KR102476070B1 - 방열 시트, 방열 시트의 제조 방법 및 적층체 - Google Patents
방열 시트, 방열 시트의 제조 방법 및 적층체 Download PDFInfo
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- KR102476070B1 KR102476070B1 KR1020197022230A KR20197022230A KR102476070B1 KR 102476070 B1 KR102476070 B1 KR 102476070B1 KR 1020197022230 A KR1020197022230 A KR 1020197022230A KR 20197022230 A KR20197022230 A KR 20197022230A KR 102476070 B1 KR102476070 B1 KR 102476070B1
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- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
- B32B15/09—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyesters
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- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
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- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
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- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
- H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
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- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C—CHEMISTRY; METALLURGY
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- C08K2003/385—Binary compounds of nitrogen with boron
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
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- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
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- Chemical & Material Sciences (AREA)
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- Microelectronics & Electronic Packaging (AREA)
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- Physics & Mathematics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Combustion & Propulsion (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-123510 | 2017-06-23 | ||
JP2017123510 | 2017-06-23 | ||
PCT/JP2018/023690 WO2018235919A1 (ja) | 2017-06-23 | 2018-06-21 | 放熱シート、放熱シートの製造方法及び積層体 |
Publications (2)
Publication Number | Publication Date |
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KR20200023264A KR20200023264A (ko) | 2020-03-04 |
KR102476070B1 true KR102476070B1 (ko) | 2022-12-12 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020197022230A KR102476070B1 (ko) | 2017-06-23 | 2018-06-21 | 방열 시트, 방열 시트의 제조 방법 및 적층체 |
Country Status (7)
Country | Link |
---|---|
US (1) | US11492528B2 (zh) |
EP (1) | EP3644353A4 (zh) |
JP (1) | JP7092676B2 (zh) |
KR (1) | KR102476070B1 (zh) |
CN (1) | CN110546758B (zh) |
TW (1) | TWI763868B (zh) |
WO (1) | WO2018235919A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102609888B1 (ko) * | 2018-01-04 | 2023-12-05 | 엘지이노텍 주식회사 | 방열 기판 |
WO2019168155A1 (ja) * | 2018-03-01 | 2019-09-06 | 積水化学工業株式会社 | 積層体 |
TWI801547B (zh) * | 2018-03-30 | 2023-05-11 | 日商三菱化學股份有限公司 | 散熱片、散熱構件及半導體元件 |
JP6963100B2 (ja) * | 2018-11-16 | 2021-11-05 | 富士高分子工業株式会社 | 熱伝導性シート及びその製造方法 |
EP4095897A4 (en) * | 2020-01-20 | 2024-02-28 | Sekisui Chemical Co Ltd | THERMALLY CONDUCTIVE SHEET, LAMINATE AND SEMICONDUCTOR DEVICE |
KR102426626B1 (ko) * | 2020-10-30 | 2022-07-29 | 마이크로컴퍼지트 주식회사 | 육방정 질화붕소 나노 입자 코팅 방열부재 및 이의 제조방법 |
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US20160340191A1 (en) | 2014-02-05 | 2016-11-24 | Mitsubishi Chemical Corporation | Agglomerated boron nitride particles, production method for agglomerated boron nitride particles, resin composition including agglomerated boron nitride particles, moulded body, and sheet |
JP2017094541A (ja) | 2015-11-19 | 2017-06-01 | 積水化学工業株式会社 | 熱硬化性シート、硬化物シート及び積層体 |
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US10351728B2 (en) * | 2013-06-14 | 2019-07-16 | Mitsubishi Electric Corporation | Thermosetting resin composition, method of producing thermal conductive sheet, and power module |
JP6364883B2 (ja) * | 2014-03-31 | 2018-08-01 | 三菱ケミカル株式会社 | 窒化ホウ素粒子および窒化ホウ素粒子の製造方法、該窒化ホウ素粒子を含む放熱シート用塗布液、該窒化ホウ素粒子を含む放熱シート、並びにパワーデバイス装置 |
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JP6135817B1 (ja) | 2016-03-09 | 2017-05-31 | 東洋インキScホールディングス株式会社 | 熱伝導性絶縁シート、およびその製造方法 |
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JP2013032496A (ja) | 2011-06-27 | 2013-02-14 | Nitto Shinko Kk | 熱硬化性樹脂組成物、熱伝導性シート、及び、半導体モジュール |
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JP2017094541A (ja) | 2015-11-19 | 2017-06-01 | 積水化学工業株式会社 | 熱硬化性シート、硬化物シート及び積層体 |
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JPWO2018235919A1 (ja) | 2020-05-21 |
US11492528B2 (en) | 2022-11-08 |
KR20200023264A (ko) | 2020-03-04 |
EP3644353A4 (en) | 2021-04-07 |
JP7092676B2 (ja) | 2022-06-28 |
CN110546758A (zh) | 2019-12-06 |
TW201904765A (zh) | 2019-02-01 |
EP3644353A1 (en) | 2020-04-29 |
US20210139761A1 (en) | 2021-05-13 |
CN110546758B (zh) | 2023-09-19 |
TWI763868B (zh) | 2022-05-11 |
WO2018235919A1 (ja) | 2018-12-27 |
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