KR102489131B1 - Induction heating welding device - Google Patents

Abstract

The present invention relates to an induction heating bonding device. The induction heating bonding device of the present invention includes an induction heating unit including one or more induction coils for generating an induction electromotive force so that a target to be treated and a bonding member are bonded via a bonding material; and a power supply source connected to the induction coil to supply power. In the induction heating bonding device of the present invention, uniform heating is possible using a magnetic core surrounding an induction coil, thereby minimizing bonding defects. Another effect is that it is possible to bond different materials and non-magnetic materials by using pre-processing and bonding materials of the materials to be bonded.

Description

Induction heating welding device {INDUCTION HEATING WELDING DEVICE}

The present invention relates to an induction heating bonding device, and more specifically, to an induction heating bonding device for bonding objects to be treated using an induction heating method.

The induction range generates magnetic force by sending current through the coil inside the range, creating eddy currents at the bottom of the pot containing magnetic components, and the eddy current at the bottom of the pot generated by the magnetic field heats the pot, so it is used for induction ranges. The container used must be a container exclusively for induction stoves containing magnetic materials.

An induction stove that operates on this principle must use a container dedicated to the induction stove (hereinafter referred to as an induction container) so that the induction stove can produce the maximum amount of heat and can be used safely for a long period of time.

The induction vessel contains an electrical induction material, such as steel, iron, nickel, or various types of alloys. It is common to use an induction vessel by attaching a magnetic material to the bottom of a general vessel (generally, a portion in contact with the grill of the range) according to the operating principle of an induction range. When using an induction stove, the stove itself is not heated, but only the cooking utensils are heated, so it has advantages such as higher safety, excellent economic efficiency, and burn hazard prevention compared to heating equipment such as a gas stove using a conventional indirect heating method.

Conventional induction cookware has a problem in that when manufacturing an induction cookware, a cookware in which iron is sprayed on aluminum has poor heating efficiency and iron content is eliminated during washing of the cookware. In addition, the induction container can be manufactured using stainless steel and aluminum clad materials, and such an induction container can only be molded into a simple drawing product, and in terms of the function and design of the cookware product, only one part can be partially used. It has a disadvantage that it cannot be made thick and cannot be molded into complex shapes, so products cannot be diversified.

An object of the present invention is to solve the above problems of the prior art, to provide a high-frequency induction heating bonding device capable of bonding dissimilar metals while minimizing bonding defects through uniform heating.

The present invention for achieving the above technical problem relates to an induction heating bonding device. The induction heating bonding device of the present invention includes an induction heating unit including one or more induction coils for generating an induction electromotive force so that a target to be treated and a bonding member are bonded via a bonding material; and a power supply source connected to the induction coil to supply power.

In one embodiment, the induction coil generates an induced electromotive force in the bonding material.

In one embodiment, the induction coil is wound in a spiral or zigzag shape.

In one embodiment, the induction coil of the induction heating unit is formed by stacking.

In one embodiment, the induction coil includes one or more magnetic cores installed in a form surrounding a part of the induction coil.

In the induction heating bonding device of the present invention, uniform heating is possible using a magnetic core surrounding an induction coil, thereby minimizing bonding defects. Another effect is that it is possible to bond different materials and non-magnetic materials by using pre-processing and bonding materials of the materials to be bonded.

1 is a schematic diagram of a high-frequency induction heating bonding device according to the present invention.
2 is a cross-sectional view of an induction heating unit.
3 is an exploded perspective view of an induction heating unit.
4 is a diagram showing a winding form of an induction coil.
5 is a view showing an induction coil and a magnetic core.
6 is a cross-sectional view of an induction heating unit in which a magnetic core is installed.
7 is a diagram illustrating a variable winding interval of an induction coil.
8 is a diagram showing a laminated structure of induction coils.
9 and 10 are diagrams showing a configuration of an object to be treated and a bonded form of the object to be treated.
11 is a view showing the shape of a groove.
12 is a view showing external and internal coating of the object to be treated.
13 is a schematic diagram of an induction heating bonding system.
14 is a flow chart of an induction heating bonding method.
15 is a configuration diagram of an assembly unit.
16 is a configuration diagram of a joint.

In order to fully understand the present invention, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the examples described in detail below. This embodiment is provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes of elements in the drawings may be exaggerated to emphasize a clearer explanation. It should be noted that in each drawing, the same configuration may be indicated by the same reference numerals. Detailed descriptions of well-known functions and configurations that may unnecessarily obscure the subject matter of the present invention are omitted.

Hereinafter, a high-frequency induction heating bonding device and a bonding system and method using the same will be described with reference to the accompanying drawings.

1 is a schematic diagram of a high-frequency induction heating bonding device according to the present invention, and FIG. 2 is a cross-sectional view of an induction heating unit.

1 and 2, the induction heating bonding device 1 of the present invention includes an induction heating unit 20 and a power supply source 40.

The induction heating unit 20 is provided inside a case 26 in which one or more induction coils 22 are wound. The induction coil 22 is connected to the power supply source 40 through the impedance matching device 30 to receive power and generate an induced electromotive force.

The power supply source 40 supplies direct current or alternating current power to the induction coil 22 through the impedance matching device 30 . A plurality of induction coils 22 may be connected in series or parallel to one power supply source 40 . Alternatively, the plurality of induction coils 22 may be connected to a plurality of power supply sources 40, respectively.

The object to be processed 10 is an object to be heated and joined by the induction heating unit 20, and is composed of an object to be treated 12, a bonding material 16, and a bonding member 14.

The object to be processed 12 is an object to which the bonding member 14 is coupled, and refers to a container made of a material such as a stan, such as a pot or a frying pan. The bonding member 14 is coupled to a part of the target 12 to be processed. The bonding member 14 may be formed of, for example, a magnetic material. The bonding material 16 is a medium that is positioned between the target to be processed 12 and the bonding member 14 and is heated by the induction heating unit 20 to couple the target 12 and the bonding member 14 to be treated.

The subject to be processed 12, the bonding material 16, and the bonding member 14 are placed in this order, and the induction heating unit 20 is moved to completely contact or approach the bonding member 14, and the bonding material 16 is driven by an induction coil. ) so that the electric field is induced. The bonding material 16 is heated by the induced electric field to couple the target 12 and the bonding member 14 to each other. Here, only the bonding material 16 may be metal, or one of the bonding member 14 or the processing target 12 and the bonding material 16 may be metal, and the bonding member 14, the processing target 12, All of the bonding materials 16 may be metal. When the object to be processed 12 and the bonding member 14 are made of a metal material, an electric field may be induced and heated by the induction heating unit 20 in the same way as the bonding material 16 . At this time, the bonding material 16 is formed to be melted at a lower temperature than the processing target 12 and the bonding member 14 .

The induction coil 22 of the induction heating unit 20 is driven by receiving high-frequency power from the power supply source 40 and transmits induced electromotive force to the object to be processed 10 stacked on top of the induction heating unit 20. do. In particular, since an induced electromotive force is induced in the bonding material 16 of the object 10 to be processed, the bonding material 16 is heated. The object to be processed 12 and the bonding member 16 are coupled by the heated bonding material 16 . Therefore, the processing target 12 and the bonding member 14 are firmly coupled by the bonding material 14 and are not separated. In addition, since the induction heating bonding device 1 is configured using the coil of the induction heating unit 20, the configuration is not complicated, so maintenance is simple, and the bonding material 16 is directly heated, so that the process can be performed quickly.

Although not shown in the drawings, the high-frequency induction heating bonding device 1 may include a sensor unit, a controller, and a cooling water supply source.

The sensor unit is installed inside the induction heating unit 20 or close to the induction heating unit 20, and may be configured as a pressure sensor or a temperature sensor. The sensor unit may further include other types of sensors as needed. The sensor unit is connected to the controller and transmits the measured pressure or temperature information to the controller. The control unit is connected to the sensor unit and receives information measured through the sensor unit. The control unit controls the power supply source 40 when it reaches a certain pressure or a certain temperature according to the measured value, and controls power supply and current intensity control. In addition, the induction coil 22 may receive cooling water from a cooling water supply source. The cooling water supplied from the cooling water supply source is supplied into the induction coil 22 to prevent the induction coil 22 from overheating.

3 is an exploded perspective view of an induction heating unit according to the present invention, and FIG. 4 is a view showing a wound shape of an induction coil.

Referring to FIGS. 3 and 4 , the induction heating unit 20 includes an induction coil 22 , a case 26 , and a cover 28 .

The induction coil 22 may be wound in various shapes such as a circle, a pentagon, a triangle, a rectangle, a square, and a free curve, and accordingly, the shape of the case 26 may vary in accordance with the shape of the winding of the induction coil 22. can In addition, the induction coil 22 may be three-dimensionally wound according to the shape of the object to be processed 10 . The induction coil 22 is installed to be located inside the case 26. The cover 28 is made of a dielectric so as not to disturb the electric field 29 generated from the induction coil 22. The cover 28 is installed on top of the case 26 so that the induction coil 22 is embedded in the case 26. Therefore, the induction heating unit 20 prevents damage and contamination of the induction coil 22 because the induction coil 22 is installed inside the case 26 and is embedded by the cover 28.

5 is a view showing an induction coil and a magnetic core according to the present invention, and FIG. 6 is a cross-sectional view of an induction heating unit in which a magnetic core is installed.

Referring to FIGS. 5 and 6 , the induction heating bonding device 1 includes a magnetic core 24 installed in a form surrounding an induction coil 22 . The magnetic core 24 is formed in a horseshoe shape, and is installed so that the magnetic flux entrance is directed in the direction in which the object to be processed is placed. One or more magnetic cores 24 may be installed throughout or partially along the induction coil 22 . The induction coil 22 to which the magnetic core 24 is coupled is installed inside the case 26, and the cover 28 is installed on the top of the case 26 so that it can be embedded by the cover 28. The magnetic core 24 focuses the magnetic field 29 generated by the induction coil 22 toward the target object 10 . Therefore, since the magnetic field 29 is focused by the magnetic core 24 in the induction heating unit 20 including the magnetic core 24, the bonding efficiency of the object to be processed 10 is improved.

7 is a view showing variable winding intervals of induction coils according to the present invention.

Referring to FIG. 7 , the induction coil 22 can be adjusted by varying the interval between windings of the induction coil 22 . The winding interval of the induction coil 22 may be varied so that the magnetic field 29 is concentrated on a relatively insoluble portion of the object 10 to be processed by varying the winding interval. In another embodiment, the induction coil 22 may vary the winding interval for partial bonding of the object 10 to be processed. Therefore, the induction coil 22 can uniformly heat the object 10 as a whole by varying the winding interval. Alternatively, the induction coil 22 may partially heat the object to be treated 10 by varying the winding interval.

8 is a view showing a laminated structure of an induction coil according to the present invention.

Referring to FIG. 8 , the induction coil 22 may be stacked and installed in multiple layers. The multi-layered induction coil 22 may be one or more induction coils 22 . In addition, the multi-layered induction coil 22 may have a magnetic core 24 installed so that the multi-layered induction coil 22 is included. Therefore, the multi-layered induction coil 22 generates a stronger magnetic field 29 than the single-layered induction coil 22, so that the bonding efficiency of the object 10 can be increased.

9 and 10 are views showing the structure of the object to be processed and the bonded form of the object to be treated according to the present invention, and FIG. 11 is a diagram showing the shape of a groove.

Referring to FIGS. 9 to 11 , one or more grooves 18 may be formed on the surface of the object to be processed 12 or the bonding member 14 facing the bonding material 16 . In addition, the grooves 18 may be formed in a spiral, mesh, regular pattern or non-uniform pattern of grooves 18 or the like. And the groove 18 can be formed in various sizes. The bonding material 16 may be in the form of one plate, several pieces, or powder. The bonding material 16 is heated by the induction heating unit 20 and flows into one or more grooves 18 . Therefore, the bonding material 16 increases the bonding surface between the target to be processed 12 and the bonding member, so that solid bonding is possible. In addition, although not separately described in the drawings, grooves of various shapes may be formed in the bonding member 14 or the bonding material 16 as in the embodiment shown in FIG. 11 .

12 is a view showing external and internal coating of the object to be treated according to the present invention.

Referring to FIG. 12 , the object to be treated 10 may undergo post-processing such as internal and external coating 19 after bonding is completed. The inner coating 17 may be composed of a Teflon coating or the like. The outer coating 19 may be composed of a ceramic coating or the like. In another embodiment, the inner coating 17 and the outer coating 19 may be coated using a coating agent made of the same material. Meanwhile, the bottom surface of the outer coating 19 in contact with the heating means may not be coated.

13 is a schematic diagram of an induction heating bonding system according to the present invention, and FIG. 14 is a flow chart of an induction heating bonding method.

Referring to FIGS. 13 and 14 , the induction heating bonding system includes a supply unit 100 , an assembly unit 200 , a bonding unit 300 , a post-processing unit 400 , and a loading unit 700 .

The supply unit 100 includes a processing target storage unit 110 , a bonding material storage unit 120 and a bonding material storage unit 130 . The processing target storage unit 110 stores the processing target 12 . The bonding member storage unit 120 stores the bonding member 14 . The bonding material storage unit 130 stores bonding materials. The supply unit 100 includes a separate preheating means to preheat the target to be processed 12, the bonding member 14, and the bonding material 16 stored in each storage unit to maintain a constant temperature. In addition, the supply unit 100 supplies the processing target 12, the bonding member 14, and the bonding material 16 to the assembly unit 200 through a separate transfer means.

The assembly unit 200 receives the processing target 10 from the supply unit 100 and stacks the processing target 12, the bonding material 16, and the bonding member 14 in this order. The assembly unit 200 supplies the stacked objects 10 to the bonding unit 300 .

The junction part 300 joins the laminated and supplied objects 10 by induction heating. The bonded object to be processed 10 is transferred to the post-processing unit 400 or the loading unit 500.

The post-processing unit 400 includes a coating unit 410 and a cooling unit 420 . The coating unit 410 applies an external coating 19 and an internal coating 17 to the bonded object 10 to be treated. The cooling unit 420 cools the object to be treated 10 bonded at the bonding portion 300 or the object to be treated 10 coated at the coating unit 410 to lower the temperature.

The loading unit 500 loads and stores finished products that have been processed in the bonding unit 300 and the post-processing unit 400 .

In the induction heating bonding system, separate transfer means may be provided between each part.

15 is a configuration diagram of an assembly unit according to the present invention.

Referring to FIG. 15 , the assembly unit 200 includes an assembly unit body 210, a first transfer unit 220, a second transfer unit 230, and a susceptor 240.

The first transfer means 220 is coupled to the upper portion of the assembly body 210 . The first transfer unit 220 is connected to the second transfer unit 230 so that the susceptor 240 can move left and right. The second transfer unit 230 may be positioned between the first transfer unit 220 and the susceptor 240 to be transported vertically. In addition, the second transfer means includes an elastic member to absorb shock generated during the joining process.

16 is a configuration diagram of a joint according to the present invention.

Referring to FIG. 16 , the junction part 300 includes a junction body 310, a third transfer means 320, a fourth transfer means 330, and an induction heating unit 20.

The fourth transfer means 330 is connected to the third transfer means 320 and is installed to be transferred facing the susceptor 240 that extends from the assembly unit and is transferred. The third transfer means 320 is configured to enable left and right transfer. The fourth transfer means 330 is connected to the induction heating unit 20 and transferred vertically to approach the assembled object 10 . The induction heating unit 20 is driven by receiving power from the power supply source 40 in close proximity to or in close contact with the object to be processed 10 . The driven toxic heating unit 20 is raised by the fourth transfer means when the processing target 10 is completed bonding.

The embodiments of the present invention described above are merely exemplary, and those skilled in the art will appreciate that various modifications and equivalent other embodiments are possible therefrom. Therefore, it will be well understood that the present invention is not limited to the forms mentioned in the detailed description above. Therefore, the true technical protection scope of the present invention should be determined by the technical spirit of the appended claims. It is also to be understood that the present invention includes all modifications, equivalents and alternatives within the spirit and scope of the present invention as defined by the appended claims.

1: induction heating bonding device 10: object to be treated
12: target to be treated 14: joint member
16: bonding material 17: inner coating
18: groove 19: external coating
20: induction heating unit 22: induction coil
24: magnetic core 26: case
28: cover 29: magnetic field
30: impedance matching device 50: power supply unit
100: supply unit for processing objects 110: storage unit for processing targets
120: joint material storage unit 130: joint material storage unit
200: processing object assembly unit 210: assembly unit body
220: first transfer means 230: second transfer means
240: susceptor 300: processing target junction
400: post-processing unit 410: coating unit
420: cooling unit 500: object loading unit

Claims (6)

an induction heating unit including one or more induction coils for generating an induced electromotive force so that the object to be processed and the bonding member are bonded via the bonding material; and
A power supply source connected to the induction coil to supply power,
The induction coil,
Including one or more magnetic cores installed in a form surrounding a part of the induction coil,
The induction coil,
An induction heating bonding device, characterized in that the interval between the windings of the induction coil is adjusted by varying. According to claim 1,
The induction coil is an induction heating bonding device, characterized in that for generating an induction electromotive force in the bonding material. According to claim 1,
The induction heating bonding device, characterized in that the induction coil is wound and installed in a spiral or zigzag form. According to claim 1,
The induction heating bonding device, characterized in that the induction coil of the induction heating unit is formed by stacking. delete Preheating for preheating to maintain the subject to be treated, the joint member, and the joint material at a constant temperature. a supply unit provided with means;
an assembling unit stacking the processing target, the bonding material, and the bonding member supplied from the supply unit;
a bonding unit for bonding the processing target, the bonding material, and the bonding member by induction heating using an induction heating bonding device;
a post-processing unit formed with a coating unit for externally coating and internally coating an object to be processed to which the target object, the bonding material and the bonding member are bonded, and a cooling unit for lowering the temperature of the coated object; and
Loading unit for loading and storing the processed finished product;
and
The induction heating bonding device,
an induction heating unit including one or more induction coils for generating an induced electromotive force so that the object to be processed and the bonding member are bonded via the bonding material; and
a power supply source connected to the induction coil to supply power;
including,
The induction coil,
Including one or more magnetic cores installed in a form surrounding a part of the induction coil,
The induction coil,
An induction heating bonding system using an induction heating bonding device, characterized in that the gap between the windings of the induction coil is varied and adjusted.

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