KR102426614B1 - Display device - Google Patents

Abstract

The display device includes a display panel and a touch sensing unit disposed on the display panel, wherein the touch sensing unit is disposed on a first conductive pattern disposed on the display panel, an insulating layer covering the first conductive pattern, and the insulating layer, A portion includes a second conductive pattern crossing the first conductive pattern. The thickness of the first conductive pattern is smaller than the thickness of the second conductive pattern.

Description

display device {DISPLAY DEVICE}

The present invention relates to a display device, and more particularly, to a display device in which a crack occurrence rate of an insulating layer included in a touch sensing unit is reduced.

In the information society, the importance of a display device as a visual information delivery medium is emerging. Currently known display devices include a liquid crystal display (LCD), a plasma display panel (PDP), an organic light emitting display (OLED), and a field effect display. : FED), and an electrophoretic display (EPD).

The display device is activated by receiving an electrical signal. The display device includes a touch screen that senses a touch applied from the outside of a display panel that displays an image.

The display device may include various electrode patterns to be activated by an electrical signal. The region in which the electrode patterns are activated responds to a touch applied from the outside or displayed information.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display device in which a crack occurrence rate of an insulating layer included in a touch sensing unit is reduced.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display device in which a short defect rate of a touch sensing unit is reduced.

An embodiment of the present invention includes a display panel and a touch sensing unit disposed on the display panel, wherein the touch sensing unit includes a first conductive pattern disposed on the display panel, an insulating layer covering the first conductive pattern, and an insulating layer Provided is a display device including a second conductive pattern disposed on the upper surface and partially intersecting the first conductive pattern, wherein the thickness of the first conductive pattern is smaller than the thickness of the second conductive pattern.

The first conductive pattern and the insulating layer are directly disposed on the thin film encapsulation layer of the display panel, the insulating layer is disposed on the first conductive pattern and spaced apart from the thin film encapsulation layer, the second part is in contact with the thin film encapsulation layer; and a third part connecting the first part and the second part.

The thickness of the first conductive pattern may be smaller than the thickness of the insulating layer.

The thickness of the first conductive pattern may be 1800 Å or more and 2100 Å or less, and the thickness of the second conductive pattern may be 2700 Å or more and 3500 Å or less.

The first conductive pattern includes a first conductive layer disposed on the display panel, a second conductive layer disposed on the first conductive layer, and a third conductive layer disposed on the second conductive layer, the second conductive layer comprising: The electrical resistivity may be smaller than that of the first conductive layer and the third conductive layer, and the thickness of the second conductive layer may be greater than the thickness of the first conductive layer and the thickness of the third conductive layer.

A thickness of the third conductive layer may be greater than a thickness of the first conductive pattern.

The thickness of the third conductive layer may be 1.5 times or more and 3 times or less the thickness of the first conductive pattern.

The thickness of the first conductive layer may be 50 Å to 200 Å, the thickness of the second conductive layer may be 1000 Å to 1800 Å, and the thickness of the third conductive layer may be 250 Å to 350 Å.

Each of the first conductive layer and the third conductive layer may include Ti, and the second conductive layer may include Al.

The second conductive pattern includes a fourth conductive layer disposed on the insulating layer, a fifth conductive layer disposed on the fourth conductive layer, and a sixth conductive layer disposed on the fifth conductive layer, the fifth conductive layer comprising: An electrical resistivity may be smaller than that of the fourth conductive layer and the sixth conductive layer, and the thickness of the fifth conductive layer may be greater than that of the fourth conductive layer and the thickness of the sixth conductive layer.

The thickness of the second conductive layer may be smaller than the thickness of the fifth conductive layer.

The thickness of the first conductive layer may be smaller than the thickness of the fourth conductive layer.

The thickness of the fourth conductive layer may be 250 Å to 350 Å, the thickness of the fifth conductive layer may be 2200 Å to 2800 Å, and the thickness of the sixth conductive layer may be 250 Å to 350 Å.

Each of the fourth conductive layer and the sixth conductive layer may include Ti, and the fifth conductive layer may include Al.

The second conductive pattern may include first connection parts, first touch sensor parts connected by the first connection parts, and second touch sensor parts spaced apart from the first touch sensor parts.

The first conductive pattern may include second connection parts connecting the second touch sensor parts, and the second connection parts may cross the first connection parts.

The first conductive pattern includes second connection parts connecting the second touch sensor parts, and the first touch sensor parts and the second touch sensor parts each include a plurality of mesh lines defining a plurality of mesh holes, and a second The connection parts may cross mesh lines of the first touch sensor units and mesh lines of the second touch sensor units.

The second connecting portions may not intersect the first connecting portions.

The first conductive pattern may include second connection parts connecting the second touch sensor parts, a contact hole is defined in an insulating layer, and the second connection parts connect the second touch sensor parts through the contact hole.

The display panel may include a base layer, a circuit layer disposed on the base layer, an organic light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the organic light emitting device layer.

According to the display device according to an embodiment of the present invention, the crack occurrence rate of the insulating layer included in the touch sensing unit is reduced, and as a result, a short defect of the touch sensing unit due to the crack generation can be improved.

1A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment.
1B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment.
1C is a perspective view illustrating a third operation of a display device according to an exemplary embodiment.
2 is a cross-sectional view of a display device according to an exemplary embodiment.
3A and 3B are perspective views of a display device according to an exemplary embodiment.
4A and 4B are perspective views of a display device according to an exemplary embodiment.
5A is a plan view of a display panel included in a display device according to an exemplary embodiment.
5B is a cross-sectional view of a display module included in a display device according to an exemplary embodiment.
6A is an equivalent circuit diagram of a pixel included in a display device according to an exemplary embodiment.
6B is a partial cross-sectional view of a display panel included in a display device according to an exemplary embodiment.
6C is a partial cross-sectional view of a display panel included in a display device according to an exemplary embodiment.
7A to 7C are cross-sectional views of a thin film encapsulation layer included in a display device according to an exemplary embodiment.
8A is a cross-sectional view of a touch sensing unit included in a display device according to an exemplary embodiment.
8B to 8E are plan views of a touch sensing unit included in a display device according to an exemplary embodiment.
FIG. 8F is a partially enlarged view of area A1 of FIG. 8B .
FIG. 9 is a partially enlarged view of area A2 of FIG. 8B .
10A and 10B are schematic cross-sectional views corresponding to the line I-I' of FIG. 9 .
11 is a schematic cross-sectional view of a touch sensing unit included in a conventional display device.
12A to 12D are plan views of a touch sensing unit included in a display device according to an exemplary embodiment.
13A to 13C are partially enlarged views of area A3 of FIG. 12A .
14 is a schematic cross-sectional view corresponding to the line II-II' of FIG. 13C.
15 is a partial cross-sectional view of a touch sensing unit included in a display device according to an exemplary embodiment.
16 is a cross-sectional view of a touch sensing unit included in a display device according to an exemplary embodiment.

The above objects, other objects, features and advantages of the present invention will be easily understood through the following preferred embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed subject matter may be thorough and complete, and that the spirit of the present invention may be sufficiently conveyed to those skilled in the art.

In describing each figure, like reference numerals have been used for like elements. In the accompanying drawings, the dimensions of the structures are enlarged than the actual size for clarity of the present invention. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof. Also, when a part of a layer, film, region, plate, etc. is said to be “on” another part, this includes not only cases where it is “directly on” another part, but also cases where another part is in between. Conversely, when a part, such as a layer, film, region, plate, etc., is "under" another part, this includes not only cases where it is "directly under" another part, but also cases where there is another part in between.

Hereinafter, a display device according to an embodiment of the present invention will be described.

1A is a perspective view illustrating a first operation of a display device DD according to an exemplary embodiment. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment. 1C is a perspective view illustrating a third operation of the display device DD according to an exemplary embodiment.

As shown in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to a surface defined by the first direction axis DR1 and the second direction axis DR2 . The third direction axis DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. A front surface (or an upper surface) and a rear surface (or a lower surface) of each member are divided by the third direction axis DR3 . However, the directions indicated by the first to third direction axes DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third direction axes DR1 , DR2 , and DR3 , respectively.

1A to 1C illustrate a foldable display device as an example of a flexible display device DD. However, the present invention may be a rollable display device that is rolled or a bent display device, and is not particularly limited. Also, although the flexible display device is illustrated in the present embodiment, the present invention is not limited thereto. The display device DD according to the present exemplary embodiment may be a flat rigid display device. The flexible display device DD according to the present invention may be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game machines, and smart watches.

As illustrated in FIG. 1A , the display surface IS of the flexible display device DD may include a plurality of regions. The flexible display device DD includes a display area DD-DA in which an image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which an image is not displayed. 1A shows a vase as an example of the image IM. As an example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the present invention is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be relatively designed.

1A to 1C , the display device DD may include a plurality of regions defined according to an operation type. The display device DD includes the bending area BA, the first non-bending area NBA1, and the second non-bending area NBA2 that are bent on the basis of the bending axis BX. may include As illustrated in FIG. 1B , the display device DD is inner bent so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As illustrated in FIG. 1C , the display device DD may be outwardly bent so that the display surface IS is exposed to the outside.

Although only one bending area BA is illustrated in FIGS. 1A to 1C , the present invention is not limited thereto. For example, in an embodiment of the present invention, the display device DD may include a plurality of bending areas BA. In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes illustrated in FIGS. 1A and 1B . However, the present invention is not limited thereto, and the bending area BA may be defined to correspond to a shape in which the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C , the bending area BA may be defined in parallel to the first direction axis DR1 or may be defined in a diagonal direction. The area of the bending area BA is not fixed and may be determined according to a radius of curvature.

2 is a cross-sectional view of a display device DD according to an exemplary embodiment. 2 illustrates a cross-section defined by the second direction axis DR2 and the third direction axis DR3.

As shown in FIG. 2 , the display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, and a second adhesive member (AM1). AM2), and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, the second adhesive member AM2 couples the display module DM and the optical member LM, and the third adhesive member (AM3) combines the optical member (LM) and the window (WM). If necessary, at least one of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 may be omitted.

The protective film PM protects the display module DM. The protective film PM provides the first outer surface OS-L exposed to the outside, and provides an adhesive surface that is adhered to the first adhesive member AM1 . The protective film PM may serve to prevent external moisture from penetrating into the display module DM and to absorb external shocks.

The protective film PM may include a plastic film as a base substrate. Protective film (PM) is polyethersulfone (PES, polyethersulfone), polyacrylate (polyacrylate), polyetherimide (PEI, polyetherimide), polyethylene naphthalate (PEN, polyethylenenaphthalate), polyethylene terephthalate (PET, polyethyleneterephthalate), poly phenylene sulfide (PPS, polyphenylene sulfide), polyarylate (polyarylate), polyimide (PI, polyimide), polycarbonate (PC, polycarbonate), poly(arylene ethersulfone), and combinations thereof It may include a plastic film comprising any one selected from the group consisting of.

The material constituting the protective film PM is not limited to plastic resins, and may include an organic/inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In an embodiment of the present invention, the protective film PM may be omitted.

The window WM may protect the display module DM from external impact and may provide an input surface to the user. The window WM provides the second outer surface OS-U exposed to the outside, and provides an adhesive surface that is adhered to the second adhesive member AM2 . The display surface IS illustrated in FIGS. 1A to 1C may be the second outer surface OS-U.

The window WM may include a plastic film. The window WM may have a multi-layered structure. The window WM may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window WM may further include a bezel pattern. The multi-layer structure may be formed through a continuous process or an adhesion process using an adhesive layer.

The optical member LM reduces external light reflectance. The optical member LM may include at least a polarizing film. The optical member LM may further include a retardation film. In an embodiment of the present invention, the optical member LM may be omitted.

The display module DM may include a display panel DP and a touch sensing unit TS. The touch sensing unit TS may be directly disposed on the display panel DP. As used herein, "directly disposed" means that it is formed by a continuous process, except for attachment using a separate adhesive layer. However, the present invention is not limited thereto, and other layers such as an adhesive layer and a substrate may be interposed between the display panel DP and the touch sensing unit TS.

Hereinafter, it has been described that the display panel DP is an organic light emitting display panel DP as an example, but the present invention is not limited thereto, and the display panel DP includes a liquid crystal display panel and a plasma display panel. display panel), an electrophoretic display panel, a MEMS display panel (microelectromechanical system display panel), and an electrowetting display panel.

The organic light emitting display panel DP generates an image IM (refer to FIG. 1A ) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing in the thickness direction DR3.

The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may sense an external input in a capacitive manner.

Although not shown separately, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a stacked structure of a conductive layer/insulating layer/conductive layer. The antireflection layer absorbs or destructively interferes with or polarizes light incident from the outside to reduce the reflectance of external light. The anti-reflection layer may replace the function of the optical member LM.

Each of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 is an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). Alternatively, it may be an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as polyurethane, polyacrylic, polyester, polyepoxy, or polyvinyl acetate.

Although not shown separately, the display device DD may further include a frame structure supporting the functional layers to maintain the state illustrated in FIGS. 1A to 1C . The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of a display device DD-1 according to an exemplary embodiment. FIG. 3A illustrates the display device DD-1 in an unfolded state, and FIG. 3B illustrates the display device DD-1 in a bent state.

The display device DD-1 may include one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD-1 may be bent. However, in an embodiment of the present invention, the bending area of the display device DD-1 may be changed.

Unlike the display device DD illustrated in FIGS. 1A to 1C , the display device DD-1 according to the present exemplary embodiment may be fixed in a single shape to operate. The display device DD-1 may operate in a bent state as illustrated in FIG. 3B . The display device DD-1 may be fixed to a frame or the like in a bent state, and the frame may be coupled to a housing of the electronic device.

The display device DD-1 according to the present exemplary embodiment may have the same cross-sectional structure as shown in FIG. 2 . However, the non-bending area NBA and the bending area BA may have different stacked structures. The non-bending area NBA may have the same cross-sectional structure as shown in FIG. 2 , and the bending area BA may have a different cross-sectional structure from that illustrated in FIG. 2 . The optical member LM and the window WM may not be disposed in the bending area BA. That is, the optical member LM and the window WM may be disposed only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may also not be disposed in the bending area BA.

4A is a perspective view of a display device DD-2 according to an exemplary embodiment.

The display device DD-2 includes a non-bending area (NBA, or planar area) in which the main image is displayed on the front side and a bending area (BA, or a side area) in which the sub image is displayed on the side. Although not shown separately, the sub-image may include an icon providing predetermined information. In the present exemplary embodiment, the terms “non-bending area NBA and bending area BA” define the display device DD-2 as a plurality of areas divided by shapes.

The bending area BA bent from the non-bending area NBA is a fourth direction axis DR4 intersecting the first direction axis DR1 , the second direction axis DR2 , and the third direction axis DR3 . Display the sub image. However, the directions indicated by the first to fourth direction axes DR1 to DR4 are relative concepts and may be converted into other directions.

4B is a perspective view of a display device DD-3 according to an exemplary embodiment.

The display device DD-3 includes a non-bending area NBA in which the main image is displayed on the front side, and a first bending area BA1 and a second bending area BA2 in which the sub image is displayed on the side surface. The first bending area BA1 and the second bending area BA2 may be bent from both sides of the non-bending area NBA.

5A is a plan view of an organic light emitting display panel DP included in a display device according to an embodiment of the present invention, and FIG. 5B is a cross-sectional view of a display module DM included in the display device according to an embodiment of the present invention. to be. For example, FIG. 5B may illustrate a portion of a cross section in a plane parallel to a plane defined by the second direction DR2 and the third direction DR3 .

As shown in FIG. 5A , the organic light emitting display panel DP includes a display area DA and a non-display area NDA in a plan view. The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (refer to FIG. 1A ) and the non-display area DD-NDA of the display device DD (refer to FIG. 1A ). , respectively, see FIG. 1A ). The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (refer to FIG. 1A ) and the non-display area DD-NDA of the display device DD (refer to FIG. 1A ). , see FIG. 1A ), and may be changed according to the structure/design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of pixels PX. An area in which the plurality of pixels PX are disposed is defined as the display area DA. In the present exemplary embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The organic light emitting display panel DP includes gate lines GL, data lines DL, emission lines EL, control signal line SL-D, initialization voltage line SL-Vint, and voltage line EL. SL-VDD), and a pad part PD.

The gate lines GL are respectively connected to a corresponding pixel PX of the plurality of pixels PX, and the data lines DL are respectively connected to a corresponding pixel PX of the plurality of pixels PX. do. Each of the light emitting lines EL may be arranged in parallel with a corresponding one of the gate lines GL. The control signal line SL-D may provide control signals to the gate driving circuit GDC. The initialization voltage line SL-Vint may provide an initialization voltage to the plurality of pixels PX. The voltage line SL-VDD is connected to the plurality of pixels PX and may provide a first voltage to the plurality of pixels PX. The voltage line SL-VDD may include a plurality of lines extending in the first direction DR1 and a plurality of lines extending in the second direction DR2 .

A gate driving circuit GDC to which the gate lines GL and the light emitting lines EL are connected may be disposed on one side of the non-display area NDA. Some of the gate lines GL, the data lines DL, the light emitting lines EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line are disposed on the same layer, Some are placed on different floors.

The pad part PD may be connected to ends of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD. As illustrated in FIG. 5B , the organic light emitting display panel DP includes a base layer SUB, a circuit layer DP-CL disposed on the base layer SUB, and a circuit layer CP-CL disposed on the circuit layer CP-CL. It may include an organic light emitting device layer (DP-OLED) and a thin film encapsulation layer (TFE) disposed on the organic light emitting device layer (DP-OLED).

The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite substrate. The plastic substrate is at least any one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin may include.

The circuit layer DP-CL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL may constitute signal lines or a control circuit of a pixel.

The organic light emitting device layer DP-OLED includes organic light emitting diodes.

The thin film encapsulation layer TFE encapsulates the organic light emitting device layer DP-OLED. The thin film encapsulation layer (TFE) includes an inorganic thin film and an organic thin film. The thin film encapsulation layer TFE may include at least two inorganic layers and an organic layer disposed therebetween. The inorganic thin film protects the organic light emitting device layer (DP-OLED) from moisture/oxygen, and the organic thin film protects the organic light emitting device layer (DP-OLED) from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include, but is not limited to, an acrylic-based organic layer. In the present invention, the touch sensing unit TS may provide uniform sensitivity by adjusting the thickness of the organic thin film. This will be described in detail later.

The touch sensing unit TS may be directly disposed on the thin film encapsulation layer TFE. However, the present invention is not limited thereto, and the inorganic layer may be disposed on the encapsulation layer TFE, and the touch sensing unit TS may be disposed on the inorganic layer. The inorganic layer may be a buffer layer. The inorganic layer may be at least one of a silicon nitride layer, a silicon oxy nitride layer, and a silicon oxide layer. However, this is illustrative and the embodiment is not limited thereto. Although the inorganic layer has been described as a separate configuration, the inorganic layer may be a configuration included in the encapsulation layer (TFE).

The touch sensing unit TS includes touch sensors and touch signal lines. The touch sensors and the touch signal lines may have a single-layer or multi-layer structure.

The touch sensors and the touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and graphene. The touch sensors and the touch signal lines may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensors and the touch signal lines may have the same layer structure or different layer structures. Details of the touch sensing unit TS will be described later.

6A is an equivalent circuit diagram of a pixel PX included in a display device according to an exemplary embodiment.

6A exemplarily illustrates the i-th pixel PXi connected to the k-th data line DLk among the plurality of data lines DL.

The i-th pixel PXi includes an organic light emitting diode OLED and a pixel driving circuit for controlling the organic light emitting diode. The driving circuit may include seven thin film transistors T1 to T7 and one storage capacitor Cst. Although the pixel driving circuit including seven thin film transistors T1 to T7 and one capacitor Cst is illustrated as an example, the pixel PXi is a driving circuit for driving the organic light emitting diode OLED. It is sufficient to include a transistor (T1, or driving transistor), a second transistor (T2, or switching transistor), and a capacitor (Cst), and the pixel driving circuit may be variously modified.

The driving transistor controls the driving current supplied to the organic light emitting diode (OLED). The output electrode of the second transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second transistor T2 may be in direct contact with the anode of the organic light emitting diode OLED or may be connected via another transistor (the sixth transistor T6 in this embodiment).

A control electrode of the control transistor may receive a control signal. The control signal applied to the i-th pixel PXi includes an i-1 th gate signal Si-1, an i-th gate signal Si, an i+1-th gate signal Si+1, a data signal Dk, and an i-th emission control signal Ei. In an embodiment of the present invention, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the i-th gate line GLi, and an output electrode connected to the output electrode of the second transistor T2 . do. The first transistor T1 is turned on by the gate signal Si applied to the i-th gate line GLi (hereinafter, the i-th gate signal), and the data signal Dk applied to the k-th data line DLk. is provided to the storage capacitor (Cst).

6B is a partial cross-sectional view of a display panel included in a display device according to an exemplary embodiment. 6C is a partial cross-sectional view of a display panel included in a display device according to an exemplary embodiment. Specifically, FIG. 6B is a cross-sectional view of a portion corresponding to the first transistor T1 of the equivalent circuit shown in FIG. 6A . FIG. 6C is a cross-sectional view of a portion corresponding to the second transistor T2, the sixth transistor T6, and the organic light emitting diode (OLED) of the equivalent circuit shown in FIG. 6A .

6B and 6C , a first transistor T1 , a second transistor T2 , and a sixth transistor T6 are disposed on the base substrate SUB. Since the transistors have substantially the same structure, the configuration of the first transistor T1 will be described below, and the configuration of the second and sixth transistors T2 and T6 will be omitted.

A top surface of the base substrate SUB is defined in a first direction DR1 and a second direction DR2 . The first transistor T1 includes a first input electrode DE1 , a first output electrode SE1 , a first control electrode GE1 , and a first oxide semiconductor pattern OSP1 .

A buffer layer BFL may be disposed on the upper surface of the base substrate SUB. The buffer layer BFL improves bonding strength between the base substrate SUB and the conductive patterns or semiconductor patterns. The buffer layer BFL may include an inorganic layer. Although not shown separately, a barrier layer that prevents foreign substances from being introduced may be further disposed on the upper surface of the base substrate SUB. The buffer layer BFL and the barrier layer may be selectively disposed or omitted.

The base substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or the like. The plastic substrate is at least any one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin may include.

A first oxide semiconductor pattern OSP1 is disposed on the buffer layer BFL. The first oxide semiconductor pattern OSP1 may include indium-tin oxide (ITO), indium-gallium-zinc oxide (IGZO), zinc oxide (ZnO), indium-zinc oxide (IZnO), or the like.

A first insulating layer 10 covering the first oxide semiconductor pattern OSP1 is disposed on the buffer layer BFL.

A first control electrode GE1 is disposed on the first insulating layer 10 , and a second insulating layer 20 covering the first control electrode GE1 is disposed on the first insulating layer 10 . The second insulating layer 20 may provide a flat top surface. The second insulating layer 30 may include an organic material and/or an inorganic material.

The first insulating layer 10 and the second insulating layer 20 may include an inorganic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

Meanwhile, the first and second contact holes CH1 and CH2 exposing the first and second regions of the first oxide semiconductor pattern OSP1 are formed in the first and second insulating layers 10 and 20 . is defined in Each of the first contact hole CH1 and the second contact hole CH2 passes through the first insulating layer 10 and the second insulating layer 20 .

The first input electrode DE1 and the first output electrode SE1 are disposed on the second insulating layer 20 . The first input electrode DE1 and the first output electrode SE1 are connected to the first region and the second region of the first oxide semiconductor pattern OSP1 through the first contact hole CH1 and the second contact hole CH2. each is connected

A third insulating layer 30 covering the first input electrode DE1 and the first output electrode SE1 is disposed on the second insulating layer 20 . The third insulating layer 30 may provide a flat top surface. The third insulating layer 30 may include an organic material and/or an inorganic material. That is, the third insulating layer 30 may cover the input electrodes and the output electrodes.

FIG. 6C exemplarily illustrates a sixth transistor T6 having substantially the same structure as that of the second transistor T2. However, the structure of the sixth transistor T6 may be modified. The input electrode DE6 of the sixth transistor T6 is connected to the output electrode SE2 of the second transistor T2 on the third insulating layer 30 .

A pixel defining layer PDL and an organic light emitting diode OLED are disposed on the third insulating layer 30 . An anode AE is disposed on the third insulating layer 30 . The anode AE is connected to the sixth output electrode SE6 of the sixth transistor T6 through the seventh contact hole CH7 penetrating the third insulating layer 30 . An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the anode AE.

The pixel PX may be disposed in the pixel area on the plane of the organic light emitting display panel DP. The pixel area may include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA may be disposed to surround the light emission area PXA. In the present embodiment, the light emitting area PXA is defined to correspond to the anode AE. However, the light emitting area PXA is not limited thereto, and it is sufficient if the light emitting area PXA is defined as an area in which light is generated. The emission area PXA may be defined to correspond to a partial area of the anode AE exposed by the opening OP.

The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-emission area NPXA. Although not shown separately, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX.

An organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML may be disposed only in a region corresponding to the opening OP. That is, the organic light emitting layer EML may be formed separately in each of the plurality of pixels PX.

An electronic control layer (ECL) is disposed on the organic light emitting layer (EML). A cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

A thin film encapsulation layer TFE is disposed on the cathode CE. The thin film encapsulation layer TFE is commonly disposed on the plurality of pixels PX. The thin film encapsulation layer TFE includes at least one inorganic layer and at least one organic layer. The thin film encapsulation layer TFE may include a plurality of inorganic layers and a plurality of organic layers that are alternately stacked.

Although the patterned organic light emitting layer EML is illustrated as an example in this embodiment, the organic light emitting layer EML may be commonly disposed on the plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. Also, the organic light emitting layer EML may have a multi-layered structure.

In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In an embodiment of the present invention, a capping layer covering the cathode CE may be further disposed. In this case, the thin film encapsulation layer TFE may directly cover the capping layer.

7A to 7C are cross-sectional views of a thin film encapsulation layer included in a display device according to an exemplary embodiment. Hereinafter, the thin film encapsulation layer will be described with reference to FIGS. 7A to 7C .

As shown in FIG. 7A , the thin film encapsulation layer TFE1 may include n inorganic thin films IOL1 to IOLn including the first inorganic thin film IOL1 disposed on the cathode CE (refer to FIG. 8B ). have. Also, the first inorganic thin film IOL1 may be disposed in direct contact with the cathode CE ( FIG. 6C ). The first inorganic thin film IOL1 may be defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film IOL1 among the n inorganic thin films IOL1 to IOLn may be defined as upper inorganic thin films.

The thin film encapsulation layer TFE1 includes n-1 organic thin films OL1 to OLn, and the n-1 organic thin films OL1 to OLn are alternately disposed with n inorganic thin films IOL1 to IOLn. can be The n-1 organic thin films OL1 to OLn may have a thickness greater than that of the n inorganic thin films IOL1 to IOLn on average.

Each of the n inorganic thin films IOL1 to IOLn may be a single layer including one material or may have a multilayer each including a different material. Each of the n-1 organic thin films OL1 to OLn may be formed by providing organic monomers. For example, each of the n-1 organic thin films OL1 to OLn may be formed using an inkjet printing method or may be formed by coating a composition including an acrylic monomer. In an embodiment of the present invention, the thin film encapsulation layer TFE1 may further include an n-th organic thin film.

7B and 7C , the inorganic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may have the same or different inorganic materials, and may have the same or different thicknesses. The organic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may have the same or different organic materials, and may have the same or different thicknesses.

As shown in FIG. 7B , the thin film encapsulation layer TFE2 is a sequentially stacked first inorganic thin film IOL1 , a first organic thin film OL1 , a second inorganic thin film IOL2 , and a second organic thin film OL2 . , and a third inorganic thin film IOL3.

The first inorganic thin film IOL1 may have a two-layer structure. The first sub-layer S1 and the second sub-layer S2 may include different inorganic materials.

As illustrated in FIG. 7C , the thin film encapsulation layer TFE3 may include a first inorganic thin film IOL10 , a first organic thin film OL1 , and a second inorganic thin film IOL20 that are sequentially stacked. The first inorganic thin film IOL10 may have a two-layer structure. The first sub-layer S10 and the second sub-layer S20 may include different inorganic materials. The second inorganic thin film IOL20 may have a two-layer structure. The second inorganic thin film IOL20 may include a first sub-layer S100 and a second sub-layer S200 deposited in different deposition environments. The first sub-layer S100 may be deposited under a low-power condition, and the second sub-layer S200 may be deposited under a high-power condition. The first sub-layer S100 and the second sub-layer S200 may include the same inorganic material.

8A is a cross-sectional view of a touch sensing unit included in a display device according to an exemplary embodiment. 8B to 8E are plan views of a touch sensing unit included in a display device according to an exemplary embodiment.

As illustrated in FIG. 8A , the touch sensing unit TS includes a first conductive pattern TS-CP1, a first insulating layer TS-IL1 (hereinafter, referred to as a first touch insulating layer), and a second conductive pattern TS-CP2. ), and a second insulating layer (TS-IL2, hereinafter referred to as a second touch insulating layer). The first conductive pattern TS-CP1 may be directly disposed on the thin film encapsulation layer TFE. However, the present invention is not limited thereto, and another inorganic layer (eg, a buffer layer) may be further disposed between the first conductive pattern TS-CP1 and the thin film encapsulation layer TFE.

If necessary, the second insulating layer TS-IL2 may be omitted. A portion of the second conductive pattern TS-CP2 intersects the first conductive pattern TS-CP1. A portion of the second conductive pattern TS-CP2 insulates and crosses the first conductive pattern TS-CP1 with the first touch insulating layer TS-IL1 interposed therebetween.

Each of the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2 may have a single-layer structure or a multi-layer structure stacked along the third direction axis DR3 .

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic material or an organic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, or silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin can do.

For the first touch insulating layer TS-IL1 , it is sufficient to insulate the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2 , and the shape thereof is not limited. The first touch insulating layer TS-IL1 may entirely cover the thin film encapsulation layer TFE or may include a plurality of insulating patterns. It is sufficient if the plurality of insulating patterns overlap the first connection parts BR1 or the second connection parts BR2 to be described later.

Although the two-layer type touch sensing unit is exemplarily illustrated in this embodiment, it is not limited thereto. The single-layered touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and touch signal lines connected to the touch sensors. The tomographic touch sensing unit may acquire coordinate information in a self-cap method.

As illustrated in FIG. 8B , the touch sensing unit TS includes first touch electrodes TE1 and second touch electrodes TE2 . The first touch electrodes TE1 include the first connection parts BR1 , the first touch sensor parts SP1 connected by the first connection parts BR1 , and a first touch signal connected to the first touch sensor parts SP1 . lines SL1 are included. The second touch electrodes TE2 include the second connection parts BR2 , the second touch sensor parts SP2 connected by the second connection parts BR2 , and a second touch signal connected to the second touch sensor parts SP2 . lines SL2. In addition, connection electrodes TSD are formed between the first touch electrodes TE1 and the second touch signal lines SL1 and between the second touch signal lines SL2 connected to the second touch electrodes TE2 . can be placed. The connection electrodes TSD may be connected to ends of each of the first touch electrodes TE1 and the second touch electrodes TE2 to transmit signals. In another embodiment of the present invention, the connection electrodes TSD may be omitted.

The first touch sensor units SP1 may be arranged in the first direction DR1 , and the second touch sensor units SP2 may be arranged in the second direction DR2 . The first touch sensor units SP1 and the second touch sensor units SP2 are spaced apart from each other.

The first touch electrodes TE1 may extend in the first direction DR1 and may be spaced apart from each other in the second direction DR2 . The second touch electrodes TE2 may extend in the second direction DR2 and may be spaced apart from each other in the first direction DR1 .

Each of the first connection parts BR1 connects two adjacent first touch sensor parts SP1 among the first touch sensor parts SP1. Each of the second connection parts BR2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2 . In FIG. 8B , some of the first connection parts BR1 and the second connection parts BR2 are shown in bold for better understanding.

The touch sensing unit TS may further include touch pad units TS-PD. Each of the first touch signal lines SL1 and the second touch signal lines SL2 may be connected to a corresponding one of the touch pad units TS-PD.

The first touch sensor units SP1 and the second touch sensor units SP2 are electrostatically coupled. As touch sensing signals are applied to the first touch sensor units SP1 , capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2 .

Hereinafter, the touch sensing unit TS will be described in more detail with reference to FIGS. 8C and 8E .

As illustrated in FIG. 8C , the first conductive pattern TS-CP1 may include the second connection parts BR2 . The second connection parts BR2 may be formed by directly patterning on the thin film encapsulation layer TFE of the organic light emitting display panel DP. That is, the first conductive pattern TS-CP1 may be directly disposed on the thin film encapsulation layer TFE of the organic light emitting display panel DP.

A first touch insulating layer TS-IL1 is disposed on the first conductive pattern TS-CP1. The first touch insulating layer TS-IL1 may be directly disposed on the thin film encapsulation layer TFE of the organic light emitting display panel CP and cover each of the second connection parts BR2 . As illustrated in FIG. 8D , a plurality of contact holes CH partially exposing the second connection parts BR2 may be defined in the first touch insulating layer TS-IL1 . Contact holes CH may be formed by a photolithography process. The second connection parts BR2 of the first conductive pattern TS-CP1 and the second touch sensor parts SP2 are electrically connected through the contact holes CH.

Referring to FIG. 8E , the second conductive pattern TS-CP2 is disposed on the first touch insulating layer TS-IL1 and is connected to It may include first touch sensor units SP1 and second touch sensor units SP2 spaced apart from the first touch sensor units. As described above, the second touch sensor units SP2 are electrically connected through a contact hole defined in the first connection parts BR1 of the first conductive pattern TS-CP1 and the first touch insulating layer TS-IL1. can be connected to

FIG. 8F is a partially enlarged view of area A1 of FIG. 8B . FIG. 9 is a partially enlarged view of area A2 of FIG. 8B .

8F and 9 , each of the first touch sensor units SP1 and the second touch sensor units SP2 includes a plurality of mesh lines ML defining a plurality of mesh holes MH. can A line width of each of the mesh lines ML may be several micrometers. Each of the first touch sensor units SP1 and the second touch sensor units SP2 may have a mesh shape. Although not specifically illustrated, the first touch signal lines SL1 and the second touch signal lines SL2 may also have a mesh shape. Each of the first touch sensor units SP1 and the second touch sensor units SP2 overlaps the non-emission area NPXA.

In a plan view, each of the mesh holes MH may have a different area. Although it is illustrated that the mesh holes MH correspond to the light emitting areas PXA one-to-one, the present invention is not limited thereto. One mesh hole may correspond to two or more light emitting areas PXA. Each of the light emitting areas PXA may have a different area, if necessary. Correspondingly, each of the mesh holes MH may have a different area in a plan view. For example, the light emitting areas PXA may include a red light emitting area, a green light emitting area, and a blue light emitting area, and may have different areas for each color of the light emitting area. However, the present invention is not limited thereto, and the areas of the light emitting areas PXA may be equal to each other, and the areas of the mesh holes MH may also be equal to each other.

As illustrated in FIG. 9 , the first connection parts BR1 and the second connection parts BR2 may cross each other. The first connection parts BR1 and the second connection parts BR2 may insulate and cross each other with the first touch insulating layer TS-IL1 interposed therebetween. However, the present invention is not limited thereto. In FIG. 9 , the first connection parts BR1 and the second connection parts BR2 are shown in bold for better understanding, but the present invention is not limited thereto. For example, the first connection parts BR1 and the second connection parts BR2 may not cross each other, which will be described in detail later.

As illustrated in FIG. 9 , each of the first connection parts BR1 and the second connection parts BR2 may have a mesh shape. However, the present invention is not limited thereto, and for example, the second connection parts BR2 may not have a mesh shape.

10A and 10B are schematic cross-sectional views corresponding to the line II′ of FIG. 9 .

10A and 10B , the thickness D1 of the first conductive pattern TS-CP1 is smaller than the thickness D2 of the second conductive pattern TS-CP2. 10A and 10B , the first conductive pattern TS-CP1 corresponds to the above-described second connection part BR2 . The thickness D1 of the first conductive pattern TS-CP1 may be smaller than the thickness D3 of the first touch insulating layer TS-IL1.

In this specification, "thickness" may mean an average value of the thickness of the corresponding component.

As described above, the first conductive pattern TS-CP1 and the first touch insulating layer TS-IL1 may be directly disposed on the thin film encapsulation layer TFE of the organic light emitting display panel DP. The first touch insulating layer TS-IL1 has a stepped structure. Specifically, the first touch insulating layer TS-IL1 is disposed on the first conductive pattern TS-CP1, and the first portion IL-SUB1 spaced apart from the thin film encapsulation layer TFE, the thin film encapsulation layer ( The TFE may include a second portion IL-SUB2 contacting the TFE, and a third portion IL-SUB3 connecting the first portion IL-SUB1 and the second portion IL-SUB2. The first part IL-SUB1 , the second part IL-SUB2 , and the third part IL-SUB3 are integrally connected.

A cross-section of the third part IL-SUB3 may have a rectangular shape. However, the present invention is not limited thereto, and the cross-section of the third portion IL-SUB3 may have a polygonal shape including an inclined surface.

11 is a schematic cross-sectional view of a touch sensing unit included in a conventional display device. Specifically, FIG. 11 is a schematic cross-sectional view of a conventional general display device including the touch sensing unit 200 on the display panel 100 .

The touch sensing unit 200 of the conventional display device 1000 has a first conductive pattern 210 , an insulating layer 220 covering the first conductive pattern 210 , and a second conductive pattern disposed on the insulating layer 220 . Including 230 , the thickness K1 of the first conductive pattern 210 and the thickness K2 of the second conductive pattern 230 are the same or have a small difference. More specifically, the thickness K1 of the first conductive pattern 210 , the thickness K3 of the insulating layer 220 , and the thickness K2 of the second conductive pattern 230 are the same or the difference therebetween is small. The insulating layer 220 covering the first conductive pattern 210 has a step caused by the first conductive pattern 210 , and referring to region B of FIG. 11 , a crack is generated in the portion having the step. There was a problem. A portion of the first conductive pattern 210 and the second conductive pattern 230 that intersects the first conductive pattern 210 is electrically connected due to a crack occurring in the insulating layer 220 , so that the touch sensing unit 200 is short-circuited. (short) A defect occurred.

Accordingly, in the display device DD according to an embodiment of the present invention, the thickness D1 of the first conductive pattern TS-CP1 is set to be thinner than that of the prior art, thereby reducing the step difference of the first touch insulating layer TS-IL1. Thus, the crack occurrence rate of the insulating layer was minimized. In order to effectively implement the above effect, the thickness D1 of the first conductive pattern TS-CP1 is preferably smaller than the thickness D3 of the first touch insulating layer TS-IL1. The thickness D3 of the first touch insulating layer TS-IL1 and the thickness D2 of the second conductive pattern TS-CP2 may be the same or have a slight difference therebetween. That is, in the display device DD according to the exemplary embodiment of the present invention, the first conductivity of the first conductive pattern TS-CP1 , the first touch insulating layer TS-IL1 and the second conductive pattern TS-CP2 . By setting only the thickness of the pattern TS-CP1 to be relatively thin, the occurrence of cracks in the first touch insulating layer TS-IL1 may be suppressed or minimized.

For example, the thickness D1 of the first conductive pattern TS-CP1 may be 1800 Å or more and 2100 Å or less, and the thickness D2 of the second conductive pattern TS-CP2 may be 2700 Å or more and 3500 Å or less. For example, the thickness D1 of the first conductive pattern TS-CP1 may be about 1950 Å, and the thickness D2 of the second conductive pattern TS-CP2 may be about 3100 Å. However, the present invention is not limited thereto.

For example, the thickness D3 of the first touch insulating layer TS-IL1 may be 2700 Å or more and 3500 Å or less. The thickness D3 of the first touch insulating layer TS-IL1 may be about 3100 Å. However, the present invention is not limited thereto.

12A to 12D are plan views of a touch sensing unit included in a display device according to an exemplary embodiment. Specifically, FIGS. 12A to 12D are plan views of a touch sensing unit included in a display device according to another exemplary embodiment. 13A to 13C are partially enlarged views of area A3 of FIG. 12A . Specifically, FIG. 13A illustrates the second connection portions BR2 included in the first conductive pattern TS-CP1 in the area A3 of FIG. 12A , and FIG. 13B illustrates the second conductive pattern TS-CP2 in the area A3 of FIG. 12A . ), and FIG. 13C is a plan view illustrating a structure in which the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2 are stacked.

As described above, the first connection parts BR1 and the second connection parts BR2 may not cross each other. 12A to 12D , the second connection parts BR2 do not intersect the first connection parts BR1 , and the second connection parts BR2 include the first touch sensor parts SP1 and the second touch sensor. It may intersect with the parts SP2. 13A to 13C , the first touch sensor units SP1 include a plurality of mesh lines ML defining a plurality of mesh holes MH as described above, and the second connection parts BR2 ) may intersect some of the plurality of mesh lines ML of the first touch sensor units SP1 . The second touch sensor units SP2 also include a plurality of mesh lines ML defining a plurality of mesh holes MH as described above, and each of the second connection units BR2 includes the second touch sensor units ( SP2) may intersect some of the plurality of mesh lines ML. In this case, the second connection parts BR2 may not have a mesh shape.

The description of FIGS. 12A to 12D is the same as the description of FIGS. 8B to 8E except for the description of the second connection parts BR2 , and detailed description thereof will be omitted.

14 is a schematic cross-sectional view corresponding to the line II-II' of FIG. 13C. The second conductive pattern TS-CP2 of FIGS. 10A and 10B corresponds to the first connection parts BR1 among the components of the second conductive pattern TS-CP2, and the second conductive pattern TS- of FIG. 14 . The description of FIG. 14 is the same as that of FIGS. 10A and 10B except that CP2 corresponds to the first touch sensor units SP1 among the components of the second conductive pattern TS-CP2. It can be applied to the bar, a detailed description will be omitted.

15 is a partial cross-sectional view of a touch sensing unit included in a display device according to an exemplary embodiment.

The first conductive pattern TS-CP1 may have a single-layer structure or a multi-layer structure. 15 , the first conductive pattern TS-CP1 may have a three-layer structure. The first conductive pattern TS-CP1 may include a first conductive layer CD1 , a second conductive layer CD2 , and a third conductive layer CD3 . The first conductive layer CD1 is disposed on the thin film encapsulation layer TFE of the display panel DP, the second conductive layer CD2 is disposed on the first conductive layer CD1, and the third conductive layer ( CD3 may be disposed on the second conductive layer CD2 . In this case, the total thickness D1 of the first conductive pattern TS-CP1 is the thickness G1 of the first conductive layer CD1, the thickness G2 of the second conductive layer CD2, and the third conductive layer ( It is the sum of the thickness (D3) of CD3).

The second conductive layer CD2 may have a lower electrical resistivity than each of the first conductive layer CD1 and the third conductive layer CD3 . That is, the second conductive layer CD2 may have superior electrical conductivity than each of the first conductive layer CD1 and the third conductive layer CD3 . A general material known in the art may be used for each of the first conductive layer CD1 , the second conductive layer CD2 , and the third conductive layer CD3 as long as the above relation is satisfied. For example, it may be selected from silver, copper, aluminum, titanium, molybdenum, and alloys thereof. Although not limited thereto, the first conductive layer CD1 and the third conductive layer CD3 may each include titanium (Ti), and the second conductive layer CD2 may include aluminum (Al).

The thickness G2 of the second conductive layer CD2 may be greater than the thickness G1 of the first conductive layer CD1 and the thickness G3 of the third conductive layer CD3, respectively. The thickness G2 of the second conductive layer CD2 may be 6 times greater than the thickness G1 of the first conductive layer CD1 . The thickness G2 of the second conductive layer CD2 may be four or more times greater than the thickness G3 of the third conductive layer CD3 .

The thickness G3 of the third conductive layer CD3 may be greater than the thickness G1 of the first conductive layer. The thickness G3 of the third conductive layer CD3 may be 1.5 times greater than the thickness G2 of the first conductive layer. The thickness G3 of the third conductive layer CD3 may be 1.5 to 3 times greater than the thickness G2 of the first conductive layer.

The second conductive layer CD2 is an essential component for the first conductive pattern CP1 to function as a conductive pattern, and the first conductive layer CD1 and the third conductive layer CD3 are used to secure process stability. It may serve as a protective layer protecting the second conductive layer CD2 . Specifically, the first conductive layer CD1 protects the second conductive layer CD2 from factors occurring under the touch sensing unit TS, and the third conductive layer CD3 is formed by the second conductive layer (CD3) in the etching process. CD2) may play a role in preventing damage.

Since specific protection purposes of the first conductive layer CD1 and the third conductive layer CD3 are different, a required thickness may also be different. The thickness of the third conductive layer CD3 is required to be at least a certain level in order to protect the second conductive layer CD2 during the etching process, so the thickness of the first conductive layer CD1 rather than the third conductive layer CD3 is the thickness of the third conductive layer CD3 . By adjusting only G1 to be small, the total thickness D1 of the first conductive pattern CP1 may be adjusted to be smaller than the total thickness D1 of the second conductive pattern CP2. However, even in this case, the thickness G1 of the first conductive layer CD1 is also required to be at least a certain level. For example, the thickness G1 of the first conductive layer CD1 is preferably 50 Å or more. When the thickness G1 of the first conductive layer CD1 is less than 50 Å, it is difficult to act as a protective layer protecting the second conductive layer CD2.

For example, the thickness G1 of the first conductive layer CD1 is 50 Å to 200 Å, the thickness G2 of the second conductive layer CD2 is 1000 Å to 1800 Å, and the thickness of the third conductive layer CD3 is ( G3) may be 250 Å to 350 Å. For example, the thickness G1 of the first conductive layer CD1 is about 150 Å, the thickness G2 of the second conductive layer CD2 is about 1500 Å, and the thickness G3 of the third conductive layer CD3 is about 150 Å. may be about 300 Å. However, the present invention is not limited thereto.

16 is a cross-sectional view of a touch sensing unit included in a display device according to an exemplary embodiment.

As shown in FIG. 16 , the second conductive pattern TS-CP2 may also have a multi-layered structure like the first conductive pattern TS-CP1 . However, the present invention is not limited thereto, and the second conductive pattern TS-CP2 may have a single-layer structure as long as it is thicker than the first conductive pattern TS-CP1 .

The second conductive pattern TS-CP2 may have a three-layer structure. The second conductive pattern TS-CP2 may include a fourth conductive layer CD4 , a fifth conductive layer CD5 , and a sixth conductive layer CD6 . The fourth conductive layer CD4 is disposed on the first touch insulating layer TS-IL1 , the fifth conductive layer CD5 is disposed on the fourth conductive layer CD4 , and the sixth conductive layer CD6 is disposed on the fourth conductive layer CD4 . silver may be disposed on the fifth conductive layer CD5 . In this case, the total thickness D2 of the second conductive pattern TS-CP2 is the thickness G4 of the fourth conductive layer CD4, the thickness G5 of the fifth conductive layer CD5, and the sixth conductive layer ( It is the sum of the thickness (D6) of CD6).

The fifth conductive layer CD5 may have a lower electrical resistivity than each of the fourth conductive layer CD4 and the sixth conductive layer CD6 . That is, the fifth conductive layer CD5 may have superior electrical conductivity than each of the fourth conductive layer CD4 and the sixth conductive layer CD6 . For each of the fourth conductive layer CD4 , the fifth conductive layer CD5 , and the sixth conductive layer CD6 , a general material known in the art may be used as long as the above relation is satisfied. For example, it may be selected from silver, copper, aluminum, titanium, molybdenum, and alloys thereof. Although not limited thereto, the fourth conductive layer CD4 and the sixth conductive layer CD6 may each include titanium (Ti), and the fifth conductive layer CD5 may include aluminum (Al).

The thickness G5 of the fifth conductive layer CD5 may be greater than the thickness G4 of the fourth conductive layer CD4 and the thickness G6 of the sixth conductive layer CD6, respectively. The thickness G5 of the fifth conductive layer CD5 may be four times greater than the thickness G4 of the fourth conductive layer CD4 . The thickness G5 of the fifth conductive layer CD5 may be four times greater than the thickness G6 of the sixth conductive layer CD6.

The fifth conductive layer CD5 is an essential component for the second conductive pattern TS-CP2 to function as a conductive pattern, and the fourth conductive layer CD4 and the sixth conductive layer CD6 secure process stability. For this purpose, it may serve as a protective layer protecting the fifth conductive layer CD5. Specifically, the fourth conductive layer CD4 protects the fifth conductive layer CD5 from factors occurring under the second conductive pattern CP2 , and the sixth conductive layer CD6 provides the fifth conductive layer during the etching process. It may serve to prevent the layer CD5 from being damaged.

The thickness G2 of the second conductive layer CD2 may be smaller than the thickness G5 of the fifth conductive layer CD5 . That is, in the first conductive pattern TS-CP1 , the thickness G2 of the second conductive layer CD2 is smaller than the thickness G5 of the fifth conductive layer CD5 of the second conductive pattern TS-CP2. , the overall thickness may be adjusted to be smaller than that of the second conductive pattern TS-CP2.

The thickness G1 of the first conductive layer CD1 may be smaller than the thickness of the fourth conductive layer CD4 . That is, the first conductive pattern TS-CP1 has the thickness G1 of the first conductive layer CD1 as the lower protective layer and the fourth conductive layer CD4 as the lower protective layer of the second conductive pattern TS-CP2. By making it smaller than the thickness G4 of , the overall thickness may be adjusted to be smaller than that of the second conductive pattern TS-CP2.

For example, the thickness G4 of the fourth conductive layer CD4 is 250 Å to 350 Å, the thickness G5 of the fifth conductive layer CD5 is 2200 Å to 2800 Å, and the thickness of the sixth conductive layer CD6 ( G6) may be 250 Å to 350 Å. For example, the thickness G4 of the fourth conductive layer CD4 is about 300 Å, the thickness G5 of the fifth conductive layer CD5 is about 2500 Å, and the thickness G6 of the sixth conductive layer CD6 is about 300 Å. may be about 300 Å. However, the present invention is not limited thereto.

The display device DD according to an exemplary embodiment may reduce the crack occurrence rate of the insulating layer (the first touch insulating layer, TS-IL1 ) included in the touch sensing unit TS. As a result, the display device DD according to an embodiment of the present invention may minimize a short defect of the touch sensing unit TS.

Above, although embodiments of the present invention have been described with reference to the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can practice the present invention in other specific forms without changing its technical spirit or essential features. You will understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

TS-CP1: first conductive pattern TS-IL1: first touch insulating layer
TS-CP2: second conductive pattern D1: thickness of first conductive pattern
D2: thickness of the second conductive pattern D3: thickness of the first touch insulating layer

Claims (22)

organic light emitting device layer;
a thin film encapsulation layer disposed on the organic light emitting device layer and including a first inorganic layer, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer;
a buffer layer disposed on the thin film encapsulation layer; and
a touch sensing unit disposed on the buffer layer;
The touch sensing unit
a first conductive pattern disposed on the buffer layer;
an insulating layer covering the first conductive pattern; and
a second conductive pattern disposed on the insulating layer, a portion of which intersects the first conductive pattern,
A thickness of the first conductive pattern is smaller than a thickness of the second conductive pattern. According to claim 1,
The insulating layer is
a first portion overlapping the first conductive pattern and spaced apart from the buffer layer;
a second portion that does not overlap the first conductive pattern; and
and a third part connecting the first part and the second part. According to claim 1,
The thickness of the first conductive pattern is
a display device that is smaller than a thickness of the insulating layer. According to claim 1,
The thickness of the first conductive pattern is 1800 Å or more and 2100 Å or less,
and a thickness of the second conductive pattern is greater than or equal to 2700 Å and less than or equal to 3500 Å. According to claim 1,
The first conductive pattern is
a first conductive layer disposed on the buffer layer;
a second conductive layer disposed on the first conductive layer; and
a third conductive layer disposed on the second conductive layer;
The second conductive pattern is
a fourth conductive layer disposed on the insulating layer;
a fifth conductive layer disposed on the fourth conductive layer; and
and a sixth conductive layer disposed on the fifth conductive layer. 6. The method of claim 5,
The thickness of the second conductive layer is
A display device having a thickness greater than a thickness of the first conductive layer and a thickness of the third conductive layer. 6. The method of claim 5,
The thickness of the fifth conductive layer is
a thickness greater than a thickness of the fourth conductive layer and a thickness of the sixth conductive layer. 6. The method of claim 5,
The thickness of the third conductive layer is
The display device of claim 1, wherein the thickness of the first conductive layer is not less than 1.5 times and not more than 3 times. 6. The method of claim 5,
The thickness of the first conductive layer is 50 Å to 200 Å,
The thickness of the second conductive layer is 1000 Å to 1800 Å,
The thickness of the third conductive layer is 250 Å to 350 Å. 6. The method of claim 5,
The first conductive layer and the third conductive layer each contain Ti,
and the second conductive layer includes Al. 6. The method of claim 5,
The thickness of the second conductive layer is
and a thickness of the fifth conductive layer is smaller than a thickness of the fifth conductive layer. 6. The method of claim 5,
The thickness of the first conductive layer is
and a thickness smaller than a thickness of the fourth conductive layer. 6. The method of claim 5,
The thickness of the fourth conductive layer is 250 Å to 350 Å,
The thickness of the fifth conductive layer is 2200 Å to 2800 Å,
The thickness of the sixth conductive layer is 250 Å to 350 Å. 6. The method of claim 5,
Each of the fourth conductive layer and the sixth conductive layer includes Ti,
The fifth conductive layer includes Al. According to claim 1,
The second conductive pattern is
first connections;
first touch sensor units connected by the first connection units; and
and second touch sensor units spaced apart from the first touch sensor units. 16. The method of claim 15,
The first conductive pattern is
It includes second connection parts for connecting the second touch sensor parts,
The second connection parts intersect the first connection parts. 16. The method of claim 15,
The first conductive pattern is
It includes second connection parts for connecting the second touch sensor parts,
The first touch sensor units and the second touch sensor units each include a plurality of mesh lines defining a plurality of mesh holes,
The second connecting parts are
A display device that intersects mesh lines of the first touch sensor units and mesh lines of the second touch sensor units. 18. The method of claim 17,
The second connecting parts are
and the display device does not intersect the first connection parts. 16. The method of claim 15,
The first conductive pattern is
It includes second connection parts for connecting the second touch sensor parts,
A contact hole is defined in the insulating layer,
The second connection parts connect the second touch sensor parts through the contact hole. According to claim 1,
The first conductive pattern is directly disposed on the buffer layer. According to claim 1,
The buffer layer includes at least one of silicon nitride, silicon oxy nitride, and silicon oxide. According to claim 1,
The buffer layer is disposed directly on the second inorganic layer.

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