KR101727066B1 - Wireless Frequency Filter - Google Patents

Wireless Frequency Filter Download PDF

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Publication number
KR101727066B1
KR101727066B1 KR1020160127450A KR20160127450A KR101727066B1 KR 101727066 B1 KR101727066 B1 KR 101727066B1 KR 1020160127450 A KR1020160127450 A KR 1020160127450A KR 20160127450 A KR20160127450 A KR 20160127450A KR 101727066 B1 KR101727066 B1 KR 101727066B1
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KR
South Korea
Prior art keywords
housing
hollow
circuit pattern
circuit board
printed circuit
Prior art date
Application number
KR1020160127450A
Other languages
Korean (ko)
Inventor
박종철
안세훈
이민호
장호정
Original Assignee
(주)웨이브텍
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Publication date
Application filed by (주)웨이브텍 filed Critical (주)웨이브텍
Priority to KR1020160127450A priority Critical patent/KR101727066B1/en
Application granted granted Critical
Publication of KR101727066B1 publication Critical patent/KR101727066B1/en
Priority to PCT/KR2017/007303 priority patent/WO2018066790A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/201—Filters for transverse electromagnetic waves
    • H01P1/205—Comb or interdigital filters; Cascaded coaxial cavities
    • H01P1/2053—Comb or interdigital filters; Cascaded coaxial cavities the coaxial cavity resonators being disposed parall to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/207—Hollow waveguide filters
    • H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
    • H01P1/2088—Integrated in a substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P1/00—Auxiliary devices
    • H01P1/20—Frequency-selective devices, e.g. filters
    • H01P1/213—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies
    • H01P1/2138—Frequency-selective devices, e.g. filters combining or separating two or more different frequencies using hollow waveguide filters

Abstract

Disclosed is a wireless frequency filter having a cavity structure including a housing having a hollow inside and closing the hollow and at least one resonance element disposed in the hollow of the housing. According to the wireless frequency filter of the present invention, at least one plate forming the housing is formed to be a printed circuit board (PCB) having a conductive metal layer formed on a surface thereof disposed on the hollow side of the housing (hereinafter referred to as inner surface), and the PCB includes a circuit pattern formed of a conductive metal on the inner surface. According to the wireless frequency filter of the present invention, the frequency characteristics of the resonance element is controlled without using a structure such as a cable, a copper plate, a bar, a copper line, and so on to control the frequency characteristics of the resonance element, so that the size and weight of the filter can be reduced. In addition, according to the wireless frequency filter of the present invention, an additional circuit implemented separately from the structure of the filter is implemented in the PCB constituting the housing, thereby achieving downsizing and weight reduction of the device including the filter.

Description

A radio frequency filter {

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a radio frequency filter, and more particularly, to a radio frequency filter having a cavity structure using a printed circuit board having a circuit pattern made of a conductive metal, A filter, a cable, a copper plate, a bar, and a copper wire, thereby achieving a reduction in size and weight of the filter.

A radio frequency filter is a device that passes only a signal of a specific frequency band among input frequency signals. In a base station of a mobile communication system, a cavity filter is generally used for filtering a high frequency signal. The cavity filter has a structure in which a resonance element is disposed in a plurality of cavities partitioned by the housing.

Specifically, referring to FIG. 1, a conventional cavity filter includes a rectangular parallelepiped-shaped housing. The housing may be formed by, for example, combining a housing main body 1 formed with one side open and a side cover 4 covering the opened side. The housing main body 1 and the side cover 4 are made of metal, particularly aluminum, and can be plated with silver if necessary. The side cover 4 is formed in a plate shape and can be integrally coupled to the housing main body 1 by soldering or screwed to the housing main body 1. Inside the housing, a plurality of hollows (cavities) are formed by the diaphragms 6, and the resonance elements 2 are arranged in the hollows. A tuning screw 7 for adjusting the resonance frequency of each resonance element is provided on the upper plate of the housing. The tuning screw 7 is fixed to the upper plate of the housing by a fixing nut 8. Here, the side surface and the upper surface are named based on the direction in which the resonance element disposed in the hollow of the housing is set.

The resonance elements 2 which are not adjacent to each other can be connected to each other by the cable 3 in order to form a notch in the frequency filter. At this time, the cable 3 should be insulated from the diaphragm 6 with a dielectric so that the cable 3 is not electrically connected to the diaphragm 6. [ A pair of input / output connectors 9 are provided on the side surfaces of the housing. The input / output connector 9 is fixedly attached to the side plate, and the side plate is fastened by the fastening bolt 9 'to form the housing main body 1. The input / output connector 9 is connected to the corresponding resonant element 2 by a copper wire 5.

Such a conventional frequency filter should include a structure such as a cable 3 for notch formation and should include a copper wire 5 for connecting the input / output connector 9 to the resonance element 2, thereby making it compact and lightweight There was a limit.

On the other hand, Patent Registration No. 10-0810971 (registered on Feb. 29, 2008) discloses an RF equipment manufacturing method and an RF equipment manufactured by the method. The disclosed method is to form a metal sheet on which the internal structure of the RF equipment is formed, to join the plastic material housing to the formed metal sheet, and then silver plating the metal sheet. Here, the RF equipment may be a capillary type radio frequency filter.

Patent Publication No. 10-2015-0118768 (published on October 23, 2015) discloses a radio frequency filter having a cavity structure. The disclosed frequency filter includes a cover made of a printed circuit board (PCB). A copper foil layer is formed on the upper and lower surfaces of the printed circuit board.

Patent Registration No. 10-1083994 (registered on November 10, 2011) discloses a circuit board connecting apparatus and an RF cavity filter having the circuit board connecting apparatus. Here, the circuit board connecting device is located inside the cavity of the cavity filter, and serves to connect an internal resonator to an external circuit board. Thus, the signal of the resonator can be transmitted to the low noise amplifier or the like through the circuit board.

On the other hand, Patent Registration No. 10-0827842 (registered on Apr. 29, 2008) discloses a notch-coupled RF filter. Here, the notch formation is achieved by providing a coupling bar at a coupling window position between adjacent resonators. Patent Registration No. 10-0911859 (registered Aug. 05, 2009) discloses a notch-coupled RF filter for forming a plurality of notches. Here, the notch is formed by a cross coupling method, wherein the cross coupling is realized by a coupling bar. The coupling bar is installed through the inner wall defining the cavity and causes a coupling phenomenon between the associated resonators.

The structure of the housing proposed in Patent Registration No. 10-0810971 is that a metal layer is formed on a dielectric substrate and there is a side similar to a printed circuit board but a circuit pattern is not formed and a plastic material is introduced from the side of manufacturing the housing, It has not been employed to adjust the frequency characteristics of the resonance element.

The housing proposed in Japanese Patent Application Laid-Open No. 10-2015-0118768 employs a printed circuit board on which a copper foil layer is formed on the upper and lower surfaces of the cover, but it is likewise employed in order to control the frequency characteristics of the resonant element in the cavity filter It was not.

On the other hand, recent mobile communication systems are demanding to be lighter and smaller in hardware. In order to comply with this trend, it is necessary to improve the circuit technology for controlling the frequency characteristics in order to miniaturize and lighten the wireless communication filter which occupies a large volume and weight in the mobile communication system.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to provide a housing of a radio frequency filter having a cavity structure by using a printed circuit board having a circuit pattern made of a conductive metal, so as to control frequency characteristics of a resonant element, Bar, a dumbbell shape, a copper wire, and the like, thereby achieving miniaturization and weight reduction of the filter.

Other objects and advantages of the present invention can be fully understood by the following detailed description of the invention.

According to an aspect of the present invention, there is provided a radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow, and at least one resonator disposed in the hollow of the housing. A radio frequency filter according to the present invention, at least one plate to form the housing surface (hereinafter referred to as "inner surface" shall mean) conductive printed circuit board a metal layer is formed on the (Printed Circuit Board disposed on the side of the hollow of the housing; PCB ), And the printed circuit board includes a circuit pattern formed of a conductive metal on the inner surface thereof.

The circuit pattern formed on the printed circuit board controls a frequency characteristic of a resonant element disposed in the hollow of the housing and controls frequency characteristics according to the shape and size of the pattern.

The printed circuit board is preferably a side plate of the housing.

The circuit pattern formed on the printed circuit board may include an input / output terminal to which the input / output connector is directly connected.

The circuit pattern formed on the printed circuit board may include an input / output coupling circuit pattern coupling a signal between the input / output terminal and the resonance element.

The circuit pattern formed on the printed circuit board may include a notch circuit pattern that forms a coupling between the resonance elements that are not adjacent to each other.

In order to change the positions of the poles generated by the notch circuit while grounding the notch circuit, one or more via holes may be formed on the inner surface of the notch circuit pattern, the via holes being coated with a conductive metal.

The circuit pattern formed on the printed circuit board may include a low pass filter (LPF) circuit pattern.

The circuit pattern formed on the printed circuit board may include a coupler circuit pattern.

The circuit pattern formed on the printed circuit board may include at least one via hole coated with a conductive metal on the inner surface thereof in order to ground the circuit pattern.

The printed circuit board includes a conductive metal layer formed on the outer surface of the printed circuit board. The circuit pattern formed on the inner surface of the printed circuit board includes a plurality of via holes coated on the inner surface thereof with a conductive metal, A substrate integrated waveguide (SIW) circuit in which a separate waveguide is formed can be implemented.

A separate electronic component may be mounted on a surface of the circuit pattern formed on the inner surface of the printed circuit board by Surface Mounted Technology (SMT).

The printed circuit board may have a structure in which the circuit pattern is formed in a cross-sectional area on the inner surface of the printed circuit board, or the circuit pattern is formed on the inner surface of the printed circuit board and an additional circuit is inserted in the printed circuit board Layer structure.

The radio frequency filter of the present invention can control the frequency characteristics of the resonance element without using a structure such as a cable, a copper plate, a bar, a dumbbell shape, and a copper wire, which are conventionally applied to control the frequency characteristics of the resonance element, It is possible to achieve miniaturization and weight reduction. In addition, the RF filter of the present invention can be implemented in a printed circuit board constituting a housing, which has to be realized separately from the structure of the filter, thereby achieving miniaturization and weight reduction of the device including the filter. Further, the radio frequency filter of the present invention can be easily manufactured even at the time of manufacturing a filter having a relatively large size, and can be manufactured at a low cost, and the additional circuit is printed on the side cover surface, thereby facilitating the frequency tuning work.

1 shows a schematic structure of a radio frequency filter having a cavity structure according to the related art.
2 is a diagram illustrating a schematic structure of a radio frequency filter having a cavity structure according to an embodiment of the present invention.
3 is a diagram illustrating a schematic structure of a radio frequency filter having a cavity structure according to another embodiment of the present invention.
FIG. 4 is a view showing the radio frequency filter of FIG. 3 from another angle. FIG.
5 is a diagram for explaining a circuit pattern of a printed circuit board applied to a side cover in the radio frequency filter of FIG.
6 is a view illustrating a state where an input / output connector is connected to another circuit pattern of a printed circuit board applied to a side cover in a radio frequency filter having a cavity structure according to the present invention.
7 is a view illustrating another circuit pattern of a printed circuit board applied to a side cover in a radio frequency filter having a cavity structure according to the present invention.
FIG. 8 is a view illustrating another circuit pattern of a printed circuit board applied to a side cover in a radio frequency filter having a cavity structure according to the present invention.
9 to 16 are views illustrating various modifications to the circuit pattern of the printed circuit board applied to the side cover in the RF filter having the cavity structure according to the present invention.

Hereinafter, the present invention will be described in detail with reference to the drawings.

The RF filter 10 of the present invention is a frequency filter having a cavity structure including the housing 100 and the resonance element 200, as shown in FIGS.

In the RF filter 10 of the present invention, the housing 100 is generally formed in a rectangular parallelepiped shape. For example, the housing 100 includes a housing body 110 having one side opened and a side cover 120 may be coupled to each other. At this time, the housing main body 110 has a hollow (cavity) 150 partitioned by a plurality of partition portions 140, and is formed of metal, especially aluminum, and can be plated with silver if necessary. A plurality of resonance elements 200 are disposed in the plurality of hollows 150 provided in the housing main body 110.

The side cover 120 is formed of a printed circuit board (PCB) 500 having a conductive metal layer formed on a surface (hereinafter, referred to as 'inner surface' ) disposed on the hollow 150 side of the housing 100. The printed circuit board 500 includes a circuit pattern formed of a conductive metal on the inner surface thereof. This circuit pattern is for controlling the frequency characteristics of the resonant element 200 disposed in the hollow 150 of the housing 100 and can control the frequency characteristics according to the shape and size of the circuit pattern.

The housing 100 may have a structure in which a housing body 110 integrally formed on one side of the housing 100 and a side cover 120 covering the opened side of the housing 100 are coupled to each other. It may be formed by assembling the upper surface plate, the lower surface plate (bottom plate), and the four side plates. In this case, at least one of the upper surface plate, the lower surface plate (bottom plate), and the four side plates may be formed of a printed circuit board on which a circuit pattern is formed. In particular, it is preferable that the side plate is formed of a printed circuit board.

A plurality of resonance elements 200 are disposed in a plurality of hollows 150 formed inside the housing 100. To adjust the resonance frequency of the resonance elements 200, a tuning screw 300 is attached to the upper plate 130 And such a tuning screw 300 is fixed to the top plate portion 130 by a fixing nut 400. Here, the expression of side, top plate and the like is based on the direction in which the resonance element 200 arranged in the hollow 150 of the housing 100 is set up.

FIG. 2 shows a circuit pattern formed on the inner and outer surfaces of the printed circuit board at a time, and the illustration of the via hole is omitted. Fig. 3 shows the housing body and the resonant element disposed in the hollow thereof and also shows a circuit pattern formed on the outer surface of the printed circuit board. Fig. 4 is a diagram showing the RF filter of Fig. 3 at different angles, and shows a circuit pattern formed on the inner surface of a printed circuit board. Here, the inner surface of the printed circuit board 500 means a surface disposed on the hollow 150 side of the housing 100, and the outer surface of the printed circuit board 500 is located on the opposite side of the inner surface That is, a surface disposed on the outer side of the housing 100. As shown in FIGS. 2 and 3, the diaphragm 140 typically forms a window at the top so that electromagnetic waves can communicate between the adjacent hollows 150. The diaphragm 140 is also used in the present invention not only to form a window on top of the printed circuit board 500 when it is employed in the side plate or side cover 120, It is preferable to form a window on its side. In the figure, a frequency filter having a structure in which six resonance elements are arranged in a line is exemplified. It is apparent that a filter can be configured in various structures in addition to this.

5 illustrates a circuit pattern of a printed circuit board applied to a radio frequency filter according to an embodiment of the present invention. This circuit pattern is the same as that shown in Fig. 5, reference numerals are used to describe the circuit pattern of the printed circuit board 500. In FIG.

2 to 5, the printed circuit board 500 has a structure in which the conductive metal layer 520 is formed on the dielectric layer 510. The conductive metal layer 520 is not printed or laminated on the dielectric layer 510 of the printed circuit board 500 but partially formed on the dielectric layer 510. Thus, each of the conductive metal layers 520 is formed separately from each other by the dielectric layer 510. The conductive metal layer 520 serves as a circuit pattern for adjusting the frequency characteristics of the resonant element 200 disposed in the hollow 150 of the housing 100. Such a circuit pattern may be formed by printing a conductive metal on a substrate made of a dielectric material or by coating a conductive metal on the entire surface of the substrate made of a dielectric material and then etching the conductive metal layer in a region except for the circuit pattern.

Such a circuit pattern includes an input / output terminal 530. The input / output terminal 530 is directly connected to the input / output connector. 6 shows a structure in which the input / output connectors are directly connected to the input / output terminals. Accordingly, the input / output terminal 530 employed in the present invention corresponds to an SMD (Surface Mounted Device) type input / output terminal. 6, the plurality of small holes are the via holes described below, and the plurality of large holes are for screwing and fixing the side cover 120 made of the printed circuit board to the housing main body 110, Is not necessary when the housing body 110 is coupled to the housing body 110 by soldering. In order to be able to perform surface mounting of the input / output connector 530 or another electronic component on the input / output terminal 530 using Surface Mounting Technology (SMT) after completing the housing 100 of the frequency filter 10, 2, the side cover 120 may have an extra area where the inner surface of the side cover 120 is exposed to the outside even after the housing body 110 is covered. Output terminals or other electronic parts may be surface-mounted on such input / output terminals 530 even after the housing 100 is completed by connecting the side cover 120 to the housing main body 110 .

In the present invention, the circuit pattern of the printed circuit board 500 may further include an input / output coupling circuit pattern 540 that couples signals between the input / output terminal 530 and the resonant element 200. The input / output coupling circuit pattern 540 may have a structure connected to the input / output terminal 530 by a conductive metal or may have a structure separated by the dielectric layer 510. According to such a structure, the input / output terminal 530 and the input / The inductance and the capacitance formed between the resonance elements 200 are different. As shown in FIG. 2, the input / output coupling circuit pattern 540 is formed at a corresponding position so as to be coupled to the resonance element 200. The input / output coupling circuit pattern 540 can control the inductance and capacitance formed between the input / output terminal 530 and the resonant element 200 as described above by adjusting the distance, shape, and area with respect to the resonant element 200 This allows you to control the frequency characteristics of the filter. Thus, the radio frequency filter of the present invention can contribute to miniaturization and weight reduction of the filter because it is not necessary to use a copper wire which has been conventionally required for connecting the input / output connector to the resonance element.

The circuit pattern of the printed circuit board 500 may also include a notch circuit pattern 550 that forms a coupling between the resonant elements 200 that are not adjacent to each other. The notch circuit pattern 550 shown in the drawing is formed to electrically connect the resonance element 200 disposed in the cavity of the first stage and the resonance element 200 disposed in the cavity of the third stage. That is, coupling the signal between the resonance elements 200 of the cavity. The notch poles of the notch circuit pattern 550 vary depending on the line width and length of the notch circuit pattern 550. The longer the width and the length of the line, the more the pole is formed near the pass band. . Therefore, if the notch circuit pattern 550 is appropriately designed, desired frequency characteristics can be obtained.

On the other hand, as shown in Figs. 10, 11, 12, and 15, a via hole can be provided at the distal end of the notch circuit pattern 550. [ The via hole has a structure in which a conductive metal is coated on the inner surface thereof, and is grounded on the outer surface of the printed circuit board 500. As shown in FIGS. 2 and 3, a plurality of ground connection pads 595 are provided on the outer surface of the printed circuit board 500 at the edge region thereof for grounding at the outer surface of the printed circuit board 500. These ground connection pads 595 may be directly connected to ground lines or grounding means. The via hole provided in the notch circuit pattern 550 functions not only to ground the notch circuit pattern 550 but also to change the position of the pole generated by the notch circuit. Depending on the position at which such a via hole is installed, the position of the pole generated by the notch circuit can be changed below or above the pass band.

Meanwhile, in the conductive metal layer 520 of the printed circuit board 500, a plurality of via holes 580 are formed separately from the via holes of the notch circuit pattern 550 described above. The via hole 580 has a structure in which an inner surface thereof is coated with a conductive metal and is grounded at the outer surface of the printed circuit board 500 as mentioned above.

In the present invention, a circuit pattern formed on the inner surface of the printed circuit board 500 may display an area 590 in which a separate electronic component is mounted by a Surface Mounted Technology (SMT) method, Electronic parts can be mounted. 5 shows an example in which some electronic parts are mounted in a surface mounting technique manner over an input / output terminal 530 and an input / output coupling circuit pattern 540 which are separated by the dielectric layer 510. [ Here, the electronic component may be mounted so as to be directly connected to the input / output terminal 530 and the input / output coupling circuit pattern 540. 2 shows an example in which some electronic parts are mounted on the input / output terminal 530 in a surface mounting technique. Here, the electronic component is mounted so as to be directly connected to the input / output terminal 530. 9 shows an example in which electronic parts are mounted on the conductive metal layer 520 existing between the input / output terminal 530 and the input / output coupling circuit pattern 540, which are separated by the dielectric layer 510, by the surface mounting technique Respectively.

7 shows an example in which a low pass filter (LPF) circuit pattern 560 is formed on the inner surface of the printed circuit board 500. As shown in FIG. When an electromagnetic wave having a fundamental frequency component of a resonance element passes through a circuit or a system, an energy source corresponding to the multiple is generated. Thus, a multiple frequency component of a certain fundamental frequency is generally referred to as a harmonic. Since a conventional cavity filter does not have the ability to remove this harmonic component, a separate circuit for implementing the LPF in addition to the cavity filter must be added to the system. On the other hand, in the RF filter 10 of the present invention, the low-pass filter circuit pattern 560 is used to remove the harmonic component of the fundamental frequency component of the resonant element 200. [ The LPF circuit pattern 560 is implemented using a combination of inductance and capacitance as shown in FIG. 7, and can be appropriately designed to remove harmonics generated in the cavity filter by being directly printed on the input or output terminal. Although LPFs printed in a circuit pattern are illustrated in the drawings, the LPFs may be implemented using inductors or capacitor chips. Therefore, since the RF filter 10 of the present invention can implement the LPF in the cavity filter itself, a separate device for the LPF is not required, thereby making it possible to achieve miniaturization and weight reduction of the system.

FIG. 8 shows an example in which a coupler circuit pattern 570 is formed on the inner surface of the printed circuit board 500. The coupler has a function of detecting the intensity of the transmission / reception signal in the wireless communication system. The system including the conventional cavity filter includes a separate coupler provided separately from the cavity filter in order to detect the intensity of the transmission / reception signal of the cavity filter should. On the other hand, in the RF filter 10 of the present invention, the coupler circuit for detecting the intensity of the transmission and reception signals of the cavity filter is formed on the printed circuit board 550 as the side cover 120 constituting the housing 100 of the filter It can be directly implemented as a line at the input or output stage. Therefore, there is no need for a separate device for the coupler, which makes it possible to achieve miniaturization and weight reduction of the system.

In addition to the above examples, more various circuit patterns can be printed on the printed circuit board 500. 9 to 16 illustrate various modifications of the circuit pattern of the printed circuit board applied to the side cover in the radio frequency filter having the cavity structure according to the present invention. In other words, as described in detail below, a very wide variety of circuit patterns can be implemented on the printed circuit board 500 applied to the RF filter 10 of the present invention in order to adjust the frequency characteristics of the resonator.

The circuit pattern illustrated in Fig. 9 is substantially the same as that shown in Figs. However, the mounting positions of the electronic parts are only slightly different.

Compared with the circuit pattern shown in Fig. 9, the circuit pattern shown in Fig. 10 differs in that a via hole is further formed at both ends of the notch circuit patterns. The Chinese part is indicated by a thick circle line. Hereinafter, the same applies.

The circuit pattern shown in Fig. 11 differs from that shown in Fig. 9 in that a via hole is further formed at one end of one notch circuit pattern, and a circuit pattern largely printed below the other notch circuit pattern It is different in that it has. Such a large circuit pattern creates a pole that is different from the pole made by the notch circuit formed on it. Thus, such a large circuit pattern can be seen as another notch circuit pattern.

The circuit pattern shown in Fig. 12 differs from that shown in Fig. 9 in that the notch circuit pattern formed on one side is removed, and a via hole is added to one end of the other notch circuit pattern.

The circuit pattern shown in Fig. 13 differs from that of Fig. 9 in that the notch circuit pattern is composed of only one, and thus the patterns formed by the plurality of via holes are different. Also, the circuit pattern around the input / output coupling circuit pattern is slightly different although it is not indicated by a thick circle line.

The circuit pattern shown in Fig. 14 differs from that of Fig. 9 in that the bent circuit pattern formed in the periphery of one input / output coupling circuit pattern is changed to a straight structure in which a long circuit pattern is formed. Due to such a structural change, the input / output coupling circuit pattern has also changed slightly. This straight-line circuit pattern produces a pole that is different from the pole the notch circuit makes. Therefore, the circuit pattern of such a straight structure can be seen as another notch circuit pattern. Also, the circuit pattern around the other input / output coupling circuit pattern is slightly different although it is not indicated by a thick circle line.

The circuit pattern shown in Fig. 15 differs from that of Fig. 13 in that the positions where the via holes are formed in the notch circuit patterns are reversed, and the periphery of one input / output coupling circuit pattern is changed to a pattern as shown in Fig.

The circuit pattern shown in Fig. 16 differs from that of Fig. 9 in that the circuit pattern of the straight structure shown in Fig. 14 is implemented around the other input / output coupling circuit pattern.

Meanwhile, the RF filter 10 of the present invention can implement a substrate integrated waveguide (SIW) circuit on its printed circuit board 500. To this end, a conductive metal layer is also formed on the outer surface of the printed circuit board 500. In addition, a plurality of via holes 580 penetrating to the outer surface are formed on the inner surface of the printed circuit board 500 in a specific arrangement. As described above, the via hole 580 is coated with a conductive metal on its inner surface. According to this structure, a substrate integrated waveguide circuit in which a separate waveguide is formed through the dielectric between the conductive metal layers of the printed circuit board 500 is realized.

In the above description, the printed circuit board 500 has a structure in which the circuit pattern is formed on the inner surface of the printed circuit board 500 in a sectional area. However, if necessary, the printed circuit board 500 may include, Layer structure in which an additional circuit is inserted into the inside of the circuit board 500.

10: frequency filter 100: housing
110: housing body 120: side cover
130: upper plate part 140:
150: Cavity (hollow) 200: Resonant element
300: Tuning screw 400: Fixing nut
500: printed circuit board 510: dielectric layer
520: conductive metal layer 530: input / output terminal
540: I / O coupling circuit pattern 550: Notch circuit pattern
560: low-pass filter circuit pattern 570: combiner circuit pattern
580: via hole 590: electronic component surface mounting area display section
595: Ground connection pad

Claims (13)

delete delete delete 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
Wherein the circuit pattern formed on the printed circuit board includes an input / output terminal to which an input / output connector is directly connected. 5. The method of claim 4,
Wherein the circuit pattern formed on the printed circuit board includes an input / output coupling circuit pattern for coupling a signal between the input / output terminal and the resonance element. delete 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
Wherein the circuit pattern formed on the printed circuit board includes a notch circuit pattern forming a coupling between the resonance elements that are not adjacent to each other,
Wherein a notch circuit pattern is formed on the inner surface with at least one via hole coated with a conductive metal so as to change a position of a pole generated by the notch circuit while grounding the notch circuit. 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
Wherein the circuit pattern formed on the printed circuit board includes a low pass filter (LPF) circuit pattern. 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
Wherein the circuit pattern formed on the printed circuit board includes a coupler circuit pattern. delete 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
The printed circuit board includes a conductive metal layer formed on the outer surface of the printed circuit board. The circuit pattern formed on the inner surface of the printed circuit board includes a plurality of via holes coated on the inner surface thereof with a conductive metal, And a substrate integrated waveguide (SIW) circuit in which a separate waveguide is formed through the substrate is implemented. 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
Wherein a separate electronic component is mounted on a region of the circuit pattern formed on the inner surface of the printed circuit board by a surface mount technology (SMT) method. 1. A radio frequency filter having a cavity structure including a housing having a hollow therein and closing the hollow and at least one resonator element disposed in the hollow of the housing,
The at least one plate forming the housing is formed of a printed circuit board (PCB) having a conductive metal layer formed on a surface disposed on the hollow side of the housing (hereinafter referred to as an inner surface ) Includes a circuit pattern formed of a conductive metal on the inner surface,
The printed circuit board may have a structure in which the circuit pattern is formed in a cross-sectional area on the inner surface of the printed circuit board, or the circuit pattern is formed on the inner surface of the printed circuit board and an additional circuit is inserted in the printed circuit board Wherein the filter has a multi-layered structure.
KR1020160127450A 2016-10-04 2016-10-04 Wireless Frequency Filter KR101727066B1 (en)

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CN108258393A (en) * 2017-12-29 2018-07-06 中国电子科技集团公司第二十研究所 A kind of K-band minimizes millimeter wave T/R components
CN110770969A (en) * 2018-06-06 2020-02-07 深圳市大富科技股份有限公司 Signal filtering device and signal transceiving equipment
KR20210030242A (en) * 2019-09-09 2021-03-17 주식회사 알에프텍 Cavity filter and method of manufacturing the same
KR102320094B1 (en) 2021-07-15 2021-11-02 (주)웨이브텍 Cavity Type Wireless Frequency Filter Having Notch Structure
KR20230146232A (en) 2022-04-12 2023-10-19 모아컴코리아주식회사 Cavity Type Wireless Frequency Filter

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CN108258393A (en) * 2017-12-29 2018-07-06 中国电子科技集团公司第二十研究所 A kind of K-band minimizes millimeter wave T/R components
CN110770969A (en) * 2018-06-06 2020-02-07 深圳市大富科技股份有限公司 Signal filtering device and signal transceiving equipment
CN110770969B (en) * 2018-06-06 2021-12-03 大富科技(安徽)股份有限公司 Signal filtering device and signal transceiving equipment
KR20210030242A (en) * 2019-09-09 2021-03-17 주식회사 알에프텍 Cavity filter and method of manufacturing the same
KR102276190B1 (en) * 2019-09-09 2021-07-12 주식회사 알에프텍 Cavity filter and method of manufacturing the same
KR102320094B1 (en) 2021-07-15 2021-11-02 (주)웨이브텍 Cavity Type Wireless Frequency Filter Having Notch Structure
KR20230146232A (en) 2022-04-12 2023-10-19 모아컴코리아주식회사 Cavity Type Wireless Frequency Filter
KR102633777B1 (en) 2022-04-12 2024-02-05 모아컴코리아주식회사 Cavity Type Wireless Frequency Filter

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