KR102382465B1 - Display apparatus - Google Patents

Abstract

The display device includes an organic light emitting display panel and a touch sensing unit disposed on the organic light emitting display panel, and the touch sensing unit includes a touch electrode and a wiring unit connected to the touch electrode. The wiring part of the touch sensing unit passes through the protruding member disposed in the non-display area of the organic light emitting display panel, and includes a first wiring part that does not overlap the protruding member on a plan view, a second wiring part and a first wiring part overlapping the protruding member, and A short circuit defect between the wiring parts may be improved by making the connection wiring part disposed between the second wiring parts and having a wiring width smaller than that of the first wiring part and the second wiring part overlap the edge of the protruding member.

Description

display device {DISPLAY APPARATUS}

The present invention relates to a display device, and more particularly, to a display device in which a wiring part defect of a touch sensing unit is improved.

Various display devices used in multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, and game machines have been developed. An input device of the display devices includes a keyboard or a mouse. Also, recently, display devices have a touch sensing unit as an input device.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a display device having an improved wiring part structure for improving a short circuit occurring between adjacent wiring parts in a touch sensing unit.

In one embodiment, a base substrate divided into a display area and a non-display area adjacent to the display area; a circuit layer disposed on the base substrate; a light emitting device layer disposed on the display area; an encapsulation layer covering the light emitting device layer; a touch sensing unit disposed on the encapsulation layer and including a touch electrode and a wiring unit connected to the touch electrode; and a protrusion member disposed on the non-display area. It provides a display device comprising a. In an embodiment, the wiring unit may include, in a plan view, a first wiring unit that does not overlap the protruding member and has a first wiring width; a second wiring part overlapping the protruding member and having a second wiring width; and a connection wiring unit having a third wiring width smaller than the first wiring width and the second wiring width and disposed between the first wiring unit and the second wiring unit; The first wiring width to the third wiring width may be a width in a direction perpendicular to an extension direction of the wiring part, and the connection wiring part may overlap an edge of the protruding member.

A ratio of the first interconnection width to the third interconnection width may be 1:0.3 or more and less than 1:1.

A length of the connection wiring part in the extending direction of the wiring part may be 5 μm or more and 50 μm or less.

The connection wiring unit may include: a first sub connection unit having a wiring width smaller than the first wiring width; a second sub connection part disposed between the first wiring part and the first sub connection part; and a third sub connection part disposed between the second wiring part and the first sub connection part; Including, the first sub-connection portion may be overlapping the edge of the protruding member.

A wiring width of the second sub-connection unit may increase in a direction toward the first wiring unit, and a wiring width of the third sub-connection unit may increase in a direction toward the second wiring unit.

The first wiring width and the second wiring width may be the same.

The second wiring unit may include: a first sub wiring unit having a first sub wiring width greater than the first wiring width; a second sub wiring part extending from the connection wiring part and having a second sub wiring width smaller than the first sub wiring width; a third sub wiring unit disposed between the first sub wiring unit and the second sub wiring unit; may include.

A wiring width of the third sub wiring unit may decrease toward the second sub wiring unit.

A ratio of the second sub-wiring width to the first sub-wiring width may be greater than 1:1 and less than or equal to 1:2.

The protrusion member includes a bottom surface, an upper surface opposite to the bottom surface, and a side surface connecting the bottom surface and the upper surface, the side surface having an inclination with respect to the bottom surface, the area of the bottom surface is the It may be greater than or equal to the upper surface area.

The protrusion member may include a lower protrusion having a first width in a cross-section perpendicular to the base substrate; and an upper protrusion disposed on the lower protrusion and having a second width equal to or less than the first width. and the first width and the second width may be a width in a direction perpendicular to an extension direction of the wiring part.

A ratio of the first width to the second width may be 1:0.3 or more and less than 1:1.

The second wiring part may overlap the upper protrusion part.

The connection wiring unit may include: a first sub connection unit having a wiring width smaller than the first wiring width; a second sub connection part disposed between the first wiring part and the first sub connection part; and a third sub connection part disposed between the second wiring part and the first sub connection part; may include, wherein the first sub-connection part overlaps an edge of the lower protrusion, and the third sub-connection part overlaps an edge of the upper protrusion.

Each of the upper protrusion and the lower protrusion may include a bottom surface, an upper surface opposite to the bottom surface, and a side surface disposed between the bottom surface and the upper surface, and the side surface may have an inclination with respect to the bottom surface. .

An exposure width of one side of the upper surface of the lower protrusion that does not overlap the upper protrusion may be 5 μm or more and 30 μm or less.

A ratio of the first width to the exposure width may be 1:0.01 or more and 1:0.4 or less.

A ratio of the height of the lower protrusion to the exposure width may be greater than 1:1 and less than or equal to 1:15.

The protrusion member may include a first protrusion member adjacent to the display area; and a second protruding member disposed outside the first protruding member and having a height greater than or equal to the first protruding member; may include

The first protrusion member may include a first lower protrusion and a first upper protrusion stacked in a thickness direction, and the second wiring portion may overlap the first upper protrusion.

The second protrusion includes a base protrusion, a second lower protrusion, and a second upper protrusion stacked in order in a thickness direction, the base protrusion having a first width, and the second lower protrusion having a first width greater than or equal to the first width. It may have two widths, the second upper protrusion may have a third width equal to or greater than the second width, and the first to third widths may be a width in a direction perpendicular to an extension direction of the wiring unit.

The second wiring unit overlapping the second protruding member may include: a first sub wiring unit having a first sub wiring width greater than the first wiring width; a second sub wiring part extending from the connection wiring part and having a second wiring width smaller than the first sub wiring width; and a third sub-wiring part disposed between the first sub-wiring part and the second sub-wiring part and having a wiring width that decreases toward the second sub-wiring part. may include

The first sub wiring part may overlap the second upper protrusion part.

The third sub wiring part may overlap an edge of the second upper protrusion part.

The wiring unit includes a first metal layer; an insulating layer disposed on the first metal layer; a second metal layer disposed on the insulating layer; and a plurality of contact holes disposed between the first metal layer and the second metal layer. may include

The plurality of contact holes may not overlap the connection wiring unit.

In the display device according to an exemplary embodiment, the width of the wiring portion overlapping the edge of the protruding member may be smaller than the width of the wiring portion at the portion that does not overlap the protruding member, thereby preventing a short circuit between adjacent wiring portions during wiring formation.

1A is a perspective view illustrating a first operation of a display device according to an exemplary embodiment.
1B is a perspective view illustrating a second operation of a display device according to an exemplary embodiment.
1C is a perspective view illustrating a third operation of a display device according to an exemplary embodiment.
2 is a cross-sectional view of a display device according to an exemplary embodiment.
3A and 3B are perspective views of a display device according to an exemplary embodiment.
4A and 4B are perspective views of a display device according to an exemplary embodiment.
5A is a plan view of an organic light emitting display panel according to an exemplary embodiment.
5B is a cross-sectional view of a display module according to an embodiment of the present invention.
6A is an equivalent circuit diagram of a pixel according to an embodiment of the present invention.
6B is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment.
6C is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment.
7A to 7C are cross-sectional views of an encapsulation layer according to an embodiment of the present invention.
8 is a view showing a cross-section of a touch sensing unit according to an embodiment of the present invention.
9 is a plan view of a display device according to an exemplary embodiment.
10A to 10C are plan views of a touch sensing unit according to an embodiment of the present invention.
FIG. 10D is a partially enlarged view of region BB of FIG. 10C .
11 is a cross-sectional view taken along region II′ of FIG. 9 .
12 is a plan view showing an enlarged area AA of FIG. 9 .
13A is a cross-sectional view taken along region II-II′ of FIG. 12 .
13B is a partially enlarged view of a CC region of FIG. 12 .
14A is a cross-sectional view taken along a region II-II′ of FIG. 12 .
14B is a partially enlarged view of a CC region of FIG. 12 .
14C is a cross-sectional view illustrating a protruding member according to an embodiment of the present invention.
15A to 15B are plan views illustrating exemplary embodiments of a wiring unit including a connection wiring unit.
16 is a plan view showing an enlarged area AA of FIG. 9 .
17A is a cross-sectional view taken along region III-III' of FIG. 16 .
17B is a plan view showing an enlarged area EE of FIG. 16 .
18A is a plan view showing an enlarged area AA of FIG. 9 .
18B is a cross-sectional view taken along region IV-IV' of FIG. 18A.
19A is a cross-sectional view taken along region II-II′ of FIG. 12 .
19B is a partially enlarged view of a CC region of FIG. 12 .
20 is a cross-sectional view schematically illustrating a photo process during a manufacturing process of a display device according to an exemplary embodiment.
21A is a plan view exemplarily illustrating a case in which a mask for manufacturing a wiring part according to the related art is used.
21B is a plan view showing the structure of a conventional wiring unit.
22 and 23 are plan views illustrating an arrangement of a mask for manufacturing a wiring unit in a display device according to an exemplary embodiment.

Since the present invention can have various changes and can have various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents and substitutes included in the spirit and scope of the present invention.

In describing each figure, like reference numerals have been used for like elements. In the accompanying drawings, the dimensions of the structures are enlarged than the actual size for clarity of the present invention. Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component. The singular expression includes the plural expression unless the context clearly dictates otherwise.

In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It is to be understood that it does not preclude the possibility of the presence or addition of numbers, steps, operations, components, parts, or combinations thereof. Also, when a part of a layer, film, region, plate, etc. is said to be "on" another part, this includes not only the case where it is "on" another part, but also the case where there is another part in between. Conversely, when a part of a layer, film, region, plate, etc. is said to be “under” another part, it includes not only cases where it is “directly under” another part, but also cases where another part is in between. In addition, in the present application, “on” may include the case of being disposed not only on the upper part but also on the lower part.

Hereinafter, a display device according to an embodiment of the present invention will be described with reference to the drawings.

1A is a perspective view illustrating a first operation of a display device DD according to an exemplary embodiment. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment. 1C is a perspective view illustrating a third operation of the display device DD according to an exemplary embodiment.

As illustrated in FIG. 1A , in the first operation mode, the display surface IS on which the image IM is displayed is parallel to a surface defined by the first direction DR1 and the second direction DR2 . The third direction DR3 indicates the normal direction of the display surface IS, that is, the thickness direction of the display device DD. A front surface (or an upper surface) and a rear surface (or a lower surface) of each member are divided by the third direction DR3 . However, the directions indicated by the first to third directions DR1 , DR2 , and DR3 may be converted into other directions as a relative concept. Hereinafter, the first to third directions refer to the same reference numerals as directions indicated by the first to third directions DR1 , DR2 , and DR3 , respectively.

1A to 1C illustrate a flexible foldable display device as an example of the display device DD. However, the present invention may be a rollable display device or a bent display device that is rolled, and is not particularly limited. Also, although the flexible display device is illustrated in the present embodiment, the present invention is not limited thereto. The display device DD according to the present exemplary embodiment may be a flat rigid display device or a curved rigid display device. The display device DD according to the present invention may be used in large electronic devices such as televisions and monitors, as well as small and medium-sized electronic devices such as mobile phones, tablets, car navigation systems, game machines, and smart watches.

1A , the display surface IS of the display device DD may include a plurality of regions. The display device DD includes a display area DD-DA in which an image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area in which an image is not displayed. 1A shows a vase as an example of the image IM. As an example, the display area DD-DA may have a rectangular shape. The non-display area DD-NDA may surround the display area DD-DA. However, the present invention is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be designed relatively.

1A to 1C , the display device DD may include a plurality of regions defined according to an operation type. The display device DD includes the bending area BA, the first non-bending area NBA1, and the second non-bending area NBA2 that are bent on the basis of the bending axis BX. may include

As illustrated in FIG. 1B , the display device DD is inner bent so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non-bending area NBA2 face each other. -bending). As illustrated in FIG. 1C , the display device DD may be outer-bending so that the display surface IS is exposed to the outside.

Although only one bending area BA is illustrated in FIGS. 1A to 1C , the present invention is not limited thereto. For example, in an embodiment of the present invention, the display device DD may include a plurality of bending areas BA.

In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes illustrated in FIGS. 1A and 1B . However, the present invention is not limited thereto, and the bending area BA may be defined to correspond to a shape in which the user manipulates the display device DD. For example, unlike FIGS. 1B and 1C , the bending area BA may be defined in parallel to the first direction DR1 or may be defined in a diagonal direction. The area of the bending area BA is not fixed and may be determined according to a radius of curvature.

2 is a cross-sectional view of a display device DD according to an exemplary embodiment. 2 illustrates a cross-section defined by the second direction DR2 and the third direction DR3.

2 , the display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, and a second adhesive member (AM1). AM2), and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 couples the display module DM and the protective film PM, the second adhesive member AM2 couples the display module DM and the optical member LM, and the third adhesive member (AM3) combines the optical member (LM) and the window (WM).

The protective film PM protects the display module DM. The protective film PM provides the first outer surface OS-L exposed to the outside, and provides an adhesive surface that is adhered to the first adhesive member AM1 . The protective film PM prevents external moisture from penetrating into the display module DM and absorbs external shocks.

The protective film PM may include a plastic film as a base substrate. Protective film (PM) is polyethersulfone (PES, polyethersulfone), polyacrylate (polyacrylate), polyetherimide (PEI, polyetherimide), polyethylene naphthalate (PEN, polyethylenenaphthalate), polyethylene terephthalate (PET, polyethyleneterephthalate), poly phenylene sulfide (PPS, polyphenylene sulfide), polyarylate (polyarylate), polyimide (PI, polyimide), polycarbonate (PC, polycarbonate), poly(arylene ethersulfone), and combinations thereof It may include a plastic film comprising any one selected from the group consisting of.

The material constituting the protective film PM is not limited to plastic resins, and may include an organic/inorganic composite material. The protective film PM may include a porous organic layer and an inorganic material filled in pores of the organic layer. The protective film PM may further include a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In an embodiment of the present invention, the protective film PM may be omitted.

The window WM may protect the display module DM from external impact and may provide an input surface to the user. The window WM provides the second outer surface OS-U exposed to the outside, and provides an adhesive surface that is adhered to the second adhesive member AM2 . The display surface IS illustrated in FIGS. 1A to 1C may be the second outer surface OS-U.

The window WM may include a plastic film. The window WM may have a multi-layered structure. The window WM may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window WM may further include a bezel pattern. The multi-layer structure may be formed through a continuous process or an adhesion process using an adhesive layer.

The optical member LM reduces external light reflectance. The optical member LM may include at least a polarizing film. The optical member LM may further include a retardation film. In an embodiment of the present invention, the optical member LM may be omitted.

The display module DM may include an organic light emitting display panel DP or a display panel and a touch sensing unit TS. The touch sensing unit TS is disposed on the organic light emitting display panel DP. Also, in an embodiment, the touch sensing unit TS may be directly disposed on the organic light emitting display panel DP. In the present specification, "directly disposed" means that it is formed by a continuous process, except for attachment using a separate adhesive layer.

The organic light emitting display panel DP generates an image IM (refer to FIG. 1A ) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel surface BS1-L and a second display panel surface BS1-U facing in the thickness direction DR3. Although the organic light emitting display panel DP has been exemplarily described in this embodiment, the display panel is not limited thereto.

The touch sensing unit TS acquires coordinate information of an external input. The touch sensing unit TS may sense an external input in a capacitive manner.

Although not shown separately, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The anti-reflection layer may include a color filter or a stacked structure of a conductive layer/insulating layer/conductive layer. The anti-reflection layer absorbs or destructively interferes with or polarizes light incident from the outside to reduce the reflectance of external light. The anti-reflection layer may replace the function of the optical member LM.

Each of the first adhesive member AM1, the second adhesive member AM2, and the third adhesive member AM3 is an optically clear adhesive film (OCA) or an optically clear adhesive resin (OCR). Alternatively, it may be an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as polyurethane, polyacrylic, polyester, polyepoxy, or polyvinyl acetate.

Although not shown separately, the display device DD may further include a frame structure supporting the functional layers to maintain the state illustrated in FIGS. 1A to 1C . The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of a display device DD-1 according to an exemplary embodiment. FIG. 3A illustrates the display device DD-1 in an unfolded state, and FIG. 3B illustrates the display device DD-1 in a bent state.

The display device DD-1 may include one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD-1 may be bent. However, in an embodiment of the present invention, the bending area of the display device DD-1 may be changed.

Unlike the display device DD illustrated in FIGS. 1A to 1C , the display device DD-1 according to the present exemplary embodiment may be fixed in a single shape to operate. The display device DD-1 may operate in a bent state as illustrated in FIG. 3B . The display device DD-1 may be fixed to a frame or the like in a bent state, and the frame may be coupled to a housing of the electronic device.

The display device DD-1 according to the present exemplary embodiment may have the same cross-sectional structure as shown in FIG. 2 . However, the non-bending area NBA and the bending area BA may have different stacked structures. The non-bending area NBA may have the same cross-sectional structure as shown in FIG. 2 , and the bending area BA may have a different cross-sectional structure from that illustrated in FIG. 2 . The optical member LM and the window WM may not be disposed in the bending area BA. That is, the optical member LM and the window WM may be disposed only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may also not be disposed in the bending area BA.

4A is a perspective view of a display device DD-2 according to an exemplary embodiment.

The display device DD-2 includes a non-bending area (NBA, or planar area) in which the main image is displayed on the front side and a bending area (BA, or a side area) in which the sub image is displayed on the side. Although not shown separately, the sub-image may include an icon providing predetermined information. In the present exemplary embodiment, the terms "non-bending area NBA and bending area BA" define the display device DD-2 as a plurality of areas divided by shapes.

The bending area BA bent from the non-bending area NBA displays a sub-image in a fourth direction DR4 crossing the first direction DR1 , the second direction DR2 , and the third direction DR3 . . However, the directions indicated by the first to fourth directions DR1 to DR4 are relative concepts and may be converted into other directions.

4B is a perspective view of a display device DD-3 according to an exemplary embodiment.

The display device DD-3 includes a non-bending area NBA in which the main image is displayed on the front side, and a first bending area BA1 and a second bending area BA2 in which the sub image is displayed on the side surface. The first bending area BA1 and the second bending area BA2 may be bent from both sides of the non-bending area NBA.

5A is a plan view of an organic light emitting display panel DP according to an embodiment of the present invention, and FIG. 5B is a cross-sectional view of a display module DM according to an embodiment of the present invention. For example, FIG. 5B may illustrate a portion of a cross section in a plane parallel to a plane defined by the second direction DR2 and the third direction DR3 .

As shown in FIG. 5A , the organic light emitting display panel DP includes a display area DA and a non-display area NDA in a plan view. The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (refer to FIG. 1A ) and the non-display area DD-NDA of the display device DD (refer to FIG. 1A ). , respectively, see FIG. 1A ). The display area DA and the non-display area NDA of the organic light emitting display panel DP are the display area DD-DA (refer to FIG. 1A ) and the non-display area DD-NDA of the display device DD (refer to FIG. 1A ). , refer to FIG. 1A ), and may be changed according to the structure/design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of pixels PX. An area in which the plurality of pixels PX are disposed is defined as the display area DA. In the present exemplary embodiment, the non-display area NDA may be defined along the edge of the display area DA.

The organic light emitting display panel DP includes gate lines GL, data lines DL, light emitting lines EL, control signal line SL-D, initialization voltage line SL-Vint, and voltage line ( SL-VDD), and a pad part PD.

The gate lines GL are respectively connected to a corresponding pixel PX of the plurality of pixels PX, and the data lines DL are respectively connected to a corresponding pixel PX of the plurality of pixels PX. do. Each of the light emitting lines EL may be arranged in parallel with a corresponding one of the gate lines GL. The control signal line SL-D may provide control signals to the gate driving circuit GDC. The initialization voltage line SL-Vint may provide an initialization voltage to the plurality of pixels PX. The voltage line SL-VDD is connected to the plurality of pixels PX and may provide a first voltage to the plurality of pixels PX. The voltage line SL-VDD may include a plurality of lines extending in the first direction DR1 and a plurality of lines extending in the second direction DR2 .

A gate driving circuit GDC to which the gate lines GL and the light emitting lines EL are connected may be disposed on one side of the non-display area NDA. Some of the gate lines GL, data lines DL, light emitting lines EL, control signal line SL-D, initialization voltage line SL-Vint, and voltage line SL-VDD are the same are arranged on one floor, and some are arranged on another floor.

The pad part PD may be connected to ends of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD.

As illustrated in FIG. 5B , the organic light emitting display panel DP includes a base substrate SUB, a circuit layer DP-CL disposed on the base substrate SUB, and a circuit layer DP-CL disposed on the circuit layer DP-CL. It may include a light emitting device layer (DP-OLED) and an encapsulation layer (TFE) surrounding the light emitting device layer (DP-OLED).

The base substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or an organic/inorganic composite material substrate. The plastic substrate is at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin may include The base substrate SUB may be a flexible substrate. Alternatively, the base substrate SUB may be a rigid substrate.

The base substrate SUB may be divided into a display area and a non-display area adjacent to the display area. The non-display area NDA may be disposed at an edge of the display area DA. However, the exemplary embodiment is not limited thereto, and the non-display area NDA may be defined only on one side of the display area DA.

A circuit layer DP-CL may be disposed on the base substrate SUB. The circuit layer DP-CL may be disposed on the display area DA and the non-display area NDA of the base substrate SUB. Although not shown separately in the drawings, the circuit layer DP-CL may include at least one pixel insulating layer, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL may constitute signal lines or a driving circuit of a pixel.

The light emitting device layer DP-OLED may include organic light emitting diodes. The light emitting device layer DP-OLED may be disposed on the display area DA. The organic light emitting diode will be described in detail with reference to FIG. 6C to be described later.

An encapsulation layer TFE may be disposed on the light emitting device layer DP-OLED. The encapsulation layer TFE may be disposed to surround the light emitting device layer DP-OLED. The encapsulation layer TFE may cover and seal the light emitting device layer DP-OLED. The encapsulation layer TFE may include an inorganic layer and an organic layer. The encapsulation layer TFE may include at least two inorganic layers and an organic layer disposed therebetween. The inorganic layer protects the light emitting element layer (DP-OLED) from moisture/oxygen, and the organic layer protects the light emitting element layer (DP-OLED) from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. The organic layer may include an acrylic-based organic material, but is not limited thereto. The inorganic layer may be provided by a deposition method, and the organic layer may be provided using a coating process, but embodiments are not limited thereto. The configuration of the encapsulation layer TFE will be described in detail later with reference to FIGS. 7A to 7C .

The touch sensing unit TS is disposed on the encapsulation layer TFE. The touch sensing unit TS may be directly disposed on the encapsulation layer TFE. However, the present invention is not limited thereto, and the inorganic layer may be disposed on the encapsulation layer TFE, and the touch sensing unit TS may be disposed on the inorganic layer. The inorganic layer may be a buffer layer. The inorganic layer may be at least one of a silicon nitride layer, a silicon oxy nitride layer, and a silicon oxide layer. However, this is illustrative and the embodiment is not limited thereto. Also, the buffer layer may be an organic layer. Although the buffer layer has been described as a separate configuration, the buffer layer may be a configuration included in the encapsulation layer TFE.

The touch sensing unit TS includes touch sensors and touch signal lines. The touch sensors and the touch signal lines may have a single-layer or multi-layer structure.

The touch sensors and the touch signal lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The touch sensors and the touch signal lines may include a metal layer, for example, molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The touch sensors and the touch signal lines may have the same layer structure or different layer structures. Specific details of the touch sensing unit TS will be described later.

6A is an equivalent circuit diagram of a pixel PX according to an exemplary embodiment. FIG. 6A exemplarily illustrates the i-th pixel PXi connected to the k-th data line DLk among the plurality of data lines DL (refer to FIG. 5A ).

The i-th pixel PXi includes an organic light emitting diode OLED and a pixel driving circuit for controlling the organic light emitting diode. The driving circuit may include seven thin film transistors T1 to T7 and one storage capacitor Cst.

The driving transistor controls the driving current supplied to the organic light emitting diode (OLED). The output electrode of the second transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second transistor T2 may be in direct contact with the anode of the organic light emitting diode OLED or may be connected via another transistor (the sixth transistor T6 in the embodiment of the present invention).

A control electrode of the control transistor may receive a control signal. The control signal applied to the i-th pixel PXi includes an i-1 th gate signal Si-1, an i-th gate signal Si, an i+1-th gate signal Si+1, a data signal Dk, and an i-th emission control signal Ei. In an embodiment of the present invention, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the i-th gate line GLi, and an output electrode connected to the output electrode of the second transistor T2 do. The first transistor T1 is turned on by the gate signal Si applied to the i-th gate line GLi (hereinafter, the i-th gate signal), and the data signal Dk applied to the k-th data line DLk. is provided to the storage capacitor (Cst).

6B is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment. 6C is a partial cross-sectional view of an organic light emitting display panel according to an exemplary embodiment. Specifically, FIG. 6B is a cross-sectional view of a portion corresponding to the first transistor T1 of the equivalent circuit shown in FIG. 6A . FIG. 6C is a cross-sectional view of a portion corresponding to the second transistor T2, the sixth transistor T6, and the organic light emitting diode (OLED) of the equivalent circuit shown in FIG. 6A .

6B and 6C , a buffer layer BFL may be disposed on the base substrate SUB. The buffer layer BFL improves bonding strength between the base substrate SUB and the conductive patterns or semiconductor patterns. The buffer layer BFL may include an inorganic layer. Although not shown separately, a barrier layer that prevents foreign substances from entering may be further disposed on the upper surface of the base substrate SUB. The buffer layer BFL and the barrier layer may be selectively disposed/omitted.

On the buffer layer BFL, the semiconductor pattern OSP1 of the first transistor T1 (hereinafter, referred to as the first semiconductor pattern), the semiconductor pattern of the second transistor T2 (OSP2: hereinafter referred to as the second semiconductor pattern), and the sixth transistor T6 are disposed on the buffer layer BFL. A semiconductor pattern OSP6 (hereinafter referred to as a sixth semiconductor pattern) is disposed. The first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 may be selected from amorphous silicon, polysilicon, and metal oxide semiconductors.

A first insulating layer 10 may be disposed on the first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 . 6B and 6C exemplarily show that the first insulating layer 10 is provided in the form of a layer covering the first semiconductor pattern OSP1, the second semiconductor pattern OSP2, and the sixth semiconductor pattern OSP6. However, the first insulating layer 10 may be provided in a pattern disposed to correspond to the first semiconductor pattern OSP1 , the second semiconductor pattern OSP2 , and the sixth semiconductor pattern OSP6 .

The first insulating layer 10 may include a plurality of inorganic thin films. The plurality of inorganic thin films may include a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer.

On the first insulating layer 10 , a control electrode (GE1: hereinafter, first control electrode) of the first transistor T1, a control electrode (GE2: hereinafter, second control electrode) of the second transistor T2, a sixth A control electrode GE6 (hereinafter, referred to as a sixth control electrode) of the transistor T6 is disposed. The first control electrode GE1 , the second control electrode GE2 , and the sixth control electrode GE6 may be manufactured according to the same photolithography process as the gate lines GL (refer to FIG. 5A ).

A second insulating layer 20 covering the first control electrode GE1 , the second control electrode GE2 , and the sixth control electrode GE6 may be disposed on the first insulating layer 10 . The second insulating layer 20 may provide a flat top surface. The second insulating layer 20 may include an organic material and/or an inorganic material.

On the second insulating layer 20 , an input electrode SE1 and an output electrode DE1 of the first transistor T1 and an input electrode DE1 of the second transistor T2 are formed on the second insulating layer 20 . SE2: Hereinafter, a second input electrode) and an output electrode (DE2: a second output electrode), an input electrode (SE6: hereinafter, a sixth input electrode) and an output electrode (DE6: a sixth output electrode) of the sixth transistor T6 ) is placed.

The first input electrode SE1 and the first output electrode DE1 form a first through hole CH1 and a second through hole CH2 passing through the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the first semiconductor pattern OSP1 through the The second input electrode SE2 and the second output electrode DE2 form a third through hole CH3 and a fourth through hole CH4 passing through the first insulating layer 10 and the second insulating layer 20 . through the second semiconductor pattern OSP2. The sixth input electrode SE6 and the sixth output electrode DE6 form a fifth through hole CH5 and a sixth through hole CH6 passing through the first insulating layer 10 and the second insulating layer 20 . are respectively connected to the sixth semiconductor pattern OSP6 through the Meanwhile, in another embodiment of the present invention, the first transistor T1 , the second transistor T2 , and the sixth transistor T6 may be modified to have a bottom gate structure.

On the second insulating layer 20 , a first input electrode SE1 , a second input electrode SE2 , a sixth input electrode SE6 , a first output electrode DE1 , a second output electrode DE2 , a second 6 A third insulating layer 30 covering the output electrode DE6 is disposed. The third insulating layer 30 includes an organic layer and/or an inorganic layer. In particular, the third insulating layer 30 may include an organic material to provide a flat surface.

Any one of the first insulating layer 10 , the second insulating layer 20 , and the third insulating layer 30 may be omitted depending on the circuit structure of the pixel. Each of the second insulating layer 20 and the third insulating layer 30 may be defined as an interlayer. The interlayer insulating layer is disposed between the conductive pattern disposed below and the conductive pattern disposed above the interlayer insulating layer to insulate the conductive patterns.

A pixel defining layer PDL and an organic light emitting diode OLED are disposed on the third insulating layer 30 . An anode AE is disposed on the third insulating layer 30 . The anode AE is connected to the sixth output electrode DE6 through the seventh through hole CH7 penetrating the third insulating layer 30 . An opening OP is defined in the pixel defining layer PDL. The opening OP of the pixel defining layer PDL exposes at least a portion of the anode AE.

The pixel PX may be disposed in the pixel area on a plane. The pixel area may include an emission area PXA and a non-emission area NPXA adjacent to the emission area PXA. The non-emission area NPXA may surround the light emission area PXA. In the present exemplary embodiment, the emission area PXA is defined to correspond to a partial area of the anode AE exposed by the opening OP.

The hole control layer HCL may be commonly disposed in the light emitting area PXA and the non-emission area NPXA. Although not shown separately, a common layer such as the hole control layer HCL may be commonly formed in the plurality of pixels PX (refer to FIG. 5A ).

An organic light emitting layer EML is disposed on the hole control layer HCL. The organic light emitting layer EML may be disposed in a region corresponding to the opening OP. That is, the organic light emitting layer EML may be formed separately in each of the plurality of pixels PX. Although the patterned organic light emitting layer EML is illustrated as an example in this embodiment, the organic light emitting layer EML may be commonly disposed on the plurality of pixels PX. In this case, the organic light emitting layer EML may generate white light. Also, the organic light emitting layer EML may have a multi-layered structure.

An electronic control layer (ECL) is disposed on the organic light emitting layer (EML). Although not shown separately, the electronic control layer ECL may be formed in common in the plurality of pixels PX (refer to FIG. 5A ).

A cathode CE is disposed on the electronic control layer ECL. The cathode CE is commonly disposed in the plurality of pixels PX.

An encapsulation layer TFE is disposed on the cathode CE. The encapsulation layer TFE is commonly disposed on the plurality of pixels PX. The encapsulation layer TFE includes at least one inorganic layer and at least one organic layer. The encapsulation layer TFE may include a plurality of inorganic layers and a plurality of organic layers that are alternately stacked.

In this embodiment, the encapsulation layer TFE directly covers the cathode CE. In an embodiment of the present invention, a capping layer covering the cathode CE may be further disposed between the encapsulation layer TFE and the cathode CE. In this case, the encapsulation layer TFE may directly cover the capping layer.

7A to 7C are cross-sectional views illustrating examples of encapsulation layers TFE1 , TFE2 , and TFE3 included in a display device according to an exemplary embodiment. As shown in FIG. 7A , the encapsulation layer TFE1 may include n inorganic thin films IOL1 to IOLn including the first inorganic thin film IOL1 disposed on the cathode CE ( FIG. 6C ). Also, the first inorganic thin film IOL1 may be disposed in direct contact with the cathode CE ( FIG. 6C ). The first inorganic thin film IOL1 may be defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film IOL1 among the n inorganic thin films IOL1 to IOLn may be defined as upper inorganic thin films.

The encapsulation layer TFE1 includes n-1 organic thin films OL1 to OLn-1, and the n-1 organic thin films OL1 to OLn-1 include n inorganic thin films IOL1 to IOLn. may be alternately placed. The n-1 organic thin films OL1 to OLn-1 may have a thickness greater than that of the n inorganic thin films IOL1 to IOLn on average.

Each of the n inorganic thin films IOL1 to IOLn may have a single layer including one material or a multilayer each including a different material. Each of the n-1 organic thin films OL1 to OLn-1 may be formed by providing organic monomers. The organic monomers may include acrylic monomers. For example, each of the n-1 organic thin films OL1 to OLn-1 may be formed by coating a composition including an acrylic monomer. Specifically, the organic thin films OL1 to OLn-1 may be formed using an inkjet printing method. In an embodiment of the present invention, the encapsulation layer TFE1 may further include an n-th organic thin film.

7B and 7C , the inorganic thin films included in each of the encapsulation layers TFE2 and TFE3 may have the same or different inorganic materials, and may have the same or different thicknesses. The organic thin films included in each of the encapsulation layers TFE2 and TFE3 may have the same or different organic materials, and may have the same or different thicknesses.

7B , the encapsulation layer TFE2 includes a first inorganic thin film IOL1, a first organic thin film OL1, a second inorganic thin film IOL2, a second organic thin film OL2, which are sequentially stacked. and a third inorganic thin film IOL3.

The first inorganic thin film IOL1 may have a two-layer structure. The first sub-layer S1 and the second sub-layer S2 may include different inorganic materials.

As illustrated in FIG. 7C , the encapsulation layer TFE3 may include a first inorganic thin film IOL10 , a first organic thin film OL1 , and a second inorganic thin film IOL20 sequentially stacked. The first inorganic thin film IOL10 may have a two-layer structure. The first sub-layer S10 and the second sub-layer S20 may include different inorganic materials. The second inorganic thin film IOL20 may have a two-layer structure. The second inorganic thin film IOL20 may include a first sub-layer S100 and a second sub-layer S200 deposited in different deposition environments. The first sub-layer S100 may be deposited under a low-power condition, and the second sub-layer S200 may be deposited under a high-power condition. The first sub-layer S100 and the second sub-layer S200 may include the same inorganic material.

Meanwhile, an inorganic layer may be further disposed on the encapsulation layer TFE. The inorganic layer may be a buffer layer. In an embodiment, the touch sensing unit TS may be disposed on the buffer layer disposed on the encapsulation layer TFE.

8 is a diagram illustrating a cross-section of a touch sensing unit TS included in a display device according to an exemplary embodiment. The touch sensing unit TS may include a first conductive layer TS-CL1 , a first insulating layer TS-IL1 , a second conductive layer TS-CL2 , and a second insulating layer TS-IL2 . can The first conductive layer TS-CL1 may be directly disposed on the encapsulation layer TFE. However, the embodiment is not limited thereto, and another inorganic layer (eg, a buffer layer) may be further disposed between the first conductive layer TS-CL1 and the encapsulation layer TFE.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 may have a single-layer structure or a multi-layer structure stacked in the third direction DR3 . The multi-layered conductive layer may include at least two or more of transparent conductive layers and metal layers. The multi-layered conductive layer may include metal layers including different metals. The transparent conductive layer may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, or graphene. The metal layer may include molybdenum, silver, titanium, copper, aluminum, and alloys thereof.

Each of the first conductive layer TS-CL1 and the second conductive layer TS-CL2 includes a plurality of patterns. Hereinafter, it will be described that the first conductive layer TS-CL1 includes first conductive patterns and the second conductive layer TS-CL2 includes second conductive patterns. Each of the first conductive patterns and the second conductive patterns may include a touch electrode and touch signal lines.

Each of the first insulating layer TS-IL1 and the second insulating layer TS-IL2 may include an inorganic material or an organic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl-based resin, epoxy-based resin, urethane-based resin, cellulose-based resin, siloxane-based resin, polyimide-based resin, polyamide-based resin, and perylene-based resin can do.

Each of the first insulating layer TS-IL1 and the second insulating layer TS-IL2 may have a single-layered or multi-layered structure. Each of the first touch insulating layer TS-IL1 and the second touch insulating layer TS-IL2 may include at least one of an inorganic layer and an organic layer. The inorganic layer and the organic layer may be formed by a chemical vapor deposition method. Meanwhile, the stacked structure of the touch sensing unit is not limited to that illustrated in FIG. 8 . For example, the second touch insulating layer TS-IL2 of the touch sensing unit may be omitted.

For the first insulating layer TS-IL1 , it is sufficient to insulate the first conductive layer TS-CL1 and the second conductive layer TS-CL2 , and the shape thereof is not limited. The shape of the first insulating layer TS-IL1 may be changed according to the shapes of the first conductive patterns and the second conductive patterns. The first insulating layer TS-IL1 may entirely cover the encapsulation layer TFE or may include a plurality of insulating patterns. It is sufficient if the plurality of insulating patterns overlap the first connection parts CP1 or second connection parts CP2 to be described later.

Although the two-layer type touch sensing unit is illustrated as an example in this embodiment, the present invention is not limited thereto. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and a wiring part connected to the touch sensors. The single-layer touch sensing unit may acquire coordinate information in a self-cap method.

Hereinafter, a display device according to an exemplary embodiment will be described with reference to FIGS. 9 to 19B . Hereinafter, in the description of the display device according to an exemplary embodiment, the content overlapping with the content described with reference to FIGS. 1 to 8 will not be described again, and differences will be mainly described.

9 is a plan view of a display device according to an exemplary embodiment. 10A to 10C are plan views illustrating a touch sensing unit TS included in the display device of FIG. 9 . FIG. 10D is an enlarged view of a portion of FIG. 10C . 11 is a diagram illustrating a cross-section of a display device according to an exemplary embodiment corresponding to I-I′ of FIG. 9 .

A display device according to an exemplary embodiment includes a touch sensing unit TS disposed on a base substrate SUB, a circuit layer DP-CL, a light emitting element layer DP-OLED, an encapsulation layer TFE, and an encapsulation layer TFE. , and a protrusion member DAM. The organic light emitting display panel DP may include a base substrate SUB, a circuit layer DP-CL, a light emitting device layer DP-OLED, and an encapsulation layer TFE. 9 and 11 , the display device DD according to an exemplary embodiment includes an organic light emitting display panel DP, a touch sensing unit TS and a protruding member DAM disposed on the organic light emitting display panel DP. may include

For the organic light emitting display panel DP, the above description in the description of FIG. 5B may be applied as it is. The display device DD according to an exemplary embodiment may include a base substrate SUB divided into a display area DA and a non-display area NDA. The display device DD according to an exemplary embodiment includes a circuit layer DP-CL disposed on a base substrate SUB, and a light emitting device layer DP- disposed on the display area DA of the base substrate SUB. OLED) may be included. The encapsulation layer TFE may be disposed to cover the light emitting device layer DP-OLED.

In addition, the protrusion member DAM may be disposed on the non-display area NDA of the base substrate SUB. At least one protrusion member DAM may be disposed in the non-display area NDA. For example, in the non-display area NDA, one protrusion member DAM may be disposed or two or more protrusion members DAM may be disposed. In addition, when the protrusion member DAM is disposed in the non-display area NDA, one protrusion member DAM is disposed in a part of the non-display area NDA, and a plurality of protrusion members DAM are disposed in the other part of the non-display area NDA. can be Also, even when the plurality of protrusion members DAM are disposed, the number of protrusion members DAM disposed may vary according to the position of the non-display area NDA. In addition, the encapsulation layer TFE may include the protrusion member DAM. ) and extend to the non-display area NDA of the base substrate SUB. In this case, the encapsulation layer TFE covering the protruding member DAM may be composed of only the inorganic thin films IOL1 to IOLn ( FIG. 7A ) in which the organic thin films OL1 to OLn-1 ( FIG. 7A ) are omitted. However, the exemplary embodiment is not limited thereto, and the encapsulation layer TFE is formed between the inorganic thin films IOL1 to IOLn ( FIG. 7A ) and the inorganic thin films IOL1 to IOLn ( FIG. 7A ) even in the portion covering the protruding member DAM. It may include all of the organic thin films OL1 to OLn-1 ( FIG. 7A ) disposed on the . In addition, when the plurality of protruding members DAM are disposed, the encapsulation layer TFE surrounding the first protruding member DAM1 that is the protruding member DAM closer to the display area is formed of the inorganic thin films IOL1 to IOLn ( FIG. 7A ). The organic thin films OL1 to OLn-1 (FIG. 7A) disposed therebetween may be included. In comparison, the encapsulation layer TFE surrounding the second protruding member DAM2 disposed outside the first protruding member DAM1 may be formed of only the inorganic thin films IOL1 to IOLn ( FIG. 7A ).

The protrusion member DAM may be disposed on the non-display area NDA. The protrusion member DAM may be disposed outside the display area DA. The protrusion member DAM may be disposed to surround the display area DA. The protrusion member DAM may include a first protrusion member DAM1 disposed relatively adjacent to the display area DA and a second protrusion member DAM2 disposed outside the first protrusion member DAM1. . The second protrusion member DAM2 may have a greater thickness in the third direction DR3 than the first protrusion member DAM1 . For example, the first protruding member DAM1 may prevent an organic monomer formed by coating the organic thin films OL1 to OLn-1 ( FIG. 7A ) from flowing to the outside.

The protrusion member DAM may be formed of a plurality of layers. For example, the first protrusion member DAM1 may have two layers stacked, and the second protrusion member DAM2 may have three layers stacked. Meanwhile, although it is illustrated in FIG. 9 that the protrusion member DAM is disposed to surround the entire display area DA, the embodiment is not limited thereto. For example, the protrusion member DAM may be disposed to surround at least one side of the display area DA.

Although not shown in FIG. 9 , the display device according to an exemplary embodiment may further include a side protrusion member (not shown) disposed on the non-display area NDA of the base substrate SUB. The side protruding member (not shown) may be disposed outside the second protruding member DAM2 . For example, the side protrusion member (not shown) may be disposed to extend in the first direction DR1 from the outside of the second protrusion member DAM2 . The side protrusion member (not shown) may absorb a shock when an external stimulus is given and may have a crack prevention function to prevent the shock from being transmitted to the display area.

Also, the display device according to an exemplary embodiment may further include a bank unit BK disposed outside the second protrusion member DAM2 and disposed adjacent to the touch pad TS-PD. Meanwhile, the bank part BK may be a third protruding member disposed outside the second protruding member DAM2 and extending in the second direction DR2 . The bank unit BK is a spacer so that the mask used during the manufacturing process of the organic light emitting display panel DP and the touch sensing unit TS does not directly contact the components of the organic light emitting display panel DP or the touch sensing unit TS. It could be a function. The thickness of the bank part BK may be higher than that of the first protruding member DAM1 or the second protruding member DAM2 .

In an embodiment, the bank unit BK may be omitted. In addition, in one embodiment, any one of the side protrusion member (not shown) and the bank part may be omitted.

The touch sensing unit TS may be disposed on the encapsulation layer TFE. The touch sensing unit TS may include a touch electrode TE and a wiring unit TW. The touch electrode TE may be disposed on the encapsulation layer TFE of the display area DA, and the wiring part TW may be connected to the touch electrode TE and disposed on the protrusion member DAM. The wiring part TW may be disposed on the protrusion member DAM along the step of the protrusion member DAM. The wiring part TW may extend from the touch electrode TE to be connected to the touch pad TS-PD.

In the plan view of FIG. 9 , the touch sensing unit TS includes first touch signal lines TE1-1 to TE1-4 connected to the first touch electrodes TE1-1 to TE1-4 and the first touch electrodes TE1-1 to TE1-4. SL1-1 to SL1-4), the second touch electrodes TE2-1 to TE2-5, and the second touch signal lines SL2- connected to the second touch electrodes TE2-1 to TE2-5. 1 to SL2-5). In addition, between the first touch electrodes TE1-1 to TE1-4 and the first touch signal lines SL1-1 to SL1-4, and between the second touch electrodes TE2-1 to TE2-5 Connection electrodes TSD may be disposed between the connected second touch signal lines SL2-1 to SL2-5. The connection electrodes TSD may be connected to ends of each of the first touch electrodes TE1-1 to TE1-4 and the second touch electrodes TE2-1 to TE2-5 to transmit signals. In another embodiment of the present invention, the connection electrodes TSD may be omitted.

Meanwhile, in FIG. 9 , the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5 are the touch electrode TE and the touch pad TS-PD. It corresponds to the wiring part TW of the present invention by connecting them. What is shown as the wiring part TW in FIG. 11 may represent any one of the first touch signal lines SL1-1 to SL1-4 and the second touch signal lines SL2-1 to SL2-5. there is. Also, the touch electrode TE illustrated in FIG. 11 may be any one of the first touch electrodes TE1-1 to TE1-4 or the second touch electrodes TE2-1 to TE2-5.

9 exemplarily shows a touch sensing unit TS including four first touch electrodes TE1-1 to TE1-4 and five second touch electrodes TE2-1 to TE2-5. However, the embodiment is not limited thereto.

Each of the first touch electrodes TE1-1 to TE1-4 may have a mesh shape in which a plurality of touch openings are defined. Each of the first touch electrodes TE1-1 to TE1-4 includes a plurality of first touch sensor parts SP1 and a plurality of first connection parts CP1. The first touch sensor units SP1 are arranged along the first direction axis DR1. Each of the first connection parts CP1 connects two adjacent first touch sensor parts SP1 among the first touch sensor parts SP1. Although not specifically illustrated, the first touch signal lines SL1-1 to SL1-4 may also have a mesh shape.

The second touch electrodes TE2-1 to TE2-5 insulate and cross the first touch electrodes TE1-1 to TE1-4. Each of the second touch electrodes TE2-1 to TE2-5 may have a mesh shape in which a plurality of touch openings are defined. Each of the second touch electrodes TE2-1 to TE2-5 includes a plurality of second touch sensor units SP2 and a plurality of second connection units CP2. The second touch sensor units SP2 are arranged along the second direction axis DR2. Each of the second connection parts CP2 connects two adjacent second touch sensor parts SP2 among the second touch sensor parts SP2 . The second touch signal lines SL2-1 to SL2-5 may also have a mesh shape.

The first touch electrodes TE1-1 to TE1-4 and the second touch electrodes TE2-1 to TE2-5 are electrostatically coupled. As touch sensing signals are applied to the first touch electrodes TE1-1 to TE1-4, capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2.

A plurality of first touch sensor units SP1, a plurality of first connection units CP1, and first touch signal lines SL1-1 to SL1-4, a plurality of second touch sensor units SP2, a plurality of Some of the second connection portions CP2 and the second touch signal lines SL2-1 to SL2-5 are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A , and other portions are formed by patterning the first conductive layer TS-CL1 shown in FIG. 6A . may be formed by patterning the second conductive layer TS-CL2 illustrated in FIG. 6A .

In order to electrically connect conductive patterns disposed on different layers, a contact hole passing through the first insulating layer TS-IL1 shown in FIG. 8 may be formed. Hereinafter, a touch sensing unit TS according to an exemplary embodiment will be described with reference to FIGS. 10A to 10C . 10A to 10C , the first to third protruding members DAM1, DAM2, and BK may be disposed in the non-display area NDA.

As shown in FIG. 10A , first conductive patterns are disposed on the encapsulation layer TFE. The first conductive patterns may include bridge patterns CP2. The bridge patterns CP2 are directly disposed on the encapsulation layer TFE. The bridge patterns CP2 correspond to the second connection parts CP2 illustrated in FIG. 9 .

As shown in FIG. 10B , a first insulating layer TS-IL1 covering the bridge patterns CP2 is disposed on the encapsulation layer TFE. Contact holes CH partially exposing the bridge patterns CP2 are defined in the first insulating layer TS-IL1 . The contact holes CH may be formed by a photolithography process.

As illustrated in FIG. 10C , second conductive patterns may be disposed on the first insulating layer TS-IL1 . The second conductive patterns include a plurality of first touch sensor units SP1, a plurality of first connection units CP1, first touch signal lines SL1-1 to SL1-4, and a plurality of second touch sensor units. It may include SP2 and second touch signal lines SL2-1 to SL2-5. Although not shown separately, the second touch insulating layer TS-IL2 covering the second conductive patterns is disposed on the first touch insulating layer TS-IL1 .

In another embodiment of the present invention, the first conductive patterns may include first touch electrodes TE1-1 to TE1-4 and first touch signal lines SL1-1 to SL1-4. The second conductive patterns may include second touch electrodes TE2-1 to TE2-5 and second touch signal lines SL2-1 to SL2-5. In this case, the contact holes CH are not defined in the first touch insulating layer TS-IL1 .

Also, in an embodiment of the present invention, the first conductive patterns and the second conductive patterns may be interchanged. That is, the second conductive patterns may include the bridge patterns CP2 .

FIG. 10D is an enlarged view of a region “BB” of FIG. 10C . As illustrated in FIG. 10D , the first touch sensor unit SP1 overlaps the non-emission area NPXA. The first touch sensor unit SP1 includes a plurality of first extension units SP1-A extending in a fifth direction DR5 intersecting the first direction DR1 and the second direction DR2 and a fifth direction ( and a plurality of second extensions SP1 -B extending in a sixth direction DR6 intersecting with DR5. The plurality of first extension parts SP1-A and the plurality of second extension parts SP1-B may be defined as mesh lines. The line width of the mesh line may be several micrometers.

The plurality of first extension parts SP1-A and the plurality of second extension parts SP1-B are connected to each other to form a plurality of touch openings TS-OP. In other words, the first touch sensor unit SP1 has a mesh shape including a plurality of touch openings TS-OP. Although it is illustrated that the touch openings TS-OP correspond to the emission areas PXA one-to-one, the present invention is not limited thereto. One touch opening TS-OP may correspond to two or more light emitting areas PXA.

The size of the emission areas PXA may vary. For example, the size of the emission areas PXA providing blue light and the emission areas PXA providing red light among the emission areas PXA may be different from each other. Accordingly, sizes of the touch openings TS-OP may also vary. Although FIG. 10 exemplarily illustrates that the emission areas PXA have various sizes, the present disclosure is not limited thereto. The size of the emission areas PXA may be the same, and the size of the touch openings TS-OP may also be the same.

9 and 10C , the protrusion member DAM is disposed in the non-display area NDA, and the first protrusion member DAM1 and the second protrusion member DAM2 are disposed in the display area DA. The touch electrodes TE1-1 to TE1-4 and TE2-1 to TE2-5 may be surrounded and disposed. In addition, although the wiring part TW is illustrated to pass only the protrusion member DAM adjacent to the touch pad TS-PD, the embodiment is not limited thereto. The wiring part TW may be disposed to pass through other parts of the protrusion member DAM as well as a part adjacent to the touch pad TS-PD. For example, the second touch signal lines SL2-1 to SL2-5 serving as the wiring part TW may include a first protrusion member DAM1 and a second protrusion member DAM2 extending in the first direction DR1 . It may be disposed to pass through at least one of the On the other hand, the bank part BK is a third protrusion member and is disposed on one side of the outer side of the second protrusion member DAM2 , and the wiring part TW passes through the bank part BK and can be connected to the touch pad TS-PD. there is.

12 is a plan view showing an enlarged portion "AA" of FIG. 12 is an enlarged plan view of a wiring part TW connecting the touch electrode and the touch pad TS-PD ( FIG. 9 ). The touch electrode may be any one of the first touch electrodes TE1-1 to TE1-4 or the second touch electrodes TE2-1 to TE2-5. The wiring unit TW may represent any one of the first touch signal lines SL1-1 to SL1-4 ( FIG. 9 ) and the second touch signal lines SL2-1 to SL2-5 ( FIG. 9 ). there is.

13A is a cross-sectional view of a portion corresponding to II-II′ of FIG. 12 , and FIG. 13B is an enlarged plan view of a portion “CC” of FIG. 12 . 13A and 13B show an embodiment of the wiring part TW passing through the first protruding member DAM1 in the plan view of FIG. 12 .

On the other hand, in FIG. 12 , passing through the wiring portion TW and the second protruding member DAM2 of the portion overlapping the first protruding member DAM1 after passing through the first protruding member DAM1 , the second protruding member DAM2 overlaps with the second protruding member DAM2 Although it is illustrated that the shape of the wiring part TW is the same, the embodiment is not limited thereto. The shapes of the second wiring part TW2 overlapping the first protruding member DAM1 and the second wiring part TW2 overlapping the second protruding member DAM2 may be different from each other.

In FIG. 12 , the wiring part TW passing through the first protruding member DAM1 and the second protruding member DAM2 is shown, and the wiring part TW passes the first protruding member DAM1 and the second protruding member DAM2 ) in the direction of The wiring part TW may extend in the first direction DR1 .

12 and 13A to 13B , the wiring portion TW includes a first wiring portion TW1 that does not overlap the protruding member DAM in a plan view and a second wiring portion that overlaps the protruding member DAM ( TW2) and a connection wiring unit TWC disposed between the first wiring unit TW1 and the second wiring unit TW2. Meanwhile, the wiring portion TW disposed between the first protruding member DAM1 and the second protruding member DAM2 corresponds to the first wiring portion TW1 that does not overlap the protruding member DAM.

13A to 13B are views illustrating the first protruding member DAM1 and the wiring part TW passing through the first protruding member DAM1 in FIG. 12 . The first wiring unit TW1 has a first wiring width W1 , the second wiring unit TW2 has a second wiring width W2 , and the connection wiring unit TWC has a first wiring width W1 . and a third wiring width W3 smaller than the second wiring width W2. For example, the first wiring width W1 and the second wiring width W2 may be the same. However, the embodiment is not limited thereto, and the first wiring width W1 and the second wiring width W2 may be different from each other.

In the description of the present invention, the wiring widths W1 , W2 , and W3 of the first wiring unit TW1 , the second wiring unit TW2 , and the connection wiring unit TWC are perpendicular to the extending direction of the wiring unit TW. The width in the direction is indicated. Hereinafter, in the description of the embodiment of the present invention, the wiring width of the wiring unit will be described as representing the width in a direction perpendicular to the extending direction of the wiring unit on a plane. Referring to FIG. 12 , the wiring widths W1 , W2 , and W3 may indicate widths in the second direction DR2 perpendicular to the first direction DR1 in which the wiring part TW extends.

In an exemplary embodiment, the first wiring part TW1 is a portion in which the wiring width is kept constant with the first wiring width W1, and the second wiring part TW2 has the wiring width with the second wiring width W2. It may be a part that is kept constant. However, the embodiment is not limited thereto. The first wiring part TW1 may have a partially different wiring width. Also, the second wiring part TW may have a partially different wiring width.

The connection wiring unit TWC may be a portion having a smaller width than that of the first wiring unit TW1 and the second wiring unit TW2 . The third wiring width W3 may indicate a minimum wiring width in the connection wiring unit TWC. The connection wiring part TWC may be disposed to overlap the edge DM-E of the protrusion member DAM. For example, a portion having the third wiring width W3 , which is the minimum wiring width, in the connection wiring unit TWC may be disposed to overlap the protruding member edge DM-E.

Referring back to FIG. 13B , the ratio of the first wiring width W1 of the first wiring unit TW1 to the third wiring width W3 of the connection wiring unit TWC may be 1:0.3 or more and less than 1:1. . For example, the first wiring width W1 may be 8 μm or more and 15 μm or less, and the third wiring width W3 may be 4 μm or more and 10 μm or less. The first wiring width W1 may be 10 μm or more and 12 μm or less, and the third wiring width W3 may be 6 μm or more and 8 μm or less. When the third wiring width W3 is less than 4 μm, disconnection of the wiring portion may occur, and when the wiring width W3 is more than 10 μm, the interval between adjacent connecting wiring portions is narrowed, thereby causing a short circuit defect.

The length L of the connection wiring part TWC in the extending direction of the wiring part TW may be 5 μm or more and 50 μm or less. That is, the interval between the first wiring part TW1 and the second wiring part TW2 extending in the first direction DR1 may be 5 μm or more and 50 μm or less. Meanwhile, the central portion of the connection wiring portion TWC and the edge DM-E of the protruding member may overlap. For example, a length of a portion overlapping with the protruding member DAM1 and a portion not overlapping with the protruding member DAM1 of the connection wiring unit TWC may have the same length.

For example, when the length L of the connection wiring portion TWC in the first direction DR1 is 50 μm, the first wiring portion TW1 is based on a portion overlapping the protruding member edge DM-E. ) is L1 and the length from the portion overlapping the protruding member edge DM-E to the second wiring portion TW2 is L2, L1 and L2 may both be 25 μm. However, the embodiment is not limited thereto, and L1 and L2 may be different from each other. In this case, L1 may be a length of a portion of the connection wiring unit TWC that does not overlap the protruding member DAM1 , and L2 may be a length of a portion of the connection wiring unit TWC that overlaps the protruding member DAM2 .

In the wiring unit TW, the connection wiring unit TWC may be a portion having a notch shape. Referring to FIG. 13B , the connection wiring unit TWC includes a first sub connection unit TWC-1 having a wiring width smaller than the first wiring width W1, the first wiring unit TW1, and the first sub connection unit TWC. -1) to include a second sub-connection part TWC-2 disposed between and a third sub-connection part TWC-3 disposed between the second wiring part TW2 and the first sub-connection part TWC-1. can The first sub-connection part TWC-1 may be a portion having a third interconnection width W3, which is the smallest width, in the connection interconnection part TWC. Referring to FIG. 13B , the first sub-connection part TWC-1 among the connection wiring parts TWC may be disposed to overlap the protrusion member edge DM-E.

The wiring width of the second sub-connection part TWC-2 may gradually increase from the first sub-connection part TWC-1 to the first wiring part TW1 direction. Also, the wiring width of the third sub-connection part TWC-3 may gradually increase from the first sub-connection part TWC-1 to the second wiring part TW2. For example, edges of the second sub-connection part TWC-2 and the third sub-connection part TWC-3 may have a curved shape. Also, although not shown in the drawings, the edge of the second sub-connection part TWC-2 or the third sub-connection part TWC-3 may have a straight shape.

13A, the first protruding member DAM1 has a bottom surface BS, an upper surface US opposite to the bottom surface BS, and a side surface connecting the bottom surface BS and the upper surface US ( SS) may be included. The side surface SS may be inclined with respect to the bottom surface BS. For example, the first protrusion member DAM1 may have a trapezoidal shape in a cross section perpendicular to the base substrate SUB. That is, on a plane defined in the first direction DR1 and the third direction DR3 , the first protrusion member DAM1 has a shape in which the width of the dam gradually decreases from the bottom surface BS to the upper surface US. can be The area of the bottom surface BS of the protrusion member DAM may be greater than or equal to the area of the upper surface US. On the other hand, although not shown separately in the drawings, the protruding member may have a plurality of layers stacked.

Although only the wiring portion TW passing through the first protruding member DAM1 and the first protruding member DAM1 is illustrated in FIG. 13A , the second protruding member DAM2 of FIG. 12 is also the same as the first protruding member DAM1. It may have a shape. However, the embodiment is not limited thereto, and the first protruding member DAM1 and the second protruding member DAM2 may have different shapes. For example, the first protruding member DAM1 and the second protruding member DAM2 may have different heights. The height of the second protrusion member DAM2 may be higher than the height of the first protrusion member DAM1 .

14A to 14B are diagrams illustrating an example in which the protrusion member DAM is formed in a plurality of layers in the display device of the exemplary embodiment illustrated in FIG. 9 . 14A to 14B illustrate a case in which the first protruding member DAM1 is stacked in two layers by way of example.

14A is a cross-sectional view of a portion corresponding to II-II′ in FIG. 12 , and FIG. 14B is an enlarged plan view of a portion “CC” of FIG. 12 . 14A and 14B are views illustrating a wiring part TW passing through the first protruding member DAM1 in the plan view of FIG. 12 . 14C is a cross-sectional view illustrating the first protruding member DAM1 of FIG. 14A .

The first protrusion member DAM1 has a first width D1 when viewed in a cross section perpendicular to the base substrate SUB and includes a lower protrusion DAM1-B and a lower protrusion DAM1 disposed on the base substrate SUB. -B) and may include an upper protrusion DAM1-T having a second width D2.

Each of the upper protrusions DAM1-T and the lower protrusions DAM1-B may include bottom surfaces BS1 and BS2, upper surfaces US1 and US2, and side surfaces SS1 and SS2. The bottom surfaces BS1 and BS2 and the upper surfaces US1 and US2 are opposite to each other, and the side surfaces SS1 and SS2 are disposed between the bottom surfaces BS1 and BS2 and the upper surfaces US1 and US2 to form the bottom surface. It may be a surface connecting the (BS1, BS2) and the upper surface (US1, US2). For example, the side surfaces SS1 and SS2 may be inclined surfaces having an inclination with respect to the bottom surfaces BS1 and BS2, respectively. Also, the bottom surface BS2 of the upper protrusion DAM1-T may be a part of the upper surface US1 of the lower protrusion DAM1-B.

In the cross-section shown in FIGS. 14A and 14C , each of the lower protrusions DAM1-B and the upper protrusions DAM1-T may have a trapezoidal shape. That is, each of the upper protrusions DAM1-T and the lower protrusions DAM1-B may have a trapezoidal shape in which the width of the dam gradually decreases from the bottom surfaces BS1 and BS2 to the upper surfaces US1 and US2.

Widths of the lower protrusion DAM1-B and the upper protrusion DAM1-T may be different from each other. The first width D1 of the bottom surface BS1 of the lower protrusion DAM1-B and the second width D2 of the bottom surface BS2 of the upper protrusion DAM1-T may be different from each other. The first width D1 of the lower protrusion DAM1-B may be greater than the second width D2 of the upper protrusion DAM1-T. The upper protrusion DAM1-T may be disposed on the lower protrusion DAM1-B so that a portion of the upper surface US1 of the lower protrusion DAM1-B is exposed. That is, the lower protrusion DAM1-B may include a portion overlapping with the upper protrusion DAM1-T and a portion not overlapping and exposed with the upper protrusion DAM1-T. For example, the first protrusion member DAM1 may have a step shape by stacking the lower protrusion parts DAM1-B and the upper protrusion parts DAM1-T having different widths.

Meanwhile, although FIGS. 14A to 14C illustrate the first protruding member DAM1 and the wiring part TW passing through the first protruding member DAM1, the embodiment is not limited thereto. The shape of the protruding member illustrated in FIGS. 14A to 14C may also be applied to the second protruding member DAM2 shown in FIG. 12 .

Lower protrusion DAM1-B exposed without overlapping upper protrusion DAM1-T in first protrusion DAM1 including step-stacked lower protrusion DAM1-B and upper protrusion DAM1-T The exposure width D3 of the exposed portion may be 5 μm or more and 30 μm or less. For example, the exposure width D3 may be 10 μm or more and 25 μm or less, and specifically, the exposure width D3 may be 15 μm or more and 20 μm or less.

The first width D1 of the bottom surface BS1 of the lower protrusion DAM1-B may be 60 μm or more and 80 μm or less. Specifically, the first width D1 may be 65 μm or more and 75 μm or less. The width of the bottom surface BS2 of the upper protrusion DAM1 -T that is the second width D2 may be 10 μm or more and 60 μm or less. Specifically, the second width D2 may be 30 μm or more and 50 μm or less.

A ratio of the first width D1 of the lower protrusion DAM1-B to the exposed width D3 of the exposed portion of the lower protrusion DAM1-B may be 1:0.01 or more and 1:0.4 or less. As the exposure width D3 increases, a short circuit between the connection wiring parts TWC in the adjacent wiring parts TW may be improved. However, when the ratio of D1:D3 is greater than 1:0.4, the area of the upper protrusion DAM1-T is reduced, so that the wiring part TW passing through the upper protrusion DAM1-T cannot be stably disposed.

The height H1 of the lower protrusions DAM1-B may be 2 μm or more and 5 μm or less. Specifically, the height H1 of the lower protrusions DAM1-B may be 2 μm or more and 3 μm or less. As the ratio of the exposure width D3 of the lower protrusion to the height H1 of the lower protrusion increases, the wiring part may be stably disposed on the protrusion member. The ratio may be greater than 1:1 and up to 1:15. When the ratio of the exposed width (D3) of the lower protrusion and the height of the lower protrusion (H1) is 1:1 or less, or the ratio of the exposed width (D3) of the lower protrusion and the height (H1) of the lower protrusion is greater than 1:15, the connection wiring part is stably cannot be formed Specifically, the ratio of the exposure width D3 of the lower protrusion to the height H1 of the lower protrusion may be greater than 1:1 and less than or equal to 1:5.

Also, the height H2 of the upper protrusion DAM1-T may be 2 μm or more and 5 μm or less. Specifically, the height H2 of the upper protrusion DAM1-T may be 2 μm or more and 3 μm or less. For example, the height H2 of the upper protrusion DAM1-T may be smaller than the height H1 of the lower protrusion DAM1-B. However, the embodiment is not limited thereto, and the height H2 of the upper protrusion DAM1-T and the height H1 of the lower protrusion DAM1-B may be the same.

Meanwhile, the first protrusion member DAM1 illustrated in FIG. 14A may be formed together in the process of manufacturing the organic light emitting display panel. The first protruding member DAM1 may be manufactured together in the process of forming the device layer DP-OLED. For example, the lower protrusion DAM1-B and the upper protrusion DAM1-T may be manufactured together when the pixel defining layer PDL ( FIG. 6B ) is formed, but the embodiment is not limited thereto.

14A to 14B , the second wiring part TW2 overlapping the first protrusion member DAM1 may overlap the upper protrusion part DAM1 -T. The connection wiring part TWC may overlap an edge of the lower protrusion part DAM1-B of the first protrusion member DAM1. The first sub connection part TWC-1 having the third width W3 in the connection wiring part TWC overlaps the edge of the lower protrusion DAM1-B, and the second wiring part TW2 and the first sub connection part The third sub-connection part TWC-3 connecting the TWC-1 may overlap the edge of the upper protrusion DAM1-T.

15A and 15B are diagrams illustrating exemplary shapes of the wiring unit TW including the connection wiring unit TWC. The wiring part of the embodiment shown in FIGS. 15A and 15B has a different shape of the connection wiring part TWC compared to the wiring part TW shown in FIGS. 13B and 14B .

On the other hand, the shape of the wiring part TW shown in FIGS. 13B and 14B and the shape of the wiring part TW shown in FIGS. 15A to 15B are exemplary embodiments, and the connection wiring part ( TWC) shape is not limited thereto.

Referring to FIG. 15A , the connection wiring part TWC may be a part in which the wiring width is constantly maintained as the third wiring width W3 . The first wiring unit TW1, the connection wiring unit TWC, and the second wiring unit TW2 may be divided by a difference in wiring width. For example, compared to the connection wiring part TWC in the embodiment shown in FIG. 13B , in the embodiment of FIG. 15A , the first wiring part TW1 is constantly maintained with the first wiring width W1 and A curved sub-connection wiring portion may be omitted between the connection wiring portions TWC having a third wiring width W3 smaller than the first wiring width W1 . Also, the sub-connection wiring part formed as a curved surface may be omitted between the connection wiring part TWC and the second wiring part TW2 in which the wiring width is constantly maintained as the second wiring width W2 . That is, in the wiring part TW of the exemplary embodiment of FIG. 15A , a sub-connection part having a curved edge between the first wiring part TW1 and the connection wiring part TWC may be omitted. For example, at least one of the second sub-connection part TWC-2 and the third sub-connection part TWC-3 may be omitted compared to the wiring part TW in the exemplary embodiment illustrated in FIG. 13B . .

Referring to FIG. 15B , the connection wiring part TWC may be a recessed portion between the first wiring part TW1 and the second wiring part TW2 . For example, the connection wiring unit TWC may be a portion concavely recessed inward based on an imaginary line IML connecting the edge portions of the first wiring unit TW1 and the second wiring unit TW2. there is.

Meanwhile, although not shown in FIGS. 15A to 15B , the connection wiring unit TWC is disposed between the first wiring unit TW1 and the second wiring unit TW2, and the first wiring unit TW1 and the second wiring unit (TW1). Any shape in which the edge of the connection wiring unit TWC is disposed inward based on a virtual line connecting the edge portions of TW2 may be used without limitation.

FIG. 16 may be an enlarged plan view of a portion corresponding to area “AA” of FIG. 9 . In FIG. 16 , the shape of the second wiring part TW2 overlapping the protrusion member may be different from that of the exemplary embodiment of FIG. 12 . Meanwhile, as illustrated in FIG. 16 , the shape of the wiring portion TW passing through the first protruding member DAM1 and the second protruding member DAM2 may be the same, but the embodiment is not limited thereto. For example, the wiring portion TW passing through the first protruding member DAM1 may have the shape shown in FIG. 14B in a plan view.

17A and 17B may illustrate the second protruding member DAM2 and the wiring part TW passing through the second protruding member DAM2 in FIG. 16 according to an exemplary embodiment. FIG. 17A may be a cross-sectional view of a plane corresponding to III-III′ in FIG. 16 . 17B may be an enlarged plan view of the area “EE” in FIG. 16 . In the embodiment of FIG. 17A , the second protrusion member DAM2 is exemplified and described, and the second protrusion member DAM2 in the embodiment of FIG. 17A is the protrusion member of the embodiment shown in FIGS. 13A and 14A . It may be different from the shape.

Referring to FIG. 17A , the second protruding member DAM2 includes a base protrusion DAM2-U, a second lower protrusion DAM2-B, and a second upper protrusion DAM2-T that are sequentially stacked in the thickness direction. may include The second protrusion member DAM2 may be formed together in the process of manufacturing the organic light emitting display panel. For example, the base protrusion DAM2-U of the second protrusion member DAM2 may be formed together in the manufacturing process of the circuit layer DP-CL, and the second lower protrusion DAM2-B and the second upper protrusion part DAM2-B (DAM2-T) may be manufactured at the same time when the pixel defining layer PDL ( FIG. 6B ) of the device layer DP-OLED is formed. However, the embodiment is not limited thereto, and the second protrusion member DAM2 may be formed by a process different from the proposed process.

In the second protrusion member DAM2 , the base protrusion DAM2-U, the second lower protrusion DAM2-B, and the second upper protrusion DAM2-T may be stacked in a step shape. The base protrusion DAM2-U has a first width D1, the second lower protrusion DAM2-B has a second width D2, and the second upper protrusion DAM2-T has a fourth width ( D4) may be present. Also, when the second lower protrusion DAM2-B is disposed on the base protrusion DAM2-U. An upper surface of the base protrusion DAM2-U may be exposed. When the exposed width of the exposed base protrusion DAM2-U is the third width D3 , the ratio of the first width D1 of the base protrusion DAM2-U to the exposed width D3 is 1:0.1 It may be greater than or equal to 1:0.4 or less. Also, when the second upper protrusion DAM2-T is disposed on the second lower protrusion DAM2-B, the second width D2 and the exposure width D5 of the second lower protrusion DAM2-B are The ratio may be 1:0.1 or more and 1:0.4 or less.

17A and 17B , in addition, the wiring portion TW passing through the second protruding member DAM2 includes the first wiring portion TW1 and the second protruding member DAM2 that do not overlap the second protruding member DAM2. It may include a second wiring unit TW2 overlapping the DAM2 , and a connection wiring unit TWC disposed between the first wiring unit TW1 and the second wiring unit TW2 . The connection wiring unit TWC may connect the first wiring unit TW1 and the second wiring unit TW2 and overlap the edge DM-E of the second protruding member DAM2 .

In addition, the second wiring portion TW2 overlapping the second protruding member DAM2 includes a first sub wiring portion TW2-1 having a first sub wiring width W4 greater than the first wiring width W1; a second sub wiring unit TW2-2 and a first sub wiring unit TW2-1 extending from the connection wiring unit TWC and having a second wiring width W2 smaller than the first sub wiring width W4; A third sub-wiring unit TW2-3 disposed between the second sub-wiring units TW2 - 2 may be included. In this case, the wiring width of the second sub wiring unit TW2 - 2 may be the same as the first wiring width W1 , which is the wiring width of the first wiring unit TW1 .

The wiring width of the third sub-wiring unit TW2 - 3 may become smaller in a direction from the first sub-wiring unit TW2-1 to the second sub-wiring unit TW2 - 2 . The third sub-wiring part TW2 - 3 may be disposed to overlap an edge of the second upper protrusion DAM2-T of the second protrusion member DAM2 .

That is, in the embodiment shown in FIGS. 17A to 17B , the wiring part TW has a notch shape in which the connection wiring part TWC overlapping the edge of the base protrusion DAM-U is concavely formed inside the wiring part. can In addition, on the upper surface of the second upper protrusion DAM2-T, which is the uppermost surface of the second protruding member DAM2, the second wiring part TW2 has a first wiring part (not overlapping with the second protruding member DAM2) ( It may include a first sub-wiring part TW2-1 formed to protrude with respect to TW1. The first sub-wiring unit TW2-1 may have a wiring width greater than the wiring width of the first wiring unit TW1. That is, the second wiring unit TW2 may include the first sub wiring unit TW2-1 convexly protruding from the first wiring unit TW1 . For example, in the second wiring unit TW2 , the first sub wiring unit TW2-1 includes the first sub wiring unit having a protruding shape, and a wiring portion overlapping the uppermost surface of the protruding member having a relatively small flat surface. It is possible to prevent disconnection of the wiring part by having a sufficient wiring width.

18A is a plan view illustrating a protruding member and a wiring portion disposed past the protruding member in the display device according to an exemplary embodiment; FIG. 18A may be an enlarged plan view of a portion corresponding to area “AA” of FIG. 9 . 18A shows a second wiring part TW2a overlapping the first protruding member DAM1 and a second wiring part TW2b overlapping the second protruding member DAM2 compared to the exemplary embodiment of FIGS. 12 and 16 . A case in which the shapes of are different from each other is shown. 18B is a view showing a cross-section of a plane corresponding to IV-IV' of FIG. 18A.

In the description of FIGS. 18A and 18B , content overlapping with the description of the exemplary embodiment of FIGS. 12 and 16 will not be described again, and differences will be mainly described.

18A to 18B , the first protrusion member DAM1 may be a protrusion member in which two layers are stacked, and the second protrusion member DAM2 may be a protrusion member in which three layers are stacked. The first protrusion member DAM1 includes a first lower protrusion part DAM1-B and a first upper protrusion part DAM1-T, and the second protrusion member DAM2 includes a base protrusion part DAM2-U and a second lower part. It may include a protrusion DAM2-B and a second upper protrusion DAM2-T.

In an embodiment, the first lower protrusion DAM1-B and the second lower protrusion DAM2-B may be manufactured in the same process. Also, the first upper protrusion DAM1-T and the second upper protrusion DAM2-T may be manufactured in the same process. For example, the first lower protrusion DAM1-B and the second lower protrusion DAM2-B, and the first upper protrusion DAM1-T and the second upper protrusion DAM2-T are the organic light emitting display panel ( It may be formed in the same process as the process of forming the pixel defining layer (PDL of FIG. 6C ) of the DP). In addition, the base protrusion DAM2-U of the second protrusion member DAM2 may be formed in the same process as the process of forming the circuit layer DP-CL.

18A to 18B , the second wiring part TW2a disposed on the second protruding member DAM2 is the first sub-wiring part TW2-1 overlapping the second upper protruding part DAM2-T. ), the second sub wiring portion TW2 - 2 overlapping the exposed portion of the second lower protrusion DAM2-B, and between the second lower protrusion DAM2-B and the second upper protrusion DAM2-T It may include a third sub-wiring unit TW2 - 3 disposed in the stepped portion.

When viewed in a plan view, the wiring portion TW has a concave notch shape at a portion overlapping the edges of the first protruding member DAM1 and the second protruding member DAM2 . In addition, the second protruding member having a higher dam height than the first protruding member may include a convexly protruding protrusion among the second wiring parts TW2b.

In the protruding member formed by stacking a plurality of layers, the wiring portion has a notch shape at the stepped portion, and on the uppermost surface of the protruding member with a relatively small flat surface, the wiring portion has a convexly protruding shape than other portions, so that the wiring as a whole It is possible to improve a negative short circuit defect or a disconnection defect.

19A and 19B show a cross-section and a plan view of a case in which the configuration of the connection part TW is different compared to the exemplary embodiment of FIGS. 14A and 14B described above. 19A to 19B , the wiring unit TW may have a double wiring structure.

In an embodiment, the wiring unit TW may include a first metal layer MTL1 , an insulating layer ISL, a second metal layer MTL2 , and a contact hole CL. The first metal layer MTL1 may be disposed on the encapsulation layer TFE, and an insulating layer ISL may be disposed between the first metal layer MTL1 and the second metal layer MTL2 . Also, a plurality of contact holes CL may be disposed between the first metal layer MTL1 and the second metal layer MTL2 . The contact holes CL may electrically connect the first metal layer MTL1 and the second metal layer MTL2. The contact hole CL may be formed to pass through the insulating layer ISL. The wiring unit may have a double wiring structure in which the first metal layer MTL1 and the second metal layer MTL2 are stacked to reduce resistance of the wiring unit.

Also, in an embodiment, the contact hole CL may be disposed to not overlap the connection wiring part TWC. The contact hole CL may be disposed so as not to overlap with the stepped portion of the protruding member. The contact hole CL is disposed on the flat surface of the encapsulation layer TFE and the flat surface of the upper protrusion DAM-T to make good electrical connection between the first metal layer MTL1 and the second metal layer MTL2. The resistance of the wiring unit TW may be reduced.

In the embodiment described above with reference to FIGS. 9 to 19B , the shape of the wiring part passing through the protruding member in the portion adjacent to the touch pad of the touch sensing unit is exemplarily shown, but the embodiment is not limited thereto. For example, the wiring portion TW connected to the second touch electrodes TE2-1 to TE2-5 shown in FIG. 9 and extending in the second direction DR2 extends in the first direction DR1. Even when the protrusion member DAM is disposed to pass, the shape of the wiring part according to the above-described exemplary embodiment may be applied. In addition, a wiring portion passing through the structure having a step as well as passing through the protrusion member DAM may have a notch shape concavely recessed in the step portion of the structure.

The display device according to an exemplary embodiment having the above-described structure of the wiring unit may improve a short circuit defect between the wiring units or a disconnection defect of the wiring unit.

20 is a cross-sectional view illustrating a part of a photo process during a process of forming a wiring part of a touch sensing unit in the display device according to an exemplary embodiment. The wiring part may be formed by patterning the metal layer TW-M deposited on the encapsulation layer TFE of the organic light emitting display panel DP in the process of FIG. 20 in an embodiment. A metal layer TW-M may be deposited on the encapsulation layer TFE, and an organic layer OM for patterning the wiring portion may be provided on the metal layer TW-M. The organic layer OM may be a photoresist material, for example, a negative type photoresist may be used as the organic layer OM. The mask MSK is disposed on the organic light emitting display panel DP coated with the organic layer OM, the organic layer OM is cured by providing ultraviolet light, and then the uncured organic layer OM is removed according to the shape of the mask. The organic layer OM is patterned. Thereafter, an etching process is performed to pattern the metal layer TW-M along the patterned organic layer OM. After patterning the metal layer TW-M, a strip process is performed to remove the remaining organic layer OM to form a wiring part.

21A shows the shape of a conventional mask MSK' used to form a wiring part. FIG. 21B is a diagram illustrating a wiring portion TW′ formed using the mask MSK′ shown in FIG. 21A .

In FIG. 21A , the mask MSK' may include a light transmitting part OTA and a light blocking part OBA. In the mask MSK' illustrated in FIG. 21A , the edge of the light-transmitting part OTA is linear. When a wiring part passing through the protruding member DAM' is formed using the mask MSK' having the shape shown in FIG. 21A, as in the "FF" region of FIG. 21B, the edge DM-E' part of the protruding member In this case, the adjacent wiring units TW' are connected to each other, and a short circuit may occur in the wiring units TW'. This is because, when the organic layer OM is provided for patterning the wiring portion TW′, the stacking height of the organic layer OM is increased at the portion where the step of the protruding member DAM′ occurs, so that the metal layer TW-M is etched during wiring. This is because a problem occurs in that the patterning quality of the negative (TW') edge portion is deteriorated. Due to the influence of the thick organic layer OM, the metal layer passing through the protruding member DAM' could not be patterned to have a straight edge along the mask pattern, so the distance between the adjacent patterned wiring parts TW' became closer. A short circuit may occur partially in the wiring part.

22 illustrates a shape of a mask MSK1 used to form a wiring portion in a display device according to an exemplary embodiment. The mask MSK1 includes a light transmitting portion OTA and a light blocking portion OBA, and the light transmitting portion OTA has a shape of the wiring portion TW of FIG. 12 formed on the protruding member DAM in the display device according to an exemplary embodiment. It may correspond to the shape.

22 illustrates a shape of a mask MSK1 of a portion overlappingly disposed on the protruding member DAM. The light transmitting portion OTA of the mask MSK1 has a first width M1 at a portion that does not overlap with the protruding member DAM, and has a second width M2 at a portion overlaps with the protruding member DAM, A connection portion overlapping the edge DM-E of the protrusion member DAM may have a third width M3. In this case, the first width M1 and the second width M2 may be the same and the third width M3 may be smaller than the first width M1 and the second width M2 . For example, in the mask MSK1 , the first width M1 and the second width M2 of the light transmitting part OTA are respectively the first wiring part TW1 among the wiring parts in the display device of the exemplary embodiment shown in FIG. 12 . ) and the first wiring width W1 and the second wiring width W2 that are the wiring widths of the second wiring unit TW2 . Also, the third width M3 of the light transmitting part OTA may correspond to the third wiring width W3 of the connection wiring part TWC.

When the wiring portion is patterned using the shape of the mask MSK1 shown in FIG. 22 , the light transmitting portion OTA of the mask MSK1 has the first width M1 or By designing to have a third width M3 smaller than the second width M2 , a short circuit between wiring units may be prevented. The light transmitting portion OTA of the mask MSK1 is made to have a smaller third width M3 compared to the portion overlapping the protruding member DAM at the portion overlapping the edge DM-E of the protruding member DAM , the thickness of the organic layer formed by the light passing through the mask light-transmitting part OTA of the third width M3 may be reduced. Accordingly, in the portion overlapping the edge DM-E of the protruding member in the wiring portion formed by the subsequent etching process, adjacent wiring portions may be sufficiently spaced apart, so that the short circuit problem between the wiring portions may be improved.

Meanwhile, when the protrusion member is formed by stacking a plurality of layers, and the area of the uppermost surface of the protrusion member is smaller than the area of the lower protrusion, the wiring part may be patterned using the mask MSK2 shown in FIG. 23 .

23 illustrates a shape of a mask MSK2 used to form a wiring portion in a display device according to an exemplary embodiment. The mask MSK2 includes a light transmitting portion OTA and a light blocking portion OBA, and the light transmitting portion OTA has a shape of the wiring portion TW of FIG. 16 formed on the protruding member DAM in the display device according to an exemplary embodiment. It may correspond to the shape.

23 illustrates the shape of the mask MSK2 of a portion overlappingly disposed on the protruding member DAM. The light transmitting portion OTA of the mask MSK2 has a first width M1 at a portion that does not overlap with the protruding member DAM, and has a second width M2 at a portion overlaps with the protruding member DAM and a portion having a fourth width M4 greater than the second width. In addition, a third width M3 may be provided at the connection portion overlapping the edge DM-E of the protrusion member DAM. In this case, the first width M1 and the second width M2 may be the same and the third width M3 may be smaller than the first width M1 and the second width M2 . For example, in the mask MSK2 , the first width M1 and the second width M2 of the light transmitting part OTA are respectively the first wiring part TW1 of the wiring parts in the display device of the exemplary embodiment shown in FIG. 16 . ) and the first wiring width W1 and the second wiring width W2 that are the wiring widths of the second wiring unit TW2 . Also, the third width M3 of the light transmitting part OTA may correspond to the third wiring width W3 of the connection wiring part TWC. The fourth width M4 of the light transmitting part OTA may correspond to the first sub-wiring width W4 of the first sub-wiring part TW2-1.

When the wiring part is patterned using the shape of the mask MSK2 shown in FIG. 23 , the light transmitting part OTA of the mask MSK2 has a first width M1 or By designing to have a third width M3 smaller than the second width M2 , a short circuit between wiring units may be prevented.

On the other hand, when the connection part is patterned using the conventional mask MSK' due to the relatively narrow area of the top surface of the protruding member, the degree of etching of the metal layer at the edge portion of the uppermost layer of the protruding member is excessive, so that the disconnection of the connection part is problems may arise.

In comparison, when the connection part is patterned using the mask MSK2 having the shape shown in FIG. 23, the width of the light transmitting part OTA of the mask in the uppermost layer of the protruding member is relatively large, so that the wiring part has a sufficient width. and patterning in such a way that the disconnection problem of the wiring part can be improved.

Accordingly, in the display device according to an exemplary embodiment, the wiring unit forms a concave notch at the step portion of the protruding member to improve the short circuit problem between the adjacent wiring units, and a convex protrusion is formed on the uppermost surface of the protruding member. Thus, it is possible to improve the disconnection problem of the wiring part.

Meanwhile, in the display device according to an exemplary embodiment, in the protrusion member, a short circuit problem between adjacent wiring units may be improved by arranging the lower protrusion and the upper protrusion to be stacked in a step shape to introduce a flat surface on the protrusion member.

Although the above has been described with reference to a preferred embodiment of the present invention, those skilled in the art or those having ordinary skill in the art will not depart from the spirit and scope of the present invention described in the claims to be described later. It will be understood that various modifications and variations of the present invention can be made without departing from the scope of the present invention.

Accordingly, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification, but should be defined by the claims.

DD: Display device TS: Touch sensing unit
TW: wiring part DAM, DAM1, DAM2: protruding member

Claims (12)

a base substrate divided into a display area and a non-display area adjacent to the display area;
a light emitting device layer disposed on the display area and including a pixel defining layer and an organic light emitting diode;
a circuit layer disposed on the base substrate and including an insulating layer adjacent to the light emitting device layer;
a touch sensing unit disposed on the light emitting element layer and including a touch electrode and a wiring part connected to the touch electrode;
an encapsulation layer disposed between the light emitting element layer and the touch sensing unit; and
a protrusion member disposed on the non-display area; including,
The wiring part on a plane,
a first wiring part that does not overlap the protruding member and has a first wiring width;
a second wiring part overlapping the protruding member and having a second wiring width; and
a third wiring portion having a third wiring width different from the first wiring width and the second wiring width and disposed between the first wiring portion and the second wiring portion; including,
The first to third wiring widths are widths in a direction perpendicular to an extension direction of the wiring portion. The method of claim 1,
and the third wiring part overlaps around an edge of the protrusion member. The method of claim 1,
The third wiring width is smaller than the first wiring width and the second wiring width. The method of claim 1,
The third wiring unit includes a first sub wiring unit;
a second sub wiring unit disposed between the first wiring unit and the first sub wiring unit; and
a third sub wiring unit disposed between the second wiring unit and the first sub wiring unit; including,
The display device in which the first sub wiring portion overlaps around an edge of the protrusion member. 5. The method of claim 4,
The wiring width of the second sub wiring unit increases in the direction of the first wiring unit,
A wiring width of the third sub wiring unit increases in a direction toward the second wiring unit. delete The method of claim 1,
The protrusion member is on the same layer as the insulating layer or the pixel defining layer. a base substrate divided into a display area and a non-display area adjacent to the display area;
a light emitting device layer disposed on the display area;
a touch sensing unit disposed on the light emitting element layer and including a touch electrode and a wiring part connected to the touch electrode;
an encapsulation layer disposed between the light emitting element layer and the touch sensing unit; and
a protrusion member disposed on the non-display area; including,
The wiring part on a plane,
a first wiring part that does not overlap the protruding member and has a first wiring width;
a second wiring part overlapping the protruding member and having a second wiring width; and
a third wiring portion having a third wiring width smaller than the first wiring width and the second wiring width, the third wiring portion being disposed between the first wiring portion and the second wiring portion; including,
The third wiring portion overlaps around the edge of the protruding member,
The first to third wiring widths are widths in a direction perpendicular to an extension direction of the wiring portion. delete at least one bending area bent with respect to a bending axis extending in one direction, and a non-bending area adjacent to the bending area,
a base substrate divided into a display area and a non-display area adjacent to the display area;
a light emitting device layer disposed on the display area;
a touch sensing unit disposed on the light emitting element layer and including a touch electrode and a wiring part connected to the touch electrode;
an encapsulation layer disposed between the light emitting element layer and the touch sensing unit; and
a protrusion member disposed on the non-display area; including,
The wiring part on a plane,
a first wiring part that does not overlap the protruding member and has a first wiring width;
a second wiring part overlapping the protruding member and having a second wiring width; and
a third wiring portion having a third wiring width different from the first wiring width and the second wiring width and disposed between the first wiring portion and the second wiring portion; including,
The first to third wiring widths are widths in a direction perpendicular to an extension direction of the wiring portion. 11. The method of claim 10,
The third wiring part overlaps around an edge of the protrusion member, and the third wiring width is smaller than the first wiring width and the second wiring width. 11. The method of claim 10,
The display device further comprising an optical member disposed on the touch sensing unit and including a polarizing film.

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