KR102459645B1 - 레이저를 이용한 미세 가공 장치 및 방법 - Google Patents
레이저를 이용한 미세 가공 장치 및 방법 Download PDFInfo
- Publication number
- KR102459645B1 KR102459645B1 KR1020220088520A KR20220088520A KR102459645B1 KR 102459645 B1 KR102459645 B1 KR 102459645B1 KR 1020220088520 A KR1020220088520 A KR 1020220088520A KR 20220088520 A KR20220088520 A KR 20220088520A KR 102459645 B1 KR102459645 B1 KR 102459645B1
- Authority
- KR
- South Korea
- Prior art keywords
- laser beam
- processed
- processing
- laser
- crystallized
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000006243 chemical reaction Methods 0.000 claims abstract description 92
- 230000008569 process Effects 0.000 claims abstract description 23
- 230000003287 optical effect Effects 0.000 claims abstract description 18
- 239000000126 substance Substances 0.000 claims abstract description 17
- 238000005459 micromachining Methods 0.000 claims abstract description 14
- 230000001376 precipitating effect Effects 0.000 claims abstract description 5
- 238000003754 machining Methods 0.000 claims description 26
- 239000000463 material Substances 0.000 claims description 18
- 230000001678 irradiating effect Effects 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- 238000010438 heat treatment Methods 0.000 claims description 9
- 229910010293 ceramic material Inorganic materials 0.000 claims description 8
- 229910052710 silicon Inorganic materials 0.000 claims description 5
- 230000008859 change Effects 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 4
- 230000008018 melting Effects 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 4
- 239000002210 silicon-based material Substances 0.000 claims 2
- 238000002425 crystallisation Methods 0.000 abstract 1
- 230000008025 crystallization Effects 0.000 abstract 1
- 239000011521 glass Substances 0.000 description 10
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 239000010453 quartz Substances 0.000 description 6
- 229910052594 sapphire Inorganic materials 0.000 description 6
- 239000010980 sapphire Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 1
- RQPZNWPYLFFXCP-UHFFFAOYSA-L barium dihydroxide Chemical compound [OH-].[OH-].[Ba+2] RQPZNWPYLFFXCP-UHFFFAOYSA-L 0.000 description 1
- 229910001863 barium hydroxide Inorganic materials 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220088520A KR102459645B1 (ko) | 2022-07-18 | 2022-07-18 | 레이저를 이용한 미세 가공 장치 및 방법 |
| PCT/KR2023/010193 WO2024019452A1 (ko) | 2022-07-18 | 2023-07-17 | 레이저를 이용한 미세 가공 장치 및 방법 |
| TW112126522A TW202406663A (zh) | 2022-07-18 | 2023-07-17 | 利用雷射的微加工裝置及方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020220088520A KR102459645B1 (ko) | 2022-07-18 | 2022-07-18 | 레이저를 이용한 미세 가공 장치 및 방법 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR102459645B1 true KR102459645B1 (ko) | 2022-10-28 |
Family
ID=83835539
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220088520A KR102459645B1 (ko) | 2022-07-18 | 2022-07-18 | 레이저를 이용한 미세 가공 장치 및 방법 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102459645B1 (zh) |
| TW (1) | TW202406663A (zh) |
| WO (1) | WO2024019452A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024019452A1 (ko) * | 2022-07-18 | 2024-01-25 | 주식회사 아이티아이 | 레이저를 이용한 미세 가공 장치 및 방법 |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101165084B1 (ko) * | 2011-09-26 | 2012-07-12 | 주식회사 비티엔아이티솔루션스 | 레이저빔을 이용한 감광성 유리 기판의 미세패턴 형성방법 |
| KR101625948B1 (ko) | 2014-10-30 | 2016-05-31 | 서울과학기술대학교 산학협력단 | 초음파 진동과 레이저 습식 후면 에칭을 이용한 유리 형상 가공장치 |
| KR20180048891A (ko) * | 2015-08-31 | 2018-05-10 | 닛본 이따 가라스 가부시끼가이샤 | 미세 구조를 갖는 유리의 제조 방법 |
| KR102382471B1 (ko) | 2020-11-03 | 2022-04-04 | 서울대학교 산학협력단 | 레이저를 이용한 미세구조물 가공방법 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016049542A (ja) * | 2014-08-29 | 2016-04-11 | アイシン精機株式会社 | レーザ加工方法、ガラス加工部品の製造方法及びレーザ加工装置 |
| KR101669645B1 (ko) * | 2015-04-01 | 2016-10-26 | 주식회사 오피트 | 감광성 유리에 3차원의 미세 구조물 및 미세 패턴을 형성하기 위한 3차원 광조사 장치, 및 이를 이용하는 방법 |
| DE102020105540A1 (de) * | 2019-10-11 | 2021-04-15 | Trumpf Laser- Und Systemtechnik Gmbh | Optisches Stanzen von Mikrolöchern in Dünnglas |
| KR102459645B1 (ko) * | 2022-07-18 | 2022-10-28 | 주식회사 아이티아이 | 레이저를 이용한 미세 가공 장치 및 방법 |
-
2022
- 2022-07-18 KR KR1020220088520A patent/KR102459645B1/ko active IP Right Grant
-
2023
- 2023-07-17 WO PCT/KR2023/010193 patent/WO2024019452A1/ko unknown
- 2023-07-17 TW TW112126522A patent/TW202406663A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101165084B1 (ko) * | 2011-09-26 | 2012-07-12 | 주식회사 비티엔아이티솔루션스 | 레이저빔을 이용한 감광성 유리 기판의 미세패턴 형성방법 |
| KR101625948B1 (ko) | 2014-10-30 | 2016-05-31 | 서울과학기술대학교 산학협력단 | 초음파 진동과 레이저 습식 후면 에칭을 이용한 유리 형상 가공장치 |
| KR20180048891A (ko) * | 2015-08-31 | 2018-05-10 | 닛본 이따 가라스 가부시끼가이샤 | 미세 구조를 갖는 유리의 제조 방법 |
| KR102382471B1 (ko) | 2020-11-03 | 2022-04-04 | 서울대학교 산학협력단 | 레이저를 이용한 미세구조물 가공방법 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024019452A1 (ko) * | 2022-07-18 | 2024-01-25 | 주식회사 아이티아이 | 레이저를 이용한 미세 가공 장치 및 방법 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW202406663A (zh) | 2024-02-16 |
| WO2024019452A1 (ko) | 2024-01-25 |
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| E701 | Decision to grant or registration of patent right | ||
| GRNT | Written decision to grant |