KR102512741B1 - Lead wire withdrawal device - Google Patents

Abstract

An object of the present invention is to provide a lead wire take-out device capable of performing initial setting processing for lead wire take-out without manual operation by human hands. In the present invention, the lead wire accommodating mechanism 101 accommodates most of the lead wire 4 so that it can be taken out from the distal end. The tension adjusting mechanism 102 having the dancer roller 7 and the two elevating guide rollers 11 forms a partial space that becomes part of the hand traveling space 50 in a ready state. The lead wire guide mechanism 103 having the retractable lead guide 12 forms a partial space that becomes part of the hand travel space 50 in a ready state. The lead wire gripping and moving mechanism 104 includes a gripping operation of gripping the front end of the lead wire 4 by the gripping unit 62g and a gripping unit moving operation of moving the gripping unit 62g through the hand travel space 50. can be executed.

Description

Lead wire withdrawal device

[0001] The present invention relates to a lead wire drawing device for pulling out a lead wire and guiding it to a target position.

As a device for bonding a lead wire to be an electrode wire to an electrode film surface of a substrate used for manufacturing a solar cell or the like, there is an ultrasonic bonding device utilizing ultrasonic vibration. When using such an ultrasonic bonding apparatus, a technique of drawing a lead wire, which is a linear conductive material, onto a substrate is required.

As a lead wire drawing technology, there is a lead wire drawing structure disclosed in Patent Literature 1 and a lead wire drawing device disclosed in Patent Literature 2, for example.

A conventional lead wire drawing technique is a technique of drawing a lead wire from a lead reel in which several layers of lead wire are wound, and continuously guiding the lead wire to a target position. The lead wire can be bonded on the substrate by drawing the lead wire out on the substrate by the lead wire drawing technique and applying ultrasonic vibration by an ultrasonic bonding device to the lead wire in a state of being brought into contact with the substrate.

International Publication No. 2012/073318 Japanese Unexamined Patent Publication No. 2015-133861

However, in the conventional lead wire drawing technology, the initial setting process for drawing out the lead wire, which first draws out the lead wire and guides it to the target position, is performed manually by an operator, and thus requires labor.

An object of the present invention is to solve the above problems and provide a lead wire take-out device capable of performing initial setting processing for lead wire take-out without manual operation by human hands.

A lead wire take-out device according to the present invention has a lead wire accommodating mechanism for accommodating a lead wire so that it can be taken out from the tip portion, and a gripping portion, and includes a gripping operation of holding the tip portion of the lead wire by the holding portion, and passing through a lead wire moving space. A lead wire gripping and moving mechanism capable of moving the gripping unit from an initial position to a target position, and at least one roller, and maintaining a contact relationship between the at least one roller and the lead wire, so that the lead wire A tension adjusting mechanism for performing a tension adjusting process for adjusting the applied tension; a lead wire guide mechanism for performing a guide process for guiding the traveling direction of the lead wire by inserting the lead wire; the lead wire accommodating mechanism; and the lead wire holding and moving mechanism. and a controller for controlling the tension adjusting mechanism and the lead wire guide mechanism to control execution of an initial setting process for lead wire drawing out, wherein the tension adjusting mechanism forms a first partial space that is part of the lead wire moving space. A state is changed between a 1 ready state and a first actual operating state in which the tension adjustment process can be executed, and the lead wire guide mechanism forms a second partial space that is part of the lead wire moving space; a second ready state; The state is changed between the second actual operation state in which the guide process can be performed, and the initial setting process for lead wire drawing, which is executed under the control of the control unit, causes the lead wire gripping and moving mechanism to (a) in the initial position (b) setting the tension adjusting mechanism to the first ready state and placing the lead wire guide mechanism into the second ready state by causing the gripping operation to be performed; state; and (c) moving the gripper from the initial position to the target position by causing the lead wire gripping moving mechanism, which is executing the gripping operation, to further perform the gripping unit moving operation. have and remind By executing step (c), the tip of the lead wire gripped by the gripper is guided to the target position together with the gripper after passing through the lead wire movement space including the first and second subspaces. After the execution of the step (c), the moving operation of the gripper ends, and (d) is executed after the step (c) to set the tension adjusting mechanism to the first thread operating state and to set the lead wire guide mechanism. to the second seal operating state; and (e) a step executed after the step (c) to end the gripping operation by the gripper and release the lead wire from the lead wire gripping and moving mechanism. provide

The lead wire take-out device of the present invention according to claim 1 automatically executes the initial setting process for lead wire take-out comprising the steps (a) to (e) described above under the control of a control unit, thereby eliminating the need for manual operation by an operator. It has the effect of guiding the lead wire from the initial position to the target position.

Objects, features, aspects and advantages of the present invention will become more apparent with the following detailed description and accompanying drawings.

1 is an explanatory diagram showing the overall configuration of a lead wire take-out device according to an embodiment of the present invention.
Fig. 2 is a block diagram schematically showing a control system of the lead wire take-out device shown in Fig. 1;
FIG. 3 is an explanatory view showing the configuration of a lead cassette in the lead wire accommodating mechanism shown in FIG. 1; FIG.
FIG. 4 is an explanatory view showing details of the locking mechanism shown in FIG. 3;
FIG. 5 is an explanatory view schematically showing the replacement situation of the lead cassette shown in FIG. 3;
FIG. 6 is an explanatory view showing details of the lead wire gripping and moving mechanism shown in FIG. 1;
Fig. 7 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 8 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 9 is an explanatory diagram showing operation contents of the initial setting process for lead wire take-out.
Fig. 10 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 11 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 12 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 13 is an explanatory diagram showing operation details of the initial setting process for lead wire extraction.
Fig. 14 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 15 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 16 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 17 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 18 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 19 is an explanatory diagram showing operational details of the initial setting process for lead wire take-out.
Fig. 20 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 21 is an explanatory diagram showing operational details of the initial setting process for lead wire extraction.
Fig. 22 is an explanatory diagram schematically showing the configuration of a lead wire take-out device as a prerequisite for the present invention.

<Prerequisite Skills>

Fig. 22 is an explanatory diagram schematically showing the configuration of a lead wire take-out device 200 as a prerequisite for the present invention. In the figure, the XYZ orthogonal coordinate system is described.

As shown in Fig. 22, the lead wire take-out device 200 includes a lead wire accommodating mechanism 201, a tension adjusting mechanism 202, and a lead wire guide mechanism 203 as main components.

A substrate 3 is placed on the substrate fixing table 2, and a lead wire 4 is disposed on the substrate 3, so that the ultrasonic vibration UV from the ultrasonic oscillation head 5 of the ultrasonic bonding device 1 is applied to the lead wire ( The lead wire 4 can be ultrasonically bonded on the board|substrate 3 by performing the ultrasonic bonding operation|movement applied to the bonding target area|region of 4). Further, the head pressing F5 is applied to the ultrasonic oscillation head 5 .

The lead wire accommodating mechanism 201 and the tension adjusting mechanism 202 are fixedly disposed on the mounting member 80 installed on the substrate fixing table 2 . The lead wire accommodating mechanism 201 has a support shaft 222 rotatable along the rotational direction R4, the lead wire 4 is wound around the support shaft 222 as a central axis, and the tip of the lead wire 4 is externally Since it is exposed to, it is possible to withdraw the lead wire 4 from the outside.

The lead wire 4 drawn out from the lead wire accommodating mechanism 201 is loosely gripped by the lead wire guide mechanism 203 from above and below while maintaining a contact relationship with various rollers of the tension adjusting mechanism 202, thereby moving downward (-Z direction). It is guided to the surface of the substrate 3. In Fig. 22, the symbol "4" indicated by a rectangular solid line indicates a lead wire that has been bonded onto the substrate 3, and the symbol "4" indicated by a broken line indicates a lead wire in the process of being pulled out toward the surface of the substrate 3 ( 4) is indicated.

With the lead wire take-out device 200 as a prerequisite technology having such a configuration, the lead wire 4 accommodated in the lead wire receiving mechanism 201 passes through the tension adjusting mechanism 202 and the lead wire guide mechanism 203 to fix the substrate. It is drawn out to the surface of a substrate 3 such as a glass substrate mounted on the table 2.

After that, the lead wire 4 can be bonded onto the substrate 3 by the ultrasonic bonding device 1 . Also, when a solar cell is manufactured on the substrate 3, it is common that an electrode film is formed on the surface of the substrate 3, and in this case, the surface of the substrate 3 becomes the surface of the electrode film.

In addition, the ultrasonic bonding device 1 is capable of horizontal movement in the horizontal movement direction H1 parallel to the surface forming direction (X direction) of the substrate 3, and the lead wire guide mechanism 203 is connected to the ultrasonic bonding device 1 It is integrally connected and moves horizontally together with the ultrasonic bonding device 1.

Therefore, for example, by moving the ultrasonic bonding device 1 (ultrasonic oscillation head 5) and the lead wire guide mechanism 203 along the left direction (-X direction), while changing the bonding target region of the lead wire 4 The ultrasonic bonding operation by the ultrasonic bonding apparatus 1 can be repeatedly performed.

The lead wire take-out device 200, which is a prerequisite technology, first pulls out the lead wire from the lead wire accommodating mechanism 201, passes it through the tension adjusting mechanism 202 and the lead wire guide mechanism 203, and moves the substrate 3 to the target position. The initial setting process for lead wire extraction leading to the surface was performed manually by an operator.

That is, by manual operation, the operator passes the lead wire 4 through the tension adjusting mechanism 202 while bringing it into contact with various rollers of the tension adjusting mechanism 202 while gripping the tip of the lead wire 4 from the lead wire accommodating mechanism 201, and further leading the lead wire ( 4) passed the lead wire 4 by the lead wire guide mechanism 203 in an aspect pinched from the top and bottom, and guided the tip part of the lead wire 4 to the surface of the board|substrate 3. In this way, the initial setting process for taking out the lead wire was performed manually by a human hand.

A lead wire take-out device according to an embodiment described below automatically performs the initial setting process for lead wire take-out.

<Embodiment>

(composition)

1 is an explanatory diagram schematically showing the overall configuration of a lead wire take-out device 100 according to an embodiment of the present invention. In FIG. 1, the XYZ orthogonal coordinate system is described.

As shown in the figure, the lead wire take-out device 100 includes a lead wire accommodating mechanism 101, a tension adjusting mechanism 102, a lead wire guide mechanism 103, a lead wire gripping and moving mechanism 104, and a control unit 105 (not shown). ) as a major component.

With the lead wire accommodating mechanism 101 as a reference, the tension adjusting mechanism 102 is provided at the front end (-X side) of the lead wire guide mechanism 103.

FIG. 2 is a block diagram schematically showing the control system of the lead wire take-out device 100. As shown in FIG. As shown in the figure, the control unit 105 outputs control signals S1 to S4. Control signal S3 is output to the lead wire storage mechanism 101, control signal S2 is output to the tension adjusting mechanism 102, control signal S3 is output to the lead wire guide mechanism 103, and control signal S4 is output to the lead wire gripping and moving mechanism It is output to (104).

On the other hand, remaining amount detection signal S16 is output from remaining amount detector 16 described later, and breakage detection signal S17 is output from breakage detector 17 described later. The remaining amount detection signal S16 and the breakage detection signal S17 are input to the control unit 105.

In addition, the control unit 105 receives an execution request signal S20 instructing execution of the initial setting process for lead-out. The execution request signal S20 can be generated by an operator performing a predetermined operation. As the predetermined operation, pressing of an execution start button (not shown) provided in the lead wire take-out device 100, for example, can be considered.

The control unit 105 is configured in detail later when the remaining amount detection signal S16 indicates a lead wire remaining amount shortage state, when the break detection signal S17 indicates breakage of the lead wire 4, or when an execution request signal S20 is received. It is possible to recognize the need to perform initial setting processing for lead wire drawing to be performed.

The control unit 105 outputs control signals S1 to S4 to the main components 101 to 104, thereby controlling the lead wire accommodating mechanism 101, the tension adjusting mechanism 102, the lead wire guide mechanism 103, and the lead wire gripping movement mechanism 104. ) is controlled to control the execution of initial setting processing for lead-out, which will be described later in detail.

Returning to Fig. 1, the lead wire storage mechanism 101 includes a lead cassette 10, a lock release mechanism 13, and a remaining amount detector 16 as main components.

FIG. 3 is an explanatory diagram showing the structure of the lead cassette 10 in the lead wire accommodating mechanism 101 shown in FIG. 1 . In FIG. 3, the XYZ orthogonal coordinate system is described. Also in each of FIGS. 4 to 21 shown later, the XYZ orthogonal coordinate system is described.

As shown in Fig. 3, in the lead cassette 10, most of the lead wire 4 is housed in the winding area 10w so that it can be taken out from the front end.

The lead cassette 10 includes a bracket 20, two guide holes 21, a support shaft 22, a guide roller 23, and a lock mechanism 24 as main components.

Two guide holes 21 are provided at the upper part (+Z direction side) of the bracket 20, a tension-variable support shaft 22 is installed in the central part, and a guide roller 23 is provided at the lower part (-Z direction side). ) and a locking mechanism 24 are provided. The guide roller 23 is provided to guide the lead wire 4 in the direction of the locking mechanism 24 . In addition, the tension-variable support shaft 22 and the guide roller 23 are attached to the bracket 20 so as to be rotatable along the rotational direction R4 (left rotation).

The lead wire 4 is wound around the support shaft 22 as a central axis, and the distal end is positioned on the locking mechanism 24 while making contact with a part of the outer circumferential surface of the guide roller 23 . Most of the lead wire 4 is housed in the winding region 10w.

The support shaft 22 has a tension variable function that generates an appropriately adjusted frictional force so that the lead wire 4 does not rotate in the opposite direction to the winding direction (= rotational direction R4) and become loose.

FIG. 4 is an explanatory diagram showing details of the locking mechanism 24 shown in FIG. 3 . The unlocking mechanism 13 shown in FIG. 1 can apply the unlocking force F13 to the locking mechanism 24 as needed. Also, as the unlocking mechanism 13, a cylinder can be considered, for example.

As shown in Fig. 4, the locking mechanism 24 includes an upper locking metal member 30, a lower locking metal member 31 and a spring 32 as main components. In a state where the unlocking force F13 is not applied from the unlocking mechanism 13, since the elastic force of the spring 32 directed downward (-Z direction) is applied, the locking metal member 30 is moved to the position indicated by the solid line. It is pushed down, so that the lower surface of the lock metal member 30 comes into close contact with the upper surface of the lock metal member 31 .

On the other hand, when the unlocking force F13 directed upward (+Z direction) is applied, since the unlocking force F13 is applied to a part of the lower surface of the locking metal member 30, the locking metal member 30 moves to the position indicated by the broken line. It is pushed up and becomes a space formation state in which a space is provided between the lower surface of the lock metal member 30 and the upper surface of the lock metal member 31 .

In the locking mechanism 24 having such a configuration, when the unlocking force F13 is not applied by the unlocking mechanism 13, the locking metal members 30 and 31 are brought into close contact with the lead wire 4 exposed to the outside. The front end of ) is pinched and gripped by the lock metal members 30 and 31. That is, the lead wire 4 is gripped and fixed by the locking mechanism 24 in a state where a specified amount protrudes from the winding region 10w.

On the other hand, when an unlocking force F13 is applied to a part of the locking metal member 30 by the unlocking mechanism 13, the locking metal members 30 and 31 are in a space forming state, and the lead wire 4 exposed to the outside The distal end of is freed. That is, the lead wire 4 is in a release state in which it can be drawn out from the lead wire accommodating mechanism 101 .

In this way, the locking mechanism 24 fixes the front end of the lead wire 4 exposed to the outside via between the locking metal members 30 and 31 depending on the presence or absence of the unlocking force F13 from the unlocking mechanism 13. / The conversion of liberation becomes possible.

Returning to FIG. 1 , the lead wire storage mechanism 101 further has a remaining amount detector 16, which is a member different from the lead cassette 10, and the remaining amount detector 16 is located in the winding area 10w of the lead wire 4 The presence or absence of a lead wire residual amount insufficient state in which the residual amount in is less than or equal to the reference amount is detected.

That is, the remaining amount detector 16 detects the remaining amount of the lead wire 4 wound around the support shaft 22 in the winding region 10w, compares the detected residual amount with the reference amount, and The presence or absence of a lead wire residual amount insufficient state in which the remaining amount is equal to or less than the reference amount is detected, and a residual amount detection signal S16 indicating the presence or absence of the lead wire residual amount insufficient state is output to the control unit 105 .

Therefore, by outputting the remaining amount detection signal S16 from the remaining amount detector 16 to the controller 105 for instructing the occurrence of a lead wire remaining amount insufficient state, replacement of the lead cassette 10 in use with a new lead cassette 10 can be urged. there is.

Further, as a specific example of the remaining amount detector 16, a reflective laser measuring instrument can be considered, for example. With the reflective laser measuring instrument, the distance to the outermost periphery of the wound lead wire 4, which is an obstacle, can be detected as a detection distance, and the remaining amount of the lead wire 4 can be detected based on this detection distance. .

For example, when the remaining amount of the lead wire 4 is "0", since there is no obstacle up to the support shaft 22, the distance from the remaining amount detector 16 to the support shaft 22 is determined by the remaining amount detector 16. The support shaft arrival distance is detected as the detection distance. Therefore, when the reference amount is "0", if the detection distance detected by the remaining amount detector 16 coincides with the reach distance of the support shaft, occurrence of the lead wire remaining amount shortage condition can be detected.

In this way, the remaining amount detector 16 has a function of measuring the distance to an immediately nearby obstacle, so that it can detect the presence or absence of a lead wire remaining amount insufficient state and output a remaining amount detection signal S16 indicating the presence or absence of a lead wire remaining amount insufficient state. In the case where the reference amount is set to "0", the remaining amount detector 16 may be a detector having a color recognition function capable of visual recognition of the support shaft 22 .

FIG. 5 is an explanatory diagram schematically showing the replacement situation of the lead cassette 10 using the remaining amount detector 16. As shown in FIG. In FIG. 5, the component part excluding the lead cassette 10 from the lead wire take-out device 100 is shown as a fixed component 100p.

As shown in the figure, a lead cassette group 10G for replacement composed of a plurality of lead cassettes 10 is prepared in advance. With respect to the lead cassette 10 (hereinafter abbreviated as "old lead cassette 10") of the lead wire take-out device 100 currently in use, residual amount detection indicating occurrence of a lead wire residual amount insufficient state by the remaining amount detector 16 Consider a case where the signal S16 is output.

In this case, the old lead cassette 10 is first detached from the holding member 100p of the lead wire take-out device 100. At this time, the unlocking mechanism 13 and the remaining amount detector 16 continue to remain as the fixed component 100p.

Then, one lead cassette 10 from the replacement lead cassette group 10G is selected as a new lead cassette 10 (hereinafter abbreviated as “new lead cassette 10”), and the new lead cassette 100p is The lead cassette 10 is installed and the lead wire take-out device 1CO is rebuilt.

In this way, when the remaining amount detection signal S16 indicating the insufficient amount of lead wire in the old lead cassette 10 is output by the remaining amount detector 16, the old lead cassette 10 can be quickly replaced with the new lead cassette 10. there is.

In addition, the two guide holes 21 provided in the respective brackets 20 of the plurality of lead cassettes 10 in the lead cassette group for replacement 10G do not shift position between the plurality of lead cassettes 10. Provided with high precision. Therefore, the two guide holes 21 serve as reference holes for determining the position of the lead cassette 10 .

Specifically, by gripping the bracket 20 of the new lead cassette 10 at an accurate gripping position based on the two guide holes 21, the distal end of the lead wire 4 (lock mechanism 24) is held with high precision. The lead cassette 10 may be installed on the fixed component 100p so as to be positioned at the initial position P1. Therefore, the positional relationship between the remaining amount detector 16 and the unlocking mechanism 13 for the new lead cassette 10, and the positional relationship between the remaining amount detector 16 and the unlocking mechanism 13 for the old lead cassette 10 become the same

By using the two guide holes 21 as reference holes in this way, the new lead cassette 10 is positioned with high precision when exchanging the old lead cassette 10 to the new lead cassette 10, and the fixing component 100p can be installed on

A gripping operation on the bracket 20 and an installation operation of the new lead cassette 10 to the fixing portion 100p are executed using a cassette gripping mechanism and a cassette mounting mechanism (not shown) that can be executed under the control of the controller 105. By doing so, automation of the exchange process from the old lead cassette 10 to the new lead cassette 10 described above can be achieved.

Returning to Fig. 1, the tension adjusting mechanism 102 includes a dancer roller 7, two elevating guide rollers 11 and a break detector 17 as main components. The dancer roller 7 is movable along the vertical movement direction V7 (±Z direction), and the two elevating guide rollers 11 are movable along the vertical movement direction V11 (±Z direction). The dancer roller 7 and the two elevating guide rollers 11 serve as at least one roller included in the tension adjusting mechanism 102 .

Moreover, as shown in FIG. 1, actually, the dancer roller 7 is attached to the installation jig 7j, and two elevating type guide rollers 11 are attached to the installation jig 11j. However, hereinafter, for convenience of description, including the dancer roller 7 and the installation jig 7j, it is simply referred to as a "dancer roller 7", and includes two elevating guide rollers 11 and an installation jig 11j In some cases, it is simply referred to as "elevating type guide roller 11".

The dancer roller 7 is located above the hand traveling space 50 described later as indicated by the broken line in the preparation state (first preparation state), and as indicated by the solid line in the actual operation state (first actual operation state). It is located below the hand travel space 50.

The elevating guide roller 11 is located below the hand traveling space 50 as indicated by a broken line in a ready state (first prepared state), and as indicated by a solid line in an actual operating state (first actual operating state). It is located within the hand travel space 50.

Therefore, the tension adjusting mechanism 102 having the dancer roller 7 and two elevating guide rollers 11 as at least one roller is a partial space (first part) that becomes part of the hand travel space 50 in the ready state. space).

On the other hand, in the tension adjusting mechanism 102, in the actual operation state, the upper outer circumferential surface of the elevating guide roller 11 and the lead wire 4 are in contact, and the lower outer circumferential surface of the dancer roller 7 and the lead wire 4 are in contact. By doing so, the tension adjusting process can be performed so that the tension applied to the lead wire 4 is kept constant.

In this way, the tension adjusting mechanism 102 is in a ready state for forming a partial space (first partial space) that is part of the hand traveling space 50 (first ready state), and an actual operating state in which the tension adjusting process can be executed. (first actual operating state).

Further, the tension adjusting mechanism 102 includes a break detector 17 that detects the presence or absence of disconnection of the lead wire 4 when the tension adjusting process is being executed in an actual operating state. The fracture detector 17 is disposed in the vicinity of the lowermost position in which the dancer roller 7 can descend in an actual operating state.

The principle of detection by the fracture detector 17 is as follows. If the lead wire 4 is disconnected, since tension by the lead wire 4 is lost, the dancer roller 7 descends to the lowest possible drop position. Therefore, the break detector 17 can detect the occurrence of the disconnection state of the lead wire 4 by detecting that the dancer roller 7 has descended to the lowest possible drop position.

As a result, the dancer roller 7 can output to the control unit 105 a fracture detection signal S17 indicating the presence or absence of disconnection of the lead wire 4 .

Further, as specific examples of the break detector 17, a position detector, a reed switch, a limit switch, a contact switch, and the like can be considered.

The lead wire guide mechanism 103 includes a retractable lead guide 12, a fixed lead guide 70, a cylinder for elevating the lead guide 71 and a lead holding cylinder 72 as main components.

The retractable lead guide 12 is movable in the vertical movement direction V12 (±Z direction) by the lead guide elevating cylinder 71. On the other hand, the fixed lead guide 70 is fixedly arranged by a fixing means not shown.

When the retractable lead guide 12 exists below indicated by solid lines, a microspace is formed between the lower surface of the retractable lead guide 12 and the upper surface of the fixed lead guide 70 by means of the lead gripping cylinder 72, The lead wire 4 can be loosely gripped so that the lead wire 4 can move. Therefore, the lead wire 4 can pass through the microspace.

In addition, a guide roller 73 is provided on the fixed lead guide 70 on the input side of the micro-space, and a guide roller 74 is provided on the retractable lead guide 12 on the output side of the micro-space. Guide rollers 73 and 74 are provided to smoothly move the lead wire 4 back and forth in the microspace.

In the ready state (second ready state), as indicated by the broken line, the retractable lead guide 12 is moved upward by the lead guide elevating cylinder 71 and is located above the hand traveling space 50, and is in actual operation. In the state (the second actual operating state), as indicated by the solid line, the microspace is formed below the hand travel space 50 between the fixed lead guide 70 and the hand travel space 50 .

Therefore, the lead wire guide mechanism 103 having the retractable lead guide 12 forms a partial space (second partial space) that becomes a part of the hand traveling space 50 in a ready state.

On the other hand, in the actual operating state, the lead wire guide mechanism 103 forms the microspace between the retractable lead guide 12 and the fixed lead guide 70, and passes the lead wire 4 through the microspace so that the lead wire 4 ) can be guided downward.

In this way, the lead wire guide mechanism 103 is in a preparation state (second preparation state) of forming a partial space (second partial space) that is part of the hand traveling space 50, and an actual operating state in which the guide process can be executed ( The state is changed between the second actual operating state).

The lead wire holding and moving mechanism 104 includes an elevating hand unit 15 and a horizontally moving mount 14 as main components.

The horizontally movable mount device 14 has a predetermined thickness (length in the Z direction) and a predetermined width (length in the Y direction), and is provided extending in the horizontal direction (X direction).

The elevating hand unit 15 has a gripping portion 629 at its tip. The gripping portion 62g is capable of gripping operation of gripping the lead wire 4 in accordance with the opening/closing operation OP15.

The elevating hand unit 15 is installed in the horizontally movable device 14 so as to be movable between the initial position P1 and the target position P2 along the horizontal movement direction H14 (±X direction). Accordingly, the elevating hand unit 15 is capable of moving the gripper moving in the horizontal movement direction H14 in a state where the gripper 629 grips the lead wire 4 . Furthermore, the elevating hand unit 15 is also capable of movement along the vertical movement direction V15 (±Z direction).

FIG. 6 is an explanatory diagram showing a detailed structure of the lead wire gripping movement mechanism 104 shown in FIG. 1 . In addition, the horizontally movable device 14 and the elevating hand unit 15 (holding portion 62g) shown in Fig. 1 are schematically shown, and the actual shape is similar to the structure shown in Fig. 6 .

As shown in Fig. 6, the horizontally movable device 14 is fixedly arranged at a position (+Z direction side) higher than the gripping portion 62g by a fixing means not shown.

The elevating type hand unit 15 is installed on the horizontally movable mount 14 through the hand unit installation jig 85 and the up and down slide table 60. The up and down slide table 60 is installed on the hand unit installation jig 85 so as to be movable in the vertical movement direction V15 (±Z direction), and the elevating hand unit 15 is provided integrally with the up and down slide table 60. do.

Accordingly, the elevating hand unit 15 can move along with the up and down slide table 60 in the vertical movement direction V15 (±Z direction) in a state where the hand unit installation jig 85 is fixed.

The chucking hand 62 is installed below the elevating hand unit 15 through a horizontal slide table 61, and the tip of the chucking hand 62 on the right side (+Y direction) serves as the gripping portion 62g. The horizontal slide table 61 is installed in the elevating hand unit 15 to be movable in the horizontal movement direction H62, and the chucking hand 62 is integrally provided with the horizontal slide table 61.

Therefore, the chucking hand 62 can move along with the horizontal slide table 61 in the horizontal movement direction H62 (±Y direction) in a state where the elevating hand unit 15 is stopped.

The end of the right side (+Y direction) of the chucking hand 62 serves as the gripping portion 62g. The gripping portion 62g can perform a gripping operation in which the lead wire 4 is gripped by the gripping portion 629 by the opening and closing operation OP15 by the upper gripping member and the lower gripping member.

As described above, the lead wire gripping movement mechanism 104 has a gripping portion 62g, and can perform a gripping operation of gripping the front end of the lead wire 4 by the gripping portion 62g.

Further, the lead wire gripping movement mechanism 104 moves the gripper 62g through the hand travel space 50 by matching the arrangement height of the gripper 62g to the hand travel space 50 as the lead wire movement space. An operation of moving the gripper to move it from the position P1 to the target position P2 is further feasible.

(Initial setting processing for lead wire withdrawal)

Regarding the initial setting process for lead wire drawing, for example, the output of the remaining amount detection signal S16 indicating the lead wire remaining amount insufficient state by the remaining amount detector 16, and the breakage indicating disconnection of the lead wire 4 by the break detector 17 The output of the detection signal S17 or the output of the execution request signal S20 according to the operator's request becomes the execution start condition.

As shown in Fig. 2, since the remaining amount detection signal S16, the break detection signal S17, and the execution request signal S20 are input to the control unit 105, when the execution start condition is satisfied, the control unit 105 executes control of the initial setting process for lead wire drawing. can initiate.

The initial setting process for lead wire drawing executed under the control of the control unit 105 includes the following steps (a) to (e).

Step (a) causes the lead wire gripping movement mechanism 104 to perform a gripping operation at the initial position P1, thereby leading the lead wire 4 housed in the lead wire accommodating mechanism 101 (winding region 10w). It is a step that grips the

Step (b) is a step of setting the tension adjusting mechanism 102 to a ready state (first ready state) and setting the lead wire guide mechanism 103 to a ready state (second ready state).

Step (c) causes the lead wire gripping moving mechanism 104, which has been gripping at the initial position P1, to further perform the gripping moving operation to move the gripping unit 62g to the target position P2. It is a moving step.

By this step (c), the tip of the lead wire 4 held by the gripper 629 passes through the hand travel space 50 (lead wire travel space) including the first and second partial spaces. After that, it is guided to the target position P2 together with the gripper 629, and after the execution of this step (c), the gripper moving operation ends.

Step (d) is executed after step (c) to set the tension adjusting mechanism 102 to an actual operating state (first actual operating state) and to set the lead wire guide mechanism 103 to an actual operating state (second actual operating state). ) is the step to set.

Step (e) is a step that is executed after step (c) and ends the gripping operation by the gripping portion 62g to release the lead wire 4 from the lead wire gripping moving mechanism 104 .

7 to 21 are explanatory diagrams showing operational details of the initial setting process for lead wire extraction. 7 to 12 schematically show the initial setting process for lead wire extraction, and are views viewed from the XZ plane in a plan view similarly to FIG. 1 . 13 to 21 show the initial setting process for lead wire drawing along the real structure within a possible range, and are views viewed from the YZ plane in plan view. 13 to 15 correspond to section A-A in FIG. 1 , FIGS. 16 to 18 correspond to section B-B in FIG. 1 , and FIGS. 19 to 21 correspond to section C-C in FIG. 1 .

Hereinafter, processing contents of the initial setting processing for lead wire extraction performed under the control of the control unit 105 are described with reference to these drawings.

As shown in Fig. 7, the lead wire accommodating mechanism 101, the tension adjusting mechanism 102, the lead wire guide mechanism 103, and the lead wire gripping mechanism 104 are each set to an initial state. That is, Fig. 7 shows the state just before the execution of the initial setting process for lead wire drawing out.

As shown in Fig. 7(a) and Fig. 14, in the initial state, the lead wire 4 is fixed by the locking mechanism 24 in a fixed state in a state where the front end protrudes from the locking mechanism 24. This state is the lead wire fixed state. That is, in the lead wire fixing state, the unlocking force F13 from the unlocking mechanism 13 is not applied to the locking mechanism 24 .

7 to 13, a virtual line extending in the horizontal direction (X direction) from the lead wire 4 fixed by the locking mechanism 24 is shown as a drawing reference line LS.

7(a) to 11(a) show the lead wire accommodating mechanism 101, the tension adjusting mechanism 102 and the lead wire guide mechanism 103, respectively, and FIG. 7(b) to FIG. 11 (b) In each case, the lead wire gripping movement mechanism 104 is shown. 7 (a) to 11 (a) and FIG. 7 (b) to FIG. 11(a) and FIG. 7(b) to FIG. 11(b) each show a common drawing reference line LS.

13 to 15, the lead cassette 10 is provided on the upper surface of the machine frame 81, and the unlocking mechanism 13 is on the upper surface of the machine frame 81, with the lead cassette 10 provided adjacent to it. In addition, the tension-variable support shaft 22 is rotatably installed on the support shaft table 26 and extends into the winding region 10w through the bearing 28 provided in the opening of the bracket 20. The base 26 for the support shaft is fixed to the bracket 20 via an installation jig 29 provided on the side of the bracket 20 .

As shown in (b) of FIG. 7 , the elevating hand unit 15 of the lead wire gripping movement mechanism 104, in the initial state, has a gripping portion 62g so that the arrangement height of the holding portion 62g is positioned at the drawing reference line LS ( 62g) is raised in the vertical movement direction V15 (+Z direction). Further, in the initial state, the gripping portion 62g is executing the opening/closing operation OP15 so that the gripping release space SP15 is provided.

Further, the elevating hand unit 15 has a hand unit movable body 19 below, and the hand unit movable body 19 moves in the horizontal direction (X direction) within the horizontal movable mount 14, thereby holding the gripping portion. The horizontal movement operation of (62g) becomes possible.

As shown in (a) of FIG. 7, in the tension adjusting mechanism 102, in the initial state, the dancer roller 7 is below the drawing reference line LS, and the elevating guide roller 11 is near the bottom of the drawing reference line LS arranged to be positioned

As shown in (a) of FIG. 7, in the lead wire guide mechanism 103, in the initial state, the retractable lead guide 12 is arranged so as to be located below the drawing reference line LS by the lead guide elevating cylinder 71.

Fig. 8 shows a state in which processing corresponding to steps (a) and (b) of the lead wire lead-out initial setting processing is executed.

As shown in FIGS. 8 and 13, the chucking hand 62 is horizontally moved from the initial state along the horizontal movement direction H62 (+Y direction) to a position where the tip of the lead wire 4 can be gripped. ) to move. That is, the chucking hand 62 is moved in a state where the tip of the lead wire 4 is present in the gripping release space SP15 (see Fig. 6) of the gripping portion 62g.

By closing the gripping release space SP15 in this state, a gripping operation of gripping the front end of the lead wire 4 by the gripping portion 62g is executed.

When the gripping operation by the gripping portion 629 is completed, as shown in FIG. 8(a) and FIG. The clamping of the lead wire 4 by the mechanism 24 is released, and the lead wire 4 is in a lead wire release state. That is, in the lead wire release state, the lead wire 4 is in a state freed from the lead wire accommodating mechanism 101 .

In this way, at the initial position P1, a process corresponding to step (a) of gripping the front end of the lead wire 4 accommodated in the lead wire receiving mechanism 101 by causing the lead wire gripping moving mechanism 104 to perform the gripping operation is performed. It runs.

As shown in Fig. 8(a) and Fig. 18, the tension adjusting mechanism 102 is set to a ready state (first ready state). That is, the elevating guide roller 11 is lowered from the initial state along the vertical movement direction V11 (-Z direction) by the elevating drive unit D11, and along the vertical movement direction V7 (+Z direction) by the elevating drive unit D7. The dancer roller 7 is raised from the initial state. Further, as the driving unit D11 for elevation and the driving unit D7 for elevation, for example, a cylinder can be considered.

In the tension adjusting mechanism 102, in the ready state, the elevating guide roller 11 is located below the drawing reference line LS and the dancer roller 7 is located above the drawing reference line LS, so that the dancer roller 7 and the elevating guide A partial space (first partial space) that is part of the hand travel space 50 is secured between the rollers 11 . That is, both the elevating guide roller 11 and the dancer roller 7 do not exist in the hand travel space 50 including the partial space.

As shown in FIG. 8(a) and FIG. 21, the lead wire guide mechanism 103 is set to a ready state (second ready state). That is, the retractable lead guide 12 is raised from the initial state along the vertical movement direction V12 (+Z direction) by the lead guide elevating cylinder 71.

In the lead wire guide mechanism 103, in the ready state, the retractable lead guide 12 is located upward from the drawing reference line LS, so that it becomes part of the hand travel space 50 between the retractable lead guide 12 and the fixed lead guide 70 A partial space (second partial space) is secured. That is, both the retractable lead guide 12 and the fixed lead guide 70 do not exist in the hand travel space 50 including the partial space.

In this way, processing corresponding to step (b) of setting the tension adjusting mechanism 102 to a ready state (first ready state) and setting the lead wire guide mechanism 103 to a ready state (second ready state) is executed.

Fig. 9 shows a state in which a process corresponding to step (c) of the lead wire lead-out initial setting process is executed.

In the stage before execution of the process corresponding to step (c), as shown in FIG. 8 , at the initial position P1, the gripping portion 62g of the lead wire gripping movement mechanism 104 is the lead wire existing on the drawing reference line LS ( The distal end of 4) is gripped. That is, the holding portion 62g is disposed so as to be included in the hand traveling space 50 in the height direction (Z direction).

Then, as shown in Fig. 9, the gripper moving operation of moving the lead wire gripping moving mechanism 104 (gripping unit 62g) performing the above-described gripping operation along the horizontal movement direction H14 (+X direction) run it As a result, the gripping portion 62g can be moved from the initial position P1 to the target position P2 through the hand travel space 50 .

As shown in FIG. 16, in the tension adjusting mechanism 102, a partial space (first partial space) that is part of the hand travel space 50 is formed between the dancer roller 7 and the elevating guide roller 11, there is. Therefore, during the execution of the gripping unit moving operation, the gripping unit 62g passes through the hand traveling space 50 (first partial space) formed between the dancer roller 7 and the elevating guide roller 11 without hindrance. can do.

Further, as shown in FIG. 19, the lead wire guide mechanism 103 forms a partial space (second partial space) between the retractable lead guide 12 and the fixed lead guide 70 as part of the hand traveling space 50. are forming Therefore, when the gripping unit moving operation is executed, the gripping unit 62g passes through the hand travel space 50 (second partial space) formed between the retractable lead guide 12 and the fixed lead guide 70 without hindrance. can do.

Therefore, by executing the gripper moving operation, the tip of the lead wire 4 gripped by the gripper 62g moves the hand traveling space 50 (lead wire moving space) including the first and second subspaces described above. After passing through, it is guided to the target position P2 together with the gripper 62g, and then the gripper moving operation ends.

In this way, a process corresponding to step (c) of causing the lead wire gripping movement mechanism 104 to execute the gripper moving operation is executed. Immediately after the execution of step (c), the lead wire 4 exists in the hand traveling space 50, and also the dancer roller 7, the elevating guide roller 11, the retractable lead guide 12 and the fixed lead guide 70 ) overlap each other and in planar view in the XY plane.

10 and 11 show a state in which a process corresponding to step (d) of the initial setting process for taking out the lead wire is executed. Fig. 11 also shows a state in which a process corresponding to step (e) of the initial setting process for taking out the lead wire is executed.

As shown in FIG. 10(a) and FIG. 20, the gripping portion 62g of the lead wire gripping movement mechanism 104 is lowered in the vertical movement direction V15 (direction -Z), and at the same time, the lead wire guide mechanism 103 is It is set to an operating state (second actual operating state). That is, the retractable lead guide 12 is lowered from the ready state (second ready state) along the vertical movement direction V12 (-Z direction) by the lead guide elevating cylinder 71 .

In the lead wire guide mechanism 103, in an actual operating state, the retractable lead guide 12 is located below the drawing reference line LS, and the lead wire 4 is positioned between the lower surface of the retractable lead guide 12 and the upper surface of the fixed lead guide 70. ) is secured. That is, the lead wire 4 is held in the microspace so that it can be drawn out from the tip.

Therefore, the lead wire guide mechanism 103 picks up the lead wire 4 from the top and bottom by the retractable lead guide 12 and the fixed lead guide 70 during actual operation, and passes the lead wire 4 through the microspace, so that the lead wire ( Guide processing for guiding the lead wire 4 in the downward (-Z direction) moving direction can be performed along with the movement in the horizontal direction (+X direction) of 4). By this guiding process, the lead wire 4 can be guided to the surface of the substrate to be bonded (not shown).

Subsequently, as shown in Fig. 11(a) and Fig. 17, the tension adjusting mechanism 102 is set to an actual operating state (first actual operating state). That is, the elevating guide roller 11 is raised from the ready state along the vertical movement direction V11 (+Z direction) by the elevating drive unit D11, and along the vertical movement direction V7 (-Z direction) by the elevating drive unit D7. The dancer roller 7 is lowered from the ready state. In addition, the drive unit D11 for elevation and the drive unit D7 for elevation are attached to the machine frame 82 .

In the tension adjusting mechanism 102, in an actual operating state, the elevating guide roller 11 is located near the drawing reference line LS, and the dancer roller 7 is located below the drawing reference line LS.

Therefore, the tension adjusting mechanism 102 maintains a contact relationship with the lead wire 4 at the upper outer circumferential surfaces of the two elevating guide rollers 11 during actual operation, and also maintains the lead wire 4 at the lower outer circumferential surface of the dancer roller 7. By maintaining the contact relationship with the lead wire 4, it is possible to execute a tension adjusting process in which the tension applied to the lead wire 4 is adjusted so as to be constant.

In this way, processing corresponding to step (d) of setting the tension adjusting mechanism 102 to the actual operating state (first actual operating state) and setting the lead wire guide mechanism 103 to the actual operating state (second actual operating state). is executed

Then, as shown by the broken line in FIG. 11 , a gripping releasing space SP15 is provided in the gripping portion 629 of the elevating hand unit 15 of the lead wire gripping movement mechanism 104, and the distal end of the lead wire 4 is provided. The gripping operation of gripping is terminated. As a result, the lead wire 4 is released from the lead wire gripping movement mechanism 104 .

In this way, processing corresponding to step (e) of ending the gripping operation by the gripper 62g is executed.

Thereafter, the chucking hand 62 is moved in the horizontal movement direction H62 (direction -Y) to return to the state indicated by the solid line in Fig. 6, followed by the solid line in Figs. 11(b) and 12(b). As shown, the elevating hand unit 15 is moved in the horizontal movement direction H14 (direction -X) and returns to the initial position P1. Further, the elevating hand unit 15 is raised from the initial position P1 in the vertical movement direction V15 (+Z direction), and the disposition of the gripping portion 629 is set to an initial state in the vicinity of the drawing reference line LS.

When the above-described initial setting process for drawing out the lead wire is completed, the lead wire 4 is placed on the surface of a substrate (not shown) by, for example, the ultrasonic bonding device 1 shown in FIG. By applying ultrasonic vibration to the region to be bonded, the lead wire 4 can be bonded to the surface of the substrate, which is the object to be bonded.

(effect)

The lead wire take-out device 100 of the present embodiment automatically executes the initial setting process for lead wire take-out including the steps (a) to (e) described above under the control of the control unit 105, thereby eliminating manual operation by the operator. There is an effect of being able to guide the tip of the lead wire 4 from the initial position P1 to the target position P2 without making it unnecessary.

In addition, the lead wire take-out device 100 fixes the front end of the lead wire 4 by the locking mechanism 24 in the lead wire storage mechanism 101 to make the lead wire fixed state, so that the lead wire 4 is not loosened. It can be housed in the lead cassette 10 (winding area 10w).

Furthermore, by releasing the tip of the lead wire 4 by the unlocking mechanism 13 in the lead wire accommodating mechanism 101 and bringing it into a lead wire released state, the tip of the lead wire 4 can be drawn out from the winding region 10w to the outside. can

Therefore, after causing the lead wire gripping and moving mechanism 104 to perform the gripping operation in the lead wire fixing state, and then causing the lead wire gripping and moving mechanism 104 to perform the gripping unit moving operation in the lead wire releasing state, the lead cassette With respect to the lead wire 4 housed in the winding region 10w in (10) in a wound state, both the gripping operation and the gripper moving operation by the lead wire gripping and moving mechanism 104 can be performed without problems.

In addition, the lead wire accommodating mechanism 101 has a residual quantity detector 16. Therefore, by detecting the occurrence of an insufficient lead wire remaining amount by the remaining amount detector 16, the necessity of replacing the lead cassette 10 with a new lead cassette 10 can be automatically recognized.

For example, as shown in Fig. 5, it is conceivable to prepare in advance a plurality of lead cassettes 10 for replacement. Then, with the output of the remaining amount detection signal S16 indicating the insufficient state of the remaining lead wire amount by the remaining amount detector 16 as a trigger, the lead cassette 10 in use is removed from the lead wire take-out device 100, and a plurality of prepared lead cassettes ( 10), one lead cassette 10 may be incorporated into the lead wire take-out device 100 as a new lead cassette 10.

In addition, the tension adjusting mechanism 102 has a break detector 17. Therefore, by detecting the disconnection state of the lead wire 4 by the break detector 17, it is possible to automatically recognize the need to redo the initial setting process for taking out the lead wire.

Although the present invention has been described in detail, the above description is illustrative in all respects, and the present invention is not limited thereto. It is interpreted that countless modified examples not illustrated can be assumed without departing from the scope of the present invention.

7: dancer roller
10: lead cassette
11: elevating guide roller
12: retractable lead guide
13: unlock mechanism
14: Horizontal directional mobile mount
15: elevating hand unit
16: remaining amount detector
17: break detector
24: lock mechanism
50: hand travel space
62: chucking hand
62g: grip part
70: fixed lead guide
100: lead wire withdrawal device
101 Lead wire receiving mechanism
102: tension adjustment mechanism
103: lead wire guide mechanism
104: lead wire gripping movement mechanism
105: control unit

Claims (4)

A lead wire receiving mechanism for housing a lead wire so that it can be taken out from the tip portion;
A lead wire gripping and moving mechanism having a gripping unit and capable of carrying out a gripping operation of gripping the tip of the lead wire by the gripping unit and a gripping unit moving operation of moving the gripping unit from an initial position to a target position through a lead wire moving space. and,
a tension adjusting mechanism that has at least one roller and performs a tension adjusting process for adjusting the tension applied to the lead wire by maintaining a contact relationship between the at least one roller and the lead wire;
a lead wire guide mechanism that performs a guide process of guiding the traveling direction of the lead wire by interposing the lead wire;
a control unit for controlling execution of an initial setting process for lead wire drawing out by controlling the lead wire accommodating mechanism, the lead wire gripping and moving mechanism, the tension adjusting mechanism, and the lead wire guide mechanism;
The gripper movement operation is a movement operation along only one direction,
the tension adjusting mechanism changes state between a first preparation state for forming a first partial space that is part of the lead wire moving space and a first actual operating state in which the tension adjustment process can be executed;
The state of the lead wire guide mechanism is changed between a second preparation state for forming a second partial space that is part of the lead wire movement space and a second actual operating state in which the guide process can be performed,
The initial setting process for lead wire withdrawal, which is executed under the control of the control unit,
(a) in the initial position, causing the lead wire gripping movement mechanism to perform the gripping operation, thereby gripping the front end portion of the lead wire housed in the lead wire receiving mechanism;
(b) setting the tension adjusting mechanism to the first ready state and setting the lead wire guide mechanism to the second ready state;
(c) a step of moving the gripping portion from the initial position to the target position by causing the lead wire gripping moving mechanism that is executing the gripping operation to further perform the gripping unit moving operation, wherein the step (c) ), after passing through the lead wire movement space including the first and second subspaces, the tip of the lead wire gripped by the gripper is guided to the target position together with the gripper, After execution of step (c), the movement of the gripper ends;
(d) a step, executed after step (c), of setting the tension adjusting mechanism to the first thread operating state and setting the lead wire guide mechanism to the second thread operating state;
(e) further comprising a step, executed after the step (c), to terminate the gripping operation by the gripping portion and release the lead wire from the lead wire gripping and moving mechanism;
Lead wire withdrawal device. According to claim 1,
The lead wire receiving mechanism,
A rotatable tension-variable support shaft is provided, and the lead wire is wound around the support shaft as a central axis and housed in such a way that the front end is exposed to the outside,
Further comprising a locking mechanism capable of switching between fixing and releasing the front end of the lead wire exposed to the outside,
Lead wire withdrawal device. According to claim 1 or 2,
The lead wire receiving mechanism,
Including a remaining amount detector for detecting the presence or absence of a lead wire remaining amount insufficient state in which the remaining amount of the lead wire is less than or equal to a reference amount,
Lead wire withdrawal device. According to claim 1 or 2,
The tension adjusting mechanism,
Including a break detector for detecting the presence or absence of disconnection of the lead wire when in the first actual operating state,
Lead wire withdrawal device.

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