KR102417280B1 - Transparent Light-emitting Display film, Method of Manufacturing the Same, and Transparent Light-emitting Signage using the Same - Google Patents

Abstract

The transparent light emitting display film includes a transparent substrate in the form of a film, a transparent electrode formed on one side of the transparent substrate, a through hole formed to penetrate the transparent substrate in a direction perpendicular to the surface of the transparent substrate, and a light emitting device mounted in the through hole. and a connection part electrically connecting the transparent electrode and the light emitting element.

Description

Transparent Light-emitting Display film, Method of Manufacturing the Same, and Transparent Light-emitting Signage using the Same

The present invention relates to a transparent light emitting display film, a manufacturing method thereof, and a transparent light emitting signage using the same.

A light emitting display is a device that provides visual information to a user using an electronic circuit and a light emitting device. A typical light emitting display is configured by mounting a light emitting diode (LED) on an opaque printed circuit board (PCB), but a transparent light emitting display device has been developed to ensure the transparency of the display itself. There is (refer to Patent Documents 1-3).

The transparent light emitting display can be applied to LED signage to make the signage itself thin. In this case, even if the LED signage is bent, a structure capable of stably supporting the electronic device mounted on the display including the LED is required.

Patent Document 1: Republic of Korea Patent Publication No. 10-2018-0047760 Patent Document 2: Republic of Korea Patent Publication No. 10-1847100 Patent Document 3: Republic of Korea Patent Publication No. 10-1789145

The present invention has been devised to solve the above problems, and one technical problem to be achieved by the present invention is to minimize the protrusion by inserting the light emitting device into the substrate, so that the display substrate is bent or not bent, but the light emitting device due to external contact An object of the present invention is to provide a transparent light emitting display film capable of stably supporting an electronic device mounted on a display by preventing the connection portion of the electronic device from being peeled off.

Another technical problem to be achieved by the present invention is to minimize the protrusion by inserting the light emitting element into the substrate so that the connection of the electronic element including the light emitting element is not peeled off due to external contact even if the display substrate is bent or not bent. , to provide a method of manufacturing a transparent light emitting display film capable of stably supporting an electronic device mounted on a display.

Another technical problem to be achieved by the present invention is to minimize the protrusion by inserting the light emitting element into the substrate so that the connection of the electronic element including the light emitting element is not peeled off due to external contact even if the display substrate is bent or not bent. , to provide a transparent light emitting signage capable of stably supporting an electronic device mounted on a display.

The problems to be solved of the present invention are not limited to those mentioned above, and other problems to be solved that are not mentioned will be clearly understood by those of ordinary skill in the art from the following description.

According to at least one embodiment of the present invention, a transparent substrate in the form of a film, a transparent electrode formed on one side of the transparent substrate, a through hole formed to penetrate the transparent substrate in a direction perpendicular to the surface of the transparent substrate, the through hole Provided is a transparent light emitting display film having a light emitting element mounted in a hole, and a connection part electrically connecting the transparent electrode and the light emitting element.

In the transparent light emitting display film according to at least one embodiment of the present invention, the transparent electrode is a transparent electrode in the form of a metal oxide thin film containing ITO, IZO, IZTO, and ZnO, CNT, silver nanowire, silver nanofiber, And a transparent electrode in the form of a two-dimensional or three-dimensional nanomaterial coating containing graphene, a transparent electrode in the form of a metal mesh having a nano or micro line width made of a metal or alloy containing gold, silver, and copper, or these It includes a transparent electrode made of a combination of

In the transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.3 mm or less.

In the transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.25 mm or less.

In the transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.188 mm or less.

In at least one embodiment of the present invention, the transparent light emitting display film is formed on the one side of the transparent substrate, and covers the one side of the transparent substrate, the transparent electrode, and one side of the light emitting device A first protective layer is further provided.

In at least one embodiment of the present invention, the transparent light emitting display film is formed on the other side opposite to the one side of the transparent substrate, covering the other side of the transparent substrate and the other side of the light emitting device A second protective layer is further provided.

In at least one embodiment of the present invention, the transparent light emitting display film further includes a lens unit or a scattering unit at a portion where light is emitted from the light emitting device.

In the transparent light emitting display film according to at least one embodiment of the present invention, the total thickness of the transparent light emitting display film is 1 mm or less.

In the transparent light emitting display film according to at least one embodiment of the present invention, the entire thickness of the transparent light emitting display film is 0.5 mm or less.

According to at least one embodiment of the present invention, applying a resin layer to one side of the transparent substrate in the form of a film, forming an electrode pattern groove in the resin layer, forming a transparent electrode in the electrode pattern groove , forming a through hole to penetrate the transparent substrate and the resin layer in a direction perpendicular to the surface of the transparent substrate at a position where the light emitting device of the transparent substrate on which the transparent electrode is formed is mounted, the light emitting in the through hole It provides a method of manufacturing a transparent light emitting display film comprising the steps of inserting a device, and electrically connecting the transparent electrode and the light emitting device.

In the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the transparent electrode is a transparent electrode in the form of a metal oxide thin film including ITO, IZO, IZTO, and ZnO, CNT, silver nanowire, silver nano A transparent electrode in the form of a nano-material coating of a two-dimensional or three-dimensional structure containing fibers and graphene, a transparent electrode in the form of a metal mesh having a nano or micro line width made of a metal or alloy containing gold, silver, and copper; or a transparent electrode made of a combination thereof.

In the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.3 mm or less.

In the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.25 mm or less.

In the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.188 mm or less.

In at least one embodiment of the present invention, in the method for manufacturing a transparent light emitting display film, the first side of the transparent substrate, the one side of the transparent substrate, the transparent electrode, and the first covering the one side of the light emitting device 1 It further comprises the step of forming a protective layer.

In at least one embodiment of the present invention, the method for manufacturing a transparent light emitting display film includes a second side of the transparent substrate that is opposite to the one side of the transparent substrate, and covers the other side of the transparent substrate and the other side of the light emitting device. 2 It further comprises the step of forming a protective layer.

In at least one embodiment of the present invention, the method for manufacturing the transparent light emitting display film further comprises the step of forming a lens unit or a scattering unit in a portion where light is emitted from the light emitting device.

In the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the total thickness of the transparent light emitting display film is formed to be 1 mm or less.

In the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the entire thickness of the transparent light emitting display film is formed to be 0.5 mm or less.

According to at least one embodiment of the present invention, there is provided a transparent light emitting signage including the transparent light emitting display film.

According to at least one embodiment of the present invention, by inserting the light emitting element into the substrate to minimize the protrusion, the display substrate is bent or not bent, but the connection of the electronic element including the light emitting element is not peeled off due to external contact even if it is not bent. , there is an effect that it is possible to provide a transparent light emitting display film capable of stably supporting an electronic device mounted on a display.

According to at least one embodiment of the present invention, by inserting the light emitting element into the substrate to minimize the protrusion, the display substrate is bent or not bent, but the connection of the electronic element including the light emitting element is not peeled off due to external contact even if it is not bent. , there is an effect that can provide a method of manufacturing a transparent light emitting display film capable of stably supporting an electronic device mounted on a display.

According to at least one embodiment of the present invention, by inserting the light emitting element into the substrate to minimize the protrusion, the display substrate is bent or not bent, but the connection of the electronic element including the light emitting element is not peeled off due to external contact even if it is not bent. , there is an effect that can provide a transparent light emitting signage that can stably support the electronic device mounted on the display.

Effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those of ordinary skill in the art from the following description.

1 is a cross-sectional view of a transparent light emitting display film according to at least one embodiment of the present invention.
2 is a cross-sectional view of a transparent light emitting display film (with a lens mounted) according to at least one embodiment of the present invention.
3A and 3B are conceptual views showing step-by-step manufacturing processes of a transparent light emitting display film according to at least one embodiment of the present invention.
4 is a cross-sectional view of a transparent light emitting display film using a wing-type (T-shaped) LED chip according to at least one embodiment of the present invention.
5 is an image showing an actual operation of a transparent light emitting display film in which light emitting devices are arranged in a 3x3 array.
6 is an image showing the flexibility of the actually fabricated transparent light emitting display film.

Hereinafter, an embodiment according to the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of a transparent light emitting display film 100 according to at least one embodiment of the present invention.

As shown in FIG. 1 , the transparent light emitting display film 100 according to at least one embodiment of the present invention includes a transparent substrate 110 in the form of a film, a transparent electrode 130 formed on the transparent substrate 110 , The through hole 122 formed to penetrate the transparent substrate 110 in a direction perpendicular to the surface of the transparent substrate 110 , the light emitting device 140 mounted in the through hole 122 , and the transparent electrode 130 and the light emitting device It is composed of an electrode connection part 150 that electrically connects the 140 .

1 illustrates one light emitting device 140 as an example, the transparent light emitting display film 100 according to at least one embodiment of the present invention has the same structure as in FIG. 1 in an array to constitute one display. .

In the example shown in FIG. 1 , the upper side of the drawing is defined as the upper direction of the transparent substrate 110 , but this is a relative direction viewed from the viewpoint of the process. may be Accordingly, the upper or lower portions described herein may be opposite to each other depending on the reference direction.

In at least one embodiment of the present invention, the transparent substrate 110 is a transparent polymer substrate (PET, PC, PCT, PEN, PU, TPU, PI, or a film such as silicone-based rubber), the light emitting device 140 have a thickness less than or equal to the height.

In at least one embodiment of the present invention, it is said that the transparent substrate 110 has a thickness equal to or less than the height of the light emitting device 140 , but the thickness of the transparent substrate 110 may vary depending on the height of the light emitting device 140 . It may be greater than or equal to the height of the element 140 .

Specifically, in at least one embodiment of the present invention, the thickness of the transparent substrate 110 is 0.3 mm or less. In at least one embodiment of the present invention, the thickness of the transparent substrate 110 is 0.25 mm or less. In at least one embodiment of the present invention, the thickness of the transparent substrate 110 is 0.188 mm or less.

After forming the resin layer 120 on the transparent substrate 110, the transparent electrode 130 forms an electrode pattern groove 121 in the resin layer 120, and in the formed electrode pattern groove 121, for example, For example, it may be formed by filling an ink composed of Au, Ag, Cu, CNT, Ag nanowire, or a combination thereof.

The transparent electrode 130 is a two-dimensional or three-dimensional nanomaterial containing ITO, IZO, IZTO, and a transparent electrode in the form of a metal oxide thin film including ZnO, CNT, silver nanowire, silver nanofiber, and graphene. A transparent electrode in the form of a coating, a transparent electrode in the form of a metal mesh having a nano or micro line width made of a metal or alloy containing gold, silver, and copper, or a transparent electrode made of a combination thereof.

The electrode connection part 150 is formed using a soldering process or a screen printing process or dispensing of conductive ink or paste, and electrically connects the light emitting device electrode 141 and the transparent electrode 130 of the light emitting device 140 . .

In at least one embodiment of the present invention, the transparent light emitting display film 100 is formed on the transparent substrate 110 to cover the upper portion of the transparent substrate 110 , the transparent electrode 130 , and the upper portion of the light emitting device 140 . The second protective layer 170 is formed under the covering first protective layer 160 and the transparent substrate 110 to cover the lower portion of the transparent substrate 110 and the lower portion of the light emitting device 140 .

In this way, a through hole 122 is formed in the transparent substrate 110 using the transparent substrate 110 having a thickness equal to or less than the height of the light emitting element 140 , and the light emitting element 140 is formed in the through hole 122 . ) by inserting the light emitting device 140 and the transparent substrate 110 together, a transparent light emitting display film having an overall thickness of 1 mm or less can be manufactured.

In at least one embodiment of the present invention, a through hole 122 is formed in the transparent substrate 110 using a transparent substrate 110 having a thickness equal to or less than the height of the light emitting device 140, and the formed through hole ( By inserting the light emitting device 140 into the 122) and combining the light emitting device 140 and the transparent substrate 110, a transparent light emitting display film having an overall thickness of 0.5 mm or less can be manufactured.

If, for example, a transparent LED signage is produced using such a transparent light emitting display film, it can be attached to a curved surface because it has a property of being able to be flexibly bent. In addition, since it is formed of a plastic material and is light and transparent, it may not block the view even if it is attached to a glass window.

In at least one embodiment of the present invention, a lens or a scattering unit may be formed in a portion where light is emitted in order to scatter light emitted from the light emitting device 140, adjust the focus, or make parallel light to increase visibility. have.

2 is a cross-sectional view of transparent light emitting display films 200 and 200' according to at least one embodiment of the present invention.

As shown in FIG. 2 , the transparent light emitting display films 200 and 200 ′ further include a lens unit 210 or a scattering unit 220 at a portion where light is emitted. 2 exemplarily shows a structure in which light is emitted downward in the drawing. Unlike FIG. 2 , in the case of a structure in which light is emitted upward in the drawing, the lens unit 210 or the scattering unit 220 may be provided at the upper side.

The lens unit 210 is formed by forming a lens having a specific shape in a portion of the protective layer through which light is emitted from the light emitting element among the portions of the transparent light emitting display film.

In at least one embodiment of the present invention, the lens unit 210 may include a spherical or aspherical micro lens shape for refracting at least a portion of light generated from the light emitting device.

The scattering unit 220 may include an uneven shape of a grating pattern for scattering, dispersing, or diffracting at least a portion of light generated from the light emitting device.

For example, the lens unit 210 or the scattering unit 220 is formed by imprinting on the protective layer using a mold of a specific shape during the UV or thermosetting resin application process of the step of forming the protective layer on the transparent substrate. , a lens unit having a desired shape may be formed on the protective layer.

As another example, the lens unit 210 or the scattering unit 220, after forming the protective layer, additionally apply a resin to perform a molding process such as imprinting, etching, or engraving to form a lens unit of a desired shape on the protective layer. can be formed For example, when the shape of the lens unit includes a concave or concave shape, the lens unit may be formed by recessing and molding the concave or concave groove without applying an additional resin to the protective layer of the corresponding portion.

3A and 3B are conceptual views showing step by step a manufacturing process of a transparent light emitting display film according to at least one embodiment of the present invention.

3A and 3B, in the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, a light emitting device such as an LED chip or an electronic device such as a resistor is formed on a transparent substrate in the form of a thin film. way to install it.

Since the transparent light emitting display film manufactured by using the method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention has a property of being flexible, it can be attached to a curved surface. In addition, since it is formed of a plastic material and is light and transparent, it may not block the view even if it is attached to a glass window.

The method for manufacturing a transparent light emitting display film according to at least one embodiment of the present invention includes applying a resin layer to one side of a film-type transparent substrate, forming an electrode pattern groove in the resin layer, and the electrode pattern groove Forming a transparent electrode (eg, a metal mesh electrode) on the transparent substrate, penetrating the transparent substrate and the resin layer in a direction perpendicular to the surface of the transparent substrate at a position where the light emitting device of the transparent substrate is formed forming a through-hole to do so, inserting the light-emitting device into the through-hole, and electrically connecting the transparent electrode and the light-emitting device.

As shown in Fig. 3a (a), a transparent polymer substrate (PET, PC, PCT, PEN, PU, TPU, PI, or a silicone-based rubber film) 110 having a thickness that is thinner or similar to that of the light emitting device. will be prepared In this case, the thinner the transparent polymer substrate 110 , the higher the transparency, the easier the processing, and the greater the flexibility of the product. Accordingly, in at least one embodiment of the present invention, the thickness of the light emitting device may be greater than the thickness of the film. The transparent polymer substrate 110 is an example of a transparent substrate.

The light-emitting device uses, for example, a light-emitting diode (LED). Although LED is used as the light emitting device in this embodiment, any chip unit device that converts electricity into light, such as LD (Laser Diode) or OLED (Organic Light-emitting Diode), may be used depending on the purpose.

As shown in FIG. 3A ( b ), a resin layer 120 is applied to form a transparent electrode on a transparent substrate. For example, a UV embossing process for forming a fine pattern groove may be performed using a UV resin, or a thermal imprinting process may be performed using a thermosetting resin.

As shown in FIG. 3A ( c ), electrode pattern grooves 121 are formed in the resin layer formed on the transparent substrate.

As a method of forming the electrode pattern on the substrate, imprinting, coating, deposition and etching, or photolithography may be used.

As shown in Fig. 3a(d), for example, a pattern of the metal mesh electrode 130 is formed by filling the electrode pattern groove with conductive ink or paste using a doctoring process performed by scraping the surface with a blade. .

For example, the method of forming the electrode pattern is an inkjet method, an offset printing method, a reverse offset printing method, a flat screen printing method, a spin coating method ( spin coating), roll coating, flow coating, dispensing, gravure printing, or flexography.

As shown in FIG. 3A (e), the through hole 122 is formed in a size slightly larger than the size of the light emitting device at a position where the light emitting device is mounted. For example, the through-hole may be drilled using a punching (punching) process, laser processing, or general machining.

3B (f), the light emitting device 140 is mounted in the through hole formed in the transparent substrate.

As shown in FIG. 3B (g), the electrode connection part 150 is formed using a soldering process or a screen printing or dispensing process of conductive ink or paste, and the electrode and the transparent electrode of the light emitting device chip are electrically connected do. Electrically connected solder or conductive paste has good properties to be cured and soldered at a high temperature, but select a temperature and curing time at which thermal deformation does not occur severely due to the nature of the plastic substrate (e.g., PET, PC For general films such as relatively low temperature or short curing time, films for high temperature materials such as PI have relatively high temperature or long curing time).

As shown in FIG. 3b (h), UV or thermosetting resin is applied to the entire surface of the transparent substrate to which the light emitting device chip is exposed and cured using UV or heat to form the first protective layer 160 . Then, it is possible to selectively cover the transparent film thereon to protect the surface where the transparent electrode and the electrode of the light emitting device chip are connected.

At this time, by using a transparent film that does not have an adhesive force with the UV resin, the surface can be protected only with the UV resin. In this case, since the UV resin enters the gap between the substrate and the light emitting device chip and fills the gap, it is possible to more strongly support the light emitting device chip with respect to the transparent substrate.

As shown in Fig. 3b(i), UV resin is applied to the opposite side to which the light emitting device chip is exposed, and then, a second protective layer 170 that protects the corresponding surface can be formed by selectively covering the transparent film. .

At this time, by using a transparent film that does not have an adhesive force with the UV resin, the surface can be protected only with the UV resin. In this case, the UV resin enters the gap between the substrate and the light emitting device chip and fills the gap, and the light emitting device chip can be more strongly supported.

Through the above process, since the resin can penetrate tightly to the upper, lower, and internal interstitial spaces of the light emitting device chip and firmly support the light emitting device chip, it is possible to stably fix the light emitting device chip to the transparent substrate.

The method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention further includes the step of forming a lens unit or a scattering unit in a portion where light is emitted from the light emitting device.

The forming of the lens unit may be a step of forming a lens unit having a specific shape in a portion of the protective layer to which light is exposed from the light emitting device chip among the portions of the transparent light emitting display film.

For example, the lens unit may include a spherical or aspherical microlens shape for refracting at least a portion of light generated from the light emitting device chip. For example, the lens unit may include an uneven shape of a grating pattern for scattering, dispersing, or diffracting at least a portion of light generated from the light emitting device chip. For example, the shape of the lens unit may be formed to have any of various shapes depending on the purpose of use.

For example, in the step of forming the lens unit, during the application process of the UV resin of the step of forming the protective layer on the entire surface of the transparent substrate, by imprinting on the protective layer using a mold of a specific shape, the protective layer has a desired shape. A lens unit may be formed.

As another example, in the forming of the lens unit, after forming the protective layer, the lens unit may be formed by additionally applying a resin to perform a molding process such as imprinting, etching, or engraving. For example, when the shape of the lens unit includes a concave or concave shape, the lens unit may be formed by recessing and molding the concave or concave groove without applying an additional resin to the protective layer of the corresponding portion.

4 is a cross-sectional view of a transparent light emitting display film 400 using a wing-type (T-shaped) LED chip according to at least one embodiment of the present invention.

The transparent light emitting display film 400 illustrated in FIG. 4 includes the light emitting device 440 instead of the light emitting device 140 .

The light emitting device 440 is a wing-type LED chip with an upper portion extending in a T-shape on both sides, and light emitting device electrodes 442 are formed on both wings 441 to emit light in the lower or upper direction of the drawing. .

The transparent light emitting display film 400 using the light emitting element 440 may electrically connect the light emitting element electrode 442 and the transparent electrode 130 using the electrode connection part 150 as shown in FIGS. 1 to 3 . However, if the lower surface of the light emitting element electrode 442 protruding from both sides is used, as shown in FIG. 4 , it is more efficient by using the electrode connection part 450 between the transparent electrode 130 and the light emitting element electrode 442 . Thus, the light emitting element electrode 442 and the transparent electrode 130 may be electrically connected.

5 is an image showing the actual operation of the transparent light emitting display film 100 in which light emitting devices are arranged in a 3x3 array.

The produced transparent light-emitting display film has a total thickness of about 0.5 mm, and is transparent in the power-off state (upper image in Fig. 4). However, when power (3.7 V) is applied, the light-emitting element (LED) operates as a display (lower image in FIG. 4).

6 is an image showing the flexibility of the actually fabricated transparent light emitting display film 100 .

Since the transparent light emitting display film 100 manufactured using a transparent substrate having a thickness of 0.188 mm has a total thickness of about 0.5 mm, it can be freely bent in both directions as shown in FIG. 5, so that it can be freely attached to a curved surface. .

In addition, by forming protective layers on both surfaces, even if the display substrate is bent, it is possible to stably support an electronic device mounted on the display, such as a light emitting device or a resistor.

When a transparent light emitting signage is produced using the transparent light emitting display film produced in this way, the desired publicity effect can be obtained without obstructing the view by mounting the signage on various surfaces including curved surfaces.

As described above, according to at least one embodiment of the present invention, even if the display substrate is bent or not bent, the connection portion of the electronic device including the light emitting device is not peeled off due to external contact, so that the electronic device mounted on the display is not bent. A transparent light emitting display film capable of stably supporting an element can be provided.

In addition, according to at least one embodiment of the present invention, even if the display substrate is bent or not bent, the connection portion of the electronic device including the light emitting device is not peeled off due to external contact, so that the electronic device mounted on the display can be stably A method for manufacturing a supportable transparent light emitting display film can be provided.

In addition, according to at least one embodiment of the present invention, even if the display substrate is bent or not bent, the connection portion of the electronic device including the light emitting device is not peeled off due to external contact, so that the electronic device mounted on the display can be stably It is possible to provide a supportable transparent light emitting signage.

In the above, the technical idea of the present invention has been described along with the accompanying drawings, but the preferred embodiment of the present invention is exemplarily described and does not limit the present invention. In addition, it is a clear fact that any person skilled in the art to which the present invention pertains can make various modifications and imitations without departing from the scope of the technical spirit of the present invention.

100, 200, 200', 400: transparent light emitting display film
110: transparent substrate
120: resin layer 121: electrode pattern groove
122: through hole 130: metal mesh electrode (transparent electrode)
140, 440: light emitting device 141, 442: light emitting device electrode
150, 450: electrode connection part (connection part) 160: first protective layer
170: second protective layer 210: lens unit
220: spawning unit 441: wings

Claims (21)

a transparent substrate in the form of a film;
a transparent electrode formed on one side of the transparent substrate and having a predetermined pattern including a first transparent electrode and a second transparent electrode;
a through hole formed to pass through the transparent substrate in a direction perpendicular to the one side of the transparent substrate;
It includes a first element electrode and a second element electrode, and is mounted in the through hole such that a surface having the first element electrode and the second element electrode forms the same plane as the one surface of the transparent substrate, the transparent substrate a light emitting device emitting light in a direction perpendicular to the one side of the light emitting device;
a first connection part electrically connecting the first transparent electrode and the first element electrode; and
a second connection part electrically connecting the second transparent electrode and the second element electrode
provided with
Transparent light emitting display film. According to claim 1,
The first transparent electrode and the second transparent electrode are a transparent electrode in the form of a metal oxide thin film containing ITO, IZO, IZTO, and ZnO, CNT, silver nanowire, silver nanofiber, and two-dimensional or graphene containing A transparent electrode in the form of a three-dimensional nanomaterial coating, a transparent electrode in the form of a metal mesh having a nano or micro line width made of a metal or alloy containing gold, silver, and copper, or a transparent electrode made of a combination thereof ,
Transparent light emitting display film. According to claim 1,
The thickness of the transparent substrate is 0.3 mm or less,
Transparent light emitting display film. According to claim 1,
The thickness of the transparent substrate is 0.25 mm or less,
Transparent light emitting display film. According to claim 1,
The thickness of the transparent substrate is 0.188 mm or less,
Transparent light emitting display film. According to claim 1,
Formed on the one side of the transparent substrate, further comprising a first protective layer covering the one side of the transparent substrate, the transparent electrode, and one side of the light emitting device,
Transparent light emitting display film. 7. The method of claim 6,
Formed on the other side opposite to the one side of the transparent substrate, further comprising a second protective layer covering the other side of the transparent substrate and the other side of the light emitting device,
Transparent light emitting display film. According to claim 1,
Further comprising a lens unit or a scattering unit at a portion where light is emitted from the light emitting device,
Transparent light emitting display film. According to claim 1,
The light emitting device is mounted near the center in the through hole,
The first connection part directly electrically connects the first transparent electrode and the first element electrode,
The second connection part directly electrically connects the second transparent electrode and the second element electrode,
Transparent light emitting display film. According to claim 1,
The through hole has a size in which the light emitting device is inscribed,
The light emitting device is mounted in the through hole so that at least a portion of the outer peripheral surface is surrounded by close to the inner wall of the through hole,
Transparent light emitting display film. applying a resin layer to one side of the transparent substrate in the form of a film;
forming an electrode pattern groove in the resin layer;
forming a transparent electrode including a first transparent electrode and a second transparent electrode in the electrode pattern groove;
Forming a through hole to penetrate through the transparent substrate and the resin layer in a direction perpendicular to the surface of the transparent substrate at a position where the light emitting device of the transparent substrate on which the first transparent electrode and the second transparent electrode are formed is mounted ;
In the through hole, the light emitting device including a first device electrode and a second device electrode and emitting light in a direction perpendicular to the one side of the transparent substrate is provided with the first device electrode and the second device electrode inserting the surface to form the same plane as the one surface of the transparent substrate;
a first connection step of electrically connecting the first transparent electrode and the first element electrode; and
A second connection step of electrically connecting the second transparent electrode and the second element electrode
provided with
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
The transparent electrode is a transparent electrode in the form of a metal oxide thin film containing ITO, IZO, IZTO, and ZnO, CNT, silver nanowire, silver nanofiber, and a nanomaterial coating form of a two-dimensional or three-dimensional structure containing graphene of a transparent electrode, a transparent electrode made of a metal mesh-type transparent electrode having a nano or micro line width made of a metal or alloy containing gold, silver, and copper, or a combination thereof,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
The thickness of the transparent substrate is 0.3 mm or less,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
The thickness of the transparent substrate is 0.25 mm or less,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
The thickness of the transparent substrate is 0.188 mm or less,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
Further comprising the step of forming a first protective layer covering the one side of the transparent substrate, the transparent electrode, and one side of the light emitting device on the one side of the transparent substrate,
A method for manufacturing a transparent light emitting display film. 17. The method of claim 16,
Further comprising the step of forming a second protective layer covering the other side of the transparent substrate and the other side of the light emitting device on the other side opposite to the one side of the transparent substrate,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
Further comprising the step of forming a lens unit or a scattering unit in a portion where light is emitted from the light emitting device,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
Inserting the light emitting device includes inserting the light emitting device near a central portion in the through hole,
The first connecting step comprises directly electrically connecting the first transparent electrode and the first element electrode,
The second connecting step comprises the step of directly electrically connecting the second transparent electrode and the second element electrode,
A method for manufacturing a transparent light emitting display film. 12. The method of claim 11,
The forming of the through hole includes forming the through hole to have a size in which the light emitting device is inscribed,
The step of inserting the light emitting device comprises the step of mounting in the through hole so that at least a portion of the outer peripheral surface of the light emitting device is surrounded close to the inner wall of the through hole,
A method for manufacturing a transparent light emitting display film. A transparent light emitting display film according to any one of claims 1 to 10, comprising:
Transparent luminous signage.

Images