KR20180119153A - Display device - Google Patents

Abstract

A display device includes a display panel and a touch sensing unit disposed on the display panel. The touch sensing unit includes a first conductive pattern disposed on the display panel, an insulating layer covering the first conductive pattern, and a second conductive pattern disposed on the insulating layer and partially crossing the first conductive pattern. The thickness of the first conductive pattern is thinner than the thickness of the second conductive pattern. Accordingly, the present invention can reduce a crack generation rate of the insulating layer.

Description

Display device {DISPLAY DEVICE}

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a display device, and more particularly, to a display device in which a crack occurrence rate of an insulating layer included in a touch sensing unit is reduced.

In the information society, display devices are becoming important as visual information delivery media. Currently known display devices include liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting displays (OLEDs), field effect displays : FED), and an electrophoretic display (EPD).

The display device is activated by receiving an electrical signal. The display device includes a touch screen for sensing a touch applied from outside the display panel for displaying the image.

The display device may include various electrode patterns to be activated by an electrical signal. The area where the electrode patterns are activated responds to information displayed or touches applied from the outside.

It is an object of the present invention to provide a display device in which the cracking rate of the insulating layer included in the touch sensing unit is reduced.

It is an object of the present invention to provide a display device in which a short defect rate of a touch sensing unit is reduced.

An embodiment of the present invention includes a display panel and a touch sensing unit disposed on the display panel, wherein the touch sensing unit includes a first conductive pattern disposed on the display panel, an insulating layer covering the first conductive pattern, And a second conductive pattern partially disposed on the second conductive pattern and intersecting the first conductive pattern, wherein a thickness of the first conductive pattern is smaller than a thickness of the second conductive pattern.

The first conductive pattern and the insulating layer are disposed directly on the thin film encapsulation layer of the display panel, the insulating layer is disposed on the first conductive pattern and has a first portion spaced apart from the thin film encapsulation layer, And a third portion connecting the first portion and the second portion.

The thickness of the first conductive pattern may be smaller than the thickness of the insulating layer.

The thickness of the first conductive pattern may be equal to or greater than 1800 ANGSTROM and equal to or less than 2100 ANGSTROM and the thickness of the second conductive pattern may be equal to or greater than 2700 ANGSTROM and equal to or less than 3500 ANGSTROM.

The first conductive pattern includes a first conductive layer disposed on the display panel, a second conductive layer disposed on the first conductive layer, and a third conductive layer disposed on the second conductive layer, The electrical resistivity of the first conductive layer and the third conductive layer may be smaller and the thickness of the second conductive layer may be larger than the thickness of the first conductive layer and the thickness of the third conductive layer.

The thickness of the third conductive layer may be greater than the thickness of the first conductive pattern.

The thickness of the third conductive layer may be 1.5 times or more and 3 times or less the thickness of the first conductive pattern.

The thickness of the first conductive layer may be about 50 Å to about 200 Å, the thickness of the second conductive layer may be about 1000 Å to about 1800 Å, and the thickness of the third conductive layer may be about 250 Å to about 350 Å.

The first conductive layer and the third conductive layer may each contain Ti, and the second conductive layer may include Al.

The second conductive pattern includes a fourth conductive layer disposed on the insulating layer, a fifth conductive layer disposed on the fourth conductive layer, and a sixth conductive layer disposed on the fifth conductive layer, The electrical resistivity of the fourth conductive layer and the sixth conductive layer may be smaller and the thickness of the fifth conductive layer may be larger than the thickness of the fourth conductive layer and the sixth conductive layer.

The thickness of the second conductive layer may be smaller than the thickness of the fifth conductive layer.

The thickness of the first conductive layer may be smaller than the thickness of the fourth conductive layer.

The fourth conductive layer may have a thickness of 250 ANGSTROM to 350 ANGSTROM, the fifth conductive layer may have a thickness of 2200 ANGSTROM to 2,800 ANGSTROM, and the sixth conductive layer may have a thickness of 250 ANGSTROM to 350 ANGSTROM.

Each of the fourth conductive layer and the sixth conductive layer may include Ti, and the fifth conductive layer may include Al.

The second conductive pattern may include first connection portions, first touch sensor portions connected by first connection portions, and second touch sensor portions spaced apart from the first touch sensor portions.

The first conductive pattern may include second connection portions connecting the second touch sensor portions, and the second connection portions may intersect with the first connection portions.

The first conductive pattern includes second connection portions connecting the second touch sensor units, the first touch sensor units and the second touch sensor units each include a plurality of mesh lines defining a plurality of mesh holes, The connection portions may intersect with the mesh lines of the first touch sensor portions and the mesh lines of the second touch sensor portions.

The second connection portions may not intersect with the first connection portions.

The first conductive pattern may include second connection portions connecting the second touch sensor portions, a contact hole may be defined in the insulating layer, and the second connection portions may connect the second touch sensor portions through the contact holes.

The display panel may include a base layer, a circuit layer disposed on the base layer, an organic light emitting element layer disposed on the circuit layer, and a thin film encapsulation layer disposed on the organic light emitting element layer.

According to the display device of the embodiment of the present invention, the cracking rate of the insulating layer included in the touch sensing unit is reduced, and as a result, short defects of the touch sensing unit due to cracks can be improved.

1A is a perspective view illustrating a first operation of a display apparatus according to an embodiment of the present invention.
1B is a perspective view illustrating a second operation of the display apparatus according to the embodiment of the present invention.
1C is a perspective view illustrating a third operation of the display apparatus according to the embodiment of the present invention.
2 is a cross-sectional view of a display device according to an embodiment of the present invention.
3A and 3B are perspective views of a display device according to an embodiment of the present invention.
4A and 4B are perspective views of a display device according to an embodiment of the present invention.
5A is a plan view of a display panel included in a display device according to an embodiment of the present invention.
5B is a cross-sectional view of a display module included in a display device according to an embodiment of the present invention.
6A is an equivalent circuit diagram of a pixel included in a display device according to an embodiment of the present invention.
6B is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention.
6C is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention.
7A to 7C are sectional views of a thin film encapsulation layer included in a display device according to an embodiment of the present invention.
8A is a cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.
8B to 8E are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention.
FIG. 8F is a partial enlarged view of the area A1 in FIG. 8B. FIG.
9 is a partial enlarged view of the region A2 in Fig. 8B.
10A and 10B are schematic cross-sectional views corresponding to line I-I 'in FIG.
11 is a schematic cross-sectional view of a touch sensing unit included in a conventional display device.
12A to 12D are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention.
13A to 13C are partial enlarged views of the region A3 in Fig. 12A.
Fig. 14 is a schematic cross-sectional view corresponding to line II-II 'in Fig. 13C.
15 is a partial cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.
16 is a sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS The above and other objects, features, and advantages of the present invention will become more readily apparent from the following description of preferred embodiments with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art.

Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown enlarged from the actual for the sake of clarity of the present invention. The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component. The singular expressions include plural expressions unless the context clearly dictates otherwise.

In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Also, where a portion such as a layer, film, region, plate, or the like is referred to as being "on" another portion, this includes not only the case where it is "directly on" another portion, but also the case where there is another portion in between. On the contrary, when a part such as a layer, film, region, plate or the like is referred to as being "under" another part, it includes not only the case where it is "directly underneath" another part but also another part in the middle.

Hereinafter, a display device according to an embodiment of the present invention will be described.

1A is a perspective view of a first operation of a display device DD according to an embodiment of the present invention. 1B is a perspective view illustrating a second operation of the display device DD according to an exemplary embodiment of the present invention. 1C is a perspective view illustrating a third operation of the display device DD according to the embodiment of the present invention.

1A, the display surface IS on which the image IM is displayed is parallel to the plane defined by the first directional axis DR1 and the second directional axis DR2. The normal direction of the display surface IS, i.e., the thickness direction of the display device DD, is indicated by the third directional axis DR3. The front surface (or the upper surface) and the back surface (or lower surface) of each of the members are separated by the third directional axis DR3. However, the directions indicated by the first to third direction axes DR1, DR2, DR3 can be converted into different directions as relative concepts. Hereinafter, the first to third directions refer to the same reference numerals in the directions indicated by the first to third direction axes DR1, DR2, and DR3, respectively.

1A to 1C show a folder display device as an example of the flexible display device DD. However, the present invention can be a rollered display device or a bended display device to be driven, and is not particularly limited. Although the flexible display device is shown in this embodiment, the present invention is not limited thereto. The display device DD according to the present embodiment may be a flat rigid display device. The flexible display device DD according to the present invention can be used for a large-sized electronic device such as a television, a monitor, etc., and a small-sized electronic device such as a mobile phone, a tablet, a car navigation system, a game machine,

As shown in FIG. 1A, the display surface IS of the flexible display device DD may include a plurality of areas. The flexible display device DD includes a display area DD-DA in which an image IM is displayed and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area (DD-NDA) is an area where no image is displayed. In Fig. 1A, a vase is shown as an example of the image IM. As an example, the display area DD-DA may be rectangular. The non-display area DD-NDA may surround the display area DD-DA. However, the shape of the display area DD-DA and the shape of the non-display area DD-NDA can be relatively designed, without being limited thereto.

As shown in Figs. 1A to 1C, the display device DD may include a plurality of areas defined according to the operation mode. The display device DD includes a bending area BA bending on the basis of bending axis BX, a first bending unbending area NBA1 and a second unbending area NBA2, . As shown in FIG. 1B, the display device DD is configured so that the display surface IS of the first non-bending area NBA1 and the display surface IS of the second non- -bending. As shown in FIG. 1C, the display device DD may be outer-bending such that the display surface IS is exposed to the outside.

1A to 1C, only one bending area BA is shown, but the present invention is not limited thereto. For example, in one embodiment of the present invention, the display device DD may include a plurality of bending areas BA. In an embodiment of the present invention, the display device DD may be configured to repeat only the operation modes shown in Figs. 1A and 1B. However, the present invention is not limited thereto, and the bending area BA may be defined corresponding to the manner in which the user operates the display device DD. For example, unlike FIGS. 1B and 1C, the bending area BA may be defined parallel to the first directional axis DR1 and may be defined diagonally. The area of the bending area BA is not fixed but can be determined according to the radius of curvature.

2 is a cross-sectional view of a display device DD according to an embodiment of the present invention. FIG. 2 shows a cross section defined by the second directional axis DR2 and the third directional axis DR3.

2, the display device DD includes a protective film PM, a display module DM, an optical member LM, a window WM, a first adhesive member AM1, a second adhesive member AM2, and a third adhesive member AM3. The display module DM is disposed between the protective film PM and the optical member LM. The optical member LM is disposed between the display module DM and the window WM. The first adhesive member AM1 combines the display module DM with the protective film PM while the second adhesive member AM2 combines the display module DM and the optical member LM, (AM3) combines the optical member (LM) and the window (WM). If necessary, at least one of the first adhesive member AM1, the second adhesive member AM2 and the third adhesive member AM3 may be omitted.

The protective film PM protects the display module DM. The protective film PM provides a first outer surface OS-L exposed to the outside, and provides an adhesive surface to be bonded to the first adhesive member AM1. The protective film PM can prevent external moisture from penetrating into the display module DM and absorb external shocks.

The protective film PM may include a plastic film as a base substrate. The protective film (PM) may be formed of at least one selected from the group consisting of polyethersulfone (PES), polyacrylate, polyetherimide (PEI), polyethylenenaphthalate (PEN), polyethyleneterephthalate (PET) (PPS), polyarylate, polyimide (PI), polycarbonate (PC), polyarylene ether sulfone (poly (arylene ethersulfone) And a plastic film containing any one selected from the group consisting of

The material constituting the protective film (PM) is not limited to plastic resins, and may include an organic / inorganic composite material. The protective film PM may comprise a porous organic layer and an inorganic material filled in the pores of the organic layer. The protective film PM may further comprise a functional layer formed on the plastic film. The functional layer may include a resin layer. The functional layer may be formed by a coating method. In one embodiment of the present invention, the protective film PM may be omitted.

The window WM protects the display module DM from an external impact and can provide an input surface to the user. The window WM provides a second outer surface OS-U exposed to the outside and provides an adhesive surface to be adhered to the second adhesive member AM2. The display surface IS shown in Figs. 1A to 1C may be a second outer surface OS-U.

The window (WM) may comprise a plastic film. The window (WM) can have a multi-layer structure. The window (WM) may have a multilayer structure selected from a glass substrate, a plastic film, and a plastic substrate. The window (WM) may further include a bezel pattern. The multi-layer structure may be formed through a continuous process or an adhesion process using an adhesive layer.

The optical member LM reduces the external light reflectance. The optical member LM may include at least a polarizing film. The optical member (LM) may further include a retardation film. In an embodiment of the present invention, the optical member LM may be omitted.

The display module DM may include a display panel DP and a touch sensing unit TS. The touch sensing unit TS can be disposed directly on the display panel DP. As used herein, the term " directly disposed " means that it is formed by a continuous process except that it is adhered using a separate adhesive layer. However, the present invention is not limited thereto, and another layer such as an adhesive layer or a substrate may be interposed between the display panel DP and the touch sensing unit TS.

Hereinafter, the display panel DP is an organic light emitting display panel (DP), but the present invention is not limited thereto. The display panel DP may be a liquid crystal display panel, a plasma display panel a display panel, an electrophoretic display panel, a microelectromechanical system display panel, and an electrowetting display panel.

The organic light emitting display panel DP generates an image IM (see Fig. 1A) corresponding to the input image data. The organic light emitting display panel DP provides a first display panel back face BS1-L and a second display panel back face BS1-U facing in the thickness direction DR3.

The touch sensing unit TS acquires the coordinate information of the external input. The touch sensing unit TS can sense an external input in a capacitive manner.

Although not shown separately, the display module DM according to an embodiment of the present invention may further include an anti-reflection layer. The antireflection layer may include a color filter or a laminated structure of a conductive layer / insulating layer / conductive layer. The antireflection layer can reduce the external light reflectance by absorbing or destructively interfering or polarizing light incident from the outside. The antireflection layer can replace the function of the optical member LM.

Each of the first adhesive member AM1, the second adhesive member AM2 and the third adhesive member AM3 is made of an optically clear adhesive film (OCA) or an optically clear resin (OCR) Or an organic adhesive layer such as a pressure sensitive adhesive film (PSA). The organic adhesive layer may include an adhesive material such as polyurethane, polyacrylic, polyester, polyepoxy, polyvinyl acetate, and the like.

Although not shown separately, the display device DD may further include a frame structure for supporting the functional layers to maintain the state shown in Figs. 1A to 1C. The frame structure may include a joint structure or a hinge structure.

3A and 3B are perspective views of a display device DD-1 according to an embodiment of the present invention. FIG. 3A shows a display device DD-1 in an unfolded state, and FIG. 3B shows a display device DD-1 in a bent state.

The display device DD-1 may include one bending area BA and one non-bending area NBA. The non-display area DD-NDA of the display device DD-1 can be bent. However, the bending area of the display device DD-1 may be changed in an embodiment of the present invention.

The display device DD-1 according to the present embodiment can be fixedly operated in one form, unlike the display device DD shown in Figs. 1A to 1C. The display device DD-1 can operate in a bent state as shown in Fig. 3B. The display device DD-1 is fixed to a frame or the like in a bent state, and the frame can be engaged with the housing of the electronic device.

The display device DD-1 according to the present embodiment may have the same cross-sectional structure as that shown in Fig. However, the non-bending region NBA and the bending region BA may have different lamination structures. The non-bending region NBA has the same cross-sectional structure as that shown in Fig. 2, and the bending region BA can have a cross-sectional structure different from that shown in Fig. The optical member LM and the window WM may not be disposed in the bending area BA. That is, the optical member LM and the window WM can be disposed only in the non-bending area NBA. The second adhesive member AM2 and the third adhesive member AM3 may not be disposed in the bending area BA.

4A is a perspective view of a display device DD-2 according to an embodiment of the present invention.

The display device DD-2 includes a non-bending area (NBA, or planar area) where the main image is displayed on the front side and a bending area (BA, or side area) where the sub image is displayed on the side. Although not shown separately, the sub-image may include an icon for providing predetermined information. In the present embodiment, the term "non-bending area (NBA) and bending area (BA)" defines the display device (DD-2) as a plurality of areas divided into shapes.

The bending region BA bending from the non-bending region NB is formed as a fourth directional axis DR4 intersecting the first directional axis DR1, the second directional axis DR2, and the third directional axis DR3 Display the sub-image. However, the directions indicated by the first to fourth direction axes DR1 to DR4 can be converted into different directions as relative concepts.

4B is a perspective view of a display device DD-3 according to an embodiment of the present invention.

The display device DD-3 includes a non-bending area NBA in which the main image is displayed on the front side, a first bending area BA1 and a second bending area BA2 in which the sub image is laterally displayed. The first bending area BA1 and the second bending area BA2 can be bent from both sides of the non-bending area NBA.

FIG. 5A is a plan view of an organic light emitting display panel DP included in a display device according to an embodiment of the present invention, FIG. 5B is a sectional view of a display module DM included in a display device according to an embodiment of the present invention to be. For example, FIG. 5B may show a part of a cross section on a plane parallel to the plane defined by the second direction DR2 and the third direction DR3.

As shown in FIG. 5A, the organic light emitting display panel DP includes a display area DA and a non-display area NDA on a plane. The display area DA and the non-display area NDA of the organic light emitting display panel DP are arranged in the display area DD-DA (see Fig. 1A) and the non-display area DD-NDA , See Fig. 1A), respectively. The display area DA and the non-display area NDA of the organic light emitting display panel DP are arranged in the display area DD-DA (see Fig. 1A) and the non-display area DD-NDA (See Fig. 1A), and may be changed according to the structure / design of the organic light emitting display panel DP.

The organic light emitting display panel DP includes a plurality of pixels PX. An area in which a plurality of pixels PX are arranged is defined as a display area DA. In the present embodiment, the non-display area NDA can be defined along the rim of the display area DA.

The organic light emitting display panel DP includes gate lines GL, data lines DL, light emitting lines EL, control signal lines SL-D, initializing voltage lines SL-Vint, SL-VDD), and a pad portion PD.

The gate lines GL are connected to the corresponding pixels PX of the plurality of pixels PX and the data lines DL are connected to the corresponding pixels PX of the plurality of pixels PX, do. Each of the light emitting lines EL may be arranged in parallel to a corresponding one of the gate lines GL. The control signal line SL-D may provide control signals to the gate drive circuit GDC. The initialization voltage line SL-Vint may provide an initialization voltage to the plurality of pixels PX. The voltage line SL-VDD is connected to the plurality of pixels PX and can provide the first voltage to the plurality of pixels PX. The voltage line SL-VDD may include a plurality of lines extending in the first direction DR1 and a plurality of lines extending in the second direction DR2.

A gate driving circuit GDC connected to the gate lines GL and the light emitting lines EL may be disposed at one side of the non-display area NDA. Some of the gate lines GL, the data lines DL, the light emitting lines EL, the control signal lines SL-D, the initialization voltage lines SL-Vint and the voltage lines are arranged in the same layer, Some are placed on different floors.

The pad portion PD may be connected to the ends of the data lines DL, the control signal line SL-D, the initialization voltage line SL-Vint, and the voltage line SL-VDD. 5B, the organic light emitting display panel DP includes a base layer SUB, a circuit layer DP-CL disposed on the base layer SUB, a circuit layer DP-CL disposed on the circuit layer CP- A thin-film encapsulation layer (TFE) disposed on the organic light-emitting device layer (DP-OLED), and the organic light-emitting device layer (DP-OLED).

The base layer (SUB) may comprise at least one plastic film. The base layer (SUB) is a flexible substrate, and may include a plastic substrate, a glass substrate, a metal substrate, or an organic / inorganic composite material substrate. The plastic substrate may be at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, . ≪ / RTI >

The circuit layer DP-CL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The plurality of conductive layers of the circuit layer DP-CL may constitute control circuits of signal lines or pixels.

The organic light emitting device layer (DP-OLED) includes organic light emitting diodes.

The thin film encapsulation layer (TFE) seals the organic light emitting element layer (DP-OLED). The thin film encapsulation layer (TFE) includes an inorganic thin film and an organic thin film. The thin film encapsulation layer (TFE) may comprise at least two inorganic layers and an organic layer disposed therebetween. The inorganic thin films protect the organic light emitting element layer (DP-OLED) from moisture / oxygen, and the organic thin film protects the organic light emitting element layer (DP-OLED) from foreign substances such as dust particles. The inorganic layer may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, an aluminum oxide layer, or the like. The organic layer may include, but is not limited to, an acrylic based organic layer. In the present invention, the thickness of the organic thin film may be adjusted so that the touch sensing unit (TS) provides a uniform sensitivity. The description thereof will be described later in detail.

The touch sensing unit TS may be disposed directly on the thin film sealing layer (TFE). However, the present invention is not limited thereto. An inorganic layer may be disposed on the sealing layer (TFE), and a touch sensing unit (TS) may be disposed on the inorganic layer. The inorganic layer may be a buffer layer. The inorganic layer may be at least one of a silicon nitride layer, a silicon oxynitride layer, and a silicon oxide layer. However, the present invention is not limited thereto. Although the inorganic layer is described as being a separate structure, the inorganic layer may be included in the sealing layer (TFE).

The touch sensing unit TS includes touch sensors and touch signal lines. The touch sensors and the touch signal lines may have a single layer or a multi-layer structure.

The touch sensors and the touch signal lines may include ITO (indium tin oxide), IZO (indium zinc oxide), ZnO (zinc oxide), ITZO (indium tin zinc oxide), PEDOT, metal nanowire, and graphene. The touch sensors and touch signal lines may comprise a metal layer, such as molybdenum, silver, titanium, copper, aluminum, or alloys thereof. The touch sensors and the touch signal lines may have the same layer structure or different layer structures. Details of the touch sensing unit TS will be described later.

6A is an equivalent circuit diagram of a pixel PX included in a display device according to an embodiment of the present invention.

In FIG. 6A, an i-th pixel PXi connected to a k-th data line DLk among the plurality of data lines DL is exemplarily shown.

The i-th pixel PXi includes an organic light emitting diode (OLED) and a pixel driving circuit for controlling the organic light emitting diode. The driving circuit may include seven thin film transistors (T1 to T7) and one storage capacitor (Cst). A pixel driving circuit including seven thin film transistors T1 to T7 and one capacitor Cst is illustrated as an example. The pixel PXi is a driving circuit for driving the organic light emitting diode OLED, It suffices to include the transistor T1 (or the driving transistor), the second transistor T2 (or the switching transistor), and the capacitor Cst, and the pixel driving circuit may be variously modified.

The driving transistor controls the driving current supplied to the organic light emitting diode (OLED). The output electrode of the second transistor T2 is electrically connected to the organic light emitting diode OLED. The output electrode of the second transistor T2 may be in direct contact with the anode of the organic light emitting diode OLED or may be connected via another transistor (the sixth transistor T6 in this embodiment).

The control electrode of the control transistor can receive the control signal. The control signal applied to the i-th pixel PXi is an i-th gate signal Si-1, an i-th gate signal Si, an i + 1-th gate signal Si + 1, a data signal Dk, And an i < th > emission control signal Ei. In an embodiment of the present invention, the control transistor may include a first transistor T1 and third to seventh transistors T3 to T7.

The first transistor T1 includes an input electrode connected to the k-th data line DLk, a control electrode connected to the i-th gate line GLi, and an output electrode connected to the output electrode of the second transistor T2 do. The first transistor T1 is turned on by a gate signal Si applied to an i-th gate line GLi and is then turned on by a data signal Dk applied to the k-th data line DLk. To the storage capacitor Cst.

6B is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention. 6C is a partial cross-sectional view of a display panel included in a display device according to an embodiment of the present invention. Specifically, FIG. 6B shows a cross section of a portion corresponding to the first transistor T1 of the equivalent circuit shown in FIG. 6A. 6C shows a cross section of a portion corresponding to the second transistor T2, the sixth transistor T6 and the organic light emitting diode OLED of the equivalent circuit shown in Fig. 6A.

6B and 6C, a first transistor T1, a second transistor T2 and a sixth transistor T6 are disposed on a base substrate SUB. Since the structure of the transistors is substantially the same, the structure of the first transistor T1 will be described below, and the description of the structure of the second and sixth transistors T2 and T6 will be omitted.

The upper surface of the base substrate SUB is defined as a first direction DR1 and a second direction DR2. The first transistor T1 includes a first input electrode DE1, a first output electrode SE1, a first control electrode GE1, and a first oxide semiconductor pattern OSP1.

The buffer layer BFL may be disposed on the upper surface of the base substrate SUB. The buffer layer BFL improves the bonding force between the base substrate SUB and the conductive patterns or semiconductor patterns. The buffer layer (BFL) may include an inorganic layer. Although not shown separately, a barrier layer for preventing foreign matter from entering may be further disposed on the upper surface of the base substrate SUB. The buffer layer (BFL) and the barrier layer may be selectively arranged or omitted.

The base substrate SUB may include a plastic substrate, a glass substrate, a metal substrate, or the like. The plastic substrate may be at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, . ≪ / RTI >

The first oxide semiconductor pattern OSP1 is disposed on the buffer layer BFL. The first oxide semiconductor pattern OSP1 may include indium-tin oxide (ITO), indium-gallium-zinc oxide (IGZO), zinc oxide (ZnO), indium-zinc oxide (IZnO), and the like.

A first insulating layer 10 covering the first oxide semiconductor pattern OSP1 is disposed on the buffer layer BFL.

The first control electrode GE1 is disposed on the first insulating layer 10 and the second insulating layer 20 covering the first control electrode GE1 is disposed on the first insulating layer 10. [ The second insulating layer 20 may provide a flat upper surface. The second insulating layer 30 may include an organic material and / or an inorganic material.

The first insulating layer 10 and the second insulating layer 20 may include an inorganic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide.

A first contact hole CH1 and a second contact hole CH2 exposing the first region and the second region of the first oxide semiconductor pattern OSP1 are formed on the first and second insulating layers 10 and 20, Lt; / RTI > Each of the first contact hole CH1 and the second contact hole CH2 penetrates the first insulating layer 10 and the second insulating layer 20. [

The first input electrode DE1 and the first output electrode SE1 are disposed on the second insulating layer 20. [ The first input electrode DE1 and the first output electrode SE1 are connected to the first region and the second region of the first oxide semiconductor pattern OSP1 through the first contact hole CH1 and the second contact hole CH2, Respectively.

A third insulating layer 30 covering the first input electrode DE1 and the first output electrode SE1 is disposed on the second insulating layer 20. [ The third insulating layer 30 may provide a flat upper surface. The third insulating layer 30 may include an organic material and / or an inorganic material. That is, the third insulating layer 30 may cover the input electrodes and the output electrodes.

6C exemplarily shows a sixth transistor T6 having substantially the same structure as the second transistor T2. However, the structure of the sixth transistor T6 may be modified. The input electrode DE6 of the sixth transistor T6 is connected to the output electrode SE2 of the second transistor T2 on the third insulating layer 30. [

A pixel defining layer (PDL) and an organic light emitting diode (OLED) are disposed on the third insulating layer 30. An anode (AE) is disposed on the third insulating layer (30). The anode AE is connected to the sixth output electrode SE6 of the sixth transistor T6 through a seventh contact hole CH7 passing through the third insulating layer 30. [ An opening OP is defined in the pixel definition film PDL. The opening OP of the pixel defining layer PDL exposes at least a part of the anode AE.

The pixel PX may be arranged in the pixel region on the plane of the organic light emitting display panel DP. The pixel region may include a light emitting region PXA and a non-light emitting region NPXA adjacent to the light emitting region PXA. The non-emission area NPXA may be disposed so as to surround the emission area PXA. In this embodiment, the light emitting region PXA is defined corresponding to the anode AE. However, the light emitting region PXA is not limited thereto, and it is sufficient if the light emitting region PXA is defined as a region where light is generated. The light emitting region PXA may be defined corresponding to a part of the region of the anode AE exposed by the opening OP.

The hole control layer HCL may be disposed in common to the light emitting region PXA and the non-light emitting region NPXA. Although not separately illustrated, a common layer such as a hole control layer (HCL) may be formed in common to the plurality of pixels PX.

An organic light emitting layer (EML) is disposed on the hole control layer (HCL). The organic light emitting layer (EML) may be disposed only in the region corresponding to the opening (OP). That is, the organic light emitting layer (EML) may be formed separately for each of the plurality of pixels PX.

An electron control layer (ECL) is disposed on the organic light emitting layer (EML). A cathode CE is disposed on the electron control layer (ECL). The cathode CE is disposed in common to the plurality of pixels PX.

A thin film encapsulation layer (TFE) is disposed on the cathode CE. The thin film encapsulation layer (TFE) is disposed in common to the plurality of pixels PX. The thin film encapsulation layer (TFE) comprises at least one inorganic layer and at least one organic layer. The thin film encapsulation layer (TFE) may comprise a plurality of alternately stacked inorganic layers and a plurality of organic layers.

Although the patterned organic light emitting layer (EML) is illustrated as an example in the present embodiment, the organic light emitting layer (EML) may be disposed in common to the plurality of pixels PX. At this time, the organic light emitting layer (EML) can generate white light. Further, the organic light emitting layer (EML) may have a multi-layer structure.

In this embodiment, the thin film encapsulation layer (TFE) directly covers the cathode CE. In an embodiment of the present invention, a capping layer covering the cathode CE may be further disposed. At this time, the thin film encapsulation layer (TFE) can directly cover the capping layer.

7A to 7C are sectional views of a thin film encapsulation layer included in a display device according to an embodiment of the present invention. Hereinafter, the thin film encapsulation layer will be described with reference to FIGS. 7A to 7C.

7A, the thin film sealing layer TFE1 may include n inorganic thin films IOL1 to IOLn including the first inorganic thin film IOL1 disposed on the cathode CE (see Fig. 8B) have. In addition, the first inorganic thin film IOL1 can be disposed in direct contact with the cathode CE (Fig. 6C). The first inorganic thin film IOL1 is defined as a lower inorganic thin film, and inorganic thin films other than the first inorganic thin film IOL1 among the n inorganic thin films IOL1 to IOLn can be defined as upper inorganic thin films.

The thin film encapsulation layer TFE1 includes n-1 organic thin films OL1 to OLn and the n-1 organic thin films OL1 to OLn are arranged alternately with the n inorganic thin films IOL1 to IOLn . the n-1 organic thin films OL1 to OLn may have an average thickness larger than the n inorganic thin films IOL1 to IOLn.

Each of the n inorganic thin films IOL1 to IOLn may be a single layer containing one material, or may have a multi-layer each containing another material. Each of the n-1 organic thin films OL1 to OLn may be formed by providing organic monomers. For example, each of the n-1 organic thin films OL1 to OLn may be formed using an inkjet printing method or may be formed by coating a composition containing an acrylic monomer. In an embodiment of the present invention, the thin film encapsulation layer (TFE1) may further include an nth organic thin film.

7B and 7C, the inorganic thin films included in each of the thin film encapsulation layers TFE2 and TFE3 may have the same or different inorganic materials and may have the same or different thicknesses. The organic thin films included in each of the thin film encapsulation layers (TFE2 and TFE3) may have the same or different organic materials and may have the same or different thicknesses.

7B, the thin film encapsulation layer TFE2 includes a first inorganic thin film IOL1, a first organic thin film OL1, a second inorganic thin film IOL2, a second organic thin film OL2, , And a third inorganic thin film (IOL3).

The first inorganic thin film IOL1 may have a two-layer structure. The first sub-layer S1 and the second sub-layer S2 may comprise different inorganic materials.

As shown in FIG. 7C, the thin film sealing layer TFE3 may include a first inorganic thin film IOL10, a first organic thin film OL1, and a second inorganic thin film IOL20 which are sequentially stacked. The first inorganic thin film IOL10 may have a two-layer structure. The first sub-layer S10 and the second sub-layer S20 may comprise different inorganic materials. The second inorganic thin film IOL20 may have a two-layer structure. The second inorganic thin film IOL20 may include a first sub-layer S100 and a second sub-layer S200 deposited in different deposition environments. The first sub-layer S100 may be deposited under low power conditions and the second sub-layer S200 may be deposited under high power conditions. The first sub-layer S100 and the second sub-layer S200 may comprise the same inorganic material.

8A is a cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention. 8B to 8E are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention.

8A, the touch sensing unit TS includes a first conductive pattern TS-CP1, a first insulating layer TS-IL1 (hereinafter, referred to as a first touch insulating layer), a second conductive pattern TS- ), And a second insulating layer (TS-IL2, hereinafter referred to as a second touch insulating layer). The first conductive pattern TS-CP1 may be disposed directly on the thin-film encapsulation layer (TFE). However, the present invention is not limited thereto, and another inorganic layer (for example, a buffer layer) may be further disposed between the first conductive pattern TS-CP1 and the thin film sealing layer TFE.

If necessary, the second insulating layer (TS-IL2) may be omitted. A portion of the second conductive pattern TS-CP2 intersects with the first conductive pattern TS-CP1. The second conductive pattern TS-CP2 partially intersects the first conductive pattern TS-CP1 with the first touch insulation layer TS-IL1 interposed therebetween.

Each of the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2 may have a single layer structure or may have a multilayer structure stacked along the third directional axis DR3.

Each of the first touch insulation layer TS-IL1 and the second touch insulation layer TS-IL2 may include an inorganic material or an organic material. The inorganic material may include at least one of aluminum oxide, titanium oxide, silicon oxide, or silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The organic material includes at least one of an acrylic resin, a methacrylic resin, a polyisoprene, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin siloxane resin, a polyimide resin, a polyamide resin and a perylene resin can do.

The first touch insulation layer TS-IL1 is sufficient to insulate the first conductive pattern TS-CP1 and the second conductive pattern TS-CP2, and the shape thereof is not limited. The first touch insulation layer TS-IL1 may cover the entire thin-film encapsulation layer (TFE) or may include a plurality of insulation patterns. It is sufficient that the plurality of insulation patterns overlap the first connection portions BR1 or the second connection portions BR2 described later.

Although the two-layer type touch sensing unit is exemplarily shown in this embodiment, the present invention is not limited thereto. The single-layer touch sensing unit includes a conductive layer and an insulating layer covering the conductive layer. The conductive layer includes touch sensors and touch signal lines connected to the touch sensors. The single-layered touch sensing unit can acquire coordinate information in a self-capping manner.

As shown in FIG. 8B, the touch sensing unit TS includes first touch electrodes TE1 and second touch electrodes TE2. The first touch electrodes TE1 are connected to the first touch sensors SP1 and the first touch sensors SP1 connected to the first connection units BR1, Lines SL1. The second touch electrodes TE2 are connected to the second touch sensors SP2 and the second touch sensors SP2 connected by the second connection units BR2 and the second connection units BR2, Lines SL2. The connection electrodes TSD are connected between the first touch signal lines TE1 and the second touch signal lines SL1 and between the second touch signal lines SL2 connected to the second touch electrodes TE2, . The connection electrodes TSD may be connected to the ends of the first touch electrodes TE1 and the second touch electrodes TE2 to transmit signals. In another embodiment of the invention, the connection electrodes TSD may be omitted.

The first touch sensor units SP1 may be arranged in a first direction DR1 and the second touch sensor units SP2 may be arranged in a second direction DR2. The first touch sensor units SP1 and the second touch sensor units SP2 are spaced apart from each other.

The first touch electrodes TE1 may extend in the first direction DR1 and may be spaced apart in the second direction DR2. The second touch electrodes TE2 may extend in the second direction DR2 and may be spaced apart in the first direction DR1.

Each of the first connection portions BR1 connects two adjacent first touch sensor units SP1 among the first touch sensor units SP1. Each of the second connection portions BR2 connects the adjacent two second touch sensor units SP2 of the second touch sensor units SP2. 8B, in order to facilitate understanding, some of the first connection portions BR1 and the second connection portions BR2 are shown in bold.

The touch sensing unit TS may further include touch pad units TS-PD. Each of the first touch signal lines SL1 and the second touch signal lines SL2 may be connected to a corresponding one of the touch pad units TS-PD.

The first touch sensor units SP1 and the second touch sensor units SP2 are electrostatically coupled. Capacitors are formed between the first touch sensor units SP1 and the second touch sensor units SP2 as the touch sensing signals are applied to the first touch sensor units SP1.

Hereinafter, the touch sensing unit TS will be described in more detail with reference to Figs. 8C and 8E.

As shown in FIG. 8C, the first conductive pattern TS-CP1 may include the second connection portions BR2. The second connection portions BR2 may be formed by patterning directly on the thin film encapsulation layer (TFE) of the organic light emitting display panel DP. That is, the first conductive pattern TS-CP1 may be disposed directly on the thin film encapsulation layer (TFE) of the organic light emitting display panel DP.

The first touch insulation layer TS-IL1 is disposed on the first conductive pattern TS-CP1. The first touch insulation layer TS-IL1 may be disposed directly on the thin film sealing layer TFE of the organic light emitting display panel CP and cover each of the second connection portions BR2. As shown in FIG. 8D, a plurality of contact holes CH may be defined in the first touch insulation layer TS-IL1 to partially expose the second connection portions BR2. The contact holes CH can be formed by a photolithography process. The second connection parts BR2 of the first conductive pattern TS-CP1 and the second touch sensor parts SP2 are electrically connected through the contact holes CH.

Referring to FIG. 8E, the second conductive pattern TS-CP2 is disposed on the first touch insulation layer TS-IL1 and has first and second connection parts BR1 and BR1, 1 touch sensor units SP1 and second touch sensor units SP2 spaced apart from the first touch sensor units. The second touch sensor units SP2 are electrically connected to the first connection parts BR1 of the first conductive pattern TS-CP1 through the contact holes defined in the first touch insulation layer TS- .

FIG. 8F is a partial enlarged view of the area A1 in FIG. 8B. FIG. 9 is a partial enlarged view of the region A2 in Fig. 8B.

Referring to FIGS. 8F and 9, each of the first touch sensor units SP1 and the second touch sensor units SP2 includes a plurality of mesh lines ML defining a plurality of mesh holes MH. . The line width of each of the mesh lines ML may be several micro. Each of the first touch sensor units SP1 and the second touch sensor units SP2 may have a mesh shape. Although not specifically shown, the first touch signal lines SL1 and the second touch signal lines SL2 may have a mesh shape. Each of the first touch sensor units SP1 and the second touch sensor units SP2 overlaps the non-light emitting area NPXA.

In plan view, each of the mesh holes MH may have a different area. Although the mesh holes MH are shown to correspond one-to-one to the light emitting regions PXA, the present invention is not limited thereto. One mesh hole may correspond to two or more light emitting regions PXA. Each of the light emitting regions PXA may have a different area, if necessary. Correspondingly, each of the mesh holes MH may have a different area on a plane. For example, the light emitting regions PXA may include a red light emitting region, a green light emitting region, and a blue light emitting region, and may have different areas depending on the light emitting region colors. However, the present invention is not limited thereto, and the areas of the light emitting regions PXA may be equal to each other, and the areas of the mesh holes MH may be equal to each other.

As shown in FIG. 9, the first connection portions BR1 and the second connection portions BR2 may intersect with each other. The first connection portions BR1 and the second connection portions BR2 may be insulated from each other with the first touch insulation layer TS-IL1 interposed therebetween. However, it is not limited thereto. Although the first connection portions BR1 and the second connection portions BR2 are shown in bold in FIG. 9 for the sake of understanding, the present invention is not limited thereto. For example, the first connection portions BR1 and the second connection portions BR2 may not intersect with each other, and this will be described later in detail.

As shown in FIG. 9, each of the first connection portions BR1 and the second connection portions BR2 may have a mesh shape. However, the present invention is not limited thereto. For example, the second connection portions BR2 may not be mesh-shaped.

10A and 10B are schematic cross-sectional views corresponding to line I-I 'in FIG.

10A and 10B, the thickness D1 of the first conductive pattern TS-CP1 is smaller than the thickness D2 of the second conductive pattern TS-CP2. 10A and 10B, the first conductive pattern TS-CP1 corresponds to the above-described second connection portion BR2. The thickness D1 of the first conductive pattern TS-CP1 may be smaller than the thickness D3 of the first touch insulation layer TS-IL1.

In the present specification, "thickness" may mean an average value of the thickness of the component.

As described above, the first conductive pattern TS-CP1 and the first touch insulation layer TS-IL1 may be disposed directly on the thin film encapsulation layer TFE of the organic light emitting display panel DP. The first touch insulation layer (TS-IL1) has a stepped structure. Specifically, the first touch insulation layer TS-IL1 is disposed on the first conductive pattern TS-CP1 and includes a first portion IL-SUB1 spaced apart from the thin film sealing layer TFE, And a third portion (IL-SUB3) connecting the first portion (IL-SUB1) and the second portion (IL-SUB2). The first portion IL-SUB1, the second portion IL-SUB2 and the third portion IL-SUB3 are integrally connected.

The cross section of the third portion (IL-SUB3) may have a rectangular shape. However, the present invention is not limited thereto, and the cross section of the third portion (IL-SUB3) may be a polygonal shape including an inclined plane.

11 is a schematic cross-sectional view of a touch sensing unit included in a conventional display device. 11 is a schematic cross-sectional view of a conventional general display device including the touch sensing unit 200 on the display panel 100. As shown in FIG.

A touch sensing unit 200 of a conventional display device 1000 includes a first conductive pattern 210, an insulating layer 220 covering the first conductive pattern 210, and a second conductive pattern 210 disposed on the insulating layer 220. [ The thickness K1 of the first conductive pattern 210 and the thickness K2 of the second conductive pattern 230 are the same or slightly different from each other. More specifically, the thickness K1 of the first conductive pattern 210, the thickness K3 of the insulating film 220, and the thickness K2 of the second conductive pattern 230 are the same or slightly different from each other. A step is formed by the first conductive pattern 210 in the insulating film 220 covering the first conductive pattern 210. Referring to the region B in FIG. 11, cracks are generated in the stepped portion There was a problem. A part of the second conductive pattern 230 intersecting the first conductive pattern 210 and the first conductive pattern 210 is electrically connected due to a crack generated in the insulating layer 220, (short) failure occurred.

The display device DD according to the embodiment of the present invention is configured such that the thickness D1 of the first conductive pattern TS-CP1 is set to be thinner than that of the conventional device, and the step of the first touch insulation layer TS- Thereby minimizing the cracking rate of the insulating layer. In order to effectively realize the above effect, the thickness D1 of the first conductive pattern TS-CP1 is preferably smaller than the thickness D3 of the first touch insulation layer TS-IL1. The thickness D3 of the first touch insulation layer TS-IL1 and the thickness D2 of the second conductive pattern TS-CP2 may be the same or slightly different from each other. That is, the display device DD according to an embodiment of the present invention includes a first conductive pattern TS-CP1, a first touch insulation layer TS-IL1, and a second conductive pattern TS- Only the thickness of the pattern (TS-CP1) is set to be relatively thin, whereby cracking of the first touch insulation layer (TS-IL1) can be suppressed or minimized.

For example, the thickness D1 of the first conductive pattern TS-CP1 may be 1800 to 2100 and the thickness D2 of the second conductive pattern TS-CP2 may be 2700 to 3500 angstroms. For example, the thickness D1 of the first conductive pattern TS-CP1 may be about 1950 ANGSTROM and the thickness D2 of the second conductive pattern TS-CP2 may be about 3100 ANGSTROM. However, it is not limited thereto.

For example, the thickness D3 of the first touch insulation layer TS-IL1 may be 2700 ANGSTROM or more and 3500 ANGSTROM or less. The thickness D3 of the first touch insulation layer TS-IL1 may be about 3100 ANGSTROM. However, it is not limited thereto.

12A to 12D are plan views of a touch sensing unit included in a display device according to an embodiment of the present invention. 12A to 12D are plan views of a touch sensing unit included in a display device according to another embodiment of the present invention. 13A to 13C are partial enlarged views of the region A3 in Fig. 12A. 13A shows the second connection portions BR2 included in the first conductive pattern TS-CP1 of the region A3 in FIG. 12A. FIG. 13B shows the second connection portions BR2 included in the second conductive pattern TS- And FIG. 13C is a plan view showing a structure in which a first conductive pattern TS-CP1 and a second conductive pattern TS-CP2 are stacked.

As described above, the first connection portions BR1 and the second connection portions BR2 may not intersect with each other. 12A to 12D, the second connection portions BR2 do not intersect with the first connection portions BR1 and the second connection portions BR2 do not intersect with the first touch sensor units SP1 and the second touch sensors SP1, And may intersect with the parts SP2. 13A to 13C, the first touch sensor units SP1 include a plurality of mesh lines ML defining a plurality of mesh holes MH, and the second connection units BR2 May intersect with a part of the plurality of mesh lines ML of the first touch sensor units SP1. The second touch sensor units SP2 also include a plurality of mesh lines ML defining a plurality of mesh holes MH and each of the second connection units BR2 includes second touch sensor units SP2) of the plurality of mesh lines (ML). In this case, the second connection portions BR2 may not have a mesh shape.

12A to 12D can be similarly applied to the description of FIGS. 8B to 8E except for the description of the second connection portions BR2, and a detailed description thereof will be omitted.

Fig. 14 is a schematic cross-sectional view corresponding to line II-II 'in Fig. 13C. The second conductive pattern TS-CP2 of FIGS. 10A and 10B corresponds to the first connection portions BR1 of the components of the second conductive pattern TS-CP2, and the second conductive pattern TS- CP2 are corresponding to the first touch sensor units SP1 among the constituent elements of the second conductive pattern TS-CP2, the description related to Fig. 14 is the same as that of Figs. 10a and 10b And the detailed description thereof will be omitted.

15 is a partial cross-sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.

The first conductive pattern (TS-CP1) may have a single-layer structure or a multi-layer structure. As shown in FIG. 15, the first conductive pattern TS-CP1 may have a three-layer structure. The first conductive pattern TS-CP1 may include a first conductive layer CD1, a second conductive layer CD2, and a third conductive layer CD3. The first conductive layer CD1 is disposed on the thin film sealing layer TFE of the display panel DP and the second conductive layer CD2 is disposed on the first conductive layer CD1, CD3) may be disposed on the second conductive layer CD2. In this case, the total thickness D1 of the first conductive pattern TS-CP1 is equal to the thickness G1 of the first conductive layer CD1, the thickness G2 of the second conductive layer CD2, CD3) of the light-emitting layer.

The second conductive layer CD2 may have a smaller electrical resistivity than the first conductive layer CD1 and the third conductive layer CD3, respectively. That is, the second conductive layer CD2 may have a higher electrical conductivity than the first conductive layer CD1 and the third conductive layer CD3, respectively. Each of the first conductive layer CD1, the second conductive layer CD2 and the third conductive layer CD3 may adopt a general material known in the art as long as it satisfies the above relationship. For example, silver, copper, aluminum, titanium, molybdenum, and alloys thereof. The first conductive layer CD1 and the third conductive layer CD3 may include titanium (Ti) and the second conductive layer CD2 may include aluminum (Al), although the present invention is not limited thereto.

The thickness G2 of the second conductive layer CD2 may be greater than the thickness G1 of the first conductive layer CD1 and the thickness G3 of the third conductive layer CD3. The thickness G2 of the second conductive layer CD2 may be at least six times larger than the thickness G1 of the first conductive layer CD1. The thickness G2 of the second conductive layer CD2 may be four times larger than the thickness G3 of the third conductive layer CD3.

The thickness G3 of the third conductive layer CD3 may be greater than the thickness G1 of the first conductive layer. The thickness G3 of the third conductive layer CD3 may be 1.5 times larger than the thickness G2 of the first conductive layer. The thickness G3 of the third conductive layer CD3 may be 1.5 to 3 times larger than the thickness G2 of the first conductive layer.

The second conductive layer CD2 is an essential element for the first conductive pattern CP1 to serve as a conductive pattern and the first conductive layer CD1 and the third conductive layer CD3 And may serve as a protective layer for protecting the second conductive layer CD2. Specifically, the first conductive layer CD1 protects the second conductive layer CD2 from a factor occurring under the touch sensing unit TS, and the third conductive layer CD3 protects the second conductive layer CD2 in the etching process. CD2) from being damaged.

The specific protection purpose of the first conductive layer CD1 and the third conductive layer CD3 is different, and the required thickness may also be different. The thickness of the third conductive layer CD3 is required to be greater than a certain level in order to protect the second conductive layer CD2 in the etching process and the thickness of the first conductive layer CD1 other than the third conductive layer CD3 The total thickness D1 of the first conductive pattern CP1 can be adjusted to be smaller than the overall thickness D1 of the second conductive pattern CP2 by adjusting only the first thickness G1. In this case, the thickness G1 of the first conductive layer CD1 is also required to be higher than a certain level. For example, the thickness G1 of the first conductive layer CD1 is preferably 50 Å or more. When the thickness G1 of the first conductive layer CD1 is less than 50 ANGSTROM, it is difficult to serve as a protective layer for protecting the second conductive layer CD2.

For example, the thickness G1 of the first conductive layer CD1 is 50 to 200 ANGSTROM, the thickness G2 of the second conductive layer CD2 is 1000 ANGSTROM to 1800 ANGSTROM, the thickness of the third conductive layer CD3 G3) may be from 250 ANGSTROM to 350 ANGSTROM. For example, the thickness G1 of the first conductive layer CD1 is about 150 Å, the thickness G2 of the second conductive layer CD2 is about 1500 Å, the thickness G3 of the third conductive layer CD3 is about 150 Å, Lt; RTI ID = 0.0 > 300A. ≪ / RTI > However, it is not limited thereto.

16 is a sectional view of a touch sensing unit included in a display device according to an embodiment of the present invention.

As shown in FIG. 16, the second conductive pattern TS-CP2 may have a multilayer structure like the first conductive pattern TS-CP1. However, the present invention is not limited thereto, and the second conductive pattern TS-CP2 may have a single-layer structure if the condition that the second conductive pattern TS-CP2 is thicker than the first conductive pattern TS-CP1 is satisfied.

The second conductive pattern (TS-CP2) may have a three-layer structure. The second conductive pattern TS-CP2 may include a fourth conductive layer CD4, a fifth conductive layer CD5, and a sixth conductive layer CD6. The fourth conductive layer CD4 is disposed on the first touch insulation layer TS-IL1, the fifth conductive layer CD5 is disposed on the fourth conductive layer CD4, the sixth conductive layer CD6, May be disposed on the fifth conductive layer CD5. In this case, the total thickness D2 of the second conductive pattern TS-CP2 is set so that the thickness G4 of the fourth conductive layer CD4, the thickness G5 of the fifth conductive layer CD5, And the thickness (D6) of the CD6.

The fifth conductive layer CD5 may have a smaller electrical resistivity than the fourth conductive layer CD4 and the sixth conductive layer CD6, respectively. That is, the fifth conductive layer CD5 may have a higher electrical conductivity than the fourth conductive layer CD4 and the sixth conductive layer CD6, respectively. The fourth conductive layer (CD4), the fifth conductive layer (CD5), and the sixth conductive layer (CD6), respectively, may adopt a general material known in the art as long as the above relationship is satisfied. For example, silver, copper, aluminum, titanium, molybdenum, and alloys thereof. The fourth conductive layer CD4 and the sixth conductive layer CD6 may include titanium (Ti), and the fifth conductive layer CD5 may include aluminum (Al), although the present invention is not limited thereto.

The thickness G5 of the fifth conductive layer CD5 may be greater than the thickness G4 of the fourth conductive layer CD4 and the thickness G6 of the sixth conductive layer CD6. The thickness G5 of the fifth conductive layer CD5 may be four times or more larger than the thickness G4 of the fourth conductive layer CD4. The thickness G5 of the fifth conductive layer CD5 may be four times larger than the thickness G6 of the sixth conductive layer CD6.

The fifth conductive layer CD5 is an essential component for the second conductive pattern TS-CP2 to function as a conductive pattern and the fourth conductive layer CD4 and the sixth conductive layer CD6 are required to secure process stability (CD5) for protecting the fifth conductive layer (CD5). Specifically, the fourth conductive layer CD4 protects the fifth conductive layer CD5 from a factor generated in the lower portion of the second conductive pattern CP2, and the sixth conductive layer CD6 protects the fifth conductive layer CD5 in the etching process. Lt; RTI ID = 0.0 > CD5 < / RTI >

The thickness G2 of the second conductive layer CD2 may be smaller than the thickness G5 of the fifth conductive layer CD5. That is, the first conductive pattern TS-CP1 is formed such that the thickness G2 of the second conductive layer CD2 is smaller than the thickness G5 of the fifth conductive layer CD5 of the second conductive pattern TS-CP2 , The entire thickness can be adjusted to be smaller than the second conductive pattern (TS-CP2).

The thickness G1 of the first conductive layer CD1 may be smaller than the thickness of the fourth conductive layer CD4. That is, the first conductive pattern TS-CP1 is formed so that the thickness G1 of the first conductive layer CD1, which is the lower protective layer, is smaller than the thickness G4 of the fourth conductive layer CD4, which is the lower protective layer of the second conductive pattern TS- The total thickness can be adjusted to be smaller than the second conductive pattern TS-CP2.

For example, the thickness G4 of the fourth conductive layer CD4 is 250 ANGSTROM to 350 ANGSTROM, the thickness G5 of the fifth conductive layer CD5 is 2200 ANGSTROM to 2800 ANGSTROM, the thickness of the sixth conductive layer CD6 G6) may be from 250 ANGSTROM to 350 ANGSTROM. For example, the thickness G4 of the fourth conductive layer CD4 is about 300 ANGSTROM, the thickness G5 of the fifth conductive layer CD5 is about 2500 ANGSTROM, the thickness G6 of the sixth conductive layer CD6, Lt; RTI ID = 0.0 > 300A. ≪ / RTI > However, it is not limited thereto.

The display device DD according to the embodiment of the present invention can reduce the crack occurrence rate of the insulating layer (the first touch insulating layer, TS-IL1) included in the touch sensing unit TS. As a result, the display device DD according to an embodiment of the present invention can minimize a short failure of the touch sensing unit TS.

While the present invention has been described in connection with what is presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood. It is therefore to be understood that the above-described embodiments are illustrative and non-restrictive in every respect.

TS-CP1: first conductive pattern TS-IL1: first touch insulation layer
TS-CP2: Second conductive pattern D1: Thickness of the first conductive pattern
D2: thickness of the second conductive pattern D3: thickness of the first touch insulation layer

Claims (20)

Display panel; And
And a touch sensing unit disposed on the display panel,
The touch sensing unit
A first conductive pattern disposed on the display panel;
An insulating layer covering the first conductive pattern; And
And a second conductive pattern disposed on the insulating layer and partially intersecting the first conductive pattern,
Wherein a thickness of the first conductive pattern is smaller than a thickness of the second conductive pattern. The method according to claim 1,
Wherein the display panel comprises a thin film sealing layer,
The first conductive pattern
A thin film encapsulation layer disposed directly on the thin encapsulation layer,
The insulating layer
A first portion disposed on the first conductive pattern and spaced apart from the thin film encapsulation layer;
A second portion in contact with the thin film encapsulation layer; And
And a third portion connecting the first portion and the second portion. The method according to claim 1,
The thickness of the first conductive pattern
Is smaller than the thickness of the insulating layer. The method according to claim 1,
Wherein the first conductive pattern has a thickness of 1800 ANGSTROM or more and 2100 ANGSTROM or less,
And the thickness of the second conductive pattern is not less than 2700 angstroms nor more than 3500 angstroms. The method according to claim 1,
The first conductive pattern
A first conductive layer disposed on the display panel;
A second conductive layer disposed on the first conductive layer; And
And a third conductive layer disposed on the second conductive layer,
The second conductive pattern
A fourth conductive layer disposed on the insulating layer;
A fifth conductive layer disposed on the fourth conductive layer; And
And a sixth conductive layer disposed on the fifth conductive layer. 6. The method of claim 5,
The thickness of the second conductive layer
The thickness of the first conductive layer and the thickness of the third conductive layer. 6. The method of claim 5,
The thickness of the fifth conductive layer
The thickness of the fourth conductive layer and the thickness of the sixth conductive layer. 6. The method of claim 5,
The thickness of the third conductive layer
Wherein the thickness of the first conductive layer is 1.5 times or more and 3 times or less the thickness of the first conductive layer. 6. The method of claim 5,
Wherein the thickness of the first conductive layer is 50 ANGSTROM to 200 ANGSTROM,
Wherein the thickness of the second conductive layer is 1000 ANGSTROM to 1800 ANGSTROM,
And the third conductive layer has a thickness of 250 ANGSTROM to 350 ANGSTROM. 6. The method of claim 5,
Wherein the first conductive layer and the third conductive layer each comprise Ti,
And the second conductive layer includes Al. 6. The method of claim 5,
The thickness of the second conductive layer
Is smaller than the thickness of the fifth conductive layer. 6. The method of claim 5,
The thickness of the first conductive layer
Is smaller than the thickness of the fourth conductive layer. 6. The method of claim 5,
The thickness of the fourth conductive layer is 250 ANGSTROM to 350 ANGSTROM,
The thickness of the fifth conductive layer is in a range of 2200 ANGSTROM to 2800 ANGSTROM,
And the sixth conductive layer has a thickness of 250 ANGSTROM to 350 ANGSTROM. 6. The method of claim 5,
Each of the fourth conductive layer and the sixth conductive layer includes Ti,
And the fifth conductive layer includes Al. The method according to claim 1,
The second conductive pattern
First connecting portions;
First touch sensor parts connected by the first connection parts; And
And second touch sensor units spaced apart from the first touch sensor units. 16. The method of claim 15,
The first conductive pattern
And second connection portions connecting the second touch sensor portions,
And the second connection portions intersect with the first connection portions. 16. The method of claim 15,
The first conductive pattern
And second connection portions connecting the second touch sensor portions,
Wherein the first touch sensor units and the second touch sensor units each include a plurality of mesh lines defining a plurality of mesh holes,
The second connection portions
And intersects the mesh lines of the first touch sensor units and the mesh lines of the second touch sensor units. 18. The method of claim 17,
The second connection portions
And does not intersect with the first connection portions. 16. The method of claim 15,
The first conductive pattern
And second connection portions connecting the second touch sensor portions,
A contact hole is defined in the insulating layer,
And the second connection portions connect the second touch sensor portions through the contact hole. The method according to claim 1,
Wherein the display panel includes an organic light emitting element layer.

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