KR102428820B1 - LED light-emitting board using transparent substrate, manufacturing method thereof - Google Patents

Abstract

The present invention relates to an LED light emitting board using a transparent substrate and a method for manufacturing the same.
According to an embodiment of the present invention, by adhering a conductive metal film to one side of the transparent substrate, forming an electrode pattern through etching, and electrically connecting the LED element inserted into the groove of the transparent substrate and the electrode pattern, An LED light emitting board using a transparent substrate configured to increase the degree of integration of a plurality of LED elements installed on a light emitting board and increase the resolution of the light emitting board by using an electrode pattern made of a metal material having excellent conductivity, and a manufacturing method thereof are disclosed.

Description

LED light-emitting board using transparent substrate, manufacturing method thereof

The present invention relates to an LED light emitting board using a transparent substrate and a method for manufacturing the same, wherein a conductive metal film is adhered to one side of the transparent substrate, an electrode pattern is formed through etching treatment, a groove is formed in the transparent substrate, and the groove is formed in the groove. A transparent substrate configured to electrically connect the inserted LED element and the electrode pattern, thereby increasing the degree of integration of a plurality of LED elements installed on the light emitting board and increasing the resolution of the light emitting board using an electrode pattern made of a metal material having excellent conductivity. It relates to an LED light emitting board using

Modern indoor/outdoor billboards can be largely divided into billboards with indirect lighting using fluorescent lamps and incandescent lamps, and billboards with direct lighting using neon signs and light emitting devices.

Recently, an electric sign using a light emitting diode (LED; Light Emitting Diode, hereinafter referred to as 'LED') has been widely used.

LEDs have advantages in that they have low calorific value and power consumption, have excellent visibility and luminance, and can be manufactured in a small size.

As an example of the prior art related to an LED light emitting board, Korean Patent Registration No. 10-1480961 (registered on January 05, 2015) proposed by the present inventor relates to a transparent plastic material LED light emitting board and a manufacturing method thereof, and a transparent plastic material The electrode pattern is formed by printing a conductive ink on the substrate of the , and the electrode pattern and the LED light emitting device are electrically connected through the conductive epoxy.

However, although the prior art has the advantage of improving aesthetics and productivity, for example, since it is a method of forming an electrode pattern by printing a conductive ink containing silver (Ag) in a screen printing method, the conductive properties of the electrode pattern material had limitations.

That is, the conductive ink containing silver (Ag) component is not generally 100% pure silver paste, but consists of 80~95% silver paste and 5~20% adhesive binder. has an electrical resistance of When the electrical resistance is large, it is impossible to insert many LEDs into one light emitting board, and for this reason, when the LED light emitting board is used for display purposes such as a billboard, there is a limitation in that the resolution of the display cannot be increased.

As another example of the prior art, the Republic of Korea Patent Registration 10-1847100 (registered on April 03, 2018) proposed by the present inventor is a method for manufacturing a transparent light emitting device using UV imprinting technology and a transparent light emitting device manufactured accordingly. In this regard, a configuration in which an integrated circuit pattern is quickly imprinted through UV imprinting technology using a mold and then filled with a conductive material in the circuit pattern to form an electrical circuit in the form of a metal mesh was proposed.

However, the prior art has the advantage of manufacturing a large-area high-resolution transparent light-emitting device, but it is necessary to form different circuit patterns to manufacture light-emitting boards of different shapes/sizes, and for this purpose, a mold must be individually manufactured, so the manufacturing cost is high. It has a limitation in that the price of the material is high due to the high level of difficulty in producing the material.

As another example of the prior art, Korean Patent Laid-Open Publication No. 10-2018-0012544 (published on February 06, 2018) relates to a high-resolution transparent light emitting device and a method for manufacturing the same, wherein a transparent circuit is formed on a first transparent substrate with grooves formed therein. ; a second transparent substrate including a groove and having a transparent circuit formed thereon; an LED chip attached to a groove formed in the first transparent substrate and including a transparent electrode, wherein one electrode of the transparent electrodes is soldered to the first transparent substrate, and the other electrode is the A configuration in which soldering is performed in the groove of the second transparent substrate is proposed.

However, in the prior art, since one electrode of the transparent electrodes of the LED chip is soldered to the first transparent substrate and the other electrode is soldered to the groove of the second transparent substrate, the transparent circuit of the first transparent substrate and There was a limitation in that manufacturing productivity was lowered in that the lamination work had to be done so that the transparent circuit of the second transparent substrate met at the correct position, and micro-bubbles and floatation could occur during the lamination process.

In addition, in the prior art, when there is a difference in the thickness or material of the first transparent substrate and the second transparent substrate, high temperature conditions (soldering temperature of 100 ℃ or more) generated in the process of connecting the LED chip to the transparent circuit or after field installation Due to the high temperature conditions (direct sunlight temperature of 100 ° C or higher) generated by direct sunlight in the process of use, there was a limitation in that defects such as warpage caused by the difference in thermal deformation between the first transparent substrate and the second transparent substrate were inherent.

Republic of Korea Patent Registration 10-1480961 (Registered on January 05, 2015) Republic of Korea Patent Registration 10-1847100 (Registered on April 03, 2018) Republic of Korea Patent Publication 10-2018-0012544 (published on February 06, 2018)

The present invention has been devised in view of the above problems, by adhering a conductive metal film to one side of a transparent substrate, forming an electrode pattern through etching, forming a groove in the transparent substrate, and an LED device inserted into the groove By electrically connecting the electrode pattern with the electrode pattern, the LED light emission using a transparent substrate configured to increase the degree of integration of a plurality of LED elements installed on the light emitting board and increase the resolution of the light emitting board using an electrode pattern made of a metal material with excellent conductivity It is an object of the present invention to provide a board and a method for manufacturing the same.

According to one aspect of the present invention for achieving the above object, the step of preparing a transparent substrate; adhering a conductive metal film to one side of the transparent substrate using a transparent adhesive; forming an electrode pattern by masking and etching the adhered conductive metal film to form an electrode pattern; forming a transparent ink layer on at least a portion of the portion from which the conductive metal film is removed by the etching process; forming a plurality of LED device insertion grooves on one side of the transparent substrate; inserting and installing the LED element into each LED element insertion groove so that the LED light emitting surface faces the other side of the transparent substrate and faces the inside of the groove; and electrically connecting the electrode pattern and the LED element to the LED element.

Preferably, the transparent substrate is made of any one of a plastic material or a glass material.

Preferably, the transparent substrate is made of a polycarbonate material or a polycarbonate-based laminated material.

Preferably, the conductive metal film is any one of a Cu film, a Ni film, a Cu-Ni alloy film, and an Al film.

Preferably, the adhesive surface of the conductive metal film is oxide-treated.

Preferably, the transparent adhesive is a transparent UV (ultraviolet) adhesive.

Preferably, the transparent ink layer is formed using a transparent UV ink.

Preferably, the electrode pattern and the LED element are electrically connected using silver epoxy or low-temperature solder cream.

Preferably, the transparent ink layer is formed to cover the remaining area except for a portion in which the LED element insertion groove is formed and an electrode pattern portion electrically directly connected to the LED element.

According to one aspect of the present invention, a transparent substrate having a plurality of LED device insertion grooves formed on one side thereof; an electrode pattern formed based on a conductive metal film adhered to one side of the transparent substrate using a transparent adhesive; a transparent ink layer formed on one side of the transparent substrate and formed to cover at least a portion of an area where the electrode pattern is not formed; and an LED element inserted into each LED element insertion groove so that the LED light emitting surface faces the other side of the transparent substrate and faces the inside of the groove, and the LED element is electrically connected to the electrode pattern. An LED light emitting board is disclosed.

Preferably, the electrode pattern is formed by etching a conductive metal film adhered to one side of the transparent substrate using a transparent adhesive.

Preferably, the transparent ink layer is formed to cover the remaining area except for a portion in which the LED element insertion groove is formed and an electrode pattern portion electrically directly connected to the LED element.

The present invention has the advantage of increasing the degree of integration of a plurality of LED elements installed on the light emitting board and increasing the resolution of the light emitting board by using an electrode pattern made of a metal material having excellent conductivity.

1A and 1B are schematic diagrams for explaining a method of manufacturing an LED light emitting board according to an embodiment of the present invention;
2 is a schematic plan view of an LED light emitting board according to an embodiment of the present invention;
3 is a photo of a prototype of an LED light emitting board according to an embodiment of the present invention;
4 is a photograph of a test article for explaining a state in which light transmittance is improved by forming a transparent ink layer according to an embodiment of the present invention.

The present invention may be embodied in various other forms without departing from its technical spirit or main characteristics. Accordingly, the embodiments of the present invention are merely illustrative in all respects and should not be construed as limiting.

The terms 1st, 2nd, etc. are used only for the purpose of distinguishing one component from another component. For example, without departing from the scope of the present invention, a first component may be referred to as a second component, and similarly, a second component may also be referred to as a first component.

When a component is referred to as being “connected” or “connected” to another component, it may be directly connected or connected to the other component, but another component may exist in between.

As used herein, the singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as "comprises" or "comprising", "have" and the like are intended to represent the presence of elements or combinations thereof described in the specification, and the possibility that other elements or features may be present or added. It is not precluded.

Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings.

1A and 1B are schematic diagrams for explaining a method of manufacturing an LED light emitting board according to an embodiment of the present invention.

First, a transparent substrate 10 is prepared.

The transparent substrate 10 may be made of any one of a plastic material or a glass material, and in view of workability, a plastic material is better.

Preferably, the transparent substrate 10 is a substrate made of a plastic material, for example, various materials such as acrylic, PC (poly carbonate), PET (poly ethylene terephthalate), etc. can be selected, and the base substrate is It may be formed by cutting to a predetermined size. In particular, the transparent substrate 10 is more preferably made of a polycarbonate material in consideration of processability, light transmission characteristics, thermal deformation characteristics, and the like.

As a modification, the transparent substrate 10 may be made of a polycarbonate-based laminated material. The laminating material is a polycarbonate substrate laminated with another plastic substrate, and as a preferred example, a polycarbonate substrate and an acrylic substrate may be laminated. As a preferred example, the thickness of the laminated material substrate may be configured such that the thickness of the polycarbonate substrate: the thickness of the acrylic substrate is about 8:2.

For example, the transparent substrate 10 is preferably formed to a thickness of about 1.2 to 1.5 mm in consideration of the usability as a light emitting board and the installation side of the LED element 50 .

Next, the conductive metal film 30 is adhered to one side 10a of the transparent substrate 10 using a transparent adhesive 20 . (a of Fig. 1a)

In a preferred embodiment, the conductive metal film 30 may be any one of a Cu (copper) film, a Ni (nickel) film, a Cu-Ni alloy film, and an Al (aluminum) film, in particular, it is preferable to use a Cu film. good night.

Preferably, the adhesive surface of the conductive metal film 30 is oxide-treated. Oxide treatment is to emboss the film surface through chemical treatment.

When the surface of the conductive metal film 30 such as a Cu film is smooth, adhesion to the transparent substrate 10 , in particular, the transparent substrate 10 made of a plastic material may not be easily achieved. In consideration of this, if the adhesive surface of the conductive metal film 30 is oxide-treated to form an embossed surface, it is advantageous to form an adhesive force.

If the conductive metal film 30 is too thin, the electrical resistance of the electrode pattern 32 is high, and if it is too thick, etching is difficult.

Preferably, the transparent adhesive 20 uses a transparent UV (ultraviolet) adhesive. A transparent UV adhesive is a transparent adhesive that is cured by UV irradiation after application.

The transparent adhesive 20 layer is not particularly limited, but may be formed to a thickness of about 3 to 4 μm.

For example, the transparent adhesive 20 is a liquid adhesive and is evenly applied to one side 10a of the transparent substrate 10 using a dispenser, and the upper and lower sides are laminated with the conductive metal film 30 on the upper side. The conductive metal film 30 is attached by pressing with a rubber roller of When a transparent UV adhesive is used as the transparent adhesive 20, it is cured by UV irradiation.

Next, the electrode pattern 32 is formed by masking and etching the bonded conductive metal film 30 for forming the electrode pattern 32 . (Fig. 1a b)

The masking method generally includes a dry film method and a photoresist (PR) method, and in this embodiment, it is preferable to use a PR (photoresist) method applicable to precise numerical conditions, but is not limited thereto.

The etching process may be performed as follows. First, after masking the part that should not be etched with PR (photoresist), the etching agent is sprayed or injected into the etching agent. The electrode pattern 32 constituting the circuit is left by etching the conductive metal film 30 portion corresponding to the area other than the masked area with the etching agent.

Next, a transparent ink layer 40 is formed on at least a portion of the portion 30c from which the conductive metal film 30 is removed by the etching process.

Preferably, the transparent ink layer 40 is the remaining region 40a except for the portion where the LED element insertion groove 12 to be described later is formed and the electrode pattern portion 32a directly electrically connected to the LED element 50 . , 40b) is preferably formed to cover.

Region 40a illustrated in FIG. 1B corresponds to a region covering the remaining electrode patterns 32 (patterns constituting circuit lines) except for the electrode pattern portion 32a directly electrically connected to the LED element 50 , and region 40b corresponds to a space region between the electrode patterns 32 .

Preferably, the transparent ink layer 40 is formed using transparent UV ink (eg, transparent UV ink for silk screen). (Fig. 1a c)

Only the transparent adhesive 20 layer remains in the portion 30c from which the conductive metal film 30 is removed by the etching process as described above. A haze phenomenon in which light transmittance is very low may occur. In order to prevent this, if the curved surface of the portion 30c from which the conductive metal film 30 is removed by etching is removed by applying liquid transparent UV ink to the curved surface where light refraction occurs, good light transmittance can be obtained. .

The region 40a covering the remaining electrode pattern 32 except for the electrode pattern portion 32a that is electrically directly connected to the LED element 50 has a risk of deterioration due to oxidation when exposed to the atmosphere due to long-term use. , it is preferable to cover the transparent ink layer 40 up to this part.

The electrode pattern portion 32a that is directly electrically connected to the LED element 50 is formed of the electrode pattern 32 and the electrode of the LED element 50 using silver epoxy 62 or low-temperature solder cream 64, as will be described later. to be electrically connected, there is no need to form the transparent ink layer 40 in this portion.

Since the inner surface of the groove 12 for LED element insertion is also not a portion where the transparent adhesive 20 layer remains, it is not necessary to form the transparent ink layer 40 in this portion.

For example, the transparent ink may be applied using a silk screen on which an ink application pattern is formed. When a transparent UV ink is used as the transparent ink, it is cured by UV irradiation after application.

In order to obtain the cover area of the transparent ink layer 40 as described above, the silk screen includes a portion in which a groove 12 for inserting an LED element is formed and an electrode pattern portion 32a that is directly electrically connected to the LED element 50 . An ink application pattern is formed so that the transparent ink is not applied to the surface, and the transparent ink is applied to the remaining regions 40a and 40b.

Next, a plurality of LED element insertion grooves 12 are formed in one side 10a of the transparent substrate 10 . For example, the groove 12 for inserting the LED element may be formed by a machining method using a mechanical device such as a CNC machine. Preferably, the groove 12 for inserting the LED element is formed based on the outer model of the LED element 50, and it is preferable to form a groove larger than the actual size by about +0.02 to 0.05 mm. (d of Fig. 1b)

Next, the LED element 50 is inserted into each LED element insertion groove 12 so that the LED light emitting surface 50a faces the other side 10b of the transparent substrate 10 and faces the inside of the groove. do. Preferably, the LED element 50 may be adhesively fixed in the groove 12 for inserting the LED element through a transparent adhesive. (e of Fig. 1b)

The other side 10b of the transparent substrate 10 may be understood as a front portion on which the light emitting display of the LED light emitting board is made.

For example, the LED device 50 of this embodiment may be a known LED device in the form of a small chip, and has an LED light emitting surface 50a formed thereon, and positive/negative electrodes formed on the opposite side thereof.

By inserting the LED element 50 in the insertion direction as described above, the LED light emitting surface 50a is the front surface of the transparent substrate 10 only by the process of inserting and bonding the LED element 50 into the LED element insertion groove 12 . It has a shape accommodated in the groove 12 for inserting the LED element while facing the part.

In addition, through this configuration, when the plurality of LED elements 50 arranged in a grid on the transparent substrate 10 are supplied with DC power through the electrode pattern 32 and emit light in various forms according to a preset control logic, Various display visual effects can be given to a user who looks at the front part of the transparent substrate 100 .

Next, the electrode pattern 32 and the LED element 50 are electrically connected. (f of Fig. 1b)

Preferably, the electrode pattern 32 and the LED element 50 are electrically connected using silver epoxy 62 or low-temperature solder cream 64 .

For example, the silver epoxy 62 may be applied using a dispenser to electrically connect the electrode pattern 32 and the LED element 50 . A dispenser is a known equipment for dispensing a liquid substance in a fixed amount.

For example, the low-temperature solder cream 64 may be applied by a silk printing method using a metal mask to electrically connect the electrode pattern 32 and the LED element 50 .

Meanwhile, in the present embodiment, the silver epoxy 62 used for electrical connection can be cured at room temperature, but may be cured at a high temperature of 100° C. or higher to speed up the curing time. In addition, the low-temperature solder cream 64 can be soldered at a high temperature condition of 140° C. or higher. Although the conductive metal film 30 such as the Cu film of this embodiment is thermally deformed under high temperature conditions, it can be restored to its original state when returning to room temperature, so there is no problem such as remaining warpage due to thermal deformation.

2 is a schematic plan view of an LED light emitting board according to an embodiment of the present invention.

The LED light emitting board of this embodiment includes a transparent substrate 10 , an electrode pattern 32 , a transparent ink layer 40 , and at least one LED element 50 .

The transparent substrate 10 has a plurality of LED element insertion grooves 12 formed on one side 10a.

The electrode pattern 32 is formed based on the conductive metal film 30 adhered to one side 10a of the transparent substrate 10 using a transparent adhesive 20 .

Preferably, the electrode pattern 32 may be formed by etching the conductive metal film 30 adhered to one side 10a of the transparent substrate 10 using a transparent adhesive 20 .

The transparent ink layer 40 is formed on one side 10a of the transparent substrate 10 and is formed to cover at least a portion 40b of the regions 12 and 40b where the electrode pattern 32 is not formed. do.

The LED element 50 is inserted and installed in each LED element insertion groove 12 so that the LED light emitting surface 50a faces the other side 10b of the transparent substrate 10 and faces the inside of the groove, , electrically connected to the electrode pattern 32 .

Preferably, the transparent ink layer 40, the remaining region 40a except for the portion where the LED element insertion groove 12 is formed and the electrode pattern portion 32a directly electrically connected to the LED element 50, 40b).

In the region 40a, the transparent ink layer 40 is not necessarily formed, but a transparent ink layer 40 is preferably formed to prevent oxidation of the electrode pattern 32, and the region 40b is formed on the transparent substrate 10 after etching. It needs to be formed in order to prevent haze caused by the transparent adhesive 20 layer remaining on the .

3 is a photograph of a prototype of an LED light emitting board according to an embodiment of the present invention.

As illustrated in FIG. 3 , the LED element 50 is installed in a grid shape on the transparent LED light emitting board in which the back background is visible in a transmissive state, and it can be confirmed that the LED element 50 is light-emitting in the form of a display.

4 is a photograph of a test article for explaining a state in which light transmittance is improved by forming a transparent ink layer according to an embodiment of the present invention.

Area A1 in FIG. 4 is a portion 30c from which the conductive metal film 30 has been removed by etching, and area A2 is a transparent ink layer ( 40) was formed.

4, since the conductive metal film 30 is removed by the etching process and the transparent adhesive 20 layer remains in the area A1, the haze in which light transmittance is very low due to refraction of light (haze) phenomenon has occurred. Because of this, in the A1 area, the letters placed under the board are difficult to see.

However, the A2 region has good light transmittance and it can be seen that the characters placed under the board are clearly visible because the curved surface is removed by applying liquid transparent UV ink to the curved surface where light refraction occurs.

Although the present invention has been described mainly in terms of preferred embodiments with reference to the accompanying drawings, it will be apparent to those skilled in the art that many various and obvious modifications can be made therefrom without departing from the scope of the present invention. Accordingly, the scope of the present invention should be construed by the appended claims to cover many such modifications.

10: transparent substrate
12: groove for inserting the LED element
20: transparent adhesive
30: conductive metal film
32: electrode pattern
40: transparent ink layer
50: LED element
62: silver epoxy
64: low temperature solder cream

Claims (12)

preparing a transparent substrate;
adhering a conductive metal film to one side of the transparent substrate on which a groove for inserting an LED element is to be formed using a transparent adhesive;
forming an electrode pattern by masking and etching the adhered conductive metal film to form an electrode pattern;
forming a transparent ink layer on at least a portion of the portion from which the conductive metal film is removed by the etching process on one side of the transparent substrate where the groove for inserting the LED element is to be formed;
forming a plurality of LED device insertion grooves on one side of the transparent substrate;
inserting and installing the LED elements into each LED element insertion groove so that the LED light emitting surface faces the other side of the transparent substrate and faces the inside of the groove; and
A method of manufacturing an LED light emitting board using a transparent substrate comprising; electrically connecting the electrode pattern and the LED element.
The method of claim 1,
The transparent substrate is a method of manufacturing an LED light emitting board using a transparent substrate, characterized in that it is composed of any one of a plastic material or a glass material.
According to claim 1,
The transparent substrate is a method of manufacturing an LED light emitting board using a transparent substrate, characterized in that it is composed of a polycarbonate material or a polycarbonate-based laminated material.
According to claim 1,
The conductive metal film,
A method of manufacturing an LED light emitting board using a transparent substrate, characterized in that it is any one of Cu film, Ni film, Cu-Ni alloy film and Al film.
According to claim 1,
An LED light emitting board manufacturing method using a transparent substrate, characterized in that the adhesive surface of the conductive metal film is treated with oxide.
According to claim 1,
The transparent adhesive is a method of manufacturing an LED light emitting board using a transparent substrate, characterized in that it is a transparent UV (ultraviolet) adhesive.
According to claim 1,
The transparent ink layer is a method of manufacturing an LED light emitting board using a transparent substrate, characterized in that it is formed using a transparent UV ink.
According to claim 1,
The method for manufacturing an LED light emitting board using a transparent substrate, characterized in that the electrode pattern and the LED element are electrically connected using silver epoxy or low-temperature solder cream.
According to claim 1,
The transparent ink layer is formed to cover the remaining area except for the portion where the LED element insertion groove is formed and the electrode pattern portion electrically directly connected to the LED element. Way.
a transparent substrate having a plurality of LED element insertion grooves formed on one side thereof;
an electrode pattern formed on the basis of a conductive metal film adhered using a transparent adhesive to one side of the transparent substrate on which a groove for inserting an LED element is formed;
a transparent ink layer formed on one side of the transparent substrate on which a groove for inserting an LED element is formed, and formed to cover at least a portion of an area where the electrode pattern is not formed; and
LED elements are installed in each LED element insertion groove so that the LED light emitting surface faces the other side of the transparent substrate and faces the inside of the groove, and the LED element is electrically connected to the electrode pattern. light board.
11. The method of claim 10,
The electrode pattern is
An LED light emitting board using a transparent substrate, characterized in that it is formed by etching a conductive metal film adhered to one side of the transparent substrate using a transparent adhesive.
11. The method of claim 10,
The transparent ink layer is an LED light emitting board using a transparent substrate, characterized in that it is formed to cover the remaining area except for the portion in which the groove for inserting the LED element is formed and the electrode pattern portion electrically directly connected to the LED element.

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