KR102492321B1 - Camera module and optical apparatus - Google Patents

Abstract

This embodiment, the circuit board; an image sensor located on an upper surface of the circuit board; a sensor base located on an upper surface of the circuit board and accommodating the image sensor therein; and a lens driving unit coupled to an upper side of the sensor base, wherein the sensor base includes a first outer surface, a second outer surface adjacent to the first outer surface, and the first outer surface and the second outer surface. A first corner portion positioned between outer surfaces, and the sensor base includes a guide portion positioned in the first corner portion and formed by recessing a portion of an upper surface of the sensor base.

Description

Camera module and optical apparatus {Camera module and optical apparatus}

This embodiment relates to a camera module and an optical device.

The contents described below provide background information on the present embodiment, but do not describe the prior art.

As the distribution of various portable terminals is widely generalized and wireless Internet services are commercialized, consumers' demands related to portable terminals are also diversifying, and various types of additional devices are being installed in portable terminals.

Among them, a typical example is a camera module that takes a picture or video of a subject. Meanwhile, in the manufacturing process of the camera module, it is necessary to assemble the lens module and the image sensor according to their optical axis alignment. Optical axis alignment may be performed by temporarily curing the assembly of the camera module in a state in which the optical axis alignment is aligned, and then final curing.

By the way, in the camera module according to the prior art, there is a problem that the temporary curing for assembly of the camera module is not perfect, so that the position is distorted during movement, and there is a problem that the time of the temporary curing process is prolonged for contact stability.

In order to solve the above problems, it is intended to provide a camera module that improves ultraviolet rays (UV) curing stability and secures process and module reliability by changing the outer shape of a sensor base or a housing of a lens driving unit.

In order to effectively perform UV curing in the Active Align (AA) process, it is intended to provide a camera module with a widened light irradiation angle.

In addition, it is intended to provide an optical device including the camera module.

The camera module according to this embodiment includes a circuit board; an image sensor located on an upper surface of the circuit board; a sensor base located on an upper surface of the circuit board and accommodating the image sensor therein; and a lens driving unit coupled to an upper side of the sensor base, wherein the sensor base includes a first outer surface, a second outer surface adjacent to the first outer surface, and the first outer surface and the second outer surface. A first corner portion positioned between outer surfaces may be included, and the sensor base may include a guide portion positioned in the first corner portion and formed by recessing a portion of an upper surface of the sensor base.

A length in the optical axis direction at the center of the first outer surface may be longer than a length in the optical axis direction at the first corner portion of the first outer surface.

The guide part may include a chamfer part having a chamfer shape.

The guide part includes a first chamfer part having a first inclination and a second chamfer part having a second inclination different from the first inclination, and the first chamfer part and the second chamfer part continuously move from the inside to the outside. can be placed.

The second inclination may be greater than the first inclination, and the second chamfer may be located outside the first chamfer.

A length of the first outer surface in the optical axis direction may decrease from the center of the first outer surface toward the first corner portion.

The sensor base further includes a through hole penetrating the sensor base in an optical axis direction, the through hole is located on an upper side of the image sensor, and a first inner surface of the sensor base forming the through hole is It faces the first outer side surface, and the length of the first outer side surface in the optical axis direction at the center may be equal to or longer than the length of the first inner side surface in the optical axis direction.

The sensor base includes a filter accommodating portion formed by recessing a portion of an upper surface of the sensor base downward, and a UV filter is accommodated in the filter accommodating portion, and the UV filter may be positioned above the image sensor. .

An adhesive member positioned between the lens driving unit and an upper surface of the sensor base may be further included, and the adhesive member may be cured by ultraviolet light.

The sensor base includes a third outer surface adjacent to the second outer surface, a fourth outer surface adjacent to the first outer surface and the third outer surface, and the second outer surface and the third outer surface. A second corner part located between, a third corner part located between the third outer surface and the fourth outer surface, and a fourth corner part located between the fourth outer surface and the first outer surface Further, the guide part may be located at each of the first to fourth corner parts of the sensor base.

The lens driving unit may include a bobbin to which a lens module is coupled; a housing positioned outside the bobbin; a first elastic member coupled to the bobbin and the housing; a first driving unit located on the bobbin; and a second driving unit located in the housing and facing the first driving unit.

The optical device according to the present embodiment includes a circuit board; an image sensor located on an upper surface of the circuit board; a sensor base located on an upper surface of the circuit board and accommodating the image sensor therein; and a lens driving unit coupled to an upper side of the sensor base, wherein the sensor base includes a first outer surface, a second outer surface adjacent to the first outer surface, and the first outer surface and the second outer surface. A first corner portion positioned between outer surfaces may be included, and the sensor base may include a guide portion positioned in the first corner portion and formed by recessing a portion of an upper surface of the sensor base.

Through this embodiment, a space between the corner of the sensor base and the corner of the lens driving unit may be secured so that the UV light injection space may be widened.

In addition, since UV curing energy is secured, contact stability with respect to the position of the lens may be increased.

In addition, productivity can be increased by reducing curing time.

In addition, a space for additional adhesive reinforcement is provided in the space of the outer edge, and the size increase due to this reinforcement can be prevented. That is, dimension over may be prevented after an adhesive reinforcing operation to improve adhesion between the sensor base and the lens driving unit.

1 is a perspective view of a camera module according to this embodiment.
2 is an exploded perspective view of the camera module according to the present embodiment.
3 is a side view of the sensor base according to the present embodiment.
4 is a plan view of the sensor base according to the present embodiment.
5 is a side view of the sensor base according to the present embodiment.

Hereinafter, some embodiments of the present invention will be described through exemplary drawings. In describing the reference numerals for the components of each drawing, the same numerals indicate the same components as much as possible, even if they are displayed on different drawings. In addition, in describing an embodiment of the present invention, if it is determined that a detailed description of a related known configuration or function hinders understanding of the embodiment of the present invention, the detailed description will be omitted.

Also, terms such as first, second, A, B, (a), and (b) may be used to describe components of an embodiment of the present invention. These terms are only used to distinguish the component from other components, and the nature, order, or order of the corresponding component is not limited by the term. When an element is described as being “connected,” “coupled to,” or “connected” to another element, the element may be directly connected, coupled, or connected to the other element, but not between the element and the other element. It should be understood that another component may be “connected”, “coupled” or “connected” between elements.

The "optical axis direction" used below is defined as the optical axis direction of the lens module coupled to the lens driving device. Meanwhile, "optical axis direction" may be used interchangeably with a vertical direction, a z-axis direction, and the like.

The "auto focus function" used below refers to focusing on a subject by adjusting the distance to the image sensor by moving the lens module in the optical axis direction according to the distance of the subject so that a clear image of the subject can be obtained from the image sensor. defined as a function. Meanwhile, “auto focus” may be used interchangeably with “auto focus (AF)”.

The “hand shake correction function” used below is defined as a function of moving or tilting a lens module in a direction perpendicular to an optical axis direction to offset vibration (movement) generated in an image sensor by an external force. Meanwhile, “hand shake correction” may be used interchangeably with “optical image stabilization (OIS)”.

Hereinafter, the configuration of the optical device according to the present embodiment will be described.

The optical device according to the present embodiment includes a mobile phone, a mobile phone, a smart phone, a portable smart device, a digital camera, a laptop computer, a digital broadcasting terminal, a personal digital assistant (PDA), and a portable multimedia player (PMP). ), navigation, etc., but is not limited thereto, and any device for capturing images or photos is possible.

The optical device according to the present embodiment includes a main body (not shown), a display unit (not shown) disposed on one surface of the main body to display information, and a camera module (not shown) installed in the main body to take images or photos. It may include a camera (not shown) having a time).

Hereinafter, the configuration of the camera module according to the present embodiment will be described with reference to the drawings.

1 is a perspective view of a camera module according to this embodiment, Figure 2 is an exploded perspective view of the camera module according to this embodiment, Figure 3 is a side view of a sensor base according to this embodiment, Figure 4 is this embodiment A plan view of the sensor base according to , and FIG. 5 is a side view of the sensor base according to the present embodiment.

1 to 5, the camera module according to the present embodiment includes a circuit board 100, an image sensor 200, a sensor base 300, a lens driving unit 400, an adhesive member 500, and a filter. 600, and a lens module 700. However, in the camera module according to the present embodiment, the circuit board 100, the image sensor 200, the sensor base 300, the lens driving unit 400, the adhesive member 500, the filter 600, and the lens module ( 700) may be omitted. Meanwhile, the camera module according to the present embodiment may further include a lens protection tape 810, an insulating tape 820, and a connector 830.

An image sensor 200 may be mounted on the circuit board 100 . An image sensor 200 may be positioned on the upper surface of the circuit board 100 . The sensor base 300 may be positioned on the upper surface of the circuit board 100 . The circuit board 100 may support the sensor base 300 . The image sensor 200 may be positioned inside the top surface of the circuit board 100 , and the sensor base 300 may be positioned outside the top surface of the circuit board 100 . A lens driving unit 400 may be positioned above the sensor base 300 . Through this structure, light passing through the lens module 700 accommodated inside the lens driving unit 400 may be irradiated to the image sensor 200 mounted on the circuit board 100 . The circuit board 100 may supply power to the lens driving unit 400 . Meanwhile, a controller (not shown) for controlling the lens driving unit 400 may be located on the circuit board 100 .

The controller may control the direction, strength, amplitude, and the like of the current supplied to each component of the lens driving unit 400 . The controller may control the lens driving unit 400 to perform at least one of an auto focus function and a hand shake correction function of the camera module. That is, the controller may control the lens driving unit 400 to move the lens module in the direction of the optical axis, move or tilt the lens module in a direction perpendicular to the direction of the optical axis. Furthermore, the controller may perform feedback control of the auto focus function and hand shake correction function. In more detail, the controller receives the position of the lens module 700 sensed by the sensor unit (not shown) and controls power or current applied to the AF coil unit (not shown) and/or the OIS coil unit (not shown). Accordingly, a more precise auto focus function and hand shake compensation function may be provided.

The image sensor 200 may be located on an upper surface of the circuit board 100 . The image sensor 200 may be mounted on the circuit board 100 . The image sensor 200 may be accommodated inside the sensor base 300 . The image sensor 200 may be positioned below the through hole 320 of the sensor base 300 . The image sensor 200 may be located below the filter 600 . The image sensor 200 may be positioned such that an optical axis coincides with the lens module 700 . Through this, the image sensor 200 may obtain light passing through the lens module 700 . The image sensor 200 may output irradiated light as an image. The image sensor 200 may be, for example, a charge coupled device (CCD), a metal oxide semi-conductor (MOS), a CPD, and a CID. However, the type of image sensor 200 is not limited thereto.

The sensor base 300 may be located on an upper surface of the circuit board 100 . The sensor base 300 may accommodate the image sensor 200 inside. A lens driving unit 400 may be coupled to an upper side of the sensor base 300 .

The sensor base 300 includes a first outer surface 301, a second outer surface 302 adjacent to the first outer surface 301, the first outer surface 301 and the second outer surface 302. It may include a first corner portion 305 located between. The sensor base 300 may include first to fourth outer surfaces 301 , 302 , 303 , and 304 successively adjacent to each other. The sensor base 300 may include a first outer surface 301 adjacent to the fourth outer surface 304 and the second outer surface 302 . The sensor base 300 may include a second outer surface 302 adjacent to the first outer surface 301 and the third outer surface 303 . The sensor base 300 may include a third outer surface 303 adjacent to the second outer surface 302 and the fourth outer surface 304 . The sensor base 300 may include a third outer surface 303 and a fourth outer surface 304 adjacent to the first outer surface 301 . The sensor base 300 may include first to fourth corner portions 305 , 306 , 307 , and 308 positioned between the first to fourth outer surfaces 301 , 302 , 303 , and 304 . The sensor base 300 may include a first corner portion 305 positioned between the first outer surface 301 and the second outer surface 302 . The sensor base 300 may include a second corner portion 306 positioned between the second outer surface 302 and the third outer surface 303 . The sensor base 300 may include a third corner portion 307 positioned between the third outer surface 303 and the fourth outer surface 304 . The sensor base 300 may include a fourth corner portion 308 positioned between the fourth outer side surface 304 and the first outer side surface 301 .

The sensor base 300 may include a guide portion 310 formed by partially recessing an upper surface of the sensor base 300 downward. The guide part 310 may be formed by recessing a part of the upper surface of the sensor base 300 downward. The guide part 310 may be located at the first to fourth corner parts 305 , 306 , 307 , and 308 of the sensor base 300 . That is, the guide part 310 may be located at each of the four corner parts 305 , 306 , 307 , and 308 of the sensor base 300 .

The guide part 310 may be formed in a chamfer shape. The guide part 310 may be formed in a shape capable of widening an irradiation angle of light to the adhesive member 500 positioned on the upper surface of the sensor base 300 from the outside. The guide part 310 may include a first chamfer part 315 having a first inclination. The guide part 310 may include a second chamfer part 316 having a second inclination different from the first inclination. At this time, the first inclination is an angle between the upper or lower surface of the sensor base 300 and the first chamfer portion 315, and the second inclination is the angle between the upper or lower surface of the sensor base 300 and the second chamfer portion 316. It may be an angle formed by The first chamfer portion 315 may have a first inclination. The second chamfer portion 316 may have a second inclination different from the first inclination. The first chamfer part 315 and the second chamfer part 316 may be continuously disposed from the inside to the outside. Meanwhile, the second gradient may be greater than the first gradient. The second chamfer portion 316 may have a second inclination greater than the first inclination. The second chamfer part 316 may be located outside the first chamfer part 315 . That is, the guide portion 310 may be formed such that the inclination increases from the inside to the outside.

The guide part 310 may play a role of preventing dimensional overrun after an adhesive reinforcing operation to improve adhesion between the sensor base 300 and the lens driving unit 400 . In more detail, since the adhesive applied according to the reinforcement operation flows down to the guide part 310, the phenomenon that the adhesive applied according to the reinforcement operation protrudes to the side of the sensor base 300 and the lens driving unit 400 is reduced. can

Guide unit 310, the first axis (x axis in FIG. 3) and the second axis (y axis in FIG. 3) disposed in the horizontal direction and the third axis (z axis in FIG. 3) disposed in the vertical direction The shape can be determined according to the dimensions. In this case, the first axis, the second axis, and the third axis may form 90° to each other. The shape of the guide part 310 can be changed according to the size of the x, y, and z axes, and the sensor base 300 can also be formed in various shapes from a quadrangular shape to a polygonal shape according to the shape of the guide part 310. there is. As an example, the overall appearance of the sensor base 300 may be formed close to a hexahedron. That is, the shape of the sensor base 300 viewed from the top may be a quadrangular shape. However, as a modified example, when the size (z-axis value) of the guide part 310 is increased in all of the first to fourth corner parts 305, 306, 307, and 308 of the sensor base 300, the circuit The shape of the lower surface of the sensor base 300 attached to the substrate 100 becomes an octagonal shape from the existing quadrangular shape. In this case, the adhesive applied according to the reinforcement operation flows down to the surface of the circuit board 100, so that the adhesive strength is improved and dimensional stability can be further secured.

Although the guide unit 310 has been described as being formed on the sensor base 300 above, the guide unit 310 may also be formed on the lens driving unit 400 . That is, a guide portion 310 that is recessed upward may be formed on a lower surface of the lens driving unit 400 . At this time, the guide portion 310 may have a chamfer shape. However, it is not limited thereto, and the guide unit 310 may be provided in any shape as long as the UV light transmission space can be secured through the guide unit 310 .

The sensor base 300 may include a through hole 320 penetrating the sensor base 300 in an optical axis direction. Here, "optical axis direction" may be used interchangeably with "vertical direction". The through hole 320 may pass through the sensor base 300 in a vertical direction. The through hole 320 may be located above the image sensor 200 . The through hole 320 may be formed by an inner surface of the sensor base 300 . The first inner surface 321 of the sensor base 300 forming the through hole 320 may face the first outer surface 301 . The length of the first outer side surface 301 in the vertical direction at the center may be the same as the length of the first inner side surface 321 in the vertical direction. Alternatively, the length of the first outer surface 301 in the vertical direction at the center may be longer than the length of the first inner surface 321 in the vertical direction.

The sensor base 300 may include a filter accommodating portion 330 formed by partially recessing an upper surface of the sensor base 300 downward. The filter accommodating part 330 may be formed by recessing a part of the upper surface of the sensor base 300 downward. The filter 600 may be accommodated in the filter accommodating part 330 .

The sensor base 300 may include a substrate accommodating portion 340 accommodating at least a portion of a substrate (not shown) of the lens driving unit 400 . The substrate receiving unit 340 may accommodate at least a portion of the substrate of the lens driving unit 400 . The substrate accommodating portion 340 may be formed by recessing a part of an outer side surface of the sensor base 300 inward.

An adhesive member 500 may be positioned between the sense base 300 and the lens driving unit 400 . An adhesive member 500 may be positioned between the upper surface of the sensor base 300 and the lower surface of the lens driving unit 400 .

The lens driving unit 400 may be coupled to an upper side of the sensor base 300 . The lens driving unit 400 may be coupled to an upper surface of the sensor base 300 by an adhesive member 500 .

The lens driving unit 400 may perform an auto focus function by moving the lens module 700 in an optical axis direction. The lens driving unit 400 may perform a hand shake correction function by moving or tilting the lens module 700 in a direction perpendicular to the optical axis direction.

The lens driving unit 400 may include a cover member, a first mover, a second mover, a stator, a base, a support member, and a sensor unit, which are not shown. However, in the lens driving unit 400 according to the present embodiment, at least one of the cover member, the first mover, the second mover, the stator, the base, the support member, and the sensor unit may be omitted. In particular, the sensor unit may be omitted as a configuration for an auto focus feedback function and/or an image stabilization feedback function.

The cover member may form the exterior of the lens driving unit 400 . The cover member may have a hexahedral shape with an open bottom. However, it is not limited thereto. The cover member may include a top plate and a side plate extending downward from an outside of the top plate. Meanwhile, the lower end of the side plate of the cover member may be mounted on the base. A first mover, a second mover, a stator, and a support member may be positioned in the inner space formed by the cover member and the base. In addition, the cover member may be mounted on the base so that the inner surface is in close contact with part or all of the side surface of the base. Through such a structure, the cover member may have a function of preventing penetration of external contaminants while protecting internal components from external impact.

The cover member may be formed of a metal material as an example. More specifically, the cover member may be provided with a metal plate material. In this case, the cover member can block radio wave interference. That is, the cover member may block radio waves generated outside the lens driving unit from flowing into the cover member. In addition, the cover member may block radio waves generated inside the cover member from being emitted to the outside of the cover member. However, the material of the cover member is not limited thereto.

The cover member may include an opening formed on the top plate to expose the lens module 700 . The opening may have a shape corresponding to that of the lens module 700 . The size of the opening may be larger than the diameter of the lens module 700 so that the lens module 700 can be assembled through the opening. Also, light introduced through the opening may pass through the lens module 700 . Meanwhile, light passing through the lens module 700 may be transmitted to the image sensor.

The first mover may be coupled to the lens module 700 . The lens module 700 may be located inside the first mover. An outer circumferential surface of the lens module 700 may be coupled to an inner circumferential surface of the first mover. Meanwhile, the first mover may move integrally with the lens module 700 through interaction with the second mover. That is, the first mover can move the lens module 700 .

The first mover may include a bobbin and an AF coil unit. The first mover may include a bobbin coupled to the lens module 700 . The first mover may include an AF coil unit located on the bobbin and moved by electromagnetic interaction with the driving magnet unit.

The bobbin may be combined with the lens module 700 . More specifically, the outer circumferential surface of the lens module 700 may be coupled to the inner circumferential surface of the bobbin. Meanwhile, the AF coil unit may be coupled to the bobbin. Also, the lower part of the bobbin may be coupled to the lower support member, and the upper part of the bobbin may be coupled to the upper support member. The bobbin may be located inside the housing. The bobbin can move relative to the housing in the optical axis direction.

The bobbin may include a lens coupling part formed on the inside. The lens module 700 may be coupled to the lens coupler. A screw thread having a shape corresponding to a screw thread formed on an outer circumferential surface of the lens module 700 may be formed on an inner circumferential surface of the lens coupler. That is, the outer circumferential surface of the lens module 700 may be screwed to the inner circumferential surface of the lens coupler. Meanwhile, adhesive may be injected between the lens module 700 and the bobbin. At this time, the adhesive may be an epoxy cured by ultraviolet (7UV). That is, the lens module 700 and the bobbin may be bonded by UV curing epoxy. Alternatively, the lens module 700 and the bobbin may be bonded by heat-hardened epoxy.

The bobbin may include a first driving unit coupling part in which the AF coil unit is wound or mounted. The first driving unit coupling part may be integrally formed with the outer surface of the bobbin. In addition, the first drive unit coupling part may be formed continuously along the outer surface of the bobbin or may be formed spaced apart at predetermined intervals. The first driving part coupling part may include a recessed part formed by a part of the outer surface of the bobbin being recessed. The AF coil unit may be positioned in the recessed portion, and in this case, the AF coil unit may be supported by the first driving unit coupling unit.

As an example, the first driving unit coupling part may be formed by protruding parts located on upper and lower sides of the recessed part, and in this case, the coil of the first driving unit may be directly wound on the recessed part of the first driving unit coupling part. Alternatively, as another example, the first driving unit coupling part may be formed with an upper or lower side of the recessed part open and a hooking part provided on the other side. At this time, the coil of the first driving unit is pre-wound through the open part. insertion can be combined.

The bobbin may include an upper coupling portion coupled to the upper support member. The upper coupling part may be coupled to the inner side of the upper support member. As an example, the protrusion of the upper coupling part may be inserted into the groove or hole of the inner part and coupled thereto.

The bobbin may include a lower coupling portion coupled to the lower support member. The lower coupling part formed on the lower part of the bobbin may be coupled to the inner part of the lower support member. As an example, the protrusion of the lower coupling part may be inserted into the groove or hole of the inner part and coupled thereto.

The AF coil unit may be positioned to face the driving magnet unit of the second mover. The AF coil unit may move the bobbin with respect to the housing through electromagnetic interaction with the driving magnet unit. The AF coil unit may include a coil. The coil may be wound on the outer surface of the bobbin by being guided to the first driving part coupling part. In addition, as another embodiment, the AF coil unit may be provided with four independent coils and disposed on the outer surface of the bobbin so that two adjacent coils form a 90° angle to each other. The AF coil unit may receive power through the lower support member. In this case, the lower support member may be provided separately as a pair to supply power to the AF coil unit. Meanwhile, the AF coil unit may include a pair of lead wires for power supply. In this case, each of the pair of lead wires of the AF coil unit may be electrically coupled to each of the pair of lower support members. Alternatively, the AF coil unit may receive power from the upper support member. Meanwhile, when power is supplied to the AF coil unit, an electromagnetic field may be formed around the AF coil unit. In another embodiment, the location of the AF coil unit and the driving magnet unit may be changed.

The second mover may be located outside the first mover and facing the first mover. The second mover may be supported by a base located on the lower side. The second mover may be supported by a fixing member. At this time, the fixing member may include a base and a stator. That is, the second mover may be supported by the base and/or the stator. The second mover may be located in the inner space of the cover member.

The second mover may include a housing and a driving magnet part. The second mover may include a housing positioned outside the bobbin. In addition, the second mover may include a driving magnet part positioned opposite to the AF coil part and fixed to the housing.

At least a portion of the housing may be formed in a shape corresponding to an inner surface of the cover member. In particular, the outer surface of the housing may be formed in a shape corresponding to the inner surface of the side plate of the cover member. The outer surface of the housing and the inner surface of the side plate of the cover member may be formed flat. More specifically, when the housing is in the initial position, the outer surface of the housing and the inner surface of the side plate of the cover member may be parallel. In this case, when the housing is moved toward the cover member as much as possible, the outer surface of the housing and the inner surface of the side plate of the cover member are in contact with each other, so that the shock generated in the housing and/or the cover member can be dispersed. The housing may, for example, have a hexahedral shape including four sides. However, the shape of the housing may be provided in any shape that can be disposed inside the cover member. An upper support member may be coupled to an upper portion of the housing, and a lower support member may be coupled to a lower portion of the housing.

The housing is made of an insulating material and can be made as an injection molding product in consideration of productivity. The housing is a moving part for driving the OIS and may be spaced apart from the cover member by a predetermined distance. However, in the AF model, the housing may be fixed on the base. Alternatively, in the AF model, the housing may be omitted and the driving magnet portion may be fixed to the cover member.

The upper and lower sides of the housing are open to accommodate the first mover movably in the vertical direction. The housing may include an upper and lower open inner space inside. A bobbin may be movably positioned in the inner space. That is, the inner space may be provided in a shape corresponding to the bobbin. In addition, the inner circumferential surface of the housing forming the inner space may be spaced apart from the outer circumferential surface of the bobbin. The housing may be movably supported relative to the base. That is, the housing may be moved or tilted in a horizontal direction relative to the base.

The housing may include a second driving unit coupling part formed on a side surface in a shape corresponding to the driving magnet unit and accommodating the driving magnet unit. That is, the second driving part coupling part may accommodate and fix the driving magnet part. The driving magnet unit may be fixed to the second driving unit coupling unit with an adhesive. Meanwhile, the second driving unit coupling part may be located on an inner circumferential surface of the housing. In this case, there is an advantage in electromagnetic interaction with the AF coil unit located inside the driving magnet unit. In addition, the second driving unit coupling part may have an open lower part as an example. In this case, there is an advantage in electromagnetic interaction between the substrate positioned below the driving magnet unit and the driving magnet unit. As an example, the lower end of the driving magnet unit may be positioned to protrude lower than the lower end of the housing. As an example, four second drive unit coupling units may be provided. A driving magnet unit may be coupled to each of the four second driving unit coupling units.

The housing may include an upper coupling portion coupled to the upper support member. The upper coupling portion may be coupled to an outer portion of the upper support member. As an example, the protrusion of the upper coupling part may be inserted into the groove or hole of the outer part and coupled thereto.

The housing may include a lower coupling portion coupled to the lower support member. The lower coupling portion formed on the lower portion of the housing may be coupled to an outer portion of the lower support member. As an example, the protrusion of the lower coupling part may be inserted into the groove or hole of the outer part and coupled thereto.

The housing may include a first side surface, a second side surface adjacent to the first side surface, and a corner portion positioned between the first side surface and the second side surface. An upper stopper may be positioned at a corner portion of the housing. The upper stopper may overlap the cover member in a vertical direction. When the housing moves upward due to an external impact, the upper stopper may contact the cover member to limit the upward movement of the housing.

The driving magnet unit may be positioned to face the AF coil unit of the first mover. The driving magnet unit may move the AF coil unit through electromagnetic interaction with the AF coil unit. The driving magnet unit may include a magnet. The magnet may be fixed to the second driving part coupling part of the housing. As an example, as shown in FIG. 2 , the driving magnet unit may be provided with four independent magnets and disposed in the housing such that two neighboring magnets form an angle of 90° to each other. That is, the drive magnet unit is mounted on the four side surfaces of the housing at equal intervals to promote efficient use of the internal volume. In addition, the drive magnet unit may be attached to the housing by an adhesive, but is not limited thereto.

A stator may be located in the base. The stator may be positioned to face the lower side of the second mover. The stator may movably support the second mover. The stator can move the second mover. A through hole corresponding to the lens module 700 may be positioned at the center of the stator. In this embodiment, since the terminal unit 401 is formed on the stator and directly conducts to the outside, a separate FPCB may not be provided. Therefore, in the present embodiment, compared to a model in which the FPCB and the pattern coil are separately provided, a cost reduction effect can be expected according to the reduction in the number of parts, the number of processes, and process management points. In addition, since the overall height of the product is lowered, it can contribute to miniaturization.

The stator may include, for example, an OIS coil unit and a substrate. The stator may include an OIS coil unit disposed on a substrate. The stator may include a substrate positioned opposite to the lower side of the driving magnet unit and seated on the base. The stator may include a terminal portion 401 bent downward from the substrate and extended.

The OIS coil unit may face the driving magnet unit. The OIS coil unit may move the driving magnet unit through electromagnetic interaction. When power is applied to the OIS coil unit, the driving magnet unit and the housing to which the driving magnet unit is fixed may move integrally by interaction with the driving magnet unit. The OIS coil unit may be mounted on, electrically connected to, or integrally formed on the substrate. The OIS coil unit may be disposed, mounted, or formed on a substrate as an FP (Fine Pattern) coil, for example. The OIS coil unit, for example, may be formed to minimize interference with the OIS sensor located on the lower side. The OIS coil unit may be formed so as not to overlap with the OIS sensor in the vertical direction. The OIS sensor may be mounted below the stator so as not to overlap with the OIS coil unit in the vertical direction. The OIS coil unit may be disposed by changing the position of the driving magnet unit.

The substrate may be seated on the base. Meanwhile, the substrate may supply power to the OIS coil unit. Also, the substrate may supply power to the AF coil unit. As an example, the substrate may supply power to the AF coil unit through the lateral support member, the upper support member, the conducting member, and the lower support member. Alternatively, the substrate may supply power to the AF coil unit through the lateral support member and the upper support member.

The substrate may be supported from below so that the housing is moved in a horizontal direction or tilted. The substrate may be coupled through the housing and the lateral support member. An OIS sensor for detecting the position or movement of the housing may be located on the substrate. An OIS coil unit may be located on the upper surface of the substrate, and an OIS sensor may be located on the lower surface.

The substrate may include a through hole. The substrate may include a through hole through which light passing through the lens module 700 passes. The through hole may be formed in the center of the substrate. The through hole may be formed in a circular shape, but is not limited thereto.

The terminal unit 401 may be connected to an external power source, through which power may be supplied to the board. The terminal portion 401 may be formed to extend from the side of the substrate. The terminal unit 401 may be located on both sides of the board. The substrate and the terminal unit 401 may be integrally formed. The terminal portion 401 may be smaller than the width of the substrate. The terminal unit 401 may be accommodated in a terminal accommodating unit formed by recessing a portion of a side surface of the base inwardly. The terminal accommodating portion may have a width corresponding to that of the terminal portion 401 .

The base can support the second mover. A sensor base 300 may be positioned below the base. Meanwhile, any one of the sensor base 300 and the base may be omitted, and the sensor base 300 and the base may be integrally formed. The base may include a through hole formed at a position corresponding to the lens coupling part of the bobbin.

The base may include, for example, a foreign matter collecting unit for collecting foreign matter introduced into the cover member. The foreign matter collecting unit is located on the upper surface of the base and may collect foreign matter on the inner space formed by the cover member and the base, including an adhesive material.

The base may include a sensor unit receiving groove to which the OIS sensor is coupled. That is, the OIS sensor may be mounted in the sensor unit receiving groove. In this case, the OIS sensor may detect a horizontal movement or tilt of the housing by detecting a driving magnet coupled to the housing. As an example, two sensor unit accommodating grooves may be provided. An OIS sensor may be located in each of the two sensor unit accommodating grooves. In this case, the OIS sensor may be disposed to detect both movement of the housing in the x-axis and y-axis directions. That is, a virtual line connecting each of the two OIS sensors and an optical axis may be orthogonal.

The support member may connect any two or more of the first mover, the second mover, the stator, and the base. The support member may elastically connect any two or more of the first mover, the second mover, the stator, and the base to enable relative movement between the respective components. The support member may be provided with an elastic member. The support member may include, for example, an upper support member, a lower support member, a side support member, and a conducting member. However, the energizing member is provided for energizing the upper support member and the lower support member, and can be described separately from the upper support member, the lower support member, and the side support member.

The upper support member may include, for example, an outer portion, an inner portion, and a connection portion. The upper support member may include an outer portion coupled to the housing, an inner portion coupled to the bobbin, and a connecting portion elastically connecting the outer portion and the inner portion.

The upper support member may be connected to an upper portion of the first mover and an upper portion of the second mover. More specifically, the upper support member may be coupled to the upper part of the bobbin and the upper part of the housing. An inner portion of the upper support member may be coupled to an upper coupling portion of the bobbin, and an outer portion of the upper support member may be coupled to an upper coupling portion of the housing.

As an example, the upper support member may be separated into six upper conductive parts. At this time, two of the upper conducting parts of the six upper conducting parts may be used to apply power to the AF coil unit by being energized with the lower support member. Each of the two upper conductive parts may be electrically connected to each of the pair of lower support members through a conductive member. Meanwhile, the remaining four upper conductive parts among the six upper conductive parts may be energized with the AF sensor unit located on the bobbin. The remaining four upper conductive parts may be used to supply power to the AF sensor unit and transmit/receive information or signals between the control unit and the AF sensor unit. Also, as a modified example, two upper conductive parts among the six upper conductive parts may be directly connected to the AF coil unit, and the remaining four upper conductive parts may be connected to the AF sensor unit.

The lower support member may include, for example, a pair of lower support members. That is, the lower support member may include a first lower support member and a second lower support member. At this time, the lower support member may be described as including two lower conducting parts. Each of the first lower support member and the second lower support member may be connected to each of a pair of lead lines of the AF coil unit provided as a coil to supply power. Meanwhile, the pair of lower support members may be electrically connected to the OIS coil unit. Through this structure, the pair of lower support members may provide power supplied from the OIS coil unit to the AF coil unit.

The lower support member may include, for example, an outer portion, an inner portion, and a connection portion. The lower support member may include an outer portion coupled to the housing, an inner portion coupled to the bobbin, and a connecting portion elastically connecting the outer portion and the inner portion.

The lower support member may be connected to a lower portion of the first mover and a lower portion of the second mover. More specifically, the lower support member may be coupled to the lower part of the bobbin and the lower part of the housing. The lower coupling portion of the bobbin may be coupled to an inner portion of the lower support member, and the lower coupling portion of the housing may be coupled to an outer portion of the lower support member.

One side of the side support member may be coupled to the stator and/or the base and the other side may be coupled to the upper support member and/or the second mover. As an example, the side support member may have one side coupled to the stator and the other side coupled to the housing. In addition, in another embodiment, one side of the side support member may be coupled to the base and the other side may be coupled to the upper support member. In this way, the lateral support member elastically supports the second mover so that the second mover can move or tilt in a horizontal direction with respect to the base.

The side support member may include a plurality of wires. In addition, the side support member may include a plurality of leaf springs. Side support members, as an example, may be provided in the same number as the upper support member. That is, the lateral support members may be divided into 6 pieces and connected to each of the 6 upper support members which are separated into 6 pieces. In this case, the side support members may supply power supplied from the stator or the outside to each of the upper support members. As an example, the number of lateral support members may be determined in consideration of symmetry. As an example, eight lateral support members, two each at each corner of the housing, may be provided.

The side support member or the upper support member may include, for example, a shock absorber for shock absorption. The shock absorber may be provided on at least one of the lateral support member and the upper support member. The shock absorber may be a separate member such as a damper. In addition, the shock absorber may be realized by changing the shape of at least one part of the side support member and the upper support member.

The conducting member may electrically connect the upper support member and the lower support member. The conducting member may be provided separately from the lateral support member. Power supplied to the upper support member through the conducting member may be supplied to the lower support member, and power may be supplied to the AF coil unit through the lower support member. Meanwhile, as a modified example, when the upper support member is directly connected to the AF coil unit, the conducting member may be omitted.

The sensor unit may be used for at least one of auto focus feedback and hand shake correction feedback. The sensor unit may detect a position or movement of one or more of the first mover and the second mover.

The sensor unit may include an AF sensor unit and an OIS sensor as an example. The AF sensor unit may provide information for AF feedback by sensing a relative vertical flow of the bobbin with respect to the housing. The OIS sensor may sense horizontal motion or tilt of the second mover and provide information for OIS feedback.

The AF sensor unit may be located on the first mover. The AF sensor unit may be located on the bobbin. The AF sensor unit may be inserted into and fixed to a sensor guide groove formed on an outer circumferential surface of the bobbin. The AF sensor unit may include, for example, a first sensor, a flexible circuit board, and a terminal unit.

The first sensor may detect the movement or position of the bobbin. Alternatively, the first sensor may detect the position of the driving magnet part mounted on the housing. The first sensor may be a hall sensor as an example. In this case, the first sensor may detect a change in relative position between the bobbin and the housing by detecting magnetic force generated from the driving magnet unit.

A first sensor may be mounted on the flexible printed circuit board. The flexible printed circuit board, for example, may be provided in a strip shape. At least a portion of the flexible printed circuit board may be provided in a shape corresponding to the sensor guide groove recessed in the upper part of the bobbin and inserted into the sensor guide groove. The flexible printed circuit board may be an FPCB as an example. That is, the flexible printed circuit board is provided with flexibility and can be bent to correspond to the shape of the sensor guide groove. A terminal portion may be formed on the flexible printed circuit board.

The terminal unit may receive power and supply power to the first sensor through the flexible printed circuit board. Also, the terminal unit may receive a control command for the first sensor or transmit a sensed value from the first sensor. As an example, four terminal units are provided and may be electrically connected to the upper support member. In this case, two terminal units may be used to receive power from the upper support member, and the remaining two terminal units may be used to transmit/receive information or signals.

The OIS sensor may be located on the stator. The OIS sensor may be located on the upper or lower surface of the OIS coil unit. The OIS sensor, for example, may be disposed on a lower surface of the OIS coil unit and located in a sensor unit receiving groove formed in the base. The OIS sensor may include a hall sensor as an example. In this case, a relative motion of the second mover with respect to the stator may be sensed by sensing the magnetic field of the driving magnet unit. The Hall sensor may be mounted on a board through surface mounting technology (SMT). As an example, two or more OIS sensors are provided to detect both x-axis and y-axis movements of the second mover.

The AF coil, the OIS coil, and the driving magnet are components that perform electromagnetic interaction with each other, and one is referred to as a 'first driving unit', the other is referred to as a 'second driving unit', and the other is referred to as a 'third driving unit'. can be called Above, it has been described that the AF coil is located on the bobbin, the driving magnet unit is located on the housing, and the OIS coil is located on the substrate, but the AF coil, OIS coil, and driving magnet unit may be positioned interchangeably.

A substrate of the lens driving unit 400 may include a terminal unit 401 . The terminal portion 401 may include a body portion coupled to the OIS coil and a terminal portion 401 bent downward from the body portion and extending therefrom. At least a portion of the terminal unit 401 may be accommodated in the substrate accommodating unit 340 of the sensor base 300 .

The adhesive member 500 may be positioned between the lens driving unit 400 and the sensor base 300 . The adhesive member 500 may be positioned between the lower surface of the lens driving unit 400 and the upper surface of the sensor base 300 . The adhesive member 500 may be cured by ultraviolet rays. The adhesive member 500 may include UV epoxy cured by ultraviolet rays. The adhesive member 500 is a liquid adhesive and may be temporarily cured by ultraviolet rays and finally cured by heat.

The filter 600 may be accommodated in the filter accommodating part 330 . The filter 600 may be positioned above the image sensor 200 . The filter 600 may include a UV filter. The UV filter may block light in the infrared region from being incident on the image sensor 200 . An infrared filter may be positioned between the lens module 700 and the image sensor 200 . The infrared filter may be an infrared absorption filter that absorbs infrared rays. Alternatively, the infrared filter may be an infrared reflection filter that reflects infrared rays. The filter 600 may be formed of a film material or a glass material. The filter 600 may be formed by coating an infrared blocking coating material on a flat plate-shaped optical filter such as a cover glass for protecting an imaging surface or a cover glass.

The lens module 700 may include a lens and a lens barrel. The lens module 700 may include one or more lenses and a lens barrel accommodating the one or more lenses. However, one component of the lens module 700 is not limited to the lens barrel, and any holder structure capable of supporting one or more lenses is possible. The lens module 700 is coupled to the lens driving unit 400 and may move together with the lens driving unit 400 . The lens module 700 may be coupled to the inside of the lens driving unit 400 . The lens module 700 may be screwed to the lens driving unit 400 . The lens module 400 may be coupled to the lens driving unit 400 by an adhesive. Meanwhile, light passing through the lens module 400 may be irradiated onto the image sensor 200 .

The lens protection tape 810 may be covered on top of the lens module 700 to prevent damage to the lens module 700 . The lens protection tape 810 may be fixed to an upper surface of the lens driving unit 400 . The lens protection tape 810 may be removed during assembly.

The insulating tape 820 may be disposed to cover a lower surface of the circuit board 100 and a portion of a side surface of the lens driving unit 400 . The insulating tape 820 may be positioned outside the terminal portion 401 of the lens driving unit 400 exposed to the outside to prevent damage to the terminal portion 401 . The insulating tape 820 may be removed during assembly.

The connector 830 may be electrically connected to the circuit board 830 . The connector 830 may electrically connect the configuration of the optical device and the camera module. That is, the image obtained through the camera module may be transmitted to other components inside the optical device through the connector 830 .

Hereinafter, the manufacturing method and effect of the camera module according to this embodiment will be described.

Active Align (AA) may be applied to the camera module according to the present embodiment during the manufacturing process. In more detail, the camera module according to the present embodiment includes the lens driving unit 400 to which the lens module 700 is coupled for assembly, and the sensor base coupled to the circuit board 100 on which the image sensor 200 is mounted ( 300) is prepared. At this time, the adhesive member 500 is applied to the upper surface of the sensor base 300 to surround the outside of the filter accommodating part 330 as shown in FIG. 1 .

Thereafter, the lens driving unit 400 is seated on the upper surface of the sensor base 300 and the optical axis alignment of the lens module 700 and the image sensor 200 is aligned. When the optical axis alignment of the lens module 700 and the image sensor 200 is aligned, UV light is irradiated between the sensor base 300 and the lens driving unit 400 to temporarily cure the adhesive member 500 . At this time, when UV light is irradiated to the guide part 310 located in the first to fourth corner parts 305, 306, 307 and 308 of the sensor base 300, a larger amount of UV light is applied to the adhesive member 500. this can be investigated. Meanwhile, the assembly of the sensor base 300 and the lens driving unit 400 in a state in which they are temporarily bonded by the temporarily cured adhesive member 500 is moved to an oven (not shown). In the oven, the adhesive member 500 is fully cured by heat, thereby completing the bonding between the lens driving unit 400 and the sensor base 300 .

However, if the guide unit 310 is not formed, the distance between the sensor base 300 and the lens driving unit 400 is only 0.1 to 0.2 mm, and the light entering path is narrow, so that temporary curing cannot be fully performed. That is, light capable of curing to the inside of the liquid adhesive member 500 because UV rays are projected from the side but the adhesive member 500 is located between the lens driving unit 400 and the sensor base 300, which do not transmit light. this is lacking In this case, a phenomenon in which the lens driving unit 400 is displaced relative to the sensor base 300 may occur during movement. If the guide part 310 is not formed, there is a disadvantage in that the curing time is long in order to secure the welding stability.

In this embodiment, chamfer-shaped guide parts 310 are formed at the corners 305 , 306 , 307 , and 308 of the sensor base 300 to ensure a UV light transmission space. That is, by securing a space between the corner portions 305 , 306 , 307 , and 308 of the sensor base 300 and the corner portion of the lens driving unit 400 , the UV light injection space may be widened. In addition, since UV curing energy is secured, contact stability with respect to the position of the lens may be increased. In addition, productivity can be increased by reducing curing time.

On the other hand, in the present embodiment, even when an adhesive reinforcement operation is performed to more firmly bond the lens driving unit 400 and the sensor base 300, the guide unit 310 prevents the size of the camera module from increasing. can In more detail, since the guide part 310 serves as a space into which the adhesive applied for reinforcement work flows in, it is possible to prevent the adhesive from protruding to the outside of the sensor base 300 . Furthermore, when the inclination of the guide part 310 is close to 90°, the reinforcing adhesive that has moved along the guide part 310 flows down on the upper surface of the circuit board 100, so the adhesive strength is improved and dimensional stability can be secured. There is.

In the above, even though all the components constituting the embodiment of the present invention have been described as being combined or operated as one, the present invention is not necessarily limited to these embodiments. That is, within the scope of the object of the present invention, all of the components may be selectively combined with one or more to operate. In addition, terms such as "comprise", "comprise" or "having" described above mean that the corresponding component may be present unless otherwise stated, and thus exclude other components. It should be construed as being able to further include other components. All terms, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which the present invention belongs, unless defined otherwise. Commonly used terms, such as terms defined in a dictionary, should be interpreted as being consistent with the contextual meaning of the related art, and unless explicitly defined in the present invention, they are not interpreted in an ideal or excessively formal meaning.

The above description is merely an example of the technical idea of the present invention, and various modifications and variations can be made to those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be construed according to the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: circuit board 200: image sensor
300: sensor base 400: lens driving unit
500: adhesive member 600: filter
700: lens module

Claims (12)

circuit board;
an image sensor located on an upper surface of the circuit board;
a sensor base located on an upper surface of the circuit board and accommodating the image sensor therein; and
And a lens driving unit coupled to the upper side of the sensor base,
The sensor base includes a first outer surface, a second outer surface adjacent to the first outer surface, and a first corner portion positioned between the first outer surface and the second outer surface,
The sensor base includes a guide portion located in the first corner portion and formed by recessing a portion of an upper surface of the sensor base;
The guide portion includes a first chamfer portion having a first inclination degree and a second chamfer portion having a second inclination degree different from the first inclination degree,
The first chamfer portion and the second chamfer portion are continuously disposed from the inside to the outside of the camera module.
According to claim 1,
A length in the optical axis direction at the center of the first outer surface is longer than a length in the optical axis direction at the first corner portion side of the first outer surface.
According to claim 1,
The second gradient is greater than the first gradient,
The camera module of the second chamfer portion disposed outside the first chamfer portion.
According to claim 1,
A length of the first outer surface in the optical axis direction decreases from the center of the first outer surface toward the first corner portion.
According to claim 1,
The sensor base further includes a through hole penetrating the sensor base in an optical axis direction,
The through hole is disposed above the image sensor,
A first inner surface of the sensor base forming the through hole faces the first outer surface,
A length of the first outer surface in the optical axis direction at the center of the camera module is equal to or longer than the length of the first inner surface in the optical axis direction.
According to claim 1,
The sensor base includes a filter accommodating portion formed by recessing a portion of an upper surface of the sensor base downward,
An ultraviolet filter is accommodated in the filter accommodating part,
The UV filter is a camera module disposed above the image sensor.
According to claim 1,
Further comprising an adhesive member disposed between the lens driving unit and the upper surface of the sensor base,
The camera module wherein the adhesive member is cured by ultraviolet rays.
According to claim 1,
The sensor base includes a third outer surface adjacent to the second outer surface, a fourth outer surface adjacent to the first outer surface and the third outer surface, and the second outer surface and the third outer surface. A second corner portion disposed between, a third corner portion disposed between the third outer surface and the fourth outer surface, and a fourth corner portion disposed between the fourth outer surface and the first outer surface. Including more
The guide part is a camera module disposed at each of the first to fourth corner parts of the sensor base.
According to claim 1,
The lens driving unit,
A bobbin to which the lens module is coupled;
a housing disposed outside the bobbin;
a first elastic member coupled to the bobbin and the housing;
a first driving unit disposed on the bobbin; and
A camera module including a second driving unit disposed in the housing and facing the first driving unit.
main body;
a display unit disposed on the main body to display information;
An optical device comprising the camera module according to any one of claims 1 to 9 disposed on the main body and taking at least one of images and photos.

delete delete

Images