KR102465688B1 - Aluminium alloy enhanced electrical conductivity, thermal conductivity and formability and manufacturing method for extrusion molding product thereof - Google Patents

Abstract

An embodiment of the present invention includes antimony (Sb), cerium (Ce), and lanthanum (La), the balance includes aluminum (Al) and unavoidable impurities, and the Sb, Ce, and La are dissolved in an Al matrix Electrical conductivity of Al-Sb, Al-Ce, or Al-La intermetallic compound, the Sb content is greater than 0 and less than 2% by weight, and the total content of Ce and La is greater than 0 and less than 3% by weight. , to provide an aluminum alloy with improved thermal conductivity and formability. According to an embodiment of the present invention, Al-Sb and Al-(Ce, La) intermetallic compounds included in the aluminum alloy suppress crystal grain growth, thereby improving high-temperature deformation characteristics, thereby providing aluminum with excellent electrical conductivity, thermal conductivity, and formability. alloys can be provided.

Description

Aluminum alloy enhanced electrical conductivity, thermal conductivity and formability and manufacturing method for extrusion molding product thereof

The present invention relates to an aluminum alloy with improved electrical conductivity, thermal conductivity and formability, and a method for manufacturing an extruded product of the aluminum alloy.

In general, heat dissipation parts are key components leading to high output, high performance, and high integration in the eco-friendly automobile, semiconductor, electric-electronic, LED lighting, and machinery industries. In the case of lightweight heat dissipation materials, it is a key material technology that improves the efficiency of parts and extends their service life by efficiently dissipating generated heat energy as well as light weight.

Among them, the motor housing serves to dissipate the heat generated from the inside to the outside, and accordingly, it has excellent thermal conductivity and at the same time has sufficient formability and strength. Due to the existence of pins, a frame manufacturing process technology having a complex shape is required.

The average lifespan of a motor is about 30 years when operated within the allowable temperature rise, but when operated at a temperature higher than this due to overload operation or the influence of the surrounding environment, the lifespan is halved every time it exceeds 10 degrees. In this way, since the heat dissipation of the heat generated from the motor of the motor is directly related to the life of the motor, various production technologies from heat dissipation design to materials are required.

In addition, if a lightweight material with high heat dissipation and excellent cooling effect such as thermal conductivity and heat dissipation is used, not only the weight of the motor but also the size can be reduced, making it possible to realize a smaller and lighter motor. and excellent moldability.

Aluminum can be considered as such a material, but pure aluminum has excellent thermal conductivity (234 W/m K), but has poor moldability during the housing manufacturing process, product deformation is easy, and processing is difficult. It is not used because it is not suitable as a material. Accordingly, cast iron (47W/mK) or ALDC12 alloy, which is an aluminum alloy for die casting with excellent castability, is used as a housing material for the motor in the prior art, but has a problem of having low heat dissipation characteristics (92W/mK). .

Accordingly, Korean Patent Nos. 10-1806714 and 10-1502340 and US Patent No. US 8936688 disclose aluminum alloys with improved thermal conductivity and workability, but aluminum alloys with new processes and compositions and their manufacturing methods need.

Republic of Korea Patent Registration No. 10-1806714 Republic of Korea Patent Registration No. 10-1502340 US registered patent US 8936688

The technical problem to be achieved by the present invention is to suppress grain growth of thermally stable Al-Sb, Al-Ce or Al-La intermetallic compounds during a high-temperature molding process, thereby improving formability by improving high-temperature deformation characteristics, electrical conductivity To provide an aluminum alloy with excellent thermal conductivity and formability and a method for manufacturing the aluminum alloy extruded product.

The technical problem to be achieved by the present invention is not limited to the above-mentioned technical problem, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

In order to achieve the above technical problem, one embodiment of the present invention provides an aluminum alloy with improved electrical conductivity, thermal conductivity and formability.

In an embodiment of the present invention, the aluminum alloy with improved electrical conductivity, thermal conductivity and formability includes antimony (Sb), cerium (Ce) and lanthanum (La), the balance being aluminum (Al) and unavoidable impurities Including, wherein the Sb, Ce and La are not dissolved in the Al matrix and are formed of Al-Sb, Al-Ce or Al-La intermetallic compounds, and the content of Sb is greater than 0 and less than 2% by weight And, the total content of Ce and La is characterized in that more than 0 and less than 3% by weight.

In an embodiment of the present invention, the average particle size of the Al-Sb, Al-Ce or Al-La intermetallic compound may be 0.1 μm to 10 μm.

In an embodiment of the present invention, as the contents of antimony (Sb), cerium (Ce), and lanthanum (La) increase, crystal grains may be refined.

In an embodiment of the present invention, 0.01 to 0.2% by weight of boron (B) may be further included.

In an embodiment of the present invention, the boron (B) is an element that inhibits electrical conductivity and thermal conductivity by forming a boride with an element that inhibits electrical conductivity and thermal conductivity contained in the aluminum alloy. It is possible to prevent being employed in the aluminum matrix.

In an embodiment of the present invention, 0.1 to 2% by weight of iron (Fe) may be further included.

In order to achieve the above technical problem, another embodiment of the present invention provides a method for manufacturing an aluminum alloy extruded product.

In an embodiment of the present invention, the method for manufacturing an aluminum alloy extruded article includes antimony (Sb), cerium (Ce), and lanthanum (La), the balance of which includes aluminum (Al) and unavoidable impurities. An aluminum alloy composition preparing; Preparing an aluminum alloy billet by dissolving the aluminum alloy composition at a casting temperature of 650 ° C to 800 ° C; Heat treatment for 2 to 12 hours in the range of 450 ℃ to 600 ℃ for homogenization of the aluminum alloy billet; Applying an extrusion process to the heat-treated aluminum alloy billet to prepare an extruded material in the range of 350 ℃ to 600 ℃; and manufacturing an extruded product using the extruded material, wherein the Sb content is greater than 0 and less than or equal to 2% by weight, and the total content of Ce and La may be greater than 0 and less than or equal to 3% by weight.

In an embodiment of the present invention, 0.01 to 0.2% by weight of boron (B) may be further included.

In an embodiment of the present invention, 0.1 to 2% by weight of iron (Fe) may be further included.

In an embodiment of the present invention, the Sb, Ce, and La may be formed as an Al-Sb, Al-Ce, or Al-La intermetallic compound without being dissolved in an Al matrix.

In an embodiment of the present invention, the average particle size of the Al-Sb, Al-Ce or Al-La intermetallic compound may be 0.1 μm to 10 μm.

According to an embodiment of the present invention, Al-Sb and Al-(Ce, La) intermetallic compounds included in the aluminum alloy suppress crystal grain growth, thereby improving high-temperature deformation characteristics, thereby providing aluminum with excellent electrical conductivity, thermal conductivity, and formability. alloys can be provided.

In addition, it is possible to provide an aluminum alloy having improved electrical conductivity, thermal conductivity and formability, characterized in that the electrical conductivity is 58.5% IACS and the thermal conductivity is 230 W/mk or more.

In addition, the extruded product manufactured by the aluminum alloy may have excellent light weight, thermal conductivity, and economy.

The effects of the present invention are not limited to the above effects, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a SEM image of an aluminum alloy according to an embodiment of the present invention.
Figure 2 is a flow chart of a method for manufacturing an aluminum alloy extruded product according to an embodiment of the present invention.
3 is an electrical conductivity and thermal conductivity measurement result of an aluminum alloy according to an embodiment of the present invention.
4 is an aluminum alloy in which Sb is (a) 0.5 wt%, (b) 0.75 wt%, (c) 1.0 wt%, (d) 2.0 wt%, and (e) 5.0 wt% according to an embodiment of the present invention. This is an image of the tissue distribution of
5 is an example of manufacturing an extrusion molded product according to an embodiment of the present invention.

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in many different forms and, therefore, is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is said to be "connected (connected, contacted, combined)" with another part, this is not only "directly connected", but also "indirectly connected" with another member in between. "Including cases where In addition, when a part "includes" a certain component, it means that it may further include other components without excluding other components unless otherwise stated.

Terms used in this specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this specification, terms such as "include" or "have" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

An aluminum alloy with improved electrical conductivity, thermal conductivity and formability according to an embodiment of the present invention will be described.

1 is a SEM image of an aluminum alloy according to an embodiment of the present invention.

Referring to FIG. 1, an aluminum alloy with improved electrical conductivity, thermal conductivity and formability according to an embodiment of the present invention includes antimony (Sb), cerium (Ce), and lanthanum (La), the remainder being aluminum (Al) and unavoidable impurities, and the Sb, Ce, and La are not dissolved in the Al matrix and are formed of Al-Sb, Al-Ce, or Al-La intermetallic compounds, and the content of Sb is It is more than 0 and 2% by weight or less, and the total content of Ce and La is characterized in that it includes more than 0 and 3% by weight or less.

An object of the present invention is to provide a new aluminum alloy material that satisfies electrical conductivity and thermal conductivity formability at the same time, which can replace cast iron material used as a motor frame material.

To this end, antimony (Sb), cerium (Ce), and lanthanum (La) were included, and the remainder included aluminum (Al) and unavoidable impurities.

The content of the Sb may be greater than 0 and less than or equal to 2% by weight.

When the Sb content exceeds 2% by weight, a coarse Al-Sb intermetallic compound may be formed, which may impair electrical conductivity, thermal conductivity, and formability.

When Sb is included in the aluminum alloy in an amount greater than 0 and 2% by weight, formability may be improved without reducing electrical conductivity and thermal conductivity. As Sb is added, it is possible to manufacture an alloy with excellent thermal conductivity and formability while reducing the amount of expensive Ce and La added.

In addition, the total content of the Ce and La (which may be a mix metal of Ce and La) may be greater than 0 and 3% by weight or less.

When the total content of Ce and La exceeds 3% by weight, the fraction of Al-Ce and Al-La increases, and during extrusion, there may be problems in reducing electrical conductivity and thermal conductivity while forming clusters of intermetallic compounds. .

The Sb, Ce and La are not dissolved in the Al matrix and are formed as an Al-Sb, Al-Ce or Al-La intermetallic compound.

The high-temperature deformation characteristics of the Al alloy of the present invention can be improved by suppressing grain growth by forming the Al-Sb, Al-Ce, or Al-La intermetallic compound.

An average particle size of the Al-Sb, Al-Ce or Al-La intermetallic compound may be 0.1 μm to 10 μm.

When the average particle size of the intermetallic compound is less than 0.1 μm, crystal grains are refined and growth is suppressed, so there is no effect of improving moldability during high temperature deformation, and when it exceeds 10 μm, there may be a problem of deteriorating formability. .

The average particle size of the crystal grains may decrease as the contents of antimony (Sb), cerium (Ce), and lanthanum (La) increase.

For example, the average particle size increases as the antimony (Sb) content increases from 0 to 2% by weight and the total content of cerium (Ce) and lanthanum (La) increases from 0 to 3% by weight. This can be refined.

Additionally, the aluminum alloy of the present invention may further include 0.01 to 0.2% by weight of boron (B).

For example, it includes antimony (Sb), cerium (Ce), lanthanum (La) and boron (B), the balance includes aluminum (Al) and unavoidable impurities, and the Sb, Ce, La and B are Characterized in that it is formed of Al-Sb, Al-Ce, Al-La or Al-B intermetallic without being dissolved in an Al base, the content of Sb is more than 0 and less than 2% by weight, and the Ce and La The total content is more than 0 and 3% by weight or less, and the content of B may include 0.01 to 0.2% by weight.

The boron may be added in the form of AlB (aluminum boron, Boral).

For example, it may be added in the form of Al-5B.

The boron (B) forms a boride with an element that inhibits electrical conductivity and thermal conductivity contained in the aluminum alloy, thereby preventing the element that inhibits electrical conductivity and thermal conductivity from being dissolved in the aluminum matrix. can do.

For example, the element that inhibits electrical conductivity and thermal conductivity may include Cr, Ti, V, Zr, and the like.

When the content of B is out of the range of 0.01 to 0.2% by weight, there may be a problem in that an element that inhibits electrical conductivity and thermal conductivity cannot be formed as a boride.

Additionally, 0.1 to 2% by weight of iron (Fe) may be further included in the aluminum alloy of the present invention.

For example, it includes antimony (Sb), cerium (Ce), lanthanum (La) and iron (Fe), the balance includes aluminum (Al) and unavoidable impurities, and the Sb, Ce, La and Fe are Characterized in that it is formed of an Al-Sb, Al-Ce, Al-La or Al-Fe intermetallic compound without being dissolved in an Al base, the content of Sb is greater than 0 and less than 2% by weight, and the Ce and La The total content is greater than 0 and less than or equal to 3% by weight, and the Fe content may include 0.1 to 2% by weight.

In addition, for example, antimony (Sb), cerium (Ce), lanthanum (La), boron (B) and iron (Fe) are included, and the balance includes aluminum (Al) and unavoidable impurities, and the Sb , Ce, La, B and Fe are not dissolved in the Al matrix and are characterized in that they are formed as Al-Sb, Al-Ce, Al-La, Al-B or Al-Fe intermetallic compounds, and the content of Sb is More than 0 and 2% by weight or less, the total content of Ce and La is more than 0 and 3% by weight or less, the content of B is 0.01 to 0.2% by weight, and the content of Fe is 0.1 to 2% by weight. can

If the Fe content is out of the range of 0.1 to 2% by weight, electrical conductivity and thermal conductivity may be reduced.

The Fe is formed as an Al-Fe intermetallic compound without being dissolved in an Al matrix like the Sb, Ce, and La.

The addition of Fe may have the advantage of improving the tensile strength of the aluminum alloy.

Figure 2 is a flow chart of a method for manufacturing an aluminum alloy extruded product according to an embodiment of the present invention.

Referring to FIG. 2, a method for manufacturing an aluminum alloy extruded product according to another embodiment of the present invention includes antimony (Sb), cerium (Ce) and lanthanum (La), the remainder being aluminum (Al) and unavoidable impurities Preparing an aluminum alloy composition comprising a (S10); Preparing an aluminum alloy billet by dissolving the aluminum alloy composition at a casting temperature of 650 ° C to 800 ° C (S20); Heat treatment for 2 to 12 hours in the range of 450 ℃ to 600 ℃ to homogenize the aluminum alloy billet (S30); Applying an extrusion process to the heat-treated aluminum alloy billet to prepare an extruded material in the range of 350 ℃ to 600 ℃ (S40); And manufacturing an extruded product using the extruded material (S50); It is characterized in that it comprises, characterized in that the content of the Sb is more than 0 and less than 2% by weight, and the total content of the Ce and La is greater than 0 and less than 3% by weight.

In the first step, antimony (Sb), cerium (Ce), and lanthanum (La) are included, the remainder including aluminum (Al) and unavoidable impurities, the content of Sb being greater than 0 and less than or equal to 2% by weight, the Prepare an aluminum alloy composition in which the total content of Ce and La is greater than 0 and less than 3% by weight (S10).

The content of the Sb may be greater than 0 and less than or equal to 2% by weight.

When the Sb content exceeds 2% by weight, a coarse Al-Sb intermetallic compound may be formed, which may impair electrical conductivity, thermal conductivity, and formability.

When Sb is included in the aluminum alloy in an amount greater than 0 and 2% by weight, formability may be improved without reducing electrical conductivity and thermal conductivity. As Sb is added, it is possible to manufacture an alloy with excellent thermal conductivity and formability while reducing the amount of expensive Ce and La added.

Additionally, 0.01 to 2% by weight of boron (B) may be further included.

The boron may be added in the form of AlB (aluminum boron, Boral).

For example, it may be added in the form of Al-5B.

When the content of B is out of the range of 0.01 to 0.2% by weight, there may be a problem in that an element that inhibits electrical conductivity and thermal conductivity cannot be formed as a boride.

In addition, 0.1 to 2% by weight of iron (Fe) may be further included.

If the Fe content is out of the range of 0.1 to 2% by weight, electrical conductivity and thermal conductivity may be reduced.

In the second step, an aluminum alloy billet is prepared by melting the aluminum alloy composition at a casting temperature of 650 ° C to 800 ° C (S20).

For example, an aluminum alloy billet may be prepared by melting at a melting temperature of 780° C. for 20 minutes.

Sb, Ce, and La included in the aluminum alloy billet may be formed as an Al-Sb, Al-Ce, or Al-La intermetallic compound without being dissolved in an Al matrix.

Since the Al-Sb, Al-Ce, or Al-La intermetallic compound inhibits grain growth, the Al alloy of the present invention may have improved high-temperature deformation characteristics.

An average particle size of the Al-Sb, Al-Ce or Al-La intermetallic compound may be 0.1 μm to 10 μm.

When the average particle size of the intermetallic compound is less than 0.1 μm, crystal grains are refined and growth is suppressed, so there is no effect of improving moldability during high temperature deformation, and when it exceeds 10 μm, there may be a problem of deteriorating formability. .

The average particle size of the crystal grains may decrease as the contents of antimony (Sb), cerium (Ce), and lanthanum (La) increase.

In addition, the boron (B) contained in the aluminum alloy billet forms a boride with an element that inhibits electrical conductivity and thermal conductivity contained in the aluminum alloy, thereby inhibiting the electrical conductivity and thermal conductivity. can be prevented from being employed in the aluminum matrix.

For example, the element that inhibits electrical conductivity and thermal conductivity may include Cr, Ti, V, Zr, and the like.

In addition, the Fe contained in the aluminum alloy billet may be formed as an Al-Fe intermetallic compound without being dissolved in an Al matrix like the Sb, Ce, and La.

The addition of Fe may have the advantage of improving the tensile strength of the aluminum alloy.

In the third step, heat treatment is performed in the range of 450 ° C to 600 ° C for 2 to 12 hours to homogenize the aluminum alloy billet (S30).

For example, it may be homogenized by heat treatment at a temperature of 550 ° C. for 4 hours.

In the fourth step, an extrusion process is applied to the heat-treated aluminum alloy billet to prepare an extruded material in the range of 350 ° C to 600 ° C (S40).

For example, an extruded material may be produced by extruding at a billet temperature of 550° C. at an extrusion rate of 17 m/min.

In the fifth step, an extruded product is manufactured using the extruded material (S50).

5 is an example of manufacturing an extrusion molded product according to an embodiment of the present invention.

Referring to FIG. 5, the extruded product may be a motor housing, etc., and the motor housing may have improved electrical conductivity, thermal conductivity and formability, as well as light weight characteristics, and is economical in terms of manufacturing cost.

Preparation Example 1

An aluminum alloy was prepared by dissolving an aluminum alloy composition containing 0.5 wt% Sb and the balance aluminum and unavoidable impurities at 780° C. for 20 minutes.

Preparation Example 2

An aluminum alloy was prepared by dissolving an aluminum alloy composition containing 0.75 wt% Sb and the balance aluminum and unavoidable impurities at 780° C. for 20 minutes.

Preparation Example 3

An aluminum alloy was prepared by dissolving an aluminum alloy composition containing 1.0 wt% Sb and the balance aluminum and unavoidable impurities at 780° C. for 20 minutes.

Production Example 4

An aluminum alloy was prepared by dissolving an aluminum alloy composition containing 2.0 wt% Sb and the balance aluminum and unavoidable impurities at 780° C. for 20 minutes.

Preparation Example 5

An aluminum alloy was prepared by dissolving an aluminum alloy composition containing 0.75 wt% Sb, 0.5 wt% La and Ce, 0.4 wt% Al-5B, and the balance aluminum and unavoidable impurities at 780° C. for 20 minutes.

Preparation Example 6

An aluminum alloy was prepared by dissolving an aluminum alloy composition containing 1.5 wt% Sb, 0.5 wt% La and Ce, 0.4 wt% Al-5B, and the balance aluminum and unavoidable impurities at 780° C. for 20 minutes.

Experimental example

1 is a SEM image of an aluminum alloy according to an embodiment of the present invention.

Referring to FIG. 1, an Al-Sb intermetallic compound and an Al-Ce-La intermetallic compound can be identified.

3 is an electrical conductivity and thermal conductivity measurement result of an aluminum alloy according to an embodiment of the present invention.

Al Sb MM
(La,Ce) Al-5B electrical conductivity
(%IACS) thermal conductivity
(W/mk) The tensile strength
(MPa) extrusion pressure
(Extrudability,
MPa) Preparation Example 1 Bal. 0.5 - - 61.00 239.16 71.7 199.4 Preparation Example 2 Bal. 0.75 - - 60.90 238.79 67.4 202.6 Preparation Example 3 Bal. 1.0 - - 60.15 236.04 67.8 202.6 Production Example 4 Bal. 2.0 - - 59.80 234.75 67.8 209.2 Preparation Example 5 Bal. 0.75 0.5 0.4 62.47 244.55 62.0 238.6 Preparation Example 6 Bal. 1.5 0.5 0.4 61.83 242.20 71.8 245.1

Table 1 is a table obtained from the electrical conductivity, thermal conductivity, tensile strength and extrusion pressure of Preparation Examples 1 to 6.

Referring to Figure 3 and Table 1, it can be seen that the electrical conductivity and thermal conductivity and moldability of Preparation Examples 1 to 6 are excellent. improvement can be seen.

Figure 4 is an aluminum alloy in which Sb is (a) 0.5wt%, (b) 0.75wt%, (c) 1.0wt%, (d) 2.0wt% and (e) 5.0wt% according to an embodiment of the present invention. This is an image of the tissue distribution of

Referring to FIG. 4 , it can be seen that as the content of Sb increases, grain growth is suppressed due to the formation of an Al-Sb intermetallic compound, and thus grains are refined.

5 is an example of manufacturing an extrusion molded product according to an embodiment of the present invention.

Referring to Figure 5, the motor housing was manufactured by extruding the aluminum alloy of the present invention.

According to an embodiment of the present invention, Al-Sb and Al-(Ce, La) intermetallic compounds included in the aluminum alloy suppress crystal grain growth, thereby improving high-temperature deformation characteristics, thereby providing aluminum with excellent electrical conductivity, thermal conductivity, and formability. alloys can be provided.

In addition, it is possible to provide an aluminum alloy having improved electrical conductivity, thermal conductivity and formability, characterized in that the electrical conductivity is 58.5% IACS and the thermal conductivity is 230 W/mk or more.

In addition, the extruded product manufactured by the aluminum alloy may have excellent light weight, thermal conductivity, and economic feasibility.

The above description of the present invention is for illustrative purposes, and those skilled in the art can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts thereof should be construed as being included in the scope of the present invention.

Claims (11)

Contains antimony (Sb), cerium (Ce), and lanthanum (La), the balance includes aluminum (Al) and unavoidable impurities, and the Sb, Ce, and La are not dissolved in the Al matrix, and Al-Sb, Al Characterized in that it is formed of -Ce or Al-La intermetallic compound,
The content of Sb is greater than 0 and less than or equal to 2% by weight, and the total content of Ce and La is greater than 0 and less than or equal to 3% by weight,
Characterized in that it further comprises 0.01 to 0.2% by weight of boron (B),
An aluminum alloy with improved electrical conductivity, thermal conductivity and formability, further comprising 0.1 to 2% by weight of iron (Fe). According to claim 1,
An aluminum alloy with improved electrical conductivity, thermal conductivity and formability, characterized in that the average particle size of the Al-Sb, Al-Ce or Al-La intermetallic compound is 0.1 μm to 10 μm. According to claim 1,
An aluminum alloy with improved electrical conductivity, thermal conductivity and formability, characterized in that crystal grains are refined as the content of antimony (Sb), cerium (Ce) and lanthanum (La) increases. delete According to claim 1,
The boron (B) forms a boride with an element that inhibits electrical conductivity and thermal conductivity contained in the aluminum alloy, thereby preventing the element that inhibits electrical conductivity and thermal conductivity from being dissolved in the aluminum matrix. An aluminum alloy with improved electrical conductivity, thermal conductivity and formability, characterized in that. delete preparing an aluminum alloy composition containing antimony (Sb), cerium (Ce) and lanthanum (La), the balance including aluminum (Al) and unavoidable impurities;
Preparing an aluminum alloy billet by dissolving the aluminum alloy composition at a casting temperature of 650 ° C to 800 ° C;
Heat treatment for 2 to 12 hours in the range of 450 ℃ to 600 ℃ for homogenization of the aluminum alloy billet;
Applying an extrusion process to the heat-treated aluminum alloy billet to prepare an extruded material in the range of 350 ℃ to 600 ℃; and
Characterized in that it comprises; manufacturing an extrusion molded product using the extruded material,
The content of Sb is greater than 0 and less than or equal to 2% by weight, and the total content of Ce and La is greater than 0 and less than or equal to 3% by weight,
In the step of preparing the aluminum alloy composition, characterized in that it further comprises 0.01 to 0.2% by weight of boron (B),
In the step of preparing the aluminum alloy composition, the aluminum alloy extruded product manufacturing method characterized in that it further comprises 0.1 to 2% by weight of iron (Fe). delete delete According to claim 7,
In the step of manufacturing the aluminum alloy billet,
The method of manufacturing an aluminum alloy extrusion molded product, characterized in that the Sb, Ce and La are formed as an Al-Sb, Al-Ce or Al-La intermetallic compound without being dissolved in an Al matrix. According to claim 10,
An aluminum alloy extruded product manufacturing method, characterized in that the average particle size of the Al-Sb, Al-Ce or Al-La intermetallic is 0.1 μm to 10 μm.

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