KR102458942B1 - Cavity filter and electric device having the same - Google Patents

Abstract

Disclosed are a cavity filter capable of performing an electrical connection with an external device through an automated process without requiring a separate space for forming an input/output terminal with an external electronic device, and an electric device including the same. This cavity filter includes a housing, a resonant element and a cover PCB. The housing includes a bottom portion and a sidewall portion extending upwardly from an end portion of the bottom portion. The resonance element includes a first resonance element and a second resonance element disposed inside the housing. The cover PCB is attached to the side wall portion to cover the housing. The cover PCB includes a substrate portion, a first pattern, and a third pattern. The first pattern is formed on a lower surface of the substrate part. The first pattern includes a first corresponding pattern and a first ground pattern. The first corresponding pattern corresponds to the resonance element. The first ground pattern is formed to surround the first corresponding pattern and is in contact with the sidewall portion of the housing. The third pattern is formed on the upper surface of the substrate part. The third pattern includes an input terminal pattern, an output terminal pattern, and a third ground pattern. The input terminal pattern corresponds to the first resonant element. The output terminal pattern corresponds to the second resonance element. The third ground pattern surrounds the input terminal pattern and the output terminal pattern and is electrically connected to the first ground pattern.

Description

CAVITY FILTER AND ELECTRIC DEVICE HAVING THE SAME

The present invention relates to a filter for passing a specific frequency and an electric device including the same, and more particularly, to a cavity filter and an electric device including the same.

The filter is a passive circuit that passes only a desired frequency among input frequency components and attenuates the rest.

These filters, depending on the bandpass characteristics, include a high-pass filter (HPF) that passes only high frequencies, a low-pass filter (LPF) that passes only low frequencies, a band-pass filter (BPF) that passes only frequencies of a specific band, and only a frequency of a specific band. It can be divided into a band-stop filter (BSF) that blocks it.

In addition, depending on the implementation form, such a filter is a lump filter formed by combining LC elements, a strip filter using a patterned transmission line, a ceramic filter using a high dielectric ceramic, a cavity filter using a waveguide, and SAW using an acoustic wave. can be classified as

Among them, a cavity filter is widely used in a filter requiring high power, such as a wireless communication base station.

FIG. 1 is a schematic exploded perspective view of a conventional cavity filter, and FIG. 2 is a cross-sectional view showing a tuning screw and a resonance element in order to show a resonance frequency tuning process of the conventional cavity filter shown in FIG. 1 .

1 and 2 , the conventional cavity filter 10 includes a housing 12 , a partition wall 16 , a resonance element 14 , a cover 11 , and a tuning screw 13 .

A terminal portion 15 including an input terminal 15a and an output terminal 15b is formed in the housing 12 .

The partition wall 16 divides the inside of the housing 12 into a plurality of spaces, and the resonance element 14 is disposed in each space. In addition, the tuning screw 13 is disposed on the cover 11 that covers the housing 12 to face the resonance element 14 , so that the separation distance between the resonance element 14 and the tuning screw 13 is By adjusting (D), the frequency of the electromagnetic wave passing through the cavity filter 10 is adjusted.

A window 17 is formed in the barrier rib 16 to allow electromagnetic waves to travel, and the window 17 may be formed in the barrier 16 according to a direction in which the electromagnetic wave travels. In FIG. 1 , the electromagnetic wave input through the input terminal 15a is linearly formed, and then is U-turned in the last resonant element, and only the electromagnetic wave having the filtered frequency is output through the output terminal 15b. However, this window 17 is merely exemplary, and may be formed so that electromagnetic waves pass through in a zigzag shape, and the output terminal 15b is disposed at a position corresponding to the last resonant element 14 .

However, in the case of the conventional cavity filter 10, a separate input terminal 15a and an output terminal 15b are formed, and a separate space is required to form the terminal part 15, and also, when assembling, the operator It is difficult to automate because it is connected to an external device by hand.

Republic of Korea Patent No. 10-1927956 Republic of Korea Patent Publication No. 10-2019-0082026 Republic of Korea Patent Publication No. 10-2019-0093160 Republic of Korea Patent Publication No. 10-2020-0044372

Accordingly, the problem to be solved by the present invention is to provide a cavity filter that does not require a separate space for forming an input/output terminal with an external electronic device, and can perform electrical connection with an external device through an automated process will do

Another problem to be solved by the present invention is to provide an electric device having such a cavity filter.

A cavity filter according to an exemplary embodiment of the present invention for solving these problems includes a housing, a resonance element, and a cover PCB. The housing includes a bottom portion and a sidewall portion extending upwardly from an end portion of the bottom portion. The resonance element includes a first resonance element and a second resonance element disposed inside the housing. The cover PCB is attached to the side wall portion to cover the housing. The cover PCB includes a substrate portion, a first pattern, and a third pattern. The first pattern is formed on a lower surface of the substrate part. The first pattern includes a first corresponding pattern and a first ground pattern. The first corresponding pattern corresponds to the resonance element. The first ground pattern is formed to surround the first corresponding pattern and is in contact with the sidewall portion of the housing. The third pattern is formed on the upper surface of the substrate part. The third pattern includes an input terminal pattern, an output terminal pattern, and a third ground pattern. The input terminal pattern corresponds to the first resonant element. The output terminal pattern corresponds to the second resonance element. The third ground pattern surrounds the input terminal pattern and the output terminal pattern and is electrically connected to the first ground pattern.

As an embodiment, the substrate unit may include a first substrate and a second substrate facing each other. In this case, the cover PCB may further include a second pattern formed between the first substrate and the second substrate. The second pattern may include a second corresponding pattern and a second ground pattern. The second corresponding pattern may face the first corresponding pattern. The second ground pattern may be formed to surround the second corresponding pattern, and may be electrically connected to the first ground pattern.

In an embodiment, the first corresponding pattern may be connected to at least one of the second corresponding pattern and the input terminal pattern through a first via.

In an embodiment, the first ground pattern may be connected to at least one of the second ground pattern and the third ground pattern through a second via.

In this case, the second via may be formed to surround the outside of at least one of the first resonator element and the second resonator element in a line or more when viewed in a plan view.

As an embodiment, the resonance element may further include a plurality of resonance elements between the first resonance element and the second resonance element according to a path along which the electromagnetic wave travels. In this case, the second pattern may further include a bridge pattern. The bridge pattern includes a point adjacent to the second corresponding pattern corresponding to the i-th resonant element, when numbers 1, ..., N are assigned to the resonant elements according to the order in which the electromagnetic wave travels, i+ The points adjacent to the second corresponding pattern corresponding to the k-th resonant element may be connected (N is a natural number greater than or equal to 3, k is a natural number greater than or equal to 2, and i+k is a natural number less than or equal to N).

For example, the resonance elements may include six resonance elements, and the bridge pattern may include a first bridge pattern and a second bridge pattern. The first bridge pattern may connect a point adjacent to the second resonance element and a point adjacent to the fifth resonance element. The second bridge pattern may connect a point adjacent to the second resonance element and a point adjacent to the fourth resonance element.

As an embodiment, the substrate unit may include a first substrate and a second substrate facing each other. In this case, the cover PCB may further include a second pattern formed between the first substrate and the second substrate. The second pattern may include the input terminal pattern and a second ground pattern. The input terminal pattern may be in electrical contact with the first corresponding pattern. The second ground pattern may be formed to surround the input terminal pattern, and may be electrically connected to the first ground pattern. In addition, the second substrate may include an opening exposing the input terminal pattern.

In an embodiment, the first corresponding pattern may be connected to the second corresponding pattern through a third via.

In an embodiment, the first ground pattern may be connected to at least one of the second ground pattern and the third ground pattern through a second via.

In this case, the second via may be formed to surround the outside of at least one of the first resonator element and the second resonator element in a line or more when viewed in a plan view.

In this case, the cavity filter may further include a feeding block. The feeding block may be in contact with the input terminal pattern, and may compensate for a height up to the third ground pattern.

As an embodiment, the resonance element may further include a plurality of resonance elements between the first resonance element and the second resonance element according to a path along which the electromagnetic wave travels. In this case, the second pattern may further include a bridge pattern. The bridge pattern includes a point adjacent to the second corresponding pattern corresponding to the i-th resonant element, when numbers 1, ..., N are assigned to the resonant elements according to the order in which the electromagnetic wave travels, i+ The points adjacent to the second corresponding pattern corresponding to the k-th resonant element may be connected (N is a natural number greater than or equal to 3, k is a natural number greater than or equal to 2, and i+k is a natural number less than or equal to N).

For example, the resonance elements may include six resonance elements, and the bridge pattern may include a first bridge pattern and a second bridge pattern. The first bridge pattern may connect a point adjacent to the second resonance element and a point adjacent to the fifth resonance element. The second bridge pattern may connect a point adjacent to the second resonance element and a point adjacent to the fourth resonance element.

As an embodiment, the resonance element may include a pipe-shaped body with an empty interior, and a head formed on the body to face the first corresponding pattern. In this case, a hole corresponding to the body may be formed in the bottom portion of the housing.

In an embodiment, the body may be integrally formed with the housing, and the head may be attached to an upper portion of the body.

In an embodiment, the housing may further include a partition wall partitioning between the resonant elements and having a window through which electromagnetic waves travel, and a window screw for controlling a bandwidth of a filtered signal may be provided in the window area. .

An electric device according to an exemplary embodiment of the present invention may include a housing, a resonance element, a cover PCB, and an operation PCB. The housing includes a bottom portion and a sidewall portion extending upwardly from an end portion of the bottom portion. The resonance element includes a first resonance element and a second resonance element disposed inside the housing. The cover PCB is attached to the side wall portion to cover the housing. The operation PCB is disposed on the cover PCB. The cover PCB is attached to the side wall portion to cover the housing. The cover PCB includes a substrate portion, a first pattern, and a third pattern. The first pattern is formed on a lower surface of the substrate part. The first pattern includes a first corresponding pattern and a first ground pattern. The first corresponding pattern corresponds to the resonance element. The first ground pattern is formed to surround the first corresponding pattern and is in contact with the sidewall portion of the housing. The third pattern is formed on the upper surface of the substrate part. The third pattern includes an input terminal pattern, an output terminal pattern, and a third ground pattern. The input terminal pattern corresponds to the first resonant element. The output terminal pattern corresponds to the second resonance element. The third ground pattern surrounds the input terminal pattern and the output terminal pattern and is electrically connected to the first ground pattern. The operation PCB is in electrical contact with at least one of the input terminal pattern and the output terminal pattern by soldering.

In one embodiment, the operation PCB may be an antenna PCB to which an antenna is attached.

As described above, the cavity filter according to the present invention can be connected to an external device by soldering to the cover PCB on the upper portion of the housing, so that an automated process is possible, and a separate space for forming a terminal part is not required.

1 is a schematic exploded perspective view of a conventional cavity filter.
FIG. 2 is a cross-sectional view illustrating a tuning screw and a resonance element in order to illustrate a resonance frequency tuning process of the conventional cavity filter shown in FIG. 1 .
3 is a perspective view of a cavity filter according to an exemplary embodiment of the present invention.
4 is a perspective view illustrating a state in which the cover PCB is removed from the cavity filter of FIG. 3 .
5 is a cross-sectional view taken along line V-V' of FIG. 3 .
6 is a cross-sectional view taken along line VI-VI' of FIG. 3 .
FIG. 7 is a plan view of the cavity filter shown in FIG. 3 .
8 is a plan view illustrating a state in which the cover PCB is removed from the second substrate.
9 is a plan view illustrating a state in which the second substrate of the cover PCB is removed according to another exemplary embodiment of the present invention.
10 is a cross-sectional view taken along line V-V' of FIG. 3 of a cavity filter according to another exemplary embodiment of the present invention.
11 is a cross-sectional view of a cavity filter according to another exemplary embodiment of the present invention.
12 is a cross-sectional view showing an electric device according to an exemplary embodiment of the present invention.
13 is a cross-sectional view showing an electric device according to another exemplary embodiment of the present invention.
14 is a graph for explaining a notch pattern according to the bridge filter of FIG. 9 .

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention. In describing each figure, like reference numerals have been used for like elements. In the accompanying drawings, the dimensions of the structures may be exaggerated than in reality for clarity of the present invention.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification is present, but one or more other features or It should be understood that the existence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded in advance. In addition, A and B are 'connected' or 'coupled' means that A and B are directly connected or combined, and other components C are included between A and B, so that A and B are connected or combined. that will include

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. Terms such as those defined in a commonly used dictionary should be interpreted as having a meaning consistent with the meaning in the context of the related art, and should not be interpreted in an ideal or excessively formal meaning unless explicitly defined in the present application. does not Further, in the claims of the method invention, the respective steps may be interchanged in their order, unless the respective steps are explicitly constrained to the order.

In addition, configurations individually described in each embodiment may be applied in other embodiments.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the drawings.

3 is a perspective view of a cavity filter according to an exemplary embodiment of the present invention, and FIG. 4 is a perspective view illustrating a state in which the cover PCB is removed from the cavity filter of FIG. 3 . FIG. 5 is a cross-sectional view taken along line V-V' of FIG. 3 , and FIG. 6 is a cross-sectional view taken along line VI-VI' of FIG. 3 . 7 is a plan view of the cavity filter shown in FIG. 3 , and FIG. 8 is a plan view illustrating a state in which the cover PCB is removed from the second substrate.

3 to 8 , the cavity filter 100 according to an exemplary embodiment of the present invention includes a housing 110 , a resonance element 120 , and a cover PCB 130 .

The housing 110 includes a bottom portion and a side wall portion extending upwardly from an end portion of the bottom portion. Although not shown, either side of the side wall portion in FIG. 5 or FIG. 7 may be the partition wall portion in FIG. 1 . In addition, a window (not shown) may be formed on the sidewall portion. The housing 110 may be formed of metal.

The resonance element 120 includes a first resonance element 120a and a second resonance element 120b disposed inside the housing 110 . For convenience of description, the first resonant element 120a is a resonant element 120 corresponding to the input terminal pattern 135a, and the second resonant element 120b is a resonant element 120 corresponding to the output terminal pattern 135c. .

The cover PCB 130 is attached to the sidewall of the housing 110 to cover the housing 110 . The cover PCB 130 includes a substrate portion including a first substrate 131 and a second substrate 132 , a first pattern 133 , and a third pattern 135 . In addition, the cover PCB 130 may further include a second pattern 134 . The first pattern 133 , the second pattern 134 , and the third pattern 135 are patterns generated by patterning and partially removing a metal layer formed on the first or second substrate 131 or 132 . to be.

The first pattern 133 is formed on the lower surface of the substrate part 130a. In more detail, when the substrate portion 130a is formed of two substrates, the first pattern 133 is formed on the lower surface of the first substrate 131 constituting the lower portion of the substrate portion 130a.

The first pattern 133 includes a first corresponding pattern 133a and a first ground pattern 133b. The first corresponding pattern 133a corresponds to the resonance element 120 . The first ground pattern 133b is formed to surround the first corresponding pattern 133a and is in contact with the sidewall portion of the housing 110 . Accordingly, the first ground pattern 133b maintains a ground state, thereby suppressing electromagnetic interference of each of the first corresponding patterns 133a corresponding to the resonance elements 120 .

The third pattern 135 is formed on the upper surface of the substrate part. More specifically, when the substrate part 130a is formed of two substrates, the third pattern 135 is formed on the upper surface of the second substrate 132 constituting the upper part of the substrate part.

The third pattern 135 includes an input terminal pattern 135a, an output terminal pattern 135c, and a third ground pattern 135b. The input terminal pattern 135a corresponds to the first resonant element 120a. The input terminal pattern 135a may be electrically connected to the first corresponding pattern 133a through a first via 136 . In the drawings, only one of the first vias 136 is illustrated for convenience, but a plurality of first vias 136 may be included.

The output terminal pattern 135c corresponds to the second resonance element 120b. The third ground pattern 135b surrounds the input terminal pattern 135a and the output terminal pattern 135c and is electrically connected to the first ground pattern 133b and the second via 137 . A plurality of second vias 137 may also be formed.

As an embodiment, as described above, the substrate unit 130a may be composed of a single substrate. Alternatively, as shown in the drawings, the first substrate 131 and the second substrate face each other. A substrate 132 may be included. In this case, the cover PCB 130 may further include a second pattern 134 formed between the first substrate 131 and the second substrate 132 .

The second pattern 134 may include a second corresponding pattern 134a and a second ground pattern 134b. The second corresponding pattern 134a may face the first corresponding pattern 133a. Also, the second corresponding pattern 134a may be electrically connected to the first corresponding pattern 133a through the first via 136 .

The second ground pattern 134b may be formed to surround the second corresponding pattern 134a and may be electrically connected to the first ground pattern 133b through the second via 137 . As illustrated, a plurality of the second vias 137 may be formed to surround the corresponding patterns. In this case, the second vias 137 may be formed in one or more rows in a plan view.

9 is a plan view illustrating a state in which the second substrate of the cover PCB is removed according to another exemplary embodiment of the present invention.

Referring to FIG. 9 , as an embodiment, the resonator element may further include a plurality of resonator elements between the first resonator element and the second resonator element according to a path along which electromagnetic waves travel. In this case, the second pattern may further include a bridge pattern. The bridge pattern includes a point adjacent to the second corresponding pattern corresponding to the i-th resonant element, when numbers 1, ..., N are assigned to the resonant elements according to the order in which the electromagnetic wave travels, i+ The points adjacent to the second corresponding pattern corresponding to the k-th resonant element may be connected (N is a natural number greater than or equal to 3, k is a natural number greater than or equal to 2, and i+k is a natural number less than or equal to N).

For example, the resonator elements may include six resonator elements #1 to #6, and the bridge pattern may include a first bridge pattern 134c and a second bridge pattern 134d. As described above, the first resonant element #1 is a resonant element through which the electromagnetic wave input through the input terminal pattern first passes, and the second resonant element #2 and the third resonant element which are neighboring resonant elements. After sequentially proceeding to (#3), make a U-turn, pass through the No. 4 resonance element (#4), the No. 5 resonance element (#5), and the No. 6 resonance element (#6), through the output terminal pattern, The filtered electromagnetic wave is output.

In this case, the first bridge pattern 134c may connect a point adjacent to the second resonator element #2 and a point adjacent to the fifth resonator element #5. In addition, the second bridge pattern 134d may connect a point adjacent to the second resonance element #2 and a point adjacent to the fourth resonance element #4. When the resonance element is connected in this way, as shown in FIG. 14 , a notch pattern may be formed to sharply form a filtering band of the filtered electromagnetic wave. As a result of the experiment, the first bridge pattern 134c forms the first and second notch patterns A and B of FIG. 14 , and the second bridge pattern 134d includes the first and second notch patterns A and B. appears to form symmetrically.

10 is a cross-sectional view taken along line V-V' of FIG. 3 of a cavity filter according to another exemplary embodiment of the present invention. The cavity filter shown in FIG. 10 is substantially the same as the cavity filter shown in FIG. 5 except for the cover PCB. Accordingly, the same or similar components are given the same reference numerals, and overlapping descriptions are contemplated.

Referring to FIG. 10 , as an embodiment, the substrate part 130a constituting the cover PCB 230 of the present embodiment may include a first substrate 131 and a second substrate 232 facing each other.

In this case, the cover PCB 230 may further include a second pattern 234 formed between the first substrate 131 and the second substrate 232 . The second pattern 234 may include the input terminal pattern 135a and the second ground pattern 134b. The input terminal pattern 135a may be in electrical contact with the first corresponding pattern 133a through the third via 138 .

The second ground pattern 134b may be formed to surround the input terminal pattern 135a and may be electrically connected to the first ground pattern 133b. Also, the second substrate 232 may include an opening exposing the input terminal pattern 135a.

In this case, the cavity filter may further include a feeding block 234c. The power supply block 234c may be in contact with the input terminal pattern 135a, and may compensate for a height up to the third ground pattern 135b. Through this, as shown in FIG. 13 , it can be attached to an external PCB by soldering.

11 is a cross-sectional view of a cavity filter according to another exemplary embodiment of the present invention.

Referring to FIG. 11 , as an embodiment, the resonance element 320 includes a body 320a in the form of a pipe having an empty interior and a head ( 320a ) formed on the body 320a and facing the first corresponding pattern. 320b). In this case, a hole corresponding to the body may be formed in the bottom of the housing 310 .

As an embodiment, the body 320a may be integrally formed with the housing 310 , and the head 320b may be attached to the upper portion of the body 320a.

In this case, by punching the head 320 through a hole and adjusting the distance with the first corresponding pattern formed on the cover PCB 130 , without configuring the tuning screw 13 of FIG. 2 , the cavity filter It is possible to adjust the frequency of the electromagnetic wave passing through (300).

In addition, as an embodiment, the housing 310 divides between the resonator elements 320 like the barrier rib 16 shown in FIG. 1 and includes a barrier rib in which a window 17 through which electromagnetic waves are formed Further, the window area may be provided with a window screw 330 for adjusting the bandwidth of the filtered signal. The window screw 330 may control the electromagnetic wave passing between the windows to change the return loss signal and adjust the bandwidth.

12 is a cross-sectional view showing an electric device according to an exemplary embodiment of the present invention, and FIG. 13 is a cross-sectional view showing an electric device according to another exemplary embodiment of the present invention. In this embodiment, in the cavity filters described above, it further includes an operation PCB. Accordingly, the same or similar components are denoted by the same reference numerals, and overlapping descriptions are omitted.

12 and 13 , the electric devices 1000 and 2000 according to an embodiment of the present invention further include the operation PCB 1100 attached to the cavity filter described above.

The operation PCB 1100 may be a PCB to which elements for performing various functions are attached. For example, the operation PCB 1100 may be a PCB for calibration, a PCB to which the antenna 1200 is attached, or the like.

The operation PCB 1100 may be in electrical contact with at least one of the input terminal pattern 135a and the output terminal pattern 135c by soldering. Therefore, an automated process is possible without an operator.

On the other hand, although FIG. 12 or 13 shows an example in which the operation PCB 110 is attached to the cover PCB 130 by soldering, the antenna 120 may be directly attached to the cover PCB 130, and the cover PCB ( The cover PCB 130 may be manufactured so that the 130 operates as an operation PCB.

As described above, the cavity filter according to the present invention can be connected to an external device by soldering to the cover PCB on the upper portion of the housing, so that an automated process is possible, and a separate space for forming a terminal part is not required.

Although the detailed description of the present invention described above has been described with reference to preferred embodiments of the present invention, those of ordinary skill in the art or those having ordinary knowledge in the art will have the spirit of the present invention described in the claims to be described later. And it will be understood that various modifications and variations of the present invention can be made without departing from the technical scope.

10: conventional cavity filter
11: cover 12: housing
13: tuning screw 14: resonant element
15: terminal part 15a: input terminal
15b: output terminal 16: bulkhead
17: Windows
100, 200, 300: cavity filter according to embodiments of the present invention
110: housing 120, 320: resonant element
120a: first resonant element 120b: second resonant element
130: cover PCB 130a: substrate part
131: second substrate 132, 232: second substrate
133: first pattern 133a: first corresponding pattern
133b: first ground pattern 134, 234: second pattern
134a. 234a: second corresponding pattern 134b: second ground pattern
134c: first bridge pattern 134d: second bridge pattern
135: third pattern 135a: input terminal pattern
135b: third ground pattern 135c: output terminal pattern
136; first via 137: second via
138: third via 234c: feed block
320a: body 320b: head
330: window screw
1000. 2000: Electronic device according to embodiments of the present invention
1100: operation PCB or antenna PCB 1200: antenna

Claims (20)

a housing including a bottom portion and a sidewall portion extending upwardly from an end portion of the bottom portion;
a resonance element including a first resonance element and a second resonance element disposed inside the housing; and
a cover PCB attached to the sidewall to cover the housing;
including,
The cover PCB is
substrate part;
a first pattern formed on a lower surface of the substrate and including a first corresponding pattern corresponding to the resonance element and a first ground pattern formed to surround the first corresponding pattern and in contact with the sidewall of the housing; and
an input terminal pattern corresponding to the first resonance element, an output terminal pattern corresponding to the second resonance element, and the first ground pattern formed on the upper surface of the substrate part and surrounding the input terminal pattern and the output terminal pattern; a third pattern including a third ground pattern electrically connected;
Cavity filter comprising a.
The method of claim 1,
The substrate part,
Comprising a first substrate and a second substrate facing each other,
The cover PCB is
Further comprising a second pattern formed between the first substrate and the second substrate,
The second pattern may include a second corresponding pattern facing the first corresponding pattern, and a second ground pattern formed to surround the second corresponding pattern and electrically connected to the first ground pattern. cavity filter.
3. The method of claim 2,
The first corresponding pattern is connected to at least one of the second corresponding pattern and the input terminal pattern through a first via.
3. The method of claim 2,
and the first ground pattern is connected to at least one of the second ground pattern and the third ground pattern through a second via.
5. The method of claim 4,
The vias are in a line or more in a plan view, and are formed to surround the outside of at least one of the first resonant element and the second resonant element.
3. The method of claim 2,
The resonance element is
A plurality of resonant elements are further included between the first resonant element and the second resonant element according to the path along which the electromagnetic wave travels,
The second pattern is
When numbers 1, ...., N are assigned to the resonant elements according to the order in which electromagnetic waves travel, the points adjacent to the second corresponding pattern corresponding to the i-th resonant element and the i+k-th resonant element are A cavity filter (N is a natural number of 3 or more, k is a natural number of 2 or more, i+k is a natural number of N or less), further comprising a bridge pattern connecting dots adjacent to the corresponding second corresponding pattern.
7. The method of claim 6,
The resonant elements include six resonant elements,
The bridge pattern is
a first bridge pattern connecting a point adjacent to the second resonance element and a point adjacent to the fifth resonance element; and
a second bridge pattern connecting a point adjacent to the second resonance element and a point adjacent to the fourth resonance element;
Cavity filter comprising a.
3. The method of claim 2,
The substrate part,
Comprising a first substrate and a second substrate facing each other,
The cover PCB is
Further comprising a second pattern formed between the first substrate and the second substrate,
The second pattern includes the input terminal pattern in electrical contact with the first corresponding pattern, and a second ground pattern formed to surround the input terminal pattern and electrically connected to the first ground pattern,
and the second substrate includes an opening exposing the input terminal pattern.
9. The method of claim 8,
The first corresponding pattern is connected to the second corresponding pattern through a third via.
9. The method of claim 8,
and the first ground pattern is connected to at least one of the second ground pattern and the third ground pattern through a second via.
11. The method of claim 10,
The vias are in a line or more in a plan view, and are formed to surround the outside of at least one of the first resonant element and the second resonant element.
9. The method of claim 8,
a feeding block in contact with the input terminal pattern and compensating for a height up to the third ground pattern;
Cavity filter, characterized in that it further comprises.
9. The method of claim 8,
The resonance element is
A plurality of resonant elements are further included between the first resonant element and the second resonant element according to the path along which the electromagnetic wave travels,
The second pattern is
When numbers 1, ...., N are assigned to the resonant elements according to the order in which electromagnetic waves travel, the points adjacent to the second corresponding pattern corresponding to the i-th resonant element and the i+k-th resonant element are A cavity filter (N is a natural number of 3 or more, k is a natural number of 2 or more, i+k is a natural number of N or less), further comprising a bridge pattern connecting dots adjacent to the corresponding second corresponding pattern.
14. The method of claim 13,
The resonant elements include six resonant elements,
The bridge pattern is
a first bridge pattern connecting a point adjacent to the second resonance element and a point adjacent to the fifth resonance element; and
a second bridge pattern connecting a point adjacent to the second resonance element and a point adjacent to the fourth resonance element;
Cavity filter comprising a.
The method of claim 1,
The resonance element includes a pipe-shaped body with an empty interior and a head formed on the body to face the first corresponding pattern,
A cavity filter, characterized in that a hole corresponding to the body is formed in the bottom of the housing.
16. The method of claim 15,
The body is integrally formed with the housing,
The cavity filter, characterized in that the head is attached to the upper portion of the body.
The method of claim 1,
The housing is
and a partition wall dividing between the resonant elements and having a window through which electromagnetic waves travel,
The cavity filter, characterized in that the window region is provided with a window screw for adjusting the bandwidth of the filtered signal.
a housing including a bottom portion and a sidewall portion extending upwardly from an end portion of the bottom portion;
a resonance element including a first resonance element and a second resonance element disposed inside the housing;
a cover PCB attached to the sidewall to cover the housing; and
Including an operation PCB disposed on the cover PCB,
including,
The cover PCB is
substrate part;
a first pattern formed on a lower surface of the substrate and including a first corresponding pattern corresponding to the resonance element and a first ground pattern formed to surround the first corresponding pattern and in contact with the sidewall of the housing; and
an input terminal pattern corresponding to the first resonance element, an output terminal pattern corresponding to the second resonance element, and the first ground pattern formed on the upper surface of the substrate part and surrounding the input terminal pattern and the output terminal pattern; A third pattern including a third ground pattern electrically connected,
The operation PCB is
The electrical device according to claim 1, wherein the electrical device is in electrical contact with at least one of the input terminal pattern and the output terminal pattern by soldering.
19. The method of claim 18,
The operation PCB is an electrical device, characterized in that the antenna is attached to the PCB.
a housing including a bottom portion and a sidewall portion extending upwardly from an end portion of the bottom portion;
a resonance element including a first resonance element and a second resonance element disposed inside the housing;
a cover PCB attached to the sidewall to cover the housing; and
antenna;
including,
The cover PCB is
substrate part;
a first pattern formed on a lower surface of the substrate and including a first corresponding pattern corresponding to the resonance element and a first ground pattern formed to surround the first corresponding pattern and in contact with the sidewall of the housing; and
an input terminal pattern corresponding to the first resonance element, an output terminal pattern corresponding to the second resonance element, and the first ground pattern formed on the upper surface of the substrate part and surrounding the input terminal pattern and the output terminal pattern; a third pattern including a third ground pattern electrically connected;
including,
and the antenna is soldered to the input terminal pattern.

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