KR102514489B1 - Edge polishing systme and method - Google Patents

Abstract

The present invention relates to an edge polishing system and method, and more particularly, to an edge polishing system and method for processing laminated thin glass substrates to secure an edge space and performing polishing through the secured edge space.

Description

Edge polishing system and method {EDGE POLISHING SYSTME AND METHOD}

The present invention relates to an edge polishing system and method, and more particularly, to an edge polishing system and method for processing laminated thin glass substrates to secure an edge space and performing polishing through the secured edge space.

In general, various substrates including a cover glass of a mobile terminal, a flat panel display panel such as LCD or OLED, a TFT substrate, a color filter substrate, and the like go through a process of cutting an original plate into a required size and shape.

When the cutting process is performed in this way, a sharp edge is formed on the cut surface. Since such sharp edges often break during transportation or subsequent processes, polishing is performed to remove sharp edges.

In addition, since chipping defects occur during substrate cutting, edge polishing of the substrate is also performed for the purpose of removing chipping and preventing cracks, and through edge polishing, the edge of the edge of the substrate is removed.

However, as shown in FIG. 1, ultra thin glass (UTG) applied to a foldable phone is very thin, with a thickness of around several tens of um. Therefore, in a state in which a plurality of original sheets (original plates) 10 bonded between each layer with an adhesive are laminated, they are cut with a laser and molded into a required shape 11.

FIG. 2 shows an example of a state in which the stacked ledgers 10 are cut into a required size and shape. As shown, the molded thin glass substrates 11 obtained by cutting the mother sheet 10 are adhered to each other by applying or inserting an adhesive material 12 over the entire area.

Therefore, as shown in FIG. 3, an edge (ED) is created on the cut surface of the outer end of the thin glass substrate 11, and even though cracks or chipping (Cc) may occur at the edge (ED), it is completely adhered with the adhesive material 12 interposed therebetween. The thin glass substrate 11 is in a state where it cannot provide a space for performing a polishing process on its outer edge.

Republic of Korea Patent No. 10-1604186 Republic of Korea Patent Publication No. 10-2015-0145503

The present invention is to solve the above-mentioned problems, by removing the adhesive material between the laminated thin glass substrates to expose the polishing processing portion of the thin glass substrates, it is possible to polish the edge of the thin glass substrates through the secured processing space. It is intended to provide an edge polishing system and method that allows

To this end, an adhesive removal device for polishing according to the present invention removes the adhesive between laminated thin glass substrates to expose the polished portion of the thin glass substrate, comprising: an adhesive removal body; Deletion brushes provided at positions corresponding to the adhesive layer between the thin glass substrates among the adhesive material removing body; and a deletion actuator connected to and installed to the adhesive material removal body to repeatedly move the deletion brush.

At this time, it is preferable to further include a deletion mover installed on one side of the adhesive material removing body and moving the position of the deletion brush to match the adhesive material layer.

Preferably, the adhesive material removing body is a rotating body rotated by the removing actuator, and the removing brush is rotated by the rotating body to remove the adhesive layer.

In addition, it is preferable to further include brush guides spaced apart from each other at the same interval as the stacking interval of the thin glass substrates and having an insertion hole through which the deletion brush passes between each layer.

An edge polishing apparatus according to the present invention polishes an edge of a thin glass substrate exposed by removing an adhesive between laminated thin glass substrates, comprising: a substrate polishing body; polishing brushes respectively provided at positions corresponding to at least the thin glass substrate in the substrate polishing body; and a polishing actuator connected and installed to the substrate polishing body to repeatedly move the polishing brush.

At this time, it is preferable to further include a polishing mover installed on one side of the substrate polishing body and moving the polishing brush to match the position of the thin glass substrate.

Preferably, the substrate polishing body is a rotating body rotated by the polishing actuator, and the polishing brush rotates by the rotating body to polish the edge of the thin glass substrate.

In addition, the edge polishing system according to the present invention includes a polishing adhesive removal device for exposing the polishing portion of the thin glass substrate by removing the adhesive between the laminated thin glass substrates; and an edge polishing device for polishing an edge of the thin glass substrate exposed by removing the adhesive material.

At this time, the adhesive material removal device for polishing includes an adhesive material removal body; Deletion brushes provided at positions corresponding to the adhesive layer between the thin glass substrates among the adhesive material removing body; and a deleting actuator connected to the adhesive removing body to repeatedly move the deleting brush, wherein the edge polishing device includes a substrate polishing body; polishing brushes respectively provided at positions corresponding to at least the thin glass substrate in the substrate polishing body; and a polishing actuator connected and installed to the substrate polishing body to repeatedly move the polishing brush.

In addition, the edge polishing method according to the present invention includes a substrate fixing step of fixing a plurality of laminated thin glass substrates to a fixing device by using an adhesive; removing the adhesive material between the laminated thin glass substrates to expose the polished portion of the thin glass substrates; and an edge polishing step of polishing an edge of the thin glass substrate exposed by removing the adhesive material.

At this time, it is preferable that the adhesive material removal step is a step of removing the adhesive material layer from the outer end to a set depth with a deleting brush disposed at a position corresponding to the adhesive material layer between the thin glass substrates.

In addition, the edge polishing step is preferably a step of polishing the edge of the thin glass substrate with polishing brushes respectively provided at positions corresponding to at least the thin glass substrate.

As described above, the present invention removes the adhesive material between the laminated thin glass substrates to expose the polishing portion of the thin glass substrates, and polishes the edges of the thin glass substrates through the secured processing space.

Therefore, the polishing process can be performed even on thin glass substrates laminated in multiple layers using an adhesive material, such as ultra-thin tempered glass, and stable polishing is possible while maintaining the laminated state by removing a portion of the adhesive material.

1 is a plan view showing a cutting and molding state of a generally applied laminated ultra-thin film tempered glass.
2 is a view showing a laminated structure of the ultra-thin-film tempered glass of FIG. 1;
FIG. 3 is a partially enlarged view showing a state in which micro-cracks and chipping occur at the edge of the cut surface of the ultra-thin-film tempered glass of FIG. 1. Referring to FIG.
4 is a perspective view showing an adhesive removal device for polishing according to an embodiment of the present invention.
5 is a partially enlarged view showing the deletion brush of FIG. 4;
6 is a perspective view showing an adhesive material removal device for polishing according to another embodiment of the present invention.
7 is another embodiment of the deletion actuator of the present invention.
8 is a perspective view showing an edge polishing apparatus according to the present invention.
9 is a partially enlarged view showing the polishing brush of FIG. 8;
10 is a partially enlarged view showing a state of edge polishing according to the present invention.
11 is another embodiment of the polishing brush of the present invention.
12 is a flowchart illustrating an edge polishing method according to the present invention.

Hereinafter, an edge polishing system and method according to a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

4 is a perspective view showing an adhesive removal device for polishing according to the present invention.

As shown, the polishing adhesive removal device 110 according to the present invention includes thin glass substrates 11 stacked in close contact with the adhesive 12 over the entire area with the adhesive (or adhesive layer) 12 interposed therebetween. ) to perform edge polishing.

That is, the present invention removes the adhesive layer 12 between the laminated thin glass substrates to a set depth from the outer end to expose the polished portion of the thin glass substrate, and the edge of the thin glass substrate 11 through the secured processing space. to proceed with polishing to remove

Therefore, even when the thin glass substrate laminated through the adhesive 12 is cut, such as UTG (Ultra Thin Glass) for a foldable smartphone, polishing is performed and only a portion of the adhesive 12 is removed to form a laminated state. It enables stable polishing while maintaining

To this end, the adhesive material removing device 110 for polishing removes the adhesive material 12 between the laminated thin glass substrates 11 and exposes the polishing processing unit, the adhesive material removing body 111, the cleaning brush 112, and the cleaning actuator 113. ) and a delete mover 114.

Here, the adhesive material removing body 111 constitutes a moving body in which the deleting brush 112 is installed, and is operated by the deleting actuator 113 and moved to the working position by the deleting mover 114.

In an embodiment, the adhesive material removal body 111 is composed of a rotating body that rotates the deletion brush 112 . The rotating body type adhesive material removing body 111 may have a height corresponding to the total height determined according to the number of laminated thin glass substrates 11 .

That is, if the number of stacks is small because the thickness of each thin glass substrate 11 is very thin, the height of the adhesive material removal body 111 may be relatively low, so the rotating disk shape as shown can be applied. On the other hand, if the number of stacks is large, it can be applied by changing to a cylindrical rotating body with a relatively high height.

If the adhesive material removing body 111 is configured as a rotary body that rotates by the removal actuator 113, they are connected to each other through a rotation shaft, and the removal brush 112 provided in the adhesive material removal body 111 also rotates together. Therefore, the adhesive material 12 is abraded and removed from the outside by the deleting brush 112 rotating at the set RPM.

As shown enlarged in FIG. 5 , the removal brush 112 removes the adhesive 12 formed between the thin glass substrates 11 of each layer by applying or inserting the adhesive 12 . That is, the adhesive layer 12 is removed by the deleting brush 112 to a set depth from the outer end.

Deletion is to remove the adhesive layer 12 layered by the adhesive 12 by a brush polishing method, and only a portion of the edge of the adhesive layer 12 is partially removed so that the edge of the thin glass substrate 11 is exposed.

To remove only the adhesive layer 12 with the cleaning brush 112, the cleaning brush 112 is provided at a position corresponding to the adhesive layer 12 between the thin glass substrates 11 in the adhesive removing body 111. Accordingly, each of the deletion brushes 112 faces the adhesive layer 12 when placed in the correct position by the deletion mover 114.

In addition, the deleting brush 112 is made of a material for deleting the adhesive material layer 12 such as resin, resin, or adhesive film. That is, the deleting brush 112 has higher abrasion strength than the hardened adhesive layer 12 so as to erase the adhesive layer 12 . Accordingly, only the edge portion of the adhesive layer 12 is removed, leaving the thin glass substrate 11 behind.

The removal actuator 113 is installed connected to the adhesive removal body 111 to repeatedly move the removal brush 112. As an embodiment, when the adhesive removal body 111 is a rotating body, a spindle equipped with a motor may be applied to the deletion actuator 113 .

Therefore, when the adhesive material removal body 111, which is a rotary body, is rotated around the rotation axis by the removal actuator 113, the removal brush 112 protruding from the adhesive material removal body 111 rotates and adheres to the adhesive layer 12. Repeated contact and removal.

As shown in FIG. 6 , as another embodiment, the deleting brush 112a may remove the adhesive layer 12 by reciprocating in the forward and backward directions. In this case, the adhesive material removal body 111a may be configured in a long bar, rod, or block shape.

In addition, the removal actuator 113a is composed of a vibrator or a cylinder device to vibrate or reciprocate the adhesive removal body 111a so that the adhesive layer 12 can be worn and removed by the removal brush 112a. do.

The removal mover 114 is installed on one side of the adhesive removal body 111, and moves the location of the removal brush 112 to coincide with the adhesive layer 12. That is, the adhesive material removal body 111 in the standby position is moved to the working position (working height).

Since the working position is a position where a part of the adhesive layer 12 is removed as described above, the deletion brush 112 moves the adhesive layer 12 to a viewing position, and a position sensor or posture sensor to enable movement to an accurate position. etc. are collected and placed in the correct position.

At this time, it is preferable that the removal actuator 113 moves along each processing surface in a state where each of the laminated thin glass substrates 11 is fixed on the work table TA of the vacuum adsorption type in the embodiment. However, the work table TA may be rotated in a state in which the removal actuator 113 is fixed in place so that each processing surface may sequentially come into contact with the removal brush 112 .

However, as shown in FIG. 7 , it is preferable that the present invention further include a brush guide 115 , and the brush guide 115 is spaced apart from each other at the same spacing as the stacking interval of the thin glass substrate 11 , respectively. are placed side by side with Thus, an entrance passage 116 through which the deletion brush 112 passes is formed between each layer.

For example, the brush guide 115 may be made of a metal material resistant to abrasion. Looking at its function, the thin glass substrate 11 prevents the brush 112 from contacting the thin glass substrate 11 while removing the adhesive 12. ) to block the path leading to

To this end, the brush guide 115 has a plurality of guide plates spaced apart in a row to correspond to the position of the thin glass plate, and may be configured in a plate shape having a length covering at least the entire length of the thin glass substrate 11.

As the edge of the adhesive layer 12 is removed by the brush 112, the exposed state of the edge ED of the thin glass substrate 11 can be confirmed through FIG. 9 below, and polishing at the exposed edge below explain about

Hereinafter, an edge polishing apparatus according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

The edge polishing apparatus 120 of the present invention is applied to laminated thin glass substrates 11 in which each thin glass substrate 11 protrudes outward from the adhesive layer 12, so that edge polishing is possible. ) can be applied regardless of the device or method for removing it.

However, it is preferable that the present invention be subsequently and continuously applied to the thin glass substrate 11 pretreated (removing the adhesive layer) by the 'adhesive removal device for polishing' described above. Therefore, hereinafter, it will be described that the thin glass substrate 11 is polished with the processing space secured by the above-described 'adhesive removal device for polishing'.

As shown in FIG. 8 , the edge polishing apparatus 120 according to the present invention removes the adhesive material 12 between the laminated thin glass substrates 11 to polish the exposed edges of the thin glass substrates 11, and the substrate polishing It includes a body 121, a polishing brush 122, a polishing actuator 123 and a polishing mover 124.

The edge polishing device 120 of the present invention also polishes the edge of the thin glass substrate 11 by brush abrasion, and the substrate polishing body 121 constitutes a moving body in which the polishing brush 122 is installed.

In an embodiment, the substrate polishing body 121 is composed of a rotating body that rotates the polishing brush 122 . The rotating body type substrate polishing body 121 may have a height corresponding to a substrate height determined according to the number of stacked thin glass substrates 11 .

That is, depending on the number of layers, a rotating disk with a relatively low height or a cylindrical rotating body with a relatively high height may be applied, and their rotational center is connected to the polishing actuator 123 through a rotating shaft to rotate.

If the substrate polishing body 121 is configured as a rotating body rotated by the polishing actuator 123, the polishing brush 122 provided in the substrate polishing body 121 also rotates, and the polishing brush 122 rotates at a set RPM. ), the edge of the thin glass substrate 11 is polished.

As shown enlarged in FIG. 9 , the polishing brush 122 is applied to the thin glass substrate 11 protruding outward of the adhesive material 12 among the plurality of thin glass substrates 11 stacked with the adhesive material layer 12 interposed therebetween. to polish That is, the laminated thin glass substrates 11 are polished in a space secured as the adhesive material 12 adhered therebetween is partially removed.

Polishing is an operation of polishing the edge (outer end edge) of the thin glass substrate 11 with the polishing brush 122 to partially shave off or round the entire side surface, thereby removing fine cracks or chips at the edge of the thin glass substrate 11 Remove

To this end, the polishing brush 122 uses a material that is gently bent so as not to apply an impact to the thin glass substrate 11 during polishing, but is abraded so that the edge portion of the thin glass substrate 11 can be gently abraded by repeated contact. A material having relatively higher strength than the thin film glass substrate 11 is used.

In addition, the polishing brush 122 is provided at a position corresponding to at least the thin glass substrate 11 of the substrate polishing body 121 . That is, if the polishing brush 122 can perform polishing in contact with all of the laminated thin glass substrates 11, the polishing brush 122 may be provided only on the thin glass substrate 11 portion or other portions may be provided. .

As shown in FIG. 10, as the polishing brush 122 is continuously installed over the entire height of the substrate polishing body 121, the laminated thin glass substrates 11 are simultaneously polished through any part thereof.

As described above, when the polishing brushes 122 are continuously disposed over the entire height of the substrate polishing body 121, only a part of the polishing brushes 122 are used for polishing during the process, and contact only the thin glass substrate 11 as much as possible. The access location can be adjusted.

In another embodiment, as shown in FIG. 11 , the polishing brush 122 may be spaced apart from each other at a position corresponding to the stacked thin glass substrates 11 . That is, it may be provided only at a position corresponding to the thin glass substrate 11 .

In this case, as the positions of the plurality of polishing brushes 122 are adjusted for polishing in response to the laminated state of the thin glass substrate 11, each polishing brush 122 may come into contact with the thin glass substrate 11. There is a need.

Also, as shown, the polishing brush 122 may have different lengths of brush bundles composed of a plurality of strands so as to gently polish the edge of the thin glass substrate 11 .

Specifically, among the plurality of strands, a virtual line connecting the ends of the brush strands by protruding so that the length at the center of the thin glass substrate 11 is short and the outside (upper and lower sides based on the drawing) longer. It can be made to have this circular arc shape or a shape similar to it. Accordingly, the entire side surface of the thin glass substrate 11 including the edge can be polished more gently.

The polishing actuator 123 is installed connected to the substrate polishing body 121 to repeatedly move the polishing brush 122. For example, when the substrate polishing body 121 is a rotating body, a spindle equipped with a motor may be applied. there is.

When the substrate polishing body 121 rotates around the rotation axis by the polishing actuator 123, the polishing brush 122 protruding from the substrate polishing body 121 rotates and contacts the edge of the thin glass substrate 11, polishing is done.

As another embodiment, similar to FIG. 6, the polishing brush 122 may also perform polishing in a forward and backward reciprocating manner. In this case, the substrate polishing body 121 is a long bar, rod, or It can be configured in a block shape.

Correspondingly, the polishing actuator 123 is composed of a vibrator or a cylinder device to vibrate or reciprocate the substrate polishing body 121 to polish the edge of the thin glass substrate 11 with the polishing brush 122.

However, the polishing actuator 123 performs polishing at a relatively low speed when the polishing brush 122 starts to contact the edge portion of the thin glass substrate 11, and the speed control such that high-speed polishing is gradually performed during the polishing process is also performed. possible.

To this end, the polishing actuator 123 receives information such as the removal depth of the adhesive layer 12, the thickness of the thin glass substrate 11, the material characteristics, and the shape of the polishing pattern, and after computing processing, the polishing is performed adaptively in an optimal state. you can make it

The polishing mover 124 is installed on one side of the substrate polishing body 121 and moves the position of the polishing brush 122 to coincide with the thin glass substrate 11 . That is, the polishing of the thin glass substrate 11 is performed by moving the substrate polishing body 121 from the standby position to the working position.

The working position means the position where the polishing brush 122 contacts the edge of the thin glass substrate 11, and collects information such as a position sensor or posture sensor to exclude excessive or insufficient contact and move to an appropriate position so that it is placed in the correct position.

At this time, it is preferable that the polishing is performed while the polishing brush 122 is in contact with only the edge portion of the thin glass substrate 11 . Therefore, the polishing mover 124 moves the substrate polishing body 121 so that when the polishing brush 122 contacts the thin glass substrate 11, the polishing is performed at that position without further entry.

After the edge polishing of one side of the thin glass substrate 11 is completed in this way, the polishing mover 124 is operated to move the edge to the other side, or the work table TA is rotated to move the other side to the polishing brush 122. It can be polished on all surfaces as needed in a way that ensures contact.

Hereinafter, an edge polishing system according to the present invention will be described with reference to the accompanying drawings.

The edge polishing system according to the present invention removes the adhesive material 12 between the laminated thin glass substrates 11 to expose the polished portion of the thin glass substrate 11, the polishing adhesive removal device 110 and the adhesive material 12 and an edge polishing device 120 for polishing the edge of the thin glass substrate 11 exposed by removing the edge.

Preferably, the polishing adhesive removal device 110 and the edge polishing device 120 are configured as a set, and first, the outer portion of the adhesive layer 12 is removed by the polishing adhesive removal device 110, thereby reducing the processing space. The exposed thin glass substrate 11 is polished with an edge polishing device 120 .

To this end, the adhesive removal device 110 for polishing is provided at a position corresponding to the adhesive material removal body 111 and the adhesive layer 12 between the thin glass substrate 11 among the adhesive material removal body 111. It includes a brush 112 and a deletion actuator 113 connected to the adhesive removal body 111 to repeatedly move the deletion brush 112. In addition, the deletion mover 114 may also be included to move to the deletion work position.

The edge polishing device 120 includes a substrate polishing body 121, a polishing brush 122 provided in a position corresponding to at least the thin glass substrate 11 of the substrate polishing body 121, and the polishing brush 122 and a polishing actuator 123 connected to and installed to the substrate polishing body 121 so as to repeatedly move the substrate. In addition, a polishing mover 124 may also be included to move to the polishing work position.

Since each component constituting the polishing adhesive removal device 110 and the edge polishing device 120 of the present invention has already been described above, a detailed description of each component and its operation relationship will be omitted.

Hereinafter, an edge polishing method according to a preferred embodiment of the present invention will be described with reference to the accompanying drawings.

12 , the edge polishing method according to the present invention includes a substrate fixing step (S110), an adhesive material removing step (S120), and an edge polishing step (S130).

Here, in the substrate fixing step (S110), the laminated thin glass substrate 11 is fixed (substrate input). The laminated thin glass substrate 11 includes a very thin material having a thickness of about several tens of micrometers, such as ultra thin glass (UTG).

In addition, in the laminated thin glass substrates 11, an adhesive 12 is inserted or applied between each layer to form an adhesive layer, and the thin glass substrate 11 is in a state of being in close contact with them over the entire area with the adhesive layer interposed therebetween. ) to perform edge polishing.

That is, in the present invention, the polishing portion of the thin glass substrate is exposed by removing the adhesive material 12 between the laminated thin glass substrates, and the edge of the thin glass substrate 11 can be removed through the secured processing space. let it be

To this end, the thin glass substrates 11 stacked in multiple layers with the adhesive 12 interposed therebetween are put into the polishing operation while being fixed on the work table TA of the vacuum adsorption method according to the embodiment.

Next, in the adhesive removal step ( S120 ), the adhesive 12 between the laminated thin glass substrates 11 is removed to expose the polished portion of the thin glass substrates 11 . That is, a space between each layer is secured at the outer end of the thin glass substrate 11 so that subsequent polishing can be performed.

At this time, in the adhesive removal step (S120), the edge portion of the adhesive material 12 is removed using the deleting brushes 112 disposed at positions corresponding to the adhesive material layer 12 between the thin glass substrates 11.

As an embodiment, in the adhesive removal step (S120), the adhesive removal device 110 for polishing having a deletion brush 112 is used to remove the adhesive 12 between the laminated thin glass substrates 11 and expose the polishing processing portion. put in

The adhesive material removal device 110 includes an adhesive material removal body 111, a deletion brush 112, a deletion actuator 113 and a deletion mover 114, and the adhesive material removal body 111 is moved by the operation of the removal mover 114. is moved to the laminated thin glass substrate 11 fixed on the work table TA.

At this time, the deleting brush 112 provided in the adhesive removal body 111 matches the height corresponding to the adhesive layer 12, that is, the adhesive between the thin glass substrates 11, and in that state, the removal actuator 113 it works

The removal actuator 113 rotates the adhesive material removal body 111 or reciprocates in the forward and backward directions to remove some of the adhesive material 12 with the removal brush 112 provided in the adhesive material removal body 111.

In this way, when the adhesive material 12 between each layer is worn and removed from the outside, the edge portion of the laminated thin glass substrate 11 is exposed as much as the removed portion, and through the exposed space, an edge polishing process to be described later can proceed.

Next, in the edge polishing step ( S130 ), the edge of the thin glass substrate 11 exposed by removing the adhesive 12 is polished as described above. Polishing is an operation of polishing the edge (outer end edge) of the thin glass substrate 11 to partially shave off or round the entire side surface, thereby removing micro cracks or chipping at the edge of the thin glass substrate 11 .

In the edge polishing step ( S130 ), at least the edge of the thin glass substrate 11 is polished with the polishing brushes 122 provided at positions corresponding to the thin glass substrate 11 . That is, if the polishing brush 122 can perform polishing in contact with all of the laminated thin glass substrates 11, the polishing brush 122 may be provided only on the thin glass substrate 11 or other portions. .

The polishing brush 122 uses a softly bent material so as not to apply an impact to the thin glass substrate 11 during polishing, but has abrasion strength so that the edge portion of the thin glass substrate 11 can be gently abraded by repeated contact. A relatively higher than the thin glass substrate 11 is used.

As an embodiment, in the edge polishing step (S130), the edge polishing device 120 having the above-described polishing brush 122 is used to polish the edge of each thin film glass substrate 11 exposed as the adhesive 12 is removed. put in

The edge polishing device 120 includes a substrate polishing body 121, a polishing brush 122, a polishing actuator 123, and a polishing mover 124, and a laminated thin film whose edges are exposed by the operation of the polishing mover 124. The substrate polishing body 121 is moved to the glass substrate 11 .

After that, the polishing actuator 123 rotates the substrate polishing body 121 or reciprocates it in the forward and backward directions to remove the edge of the thin glass substrate 11 exposed by the polishing brush 122 provided in the substrate polishing body 121. to polish

In this way, edge polishing is performed on one side of the thin glass substrate 11 and, if necessary, edge polishing is performed on the other side. To this end, after edge polishing on one side is completed, the polishing mover 124 is operated to move to the other side, or the work table TA is rotated so that the other side comes into contact with the polishing brush 122. Polishing can be done on the surface.

As described above, the present invention removes the adhesive material 12 between the laminated thin glass substrates 11 to expose the polishing portion of the thin glass substrate 11, and the edge of the thin glass substrate 11 through the secured processing space. polish it

Therefore, the polishing process can be performed even on a thin glass substrate laminated in multiple layers through an adhesive material, such as ultra-thin tempered glass of a foldable phone, and stable polishing is possible while maintaining the laminated state by removing a portion of the adhesive material.

In the above, specific embodiments of the present invention have been described in detail. However, the spirit and scope of the present invention is not limited to these specific embodiments, but those skilled in the art can make various modifications and variations without changing the gist of the present invention. You will understand when you grow up.

Therefore, since the embodiments described above are provided to completely inform those skilled in the art of the scope of the invention to which the present invention pertains, it should be understood that it is illustrative and not limiting in all respects, The invention is only defined by the scope of the claims.

10: ledger (disc)
11: molded thin film glass substrate
12: adhesive material (adhesive material layer)
110: adhesive removal device for polishing
111: adhesive material removal body
112: delete brush
113 delete actuator
114: delete mover
115: brush guide
120: edge polishing device
121: substrate polishing body
122: polishing brush
123: polishing actuator
124: polishing mover

Claims (12)

delete delete delete delete delete delete delete an adhesive removal device for polishing (110) which removes the adhesive layer between the laminated thin glass substrates to expose the polished portion of the thin glass substrates; and
An edge polishing device 120 for polishing an edge of the thin glass substrate exposed by removing the adhesive layer;
The polishing adhesive removal device 110,
an adhesive material removal body 111; a deletion brush 112 provided in the adhesive material removing body 111; And a deletion actuator 113 connected to the adhesive removal body 111 to repeatedly move the deletion brush 112;
The edge polishing device 120,
a substrate polishing body 121; a polishing brush 122 provided on the substrate polishing body 121; And a polishing actuator 123 connected to and installed to the substrate polishing body 121 to repeatedly move the polishing brush 122;
The deletion brush 112 is spaced apart and installed at a position corresponding to the adhesive layer,
The edge polishing system, characterized in that the polishing brush (122) is spaced apart and installed at a position corresponding to the thin glass substrate.
delete a substrate fixing step (S110) of fixing a plurality of laminated thin glass substrates to a fixing device by means of an adhesive;
removing the adhesive layer between the stacked thin glass substrates to expose the polished portion of the thin glass substrate (S120); and
and an edge polishing step (S130) of polishing an edge of the thin glass substrate exposed by removing the adhesive layer,
In the adhesive removal step (S120), the adhesive layer is removed from the outer end to a set depth with the deletion brush 112,
In the edge polishing step (S130), the edge of the thin glass substrate is polished with a polishing brush 122,
The deletion brush 112 is spaced apart and installed at a position corresponding to the adhesive layer,
The edge polishing method of claim 1, wherein the polishing brush 122 is spaced apart and installed at a position corresponding to the thin glass substrate.
delete delete

Images