KR100963092B1

KR100963092B1 - LED illuminations combined with the cases and heatsinks and electric circuits and which the manufacture technique against that

Info

Publication number: KR100963092B1
Application number: KR20070130548A
Authority: KR
Inventors: 이경희
Original assignee: 이경희
Priority date: 2007-12-13
Filing date: 2007-12-13
Publication date: 2010-06-14
Also published as: KR20090063032A

Abstract

The present invention relates to a method for manufacturing a product for solving the heat dissipation and cost problems required to manufacture a product containing the LED as parts of the exterior case and heat sink, PCB, etc. required for manufacturing the lighting product including the LED It is a technology for the product and its manufacturing method that improves the heat dissipation efficiency by lowering the manufacturing cost of the product in the case of mass production, and the manufacturing method thereof.In detail, the base which combines the appearance of the product and the heat sink is manufactured and the insulation layer is After the formation of the primary circuit pattern, the insulating layer is formed again, the secondary pattern is formed, and then the insulating layer is formed again, forming a reflector if necessary on the circuit made, and the LED and its control elements with a conductive adhesive After completing the circuit by connecting, complete the product by installing the cover optical module, exterior and heat sink This chapter describes the integrated manufacturing techniques of PCB, integrated manufacturing techniques of PCB and related passive components.

LED, lighting, light source, heat dissipation, mass production, integrated, manufacturing technique

Description

LED illuminations combined with the cases and heatsinks and electric circuits and which the manufacture technique against that}

The present invention relates to a method of manufacturing a product for solving the heat dissipation problem and the cost problem required for manufacturing a product containing a light emitting diode (LED).

An LED is a diode that generates light by flowing a current in a forward direction through a pn junction. Holes are injected from the p side and electrons are injected from the n side to the n side and p side, respectively, and some of these carriers recombine and disappear. At this time, the energy of the dissipated carrier is generated as light. The detailed process and mechanism of this light generation differs depending on the material. Light generated from this is usually infrared or light of a wavelength close to this, but some of the diodes emit visible light. The light emitting diode is used for display and communication because it operates at a low voltage, has a long lifetime, and emits high luminance light.

Conventionally, in order to use such LEDs for lighting, a plurality of LEDs are assembled on a single printed circuit board (hereinafter referred to as a printed circuit board) or stacked in multiple layers to form lighting. In this case, since the heat generated from the LED and its control elements cannot be efficiently discharged, the area has to be enlarged, and there are significant external restrictions such as attaching a separate heat sink to the back of the PCB. In particular, in the case of LED signboards, the LEDs placed inside the large-scale LEDs are not heat-dissipated properly, resulting in the destruction of the LED's long lifespan. In addition, in the case of a street lamp or a lighting lamp, a relatively large heat sink is inserted after the PCB to eliminate heat generated by using a high output LED to increase the amount of light. It is a factor that increases the manufacturing cost.

The present invention is to improve the heat dissipation efficiency and lower the manufacturing cost of the product in mass production by increasing the competitiveness of the product and its manufacturing method by integrating the parts such as exterior case, heat sink, PCB, etc. necessary to manufacture the lighting product including LED It is related to the technology of the present invention, and more specifically, the base of the product and the heat sink is made of aluminum, alumina, thermal conductive ceramic, thermal conductive injection material, etc., and an insulation layer is formed thereon, according to the current, resistance, and characteristics of the circuit. After forming a primary circuit pattern by coating conductive nanoparticles such as gold, silver, copper, and graphite, and again forming an insulating layer, a secondary pattern is formed, and then an insulating layer is formed on the circuit Glue the LED and its control elements with an adhesive, connect the electrodes with a conductive adhesive to complete the circuit and then reflect if necessary It describes the composition of the finished product by forming the plate by nano-particle coating method and mounting the cover optical module, the integrated manufacturing technique of the exterior and the heat sink, and the integrated manufacturing technique of the PCB and the related passive components.

Light emitting diode device and manufacturing method thereof (Publication No. 10-2004-0086871)

It aims to solve the heat problem, which is the biggest problem in the lifetime of LED lighting, and at the same time, to provide the technology to produce competitive LED lighting products by lowering the manufacturing cost in mass production.

[Figure 1] According to the manufacturing process of the product [Fig. 2] by manufacturing the product in the configuration method of the configuration diagram of the product to reduce the complicated process and material cost of separately manufacturing the case, PCB, parts, covers, etc. By shortening and increasing the heat dissipation efficiency, the temperature of the LED is lowered to extend the life.

LED ㅁ; c Competitive inventory through increased product lifespan, maximization of heat dissipation efficiency and reduction of manufacturing cost due to streamlined product manufacturing process

The exterior case and the material are determined in consideration of the design shape and heat dissipation efficiency, and accordingly, the mold is processed to form the exterior case. At this time, the material that can be used may be any material having good heat dissipation efficiency, such as aluminum, thermally conductive ceramics, alumina, thermally conductive injection molded products, copper, etc., which are general technical matters and are excluded from the claims of the present patent. If the material of the manufactured exterior case is a conductor, an insulating material is first applied, and if it is an insulator, the coating process is omitted. Before forming the insulating layer, oil and moisture on the area to be coated must be removed. In this case, the insulating material may be implemented as an oxide film through anodizing in the case of aluminum material, and in the case of other materials may be realized by applying an insulating coating agent of the "heat dissipation two-component polyurethane" series. When using two-component polyurethane-based insulation coating for heat dissipation, choose products with excellent adhesion and chemical resistance, insulation and heat dissipation, and do not exceed 30㎛ ~ 120㎛ coating thickness. Instead of the PCB pattern on the formed insulating layer, the conductive material (gold, silver, copper, carbon, etc.) is used as the primary material by using the material suitable for the characteristics or characteristics of the circuit to be implemented. The circuit pattern is applied and drawn by a nanoparticle printing method through a printing head having a fine nozzle. At this time, the thickness of the pattern varies depending on the type of paint and the thickness and density of the particles, but is about 30 μm to 100 μm. At this time, passive elements such as resistors or coils may be mounted in an equivalent pattern instead of directly inserted. By using this formation method, a metal thin film, which is a conventional PCB manufacturing process, is adhered to an insulator, and a pattern is formed by etching and etching to form a pattern. It is possible to print a pattern without using high speed printing equipment only. If the printing head is configured to move the printing head in three dimensions, the printing equipment can be formed on curved surfaces or various and complicated product surfaces. When the circuit is completed in the primary pattern, the secondary insulating layer is formed in the same manner as in (2) of FIG. When the secondary pattern is required, an insulating layer is formed on all portions except the pattern connection portion between the secondary pattern and the primary pattern. The secondary pattern layer is formed on the secondary insulating layer in the same manner as in (3) of FIG. This process can be omitted if only the primary pattern layer is needed. When the secondary pattern layer is formed, the tertiary insulating layer is formed in the same manner as in (4) of FIG. After inspecting the finished pattern for abnormalities, apply an insulator, except where the component will be mounted on the pattern, and apply a reflector if necessary. Adhesive is applied to the parts where necessary elements such as LEDs and ICs will be seated, and then the parts are adhered onto the pattern. Inspect the parts and patterns after connecting them with a conductive adhesive. Mount the optical cover or protective cover, perform an operation test and label it to identify the product. Pack the product with packaging materials to prevent damage. After packaging, the exterior of the package is labeled so that the product can be identified again.

The present invention has the effect of lowering the manufacturing cost and improving the quality in the mass production line of various products, such as lighting, signage, backlight using LED as a base technology for manufacturing, there is an industrial applicability.

1 is a manufacturing diagram of the product, looking at each term is as follows.

(1) Shape of appearance case

The appearance and the material are determined in consideration of the design shape and the heat dissipation efficiency, and accordingly, the mold is processed to form the appearance case. At this time, the material that can be used may be any material having good heat dissipation efficiency, such as aluminum, thermally conductive ceramics, alumina, thermally conductive injection molded products, copper, etc., which are general technical matters and are excluded from the claims of the present patent.

(2) forming the primary insulating layer

If the material of the manufactured exterior case is a conductor, an insulating material is first applied, and if it is an insulator, the coating process is omitted. Before forming the insulating layer, oil and moisture on the area to be coated must be removed. In this case, the insulating material may be implemented as an oxide film through anodizing in the case of aluminum material, and in the case of other materials may be realized by applying an insulating coating agent of the "heat dissipation two-component polyurethane" series. When using two-component polyurethane-based insulation coating for heat dissipation, choose products with excellent adhesion and chemical resistance, insulation and heat dissipation, and do not exceed 30㎛ ~ 120㎛ coating thickness.

(3) forming the primary pattern layer

Instead of the PCB pattern on the formed insulating layer, the conductive material (gold, silver, copper, carbon, etc.) is used as the primary material by using a material suitable for the characteristics or characteristics of the circuit to be implemented. The circuit pattern is applied and drawn by a nanoparticle printing method through a printing head having a fine nozzle. At this time, the thickness of the pattern varies depending on the type of paint and the thickness and density of the particles, but is about 30 μm to 100 μm. At this time, passive elements such as resistors or coils may be mounted in an equivalent pattern instead of directly inserted. By using this formation method, a metal thin film, which is a conventional PCB manufacturing process, is adhered to an insulator, and a pattern is formed by etching and etching to form a pattern. It is possible to print a pattern without using high speed printing equipment only. If the printing head is configured to move the printing head in three dimensions, the printing equipment can be formed on curved surfaces or various and complicated product surfaces.

(4) secondary insulation layer formation

When the circuit is completed in the primary pattern, the secondary insulating layer is formed in the same manner as in (2) of FIG. When the secondary pattern is required, an insulating layer is formed on all portions except the pattern connection portion between the secondary pattern and the primary pattern.

(5) secondary pattern layer formation

The secondary pattern layer is formed on the secondary insulating layer in the same manner as in (3) of FIG. This process can be omitted if only the primary pattern layer is needed.

(6) Create tertiary insulation layer

When the secondary pattern layer is formed, the tertiary insulating layer is formed in the same manner as in (4) of FIG. After inspecting the finished pattern for abnormalities, apply an insulator, except where the component will be mounted on the pattern, and apply a reflector if necessary.

(7) parts attachment

Adhesive is applied to the parts where necessary elements such as LEDs and ICs will be seated, and then the parts are adhered onto the pattern.

(8) electrode connection

Inspect the parts and patterns after connecting them with a conductive adhesive.

(9) With optical cover

Mount the optical cover or protective cover and perform the operation test.

(10) labeling

Label the product to identify it.

11 packing

Pack the product with packaging materials to prevent damage. After packaging, the exterior of the package is labeled so that the product can be identified again.

2 is a block diagram of the product, looking at each term is as follows.

(20) Optical or protective cover

It is a component that is designed and installed according to its needs and uses such as color rendering and distribution, condensing, and magnification of light that protects and emits internal components of the product, and can be generally classified into a transparent, translucent, and opaque series. ] Are the parts to be assembled by attaching the optical cover. As a material to be used, various materials such as polycarbonate (PC), acrylic (Acric), and the like, glass (Glass) and quartz (Quartz) may be used.

(21) LED & Surface Mount Parts

As LEDs and surface-mounted components that control them, LEDs are the main elements that emit light, and surface-mounted components drive or assist in driving the LEDs. These components have their specifications determined according to the application and the circuit design of the circuit.

(22) tertiary insulation layer

As a final insulating layer before component mounting, a reflective layer such as silver, silver oxide, nickel, or the like may be further applied if necessary. Insulating materials can be realized by anodizing through anodizing in the case of aluminum, and in the case of other materials can be realized by applying an insulating coating agent of the "heat dissipation two-component polyurethane" series. When using two-component polyurethane-based insulation coating for heat dissipation, choose products with excellent adhesion and chemical resistance, insulation and heat dissipation, and do not exceed 30㎛ ~ 120㎛ coating thickness.

(23) secondary pattern layer

This is a layer that can be created when a multi-layer circuit pattern is needed. Instead of the PCB pattern on the secondary insulating layer, conductive paints (gold, silver, copper, carbon, etc.) Using a raw material suitable for the nature or characteristics of the circuit), the primary circuit pattern is applied by the nanoparticle printing method through the printing head having a fine nozzle. At this time, the thickness of the pattern varies depending on the type of paint and the thickness and density of the particles, but is about 30 μm to 100 μm.

(24) secondary insulation layer

As a layer that can be produced when a multi-layered circuit pattern is needed, an insulating material is applied to the layer to be evenly applied, leaving only the pattern portion to be connected to the secondary pattern layer on the primary pattern layer. At this time, the insulating coating agent which can be used is a two-component polyurethane type insulating coating agent for heat dissipation, and its coating thickness is within 30㎛ ~ 120㎛.

25 primary pattern layers

Instead of the PCB pattern on the insulating layer, a primary circuit using a conductive paint (using raw materials suitable for the characteristics or characteristics of the circuit to be implemented, such as gold, silver, copper, and carbon) The pattern is applied and drawn by a nanoparticle printing method through a printing head having a micronozzle. At this time, the thickness of the pattern varies depending on the type of paint and the thickness and density of the particles, but is about 30 μm to 100 μm.

(26) Primary insulation layer

An insulating layer first applied onto the exterior case, which is necessary only when the base portion on which the components of the exterior case are to be mounted is a conductor or a semiconductor. Before forming the insulating layer, oil and moisture on the area to be coated must be removed. In this case, the insulating material may be implemented as an oxide film through anodizing in the case of aluminum material, and in the case of other materials may be realized by applying an insulating coating agent of the "heat dissipation two-component polyurethane" series. When using two-component polyurethane-based insulation coating for heat dissipation, choose products with excellent adhesion and chemical resistance, insulation and heat dissipation, and do not exceed 30㎛ ~ 120㎛ coating thickness.

(27) Exterior case

It constitutes the appearance of the product, and can be used in a variety of materials depending on the design, function, use, etc., but should be made of a material having excellent heat dissipation performance, since it must basically include a heat dissipation function. In this case, any material having good heat dissipation efficiency, such as aluminum, thermally conductive ceramics, alumina, thermally conductive injections, and copper, may be used, which is a general technical matter.

Claims

In the LED lighting that the LED and the surface-mounting component for controlling the LED is bonded to the pattern layer in which the circuit pattern is formed,

An exterior case having a heat dissipation function for the LED;

Primary insulation is formed by anodizing the upper surface of the exterior case, which is a conductor, by an anodizing film formed on the upper surface of the exterior case, or by applying an insulating coating agent of a two-component polyurethane-based heat dissipation coating on the upper surface of the exterior case. layer;

A primary pattern on which a circuit pattern is formed while a conductive paint containing any one material of gold (Au), silver (Ag), copper (Cu), or carbon (C) is applied to the upper surface of the primary insulating layer. layer;

An upper surface of the primary pattern layer is anodized and formed through an oxide film formed on the upper surface of the primary pattern layer, or a heat dissipating two-component polyurethane-based insulating coating agent is applied to the upper surface of the primary pattern layer, A secondary insulating layer formed on the primary pattern layer except for the component electrode provided in the primary pattern layer;

On the upper surface of the secondary insulating layer, a conductive pattern containing any one material of gold (Au), silver (Ag), copper (Cu) or carbon (C) is applied, the secondary pattern is formed a circuit pattern layer;

An upper surface of the secondary pattern layer is anodized and formed through an oxide film formed on the upper surface of the secondary pattern layer, or a heat dissipating two-component polyurethane-based insulating coating agent is applied to the upper surface of the secondary pattern layer, A tertiary insulating layer formed on the secondary pattern layer except for the component electrodes provided on the secondary pattern layer; And

The upper surface of the tertiary insulating layer is LED lighting integrating the exterior, heat sink and printed circuit further comprising a reflective layer formed by applying a reflective material.

The method of claim 1,

The exterior, heat dissipation plate and the heat-resistant two-component polyurethane-based insulation coating agent in one or more of the primary insulation layer, the secondary insulation layer or the tertiary insulation layer is applied to a thickness of 30㎛ ~ 120㎛ LED lighting integrated printed circuit.

The method of claim 1,

LED lighting incorporating an exterior, a heat sink and a printed circuit, wherein the conductive paint is applied to at least one of the primary pattern layer and the secondary pattern layer in a thickness of 30 μm to 100 μm.

In the LED lighting manufacturing method in which the LED and the surface-mounting component for controlling the LED is bonded to the pattern layer on which the circuit pattern is formed,

Manufacturing an exterior case having a heat dissipation function for the LED (1);

Primary insulation is formed by anodizing the upper surface of the exterior case, which is a conductor, by an anodizing film formed on the upper surface of the exterior case, or by applying an insulating coating agent of a two-component polyurethane-based heat dissipation coating on the upper surface of the exterior case. Forming a layer (2);

On one of the upper surface of the outer case or the upper surface of the primary insulating layer, a conductive paint containing any one material of gold (Au), silver (Ag), copper (Cu) or carbon (C) is applied (3) forming a primary pattern layer on which a circuit pattern is formed;

An upper surface of the primary pattern layer is anodized and formed through an oxide film formed on the upper surface of the primary pattern layer, or a heat dissipating two-component polyurethane-based insulating coating agent is applied to the upper surface of the primary pattern layer, Forming a secondary insulating layer formed on the primary pattern layer except for the component electrode provided in the primary pattern layer (4);

On the upper surface of the secondary insulating layer, a conductive pattern containing any one material of gold (Au), silver (Ag), copper (Cu) or carbon (C) is applied, the secondary pattern is formed a circuit pattern Forming a layer (5); And

An upper surface of the secondary pattern layer is anodized and formed through an oxide film formed on the upper surface of the secondary pattern layer, or a heat dissipating two-component polyurethane-based insulating coating agent is applied to the upper surface of the secondary pattern layer, Forming a tertiary insulating layer formed on the secondary pattern layer except for the component electrodes provided on the secondary pattern layer (6); And

Forming a reflective layer formed by coating a reflective material on an upper surface of the tertiary insulating layer; LED lighting manufacturing method incorporating an exterior, a heat sink and a printed circuit comprising a.