KR20200011875A - Transparent Light-emitting Display film, Method of Manufacturing the Same, and Transparent Light-emitting Signage using the Same - Google Patents

Abstract

According to the present invention, a transparent light emitting display film comprises: a transparent substrate in film form; a transparent electrode formed on one side of the transparent substrate; a through hole formed to penetrate the transparent substrate in a direction perpendicular to a surface of the transparent substrate; a light emitting element mounted in the through hole; and a connection portion electrically connecting the transparent electrode and the light emitting element.

Description

Transparent light-emitting display film, method of manufacturing the same, and transparent light-emitting signage using the same

The present invention relates to a transparent light emitting display film, a method of manufacturing the same, and a transparent light emitting signage using the same.

A light emitting display is a device that provides visual information to a user by using an electronic circuit and a light emitting element. Conventional light emitting displays are constructed by mounting a light-emitting diode (LED) on an opaque printed circuit board (PCB), but a transparent light emitting display device for securing the display itself is developed. (See patent document 1-3).

The transparent light emitting display is applied to the LED signage to make the signage itself thin. In this case, even if the LED sign is bent, there is a need for a structure capable of stably supporting the electronic device mounted on the display including the LED.

Patent Document 1: Republic of Korea Patent Publication No. 10-2018-0047760 Patent Document 2: Republic of Korea Patent Publication No. 10-1847100 Patent Document 3: Republic of Korea Patent Publication No. 10-1789145

The present invention has been devised to solve the above problems, and one technical problem to be achieved by the present invention is to minimize the protrusion by inserting the light emitting device into the substrate to minimize the protrusion of the display substrate, even if the display substrate is not bent, or due to external contact The present invention provides a transparent light emitting display film that can stably support an electronic device mounted on a display by preventing a connection of an electronic device including a peeled off part.

Another technical object of the present invention is to insert the light emitting device into the substrate to minimize the protrusion so that the display substrate is not bent, or even if the display substrate is not bent due to external contact does not peel off the connection of the electronic device including the light emitting device The present invention provides a method of manufacturing a transparent light emitting display film that can stably support an electronic device mounted on a display.

Another technical object of the present invention is to insert the light emitting device into the substrate to minimize the protrusion so that the display substrate is not bent, or even if the display substrate is not bent due to external contact does not peel off the connection of the electronic device including the light emitting device The present invention provides a transparent light emitting signage capable of stably supporting an electronic element mounted on a display.

The problem of the present invention is not limited to those mentioned above, and other problems not mentioned above will be clearly understood by those skilled in the art from the following description.

According to at least one embodiment of the present invention, a transparent substrate in the form of a film, a transparent electrode formed on one side of the transparent substrate, a through hole formed to penetrate the transparent substrate in a direction perpendicular to the surface of the transparent substrate, the through A light emitting device mounted in a hole and a connecting portion for electrically connecting the transparent electrode and the light emitting device are provided.

In the transparent light emitting display film according to at least one embodiment of the present invention, the transparent electrode is a transparent electrode in the form of a metal oxide thin film including ITO, IZO, IZTO, and ZnO, CNT, silver nanowires, silver nanofibers, And a transparent electrode in the form of a nano-material coating having a two-dimensional or three-dimensional structure including graphene, a transparent electrode in the form of a metal mesh having a nano or micro line width composed of a metal or an alloy including gold, silver, and copper, or It includes a transparent electrode made of a combination of.

In the transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.3 mm or less.

In the transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.25 mm or less.

In the transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.188 mm or less.

In at least one embodiment of the present invention, the transparent light emitting display film is formed on the one side of the transparent substrate, covering the one side of the transparent substrate, the transparent electrode, and one side of the light emitting device. A first protective layer is further provided.

In at least one embodiment of the present invention, the transparent light emitting display film is formed on the other side opposite to the one side of the transparent substrate, covering the other side of the transparent substrate and the other side of the light emitting device. A second protective layer is further provided.

In at least one embodiment of the present invention, the transparent light emitting display film further includes a lens unit or scattering unit at a portion where light is emitted from the light emitting element.

In the transparent light emitting display film according to at least one embodiment of the present invention, the total thickness of the transparent light emitting display film is 1 mm or less.

In the transparent light emitting display film according to at least one embodiment of the present invention, the total thickness of the transparent light emitting display film is 0.5 mm or less.

According to at least one embodiment of the present invention, the step of applying a resin layer on one side of the transparent substrate in the form of a film, forming an electrode pattern groove in the resin layer, forming a transparent electrode in the electrode pattern groove And forming a through hole to penetrate the transparent substrate and the resin layer in a direction perpendicular to the surface of the transparent substrate at a position where the light emitting device of the transparent substrate on which the transparent electrode is formed is mounted. Inserting a device, and electrically connecting the transparent electrode and the light emitting device, there is provided a transparent light emitting display film manufacturing method.

In the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the transparent electrode is a transparent electrode in the form of a metal oxide thin film comprising ITO, IZO, IZTO, and ZnO, CNT, silver nanowires, silver nano Transparent electrode in the form of a nano-material coating of a two-dimensional or three-dimensional structure including fibers and graphene, a transparent electrode in the form of a metal mesh having a nano or micro line width composed of a metal or an alloy including gold, silver, and copper, Or a transparent electrode made of a combination thereof.

In the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.3 mm or less.

In the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.25 mm or less.

In the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent substrate is 0.188 mm or less.

In at least one embodiment of the present invention, the method of manufacturing a transparent light emitting display film may include an agent covering one side of the transparent substrate, the transparent electrode, and one side of the light emitting device on the one side of the transparent substrate. It further comprises the step of forming a protective layer.

In at least one embodiment of the present invention, the method of manufacturing a transparent light emitting display film may include a second surface covering the other side of the transparent substrate and the other side of the light emitting device on the other side opposite to the one side of the transparent substrate. It further comprises the step of forming a protective layer.

In at least one embodiment of the present invention, the method of manufacturing a transparent light emitting display film further includes forming a lens unit or a scattering unit in a portion where light is emitted from the light emitting device.

In the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the transparent light emitting display film as a whole is formed to 1 mm or less.

In the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention, the thickness of the entire transparent light emitting display film is formed to 0.5 mm or less.

According to at least one embodiment of the present invention, a transparent light emitting sign provided with the transparent light emitting display film is provided.

According to at least one embodiment of the present invention, the light emitting device is inserted into the substrate to minimize the protrusion so that the contact of the electronic device including the light emitting device is not detached due to external contact even if the display substrate is bent or not bent. In addition, there is an effect of providing a transparent light emitting display film capable of stably supporting an electronic device mounted on a display.

According to at least one embodiment of the present invention, the light emitting device is inserted into the substrate to minimize the protrusion so that the contact of the electronic device including the light emitting device is not detached due to external contact even if the display substrate is bent or not bent. There is an effect that can provide a method for producing a transparent light emitting display film that can stably support an electronic device mounted on a display.

According to at least one embodiment of the present invention, the light emitting device is inserted into the substrate to minimize the protrusion so that the contact of the electronic device including the light emitting device is not detached due to external contact even if the display substrate is bent or not bent. In addition, there is an effect of providing a transparent light emitting signage capable of stably supporting the electronic device mounted on the display.

The effects of the present invention are not limited to those mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the following description.

1 is a cross-sectional view of a transparent light emitting display film according to at least one embodiment of the present invention.
2 is a cross-sectional view of a transparent light emitting display film (lens mounting) according to at least one embodiment of the present invention.
3A and 3B are conceptual views illustrating step-by-step manufacturing processes of a transparent light emitting display film according to at least one embodiment of the present invention.
4 is a cross-sectional view of a transparent light emitting display film using a wing type (T-shaped) LED chip according to at least one embodiment of the present invention.
5 is an image showing the actual operation of the transparent light emitting display film in which the light emitting elements are arranged in a 3x3 array.
5 is an image showing the flexibility of the transparent light emitting display film actually produced.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a cross-sectional view of a transparent light emitting display film 100 according to at least one embodiment of the present invention.

As shown in FIG. 1, the transparent light emitting display film 100 according to at least one embodiment of the present invention includes a transparent substrate 110 in a film form, a transparent electrode 130 formed on the transparent substrate 110, The through hole 122 formed to penetrate the transparent substrate 110 in a direction perpendicular to the surface of the transparent substrate 110, the light emitting device 140 mounted in the through hole 122, and the transparent electrode 130 and the light emitting device. It is composed of an electrode connecting portion 150 for electrically connecting the 140.

Although FIG. 1 illustrates one light emitting device 140 as an example, the transparent light emitting display film 100 according to at least one embodiment of the present invention has a structure as shown in FIG. 1 to form one display. .

In the example shown in FIG. 1, the upper part of the drawing is defined as the upper direction of the transparent substrate 110. However, this is a relative direction viewed from a process point of view, and in the case of an element emitting the lower part of the drawing, the emitting direction may be determined as the upper direction. It may be. Thus, the top or bottom described herein may be opposite to each other depending on the reference direction.

In at least one embodiment of the invention, the transparent substrate 110 is a transparent polymer substrate (PET, PC, PCT, PEN, PU, TPU, PI, or a film of silicon-based rubber, etc.) of the light emitting device 140 It has a thickness less than the height.

In at least one embodiment of the present invention, although the transparent substrate 110 is said to have a thickness less than the height of the light emitting device 140, depending on the height of the light emitting device 140, the thickness of the transparent substrate 110 is light-emitting It may be greater than or equal to the height of the element 140.

Specifically, in at least one embodiment of the present invention, the thickness of the transparent substrate 110 is 0.3 mm or less. In at least one embodiment of the present invention, the thickness of the transparent substrate 110 is 0.25 mm or less. In at least one embodiment of the present invention, the thickness of the transparent substrate 110 is 0.188 mm or less.

After forming the resin layer 120 on the transparent substrate 110, the transparent electrode 130 forms an electrode pattern groove 121 in the resin layer 120, and then forms an electrode pattern groove 121 in the formed electrode pattern groove 121. For example, it can form by filling the ink which consists of Au, Ag, Cu, CNT, Ag nanowire, or a combination thereof.

The transparent electrode 130 is a nanomaterial having a two-dimensional or three-dimensional structure including a transparent electrode in the form of a metal oxide thin film including ITO, IZO, IZTO, and ZnO, CNT, silver nanowires, silver nanofibers, and graphene. Transparent electrodes in the form of coatings, transparent electrodes in the form of metal meshes having nano or micro linewidths consisting of metals or alloys comprising gold, silver, and copper, or combinations thereof.

The electrode connection unit 150 is formed by using a soldering process, a screen printing process of conductive ink or paste, or dispensing, and electrically connects the light emitting element electrode 141 of the light emitting element 140 to the transparent electrode 130. .

In at least one embodiment of the present invention, the transparent light emitting display film 100 is formed on the transparent substrate 110, the upper portion of the transparent substrate 110, the transparent electrode 130, and the upper portion of the light emitting device 140 A second protective layer 170 is formed below the first protective layer 160 and the transparent substrate 110 to cover the lower portion of the transparent substrate 110 and the lower portion of the light emitting device 140.

As such, the through hole 122 is formed in the transparent substrate 110 using the transparent substrate 110 having a thickness less than or equal to the height of the light emitting element 140, and the light emitting element 140 is formed in the formed through hole 122. By inserting ()) to couple the light emitting device 140 and the transparent substrate 110, a transparent light emitting display film having a total thickness of 1 mm or less may be manufactured.

In at least one embodiment of the present invention, the through hole 122 is formed in the transparent substrate 110 using the transparent substrate 110 having a thickness less than or equal to the height of the light emitting device 140, and the formed through hole ( By inserting the light emitting element 140 into the 122 and combining the light emitting element 140 and the transparent substrate 110, a transparent light emitting display film having a total thickness of 0.5 mm or less can be manufactured.

If such a transparent light emitting display film is used, for example, a transparent LED signage is manufactured, the transparent LED signage can be flexibly attached to the curved surface. In addition, since it is formed of a plastic material and is light and transparent, it may not cover the field of view even when attached to the glass window.

In at least one embodiment of the present invention, a lens or scattering portion may be formed in a portion where light is emitted to scatter, adjust focus, or make parallel light to emit light emitted from the light emitting device 140. have.

2 is a cross-sectional view of a transparent light emitting display film 200, 200 ′ according to at least one embodiment of the invention.

As shown in FIG. 2, the transparent light emitting display films 200 and 200 ′ further include a lens unit 210 or a scattering unit 220 at a portion where light is emitted. 2 exemplarily shows a structure in which light is emitted downward of the drawing. Unlike in FIG. 2, in the case of a structure in which light is emitted upward of the drawing, the lens unit 210 or the scattering unit 220 may be provided above.

The lens part 210 forms the lens which has a specific shape in the part of the protective layer which light is emitted from a light emitting element among the parts of a transparent light emitting display film.

In at least one embodiment of the present invention, the lens unit 210 may include a spherical or aspherical micro lens shape for refracting at least a portion of light generated from the light emitting device.

The scattering unit 220 may include a concave-convex shape of a lattice pattern for scattering, dispersing, or diffracting at least a portion of light generated from the light emitting device.

For example, the lens unit 210 or the scattering unit 220 may be imprinted on the protective layer using a mold of a specific shape during the application process of the UV or thermosetting resin in the step of forming the protective layer on the transparent substrate. The lens portion of the desired shape can be formed in the protective layer.

As another example, after forming the protective layer, the lens unit 210 or the scattering unit 220 may further apply a resin to perform a molding process such as imprinting, etching, or engraving to form a lens unit having a desired shape in the protective layer. Can be formed. For example, when the shape of the lens portion includes an intaglio or concave shape, the lens portion may be formed by recessing and forming an intaglio or concave shape groove without applying additional resin to the protective layer of the portion.

3A and 3B are conceptual views illustrating step-by-step manufacturing processes of a transparent light emitting display film according to at least one embodiment of the present invention.

As shown in FIGS. 3A and 3B, a method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention may include a light emitting device such as an LED chip or an electronic device such as a resistor on a transparent film in a thin film form. It is a method for mounting.

The transparent light emitting display film manufactured by using the method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention may be attached to a curved surface since it has a flexible bending property. In addition, since it is formed of a plastic material and is light and transparent, it may not cover the field of view even when attached to the glass window.

Method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention is the step of applying a resin layer on one side of the transparent substrate in the form of a film, forming an electrode pattern groove in the resin layer, the electrode pattern groove Forming a transparent electrode on the transparent substrate (eg, a metal mesh electrode) and penetrating the transparent substrate and the resin layer in a direction perpendicular to the surface of the transparent substrate at a position where the light emitting device of the transparent substrate on which the transparent electrode is formed is mounted Forming a through hole, inserting the light emitting element into the through hole, and electrically connecting the transparent electrode and the light emitting element.

As shown in FIG. 3A (a), a transparent polymer substrate (film such as PET, PC, PCT, PEN, PU, TPU, PI, or silicone-based rubber) 110 having a thickness thinner or similar to that of a light emitting device is shown. To be prepared. In this case, the thinner the transparent polymer substrate 110, the higher the transparency, the easier the processing, and the superior the flexibility of the product. Thus, in at least one embodiment of the present invention, the thickness of the light emitting device can be thicker than the film thickness. The transparent polymer substrate 110 is an example of a transparent substrate.

The light emitting element uses, for example, a light-emitting diode (LED). In the present embodiment, the LED is used as a light emitting device, but any device may be used as long as it is a chip unit for converting electricity into light, such as LD (Laser Diode), OLED (Organic Light-emitting Diode), and the like.

As shown in FIG. 3A (b), a resin layer 120 is applied to form a transparent electrode on the transparent substrate. For example, a UV embossing process may be performed to form fine patterns of grooves using UV resin or a thermal imprinting process may be performed using heat curable resin.

As shown in FIG. 3A (c), the electrode pattern groove 121 is formed in the resin layer formed on the transparent substrate.

As the method of forming the electrode pattern on the substrate, imprinting, coating, deposition and etching, or photolithography may be used.

As shown in FIG. 3A (d), for example, a pattern of the metal mesh electrode 130 is formed by filling conductive ink or paste in the electrode pattern groove using a doctoring process performed by scraping a surface with a blade. .

For example, the method of forming the electrode pattern may be an inkjet method, an offset printing method, a reverse offset printing method, a flat screen printing method, a spin coating method ( spin coating, roll coating, flow coating, dispensing, gravure printing, or flexographic printing.

As shown in FIG. 3A (e), the through hole 122 is formed at a position where the light emitting device is mounted to be slightly larger than the size of the light emitting device. For example, the through hole may be drilled using a punching process, laser processing, or general machining.

As shown in FIG. 3B (f), the light emitting device 140 is mounted in a through hole formed in the transparent substrate.

As shown in FIG. 3B (g), the electrode connecting portion 150 is formed by using a soldering process or a screen printing or dispensing process of a conductive ink or paste, so that the electrodes of the light emitting device chip and the transparent electrode are electrically connected to each other. do. Electrically connected solders or conductive pastes have good properties of curing and soldering at high temperatures, but select the temperature and curing time at which thermal deformation does not occur severely due to the nature of the plastic substrate (e.g. PET, PC Typical films such as relatively low temperatures or short cure times; films for high temperature materials such as PI have relatively high temperatures or long cure times).

As shown in FIG. 3B (h), the first protective layer 160 may be formed by applying UV or thermosetting resin to the entire surface of the transparent substrate to which the light emitting device chip is exposed and curing using UV or heat. . Thereafter, the transparent film may be selectively covered thereon to protect the surface on which the transparent electrode and the electrode of the light emitting device chip are connected.

At this time, by using a UV resin and a transparent film having no adhesive force, the surface can be protected by UV resin alone. In this case, the UV resin enters the gap between the substrate and the light emitting device chip to fill the gaps, so that the light emitting device chip can be more strongly supported on the transparent substrate.

As shown in FIG. 3B (i), the UV resin may be applied to the opposite side of the light emitting device chip to which the light emitting device chip is exposed, and then a second protective layer 170 may be formed to selectively cover the transparent film to protect the surface. .

At this time, by using a UV resin and a transparent film having no adhesive force, the surface can be protected by UV resin alone. In this case, the UV resin can enter the gap between the substrate and the light emitting device chip to fill the gap, thereby supporting the light emitting device chip more strongly.

Through the above process, since the resin penetrates tightly to the upper, lower and inner gap space of the light emitting device chip, the light emitting device chip can be stably fixed to the transparent substrate.

The method of manufacturing a transparent light emitting display film according to at least one embodiment of the present invention further includes forming a lens unit or a scattering unit in a portion where light is emitted from the light emitting device.

The forming of the lens unit may include forming a lens unit having a specific shape on a portion of the protective layer to which light is exposed from the light emitting device chip among the portions of the transparent light emitting display film.

For example, the lens unit may include a spherical or aspheric micro lens shape for refracting at least a portion of light generated from the light emitting device chip. For example, the lens unit may include a concave-convex shape of a grating pattern for scattering, scattering, or diffracting at least a portion of light generated from the light emitting device chip. For example, the shape of the lens unit may be formed to have any of various shapes depending on the purpose of use.

For example, the forming of the lens unit may be performed by imprinting the protective layer using a mold of a specific shape during the application process of the UV resin in the step of forming the protective layer on the front surface of the transparent substrate, thereby forming the protective layer of the desired shape. The lens portion can be formed.

As another example, in the forming of the lens unit, after forming the protective layer, the lens unit may be formed by additionally applying a resin to perform a molding process such as imprinting, etching or engraving. For example, when the shape of the lens portion includes an intaglio or concave shape, the lens portion may be formed by recessing and forming an intaglio or concave shape groove without applying additional resin to the protective layer of the portion.

4 is a cross-sectional view of a transparent light emitting display film 400 using a wing type (T-shaped) LED chip according to at least one embodiment of the present invention.

The transparent light emitting display film 400 illustrated in FIG. 4 includes a light emitting device 440 instead of the light emitting device 140.

The light emitting device 440 is a wing type LED chip having an upper portion extending in a T-shape on both sides, and the light emitting device electrodes 442 are formed on both wings 441 so as to emit light in the lower or upper direction of the drawing. .

The transparent light emitting display film 400 using the light emitting element 440 may electrically connect the light emitting element electrode 442 and the transparent electrode 130 using the electrode connecting portion 150 as illustrated in FIGS. 1 to 3. However, when the lower surface of the light emitting element electrode 442 protruding on both sides is used, as shown in FIG. 4, the electrode connecting portion 450 is more efficiently used between the transparent electrode 130 and the light emitting element electrode 442. As a result, the light emitting element electrode 442 and the transparent electrode 130 may be electrically connected to each other.

FIG. 5 is an image showing the actual operation of the transparent light emitting display film 100 in which light emitting devices are arranged in a 3 × 3 array.

The produced transparent light emitting display film has a total thickness of about 0.5 mm and is a transparent film in a power off state (upper image of FIG. 4), but when a power source (3.7 V) is applied, a light emitting device (LED) operates to operate as a display. (Bottom image of Figure 4).

6 is an image showing the flexibility of the transparent light emitting display film 100 actually manufactured.

Since the total thickness of the transparent light emitting display film 100 manufactured using a 0.188 mm thick substrate is about 0.5 mm, as shown in FIG. 5, the transparent light emitting display film 100 can be bent freely in both directions and can be freely attached to a curved surface. .

In addition, by forming a protective layer on both surfaces, even if the display substrate is bent, it is possible to stably support electronic devices mounted on the display such as a light emitting device or a resistor.

When the transparent light emitting signage is manufactured using the transparent light emitting display film manufactured as described above, the signage is mounted on various surfaces including curved surfaces to obtain a desired promotional effect without covering the field of view.

As described above, according to at least one embodiment of the present invention, even when the display substrate is bent or not bent, the electronic parts mounted on the display are prevented from peeling off due to external contact. A transparent light emitting display film capable of stably supporting an element can be provided.

In addition, according to at least one embodiment of the present invention, even if the display substrate is bent or not bent, the contact of the electronic element including the light emitting element is not peeled off due to external contact, thereby stably keeping the electronic element mounted on the display. It is possible to provide a method for producing a supportable transparent light emitting display film.

In addition, according to at least one embodiment of the present invention, even if the display substrate is bent or not bent, the contact of the electronic element including the light emitting element is not peeled off due to external contact, thereby stably keeping the electronic element mounted on the display. A supportable transparent light emitting signage can be provided.

In the above description, the technical idea of the present invention has been described with the accompanying drawings. However, the present invention has been described by way of example only, and is not intended to limit the present invention. In addition, it will be apparent to those skilled in the art that various modifications and imitations can be made without departing from the scope of the technical idea of the present invention.

100, 200, 200 ', 400: transparent light emitting display film
110: transparent substrate
120: resin layer 121: electrode pattern groove
122: through hole 130: metal mesh electrode (transparent electrode)
140 and 440 light emitting elements 141 and 442 light emitting element electrodes
150, 450: electrode connection portion (connection portion) 160: first protective layer
170: second protective layer 210: lens part
220: scattering part 441: wing

Claims (21)

Transparent substrates in the form of films;
A transparent electrode formed on one side of the transparent substrate;
A through hole formed to penetrate the transparent substrate in a direction perpendicular to a surface of the transparent substrate;
A light emitting element mounted in the through hole; And
A connecting portion for electrically connecting the transparent electrode and the light emitting element
With,
Transparent light emitting display film. The method of claim 1,
The transparent electrode has a two-dimensional or three-dimensional structure of nanomaterial coating including a transparent electrode in the form of a metal oxide thin film including ITO, IZO, IZTO, and ZnO, CNT, silver nanowires, silver nanofibers, and graphene Including a transparent electrode made of a metal mesh having a nano or micro line width consisting of a transparent electrode, a metal or an alloy including gold, silver, and copper, or a transparent electrode made of a combination thereof,
Transparent light emitting display film. The method of claim 1,
The thickness of the transparent substrate is 0.3 mm or less,
Transparent light emitting display film. The method of claim 1,
The thickness of the transparent substrate is 0.25 mm or less,
Transparent light emitting display film. The method of claim 1,
The thickness of the transparent substrate is 0.188 mm or less,
Transparent light emitting display film. The method of claim 1,
A first protective layer formed on the one side of the transparent substrate and covering the one side of the transparent substrate, the transparent electrode, and one side of the light emitting device;
Transparent light emitting display film. The method of claim 6,
A second protective layer formed on the other side of the transparent substrate opposite to the one side, and covering the other side of the transparent substrate and the other side of the light emitting device;
Transparent light emitting display film. The method of claim 1,
Further comprising a lens portion or a scattering portion in the light emitting portion from the light emitting element,
Transparent light emitting display film. The method of claim 1,
The thickness of the whole transparent light emitting display film is 1 mm or less,
Transparent light emitting display film. The method of claim 1,
The thickness of the whole transparent light emitting display film is 0.5 mm or less,
Transparent light emitting display film. Applying a resin layer to one side of the transparent substrate in the form of a film;
Forming an electrode pattern groove in the resin layer;
Forming a transparent electrode in the electrode pattern groove;
Forming a through hole to penetrate the transparent substrate and the resin layer in a direction perpendicular to the surface of the transparent substrate at a position where the light emitting device of the transparent substrate on which the transparent electrode is formed is mounted;
Inserting the light emitting device into the through hole; And
Electrically connecting the transparent electrode and the light emitting element
With,
Transparent light emitting display film manufacturing method. The method of claim 11,
The transparent electrode has a two-dimensional or three-dimensional structure of nanomaterial coating including a transparent electrode in the form of a metal oxide thin film including ITO, IZO, IZTO, and ZnO, CNT, silver nanowires, silver nanofibers, and graphene Including a transparent electrode made of a metal mesh having a nano or micro line width consisting of a transparent electrode, a metal or an alloy including gold, silver, and copper, or a transparent electrode made of a combination thereof,
Transparent light emitting display film manufacturing method. The method of claim 11,
The thickness of the transparent substrate is 0.3 mm or less,
Transparent light emitting display film manufacturing method. The method of claim 11,
The thickness of the transparent substrate is 0.25 mm or less,
Transparent light emitting display film manufacturing method. The method of claim 11,
The thickness of the transparent substrate is 0.188 mm or less,
Transparent light emitting display film manufacturing method. The method of claim 11,
And forming a first protective layer on the one side of the transparent substrate, the first protective layer covering the one side of the transparent substrate, the transparent electrode, and the one side of the light emitting device.
Transparent light emitting display film manufacturing method. The method of claim 16,
And forming a second protective layer on the other side of the transparent substrate, the second side of the transparent substrate covering the other side of the transparent substrate and the other side of the light emitting device.
Transparent light emitting display film manufacturing method. The method of claim 11,
The method may further include forming a lens unit or a scattering unit in a portion where light is emitted from the light emitting device.
Transparent light emitting display film manufacturing method. The method of claim 11,
Forming the thickness of the entire transparent light emitting display film to 1 mm or less,
Transparent light emitting display film manufacturing method. The method of claim 11,
Forming the thickness of the entire transparent light emitting display film to 0.5 mm or less,
Transparent light emitting display film manufacturing method. The transparent light emitting display film of any one of Claims 1-10 is provided,
Transparent luminous signage.

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