KR102461592B1 - Substrate procesing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus, comprising: a polishing part on which a polishing process is performed on a substrate; a pre-cleaning unit for pre-cleaning the substrate in the unloading area while the substrate is being unloaded into the It is possible to obtain advantageous effects of minimizing the adhesion of foreign substances to the substrate and increasing cleaning efficiency.

Description

Substrate processing apparatus {SUBSTRATE PROCESING APPARATUS}

The present invention relates to a substrate processing apparatus, and more particularly, to a substrate processing apparatus capable of increasing the processing efficiency of a substrate and simplifying a processing process.

Recently, as interest in information display is rising and the demand to use portable information media increases, it is used in a lightweight, thin flat panel display (FPD) that replaces the cathode ray tube (CRT), which is an existing display device. Research and commercialization are focused on.

In the field of flat panel displays, a liquid crystal display device (LCD), which is light and low in power consumption, has been the most attractive display device until now, but the liquid crystal display device is a light receiving device, not a light emitting device. ratio) and viewing angle, and the like, development of a new display device capable of overcoming these disadvantages is being actively developed. Among them, as one of the next-generation displays that have recently been spotlighted, there is an organic light emitting display (OLED).

In general, a glass substrate having excellent strength and transmittance is used in a display device. Recently, since the display device tends to be slim and high-pixel, a corresponding glass substrate should be prepared.

For example, as one of the OLED processes, in the Eximer Laser Annealing (ELA) process, in which amorphous silicon (a-Si) is crystallized into poly-Si by scanning a laser, protrusions may occur on the surface while polysilicon is crystallized. and, since these protrusions can cause mura-effects, the glass substrate must be able to be polished to remove the protrusions.

To this end, in recent years, various studies have been made to efficiently polish the surface of the substrate, but the development thereof is still insufficient.

An object of the present invention is to provide a substrate processing apparatus capable of improving substrate processing efficiency and simplifying a processing process.

In particular, it is an object of the present invention to effectively clean foreign substances remaining on a substrate within a short period of time before they are fixed.

In addition, an object of the present invention is to improve the cleaning efficiency of the substrate and to improve the yield.

In addition, an object of the present invention is to improve the degree of freedom in design and to contribute to the miniaturization of equipment.

Another object of the present invention is to shorten the time required for processing a substrate and improve productivity.

According to a preferred embodiment of the present invention for achieving the above-described objects of the present invention, the substrate processing process is simplified by allowing the substrate to be pre-cleaned during the unloading process in which the substrate subjected to the polishing process is unloaded. and the cleaning efficiency of the substrate can be increased.

As described above, according to the present invention, advantageous effects of increasing the processing efficiency of the substrate and simplifying the processing process can be obtained.

In particular, according to the present invention, it is possible to obtain an advantageous effect of effectively cleaning foreign substances remaining on the substrate in a short time before being fixed.

In addition, according to the present invention, it is possible to improve the cleaning efficiency of the substrate, and it is possible to obtain an advantageous effect of improving the yield.

In addition, according to the present invention, the degree of freedom in design can be improved, and it can contribute to the miniaturization of equipment.

In addition, according to the present invention, it is possible to obtain advantageous effects of reducing the time required for processing the substrate and improving process efficiency and yield.

1 is a plan view showing the configuration of a substrate processing apparatus according to the present invention;
2 is a perspective view for explaining a polishing part as a substrate processing apparatus according to the present invention;
3 is a side view for explaining a polishing part as a substrate processing apparatus according to the present invention;
4 to 6 are views for explaining a loading process of a substrate as a substrate processing apparatus according to the present invention;
7 is a view for explaining a retainer as a substrate processing apparatus according to the present invention;
8 is a plan view illustrating a polishing path of a polishing unit in a substrate processing apparatus according to the present invention;
9 is a view for explaining an unloading process of a substrate as a substrate processing apparatus according to the present invention;
10 to 12 are views for explaining a preliminary cleaning unit as a substrate processing apparatus according to the present invention;
13 is a view for explaining a cleaning part as a substrate processing apparatus according to the present invention;
14 to 16 are views for explaining another embodiment of a preliminary cleaning unit as a substrate processing apparatus according to the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings, but the present invention is not limited or limited by the embodiments. For reference, the same numbers in this description refer to substantially the same elements, and may be described by citing the contents described in other drawings under these rules, and the contents determined to be obvious to those skilled in the art or repeated may be omitted.

1 is a plan view showing the configuration of a substrate processing apparatus according to the present invention, FIG. 2 is a substrate processing apparatus according to the present invention, a perspective view for explaining a polishing part, and FIG. 3 is a substrate processing apparatus according to the present invention , a side view for explaining the abrasive part. 4 to 6 are views for explaining a loading process of a substrate as a substrate processing apparatus according to the present invention, and FIG. 7 is a diagram for explaining a retainer as a substrate processing apparatus according to the present invention. And, FIG. 8 is a plan view for explaining a polishing path of a polishing unit as a substrate processing apparatus according to the present invention, and FIG. 9 is a substrate processing apparatus according to the present invention, for explaining a substrate unloading process. 10 to 12 are views for explaining a preliminary cleaning unit as a substrate processing apparatus according to the present invention, FIG. 13 is a diagram for explaining a cleaning part as a substrate processing apparatus according to the present invention, and FIG. 14 to 16 are views for explaining another embodiment of a preliminary cleaning unit as a substrate processing apparatus according to the present invention.

1 to 16 , in the substrate processing apparatus 10 according to the present invention, a polishing part 200 on which a polishing process for a substrate W is performed, and a substrate on which polishing is completed in the polishing part 200 ( An unloading part 300 from which W) is unloaded, and a pre-cleaning unit ( 500 , and a cleaning part 400 that receives the substrate W that has been pre-cleaned in the unloading area and performs a subsequent cleaning process.

This is to simplify the processing process of the substrate W and to improve the cleaning efficiency of the substrate.

That is, in the process of transferring the substrate on which the polishing process has been performed to the cleaning part, if the abrasive particles deposited on the polishing surface of the substrate are dried and adhered to the polishing surface during the polishing process, it takes much longer to remove the particles adhering to the polishing surface. There is a problem in that a cleaning process of time is required and the cleaning effect is also lowered.

In order to solve this problem, conventionally, efforts have been made to start the cleaning process by quickly transferring the substrate on which the polishing process has been performed to the cleaning part as quickly as possible. However, during the transfer from the abrasive part to the cleaning part, or when it is necessary to wait until the cleaning process for the substrate transferred to the cleaning part is to be started, as the polishing surface of the substrate dries, foreign substances adhering to the substrate adhere to the surface of the substrate. It is impossible to avoid sticking, and there is a problem if there is a limit in solving the problem that the cleaning process takes a long time and the cleaning effect is low despite the above efforts. In particular, as the size of the substrate increases, the time it takes to polish and transport the substrate increases, so there is a problem in that there is a high possibility that foreign substances are adhered to the substrate.

However, in the present invention, after the polishing process of the substrate is performed in the polishing part, the pre-cleaning process for the substrate is performed immediately before the foreign substances attached to the substrate are fixed to the substrate surface during the unloading process in which the substrate is unloaded to the unloading part. By doing so without delay, it is possible to minimize adhering of abrasive particles to the polishing surface as the polishing surface of the substrate is dried, minimize the processing time required for the subsequent cleaning process, and obtain advantageous effects of increasing cleaning efficiency. have.

Furthermore, the present invention relates to the treatment of a substrate by allowing a pre-cleaning of the substrate to be performed during the process in which the substrate is unloaded, that is, by allowing the unloading of the substrate and the pre-cleaning of the substrate to be performed simultaneously. Time can be shortened, and advantageous effects of improving process efficiency and yield can be obtained.

For reference, the term 'pre-cleaning' as used herein refers to a cleaning process performed before foreign substances adhered to the substrate are adhered to the substrate surface at a position where the substrate after the polishing process is unloaded in the polishing part. And, the term "subsequent cleaning" described in this specification refers to the main cleaning process (cleaning performed in the conventional cleaning part) performed in the cleaning part by receiving the unloaded substrate to the unloading position.

The polishing part 200 is disposed between the loading part 100 and the unloading part 300 , and the substrate W supplied to the loading part 100 is polished in a loaded state in the loading part 100 . , is unloaded through the unloading part.

The loading part 100 is provided to load the substrate W to be polished onto the polishing part 200 .

The loading part 100 may be formed in various structures capable of loading the substrate W on the polishing part 200 , and the present invention is not limited or limited by the structure of the loading part 100 .

For example, the loading part 100 includes a plurality of loading transport rollers 110 that are provided to transport the substrate W at the same height as the transport belt 210 , are spaced apart from each other at a predetermined interval, and include a plurality of loading transport rollers 110 . The substrate W supplied to the upper portion of the loading transport roller 110 is cooperatively transported by the plurality of loading transport rollers 110 as the loading transport roller 110 rotates. In some cases, it is also possible for the loading part to be configured to include an endless belt circulated by the loading conveying roller.

Here, the loading part 100 transfers the substrate W at the same height as the transfer belt 210 means that the loading part 100 is disposed at a height that allows bending deformation of the substrate W and the substrate W ) is defined as transporting For example, in a state in which the substrate protrudes from the loading part (the substrate is transported so as to escape the loading transport roller disposed at the outermost surface), the loading part is slightly larger than the transport belt in consideration of the bending deformation caused by the weight of the protruding part of the substrate. It can be placed at a high height (eg, within 10 mm). However, if the bending deformation of the substrate can be suppressed, the height at which the substrate W is transferred in the loading part 100 and the height at which the substrate W is seated and transferred in the transfer belt 210 may be the same .

In addition, before being supplied to the loading part 100 , the substrate W supplied to the loading part 100 may be aligned with the attitude and position determined by the alignment unit (not shown).

For reference, as the substrate W used in the present invention, a rectangular substrate W having a side length greater than 1 m may be used. As an example, as the target substrate W on which the chemical mechanical polishing process is performed, a 6th generation glass substrate W having a size of 1500 mm * 1850 mm may be used. In some cases, it is also possible to use the 7th and 8th generation glass substrates as the target substrate (W). Alternatively, it is also possible to use a substrate (eg, a second-generation glass substrate) having a side length of less than 1 m.

The polishing part 200 may be formed in various structures capable of polishing the surface of the substrate W.

For example, the abrasive part 200 is provided movably along a predetermined path and includes a transfer belt 210 on which the substrate W is seated on the outer surface, and the transfer belt 210 disposed inside the substrate W. It includes a substrate support 220 for supporting the bottom surface, and a polishing unit 230 for polishing the upper surface of the substrate (W).

In this case, the transport belt 210 may be configured to move along a path determined in various ways according to required conditions and design specifications. As an example, the transport belt 210 may be configured to cyclically rotate along a predetermined path.

For reference, in the present invention, that the polishing part 200 polishes the substrate W means that the polishing part 200 is subjected to a mechanical polishing process or a chemical mechanical polishing (CMP) process for the substrate W. ) is defined as grinding For example, in the polishing part 200 , a slurry for chemical polishing is supplied while mechanical polishing of the substrate W is performed, and a chemical mechanical polishing (CMP) process is performed.

The conveying belt 210 is disposed adjacent to the loading part 100 and is configured to cyclically rotate in an endless loop manner along a predetermined path. The substrate W transferred from the loading part 100 to the transfer belt 210 is transferred as the transfer belt 210 circulates while being seated on the outer surface of the transfer belt 210 .

More specifically, the substrate W transferred from the loading part 100 to the transfer belt 210 is seated on the outer surface of the transfer belt 210 as the transfer belt 210 circulates in the polishing position PZ. ) (the upper position of the substrate support). In addition, the polished substrate W may be transferred from the polishing position PZ to the unloading part 300 side as the transfer belt 210 cyclically rotates.

Cyclic rotation of the conveying belt 210 may be performed in various ways depending on required conditions and design specifications. For example, the conveyance belt 210 circulates along a path determined by the roller unit 212 , and the substrate W seated on the conveyance belt 210 linearly moves by the circulation rotation of the conveyance belt 210 . transported along the path.

A movement path (eg, a circulation path) of the conveyance belt 210 may be variously changed according to required conditions and design specifications. For example, the roller unit 212 includes a first roller 212a and a second roller 212b that is horizontally spaced apart from the first roller 212a, and the conveying belt 210 includes a first roller ( 212a) and the second roller 212b cyclically rotates in an endless loop manner.

For reference, the outer surface of the transfer belt 210 means an outer surface exposed to the outside of the transfer belt 210 , and the substrate W is seated on the outer surface of the transfer belt 210 . And, the inner surface of the transfer belt 210 means the inner surface of the transfer belt 210 to which the first roller 212a and the second roller 212b are in contact.

In addition, any one or more of the first roller (212a) and the second roller (212b) may be configured to selectively move linearly in a direction approaching and spaced apart from each other. For example, the first roller 212a is fixed to the second roller 212b may be configured to move linearly in a direction approaching and spaced apart from the first roller 212a. As described above, by allowing the second roller 212b to approach and separate from the first roller 212a according to manufacturing tolerances and assembly tolerances, the tension of the conveying belt 210 can be adjusted.

Here, adjusting the tension of the transport belt 210 is defined as adjusting the tension by pulling or loosening the transport belt 210 . In some cases, it is also possible to adjust the tension of the conveying belt by providing a separate tension adjusting roller and moving the tension adjusting roller. However, it is preferable to move at least one of the first roller and the second roller to improve the structure and space utilization.

Preferably, the transfer belt 210 moves in a direction spaced apart from the bottom surface of the substrate W in a state in which the polished substrate W is transferred over a certain section.

More specifically, referring to FIG. 9 , the conveyance belt 210 rotates cyclically along a predetermined path and is configured to convey the substrate W, the substrate W is the conveyance belt 210 moves along the rotation path. At the position where the transfer belt starts to move (the position at which the transfer belt begins to move along a curved path along the outer surface of the second roller), the transfer belt 210 moves in a direction away from the bottom surface of the substrate W as the transfer belt separated from 210 .

In this way, in a state in which the transfer belt 210 for transferring the substrate W transfers the substrate W over a certain section, the transfer belt 210 is moved in a direction spaced apart from the bottom surface of the substrate W. Accordingly, it is possible to obtain an advantageous effect of naturally separating the substrate W from the transfer belt 210 without a separate pickup process (eg, a pickup process using a substrate adsorption device).

For reference, in the present invention, the transfer belt 120 has the meaning of a carrier for transferring the substrate (W). As such, the conveying belt has the meaning of a carrier, but hereinafter, it will be referred to as a conveying belt for convenience.

In some cases, the conveying belt is wound from one direction to another and it is also possible to convey the substrate. (not shown) Here, the conveying belt is usually wound from one direction to the other. It is defined as moving (winding) along the movement trajectory of an open loop in the reel-to-reel winding method of cassette tapes (a method that is wound on the first reel and then wound on the second reel in the opposite direction). do.

Even when the transport belt moves in a reel-to-reel take-up manner, the substrate remains at the position where the transport belt's travel path bends (eg, the position where the transport belt begins to move along a curved path along the outer surface of the roller). In the , the transfer belt is separated from the transfer belt as it moves in a direction away from the bottom surface of the substrate.

In addition, referring to FIG. 7 , a first surface layer 210b for suppressing slip by increasing a friction coefficient with respect to the substrate W is formed on the outer surface of the transfer belt 210 .

In this way, by forming the first surface layer 210b on the outer surface of the transfer belt 210, the substrate W is seated on the outer surface of the transfer belt 210, It is possible to restrict the movement of the substrate W (slip restraint), and an advantageous effect of stably maintaining the arrangement position of the substrate W can be obtained.

The first surface layer 210b may be formed of various materials having adhesion to the substrate W, and the present invention is not limited or limited by the material of the first surface layer 210b. For example, the first surface layer 210b is formed of an engineering plastic having excellent elasticity and adhesion (friction force). In some cases, it is also possible to form the first surface layer of another material having a non-slip function, for example, polyurethane having a non-slip function.

Furthermore, by forming the first surface layer 210b having elasticity on the outer surface of the transfer belt 210, even if a foreign material is introduced between the substrate W and the transfer belt 210, the foreign material is located as much as the thickness of the foreign material. Since the first surface layer 210b can be pressed in the portion, the height deviation of the substrate W caused by foreign substances (a specific portion of the substrate is locally protruded due to the foreign material) can be resolved, and a specific portion of the substrate W It is possible to obtain an advantageous effect of minimizing the deterioration of the polishing uniformity due to the local protrusion.

In this case, the first surface layer 210b is preferably formed entirely on the outer surface of the conveyance belt 210 .

In addition, a second surface layer 210c for suppressing slip by increasing a coefficient of friction with respect to the substrate support unit 220 may be formed on the inner surface of the transfer belt 210 .

In this way, by forming the second surface layer 210c on the inner surface of the transfer belt 210 , the inner surface of the transfer belt 210 is in contact with the substrate support unit 220 , and is applied to the substrate support unit 220 . It is possible to constrain the movement of the transfer belt 210 to (slip), and it is possible to obtain an advantageous effect of stably maintaining the arrangement position of the transfer belt 210 .

The second surface layer 210c may be formed of various materials having excellent frictional force with respect to the substrate support 220 , and the present invention is not limited or limited by the material of the second surface layer 210c. For example, the second surface layer 210c has excellent friction with respect to the substrate support 220 and is formed of engineering plastic that can be easily separated from the substrate support 220 . In some cases, it is also possible to form the second surface layer of another material having a non-slip function, for example, polyurethane having a non-slip function.

Preferably, the conveying belt 210 includes a reinforcing layer 210a disposed between the first surface layer 210b and the second surface layer 210c.

That is, it is also possible to configure the transport belt 210 only with the first surface layer 210b and the second surface layer 210c. However, if the conveying belt 210 is composed of only the first surface layer 210b and the second surface layer 210c, excessive sagging of the conveying belt 210 may occur during the polishing process, and thus the polishing uniformity is reduced. There is a problem of degradation. Accordingly, in the present invention, by forming a reinforcing layer 210a having high durability and strength between the first surface layer 210b and the second surface layer 210c, movement and deformation of the conveying belt 210 during the polishing process. It is possible to obtain the advantageous effect of minimizing

The reinforcing layer may be formed of various materials having high durability and strength. Preferably, the reinforcing layer is formed of an engineering plastic. At this time, the reinforcing layer should be cyclically rotated together with the conveying belt 210, so it should be able to be formed to a thickness that can ensure cyclic rotation. For example, the reinforcing layer made of an engineering plastic material may be formed to a thickness of 0.1 to 2 mm. In some cases, it is also possible to form the reinforcing layer of steel (SUS) or a non-woven material.

The substrate support unit 220 is disposed inside the transfer belt 210 and is provided to support the bottom surface of the substrate W with the transfer belt 210 interposed therebetween.

More specifically, the substrate support 220 is disposed inside the transfer belt 210 to face the bottom surface of the substrate W, and supports the inner surface of the transfer belt 210 .

The substrate support unit 220 may be configured to support the inner surface of the transfer belt 210 in various ways according to required conditions and design specifications. For example, a granite plate may be used as the substrate support unit 220 , and the substrate support unit 220 is disposed in close contact with the inner surface of the transfer belt 210 to support the inner surface of the transfer belt 210 .

In this way, by allowing the substrate support 220 to support the inner surface of the transfer belt 210 , the weight of the substrate W and the transfer belt 210 as the polishing unit 230 presses the substrate W can prevent sagging.

Hereinafter, an example in which the substrate support unit 220 is formed in a substantially rectangular plate shape will be described. In some cases, the substrate support part may be formed in other shapes and structures, and it is also possible to support the inner surface of the transport belt by two or more substrate support parts.

On the other hand, in the above and illustrated embodiments of the present invention, the substrate support portion is described as an example configured to support the inner surface of the transfer belt in a contact manner, but in some cases, the substrate support portion is the inner surface of the transfer belt in a non-contact manner. It is also possible to configure it to support. As an example, the substrate support unit may be configured to spray a fluid on the inner surface of the transfer belt and support the inner surface of the transfer belt by a jet force of the fluid. Alternatively, the substrate support may be configured to support the inner surface of the conveying belt in a non-contact manner using magnetic force (eg, repulsive force) or levitation force due to ultrasonic vibration.

The polishing unit 230 is provided to polish the surface of the substrate W while in contact with the surface of the substrate W.

For example, the polishing unit 230 is formed to have a size smaller than that of the substrate W, and includes a polishing pad 232 that rotates while in contact with the substrate W and moves.

More specifically, the polishing pad 232 is mounted on a polishing pad carrier (not shown) and linearly polishes (planarizes) the surface of the substrate W while rotating while in contact with the surface of the substrate W.

The polishing pad carrier may be formed in various structures capable of rotating the polishing pad 232 , and the present invention is not limited or limited by the structure of the polishing pad carrier. For example, the polishing pad carrier may be configured as a single body or a plurality of bodies coupled thereto, and is configured to rotate in connection with a drive shaft (not shown). In addition, the polishing pad carrier is provided with a pressing unit for pressing the polishing pad 232 to the surface of the substrate W (eg, a pneumatic pressing unit for pressing the polishing pad with pneumatic pressure).

The polishing pad 232 is formed of a material suitable for mechanical polishing of the substrate (W). For example, the polishing pad 232 may include polyurethane, polyurea, polyester, polyether, epoxy, polyamide, polycarbonate, polyethylene, polypropylene, fluoropolymer, vinyl polymer, acrylic and methacrylic polymer; It can be formed using silicone, latex, nitride rubber, isoprene rubber, butadiene rubber, and various copolymers of styrene, butadiene and acrylonitrile, and the material and properties of the polishing pad 232 depend on required conditions and design specifications. It can be variously changed according to.

Preferably, a circular polishing pad 232 having a size smaller than that of the substrate W is used as the polishing pad 232 . That is, it is possible to polish the substrate W using the polishing pad 232 having a size larger than that of the substrate W, but if the polishing pad 232 having a size larger than the substrate W is used, the polishing Since a very large rotating equipment and space are required to rotate the pad 232 , there is a problem in that space efficiency and design freedom are lowered and stability is lowered. More preferably, the polishing pad may be formed to have a diameter corresponding to the horizontal or vertical length of the substrate, or may be formed to have a diameter smaller than 1/2 of the horizontal or vertical length of the substrate.

Substantially, since the substrate W has a size greater than 1 m in length of at least one side, rotating a polishing pad having a size larger than that of the substrate W (eg, a polishing pad having a diameter greater than 1 m) It has its own very difficult problem. In addition, when a non-circular polishing pad (eg, a rectangular polishing pad) is used, the surface of the substrate W polished by the rotating polishing pad cannot be polished to a uniform thickness as a whole. However, in the present invention, by rotating the circular polishing pad 232 having a size smaller than that of the substrate W to polish the surface of the substrate W, the polishing pad ( It is possible to polish the substrate W by rotating the 232 , and it is possible to obtain an advantageous effect of maintaining a uniform polishing amount by the polishing pad 232 as a whole.

In this case, the polishing path of the polishing unit 230 may be variously changed according to required conditions and design specifications.

For example, referring to FIG. 8 , the polishing pad 232 includes a first oblique path L1 inclined with respect to one side of the substrate W, and a second oblique line inclined in the opposite direction of the first oblique path L1 . It is configured to polish the surface of the substrate W while repeatedly moving zigzag along the path L2.

Here, the first oblique path L1 means a path inclined at a predetermined angle θ with respect to the base of the substrate W, for example. In addition, the second oblique path L2 means a path inclined at a predetermined angle toward the opposite direction of the first oblique path L1 to intersect the first oblique path L1.

In addition, in the present invention, the polishing pad 232 repeatedly zigzag along the first diagonal path L1 and the second diagonal path L2 means that the polishing pad 232 is in contact with the surface of the substrate W. It is defined as that the movement path of the polishing pad 232 with respect to the substrate W is not interrupted and is switched to a different direction (switched from the first oblique path to the second oblique path) while moving in the current state. In other words, the polishing pad 232 continuously moves along the first oblique path L1 and the second oblique path L2 to form a continuously connected wave-shaped movement trajectory.

More specifically, the first oblique path L1 and the second oblique path L2 are line symmetric with respect to one side of the substrate W, and the polishing pad 232 includes the first oblique path L1 and the second oblique path. The surface of the substrate W is polished by repeatedly moving zigzag along (L2). At this time, when the first oblique path L1 and the second oblique path L2 are line symmetric with respect to one side of the substrate W, the first oblique path L1 with the one side 11 of the substrate W as the center. ) and the second oblique path L2, it means that the first oblique path L1 and the second oblique path L2 completely overlap, and one side of the substrate W and the first oblique path L1 ) and an angle formed by one side of the substrate W and the second oblique path L2 are defined to be the same.

Preferably, the polishing pad 232 has a length less than or equal to the diameter of the polishing pad 232 as a reciprocating movement pitch to the substrate W along the first oblique path L1 and the second oblique path L2. round-trip about Hereinafter, with respect to the substrate W along the first oblique path L1 and the second oblique path L2, the polishing pad 232 sets a length corresponding to the diameter of the polishing pad 232 as the reciprocating movement pitch P. An example of regular reciprocation will be described.

At this time, the polishing unit 230 may be configured to move linearly by a structure (not shown) such as a gantry, and the present invention is limited or limited by the type and structure of the structure for moving the polishing unit. not. For example, the gantry is disposed on both sides of the substrate with the substrate interposed therebetween and connects a first support shaft and a second support shaft provided to be linearly movable along the transport direction of the substrate, and a first support shaft and a second support shaft. It may include a connecting shaft, and the polishing unit may be mounted on the connecting shaft.

As described above, while the polishing pad 232 moves repeatedly along the first diagonal path L1 and the second diagonal path L2 with respect to the substrate W in a zigzag motion to polish the surface of the substrate W, the polishing pad ( By causing the polishing pad 232 to move forward with respect to the substrate W with a reciprocating movement pitch P having a length less than or equal to the diameter of the polishing pad 232, the polishing pad 232 in the entire surface area of the substrate W ), it is possible to obtain an advantageous effect of regularly and uniformly polishing the entire surface of the substrate W without a region in which polishing is omitted.

Here, the forward movement of the polishing pad 232 with respect to the substrate W means that the polishing pad 232 moves with respect to the substrate W along the first oblique path L1 and the second oblique path L2. It is defined as moving in a straight line toward the front of the substrate W (eg, from the bottom side to the top side of the substrate with reference to FIG. 8 ). In other words, for example, a right-angled triangle consisting of a base, a hypotenuse, and an opposite side, the base of the right-angled triangle is defined as the base of the substrate W, and the hypotenuse of the right triangle is the first oblique path L1 or the second oblique path ( L2), and the opposite side of the right triangle may be defined as the forward movement distance of the polishing pad 232 with respect to the substrate W.

In other words, the polishing pad 232 repeatedly moves in a zigzag with respect to the substrate W (moving along the first oblique path and the second oblique path) with a length smaller than or equal to the diameter of the polishing pad 232 as the reciprocating movement pitch. ) while polishing the substrate W, it is possible to prevent a region where polishing by the polishing pad 232 is omitted from the entire surface area of the substrate W, so that the thickness deviation of the substrate W is prevented. The advantageous effect of improving the polishing quality can be obtained by uniformly controlling the

As another example, the polishing pad may polish the surface of the substrate while repeatedly moving zigzag along a first straight path (not shown) along one side of the substrate and a second straight path opposite to the first straight path. do. Here, the first straight path means, for example, a path along a direction from one end of the base of the substrate to the other end. In addition, the second straight path means a path facing in a direction opposite to the first straight path.

In the above and illustrated embodiments of the present invention, the polishing part is described as an example of polishing the substrate by a polishing pad moving while rotating while in contact with the substrate, but in some cases, the polishing part is in an endless loop method. It is also possible to polish the substrate using a cyclically rotating abrasive belt.

For reference, although the above and illustrated embodiments of the present invention have been described as an example in which the abrasive part is composed of only one grinding unit, it is possible that the abrasive part includes two or more grinding units in some cases. In this case, the plurality of polishing units may each include a polishing pad, and may be configured to polish the surface of the substrate while moving in the same path or in opposite directions.

In addition, the substrate processing apparatus may include a conditioner (not shown) for modifying the outer surface (surface in contact with the substrate) of the polishing pad.

For example, the conditioner may be disposed on the outer region of the substrate, and the surface (bottom surface) of the polishing pad is pressed with a predetermined pressing force and finely cut so that micropores formed on the surface of the polishing pad appear on the surface. In other words, the conditioner finely cuts the outer surface of the abrasive pad so that the numerous micropores in the foam, which are responsible for storing the slurry mixed with abrasives and chemicals on the outer surface of the polishing pad, are not blocked. Ensure that the slurry is smoothly supplied to the substrate. Preferably, the conditioner is rotatably provided, and is in rotational contact with the outer surface (bottom surface) of the polishing pad.

In addition, the polishing part 200 includes a retainer 214 provided on the outer surface of the transfer belt 210 so as to surround the circumference of the substrate (W).

The retainer 214 is polished at the edge of the substrate W when the polishing pad 232 of the polishing unit 230 enters the inner region of the substrate W from the outer region of the substrate W during the polishing process. The pad 232 minimizes the rebound phenomenon (bouncing phenomenon), and the non-polishing area (dead zone) at the edge of the substrate W due to the rebound phenomenon of the polishing pad 232 (polishing by the polishing pad is performed). area) to be minimized.

More specifically, the retainer 214 has a substrate accommodating portion 214a corresponding to the shape of the substrate W is formed through, and the substrate W is formed inside the substrate accommodating portion 214a outside the transfer belt 210. is seated on the surface.

In a state in which the substrate W is accommodated in the substrate accommodating part 214a, the surface height of the retainer 214 has a height similar to the surface height of the edge of the substrate W. In this way, by making the edge portion of the substrate W and the outer region (retainer 214 region) of the substrate W adjacent to the edge portion of the substrate W have a similar height to each other, the polishing pad during the polishing process While the 232 moves from the outer region of the substrate W to the inner region of the substrate W, or moves from the inner region of the substrate W to the outer region of the substrate W, the inner region of the substrate W It is possible to minimize the rebound phenomenon of the polishing pad 232 caused by the height deviation between the outer region and the outer region, and it is possible to obtain an advantageous effect of minimizing the occurrence of the non-polishing region due to the rebound phenomenon.

Preferably, the retainer 214 is formed to have a thickness equal to or thinner than the substrate W (T1≧T2). As described above, by forming the retainer 214 to have a thickness T2 that is thinner than or equal to that of the substrate W, the polishing pad 232 moves from the outer region of the substrate W to the inner region of the substrate W. During the process, it is possible to obtain an advantageous effect of preventing the occurrence of a rebound phenomenon due to the collision between the polishing pad 232 and the retainer 214 .

In addition, a plurality of retainers 214 are provided on the outer surface of the transfer belt 210 along the circulation direction of the transfer belt 210 . As such, by forming the plurality of retainers 214 on the outer surface of the transfer belt 210 , there is an advantage in that different substrates W can be continuously processed in an inline manner.

Also, in the substrate processing apparatus 10 , during a loading transfer process of transferring the substrate W from the loading part 100 to the polishing part 200 , the loading transfer speed at which the loading part 100 transfers the substrate W And, the transfer belt 210 includes a loading control unit 120 for synchronizing the belt transfer speed for transferring the substrate (W).

More specifically, the loading control unit 120, when one end of the substrate (W) is disposed at a predefined seating start position SP on the transfer belt 210, synchronizes the loading transfer rate and the belt transfer rate.

Here, the pre-seating start position (SP) on the transfer belt 210 is defined as a position at which the substrate W can start to be transferred by the circular rotation of the transfer belt 210, and the seating start position (SP) In this case, adhesion between the transfer belt 210 and the substrate W is provided. As an example, the seating start position SP may be set at one side (or a position adjacent to one side of the substrate receiving unit) of the substrate receiving part 214a facing the front end of the substrate W transferred from the loading part 100 . .

For reference, when it is detected that one side of the substrate receiving part 214a is positioned at the seating start position SP by a conventional sensing means such as a sensor or a vision camera, one side of the substrate receiving part 214a is positioned at the seating start position ( The rotation of the conveying belt 210 is stopped so that the state positioned at the SP) is maintained.

After that, in a state in which the rotation of the transfer belt 210 is stopped, when it is detected that the tip of the substrate W is disposed at the seating start position SP by the sensing means, the loading control unit 120 controls the loading part 100 ) rotates (synchronized rotation) the transport belt 210 so that the loading transport speed at which the substrate W is transported and the belt transport speed at which the transport belt 210 transports the substrate W become the same speed as the substrate ( W) is transferred to the grinding position PZ.

The unloading part 300 is provided to unload the substrate W on which the polishing process is completed from the polishing part 200 .

That is, the substrate W separated from the transfer belt 120 is unloaded to the unloading part 300 .

The unloading part 300 may be formed in various structures capable of unloading the substrate W from the polishing part 200 , and the present invention is not limited or limited by the structure of the unloading part 300 .

For example, the unloading part 300 includes a plurality of unloading transport rollers 310 that transport the substrate W at the same height as the transport belt 210 and are spaced apart from each other at a predetermined interval, and include a plurality of The substrate W supplied to the upper portion of the unloading transfer roller 310 is cooperatively transferred by the plurality of unloading transfer rollers 310 as the unloading transfer roller 310 rotates. In some cases, it is also possible that the unloading part comprises a circular belt circulated by the unloading conveying roller.

Here, that the unloading part 300 transfers the substrate W at the same height as the transfer belt 210 means that the unloading part 300 is disposed at a height allowing bending deformation of the substrate W (W) is defined as transporting. For example, in a state in which the substrate protrudes from the transfer belt (a state in which a part of the substrate is transferred to the outside of the transfer belt), in consideration of the bending deformation due to the weight of the protruding part of the substrate, the loading part has a slightly lower height than the transfer belt (for example, , within 10 mm). However, if the bending deformation of the substrate can be suppressed, the height at which the substrate W is transferred in the unloading part 300 and the height at which the substrate W is seated and transferred in the transfer belt 210 may be the same. have.

In addition, in the substrate processing apparatus 10 , the transfer belt 210 transfers the substrate W during an unloading transfer process of transferring the substrate W from the polishing part 200 to the unloading part 300 . An unloading control unit 320 for synchronizing the transport speed and the unloading transport speed at which the unloading part 300 transports the substrate W is included.

For example, when one end of the substrate W is sensed, the unloading control unit 320 synchronizes the unloading transport speed at the same speed as the belt transport speed at which the transport belt 210 transports the substrate W. In some cases, regardless of whether one end of the substrate is detected or not, the conveyor belt is rotated while the unloading transport roller is rotating so that the belt transport speed and the unloading transport speed are the same to unload the substrate as an unloading part. It is also possible

The preliminary cleaning unit 500 may be configured to perform preliminary cleaning of the substrate W in various ways according to required conditions and design specifications.

For example, referring to FIG. 11 , the preliminary cleaning unit 500 includes a non-contact cleaning unit 510 that does not physically contact the surface of the substrate W and performs preliminary cleaning.

The non-contact cleaning unit 510 is physically non-contact with the surface of the substrate W and may be provided in various structures capable of performing cleaning. For example, the non-contact cleaning unit 510 includes a fluid injection unit 512 that sprays at least one type of cleaning fluid onto the surface of the substrate W.

The type and characteristics of the cleaning fluid that can be injected by the fluid ejection unit 512 may be variously changed according to required conditions and design specifications. For example, the cleaning fluid may be any one of a gaseous fluid (eg, nitrogen) and a liquid fluid (eg, pure water). Preferably, the fluid injection unit 512 is injected at a high pressure so as to hit the foreign material present on the surface of the substrate W with sufficient striking force.

In some cases, the fluid spraying unit may be configured to spray steam or a gaseous fluid (or liquid fluid) together with dry ice particles. Alternatively, it is also possible to supply vibration energy (eg, high-frequency vibration energy or low-frequency vibration energy) for effectively separating foreign substances from the surface of the substrate while the fluid ejection unit injects the fluid to the surface of the substrate.

As another embodiment of the pre-cleaning unit, referring to FIG. 14 , the fluid ejection unit 512 ′ is inclined at a predetermined angle θ with respect to the substrate W, and faces the direction in which the substrate W is transported. A linear fluid curtain is formed that is obliquely in contact with the surface over the entire width of the substrate (W).

Here, the linear fluid curtain means a curtain in the form of a film formed by a fluid that is linearly formed. Preferably, the linear fluid curtain contacts the substrate W continuously along the width direction of the substrate W (direction orthogonal to the transport direction of the substrate).

This is to increase the cleaning efficiency of the substrate W and to minimize the re-attachment of foreign substances separated from the substrate to the substrate W.

That is, in a large-area rectangular substrate W having a side length greater than 1 m, it takes a lot of time to clean the entire area of the substrate W due to the large size of the substrate W, so the surface of the substrate W There is a risk that foreign substances separated by the injected fluid may be re-adhered (adhered) to the surface of the substrate W again.

Accordingly, the present invention separates foreign substances from the surface of the substrate by cleaning the substrate W by a linear fluid curtain that is in inclined contact with the substrate W, and at the same time separates the separated foreign substances from one end of the substrate in the direction of the other end. Since it can be quickly discharged to the outside of the substrate by sweeping it to the outside, it is possible to obtain an advantageous effect of minimizing the re-adhesion of foreign substances separated from the substrate to the substrate. Moreover, cleaning efficiency of the substrate can be improved by cleaning the substrate by the inclined linear fluid curtain, and advantageous effects of reducing the amount of fluid used can be obtained.

In addition, referring to FIG. 15 , the preliminary cleaning unit is disposed at the rear of the linear fluid curtain sprayed from the fluid ejection unit 512 ′ based on the transfer direction of the substrate W, and the substrate W from the fluid ejection unit It may include a fluid suction unit 530 for sucking the fluid injected to the surface of the.

The fluid suction part 530 may be formed in various structures capable of sucking a fluid (fluid containing a foreign substance) located on the surface of the substrate W, and the fluid suction part 530 depends on the suction method and the suction structure. The present invention is not limited or limited by the

For example, the fluid suction unit 530 may include a suction member (not shown) disposed close to the upper surface of the substrate, and the suction member has a suction slot (not shown) for sucking the fluid along the width direction of the substrate. It can be formed continuously.

In this way, by allowing the fluid injected from the fluid ejection unit 512 ′ to the surface of the substrate W to be directly sucked by the fluid suction unit 530 , foreign substances separated from the substrate W are more quickly removed from the substrate. It can be removed from the substrate (W), it is possible to obtain an advantageous effect of effectively preventing the foreign substances separated from the substrate (W) from being re-attached to the substrate (W).

Also, referring to FIG. 16 , the preliminary cleaning unit is disposed in front of the contact position CS where the fluid sprayed from the fluid ejection unit 512 ′ contacts the substrate W along the transport direction of the substrate W. and may include a blocking member 540 to block the fluid scattering from the surface of the substrate (W).

In this way, the blocking member 540 is disposed in front of the contact position CS where the fluid is in contact with the substrate W, and the fluid that bounces back from the surface of the substrate W is blocked by the blocking member 540 . By doing so, it is possible to obtain an advantageous effect of minimizing re-attachment of foreign substances separated from the substrate W to the region of the substrate W that has passed through the contact position CS.

Meanwhile, referring to FIG. 12 , the preliminary cleaning unit 500 includes a contact cleaning unit 520 that physically contacts the surface of the substrate W and performs preliminary cleaning.

The contact cleaning unit 520 is in physical contact with the surface of the substrate W and may be provided in various structures capable of performing cleaning. For example, the contact cleaning unit 520 includes a cleaning brush 522 that rotates and contacts the surface of the substrate W.

As the cleaning brush 522, a brush made of a common material (eg, polyvinyl alcohol of a porous material) capable of frictionally contacting the surface of the substrate W may be used. In addition, it is possible to form a plurality of cleaning protrusions on the surface of the cleaning brush 522 to improve the contact characteristics of the brush. Of course, in some cases, it is also possible to use a brush without cleaning projections.

In addition, while cleaning by the cleaning brush 522 is performed, in order to increase the cleaning effect due to frictional contact between the cleaning brush 522 and the substrate W, the cleaning brush 522 and the substrate W are in contact with each other. It is also possible to supply a chemical or cleaning solution.

As described above, after the polishing process of the substrate W is performed in the polishing part 200 , a preliminary cleaning process for the substrate W is immediately performed during the unloading process in which the substrate W is unloaded to the unloading part 300 . By doing this without delay, it is possible to minimize adhering of abrasive particles to the polishing surface while the polishing surface of the substrate W is dried, minimize the process time required for a subsequent cleaning process, and increase cleaning efficiency. effect can be obtained.

Furthermore, by causing the substrate to be pre-cleaned during the process in which the substrate W is unloaded, that is, by allowing the unloading process of the substrate and the pre-cleaning process to be performed at the same time, the processing of the substrate Time can be shortened, and advantageous effects of improving process efficiency and yield can be obtained.

Preferably, the substrate processing apparatus includes a blocking unit 501 that is provided in the unloading area of the unloading part 300 and blocks a space in which the preliminary cleaning process is performed from other spaces.

Here, the space in which the preliminary cleaning process is performed may be understood as a space in which the preliminary cleaning is performed, and this space is provided in an independently closed chamber structure by the blocking unit 501 .

The blocking unit 501 may be provided in various structures capable of providing an independent closed space blocked from the outside. For example, the blocking unit 501 is provided to surround a portion of the space of the unloading area and includes a casing 502 that provides an independent preliminary cleaning treatment space, and an opening/closing member ( 504) may be included.

The casing 502 may be provided in the form of a substantially rectangular box having an entrance 502a formed on the side thereof, and the opening and closing member 504 is vertically directed by a conventional driving unit (eg, a combination of a motor and a power transmission member). It may be configured to open and close the entrance 502a of the casing 502 while moving along the straight line.

In this way, the blocking unit 501 formed in the unloading area where the preliminary cleaning process is performed forms an independent chamber that blocks the space where the preliminary cleaning process is performed from other spaces, so that the preliminary cleaning process is not performed in the chamber. By blocking the outflow of the cleaning liquid and foreign substances to the outside of the chamber during the cleaning process, an advantageous effect of minimizing the inflow of foreign substances generated in the preliminary cleaning process into the adjacent abrasive part 200 or the cleaning part 400 is obtained. can

More preferably, the substrate processing apparatus includes an exhaust unit 600 communicating with the internal space of the blocking unit 501 and sucking in and exhausting foreign substances in the internal space of the blocking unit 501 .

For example, the exhaust unit 600 is connected to the upper surface or the side surface of the blocking unit 501, and includes an exhaust pipe (not shown) to which vacuum pressure is applied.

In this way, by connecting the exhaust unit 600 to the blocking unit 501 and allowing foreign substances (eg, particles) suspended in the internal space of the blocking unit 501 to be exhausted through the exhaust unit 600 , , it is possible to obtain advantageous effects of minimizing the inflow of foreign substances generated during preliminary cleaning into the cleaning part 400, and minimizing cleaning errors and deterioration in cleaning effect due to foreign substances.

1 and 13 , the cleaning part 400 is provided to subsequently clean the substrate W pre-cleaned by the preliminary cleaning unit 500 again.

Here, the subsequent cleaning of the substrate W is a process for cleaning foreign substances remaining on the surface of the substrate W (especially, the polished surface of the substrate and the non-polished surface of the substrate can also be cleaned) after the preliminary cleaning is completed. Defined.

The cleaning part 400 may be provided in a structure capable of performing several stages of cleaning and drying processes, and the present invention is not limited or limited by the structure and layout of the cleaning station constituting the cleaning part 400 .

Preferably, the cleaning part 400 is in physical contact with the surface of the substrate W to perform cleaning to effectively perform cleaning to remove organic matter and other foreign substances remaining on the surface of the substrate W. It may be configured to include a contact cleaning unit 410 and a non-contact cleaning unit 420 that is physically non-contact with the surface of the substrate W and performs cleaning. In some cases, it is also possible that the cleaning part is configured to include only one of a contact cleaning unit and a non-contact cleaning unit.

For example, the contact cleaning unit 410 includes a cleaning brush 422 that rotates and contacts the surface of the substrate W.

In addition, the non-contact cleaning unit 420 may include heterogeneous fluid ejection units 422 and 424 that eject different heterogeneity fluids to the surface of the substrate W. In addition, the heterogeneous fluid ejection units 422 and 424 may be provided in various structures capable of ejecting the heterogeneous fluid. For example, the heterogeneous fluid ejection units 422 and 424 include a first fluid ejection nozzle 422 for ejecting a first fluid (liquid fluid or gaseous fluid), and a second fluid (liquid fluid or gaseous fluid) different from the first fluid. It may include a second fluid jet nozzle 424 for jetting, and the first fluid and the second fluid may be jetted to the surface of the substrate W in a mixed or separated state.

As described above, although described with reference to preferred embodiments of the present invention, those skilled in the art can variously modify and modify the present invention within the scope without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be changed.

10: substrate processing apparatus 100: loading part
110: loading transport roller 120: loading control unit
200: abrasive part 210: conveying belt
212: roller unit 212a: first roller
212b: second roller 214: retainer
214a: substrate receiving unit 220: substrate supporting unit
230: polishing unit 232: polishing pad
300: unloading part 310: unloading transfer roller
320: unloading control unit 400: cleaning part
500: preliminary cleaning unit 501: blocking unit
510: non-contact cleaning unit 512: fluid injection unit
520: contact cleaning unit 522: cleaning brush
600: exhaust

Claims (21)

An apparatus for processing a square-shaped substrate used in a display device, comprising:
a polishing part on which a polishing process is performed on the substrate;
a cleaning part to which a subsequent cleaning process is performed by receiving the substrate that has been pre-cleaned in an unloading area;
a blocking unit provided in a path in which the substrate on which the polishing has been completed in the polishing part moves in one direction to the cleaning part to block a space in which a preliminary cleaning process is performed from other spaces;
A fluid injection unit installed inside the blocking unit to face a direction in which the substrate is transported and to spray a fluid to form a linear fluid curtain that is in contact with the surface of the substrate in an inclined manner with respect to the entire width of the substrate. Wow;
a fluid suction unit disposed at the rear of the linear fluid curtain based on the transfer direction of the substrate and sucking the fluid injected from the fluid injection unit to the surface of the substrate;
The substrate processing apparatus of claim 1 , wherein the substrate is pre-cleaned while the substrate is being transferred between the polishing part and the cleaning part.
delete delete delete delete The method of claim 1,
and a blocking member disposed in front of a contact position where the fluid sprayed from the fluid spraying unit contacts the substrate along the transfer direction of the substrate and blocking the fluid scattering from the surface of the substrate. substrate processing equipment.
delete delete delete The method of claim 1,
The blocking unit is
a casing having an entrance through which the substrate enters and exits and is provided to surround a space in which the preliminary cleaning process is performed;
an opening and closing member for selectively opening and closing the entrance;
A substrate processing apparatus comprising:
The method of claim 1,
and an exhaust unit communicating with the internal space of the blocking unit and configured to suck and exhaust foreign substances in the internal space.


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