KR20240067055A - Display device - Google Patents

Abstract

The display device includes a display panel and a touch sensing unit disposed on the display panel, wherein the touch sensing unit is disposed on a first conductive pattern disposed on the display panel, an insulating layer covering the first conductive pattern, and an insulating layer, It includes a second conductive pattern, a portion of which intersects the first conductive pattern. The thickness of the first conductive pattern is smaller than the thickness of the second conductive pattern.

Description

Display device {DISPLAY DEVICE}

The present invention relates to a display device, and more specifically, to a display device with a reduced crack incidence of an insulating layer included in a touch sensing unit.

In the information society, display devices are gaining importance as a medium for transmitting visual information. Currently known display devices include liquid crystal display (LCD), plasma display panel (PDP), organic light emitting display (OLED), and field effect display. : FED), electrophoretic display (EPD), etc.

The display device is activated by receiving an electrical signal. The display device includes a touch screen that detects a touch applied from outside the display panel that displays an image.

A display device may include various electrode patterns to be activated by electrical signals. The area where the electrode patterns are activated displays information or responds to a touch applied from the outside.

One object of the present invention is to provide a display device with a reduced crack incidence of an insulating layer included in a touch sensing unit.

One object of the present invention is to provide a display device with a reduced short defect rate of the touch sensing unit.

One embodiment of the present invention includes a display panel and a touch sensing unit disposed on the display panel, wherein the touch sensing unit includes a first conductive pattern disposed on the display panel, an insulating layer covering the first conductive pattern, and an insulating layer. A display device is provided, including a second conductive pattern disposed on the first conductive pattern and a portion of the first conductive pattern intersecting the first conductive pattern, wherein the first conductive pattern has a thickness smaller than the second conductive pattern.

The first conductive pattern and the insulating layer are directly disposed on the thin film encapsulation layer of the display panel, and the insulating layer has a first portion disposed on the first conductive pattern and spaced apart from the thin film encapsulation layer, a second portion in contact with the thin film encapsulation layer, and And it may include a third part connecting the first part and the second part.

The thickness of the first conductive pattern may be smaller than the thickness of the insulating layer.

The thickness of the first conductive pattern may be 1800 Å or more and 2100 Å or less, and the thickness of the second conductive pattern may be 2700 Å or more and 3500 Å or less.

The first conductive pattern includes a first conductive layer disposed on the display panel, a second conductive layer disposed on the first conductive layer, and a third conductive layer disposed on the second conductive layer, and the second conductive layer is The electrical resistivity may be smaller than that of the first conductive layer and the third conductive layer, and the thickness of the second conductive layer may be greater than the thickness of the first conductive layer and the third conductive layer.

The thickness of the third conductive layer may be greater than the thickness of the first conductive pattern.

The thickness of the third conductive layer may be 1.5 to 3 times the thickness of the first conductive pattern.

The first conductive layer may have a thickness of 50Å to 200Å, the second conductive layer may have a thickness of 1000Å to 1800Å, and the third conductive layer may have a thickness of 250Å to 350Å.

The first conductive layer and the third conductive layer may each contain Ti, and the second conductive layer may contain Al.

The second conductive pattern includes a fourth conductive layer disposed on the insulating layer, a fifth conductive layer disposed on the fourth conductive layer, and a sixth conductive layer disposed on the fifth conductive layer, and the fifth conductive layer is The electrical resistivity may be smaller than that of the fourth conductive layer and the sixth conductive layer, and the thickness of the fifth conductive layer may be greater than the thickness of the fourth conductive layer and the sixth conductive layer.

The thickness of the second conductive layer may be smaller than the thickness of the fifth conductive layer.

The thickness of the first conductive layer may be smaller than the thickness of the fourth conductive layer.

The thickness of the fourth conductive layer may be 250Å to 350Å, the thickness of the fifth conductive layer may be 2200Å to 2800Å, and the thickness of the sixth conductive layer may be 250Å to 350Å.

Each of the fourth and sixth conductive layers may contain Ti, and the fifth conductive layer may contain Al.

The second conductive pattern may include first connection parts, first touch sensor units connected by the first connection parts, and second touch sensor units spaced apart from the first touch sensor units.

The first conductive pattern may include second connection parts connecting the second touch sensor units, and the second connection parts may intersect the first connection parts.

The first conductive pattern includes second connection parts connecting the second touch sensor units, the first touch sensor units and the second touch sensor units each include a plurality of mesh lines defining a plurality of mesh holes, and the second touch sensor units each include a plurality of mesh lines defining a plurality of mesh holes. The connection portions may intersect mesh lines of the first touch sensor units and mesh lines of the second touch sensor units.

The second connectors may not intersect the first connectors.

The first conductive pattern may include second connection parts connecting the second touch sensor units, a contact hole is defined in the insulating layer, and the second connection parts may connect the second touch sensor units through the contact hole.

The display panel may include a base layer, a circuit layer disposed on the base layer, an organic light-emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the organic light-emitting device layer.

According to the display device according to an embodiment of the present invention, the crack occurrence rate of the insulating layer included in the touch sensing unit is reduced, and as a result, short defects in the touch sensing unit due to crack occurrence can be improved.

FIG. 1A is a perspective view of a first operation of a display device according to an embodiment of the present invention.
FIG. 1B is a perspective view of a second operation of a display device according to an embodiment of the present invention.
Figure 1C is a perspective view of a third operation of a display device according to an embodiment of the present invention.
Figure 2 is a cross-sectional view of a display device according to an embodiment of the present invention.
3A and 3B are perspective views of a display device according to an embodiment of the present invention.
4A and 4B are perspective views of a display device according to an embodiment of the present invention.
FIG. 5A is a plan view of a display panel included in a display device according to an embodiment of the present invention.
Figure 5b is a cross-sectional view of a display module included in a display device according to an embodiment of the present invention.
Figure 6A is an equivalent circuit diagram of a pixel included in a display device according to an embodiment of the present invention.
6B is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention.
FIG. 6C is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention.
7A to 7C are cross-sectional views of a thin film encapsulation layer included in a display device according to an embodiment of the present invention.
FIG. 8A is a cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.
8B to 8E are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention.
FIG. 8F is a partial enlarged view of area A1 in FIG. 8B.
Figure 9 is a partial enlarged view of area A2 in Figure 8b.
Figures 10a and 10b are schematic cross-sectional views corresponding to line II' in Figure 9.
Figure 11 is a schematic cross-sectional view of a touch sensing unit included in a typical conventional display device.
12A to 12D are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention.
FIGS. 13A to 13C are partial enlarged views of area A3 in FIG. 12A.
FIG. 14 is a schematic cross-sectional view corresponding to line II-II' in FIG. 13C.
Figure 15 is a partial cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.
Figure 16 is a cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.

The above objects, other objects, features and advantages of the present invention will be easily understood through the following preferred embodiments related to the attached drawings. However, the present invention is not limited to the embodiments described herein and may be embodied in other forms. Rather, the embodiments introduced herein are provided so that the disclosed content will be thorough and complete and so that the spirit of the present invention can be sufficiently conveyed to those skilled in the art.

While describing each drawing, similar reference numerals are used for similar components. In the attached drawings, the dimensions of the structures are enlarged from the actual size for clarity of the present invention. Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, a first component may be named a second component without departing from the scope of the present invention, and similarly, the second component may also be named a first component. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this application, "include" or "have" Terms such as are intended to designate the presence of features, numbers, steps, operations, components, parts, or a combination thereof described in the specification, but are intended to indicate the presence of one or more other features, numbers, steps, operations, components, parts, or It should be understood that the existence or addition possibility of combinations of these is not excluded in advance. Additionally, parts such as layers, membranes, regions, plates, etc. are "on" other parts. If there is, it is "directly above" the other part. It includes not only cases where there is, but also cases where there is another part in between. On the other hand, parts such as layers, membranes, regions, plates, etc. are located at the "lower part" If there is, it is "directly below" the other part. It includes not only cases where there is, but also cases where there is another part in between.

Hereinafter, a display device according to an embodiment of the present invention will be described.

FIG. 1A is a perspective view of a first operation of the display device DD according to an embodiment of the present invention. FIG. 1B is a perspective view of a second operation of the display device DD according to an embodiment of the present invention. FIG. 1C is a perspective view of a third operation of the display device DD according to an embodiment of the present invention.

As shown in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2. The normal direction of the display surface IS, that is, the thickness direction of the display device DD, is indicated by the third direction axis DR3. The front (or upper) and back (or lower) surfaces of each member are separated by the third direction DR3. However, the direction indicated by the first to third direction axes DR1, DR2, and DR3 is a relative concept and can be converted to another direction. Hereinafter, the first to third directions refer to the same reference numerals as the directions indicated by the first to third direction axes DR1, DR2, and DR3, respectively.

1A to 1C illustrate a foldable display device as an example of a flexible display device (DD). However, the present invention may be a rolled rollable display device or a bent display device, and is not particularly limited. Additionally, although a flexible display device is shown in this embodiment, the present invention is not limited thereto. The display device DD according to this embodiment may be a flat rigid display device. The flexible display device (DD) according to the present invention can be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game consoles, and smart watches.

As shown in FIG. 1A, the display surface IS of the flexible display device DD may include a plurality of areas. The flexible display device (DD) includes a display area (DD-DA) where an image (IM) is displayed and a non-display area (DD-NDA) adjacent to the display area (DD-DA). The non-display area (DD-NDA) is an area where images are not displayed. Figure 1a shows a vase as an example of an image (IM). As an example, the display area (DD-DA) may have a rectangular shape. The non-display area (DD-NDA) may surround the display area (DD-DA). However, the shape is not limited to this, and the shape of the display area (DD-DA) and the shape of the non-display area (DD-NDA) may be designed relatively.

As shown in FIGS. 1A to 1C , the display device DD may include a plurality of areas defined according to an operation type. The display device (DD) includes a bending area (BA) that is bent, a first non-bending area (NBA1), and a second non-bending area (NBA2) that are bent on the basis of the bending axis (BX). It can be included. As shown in FIG. 1B, the display device DD is bent inside so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending) can be done. As shown in FIG. 1C, the display device DD may be outer-bended so that the display surface IS is exposed to the outside.

1A to 1C show only one bending area BA, but the present invention is not limited thereto. For example, in one embodiment of the present invention, the display device DD may include a plurality of bending areas BA. In one embodiment of the present invention, the display device DD may be configured to repeat only the operation modes shown in FIGS. 1A and 1B. However, the present invention is not limited to this, and the bending area BA may be defined to correspond to the way the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C, the bending area BA may be defined parallel to the first direction axis DR1 or may be defined diagonally. The area of the bending area (BA) is not fixed and may be determined depending on the radius of curvature.

Figure 2 is a cross-sectional view of the display device DD according to an embodiment of the present invention. FIG. 2 shows a cross section defined by the second direction DR2 and the third direction DR3.

As shown in FIG. 2, the display device DD includes a protective film (PM), a display module (DM), an optical member (LM), a window (WM), a first adhesive member (AM1), and a second adhesive member ( AM2), and a third adhesive member (AM3). The display module (DM) is disposed between the protective film (PM) and the optical member (LM). The optical member LM is disposed between the display module DM and the window WM. The first adhesive member (AM1) combines the display module (DM) and the protective film (PM), the second adhesive member (AM2) combines the display module (DM) and the optical member (LM), and the third adhesive member (AM3) combines the optical member (LM) and the window (WM). If necessary, at least one of the first adhesive member (AM1), the second adhesive member (AM2), and the third adhesive member (AM3) may be omitted.

The protective film (PM) protects the display module (DM). The protective film PM provides a first outer surface OS-L exposed to the outside and an adhesive surface adhered to the first adhesive member AM1. The protective film (PM) prevents external moisture from penetrating into the display module (DM) and can serve to absorb external shocks.

The protective film (PM) may include a plastic film as a base substrate. Protective film (PM) is made of polyethersulfone (PES), polyacrylate (polyacrylate), polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyleneterephthalate (PET), and polyethylene terephthalate (PET). Phenylene sulfide (PPS, polyphenylene sulfide), polyarylate, polyimide (PI, polyimide), polycarbonate (PC, polycarbonate), poly(arylene ethersulfone), and combinations thereof. It may include a plastic film containing any one selected from the group consisting of

Materials constituting the protective film (PM) are not limited to plastic resins and may include organic/inorganic composite materials. The protective film (PM) may include a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective film (PM) may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In one embodiment of the present invention, the protective film (PM) may be omitted.

The window (WM) can protect the display module (DM) from external shock and provide an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and an adhesive surface adhered to the second adhesive member AM2. The display surface IS shown in FIGS. 1A to 1C may be the second outer surface OS-U.

The window WM may include a plastic film. A window (WM) may have a multi-layer structure. The window WM may have a multilayer structure selected from glass substrate, plastic film, and plastic substrate. The window (WM) may further include a bezel pattern. The multilayer structure can be formed through a continuous process or an adhesion process using an adhesive layer.

The optical member (LM) reduces external light reflectance. The optical member LM may include at least a polarizing film. The optical member LM may further include a retardation film. In one embodiment of the present invention, the optical member LM may be omitted.

The display module (DM) may include a display panel (DP) and a touch sensing unit (TS). The touch sensing unit TS may be placed directly on the display panel DP. In this specification, "directly placed" means formed through a continuous process, excluding attachment using a separate adhesive layer. However, it is not limited thereto, and other layers such as an adhesive layer or a substrate may be interposed between the display panel DP and the touch sensing unit TS.

Below, the display panel (DP) is explained as an example of an organic light emitting display panel (DP), but the display panel (DP) is not limited to this, and the display panel (DP) may be a liquid crystal display panel or a plasma display panel. It may be a display panel, an electrophoretic display panel, a MEMS display panel (microelectromechanical system display panel), and an electrowetting display panel.

The organic light emitting display panel (DP) generates an image (IM, see FIG. 1A) corresponding to input image data. The organic light emitting display panel DP provides a first display panel back surface BS1-L and a second display panel back surface BS1-U that face each other in the thickness direction DR3.

The touch detection unit (TS) acquires coordinate information of external input. The touch detection unit (TS) can detect external input using a capacitance method.

Although not separately shown, the display module (DM) according to an embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a laminate structure of a conductive layer/insulating layer/conductive layer. The anti-reflection layer can reduce external light reflectance by absorbing, destructively interfering with, or polarizing light incident from the outside. The antireflection layer can replace the function of the optical member (LM).

Each of the first adhesive member (AM1), the second adhesive member (AM2), and the third adhesive member (AM3) is made of an optically clear adhesive film (OCA, Optically Clear Adhesive film) or an optically clear adhesive resin (OCR, Optically Clear Resin). Alternatively, it may be an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include adhesive materials such as polyurethane-based, polyacrylic-based, polyester-based, polyepoxy-based, and polyvinyl acetate-based.

Although not separately shown, the display device DD may further include a frame structure supporting the functional layers to maintain the state shown in FIGS. 1A to 1C. The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of the display device DD-1 according to an embodiment of the present invention. FIG. 3A shows the display device DD-1 in an unfolded state, and FIG. 3B shows the display device DD-1 in a bent state.

The display device DD-1 may include one bending area (BA) and one non-bending area (NBA). The non-display area (DD-NDA) of the display device (DD-1) may be bent. However, in one embodiment of the present invention, the bending area of the display device DD-1 may be changed.

The display device DD-1 according to this embodiment, unlike the display device DD shown in FIGS. 1A to 1C, can be fixed and operated in one form. The display device DD-1 may operate in a bent state as shown in FIG. 3B. The display device DD-1 may be fixed to a frame, etc. in a bent state, and the frame may be coupled to the housing of the electronic device.

The display device DD-1 according to this embodiment may have the same cross-sectional structure as shown in FIG. 2 . However, the non-bending area (NBA) and the bending area (BA) may have different stacked structures. The non-bending area NBA may have the same cross-sectional structure as shown in FIG. 2, and the bending area BA may have a different cross-sectional structure from that shown in FIG. 2. The optical member LM and window WM may not be disposed in the bending area BA. That is, the optical member LM and window WM can be placed only in the non-bending area NBA. The second adhesive member (AM2) and the third adhesive member (AM3) may also be not disposed in the bending area (BA).

FIG. 4A is a perspective view of a display device DD-2 according to an embodiment of the present invention.

The display device DD-2 includes a non-bending area (NBA, or flat area) in which the main image is displayed on the front and a bending area (BA, or side area) in which the sub-image is displayed on the side. Although not separately shown, the sub-image may include an icon that provides certain information. In this embodiment, the terms "non-bending area (NBA) and bending area (BA)" define the display device DD-2 as a plurality of areas divided by shape.

The bending area (BA) bent from the non-bending area (NBA) is connected to the fourth direction axis (DR4) that intersects the first direction axis (DR1), the second direction axis (DR2), and the third direction axis (DR3). Displays the sub image. However, the direction indicated by the first to fourth axes DR1 to DR4 is a relative concept and can be converted to another direction.

Figure 4b is a perspective view of the display device DD-3 according to an embodiment of the present invention.

The display device DD-3 includes a non-bending area NBA where the main image is displayed on the front, a first bending area BA1 and a second bending area BA2 where the sub-image is displayed on the side. The first bending area BA1 and the second bending area BA2 may be bent from both sides of the non-bending area NBA.

FIG. 5A is a plan view of an organic light emitting display panel (DP) included in a display device according to an embodiment of the present invention, and FIG. 5B is a cross-sectional view of a display module (DM) included in a display device according to an embodiment of the present invention. am. For example, FIG. 5B may show a portion of a cross section in a plane parallel to the plane defined by the second direction DR2 and the third direction DR3.

As shown in FIG. 5A, the organic light emitting display panel (DP) includes a display area (DA) and a non-display area (NDA) on a plane. The display area (DA) and non-display area (NDA) of the organic light emitting display panel (DP) are the display area (DD-DA, see FIG. 1A) and the non-display area (DD-NDA) of the display device (DD, see FIG. 1A). , see Figure 1a), respectively. The display area (DA) and non-display area (NDA) of the organic light emitting display panel (DP) are the display area (DD-DA, see FIG. 1A) and the non-display area (DD-NDA) of the display device (DD, see FIG. 1A). , see FIG. 1A), and may change depending on the structure/design of the organic light emitting display panel (DP).

The organic light emitting display panel (DP) includes a plurality of pixels (PX). An area where a plurality of pixels (PX) are arranged is defined as a display area (DA). In this embodiment, the non-display area (NDA) may be defined along the border of the display area (DA).

The organic light emitting display panel (DP) includes gate lines (GL), data lines (DL), light emission lines (EL), control signal lines (SL-D), initialization voltage lines (SL-Vint), and voltage lines ( SL-VDD), and a pad portion (PD).

The gate lines GL are each connected to a corresponding pixel PX among the plurality of pixels PX, and the data lines DL are respectively connected to the corresponding pixel PX among the plurality of pixels PX. do. Each of the light emitting lines EL may be arranged in parallel with a corresponding gate line among the gate lines GL. The control signal line (SL-D) can provide control signals to the gate driving circuit (GDC). The initialization voltage line SL-Vint may provide an initialization voltage to the plurality of pixels PX. The voltage line SL-VDD is connected to a plurality of pixels PX and may provide a first voltage to the plurality of pixels PX. The voltage line SL-VDD may include a plurality of lines extending in the first direction DR1 and a plurality of lines extending in the second direction DR2.

A gate driving circuit (GDC) to which gate lines (GL) and emission lines (EL) are connected may be disposed on one side of the non-display area (NDA). Some of the gate lines (GL), data lines (DL), light emission lines (EL), control signal line (SL-D), initialization voltage line (SL-Vint), and voltage lines are arranged on the same layer, Some are placed on different floors.

The pad portion PD may be connected to the ends of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD. As shown in FIG. 5B, the organic light emitting display panel (DP) includes a base layer (SUB), a circuit layer (DP-CL) disposed on the base layer (SUB), and a circuit layer (CP-CL) disposed on the base layer (SUB). It may include an organic light emitting device layer (DP-OLED) and a thin film encapsulation layer (TFE) disposed on the organic light emitting device layer (DP-OLED).

The base layer (SUB) may include at least one plastic film. The base layer (SUB) is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite substrate. The plastic substrate is at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. may include.

The circuit layer DP-CL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. A plurality of conductive layers of the circuit layer (DP-CL) may form signal lines or a control circuit of a pixel.

The organic light emitting device layer (DP-OLED) includes organic light emitting diodes.

The thin film encapsulation layer (TFE) seals the organic light emitting device layer (DP-OLED). The thin film encapsulation layer (TFE) includes an inorganic thin film and an organic thin film. The thin film encapsulation layer (TFE) may include at least two inorganic layers and an organic layer disposed between them. Inorganic thin films protect the organic light emitting device layer (DP-OLED) from moisture/oxygen, and organic thin films protect the organic light emitting device layer (DP-OLED) from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxy nitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer. The organic layer may include, but is not limited to, an acrylic-based organic layer. In the present invention, the thickness of the organic thin film can be adjusted to ensure that the touch sensing unit (TS) provides uniform sensitivity. This will be explained in detail later.

The touch sensing unit (TS) may be placed directly on the thin film encapsulation layer (TFE). However, it is not limited to this, and an inorganic layer may be disposed on the encapsulation layer (TFE), and a touch sensing unit (TS) may be disposed on the inorganic layer. The inorganic layer may be a buffer layer. The inorganic layer may be at least one of a silicon nitride layer, a silicon oxy nitride layer, and a silicon oxide layer. However, this is an illustrative example and the embodiment is not limited thereto. Although the inorganic layer is described as a separate component, the inorganic layer may be included in the encapsulation layer (TFE).

The touch sensing unit (TS) includes touch sensors and touch signal lines. Touch sensors and touch signal lines may have a single-layer or multi-layer structure.

Touch sensors and touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowire, and graphene. The touch sensors and touch signal lines may include a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The touch sensors and touch signal lines may have the same layer structure or may have different layer structures. Specific details about the touch sensing unit (TS) will be described later.

FIG. 6A is an equivalent circuit diagram of a pixel PX included in a display device according to an embodiment of the present invention.

FIG. 6A exemplarily shows the i-th pixel (PXi) connected to the k-th data line (DLk) among the plurality of data lines (DL).

The ith pixel (PXi) includes an organic light emitting diode (OLED) and a pixel driving circuit that controls the organic light emitting diode. The driving circuit may include seven thin film transistors (T1 to T7) and one storage capacitor (Cst). Although the pixel driving circuit including seven thin film transistors (T1 to T7) and one capacitor (Cst) is shown as an example, the pixel (PXi) is a driving circuit for driving an organic light emitting diode (OLED) and is the first It is sufficient to include a transistor (T1, or driving transistor), a second transistor (T2, or switching transistor), and a capacitor (Cst), and the pixel driving circuit can be modified in various ways.

The driving transistor controls the driving current supplied to the organic light-emitting diode (OLED). The output electrode of the second transistor (T2) is electrically connected to the organic light emitting diode (OLED). The output electrode of the second transistor T2 may be in direct contact with the anode of the organic light emitting diode (OLED), or may be connected via another transistor (the sixth transistor T6 in this embodiment).

The control electrode of the control transistor can receive a control signal. The control signal applied to the ith pixel (PXi) is the i-1th gate signal (Si-1), the ith gate signal (Si), the i+1th gate signal (Si+1), the data signal (Dk), and an i-th emission control signal (Ei). In an embodiment of the present invention, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the ith gate line GLi, and an output electrode connected to the output electrode of the second transistor T2. do. The first transistor T1 is turned on by the gate signal (Si, hereinafter referred to as the i-th gate signal) applied to the ith gate line (GLi), and the data signal (Dk) applied to the k-th data line (DLk). is provided to the storage capacitor (Cst).

6B is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention. FIG. 6C is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention. Specifically, FIG. 6B shows a cross section of a portion corresponding to the first transistor T1 of the equivalent circuit shown in FIG. 6A. FIG. 6C shows a cross section of a portion corresponding to the second transistor T2, the sixth transistor T6, and the organic light emitting diode (OLED) of the equivalent circuit shown in FIG. 6A.

Referring to FIGS. 6B and 6C, the first transistor T1, the second transistor T2, and the sixth transistor T6 are disposed on the base substrate SUB. Since the structures of the transistors are substantially the same, the structure of the first transistor T1 will be described below, and the description of the structures of the second and sixth transistors T2 and T6 will be omitted.

The top surface of the base substrate SUB is defined by the first direction DR1 and the second direction DR2. The first transistor T1 includes a first input electrode DE1, a first output electrode SE1, a first control electrode GE1, and a first oxide semiconductor pattern OSP1.

A buffer layer (BFL) may be disposed on the top surface of the base substrate (SUB). The buffer layer (BFL) improves the bonding strength between the base substrate (SUB) and the conductive patterns or semiconductor patterns. The buffer layer (BFL) may include an inorganic layer. Although not separately shown, a barrier layer to prevent foreign substances from entering may be further disposed on the upper surface of the base substrate (SUB). The buffer layer (BFL) and barrier layer can be selectively placed or omitted.

The base substrate (SUB) may include a plastic substrate, a glass substrate, a metal substrate, etc. The plastic substrate is at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. may include.

The first oxide semiconductor pattern OSP1 is disposed on the buffer layer BFL. The first oxide semiconductor pattern OSP1 may include indium-tin oxide (ITO), indium-gallium-zinc oxide (IGZO), zinc oxide (ZnO), and indium-zinc oxide (IZnO).

A first insulating layer 10 covering the first oxide semiconductor pattern OSP1 is disposed on the buffer layer BFL.

The first control electrode GE1 is disposed on the first insulating layer 10, and the second insulating layer 20 covering the first control electrode GE1 is disposed on the first insulating layer 10. The second insulating layer 20 may provide a flat top surface. The second insulating layer 30 may include organic materials and/or inorganic materials.

The first insulating layer 10 and the second insulating layer 20 may include an inorganic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

Meanwhile, the first contact hole (CH1) and the second contact hole (CH2) exposing the first and second regions of the first oxide semiconductor pattern (OSP1) are formed through the first and second insulating layers (10, 20). is defined in Each of the first contact hole (CH1) and the second contact hole (CH2) penetrates the first insulating layer 10 and the second insulating layer 20.

The first input electrode DE1 and the first output electrode SE1 are disposed on the second insulating layer 20 . The first input electrode DE1 and the first output electrode SE1 are connected to the first and second regions of the first oxide semiconductor pattern OSP1 through the first contact hole CH1 and the second contact hole CH2. Each is connected.

A third insulating layer 30 covering the first input electrode DE1 and the first output electrode SE1 is disposed on the second insulating layer 20 . The third insulating layer 30 may provide a flat top surface. The third insulating layer 30 may include organic materials and/or inorganic materials. That is, the third insulating layer 30 can cover the input electrodes and output electrodes.

FIG. 6C exemplarily shows the sixth transistor T6 having substantially the same structure as the second transistor T2. However, the structure of the sixth transistor T6 may be modified. The input electrode DE6 of the sixth transistor T6 is connected to the output electrode SE2 of the second transistor T2 on the third insulating layer 30.

A pixel defining layer (PDL) and an organic light emitting diode (OLED) are disposed on the third insulating layer 30. An anode (AE) is disposed on the third insulating layer 30. The anode AE is connected to the sixth output electrode SE6 of the sixth transistor T6 through the seventh contact hole CH7 penetrating the third insulating layer 30. An opening (OP) is defined in the pixel definition layer (PDL). The opening OP of the pixel definition layer PDL exposes at least a portion of the anode AE.

The pixel PX may be disposed in a pixel area on a plane of the organic light emitting display panel DP. The pixel area may include a light-emitting area (PXA) and a non-light-emitting area (NPXA) adjacent to the light-emitting area (PXA). The non-emissive area (NPXA) may be arranged to surround the light-emitting area (PXA). In this embodiment, the light emitting area (PXA) is defined to correspond to the anode (AE). However, the light-emitting area PXA is not limited to this, and it is sufficient if the light-emitting area PXA is defined as an area where light is generated. The light emitting area (PXA) may be defined to correspond to a partial area of the anode (AE) exposed by the opening (OP).

The hole control layer (HCL) may be commonly disposed in the emission area (PXA) and the non-emission area (NPXA). Although not shown separately, a common layer such as the hole control layer (HCL) may be formed in common in the plurality of pixels (PX).

An organic light emitting layer (EML) is disposed on the hole control layer (HCL). The organic light emitting layer (EML) may be disposed only in the area corresponding to the opening OP. That is, the organic light emitting layer (EML) may be formed separately in each of the plurality of pixels (PX).

An electronic control layer (ECL) is disposed on the organic light emitting layer (EML). A cathode (CE) is disposed on the electronic control layer (ECL). The cathode CE is commonly disposed in the plurality of pixels PX.

A thin film encapsulation layer (TFE) is disposed on the cathode (CE). The thin film encapsulation layer (TFE) is commonly disposed in the plurality of pixels (PX). The thin film encapsulation layer (TFE) includes at least one inorganic layer and at least one organic layer. The thin film encapsulation layer (TFE) may include a plurality of inorganic layers and a plurality of organic layers alternately stacked.

Although the patterned organic light emitting layer (EML) is shown as an example in this embodiment, the organic light emitting layer (EML) may be commonly disposed in a plurality of pixels (PX). At this time, the organic light emitting layer (EML) can generate white light. Additionally, the organic light emitting layer (EML) may have a multilayer structure.

In this embodiment, the thin film encapsulation layer (TFE) directly covers the cathode (CE). In one embodiment of the present invention, a capping layer covering the cathode (CE) may be further disposed. At this time, the thin film encapsulation layer (TFE) can directly cover the capping layer.

7A to 7C are cross-sectional views of a thin film encapsulation layer included in a display device according to an embodiment of the present invention. Hereinafter, the thin film encapsulation layer will be described with reference to FIGS. 7A to 7C.

As shown in FIG. 7A, the thin film encapsulation layer (TFE1) may include n inorganic thin films (IOL1 to IOLn) including the first inorganic thin film (IOL1) disposed on the cathode (CE, see FIG. 8B). there is. Additionally, the first inorganic thin film (IOL1) may be disposed in direct contact with the cathode (CE, Figure 6c). The first inorganic thin film (IOL1) may be defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film (IOL1) among the n inorganic thin films (IOL1 to IOLn) may be defined as upper inorganic thin films.

The thin film encapsulation layer (TFE1) includes n-1 organic thin films (OL1 to OLn), and the n-1 organic thin films (OL1 to OLn) are arranged alternately with n inorganic thin films (IOL1 to IOLn). It can be. The n-1 organic thin films (OL1 to OLn) may have a greater thickness on average than the n inorganic thin films (IOL1 to IOLn).

Each of the n inorganic thin films (IOL1 to IOLn) may have a single layer containing one material, or may have multiple layers each containing a different material. Each of n-1 organic thin films (OL1 to OLn) can be formed by providing organic monomers. For example, each of the n-1 organic thin films (OL1 to OLn) may be formed using an inkjet printing method or may be formed by coating a composition containing an acrylic monomer. In one embodiment of the present invention, the thin film encapsulation layer (TFE1) may further include an nth organic thin film.

As shown in FIGS. 7B and 7C, the inorganic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may be made of the same or different inorganic materials and may have the same or different thickness. The organic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may have the same or different organic materials and may have the same or different thickness.

As shown in FIG. 7B, the thin film encapsulation layer (TFE2) includes a first inorganic thin film (IOL1), a first organic thin film (OL1), a second inorganic thin film (IOL2), and a second organic thin film (OL2) sequentially stacked. , and a third inorganic thin film (IOL3).

The first inorganic thin film (IOL1) may have a two-layer structure. The first sub-layer (S1) and the second sub-layer (S2) may include different inorganic materials.

As shown in FIG. 7C, the thin film encapsulation layer (TFE3) may include a first inorganic thin film (IOL10), a first organic thin film (OL1), and a second inorganic thin film (IOL20) sequentially stacked. The first inorganic thin film (IOL10) may have a two-layer structure. The first sub-layer (S10) and the second sub-layer (S20) may include different inorganic materials. The second inorganic thin film (IOL20) may have a two-layer structure. The second inorganic thin film (IOL20) may include a first sub-layer (S100) and a second sub-layer (S200) deposited in different deposition environments. The first sub-layer S100 may be deposited under low power conditions and the second sub-layer S200 may be deposited under high power conditions. The first sub-layer (S100) and the second sub-layer (S200) may include the same inorganic material.

FIG. 8A is a cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention. 8B to 8E are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention.

As shown in FIG. 8A, the touch sensing unit (TS) includes a first conductive pattern (TS-CP1), a first insulating layer (TS-IL1, hereinafter referred to as first touch insulating layer), and a second conductive pattern (TS-CP2). ), and a second insulating layer (TS-IL2, hereinafter referred to as a second touch insulating layer). The first conductive pattern TS-CP1 may be directly disposed on the thin film encapsulation layer (TFE). However, the present invention is not limited thereto, and another inorganic layer (eg, a buffer layer) may be further disposed between the first conductive pattern (TS-CP1) and the thin film encapsulation layer (TFE).

If necessary, the second insulating layer TS-IL2 may be omitted. A portion of the second conductive pattern (TS-CP2) intersects the first conductive pattern (TS-CP1). A portion of the second conductive pattern TS-CP2 insulates and intersects the first conductive pattern TS-CP1 with the first touch insulating layer TS-IL1 interposed therebetween.

Each of the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3.

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include an inorganic material or an organic material. The inorganic material may include aluminum oxide, titanium oxide, silicon oxide, or at least one of silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, urethane resin, cellulose resin, siloxane resin, polyimide resin, polyamide resin, and perylene resin. can do.

The first touch insulating layer TS-IL1 is sufficient to insulate the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2, and its shape is not limited. The first touch insulating layer TS-IL1 may entirely cover the thin film encapsulation layer TFE or may include a plurality of insulating patterns. It is sufficient for the plurality of insulating patterns to overlap the first or second connection parts BR1 or BR2, which will be described later.

In this embodiment, a two-layer touch sensing unit is shown as an example, but is not limited thereto. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and touch signal lines connected to the touch sensors. The single-layer touch sensing unit can acquire coordinate information using the self-cap method.

As shown in FIG. 8B, the touch sensing unit TS includes first touch electrodes TE1 and second touch electrodes TE2. The first touch electrodes TE1 include first connection parts BR1, first touch sensor units SP1 connected by the first connection parts BR1, and first touch signals connected to the first touch sensor units SP1. It includes lines SL1. The second touch electrodes TE2 include second connectors BR2, second touch sensor units SP2 connected by the second connectors BR2, and second touch signals connected to the second touch sensor units SP2. Contains lines SL2. Additionally, connection electrodes (TSD) are formed between the first touch electrodes (TE1) and the second touch signal lines (SL1), and between the second touch signal lines (SL2) connected to the second touch electrodes (TE2). can be placed. The connection electrodes TSD may be connected to each end of the first touch electrodes TE1 and the second touch electrodes TE2 to transmit signals. In another embodiment of the present invention, the connection electrodes (TSD) may be omitted.

The first touch sensor units SP1 may be arranged in the first direction DR1, and the second touch sensor units SP2 may be arranged in the second direction DR2. The first touch sensor units SP1 and the second touch sensor units SP2 are spaced apart from each other.

The first touch electrodes TE1 may extend in the first direction DR1 and be spaced apart in the second direction DR2. The second touch electrodes TE2 may extend in the second direction DR2 and be spaced apart in the first direction DR1.

Each of the first connection parts BR1 connects two adjacent first touch sensor parts SP1 among the first touch sensor parts SP1. Each of the second connection parts BR2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2. In FIG. 8B , some of the first and second connection parts BR1 and BR2 are shown in bold to facilitate understanding.

The touch sensing unit (TS) may further include touch pad units (TS-PD). Each of the first touch signal lines SL1 and the second touch signal lines SL2 may be connected to a corresponding touch pad part among the touch pad parts TS-PD.

The first touch sensor units SP1 and the second touch sensor units SP2 are electrostatically coupled. As touch detection signals are applied to the first touch sensor units SP1, capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2.

Hereinafter, the touch sensing unit TS will be described in more detail with reference to FIGS. 8C and 8E.

As shown in FIG. 8C, the first conductive pattern TS-CP1 may include second connection portions BR2. The second connection portions BR2 may be formed by directly patterning the thin film encapsulation layer (TFE) of the organic light emitting display panel (DP). That is, the first conductive pattern TS-CP1 may be directly disposed on the thin film encapsulation layer TFE of the organic light emitting display panel DP.

A first touch insulating layer (TS-IL1) is disposed on the first conductive pattern (TS-CP1). The first touch insulating layer TS-IL1 may be directly disposed on the thin film encapsulation layer TFE of the organic light emitting display panel CP and cover each of the second connection parts BR2. As shown in FIG. 8D , a plurality of contact holes CH that partially expose the second connection portions BR2 may be defined in the first touch insulating layer TS-IL1. Contact holes (CH) may be formed through a photolithography process. The second connection parts BR2 of the first conductive pattern TS-CP1 and the second touch sensor parts SP2 are electrically connected through the contact holes CH.

Referring to FIG. 8E, the second conductive pattern TS-CP2 is disposed on the first touch insulating layer TS-IL1, and the first connection parts BR1 are connected by the first connection parts BR1. It may include 1 touch sensor units SP1 and second touch sensor units SP2 spaced apart from the first touch sensor units. As described above, the second touch sensor units SP2 are electrically connected through the contact holes defined in the first connection parts BR1 of the first conductive pattern TS-CP1 and the first touch insulating layer TS-IL1. It can be connected to .

FIG. 8F is a partial enlarged view of area A1 in FIG. 8B. Figure 9 is a partial enlarged view of area A2 in Figure 8b.

Referring to FIGS. 8F and 9 , each of the first touch sensor units SP1 and the second touch sensor units SP2 includes a plurality of mesh lines ML defining a plurality of mesh holes MH. You can. The line width of each of the mesh lines ML may be several microns. Each of the first touch sensor units SP1 and the second touch sensor units SP2 may have a mesh shape. Although not specifically shown, the first touch signal lines SL1 and the second touch signal lines SL2 may also have a mesh shape. Each of the first touch sensor units SP1 and the second touch sensor units SP2 overlaps the non-emission area NPXA.

On a plane, each of the mesh holes MH may have a different area. Although the mesh holes MH are shown as having a one-to-one correspondence with the light emitting areas PXA, the present invention is not limited thereto. One mesh hole may correspond to two or more light emitting areas (PXA). Each of the light emitting areas (PXA) may have a different area depending on need. Correspondingly, each of the mesh holes MH may have a different area on a plane. For example, the light-emitting areas PXA may include a red light-emitting area, a green light-emitting area, and a blue light-emitting area, and may have different areas for each color of the light-emitting area. However, it is not limited thereto, and the areas of the light emitting areas PXA may be the same, and the areas of the mesh holes MH may also be the same.

As shown in FIG. 9, the first connection parts BR1 and the second connection parts BR2 may cross each other. The first connection parts BR1 and the second connection parts BR2 may be insulated and intersect with the first touch insulating layer TS-IL1 interposed therebetween. However, it is not limited thereto. In FIG. 9 , the first connection parts BR1 and the second connection parts BR2 are shown in bold to facilitate understanding, but the present invention is not limited thereto. For example, the first connection parts BR1 and the second connection parts BR2 may not intersect each other, which will be described in detail later.

As shown in FIG. 9, each of the first connection parts BR1 and the second connection parts BR2 may have a mesh shape. However, it is not limited thereto, and for example, the second connection parts BR2 may not have a mesh shape.

Figures 10a and 10b are schematic cross-sectional views corresponding to line II' in Figure 9.

As shown in FIGS. 10A and 10B, the thickness D1 of the first conductive pattern TS-CP1 is smaller than the thickness D2 of the second conductive pattern TS-CP2. 10A and 10B, the first conductive pattern TS-CP1 corresponds to the above-described second connection part BR2. The thickness D1 of the first conductive pattern TS-CP1 may be smaller than the thickness D3 of the first touch insulating layer TS-IL1.

In this specification, "thickness" may mean the average value of the thickness of the corresponding component.

As described above, the first conductive pattern TS-CP1 and the first touch insulating layer TS-IL1 may be directly disposed on the thin film encapsulation layer TFE of the organic light emitting display panel DP. The first touch insulating layer TS-IL1 has a stepped structure. Specifically, the first touch insulating layer (TS-IL1) is disposed on the first conductive pattern (TS-CP1), the first portion (IL-SUB1) spaced apart from the thin film encapsulation layer (TFE), and the thin film encapsulation layer ( It may include a second part (IL-SUB2) in contact with the TFE) and a third part (IL-SUB3) connecting the first part (IL-SUB1) and the second part (IL-SUB2). The first part (IL-SUB1), the second part (IL-SUB2), and the third part (IL-SUB3) are integrally connected.

The cross section of the third portion (IL-SUB3) may have a rectangular shape. However, it is not limited thereto, and the cross section of the third portion (IL-SUB3) may have a polygonal shape including an inclined surface.

Figure 11 is a schematic cross-sectional view of a touch sensing unit included in a typical conventional display device. Specifically, FIG. 11 is a schematic cross-sectional view of a typical conventional display device including a touch sensing unit 200 on a display panel 100.

The touch sensing unit 200 of a conventional display device 1000 includes a first conductive pattern 210, an insulating film 220 covering the first conductive pattern 210, and a second conductive pattern disposed on the insulating film 220. 230 , and the thickness K1 of the first conductive pattern 210 and the thickness K2 of the second conductive pattern 230 are the same or the difference is slight. More specifically, the thickness K1 of the first conductive pattern 210, the thickness K3 of the insulating film 220, and the thickness K2 of the second conductive pattern 230 were the same or had a slight difference. The insulating film 220 covering the first conductive pattern 210 has a step due to the first conductive pattern 210, and referring to area B of FIG. 11, a crack occurs in the portion where there is a step. There was a problem. Due to a crack occurring in the insulating film 220, the first conductive pattern 210 and a portion of the second conductive pattern 230 that intersects the first conductive pattern 210 are electrically connected, causing a short circuit in the touch sensing unit 200. (short) A defect has occurred.

Accordingly, the display device DD according to an embodiment of the present invention sets the thickness D1 of the first conductive pattern TS-CP1 to be thinner than before, thereby reducing the step of the first touch insulating layer TS-IL1. This minimized the incidence of cracks in the insulation layer. In order to efficiently implement the above effect, the thickness D1 of the first conductive pattern TS-CP1 is preferably smaller than the thickness D3 of the first touch insulating layer TS-IL1. The thickness D3 of the first touch insulating layer TS-IL1 and the thickness D2 of the second conductive pattern TS-CP2 may be the same or have a slight difference. That is, the display device DD according to an embodiment of the present invention has a first conductive pattern among the first conductive pattern TS-CP1, the first touch insulating layer TS-IL1, and the second conductive pattern TS-CP2. By setting only the thickness of the pattern TS-CP1 to be relatively thin, the occurrence of cracks in the first touch insulating layer TS-IL1 can be suppressed or minimized.

For example, the thickness D1 of the first conductive pattern TS-CP1 may be 1800 Å or more and 2100 Å or less, and the thickness D2 of the second conductive pattern TS-CP2 may be 2700 Å or more and 3500 Å or less. For example, the thickness D1 of the first conductive pattern TS-CP1 may be about 1950 Å, and the thickness D2 of the second conductive pattern TS-CP2 may be about 3100 Å. However, it is not limited thereto.

For example, the thickness D3 of the first touch insulating layer TS-IL1 may be 2700 Å or more and 3500 Å or less. The thickness D3 of the first touch insulating layer TS-IL1 may be about 3100 Å. However, it is not limited thereto.

12A to 12D are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention. Specifically, FIGS. 12A to 12D are plan views of a touch sensing unit included in a display device according to another embodiment of the present invention. FIGS. 13A to 13C are partial enlarged views of area A3 in FIG. 12A. Specifically, FIG. 13A shows the second connection parts BR2 included in the first conductive pattern (TS-CP1) in the A3 area of FIG. 12A, and FIG. 13B shows the second conductive pattern (TS-CP2) in the A3 area. ), and FIG. 13C is a plan view showing a structure in which the first conductive pattern (TS-CP1) and the second conductive pattern (TS-CP2) are stacked.

As described above, the first connection parts BR1 and the second connection parts BR2 may not intersect each other. 12A to 12D, the second connection parts BR2 do not intersect the first connection parts BR1, and the second connection parts BR2 are connected to the first touch sensor parts SP1 and the second touch sensor. It may be a cross with cattail (SP2). Referring to FIGS. 13A to 13C , the first touch sensor units SP1 include a plurality of mesh lines ML defining a plurality of mesh holes MH as described above, and the second connection parts BR2 ) Each may intersect with some of the plurality of mesh lines ML of the first touch sensor units SP1. As described above, the second touch sensor units SP2 also include a plurality of mesh lines ML defining a plurality of mesh holes MH, and each of the second connection parts BR2 includes the second touch sensor units ( It may intersect with some of the plurality of mesh lines (ML) of SP2). In this case, the second connection parts BR2 may not have a mesh shape.

Since the description of FIGS. 12A to 12D can be applied in the same manner as the description of FIGS. 8B to 8E except for the description of the second connection parts BR2, detailed description will be omitted.

FIG. 14 is a schematic cross-sectional view corresponding to line II-II' in FIG. 13C. The second conductive pattern TS-CP2 in FIGS. 10A and 10B corresponds to the first connection parts BR1 among the components of the second conductive pattern TS-CP2, and the second conductive pattern TS- in FIG. 14 The description of FIG. 14 is the same as that of FIGS. 10A and 10B, except that CP2) corresponds to the first touch sensor units SP1 among the components of the second conductive pattern TS-CP2. Since it can be applied in many ways, detailed explanation will be omitted.

Figure 15 is a partial cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.

The first conductive pattern TS-CP1 may have a single-layer structure or a multi-layer structure. As shown in FIG. 15, the first conductive pattern TS-CP1 may have a three-layer structure. The first conductive pattern (TS-CP1) may include a first conductive layer (CD1), a second conductive layer (CD2), and a third conductive layer (CD3). The first conductive layer (CD1) is disposed on the thin film encapsulation layer (TFE) of the display panel (DP), the second conductive layer (CD2) is disposed on the first conductive layer (CD1), and the third conductive layer ( CD3) may be disposed on the second conductive layer (CD2). In this case, the total thickness (D1) of the first conductive pattern (TS-CP1) is the thickness (G1) of the first conductive layer (CD1), the thickness (G2) of the second conductive layer (CD2), and the third conductive layer ( It is the sum of the thickness (D3) of CD3).

The second conductive layer (CD2) may have a smaller electrical resistivity than each of the first conductive layer (CD1) and the third conductive layer (CD3). That is, the second conductive layer (CD2) may have better electrical conductivity than each of the first conductive layer (CD1) and the third conductive layer (CD3). Each of the first conductive layer (CD1), second conductive layer (CD2), and third conductive layer (CD3) can be made of a common material known in the art as long as it satisfies the above relationship. For example, it may be selected from silver, copper, aluminum, titanium, molybdenum, and alloys thereof. Although not limited thereto, the first conductive layer (CD1) and the third conductive layer (CD3) may each contain titanium (Ti), and the second conductive layer (CD2) may contain aluminum (Al).

The thickness G2 of the second conductive layer CD2 may be greater than the thickness G1 of the first conductive layer CD1 and the thickness G3 of the third conductive layer CD3. The thickness G2 of the second conductive layer CD2 may be more than 6 times greater than the thickness G1 of the first conductive layer CD1. The thickness G2 of the second conductive layer CD2 may be at least four times greater than the thickness G3 of the third conductive layer CD3.

The thickness G3 of the third conductive layer CD3 may be greater than the thickness G1 of the first conductive layer. The thickness G3 of the third conductive layer CD3 may be 1.5 times or more greater than the thickness G2 of the first conductive layer. The thickness G3 of the third conductive layer CD3 may be 1.5 to 3 times greater than the thickness G2 of the first conductive layer.

The second conductive layer (CD2) is an essential component for the first conductive pattern (CP1) to function as a conductive pattern, and the first conductive layer (CD1) and third conductive layer (CD3) are used to ensure process stability. It may serve as a protective layer to protect the second conductive layer (CD2). Specifically, the first conductive layer (CD1) protects the second conductive layer (CD2) from factors occurring below the touch sensing unit (TS), and the third conductive layer (CD3) protects the second conductive layer (CD2) during the etching process. It may play a role in preventing damage to CD2).

Since the specific protection purposes of the first conductive layer (CD1) and the third conductive layer (CD3) are different, the required thickness may also be different. The third conductive layer (CD3) is required to be thicker than a certain level in order to protect the second conductive layer (CD2) during the etching process. The thickness of the first conductive layer (CD1), not the third conductive layer (CD3), is By adjusting only (G1) to be small, the total thickness (D1) of the first conductive pattern (CP1) can be adjusted to be smaller than the total thickness (D1) of the second conductive pattern (CP2). However, even in this case, the thickness (G1) of the first conductive layer (CD1) is also required to be above a certain level. For example, the thickness (G1) of the first conductive layer (CD1) is preferably 50 Å or more. When the thickness G1 of the first conductive layer CD1 is less than 50 Å, it is difficult to function as a protective layer to protect the second conductive layer CD2.

For example, the thickness G1 of the first conductive layer CD1 is 50 Å to 200 Å, the thickness G2 of the second conductive layer CD2 is 1000 Å to 1800 Å, and the thickness of the third conductive layer CD3 is ( G3) may be 250Å to 350Å. For example, the thickness (G1) of the first conductive layer (CD1) is about 150 Å, the thickness (G2) of the second conductive layer (CD2) is about 1500 Å, and the thickness (G3) of the third conductive layer (CD3) is about 150 Å. may be about 300 Å. However, it is not limited thereto.

Figure 16 is a cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.

As shown in FIG. 16, the second conductive pattern TS-CP2 may have a multilayer structure like the first conductive pattern TS-CP1. However, it is not limited thereto, and the second conductive pattern TS-CP2 may have a single-layer structure as long as it satisfies the condition of being thicker than the first conductive pattern TS-CP1.

The second conductive pattern (TS-CP2) may have a three-layer structure. The second conductive pattern (TS-CP2) may include a fourth conductive layer (CD4), a fifth conductive layer (CD5), and a sixth conductive layer (CD6). The fourth conductive layer (CD4) is disposed on the first touch insulating layer (TS-IL1), the fifth conductive layer (CD5) is disposed on the fourth conductive layer (CD4), and the sixth conductive layer (CD6) may be disposed on the fifth conductive layer (CD5). In this case, the total thickness (D2) of the second conductive pattern (TS-CP2) is the thickness (G4) of the fourth conductive layer (CD4), the thickness (G5) of the fifth conductive layer (CD5), and the sixth conductive layer ( It is the sum of the thickness (D6) of CD6).

The fifth conductive layer (CD5) may have a smaller electrical resistivity than each of the fourth conductive layer (CD4) and the sixth conductive layer (CD6). That is, the fifth conductive layer (CD5) may have better electrical conductivity than each of the fourth conductive layer (CD4) and the sixth conductive layer (CD6). The fourth conductive layer (CD4), the fifth conductive layer (CD5), and the sixth conductive layer (CD6) can each use common materials known in the art as long as they satisfy the above relationship. For example, it may be selected from silver, copper, aluminum, titanium, molybdenum, and alloys thereof. Although not limited thereto, the fourth conductive layer (CD4) and the sixth conductive layer (CD6) may each contain titanium (Ti), and the fifth conductive layer (CD5) may contain aluminum (Al).

The thickness G5 of the fifth conductive layer CD5 may be greater than the thickness G4 of the fourth conductive layer CD4 and the thickness G6 of the sixth conductive layer CD6. The thickness G5 of the fifth conductive layer CD5 may be at least four times greater than the thickness G4 of the fourth conductive layer CD4. The thickness G5 of the fifth conductive layer CD5 may be at least four times greater than the thickness G6 of the sixth conductive layer CD6.

The fifth conductive layer (CD5) is an essential component for the second conductive pattern (TS-CP2) to function as a conductive pattern, and the fourth conductive layer (CD4) and sixth conductive layer (CD6) ensure process stability. It may serve as a protective layer to protect the fifth conductive layer (CD5). Specifically, the fourth conductive layer (CD4) protects the fifth conductive layer (CD5) from factors occurring below the second conductive pattern (CP2), and the sixth conductive layer (CD6) protects the fifth conductive layer (CD5) during the etching process. It may play a role in preventing damage to the layer (CD5).

The thickness G2 of the second conductive layer CD2 may be smaller than the thickness G5 of the fifth conductive layer CD5. That is, the thickness (G2) of the second conductive layer (CD2) of the first conductive pattern (TS-CP1) is smaller than the thickness (G5) of the fifth conductive layer (CD5) of the second conductive pattern (TS-CP2). , the overall thickness can be adjusted to be smaller than that of the second conductive pattern (TS-CP2).

The thickness G1 of the first conductive layer CD1 may be smaller than the thickness of the fourth conductive layer CD4. That is, the first conductive pattern (TS-CP1) divides the thickness (G1) of the first conductive layer (CD1), which is the lower protective layer, into the fourth conductive layer (CD4) that is the lower protective layer of the second conductive pattern (TS-CP2). By making it smaller than the thickness (G4), the overall thickness can be adjusted to be smaller than the second conductive pattern (TS-CP2).

For example, the thickness G4 of the fourth conductive layer CD4 is 250Å to 350Å, the thickness G5 of the fifth conductive layer CD5 is 2200Å to 2800Å, and the thickness of the sixth conductive layer CD6 is ( G6) may be 250Å to 350Å. For example, the thickness G4 of the fourth conductive layer CD4 is about 300 Å, the thickness G5 of the fifth conductive layer CD5 is about 2500 Å, and the thickness G6 of the sixth conductive layer CD6 is about 2500 Å. may be about 300 Å. However, it is not limited thereto.

The display device DD according to an embodiment of the present invention can reduce the crack occurrence rate of the insulating layer (first touch insulating layer, TS-IL1) included in the touch sensing unit TS. As a result, the display device DD according to an embodiment of the present invention can minimize short circuit defects in the touch sensing unit TS.

Above, embodiments of the present invention have been described with reference to the attached drawings, but those skilled in the art will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. You will understand that it exists. Therefore, the embodiments described above should be understood in all respects as illustrative and not restrictive.

TS-CP1: First conductive pattern TS-IL1: First touch insulating layer
TS-CP2: Second conductive pattern D1: Thickness of first conductive pattern
D2: Thickness of second conductive pattern D3: Thickness of first touch insulating layer

Claims (15)

Organic light emitting device layer;
a thin film encapsulation layer disposed on the organic light emitting device layer;
a buffer layer disposed directly on the thin film encapsulation layer; and
a touch sensing unit disposed directly on the buffer layer; Including,
The touch sensing unit is
a first conductive pattern including a first conductive layer disposed on the buffer layer, a second conductive layer disposed on the first conductive layer, and a third conductive layer disposed on the second conductive layer;
an insulating layer covering the first conductive pattern; and
and a fourth conductive layer disposed on the insulating layer, a fifth conductive layer disposed on the fourth conductive layer, and a sixth conductive layer disposed on the fifth conductive layer, and greater than the first conductive pattern. a second conductive pattern having a large thickness; Including,
When viewed from a second direction intersecting the first direction, the first conductive pattern and the second conductive pattern each have an inclined surface along the first direction, and the first direction and the second direction define the thickness. A display device that intersects the third direction. According to clause 1,
A first upper surface of the second conductive pattern connected to one side of the inclined surface overlaps the first conductive layer in a plane view,
A second upper surface of the second conductive pattern connected to the other side of the inclined surface is spaced apart from the first conductive layer in a plane view,
The second upper surface has a lower height than the first upper surface. According to clause 1,
The first conductive pattern is directly disposed on the buffer layer. According to clause 1,
The thin film encapsulation layer is formed on the organic light emitting device layer using at least one of a deposition process, an inkjet printing process, and a coating process. According to clause 4,
The thin film encapsulation layer is a display device including an inorganic layer disposed on the organic light emitting device layer. According to clause 4,
The thin film encapsulation layer is a display device including an organic layer inkjet printed on the organic light emitting device layer. According to clause 4,
The thin film encapsulation layer is a display device including an organic layer coated on the organic light emitting device layer. According to clause 1,
A display device in which the thickness of the first conductive pattern is smaller than the thickness of the insulating layer. According to clause 8,
A display device in which the thickness of the insulating layer is the same as the thickness of the second conductive pattern. According to clause 1,
A display device in which the thickness of the second conductive layer is greater than each of the first conductive layer and the third conductive layer. According to clause 1,
A display device in which the thickness of the fifth conductive layer is greater than each of the fourth conductive layer and the sixth conductive layer. According to clause 1,
A display device in which the thickness of the second conductive layer is smaller than the thickness of the fifth conductive layer. According to clause 1,
A display device wherein a thickness difference between the second conductive layer and the first conductive layer is greater than a thickness difference between the third conductive layer and the first conductive layer. According to clause 1,
A display device in which a thickness difference between the fifth conductive layer and the fourth conductive layer is greater than a thickness difference between the sixth conductive layer and the fourth conductive layer. According to clause 1,
A display device in which a thickness difference between the fifth conductive layer and the fourth conductive layer is greater than a thickness difference between the second conductive layer and the first conductive layer.