KR102357271B1 - Display apparatus - Google Patents

Abstract

A display device includes a display panel including a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer, and disposed directly on the thin film encapsulation layer and a sensor including sensing electrodes, wherein the thin film encapsulation layer includes a first inorganic layer, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer, The upper surface includes a first upper surface and a second upper surface adjacent to the first upper surface, the sensing electrodes are disposed on the first upper surface and the second upper surface, and a sensing electrode disposed on the second upper surface of the sensing electrodes is curved along the shape of the second upper surface in the thickness direction of the display panel, the distance between the first upper surface and the base layer is a first distance, and the distance between the first portion of the second upper surface and the base layer is a second distance is greater than the first distance, a third distance between the second portion of the second upper surface and the base layer is less than the first distance, and the second portion of the second upper surface is the second portion of the second upper surface It may be spaced apart from the first upper surface with a second portion interposed therebetween.

Description

display device {DISPLAY APPARATUS}

The present invention relates to a display device, and to a display device including a touch sensing unit.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines have been developed. The input devices of the display devices include a keyboard or a mouse. Also, recently, display devices have a touch sensing unit as an input device.

An object of the present invention is to provide a display device including a touch sensing unit.

A display device according to an embodiment of the present invention includes a display panel including a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer; and a sensor including sensing electrodes disposed directly on the thin film encapsulation layer, wherein the thin film encapsulation layer comprises a first inorganic layer, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer. wherein an upper surface of the thin film encapsulation layer includes a first upper surface and a second upper surface adjacent to the first upper surface, wherein the sensing electrodes are disposed on the first upper surface and the second upper surface, and among the sensing electrodes A sensing electrode disposed on a second upper surface is bent in a thickness direction of the display panel according to a shape of the second upper surface, a distance between the first upper surface and the base layer is a first distance, and a second upper surface of the second upper surface is a first distance. a second distance between the first portion and the base layer is greater than the first distance, a third distance between the second portion of the second upper surface and the base layer is less than the first distance, and the second distance of the second upper surface The portion may be spaced apart from the first upper surface with the second portion of the second upper surface interposed therebetween.
The thin film encapsulation layer may further include a first thin film encapsulation region overlapping the first upper surface and a second thin film encapsulation region overlapping the second upper surface.
The sensor may be directly disposed on the display panel.
The second upper surface protruding more than the first upper surface is defined by a thickness of the thin film encapsulation layer, the first distance is an average of the distances between the first upper surface and the base layer, and the second distance is the second distance The maximum distance may be between the upper surface and the base layer, and the third distance may be the minimum distance between the second upper surface and the base layer.
The shape of the second upper surface may be controlled by the shape of the organic layer of the thin film encapsulation layer.
In a plan view, the organic layer may overlap the first thin film encapsulation region and the second thin film encapsulation region, and the upper surface of the thin film encapsulation layer may be an upper surface of the second inorganic layer of the thin film encapsulation layer.
In a plan view, the organic layer may not overlap the first thin film encapsulation region and may overlap the second thin film encapsulation region.
The display panel may further include a display area and a non-display area adjacent to the display area, and the second upper surface may be disposed between the first upper surface and the non-display area in a plan view.
On a plane, the second upper surface may surround the first upper surface.
A thickness of the display panel in the second area overlapping the second upper surface may be greater than a thickness of the display panel in the first area overlapping the first upper surface.
A display device according to an exemplary embodiment includes a base layer, a light emitting device layer disposed on the base layer, and a thin film encapsulation covering the light emitting device layer and including a first top surface and a second top surface adjacent to the first top surface layer, and sensing electrodes disposed on the first upper surface and the second upper surface, wherein the second upper surface has a first inclined surface extending in a direction away from the base layer, and the first inclined surface approaches the base layer from the first inclined surface and a second inclined surface extending in a direction toward
On a plane, the second upper surface may surround the first upper surface.
The second upper surface may include a region that protrudes from the first upper surface.
The thin film encapsulation layer may include an organic layer, and the shape of the second upper surface may be controlled by the shape of the organic layer.
In a plan view, the organic layer may overlap the first upper surface and the second upper surface.
In a plan view, the organic layer may not overlap the first upper surface and may overlap the second upper surface.
A first distance between a boundary between the first inclined surface and the second inclined surface and the second base layer may be greater than a second distance between the first upper surface and the base layer.
A distance between one point of the first inclined surface and the base layer may be greater than the second distance and smaller than the first distance.
A distance between one point of the second inclined surface and the base layer may be smaller than the second distance.
A display device according to an embodiment of the present invention includes a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer, the display area and a sensor including a display panel having a non-display area adjacent to the display area defined, and sensing electrodes disposed on the display area of the display panel, wherein the thin film encapsulation layer overlaps a first upper surface of the display panel and a second thin film encapsulation area overlapping a second upper surface of the display panel adjacent to the first upper surface, wherein the sensing electrodes are disposed on the first upper surface and the second upper surface; The thin film encapsulation layer includes an organic layer, and the shape of the second upper surface is controlled by the shape of the organic layer, and in a plan view, the organic layer does not overlap the first thin film encapsulation region, and overlaps the second thin film encapsulation region. can

According to an embodiment of the present invention, the thickness of the organic layer of the thin film encapsulation layer is adjusted. Accordingly, it is possible to control the deviation of the touch sensitivity of the touch sensing unit according to the change in the thickness of the thin film encapsulation layer.

1A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment.
1B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment.
1C is a perspective view illustrating a third operation of a display device according to an exemplary embodiment of the present invention.
2 is a cross-sectional view of a display device according to an exemplary embodiment.
3A and 3B are perspective views of a display device according to an exemplary embodiment.
4 is a perspective view of a display device according to an exemplary embodiment.
5A is a plan view of an organic light emitting display panel according to an exemplary embodiment.
5B is a cross-sectional view of a display module according to an embodiment of the present invention.
6A is an equivalent circuit diagram of a pixel according to an embodiment of the present invention.
6B is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment.
6C is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment.
7A is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment.
7B is a schematic plan view of a thin film encapsulation layer according to an embodiment of the present invention.
7C is a schematic plan view of a thin film encapsulation layer according to an embodiment of the present invention.
8A is a cross-sectional view taken along region II′ of FIG. 7B.
8B is a cross-sectional view taken along region II′ of FIG. 7B .
8C is a cross-sectional view taken along region II′ of FIG. 7B .
8D is a cross-sectional view taken along region II′ of FIG. 7B .
FIG. 9A is a partially enlarged view of area AA of FIG. 5B .
9B is a cross-sectional view of a touch sensing unit according to an embodiment of the present invention.
9C to 9E are plan views of a touch sensing unit according to an embodiment of the present invention.
FIG. 9F is a partially enlarged view of a region BB of FIG. 9E .
FIG. 10 is a cross-sectional view taken along region II-II′ of FIG. 9B .

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, and should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In this specification, when a component (or region, layer, part, etc.) is referred to as being “on”, “connected to” or “coupled to” another component, it is directly connected/connected on the other component. It means that they may be coupled or that a third component may be disposed between them.

Like reference numerals refer to like elements. In addition, in the drawings, thicknesses, ratios, and dimensions of components are exaggerated for effective description of technical content. “and/or” includes any combination of one or more that the associated configurations may define.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In addition, terms such as "below", "below", "above", and "upper side" are used to describe the relationship of the components shown in the drawings. The above terms are relative concepts, and are described based on directions indicated in the drawings.

Terms such as “comprise” or “have” are intended to designate that a feature, number, step, action, component, part, or combination thereof described in the specification is present, and includes one or more other features, number, or step. , it should be understood that it does not preclude the possibility of the existence or addition of an operation, a component, a part, or a combination thereof.

1A is a perspective view illustrating a first operation of a display device DD according to an exemplary embodiment. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment. 1C is a perspective view illustrating a third operation of a display device DD according to an exemplary embodiment.

As illustrated in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to a surface defined by the first direction DR1 and the second direction DR2 . The third direction DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. A front surface (or an upper surface) and a rear surface (or a lower surface) of each member are divided by the third direction DR3 . However, the directions indicated by the first to third directions DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third directions DR1 , DR2 , and DR3 , respectively.

1A to 1C illustrate a flexible and foldable display device as an example of the display device DD. However, the present invention may be a rollable display device or a banded display device that is rolled, and is not particularly limited. Also, although the flexible display device is illustrated in the present embodiment, the present invention is not limited thereto. The display device DD according to the present exemplary embodiment may be a flat rigid display device or a curved rigid display device. The display device DD according to the present invention may be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game machines, and smart watches.

1A , the display surface IS of the display device DD may include a plurality of regions. The display device DD includes a display area DD-DA in which an image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which an image is not displayed. 1A shows a vase as an example of the image IM. As an example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the present invention is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be designed relatively.

1A to 1C , the display device DD may include a plurality of regions defined according to an operation type. The display device DD includes the bending area BA, the first non-bending area NBA1, and the second non-bending area NBA2 that are bent on the basis of the bending axis BX. may include

As illustrated in FIG. 1B , the display device DD is inner bent so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As illustrated in FIG. 1C , the display device DD may be outer-bending so that the display surface IS is exposed to the outside.

Although only one bending area BA is illustrated in FIGS. 1A to 1C , the present invention is not limited thereto. For example, in an embodiment of the present invention, the display device DD may include a plurality of bending areas BA.

In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes illustrated in FIGS. 1A and 1B . However, the present invention is not limited thereto, and the bending area BA may be defined to correspond to a shape in which the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C , the bending area BA may be defined in parallel to the first direction DR1 or may be defined in a diagonal direction. The area of the bending area BA is not fixed and may be determined according to a radius of curvature.

2 is a cross-sectional view of a display device DD according to an exemplary embodiment. 2 illustrates a cross-section defined by the second direction DR2 and the third direction DR3.

2 , the display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, and a second adhesive member ( AM2), and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, the second adhesive member AM2 couples the display module DM and the optical member LM, and the third adhesive member (AM3) combines the optical member (LM) and the window (WM).

The protective film PM protects the display module DM. The protective film PM provides the first outer surface OS-L exposed to the outside, and provides an adhesive surface that is adhered to the first adhesive member AM1 . The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external shocks.

The protective film PM may include a plastic film as a base substrate. Protective film (PM) is polyethersulfone (PES, polyethersulfone), polyacrylate (polyacrylate), polyetherimide (PEI, polyetherimide), polyethylene naphthalate (PEN, polyethylenenaphthalate), polyethylene terephthalate (PET, polyethyleneterephthalate), poly phenylene sulfide (PPS, polyphenylene sulfide), polyarylate (polyarylate), polyimide (PI, polyimide), polycarbonate (PC, polycarbonate), poly(arylene ethersulfone), and combinations thereof It may include a plastic film comprising any one selected from the group consisting of.

The material constituting the protective film PM is not limited to plastic resins, and may include an organic/inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In an embodiment of the present invention, the protective film PM may be omitted.

The window WM may protect the display module DM from external impact and may provide an input surface to the user. The window WM provides the second outer surface OS-U exposed to the outside, and provides an adhesive surface that is adhered to the second adhesive member AM2 . The display surface IS illustrated in FIGS. 1A to 1C may be the second outer surface OS-U.

The window WM may include a plastic film. The window WM may have a multi-layered structure. The window WM may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window WM may further include a bezel pattern. The multi-layer structure may be formed through a continuous process or an adhesion process using an adhesive layer.

The optical member LM reduces external light reflectance. The optical member LM may include at least a polarizing film. The optical member LM may further include a retardation film. In an embodiment of the present invention, the optical member LM may be omitted.

The display module DM may include an organic light emitting display panel DP or a display panel and a touch sensing unit TS. The touch sensing unit TS is directly disposed on the organic light emitting display panel DP. In the present specification, "directly disposed" means that it is formed by a continuous process, except for attachment using a separate adhesive layer.

The organic light emitting display panel DP generates an image IM (refer to FIG. 1A ) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing in the thickness direction DR3. Although the organic light emitting display panel DP has been exemplarily described in this embodiment, the display panel is not limited thereto.

The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may sense an external input in a capacitive manner.

Although not shown separately, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a stacked structure of a conductive layer/insulating layer/conductive layer. The anti-reflection layer absorbs or destructively interferes with or polarizes light incident from the outside to reduce the reflectance of external light. The anti-reflection layer may replace the function of the optical member LM.

Each of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 is an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). Alternatively, it may be an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as polyurethane, polyacrylic, polyester, polyepoxy, or polyvinyl acetate.

Although not shown separately, the display device DD may further include a frame structure supporting the functional layers to maintain the state illustrated in FIGS. 1A to 1C . The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of a display device DD-1 according to an exemplary embodiment. FIG. 3A shows the display device DD-1 in an unfolded state, and FIG. 3B shows the display device DD-1 in a bent state.

The display device DD-1 may include one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD-1 may be bent. However, in an embodiment of the present invention, the bending area of the display device DD-1 may be changed.

Unlike the display device DD illustrated in FIGS. 1A to 1C , the display device DD-1 according to the present exemplary embodiment may be fixed in a single shape to operate. The display device DD-1 may operate in a bent state as shown in FIG. 3B . The display device DD-1 may be fixed to a frame or the like in a bent state, and the frame may be coupled to a housing of the electronic device.

The display device DD-1 according to the present exemplary embodiment may have the same cross-sectional structure as shown in FIG. 2 . However, the non-bending area NBA and the bending area BA may have different stacked structures. The non-bending area NBA may have the same cross-sectional structure as shown in FIG. 2 , and the bending area BA may have a different cross-sectional structure from that illustrated in FIG. 2 . The optical member LM and the window WM may not be disposed in the bending area BA. That is, the optical member LM and the window WM may be disposed only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may also not be disposed in the bending area BA.

4 is a perspective view of a display device DD-2 according to an exemplary embodiment.

The display device DD-2 includes a non-bending area (NBA, or planar area) in which the main image is displayed on the front side and a bending area (BA, or a side area) in which the sub image is displayed on the side. Although not shown separately, the sub-image may include an icon providing predetermined information. In the present embodiment, the terms "non-bending area NBA and bending area BA" define the display device DD-2 as a plurality of areas divided by shapes.

In this embodiment, the display device DD-2 including one bending area BA bent from one side of the non-bending area NBA is illustrated as an example. The display device DD-2 according to an exemplary embodiment may include two bending areas bent from both sides of the non-bending area NBA.

The bending area BA bent from the non-bending area NBA displays a sub-image in a fourth direction DR4 crossing the first direction DR1 , the second direction DR2 , and the third direction DR3 . . However, the directions indicated by the first to fourth directions DR1 to DR4 are relative concepts and may be converted into other directions.

5A is a plan view of an organic light emitting display panel DP according to an embodiment of the present invention, and FIG. 5B is a cross-sectional view of a display module DM according to an embodiment of the present invention.

As shown in FIG. 5A , the organic light emitting display panel DP includes a display area DA and a non-display area NDA in a plan view. The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (refer to FIG. 1A ) and the non-display area DD-NDA of the display device DD (refer to FIG. 1A ). , respectively, see FIG. 1A ). The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (refer to FIG. 1A ) and the non-display area DD-NDA of the display device DD (refer to FIG. 1A ). , refer to FIG. 1A ), and may be changed according to the structure/design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of pixels PX. An area in which the plurality of pixels PX are disposed is defined as the display area DA. In the present exemplary embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The organic light emitting display panel DP includes gate lines GL, data lines DL, light emitting lines EL, control signal line SL-D, initialization voltage line SL-Vint, and voltage line ( SL-VDD), and a pad part PD.

The gate lines GL are respectively connected to a corresponding pixel PX of the plurality of pixels PX, and the data lines DL are respectively connected to a corresponding pixel PX of the plurality of pixels PX. do. Each of the light emitting lines EL may be arranged in parallel with a corresponding one of the gate lines GL. The control signal line SL-D may provide control signals to the gate driving circuit GDC. The initialization voltage line SL-Vint may provide an initialization voltage to the plurality of pixels PX. The voltage line SL-VDD is connected to the plurality of pixels PX and may provide a first voltage to the plurality of pixels PX. The voltage line SL-VDD may include a plurality of lines extending in the first direction DR1 and a plurality of lines extending in the second direction DR2 .

A gate driving circuit GDC to which the gate lines GL and the light emitting lines EL are connected may be disposed on one side of the non-display area NDA. Some of the gate lines GL, the data lines DL, the light emitting lines EL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line are disposed on the same layer, Some are placed on different floors.

The pad part PD may be connected to ends of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD.

As shown in FIG. 5B , the organic light emitting display panel DP includes a base layer SUB, a circuit layer DP-CL disposed on the base layer SUB, a light emitting device layer DP-OLED, and a thin film. and an encapsulation layer (TFE).

The base layer SUB may include at least one plastic film. The base layer SUB is a flexible substrate and may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite substrate. The plastic substrate is at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin may include

The circuit layer DP-CL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL may constitute signal lines or a control circuit of a pixel.

The light emitting device layer DP-OLED includes organic light emitting diodes.

The thin film encapsulation layer TFE seals the light emitting device layer DP-OLED. The thin film encapsulation layer (TFE) includes a plurality of inorganic layers and at least one organic layer disposed therebetween. The inorganic layers protect the light emitting device layer (DP-OLED) from moisture/oxygen, and the organic layer protects the light emitting device layer (DP-OLED) from foreign substances such as dust particles. In the present invention, the thickness of the organic layer may be adjusted so that the touch sensing unit TS provides uniform touch sensitivity. This will be described in detail later.

The touch sensing unit TS is disposed on the thin film encapsulation layer TFE. The touch sensing unit TS includes touch sensors and touch signal lines. The touch sensors and the touch signal lines may have a single-layer or multi-layer structure.

The touch sensors and the touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The touch sensors and the touch signal lines may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensors and the touch signal lines may have the same layer structure or different layer structures. Specific details of the touch sensing unit TS will be described later.

6A is an equivalent circuit diagram of a pixel PX according to an exemplary embodiment.

FIG. 6A exemplarily illustrates the i-th pixel PXi connected to the k-th data line DLk among the plurality of data lines DL (refer to FIG. 5A ).

The i-th pixel PXi includes an organic light emitting diode OLED and a pixel driving circuit for controlling the organic light emitting diode. The driving circuit may include seven thin film transistors T1 to T7 and one storage capacitor Cst.

The driving transistor controls the driving current supplied to the organic light emitting diode (OLED). The output electrode of the second transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second transistor T2 may be in direct contact with the anode of the organic light emitting diode OLED or may be connected via another transistor (the sixth transistor T6 in this embodiment).

A control electrode of the control transistor may receive a control signal. The control signal applied to the i-th pixel PXi includes an i-1 th gate signal Si-1, an i-th gate signal Si, an i+1-th gate signal Si+1, a data signal Dk, and an i-th emission control signal Ei. In an embodiment of the present invention, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the i-th gate line GLi, and an output electrode connected to the output electrode of the second transistor T2 do. The first transistor T1 is turned on by the gate signal Si applied to the i-th gate line GLi (hereinafter, the i-th gate signal), and the data signal Dk applied to the k-th data line DLk. is provided to the storage capacitor (Cst).

6B is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment. 6C is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment. Specifically, FIG. 6B is a cross-sectional view of a portion corresponding to the first transistor T1 of the equivalent circuit shown in FIG. 6A . FIG. 6C is a cross-sectional view of a portion corresponding to the second transistor T2, the sixth transistor T6, and the organic light emitting diode (OLED) of the equivalent circuit shown in FIG. 6A .

6B and 6C , a buffer layer BFL may be disposed on the base layer SUB. The buffer layer BFL improves bonding strength between the base layer SUB and the conductive patterns or semiconductor patterns. The buffer layer BFL may include an inorganic layer. Although not shown separately, a barrier layer that prevents foreign substances from entering may be further disposed on the upper surface of the base layer SUB. The buffer layer BFL and the barrier layer may be selectively disposed or omitted.

On the buffer layer BFL, the semiconductor pattern OSP1 of the first transistor T1 (hereinafter, referred to as the first semiconductor pattern), the semiconductor pattern of the second transistor T2 (OSP2: hereinafter referred to as the second semiconductor pattern), and the sixth transistor T6 are disposed on the buffer layer BFL. A semiconductor pattern OSP6 (hereinafter referred to as a sixth semiconductor pattern) is disposed. The first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 may be selected from amorphous silicon, polysilicon, and metal oxide semiconductors.

A first insulating layer 10 may be disposed on the first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 . 6B and 6C exemplarily show that the first insulating layer 10 is provided in the form of a layer covering the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6. However, the first insulating layer 10 may be provided in a pattern disposed to correspond to the first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 .

The first insulating layer 10 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer.

On the first insulating layer 10 , a control electrode (GE1: hereinafter, first control electrode) of the first transistor T1, a control electrode (GE2: hereinafter, second control electrode) of the second transistor T2, a sixth A control electrode GE6 (hereinafter, referred to as a sixth control electrode) of the transistor T6 is disposed. The first control electrode GE1 , the second control electrode GE2 , and the sixth control electrode GE6 may be manufactured according to the same photolithography process as the gate lines GL (refer to FIG. 5A ).

A second insulating layer 20 covering the first control electrode GE1 , the second control electrode GE2 , and the sixth control electrode GE6 may be disposed on the first insulating layer 10 . The second insulating layer 20 may provide a flat top surface. The second insulating layer 20 may include an organic material and/or an inorganic material.

On the second insulating layer 20 , an input electrode SE1 and an output electrode DE1 of the first transistor T1 and an input electrode DE1 of the second transistor T2 are formed on the second insulating layer 20 . SE2: Hereinafter, a second input electrode) and an output electrode (DE2: a second output electrode), an input electrode (SE6: hereinafter, a sixth input electrode) and an output electrode (DE6: a sixth output electrode) of the sixth transistor T6 ) is placed.

The first input electrode SE1 and the first output electrode DE1 form a first through hole CH1 and a second through hole CH2 passing through the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the first semiconductor pattern OSP1 through the The second input electrode SE2 and the second output electrode DE2 form a third through hole CH3 and a fourth through hole CH4 passing through the first insulating layer 10 and the second insulating layer 20 . through the second semiconductor pattern OSP2. The sixth input electrode SE6 and the sixth output electrode DE6 form a fifth through hole CH5 and a sixth through hole CH6 passing through the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the sixth semiconductor pattern OSP6 through the Meanwhile, in another embodiment of the present invention, the first transistor T1 , the second transistor T2 , and the sixth transistor T6 may be modified to have a bottom gate structure.

On the second insulating layer 20 , a first input electrode SE1 , a second input electrode SE2 , a sixth input electrode SE6 , a first output electrode DE1 , a second output electrode DE2 , a second 6 A third insulating layer 30 covering the output electrode DE6 is disposed. The third insulating layer 30 includes an organic layer and/or an inorganic layer. In particular, the third insulating layer 30 may include an organic material to provide a flat surface.

Any one of the first insulating layer 10 , the second insulating layer 20 , and the third insulating layer 30 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 20 and the third insulating layer 30 may be defined as an interlayer. The interlayer insulating layer is disposed between the conductive pattern disposed below and the conductive pattern disposed above the interlayer insulating layer to insulate the conductive patterns.

A pixel defining layer PDL and an organic light emitting diode OLED are disposed on the third insulating layer 30 . An anode AE is disposed on the third insulating layer 30 . The anode AE is connected to the sixth output electrode DE6 through the seventh through hole CH7 penetrating the third insulating layer 30 . An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the anode AE.

The pixel PX may be disposed in the pixel area on a plane. The pixel area may include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA may surround the light emission area PXA. In the present exemplary embodiment, the emission area PXA is defined to correspond to a partial area of the anode AE exposed by the opening OP.

The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-emission area NPXA. Although not shown separately, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (refer to FIG. 5A ).

An organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML may be disposed in a region corresponding to the opening OP. That is, the organic light emitting layer EML may be formed separately in each of the plurality of pixels PX. Although the patterned organic light emitting layer EML is illustrated as an example in this embodiment, the organic light emitting layer EML may be commonly disposed on the plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. Also, the organic light emitting layer EML may have a multi-layered structure.

An electronic control layer (ECL) is disposed on the organic light emitting layer (EML). Although not shown separately, the electronic control layer ECL may be formed in common in the plurality of pixels PX (refer to FIG. 5A ).

A cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

A thin film encapsulation layer TFE is disposed on the cathode CE. The thin film encapsulation layer TFE is commonly disposed on the plurality of pixels PX. The thin film encapsulation layer (TFE) includes at least one inorganic layer and at least one organic layer. The thin film encapsulation layer TFE may include a plurality of inorganic layers and a plurality of organic layers that are alternately stacked.

In this embodiment, the thin film encapsulation layer TFE directly covers the cathode CE. In an embodiment of the present invention, a capping layer covering the cathode CE may be further disposed between the thin film encapsulation layer TFE and the cathode CE. In this case, the thin film encapsulation layer TFE may directly cover the capping layer.

7A is a partial cross-sectional view of an organic light emitting display panel DP according to an exemplary embodiment. Specifically, FIG. 7A is an enlarged cross-sectional view of the display area DA of the organic light emitting display panel DP of FIG. 5B .

Referring to FIG. 7A , the thin film encapsulation layer TFE may be divided into a first thin film encapsulation area TFA1 and a second thin film encapsulation area TFA2 .

The upper surface TFE-U of the thin film encapsulation layer TFE facing the touch sensing unit TS (refer to FIG. 5B ) is a first upper surface TFE-U1 and a second thin film disposed in the first thin film encapsulation area TFA1. A second upper surface TFE-U2 disposed on the encapsulation area TFA2 may be included.

The first upper surface TFE-U1 may be parallel to the base layer SUB. For example, the first top surface TFE-U1 may be parallel to the top surface of the base layer SUB. When the organic light emitting display panel DP has a flat shape, both the first upper surface TFE-U1 and the base layer SUB may have a flat shape. Also, when the organic light emitting display panel DP is curved in a predetermined direction, both the first upper surface TFE-U1 and the base layer SUB may have a curved shape in the predetermined direction.

"Parallel" described in this specification does not mean only "parallel (do not meet each other no matter how extended)" in the dictionary meaning. For example, the first upper surface TFE-U1 may have a non-planar upper surface. Specifically, a reference plane (not shown) parallel to the base layer SUB on the cross-section is defined in a dictionary meaning. The first upper surface TFE-U1 vibrates in a direction approaching the base layer SUB and away from the base layer SUB with respect to the reference plane, and may extend along the reference plane. The difference between the distance between the first upper surface TFE-U1 and the base layer SUB and the distance between the reference surface and the base layer SUB may be 0 to a predetermined error range. The predetermined error range may be several hundred nanometers or less.

The second upper surface TFE-U2 may convexly protrude in a direction away from the base layer SUB, for example, in the third direction DR3 . Specifically, the second upper surface TFE-U2 protrudes in a direction away from the base layer SUB from the reference surface RL extending from the first upper surface TFE-U1 (eg, the third direction DR3 ). can be

The distance between the first upper surface TFE-U1 and the base layer SUB may be the first distance DT1 . For example, since the first upper surface TFE-U1 is parallel to the base layer SUB, the distance between each point on the first upper surface TFE-U1 and the base layer SUB is substantially the same within a predetermined error range. can do. For example, the predetermined error range may be several hundred nanometers or less. Specifically, the predetermined error range may be 500 nanometers or less.

As used herein, “distance” means a distance measured in a direction parallel to the thickness direction of the organic light emitting display panel DP. For example, when the organic light emitting display panel DP is flat, the “distance” may be a distance parallel to the third direction DR3. Also, when the organic light emitting display panel DP is bent, the “distance” may be a distance measured along a normal direction perpendicular to the tangent of the measurement point.

The distance between the second upper surface TFE-U2 and the base layer SUB is within a range of a second distance DT2 greater than the first distance DT1 and a third distance DT3 smaller than the first distance DT1 . You can walk various distances. That is, the maximum distance between the second upper surface TFE-U2 and the base layer SUB is the second distance DT2, and the minimum distance between the second upper surface TFE-U2 and the base layer SUB is the third distance ( DT3).

The second upper surface TFE-U2 may include a peak PK, a first inclined surface IS1 , and a second inclined surface IS2 . The peak PK may be defined as a predetermined region within the second upper surface TFE-U2 spaced apart from the base layer SUB by a second distance DT2 . That is, the peak PK may be a region having the greatest distance from the base layer SUB. The first inclined surface IS1 may extend in a direction away from the base layer SUB, and may connect the first upper surface TFE-U1 and the peak PK. The second inclined surface IS2 may extend from the peak PK toward the base layer SUB.

In the present embodiment, the term "the first thin film encapsulation area TFA1 and the second thin film encapsulation area TFA2" defines the thin film encapsulation layer TFE as a plurality of areas divided by the shape of the top surface. "The first thin film encapsulation area TFA1 and the second thin film encapsulation area TFA2" may be defined not only on a plane defined by the first direction DR1 and the second direction DR2 but also on a cross-section. That is, the “first thin film encapsulation area TFA1 and the second thin film encapsulation area TFA2” may be regions defined in three dimensions.

7B is a schematic plan view of a thin film encapsulation layer (TFE) according to an embodiment of the present invention. Specifically, FIG. 7B briefly illustrates the relationship between the first thin film encapsulation area TFA1, the second thin film encapsulation area TFA2, the display area DA, and the non-display area NDA when viewed in the thickness direction. will be.

The first thin film encapsulation area TFA1 and the second thin film encapsulation area TFA2 may overlap the display area DA in a plan view. In a plan view, the first thin film encapsulation area TFA1 may be surrounded by the second thin film encapsulation area TFA2 . Accordingly, the second thin film encapsulation area TFA2 may be disposed between the non-display area NDA and the first thin film encapsulation area TFA1 .

7B is a schematic plan view of a thin film encapsulation layer (TFEa) according to an embodiment of the present invention. 7C , there is a difference in the positional relationship between the first thin film encapsulation area TFA1a and the second thin film encapsulation area TFA2a compared with FIG. 7B .

Referring to FIG. 7C , the second thin film encapsulation area TFA2a may be disposed on both side surfaces of the first thin film encapsulation area TFA1a. For example, in FIG. 7C , the second thin film encapsulation area TFA2a , the first thin film encapsulation area TFA1a , and the second thin film encapsulation area TFA2a may be sequentially arranged along the second direction DR2 .

The arrangement relationship between the first thin film encapsulation region and the second thin film encapsulation region is not limited to FIGS. 7B and 7C , which have been exemplarily described above. For example, the second thin film encapsulation area may be disposed on only one side of the first thin film encapsulation area or may be disposed on three side surfaces of the first thin film encapsulation area.

FIG. 8A is a cross-sectional view taken along region I-I′ of FIG. 7B.

Referring to FIG. 8A , the thin film encapsulation layer TFE may include a first inorganic layer IOL1 , a second inorganic layer IOL2 , and a first organic layer OL1 .

The first inorganic layer IOL1 may be disposed on the cathode CE (refer to FIG. 6C ). The first organic layer OL1 may be disposed on the first inorganic layer IOL1 . The second inorganic layer IOL2 may be disposed on the first organic layer OL1 .

The first inorganic layer IOL1 and the second inorganic layer IOL2 may be a single layer including one material or may have multiple layers each including a different material. The first organic layer OL1 may include a polymer including a monomer. The first organic layer OL1 may be formed using an inkjet printing method or may be formed by coating a composition including an acrylic monomer. The shape of the second upper surface TFE-U2 of the thin film encapsulation layer TFE may be provided by the first organic layer OL1 . The first organic layer OL1 may include a lower surface OL1-B and an upper surface OL1-U. The lower surface OL1-B of the first organic layer OL1 is in contact with the first inorganic layer IOL1, and the upper surface OL1-U of the first organic layer OL1 is in contact with the second inorganic layer IOL2. is the side The lower surface OL1 -B of the first organic layer OL1 may have a shape corresponding to the shape of the first inorganic layer IOL1 .

The top surface OL1-U of the first organic layer OL1 may include a first surface OL1-U1 and a second surface OL1-U2. The first surfaces OL1 - U1 may be disposed in the first thin film encapsulation area TFA1 and may be parallel to the base layer SUB (refer to FIG. 7A ). The second surfaces OL1 - U2 may be disposed in the second thin film encapsulation area TFA2 and may be convex in a direction away from the base layer SUB (refer to FIG. 7A ). The second surfaces OL1-U2 may be formed by controlling the amount of the composition including the monomer to be printed on the second thin film encapsulation area TFA2 or adjusting the printing time.

8B and 8C are cross-sectional views taken along region I-I′ of FIG. 7B.

8B and 8C , each of the thin film encapsulation layers TFE-1 and TFE-2 is a first inorganic layer IOL1, a second inorganic layer IOL2, a third inorganic layer IOL3, and a first It may include an organic layer OL1 and a second organic layer OL2 .

The first inorganic layer IOL1 may be disposed on the cathode CE (refer to FIG. 6C ). The first organic layer OL1 may be disposed on the first inorganic layer IOL1 . The second inorganic layer IOL2 may be disposed on the first organic layer OL1 . The second organic layer OL2 may be disposed on the second inorganic layer IOL2 . The third inorganic layer IOL3 may be disposed on the second organic layer OL2 .

A top surface of at least one of the first organic layer OL1 and the second organic layer OL2 is disposed in the first thin film encapsulation area TFA1 and is parallel to the base layer SUB (refer to FIG. 7A ). The thin film encapsulation area TFA2 may include a convex second surface in a direction away from the base layer SUB (refer to FIG. 7A ).

As illustrated in FIG. 8B , the second organic layer OL2 of the thin film encapsulation layer TFE-1 includes an upper surface OL2-U. The upper surface OL2-U is disposed in the first thin film encapsulation area TFA1 and is disposed on the first surface OL2-U1 and the second thin film encapsulation area TFA2 parallel to the base layer SUB (refer to FIG. 7A ). A second surface OL2-U2 convex in a direction away from the base layer SUB (refer to FIG. 7A ) may be included.

As shown in FIG. 8C , the first organic layer OL1 of the thin film encapsulation layer TFE-2 includes the upper surface OL1-U. The upper surface OL1-U is disposed on the first thin film encapsulation area TFA1 and is disposed on the first surface OL1-U1 and the second thin film encapsulation area TFA2 parallel to the base layer SUB (refer to FIG. 7A ). It may include second surfaces OL1-U2 convex in a direction away from the base layer SUB (refer to FIG. 7A ).

The second organic layer OL2 of the thin film encapsulation layer TFE-2 includes an upper surface OL2-U. The upper surface OL2-U is disposed in the first thin film encapsulation area TFA1 and is disposed on the first surface OL2-U1 and the second thin film encapsulation area TFA2 parallel to the base layer SUB (refer to FIG. 7A ). A second surface OL2-U2 convex in a direction away from the base layer SUB (refer to FIG. 7A ) may be included.

When the thin film encapsulation layer includes a plurality of organic layers, the shape of the upper surface of the thin film encapsulation layer may be controlled by adjusting the thickness of any one organic layer among the plurality of organic layers or at least two organic layers among the plurality of organic layers.

8B and 8C exemplarily illustrate that the thin film encapsulation layer includes three inorganic layers and two organic layers, but is not limited thereto. For example, the thin film encapsulation layer may include three or more inorganic layers and two or more organic layers, and the organic layers may be alternately disposed with the inorganic layers. The thickness of the organic layers may be greater than the thickness of the inorganic layers on average.

FIG. 8D is a cross-sectional view taken along region I-I′ of FIG. 7B.

Referring to FIG. 8D , the thin film encapsulation layer TFE-3 may include a first inorganic layer IOL1 , a second inorganic layer IOL2 , a first organic layer OL1 , and an organic coating layer OC.

The first inorganic layer IOL1 may be disposed on the cathode CE (refer to FIG. 6C ). The first organic layer OL1 may be disposed on the first inorganic layer IOL1 . The second inorganic layer IOL2 may be disposed on the first organic layer OL1 . The organic coating layer OC may be disposed on the second inorganic layer IOL2 .

The organic coating layer OC may include a convex top surface in a direction away from the base layer SUB (refer to FIG. 7A ). In the present embodiment, it is illustrated that the organic coating layer OC is disposed on the second thin film encapsulation area TFA2 , but the present invention is not limited thereto. For example, the organic coating layer OC may also be disposed on the first thin film encapsulation area TFA1 .

FIG. 9A is a partially enlarged view of area AA of FIG. 5B . 9B to 9E are plan views of a touch sensing unit TS according to an embodiment of the present invention.

As shown in FIG. 9A , the touch sensing unit TS includes a first conductive layer TS-CL1, a first insulating layer TS-IL1 (hereinafter, referred to as a first touch insulating layer), and a second conductive layer TS-CL2. ), and a second insulating layer (TS-IL2, hereinafter referred to as a second touch insulating layer). The first conductive layer TS-CL1 is disposed on the thin film encapsulation layer TFE. The touch sensing unit TS may have a curved shape in some regions corresponding to the shape of the upper surface TFE-U of the thin film encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a single-layer structure or a multi-layer structure stacked along the third direction DR3 . The multi-layered conductive layer may include at least two or more of transparent conductive layers and metal layers. The multi-layered conductive layer may include metal layers including different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, it will be described that the first conductive layer TS-CL1 includes first conductive patterns and the second conductive layer TS-CL2 includes second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include touch electrodes and touch signal lines.

Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may have a single-layered or multi-layered structure. Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include at least one of an inorganic layer and an organic layer.

For the first touch insulating layer TS-IL1 , it is sufficient to insulate the first conductive layer TS-CL1 and the second conductive layer TS-CL2 , and the shape thereof is not limited. The shape of the first touch insulating layer TS-IL1 may be changed according to the shapes of the first conductive patterns and the second conductive patterns. The first touch insulating layer TS-IL1 may entirely cover the thin film encapsulation layer TFE or may include a plurality of insulating patterns. It is sufficient if the plurality of insulating patterns overlap the first connection parts CP1 or second connection parts CP2 to be described later.

Although the two-layer type touch sensing unit is illustrated as an example in this embodiment, the present invention is not limited thereto. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and touch signal lines connected to the touch sensors. The single-layer touch sensing unit may acquire coordinate information in a self-cap method.

As shown in FIG. 9B , the touch sensing unit TS includes first touch electrodes TE1-1 to TE1-4, and first touch signal lines SL1-1 to SL1- connected to the first touch electrodes. 4), the second touch electrodes TE2-1 to TE2-5, and the second touch signal lines SL2-1 to SL2-5 connected to the second touch electrodes TE2-1 to TE2-5. , and a pad part PADa connected to the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5.

Each of the first touch electrodes TE1-1 to TE1-4 has a shape extending along the first direction DR1 and may be arranged along the second direction DR2, and the second touch electrodes TE2- 1 to TE2 - 5 ) each have a shape extending along the second direction DR2 and may be arranged along the first direction DR1 .

9B exemplarily shows the touch sensing unit TS including four first touch electrodes TE1-1 to TE1-4 and five second touch electrodes TE2-1 to TE2-5. However, it is not limited thereto. For example, M number of first touch electrodes (M is an integer greater than or equal to 1) may be sequentially arranged along the second direction DR2 , and N second touch electrodes may be sequentially arranged along the first direction DR1 Numbers (N is an integer greater than or equal to 1) may be arranged.

In FIG. 9B , the first first touch electrode may be the first touch electrode TE1-1, and the M-th first touch electrode may be the first touch electrode TE1-4. Also, the first second touch electrode may be the second touch electrode TE2-1, and the N-th second touch electrode may be the second touch electrode TE2-N.

Each of the first touch electrodes TE1-1 to TE1-4 may have a mesh shape in which a plurality of touch openings are defined. Each of the first touch electrodes TE1-1 to TE1-4 includes a plurality of first touch sensor parts SP1 and a plurality of first connection parts CP1. The first touch sensor units SP1 are arranged along the first direction DR1. Each of the first connection parts CP1 connects two adjacent first touch sensor parts SP1 among the first touch sensor parts SP1 . Although not specifically illustrated, the first touch signal lines SL1-1 to SL1-4 may also have a mesh shape.

The second touch electrodes TE2-1 to TE2-5 insulate and cross the first touch electrodes TE1-1 to TE1-4. Each of the second touch electrodes TE2-1 to TE2-5 may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-5 includes a plurality of second touch sensor units SP2 and a plurality of second connection units CP2. The second touch sensor units SP2 are arranged along the second direction DR2. Each of the second connection parts CP2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2 . The second touch signal lines SL2-1 to SL2-5 may also have a mesh shape.

The first touch electrodes TE1-1 to TE1-4 and the second touch electrodes TE2-1 to TE2-5 are electrostatically coupled. As touch sensing signals are applied to the first touch electrodes TE1-1 to TE1-4, capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2.

A plurality of first touch sensor units SP1, a plurality of first connection units CP1, and first touch signal lines SL1-1 to SL1-4, a plurality of second touch sensor units SP2, a plurality of Some of the second connection portions CP2 and the second touch signal lines SL2-1 to SL2-5 are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A , and other portions are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A . may be formed by patterning the second conductive layer TS-CL2 illustrated in FIG. 6A .

Each of the first touch sensor units SP1 and the second touch sensor units SP2 may be defined as a central touch sensor unit SP-C or a peripheral touch sensor unit SP-S. The terms “center touch sensor unit SP-C and peripheral touch sensor unit SP-S” are terms defined according to positions in which touch sensor units are disposed.

Among the first touch sensor units SP1 , touch sensor units overlapping the first thin film encapsulation area TFA1 on a plane may be defined as a center touch sensor unit SP-C. Among the first touch sensor units SP1 , touch sensor units overlapping the second thin film encapsulation area TFA2 on a plane may be defined as peripheral touch sensor units SP-S. Also, among the second touch sensor units SP2 , touch sensor units overlapping the first thin film encapsulation area TFA1 on a plane may be defined as a center touch sensor unit SP-C, and may be defined as a second thin film encapsulation area on a planar view. The touch sensor units overlapping the TFA2 may be defined as a peripheral touch sensor unit SP-S. That is, the center touch sensor unit SP-C and the peripheral touch sensor unit SP-S are divided according to the location of the touch sensor unit.

Referring to FIG. 9B , the first touch sensor units SP1 constituting the two outermost first touch electrodes TE1-1 and TE1-4 disposed on the plane are all peripheral touch sensor units SP-S. can be defined as In addition, the second touch sensor units SP2 constituting the two outermost second touch electrodes TE2-1 and TE2-5 disposed on the plane are all to be defined as peripheral touch sensor units SP-S. can

Among the first touch electrodes TE1-1 to TE1-4, two first touch electrodes TE1-1 and TE1-4 may be closest to the non-display area NDA on a plane. Also, among the second touch electrodes TE2-1 to TE2-5, two second touch electrodes TE2-1 and TE2-5 may be closest to the non-display area NDA on a plane view. The two first touch electrodes TE1-1 and TE1-4 and the two second touch electrodes TE2-1 and TE2-5 may be defined as peripheral touch electrodes.

Some of the peripheral touch electrodes may overlap a peak (PK, see FIG. 7A ) on a plane. For example, as shown in FIG. 7B , when the second thin film encapsulation area TFA2 surrounds all sides of the first thin film encapsulation area TFA1 , the four peripheral touch electrodes TE1-1, TE1-4, TE2 -1, TE2-5) may overlap the peak (PK, see FIG. 7A ). Also, as shown in FIG. 7C , when the second thin film encapsulation area TFA2 surrounds only two side surfaces of the first thin film encapsulation area TFA1 , only the two peripheral touch electrodes TE1-1 and TE1-4 have peaks. (PK, see Fig. 7a) can be overlapped.

In order to electrically connect the conductive patterns disposed on different layers, a contact hole passing through the first touch insulating layer TS-IL1 shown in FIG. 9A may be formed. Hereinafter, a touch sensing unit TS according to an exemplary embodiment will be described with reference to FIGS. 9C to 9E .

As illustrated in FIG. 9C , first conductive patterns are disposed on the thin film encapsulation layer TFE. The first conductive patterns may include bridge patterns CP2. The bridge patterns CP2 are disposed on the thin film encapsulation layer TFE. The bridge patterns CP2 correspond to the second connection parts CP2 illustrated in FIG. 6B .

As illustrated in FIG. 9D , a first touch insulating layer TS-IL1 covering the bridge patterns CP2 is disposed on the thin film encapsulation layer TFE. Contact holes CH partially exposing the bridge patterns CP2 are defined in the first touch insulating layer TS-IL1 . Contact holes CH may be formed by a photolithography process.

As shown in FIG. 9E , second conductive patterns are disposed on the first touch insulating layer TS-IL1. The second conductive patterns include a plurality of first touch sensor units SP1, a plurality of first connection units CP1, first touch signal lines SL1-1 to SL1-4, and a plurality of second touch sensor units. It may include SP2 and second touch signal lines SL2-1 to SL2-5. Although not shown separately, the second touch insulating layer TS-IL2 covering the second conductive patterns is disposed on the first touch insulating layer TS-IL1 .

In another embodiment of the present invention, the first conductive patterns may include first touch electrodes TE1-1 to TE1-4 and first touch signal lines SL1-1 to SL1-4. The second conductive patterns may include second touch electrodes TE2-1 to TE2-5 and second touch signal lines SL2-1 to SL2-5. In this case, the contact holes CH are not defined in the first touch insulating layer TS-IL1 .

Also, in an embodiment of the present invention, the first conductive patterns and the second conductive patterns may be interchanged. That is, the second conductive patterns may include the bridge patterns CP2 .

FIG. 9F is a partially enlarged view of a region BB of FIG. 9E .

As illustrated in FIG. 9F , the first touch sensor unit SP1 overlaps the non-emission area NPXA. The first touch sensor unit SP1 includes a plurality of first extension units SP1-A extending in a fifth direction DR5 intersecting the first direction DR1 and the second direction DR2 and a fifth direction ( and a plurality of second extensions SP1 -B extending in a sixth direction DR6 intersecting with DR5. The plurality of first extension parts SP1-A and the plurality of second extension parts SP1-B may be defined as mesh lines. The line width of the mesh line may be several micrometers.

The plurality of first extension parts SP1-A and the plurality of second extension parts SP1-B are connected to each other to form a plurality of touch openings TS-OP. In other words, the first touch sensor unit SP1 has a mesh shape including a plurality of touch openings TS-OP. Although it is illustrated that the touch openings TS-OP correspond to the emission areas PXA one-to-one, the present invention is not limited thereto. One touch opening TS-OP may correspond to two or more light emitting areas PXA.

The size of the emission areas PXA may vary. For example, the size of the emission areas PXA providing blue light and the emission areas PXA providing red light among the emission areas PXA may be different from each other. Accordingly, sizes of the touch openings TS-OP may also vary. 9F exemplarily illustrates that the emission areas PXA have various sizes, but is not limited thereto. The size of the emission areas PXA may be the same, and the size of the touch openings TS-OP may also be the same.

FIG. 10 is a cross-sectional view taken along region II-II′ of FIG. 9B .

Referring to FIG. 10 , a cross section of one central touch sensor unit SP-C disposed on the thin film encapsulation layer TFE and one peripheral touch sensor unit SP-S disposed on the thin film encapsulation layer TFE is shown. shown. The central touch sensor unit SP-C is disposed on the first thin film encapsulation area TFA1 of the thin film encapsulation layer TFE, and the peripheral touch sensor unit SP-S encapsulates the second thin film encapsulation of the thin film encapsulation layer TFE. It may be disposed on the area TFA2. The central touch sensor unit SP-C may have a shape corresponding to the shape of the first upper surface TFE-U1 of the thin film encapsulation layer TFE, and the peripheral touch sensor unit SP-S may have a thin film encapsulation layer ( It may have a shape corresponding to the shape of the second upper surface TFE-U2 of the TFE. That is, the peripheral touch sensor unit SP-S may be curved to correspond to the shape of the second upper surface TFE-U2.

A width in the second direction DR2 of the second thin film encapsulation area TFA2 may be the same as a width in the second direction DR2 of one peripheral touch sensor unit SP-S. For example, the width of the second thin film encapsulation area TFA2 in the second direction DR2 may be 4 μm, and the width of the peripheral touch sensor unit SP-S may also be 4 μm. However, this is illustrative and not limited thereto.

The peak PK of the second thin film encapsulation area TFA2 may overlap the peripheral touch sensor unit SP-S on a plane surface. The position of the peak PK may be adjusted in a region overlapping the surrounding touch sensor unit SP-S on a plane.

A distance between each of the points in the center touch sensor unit SP-C and the base layer SUB may be a first distance SD1 . Since the second upper surface TFE-U2 is parallel to the base layer SUB, the distance between the center touch sensor unit SP-C and the base layer SUB is substantially within a predetermined error range at each point. may be identical to each other. For example, the predetermined error range may be several hundred nanometers or less. Specifically, the predetermined error range may be 500 nanometers or less.

A distance between each of the points in the peripheral touch sensor unit SP-S and the base layer SUB may vary. 9F exemplarily illustrates spacings SD2a and SD2b between the base layer SUB at two points of the peripheral touch sensor unit SP-S. The intervals SD2a and SD2b at each of the two points may be different from each other.

The organic layer of the thin film encapsulation layer (TFE) may be formed by an inkjet printing process. In this case, the thickness of the organic layer in the area adjacent to the non-display area (NDA, see FIG. 5B ) may decrease according to the flow of the organic layer. When the thickness of the organic layer is reduced, the distance between the touch sensing unit TS disposed on the thin film encapsulation layer TFE and the light emitting device layer DP-OLED disposed on the base layer SUB may become closer. That is, the distance between the touch sensing unit TS and the cathode CE (refer to FIG. 6C ) to which the second voltage ELVSS (refer to FIG. 6A ) is applied may become closer. In this case, a phenomenon may occur in which the electric field formed in the touch sensing unit TS is concentrated to the cathode CE (refer to FIG. 6C ) rather than the upper portion of the touch sensing unit TS (eg, a space to which a user's touch is input). Accordingly, the sensitivity of the touch sensing unit TS may decrease as the thickness of the organic layer decreases.

According to an embodiment of the present invention, the thickness of the thin film encapsulation layer TFE overlapping the second thin film encapsulation area TFA2 may be adjusted to compensate for the reduced thickness of the thin film encapsulation layer TFE. For example, by adjusting the amount of the composition including the printed monomer in the area adjacent to the non-display area (NDA, see FIG. 5B) or adjusting the printing time, the thin film encapsulation layer (TFE) is formed in the second thin film encapsulation area ( TFA2) can be made to have a convex shape. By adjusting the thickness of the second thin film encapsulation area TFA2, the average distance SD2-a between each point of the peripheral touch sensor unit SP-S and the base layer SUB is adjusted to the center touch sensor unit SP- The first interval SD1 between C) and the base layer SUB may be adjusted to be substantially the same within a predetermined error range. The predetermined error range may be several hundred nanometers or less. Specifically, the predetermined error range may be 500 nanometers or less. As a result, the difference between the touch sensitivity of the peripheral touch sensor unit SP-S and the touch sensitivity of the center touch sensor unit SP-C can be reduced, and the touch sensing unit TS having a uniform touch sensitivity is provided. can do.

Although the above has been described with reference to the preferred embodiment of the present invention, those skilled in the art or those having ordinary knowledge in the technical field will not depart from the spirit and technical scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention. Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

DD: display device DM: display module
DP: organic light emitting display panel TS: touch sensing unit
SUB: base layer DP-CL: circuit layer
DP-OLED: light emitting element layer TFE: thin film encapsulation layer
DA: display area NDA: non-display area

Claims (20)

a display panel including a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer; and
a sensor including sensing electrodes disposed directly on the thin film encapsulation layer;
The thin film encapsulation layer includes a first inorganic layer, an organic layer disposed on the first inorganic layer, and a second inorganic layer disposed on the organic layer,
The upper surface of the thin film encapsulation layer includes a first upper surface and a second upper surface adjacent to the first upper surface,
The sensing electrodes are disposed on the first upper surface and the second upper surface,
a sensing electrode disposed on the second upper surface of the sensing electrodes is curved in a thickness direction of the display panel along a shape of the second upper surface;
A distance between the first upper surface and the base layer is a first distance,
a second distance between the first portion of the second upper surface and the base layer is greater than the first distance;
a third distance between the second portion of the second upper surface and the base layer is smaller than the first distance;
The second portion of the second upper surface is spaced apart from the first upper surface with the first portion of the second upper surface interposed therebetween. According to claim 1,
The thin film encapsulation layer further includes a first thin film encapsulation region overlapping the first upper surface and a second thin film encapsulation region overlapping the second upper surface. 3. The method of claim 2,
The sensor is disposed directly on the display panel. 3. The method of claim 2,
The second upper surface protruding more than the first upper surface is defined by the thickness of the thin film encapsulation layer,
The first distance is an average of the distances between the first upper surface and the base layer,
The second distance is the maximum distance between the second upper surface and the base layer,
The third distance is a minimum distance between the second upper surface and the base layer. 3. The method of claim 2,
The shape of the second upper surface is controlled by the shape of the organic layer of the thin film encapsulation layer. 6. The method of claim 5,
On a plane, the organic layer overlaps the first thin film encapsulation region and the second thin film encapsulation region,
The upper surface of the thin film encapsulation layer is an upper surface of the second inorganic layer of the thin film encapsulation layer. 6. The method of claim 5,
In a plan view, the organic layer does not overlap the first thin film encapsulation region and overlaps the second thin film encapsulation region. According to claim 1,
The display panel further includes a display area and a non-display area adjacent to the display area;
In a planar view, the second upper surface is disposed between the first upper surface and the non-display area. According to claim 1,
In a planar view, the second upper surface surrounds the first upper surface. According to claim 1,
A thickness of the display panel in a second area overlapping the second upper surface is greater than a thickness of the display panel in a first area overlapping the first upper surface. base layer;
a light emitting device layer disposed on the base layer;
a thin film encapsulation layer covering the light emitting element layer and including a first upper surface and a second upper surface adjacent to the first upper surface; and
and sensing electrodes disposed on the first upper surface and the second upper surface,
The second upper surface includes a first inclined surface extending in a direction away from the base layer, and a second inclined surface extending in a direction approaching the base layer from the first inclined surface,
A sensing electrode disposed on the second upper surface of the sensing electrodes is curved in a thickness direction of the base layer along a shape of the second upper surface. 12. The method of claim 11,
In a planar view, the second upper surface surrounds the first upper surface. 12. The method of claim 11,
The second upper surface includes a region that protrudes from the first upper surface. 12. The method of claim 11,
The thin film encapsulation layer includes an organic layer, and a shape of the second upper surface is controlled by a shape of the organic layer. 15. The method of claim 14,
The organic layer overlaps the first upper surface and the second upper surface on a plane surface. 15. The method of claim 14,
In a plan view, the organic layer does not overlap the first upper surface and overlaps the second upper surface. 12. The method of claim 11,
A first distance between the boundary between the first inclined surface and the second inclined surface and the second base layer is greater than a second distance between the first upper surface and the base layer. 18. The method of claim 17,
A distance between one point of the first inclined surface and the base layer is greater than the second distance and smaller than the first distance. 18. The method of claim 17,
A distance between one point of the second inclined surface and the base layer is smaller than the second distance. a base layer, a circuit layer disposed on the base layer, a light emitting device layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the light emitting device layer, wherein a display area and a non-display area adjacent to the display area are defined display panel; and
a sensor including sensing electrodes disposed on the display area of the display panel;
The thin film encapsulation layer includes a first thin film encapsulation area overlapping a first upper surface of the display panel and a second thin film encapsulation area overlapping a second upper surface of the display panel adjacent to the first upper surface;
The sensing electrodes are disposed on the first upper surface and the second upper surface,
The thin film encapsulation layer includes an organic layer, and the shape of the second upper surface is controlled by the shape of the organic layer,
On a plane, the organic layer does not overlap the first thin film encapsulation region and overlaps the second thin film encapsulation region,
The second upper surface of the display panel is convex in a direction away from the base layer, and a sensing electrode disposed on the second upper surface of the sensing electrodes is curved along a shape of the second upper surface.

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