 214 has conductivity by including a conductive film such as chromium is exemplified, but the light shielding film 214 may be made of resin as described later. 11 and the like illustrate the case where the light shielding film 214 projects outward from the counter electrode 216, but the counter electrode 216 may project outward, or may be shielded from the counter substrate 216. The positions of the edges of the film 214 may be aligned.

  The light shielding film 214 and the counter electrode 216 are provided with a slit 220 in common. Note that FIG. 11 illustrates the case where the light shielding film 214 and the counter electrode 216 do not have the same edge for forming the slit 220, but the edge positions of the light shielding film 214 and the counter electrode 216 may be aligned. .

  The slit 220 is provided at a position facing the seal 310, and the seal 310 is bonded to the substrate 212 through the slit 220. The slit 220 extends so as to surround the display region along three sides of the counter substrate 200 excluding the side portion close to the external connection terminal region. In the liquid crystal panel 60, the slits 220 are continuously formed along the three sides, and the light shielding film 214 and the counter electrode 216 are divided into a portion inside and a portion outside the slit 220, respectively.

  Here, in the counter substrate 200, a conductive layer that faces the seal 310 and extends inward and outward from the seal 310 is referred to as a counter conductive layer 218. The counter conductive layer 218 of the liquid crystal panel 62 includes the light shielding film 214 and the counter substrate 200. A slit 220 is provided in the counter conductive layer 218, which is constituted by the electrode 216. Note that the counter substrate 200 does not include a conductive element extending outside the seal 310 except for the counter conductive layer 218.

  The slit 220 and the common wiring 116 are provided to face each other. Here, the common wiring 116 is made of a light-shielding material, for example, a metal such as the above-described aluminum, so that the backlight light incident from the circuit board 100 side can be prevented from leaking from the slit 220. Instead of the common wiring 116, another light-shielding element may be opposed to the slit 220.

  The portion of the counter conductive layer 218 outside the slit 220 extends beyond the seal 310 and is exposed to the external space, while the conductive overhanging portion 126 of the circuit board 100 is adhered to the seal 310. Opposite to. The opposing conductive layer 218 and the conductive overhanging portion 126 are electrically connected by contact with the conductive particles 330 in the seal 310. For this reason, even if static electricity in the external space is discharged to a portion of the counter conductive layer 218 outside the seal 310, the conductive particles 330, the conductive overhanging portion 126, and the wiring 122 are discharged from the portion. And flows to the ground potential of the external circuit 80 via the wiring 72 of the FPC 70. In addition, the presence of the slit 220 prevents discharge from entering the portion of the counter conductive layer 218 that is inside the slit 220. Therefore, the malfunction of the liquid crystal panel 62 can be prevented. About the discharge to the electroconductive overhang | projection part 126 of the circuit board 100, it is the same as that of the said liquid crystal panel 60. FIG. Note that, although the case where the portion outside the seal 310 in the counter conductive layer 218 is exposed to the external space is illustrated, the surface of the portion outside the seal 310 is covered with an insulating film or the like. However, it is possible to induce discharge to the counter conductive layer 218 outside the seal 310.

  The counter conductive layer 218 is provided on the side surface of the liquid crystal panel 62. For this reason, as with the conductive overhanging portion 126, it is effective for the discharge from the lateral direction and contributes to downsizing.

  The width w of the slit 220 is set to be equal to or larger than the gap d between the circuit board 100 and the counter substrate 200 in the region where the seal 310 is disposed. Here, the dimension d corresponds to the dimension (diameter) of the conductive particles 330. Here, as with the liquid crystal panel 60, in the liquid crystal panel 62, the pressure resistance of the seal 310 is at a level that can suppress the discharge of the discharge to the conductive overhanging portion 126 from passing through the seal 310 to the counter conductive layer 218. Is set. For this reason, according to the above relationship between w and d, the discharge to the portion outside the seal 310 in the counter conductive layer 218 is prevented from entering the portion inside the slit 220 through the slit 220. can do. In addition, according to the above relationship between w and d, even if the discharge enters inside the slit 220, most of the energy of the discharge is consumed when passing through the seal 310. Can be suppressed.

  In the liquid crystal panel 62, the seal 310 extends to a region where the inter-substrate connection electrode 120 and the counter electrode 216 face each other, and the conductive particles 330 in the seal 310 electrically connect both the electrodes 120 and 216, that is, both the substrates 100 and 200. Connected. For this reason, in the liquid crystal panel 62, the inter-substrate connection layer 320 (see FIG. 5 and the like) is not separately required, and therefore the number of manufacturing steps can be reduced as compared with the liquid crystal panel 60.

  Here, when the conductive overhanging portion 126 is made of ITO or the like, the conductive overhanging portion 126 is preferably provided on the outer side of the slit 220 in view of the adhesiveness with the seal 310 described above. This is because the adhesive area between the seal 310 and the insulating layer 114 becomes wider, and the adhesive strength between the circuit board 100 and the seal 310 increases.

  Note that the wiring 122 of the liquid crystal panel 62 may be made of a highly corrosion-resistant material such as molybdenum as in the liquid crystal panel 61.

  FIG. 12 is a partially enlarged plan view (layout diagram) of the liquid crystal panel 63 according to the fourth embodiment. The liquid crystal panel 63 has a configuration in which the slits 220 are intermittently provided in the liquid crystal panel 62, and the other configuration is the same as that of the liquid crystal panel 62. The liquid crystal panel 63 can be applied to the liquid crystal display device 50 in place of the liquid crystal panel 60.

  Due to the intermittent slit 220, the counter conductive layer 218 has a bridge portion 218 a that connects a portion inside the slit 220 and a portion outside the slit 220. The number of bridge portions 218a is not limited to the illustrated example.

  According to the above configuration, the outer portion and the inner portion of the slit 220 are connected by the high-resistance bridge portion 218a as compared with these two portions. For this reason, even if the discharge enters from a portion outside the seal 310 in the counter conductive layer 218, much of the energy of the discharge can be consumed by the bridge portion 218a. Accordingly, it is possible to sufficiently reduce the discharge energy that enters the common wiring 116 through the bridge portion 218a, the portion inside the slit 220 of the counter conductive layer 218 and the inter-substrate connection layer 320, thereby suppressing operation failure. is there. In other words, what is necessary is just to set the magnitude | size of the bridge part 218a according to the pressure | voltage resistant design with respect to discharge. Further, in the liquid crystal panel 62, the counter conductive layer 218 is less likely to be discharged due to the reduction in electric capacity, but there is a possibility that the discharge occurs in other places. On the other hand, according to the liquid crystal panel 63, the discharge can be attracted to a portion outside the seal 310 in the counter conductive layer 218, so that it is possible to suppress the discharge in other places. .

  In addition, it is possible to provide a high resistance body with a separate film or the like instead of the bridge section 218a. However, according to the bridge section 218a, the high resistance body is configured by a simple method of intermittently forming the slit 220. can do.

  When the light-shielding film 214 has conductivity in the liquid crystal panels 62 and 63, the adhesive strength between the counter substrate 200 and the seal 310 can be increased by omitting the counter electrode 216 outside the slit 220. Is possible. This is because the adhesiveness of the seal 310 is higher for the light shielding film 214 than for the counter electrode 216 made of, for example, ITO. In this case, a portion of the counter conductive layer 218 outside the seal 310 is configured only by the conductive light shielding film 214.

  In addition, unlike the above example, in the case where the light shielding film 214 is formed of an insulator such as a resin, the counter conductive layer 218 may be formed only of the counter electrode 216 and the slit 220 may be provided only in the counter electrode 216. In this case, light leakage from the slit 220 is prevented by the light shielding film 214, so that it is not necessary to make the slit 220 and the common wiring 116 or the like face each other, and the degree of freedom in layout is increased. Further, since it is not necessary to prevent the light leakage by the circuit board 100, the slits 220 can be provided over the entire periphery of the counter substrate 200.

  The counter conductive layer 218 may include a conductive film other than the conductive light shielding film 214 and the counter electrode 216, or may be configured of a conductive film other than the conductive light shielding film 214 and the counter electrode 216. Also good.

It is a schematic diagram explaining the liquid crystal display device which concerns on Embodiment 1 of this invention. It is a schematic diagram explaining the liquid crystal display device which concerns on Embodiment 1 of this invention. FIG. 3 is an enlarged view of a portion 3 surrounded by an alternate long and short dash line in FIG. 1 and FIG. 2. FIG. 3 is an enlarged view of a portion 3 surrounded by an alternate long and short dash line in FIG. 1 and FIG. 2. FIG. 5 is a cross-sectional view taken along line 5-5 in FIG. 3 and FIG. FIG. 3 is an enlarged view of a portion 6 surrounded by an alternate long and short dash line in FIG. 1 and FIG. 2. It is a partially expanded plan view of the liquid crystal panel according to Embodiment 2 of the present invention. It is a top view of the liquid crystal panel which concerns on Embodiment 3 of this invention. It is an enlarged view of the part 9 enclosed with the dashed-dotted line in FIG. It is an enlarged view of the part 9 enclosed with the dashed-dotted line in FIG. It is sectional drawing in the 11-11 line in FIG. 9 and FIG. It is a partially expanded plan view of the liquid crystal panel according to Embodiment 4 of the present invention. It is a partially expanded plan view of a conventional liquid crystal panel. It is a partially expanded plan view of a conventional liquid crystal panel. It is sectional drawing in the 15-15 line in FIG. 13 and FIG. It is the schematic explaining an air discharge test.

Explanation of symbols

  50 liquid crystal display device, 60 to 63 liquid crystal panel, 80 external circuit, 100 circuit board, 114 insulating layer, 122 wiring, 126 conductive overhang, 200 counter substrate, 216 counter electrode, 218 counter conductive layer, 220 slit, 310 seal 330 conductive particles, d gap, w width.

Claims (12)

A liquid crystal panel configured by bonding a circuit board and a counter substrate facing the circuit board by a seal provided along a peripheral edge of the counter substrate; and an external circuit connected to the liquid crystal panel. A liquid crystal display device,
The circuit board is
Wiring provided in the peripheral area;
An insulating portion covering the wiring;
A conductive projecting portion connected to the wiring and projecting outward from the seal;
Comprising
The liquid crystal display device, wherein the wiring and the overhanging portion are provided independently of a circuit for driving the liquid crystal panel, and the overhanging portion is connected to the ground potential of the external circuit through the wiring. . The liquid crystal display device according to claim 1,
The seal adheres to the overhanging portion and the insulating portion, and the insulating portion has higher adhesiveness to the seal than the overhanging portion, and the overhanging portion includes a plurality of conductive films arranged discretely. A liquid crystal display device. The liquid crystal display device according to claim 1 or 2,
The liquid crystal display device, wherein the wiring is disposed without overlapping the circuit. The liquid crystal display device according to any one of claims 1 to 3,
The liquid crystal display device, wherein each of the wiring and the projecting portion is made of the same material as any one of the conductive films in the circuit board. A liquid crystal display device according to any one of claims 1 to 4,
2. The liquid crystal display device according to claim 1, wherein the counter substrate is configured so as not to include a conductive element outside the seal. A liquid crystal display device according to any one of claims 1 to 4,
The counter substrate includes a conductive element outside the seal,
The liquid crystal display device according to claim 1, wherein the projecting portion extends to the outside of the conductive element. A liquid crystal display device according to any one of claims 1 to 4,
The counter substrate includes a conductive counter conductive layer facing the seal and extending inward and outward from the seal,
Conductive particles are mixed in the seal,
The counter conductive layer has a slit at a position facing the seal, and a portion of the counter conductive layer outside the slit is connected to the protruding portion of the circuit board via the conductive particles. A liquid crystal display device. The liquid crystal display device according to claim 7,
The liquid crystal display device, wherein the slit has a width equal to or larger than a gap between the circuit board and the counter substrate. The liquid crystal display device according to claim 7 or 8, wherein
The liquid crystal display device, wherein the slits are provided intermittently. A liquid crystal display device according to any one of claims 7 to 9,
The liquid crystal display device, wherein the circuit board further includes a light-shielding film facing the slit. The liquid crystal display device according to any one of claims 7 to 10,
The counter conductive layer has a counter electrode provided on the counter substrate facing the pixel electrode,
The liquid crystal display device, wherein the counter electrode is connected to the circuit board via the conductive particles in the seal inside the slit. A liquid crystal display device according to any one of claims 7 to 11,
The liquid crystal display device, wherein the projecting portion is provided outside the slit.

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