KR20210042682A - Led illuminating apparatus using three-dimensional printing process and method for manufacturing the same - Google Patents

Abstract

The present invention relates to an LED lighting device using three-dimensional printing and a method for manufacturing the same. Provided are an LED lighting device having a structure from which a printed circuit board (PCB) is removed, and a method for manufacturing the same. The LED lighting device comprises: a support body (10); a conductive circuit pattern (40) formed on the support body (10) and formed through three-dimensional printing; an LED package (20) and an LED driving element (30) installed on the conductive circuit pattern (40); and a protective layer (50) formed on the conductive circuit pattern (40) and formed through three-dimensional printing. In addition, provided are an LED lighting device and a method for manufacturing the same, wherein the LED lighting device comprises: a heat dissipating member (100); an engraved part (60) formed on the heat dissipating member (100); an insulation layer (45) formed on a seating surface (101) in the engraved part (60); a conductive circuit pattern (40) formed on the insulation layer (45) in the engraved part (60) and formed through three-dimensional printing; an LED package (20) and an LED driving element (30) inserted and installed on the engraved part (60) and installed on the conductive circuit pattern (40) in the engraved part (60); and a protective layer (50) formed on the conductive circuit pattern (40) and formed through three-dimensional printing. According to the present invention, at least the printed circuit board (PCB) is removed from the LED lighting device such that the number of components in the LED lighting device is reduced and a manufacturing process thereof is simplified, and the LED lighting device has excellent heat dissipating properties.

Description

LED lighting device using 3D printing and its manufacturing method {LED ILLUMINATING APPARATUS USING THREE-DIMENSIONAL PRINTING PROCESS AND METHOD FOR MANUFACTURING THE SAME}

The present invention relates to an LED lighting device and a manufacturing method thereof, by forming a circuit pattern using 3D printing (Three-Dimensional Printing) according to one embodiment, at least a printed circuit board (PCB) is removed, the number of parts and The manufacturing process is simplified, and the present invention relates to an LED lighting device and a manufacturing method thereof using 3D printing with improved heat dissipation and the like.

A lighting device using a light emitting diode ("LED") consumes less power, has long life characteristics and eco-friendliness. Accordingly, LED lighting devices using LEDs are widely used not only in general buildings, but also in almost all industrial fields such as automobiles and aircraft, and their demand is increasing.

1 is a cross-sectional view showing a schematic view of an LED lighting device according to the prior art. In general, an LED lighting device includes a printed circuit board (PCB) 1, an LED package 2 mounted (fixed) on the printed circuit board (PCB) 1, and an LED driving element (not shown). It has an LED module that includes. The LED package 2 includes an LED light source (such as an LED chip), and the LED driving element is composed of components for driving the LED package 2. At this time, in most conventional LED modules, the LED package 2 and the LED driving element are electrically connected to each other through soldering (SMT) or wire bonding, and fixed on the printed circuit board (PCB) 1. It is becoming modular. In Fig. 1, reference numeral 2a is an LED light source, 2b is an electrode, and 2c is a conductive adhesive layer.

In addition, the LED lighting device includes an optical lens 4 for distributing light emitted from the LED package 2 or a heat dissipation member (or heat) for dissipating (air cooling) heat emitted from the LED package 2, depending on the product. Sink) (5), etc. In general, the heat dissipation member 5 includes a heat dissipation plate 5a on a flat plate, which has a structure in which the heat dissipation fin 5b extends under the heat dissipation plate 5a depending on the product, or in some cases, the heat dissipation fin 5b ) Has a structure in which a through hole for ventilation through which air passes is formed. In addition, the LED lighting device may include a case (or housing) for protecting and embedding the components.

For example, Korean Patent Laid-Open No. 10-2015-0060499, Korean Patent Laid-Open No. 10-2016-0106431, Korean Patent No. 10-1689592, Korean Patent No. 10-1870596, and Korean Patent No. 10- In 1980584, etc., the technology related to the above is presented.

However, the LED lighting device according to the prior art has the following problems, for example.

First, there are many parts and assembly processes. Referring to FIG. 1, in general, in manufacturing (assembling) a conventional LED lighting device, a printed circuit board (PCB) 1, an LED package 2, and an LED driving element are separately manufactured and prepared. Then, a conductive circuit pattern 3 is formed on the printed circuit board (PCB) 1, and then the LED package 2 and the LED driving element are attached to the circuit pattern 3 of the printed circuit board (PCB) 1. It is modularized by connecting and fixing through soldering or wire bonding. In addition, a conductive adhesive layer 2c is formed between the printed circuit board (PCB) 1 and the electrode 2b of the LED package 2, and the printed circuit board (PCB) 1 and the heat dissipating member 5 A heat conductive layer 6 is formed between the heat sinks 5a.

Accordingly, the LED lighting device according to the prior art has a large number of components including at least a printed circuit board (PCB) 1, and a bonding process such as soldering or wire bonding as well as a manufacturing process of a printed circuit board (PCB), There is a problem in that the manufacturing process is complicated because a process of forming the conductive adhesive layer 2c and a process of forming the thermally conductive layer 6 are required.

In addition, in the LED lighting device according to the prior art, the shape of the LED module is determined by the printed circuit board (PCB) 1, so the size and design of the LED module are limited, and the shape or bonding of the heat dissipating member 5 is also limited. Is following this. Additionally, the LED lighting device according to the prior art has a printed circuit board (PCB) 1 disposed between the LED package 2 and the heat dissipating member 5 for structural and morphological reasons, so that the LED package 2 and Since the heat dissipation member 5 is not in direct contact, there is a problem in that heat dissipation is poor.

Korean Patent Application Publication No. 10-2015-0060499 Korean Patent Application Publication No. 10-2016-0106431 Korean Patent Registration No. 10-1689592 Korean Patent Registration No. 10-1870596 Korean Patent Registration No. 10-1980584

Accordingly, an object of the present invention is to provide an improved LED lighting device and a method of manufacturing the same.

According to an embodiment of the present invention, by forming a circuit pattern using 3D printing (Three-Dimensional Printing), at least a printed circuit board (PCB) is removed to reduce the number of parts and manufacturing processes, and the LED lighting device thereof. It is an object to provide a manufacturing method.

In addition, an object of the present invention is to provide a highly heat-dissipating LED lighting device and a method of manufacturing the same, wherein the LED module is compact and heat dissipation is improved through structural and morphological improvement of the LED module.

In order to achieve the above object, the present invention,

Support;

A conductive circuit pattern formed on the support and formed through 3D printing;

An LED package and an LED driving element installed on the conductive circuit pattern; And

Doedoe formed on the conductive circuit pattern, it provides an LED lighting device including a protective layer formed through 3D printing.

In addition, the present invention,

Heat dissipation member;

An intaglio formed on the heat dissipating member;

An insulating layer formed on the seating surface in the intaglio;

A conductive circuit pattern formed on the insulating layer in the intaglio and formed through 3D printing;

An LED package and an LED driving element inserted into the intaglio and installed on the conductive circuit pattern in the intaglio; And

Doedoe formed on the conductive circuit pattern, it provides an LED lighting device including a protective layer formed through 3D printing.

In addition to this, the present invention,

Preparing a heat dissipation member having an intaglio formed thereon;

Forming an insulating layer on the seating surface in the intaglio;

Forming a conductive circuit pattern through 3D printing, which is formed on the insulating layer in the intaglio;

Inserting and installing in the intaglio, but installing an LED package and an LED driving element on the conductive circuit pattern in the intaglio; And

It is formed on the conductive circuit pattern, it provides a method of manufacturing an LED lighting device comprising the step of forming a protective layer through 3D printing.

According to the present invention, an improved LED lighting device and a method of manufacturing the same are provided. According to the present invention, according to one embodiment, a circuit pattern is formed through three-dimensional printing and at least a printed circuit board (PCB) is removed, thereby reducing the number of parts and manufacturing processes.

In addition, according to the present invention, the components constituting the LED lighting device are arranged in a compact structure, and the LED package and the heat dissipating member are directly in contact with each other to have excellent heat dissipation properties. Additionally, according to the present invention, the light efficiency (light reflectivity) is improved.

1 is a cross-sectional view of an LED lighting device according to the prior art.
2 is a cross-sectional view for explaining a manufacturing process of the LED lighting device according to the first embodiment of the present invention.
3 is a perspective view for explaining the manufacturing process of the LED lighting device according to the first embodiment of the present invention, which shows a 3D printing process.
4 is a plan view for explaining the manufacturing process of the LED lighting device according to the second embodiment of the present invention.
5 is a cross-sectional view showing a main part of an LED lighting device according to a second embodiment of the present invention.
6 is a cross-sectional view showing a main part of an LED lighting device according to a second embodiment of the present invention.

The term "and/or" used in the present invention is used to mean including at least one or more of the components listed before and after. The term "one or more" used in the present invention means one or two or more pluralities. The terms “first”, “second”, “one side” and “the other side” used in the present invention are used to distinguish one component from other components, and each component is included in the above terms. Is not limited by.

In addition, the terms "form on the top", "form on the top (top)", "form on the bottom (bottom)", "install on the top", "install on the top (top)" and "bottom ( "Installation on the lower side)" does not mean that the components are directly in contact with each other to form a stack (installation), but includes a meaning in which other components are further formed (installed) between the components. For example, "formed on" and "installed on" means that the second component is formed (installed) in direct contact with the first component, as well as the first component and the second component. It includes a meaning that a third component can be further formed (installed) between the elements.

Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. The accompanying drawings show exemplary embodiments of the present invention, which are provided only to aid understanding of the present invention. In the accompanying drawings, the thickness may be enlarged to clearly express each layer and region, and the scope of the present invention is not limited by the thickness, size, and ratio indicated in the drawings. In addition, in describing the embodiments of the present invention, detailed descriptions of related known general-purpose functions and/or configurations are omitted.

[First Embodiment]

The LED lighting device (or LED light emitting device) according to the present invention emits LED light (light), and its application fields and uses are not limited. The LED lighting device according to the present invention may be used (installed) in a general building as well as a vehicle or an aircraft, which is, for example, an LED lighting device for a vehicle, an LED lighting device using a battery, and/or a DC power source. It can be selected from LED lighting devices and the like.

2 is a cross-sectional view for explaining a manufacturing process of the LED lighting device according to the first embodiment of the present invention. And Figure 3 is a perspective view for explaining the manufacturing process of the LED lighting device according to the first embodiment of the present invention, Figure 3 (a) is a state in which the circuit pattern 40 is formed through 3D printing, and 3(b) shows a state in which the protective layer 50 is formed through 3D printing.

2 and 3, the LED lighting device according to the present invention includes a support 10, a conductive circuit pattern 40 formed on the support 10, and an LED installed on the conductive circuit pattern 40. It includes a package 20, an LED driving device 30, and a protective layer 50 formed on the conductive circuit pattern 40. In this case, the circuit pattern 40 and the protective layer 50 are formed through 3D printing.

The LED lighting device according to the present invention includes the above components 10, 20, 30, 40, 50 as an LED module, and one or a plurality of such LED modules. In addition, in each LED module, the number of the LED package 20 and the LED driving element 30 is not limited, and these 20 and 30 are each one or more electrically by the circuit pattern 40. Can be connected.

In addition, the manufacturing method of the LED lighting device according to the present invention, the steps of preparing a support (10); Forming a conductive circuit pattern 40 on the support 10 through 3D printing; Installing an LED package 20 and an LED driving device 30 on the conductive circuit pattern 40; And forming a protective layer 50 on the conductive circuit pattern 40 through 3D printing.

The LED lighting device according to the present invention is a structure in which a printed circuit board (PCB) used as an essential component in a conventional LED lighting device is removed, and the LED package 20 and the LED driving element ( 30) is mounted and fixed. That is, the support 10 has a function of a module body for modularizing an LED by replacing the existing printed circuit board (PCB). At this time, the support 10 is selected from a case (or housing) constituting an LED lighting device, an optical lens and/or a heat dissipation member 100 (see FIG. 4), etc., excluding a printed circuit board (PCB). .

Specifically, the present invention does not include a conventional printed circuit board (PCB) for mounting the LED package 20 and the LED driving element 30, and as a technical means to replace it, a case (or housing), an optical lens And/or that the LED package 20 and the LED driving element 30 are mounted on the support 10 itself selected from the heat dissipation member 100 and the like; A circuit pattern 40 is formed on the support 10 itself through a three-dimensional 3D printing process to electrically connect and fix the LED package 20 and the LED driving element 30, and three-dimensional There is technical significance in that the protective layer 50 is formed on the circuit pattern 40 through the 3D printing process to prevent disconnection and provide durability and strong bonding strength. A detailed manufacturing process will be described as follows.

First, the support 10 is prepared. The support 10 is selected from components other than a printed circuit board (PCB) among components of the LED lighting device. The support 10 constitutes an LED lighting device as described above, and is selected from a case (or housing) for an LED module, an optical lens and/or a heat dissipation member 100, and the like.

The material and shape of the support 10 are not limited. The support 10 may be selected from, for example, a metal material, a synthetic resin material, a ceramic material, a wood material, a stone material and/or a glass material. In one example, the support 10 may be selected from the heat dissipating member 100, which may be specifically selected from the heat dissipating member 100 made of a heat dissipating metal and/or ceramic. In addition, the support 10 may have a flat surface or a curved surface, and may have a shape such as a flat plate or any three-dimensional shape. According to one embodiment, the support 10 may have a flat plate shape having a predetermined thickness.

2 and 3 illustrate a plate-shaped support 10. Referring to FIG. 2, a conductive circuit pattern 40 is formed on the support 10 by using a 3D printing process. According to another embodiment, before forming the circuit pattern 40, a roughness 11 may be formed on the support 10 or an insulating layer 45 may be formed.

The irregularities 11 allow the insulating layer 45 and/or the circuit pattern 40 to be bonded to the support 10 with good bonding force, and may be formed through physical and/or chemical treatment. The irregularities 11 may be formed to have fine roughness through processing processes such as milling, polishing, corrosion, etching, laser etching, and/or NC (Numerical Control). As shown in FIG. 2, the unevenness 11 is formed on the surface of the support 10, but is preferably formed at least at the interface with the insulating layer 45 and/or the circuit pattern 40.

The insulating layer 45 is an optional configuration, which may be formed when the support 10 has conductivity. The insulating layer 45 is not particularly limited as long as it has insulating properties, and this is, for example, epoxy, polyimide, silicone, polyurethane (PU), polycarbonate (PC), polyester. (Polyester) and polydimethylsiloxane (Polydimethylsiloxane) may include at least one type of adhesion-insulating resin selected from. The method of forming the insulating layer 45 is not limited, and it may be formed by a general coating method. The insulating layer 45 may have a thickness of, for example, 0.01 μm to 100 μm, but is not limited thereto.

Next, a conductive circuit pattern 40 is formed on the support 10. In this case, when the insulating layer 45 is formed on the support 10, the circuit pattern 40 is formed on the insulating layer 45. When the support 10 itself has insulating properties and the insulating layer 45 is not required, a conductive circuit pattern 40 is formed on the irregularities 11 of the support 10.

The conductive circuit pattern 40 electrically connects an electrode of the LED package 20, a lead pad and/or a power pad of the LED driving element 30 to each other, which is 3D according to the present invention. Formed through printing. The circuit pattern 40 has various patterns. The circuit pattern 40 may have various shapes and sizes (thickness, width and width) according to the number, shape and size of the LED package 20 and the LED driving elements 30. Hereinafter, in describing the present invention, in some cases, the LED package 20 and the LED driving device 30 are referred to as components 20 and 30.

The 3D printing is, for example, PolyJET (Photopolymer Jetting Technology), MJF (multi jet fusion), DLP (Digital Light Processing), DMT (Direct Metal Tooling), FFF (Fused Filament Fabrication), MJM (Multi Jet Modeling), It may be selected from 3D printing processes such as Stereolithography Apparatus (SLA), Laminated Object Manufacturing (LOM), Fused Deposition Modeling (FDM), Selective Laser Melting (SLM), and/or 3D Projet.

According to one embodiment, the circuit pattern 40 may be formed by 3D printing a conductive material through the nozzle 210 of the 3D printing apparatus 200. In this case, the 3D printing apparatus 200 includes, for example, a receiving portion containing a conductive material, a nozzle 210 receiving a conductive material from the receiving portion and printing a circuit pattern 40, and the nozzle 210 It may include a three-dimensional movement unit (unit) to freely move in a three-dimensional space (xyz direction), and a control unit that controls the three-dimensional movement unit. The control unit controls the 3D moving unit according to the arrangement position of each component 20, 30, or controls the 3D moving unit according to the pattern information designed (input) in advance to control the circuit pattern ( 40) can be formed. Additionally, the 3D printing apparatus 200 may include a curing unit for curing (or drying) the conductive material printed through the nozzle 210, and the curing unit is a heat source and/or an ultraviolet (UV) light source, etc. It may include.

In addition, the conductive material may be liquid or may have a paste formulation having a predetermined viscosity, and this is not particularly limited as long as it has electrical conductivity. The conductive material may include metal, carbon, and/or a conductive polymer. As the conductive material, for example, a conductive paste including metal particles such as silver (Ag) and/or copper (Cu) may be used, and the metal particles may have a nanometer (nm) size.

According to the present invention, the circuit pattern 40 can be freely formed regardless of the shape or arrangement position of the support 10 and each of the components 20 and 30 by 3D printing as described above. Specifically, according to the present invention, in the shape of the support 10 and each component 20, 30, these (10) (20) (30) are planar, curved, protruding and/or recessed. Even if it has a shape such as, it is possible to freely form the circuit pattern 40 by the 3D printing regardless of the shape. In addition, it is possible to form a circuit pattern 40 with high precision and freely adjustable width and thickness by the 3D printing. In this case, the circuit pattern 40 may have, for example, a width of 0.01 μm or more and a thickness of 0.01 μm or more. For a specific example, the circuit pattern 40 may have a width of 0.01 μm to 2 mm and a thickness of 0.01 μm to 1,000 μm, but is not limited thereto.

As shown in (a) of FIG. 2, after forming the circuit pattern 40 as above, each component 20 and 30 is installed on the circuit pattern 40. That is, the LED package 20 and the LED driving device 30 are installed on the conductive circuit pattern 40 to be electrically connected. For example, an electrode of the LED package 20 and a lead pad of the LED driving element 30 are brought into contact with the circuit pattern 40 so that the components 20 and 30 are electrically energized.

In addition, in some cases, the LED package 20 and the LED driving element 30 may be attached and fixed to the circuit pattern 40 through a conductive adhesive. The said conductive adhesive is transparent, for example. The conductive adhesive may be selected from solder or conductive polymer. And the conductive polymer may include, for example, polyaniline, polypyrrole and/or polythiophene. The conductive adhesive may be used for the purpose of temporarily fixing or completely fixing the LED package 20 and the LED driving element 30 to the circuit pattern 40 before forming the protective layer 50.

The LED package 20 and the LED driving element 30 may be configured as usual, and these are not particularly limited. The LED package 20 includes an LED light source and an electrode. The LED package 20 may be packaged in a structure that further includes a driver IC, a protection chip, and/or a constant current chip, in addition to an LED light source and an electrode. The LED driving device 30 is a component device for driving the LED package 20, and may include, for example, a device such as a capacitor, a transistor, and/or a resistor. In addition, the LED driving device 30 may include a driver IC, a protection chip, and/or a constant current chip.

Next, a protective layer 50 is formed on the circuit pattern 40. 3B illustrates a state in which the protective layer 50 is formed through 3D printing. The protective layer 50 may be formed at least in a width (width) capable of covering the circuit pattern 40 to protect the circuit pattern 40. According to another embodiment, the protective layer 50 covers at least the circuit pattern 40, but in addition to this, the width (width ). That is, among the externally exposed surfaces of the LED package 20 and the LED driving element 30, the protective layer 50 may be formed on a partial surface (side) or the protective layer 50 may be formed on the entire surface. In addition, the protective layer 50 may be formed on the surface of the circuit pattern 40 and/or the components 20 and 30 as well as over a part or the entire area of the surface of the support 10.

The material of the protective layer 50 is not particularly limited as long as it can protect the circuit pattern 40 and the components 20 and 30 from external physical and chemical impacts. The protective layer 50 is transparent, and may have adhesiveness and insulation. The protective layer 50 may include an adhesive and insulating transparent resin, for example, epoxy, polyimide, silicone, polyurethane (PU), polycarbonate (PC) , Polyester, polydimethylsiloxane, and the like, at least one adhesive-insulating resin may be included.

By the protective layer 50 as described above, at least the circuit pattern 40 and/or the components 20 and 30 are protected from the outside. In addition, the support 10 and the components 20 and 30 have a strong bonding force due to the adhesion of the protective layer 50.

As shown in (b) of FIG. 3, the protective layer 50 may be formed through 3D printing. That is, as described with the circuit pattern 40, the protective layer 50 may also be formed by 3D printing the adhesive-insulating resin through the nozzle 210 of the 3D printing apparatus 200. The protective layer 50 is formed through 3D printing, and may have a thickness of 1,000 μm or less, for example, 0.01 μm to 1,000 μm, for example.

On the other hand, according to another embodiment of the present invention, before installing each of the components 20 and 30, the protective layer 50 may be formed first. This is as follows with reference to (b) of FIG. 2.

Referring to (b) of FIG. 2, after forming the circuit pattern 40 on the insulating layer 45 through 3D printing as described above, a protective layer 50 is formed around the circuit pattern 40. can do. That is, the protective layer 50 may be formed on and around the side surfaces of the circuit pattern 40 except for portions where the components 20 and 30 are to be installed. In this way, after first forming the protective layer 50, each of the components 20 and 30 is installed in a portion where the components 20 and 30 are to be installed. In this case, for example, the entire manufacturing process can be monotonous. Specifically, both the circuit pattern 40 and the protective layer 50 are continuously performed in the production line for surface treatment (corrugation and insulation treatment, etc.) of the support 10 and 3D printing, and then production for semiconductor chip assembly. The whole process can be monotonous because the parts 20 and 30 can be assembled on the line.

Hereinafter, an LED lighting device according to a second embodiment of the present invention and a method of manufacturing the same will be described with reference to FIGS. 4 to 6. In describing the second embodiment of the present invention, terms and reference numerals used in the same manner as in the first embodiment represent the same functions, and thus detailed descriptions thereof will be omitted. In addition, if there are parts that are not specifically described below, these are the same as those described in the first embodiment.

[Second Embodiment]

4 is a plan view for explaining a manufacturing process of the LED lighting device according to the second embodiment of the present invention. And Figures 5 and 6 are cross-sectional views showing an LED lighting device and a manufacturing process thereof according to a second embodiment of the present invention, Figure 5 is a state of the LED driving device 30, Figure 6 is an LED package 20 It showed the appearance of.

4 to 6, according to this embodiment, the support 10 has an intaglio 60 formed therein. In addition, the support 10 may be selected from the heat dissipation member 100.

The LED lighting device according to the present embodiment includes a heat dissipation member 100; An intaglio 60 formed on the heat dissipation member 100; An insulating layer 45 formed on the seating surface 101 in the intaglio 60; A conductive circuit pattern 40 formed on the insulating layer 45 in the intaglio 60 and formed through 3D printing; Doedoe inserted into the intaglio 60, the LED package 20 and the LED driving element 30 installed on the conductive circuit pattern 40 in the intaglio 60; And a protective layer 50 formed on the conductive circuit pattern 40 and formed through 3D printing.

In addition, the manufacturing method of the LED lighting device according to the present embodiment, the steps of preparing a heat dissipation member 100 in which the intaglio 60 is formed; Forming an insulating layer 45 on the seating surface 101 in the intaglio 60; Forming a conductive circuit pattern 40 through 3D printing, which is formed on the insulating layer 45 in the intaglio 60; Inserting and installing the intaglio 60, but installing the LED package 20 and the LED driving element 30 on the conductive circuit pattern 40 in the intaglio 60; And forming the protective layer 50 on the conductive circuit pattern 40 through 3D printing.

According to this embodiment, the heat dissipation member 100 has an original function as the heat dissipation member 100 by replacing the existing printed circuit board (PCB), and the heat dissipation member 100 itself is a module for LED moduleization. It has the function of the body. The LED lighting device according to the present embodiment has a compact structure and excellent heat dissipation.

The LED lighting device according to the present embodiment will be described through a manufacturing process as follows. 4(a) is a plan view showing a state in which an intaglio 60 is formed on the heat dissipation member 100, and FIG. 4(b) is a plan view showing a state in which an insulating layer 45 is formed in the intaglio 60, 4B is a plan view showing a circuit pattern 40 formed on the insulating layer 45 in the intaglio 60. And Figure 4 (d) is a plan view showing a state in which the LED package 20 and the LED driving element 30 are inserted and installed on the circuit pattern 40 in the intaglio 60, and Figure 4 (e) is an LED A plan view showing a state in which the protective layer 50 is formed on the package 20 and the LED driving device 30.

Referring to FIG. 4, first, a heat dissipation member 100 is prepared. The heat dissipation member 100 is not particularly limited as long as it has heat dissipation. The heat dissipation member 100 may include a flat heat dissipation plate 112 having a predetermined thickness. In addition, the heat dissipation member 100 may include a heat dissipation plate 112 and may include a heat dissipation fin structure (not shown) formed under the heat dissipation plate 112. The heat dissipation member 100 is formed on the heat dissipation plate 112 and/or the heat dissipation fin, and may have a structure in which a through hole for ventilation through which outside air passes is formed. The heat dissipation member 100 is, for example, a metal material, and may be made of a material such as aluminum (Al), copper (Cu), and/or an alloy thereof (Al alloy or Cu alloy), for example.

The heat dissipation member 100 includes an intaglio 60. That is, one or two or more intaglios 60 are formed on the heat sink 112 of the heat radiation member 100. Components such as the LED package 20 and the LED driving device 30 are inserted and installed in the intaglio 60. The intaglio 60 may have various shapes and sizes (depth, width, width), etc. according to the number, shape and size of the LED package 20 and the LED driving elements 30.

The heat dissipation member 100 has a space in which the LED package 20 and the LED driving element 30 can be inserted by the formation of the intaglio 60 as described above, and an inner wall surface formed in the lateral direction of the intaglio 60 It may have (102) and a seating surface (101) formed in the lower surface direction of the intaglio (60). In addition, the bottom portion 111 may have a predetermined thickness T1. In this case, the bottom part 111 may have a thickness T1 of 50 μm or more, for example, and may have a thickness T1 of 50 μm to 1,000 μm, for example, but is not limited thereto. .

The intaglio 60 may have a greater depth than the thickness of the LED package 20 and the LED driving device 30. For example, the intaglio 60 may have a depth obtained by adding about 0.01 μm to 1,000 μm to the thickness of the parts 20 and 30. That is, in FIG. 5, reference numeral T2 may be about 0.01 µm to 1,000 µm as an extra depth, and specifically, the depth extra T2 may be about 20 µm to 500 µm. In addition, the width or width of the intaglio 60 may be formed larger than the width or width of the corresponding parts 20 and 30. At this time, the components 20 and 30, that is, the LED package 20 and the LED driving element 30, the inner wall surface 102 of the heat dissipation member 100 and the tolerance (D) (see Fig. 5). It can be inserted and installed in the intaglio 60. The intaglio 60 may have a width or width in which, for example, a tolerance D of about 10 μm to 100 μm can be formed between the inner wall surface 102 and the parts 20 and 30. .

The intaglio 60 may be formed during a molding process (eg, injection molding, etc.) of the heat dissipating member 100 when manufacturing the heat dissipating member 100, or may be formed through a separate cutting process. The intaglio 60 may be formed through a cutting process using, for example, a drill or a laser. The intaglio 60 may be variously formed according to the number, shape and size of the LED package 20 and the LED driving elements 30. The intaglio 60 may include at least one package intaglio 62 into which the LED package 20 is inserted and installed, and at least one device intaglio 63 into which the LED driving device 30 is inserted and installed. .

After preparing the heat dissipation member 100 on which the intaglio 60 is formed as above, a circuit pattern 40 is formed on the seating surface 101 of the portion where the intaglio 60 is formed. According to another embodiment, the unevenness 11 and/or the insulating layer 45 may be formed on the seating surface 101 before the circuit pattern 40 is formed. The irregularities 11 and the insulating layer 45 are as described in the first embodiment. 4 to 6 illustrate a state in which the insulating layer 45 is formed on the seating surface 101 in the intaglio 60 and the circuit pattern 40 is formed on the insulating layer 45.

After the circuit pattern 40 is formed, the components 20 and 30 are inserted and installed on the circuit pattern 40 in the intaglio 60. Specifically, the LED package 20 is inserted and installed on the circuit pattern 40 in the package intaglios 60 and 62, and the LED driving element ( 30) is inserted and installed. In this case, in some cases, a conductive adhesive may be coated between the parts 20, 30 and the intaglios 60, 62, and 63 to be attached and fixed.

In addition, referring to FIG. 6, the LED package 20 may further include a light reflection layer 140. Specifically, the light reflection layer 140 may be formed on the package intaglios 60 and 62 into which the LED package 20 is inserted and installed. At this time, as shown in Figure 6, the heat dissipation member 100 has a seating surface 101 and an inner wall surface 102 formed by the intaglio 60, 62, the inner wall surface 102 is an inclined surface It can be composed of 103. The package intaglios 60 and 62 may have a cross section that is expanded toward an upper side. In the case of having such an enlarged cross section, the LED light may be diffused.

The light reflection layer 140 may reflect the LED light emitted from the LED package 20 to improve light efficiency. As shown in FIG. 6, the light reflection layer 140 may be formed on the surfaces of the seating surface 101 and the inclined surface 103. In addition, the insulating side 45 and the circuit pattern 40 may be formed on the light reflecting layer 140. The light reflective layer 140 may be formed by physical and/or chemical methods, and may be formed by surface treatment by methods such as polishing, sanding, coating, plating, anodizing and/or etching, for example. According to one embodiment, the light reflection layer 140 may be formed by coating a light reflection material selected from metal particles, ceramic particles, and/or colored pigments, etc., for example, silver (Ag) for high light efficiency. It can be formed by coating.

Next, after inserting and installing the corresponding parts 20 and 30 in each of the intaglios 60, 62 and 63, a protective layer ( 50). As described above, the protective layer 50 is formed to cover at least the circuit pattern 40. According to another embodiment, the protective layer 50 may also be formed on the surfaces of the components 20 and 30 and/or the heat dissipation member 100. By this protective layer 50, the circuit pattern 40 and/or the components 20 and 30 are protected from the outside, and the bonding force between the heat dissipating member 100 and the components 20 and 30 may be improved.

In addition, referring to FIG. 5, the protective layer 50 may be formed within a tolerance D formed between the inner wall surface 102 and the components 20 and 30. Specifically, the adhesive-insulating resin forming the protective layer 50 may be applied not only to the surface of the circuit pattern 40 and/or the parts 20, 30, but also inserted and formed in the tolerance (D). have. Accordingly, the buried layer 52 extending from the protective layer 50 is formed in the tolerance D. In this case, the bonding force between the heat dissipating member 100 and the components 20 and 30 is reinforced by the adhesive protective layer 50 to have a solid assembly structure.

According to this embodiment, the intaglio 60 is formed in the heat dissipation member 100 as above, and the circuit pattern 40, the LED package 20, and the LED driving element 30 are inserted into the intaglio 60. In this case, while the LED package 20 and the LED driving element 30 are protected from the outside, disconnection of the circuit pattern 40 electrically connecting the components 20 and 30 can be effectively prevented. In addition, by the intaglio 60, the LED package 20 and the LED driving element 30 are modularized into a structure in which the heat dissipating member 100 is inserted, so that the compact of the LED module is achieved. In addition, the LED package 20 is in close contact with the heat dissipating member 100 in the intaglio 60 as close as possible, so that excellent heat dissipation is achieved.

Additionally, after the protective layer 50 is formed, a coating layer (not shown) may be further formed. In this case, the coating layer may be formed on the protective layer 50 in a range that does not impair the light efficiency of the LED package 20. In one example, the coating layer may be selected from color layers, and the color layer may have the same/similar color as the color of the heat dissipating member 100. Such a color layer is in a range that does not impair the light efficiency (luminance, etc.) of the LED package 20, for example, except for the upper portion of the LED package 20, It may be formed on the protective layer 50 formed thereon.

On the other hand, the LED lighting device according to the present embodiment further includes an optical lens (not shown) installed on the LED package 20, or a case (not shown) for protecting and embedding each of the components. Can include.

According to the present invention described above, it has at least the following effects.

First, according to the present invention, as described above, the circuit pattern 40 is directly patterned through 3D printing on the support 10 such as the heat dissipation member 100 without using the conventional printed circuit board (PCB). ) Is formed, and the LED package 20 and the LED driving element 30 are mounted and fixed to the heat dissipating member 100 itself, and at least the printed circuit board (PCB) is removed, reducing the number of parts and the manufacturing process. In addition, the circuit pattern 40 is formed by 3D printing, which enables a free three-dimensional shape, thereby simplifying the process.

In addition, according to the present invention, the size or design of the LED module is non-limiting and has an effect of implementing a concise design. Specifically, the printed circuit board (PCB) is removed, and the circuit pattern 40 is formed through 3D printing, so that various and concise designs can be implemented regardless of the size or shape of the supports 10 and 100.

In addition, according to the present invention, an intaglio 60 is formed on the support 10 and 100, and the circuit pattern 40, the LED package 20, and the LED driving element 30 are inserted into the intaglio 60. , Is installed, while the respective components 20, 30, 40 are protected from the outside by the intaglio 60, the LED package 20 and the LED driving element 30 are supported by the support 10 ( It is modularized into a structure inserted in 100), so that at least a compact of the LED module is achieved.

In addition, according to the present invention, it has an effect of improved heat dissipation compared to the prior art. In the conventional case, a printed circuit board (PCB) is disposed between the LED package and the heat dissipation member 5 (refer to FIG. 1), so that the LED package and the heat dissipation member 5 are not in direct contact, so heat dissipation is poor, according to the present invention. The printed circuit board (PCB) is removed, and the LED package 20 and the heat dissipating member are disposed at the shortest distance, thereby improving heat dissipation. Specifically, referring to FIG. 6, the LED package 20 is inserted into the intaglio 60, but is in close contact with the bottom portion 110 of the heat dissipating member 100 as close as possible, and thus has excellent heat dissipation.

Additionally, according to the present invention, the light efficiency is improved. Specifically, the intaglio 60 is formed on the support 10 and 100, and the LED package 20 is inserted into the intaglio 60, but the seating surface 101 and the inclined surface 103 in the intaglio 60 ) When the light reflective layer 140 is formed on it, light reflectivity and light condensation are improved to have excellent light efficiency.

10: support 20: LED package
30: LED driving element 40: circuit pattern
45: insulating layer 50: protective layer
60: intaglio 100: heat dissipation member
111: bottom part 112: heat sink
140: light reflection layer

Claims (4)

Support 10;
A conductive circuit pattern 40 formed on the support 10 and formed through 3D printing;
An LED package 20 and an LED driving element 30 installed on the conductive circuit pattern 40; And
Is formed on the conductive circuit pattern 40, including a protective layer 50 formed through 3D printing,
LED lighting device, characterized in that the printed circuit board (PCB) is removed.
The method of claim 1,
The support 10 is an LED lighting device, characterized in that the case constituting the LED lighting device, an optical lens or a heat radiation member (100).
A heat radiation member 100;
An intaglio 60 formed on the heat dissipation member 100;
An insulating layer 45 formed on the seating surface 101 in the intaglio 60;
A conductive circuit pattern 40 formed on the insulating layer 45 in the intaglio 60 and formed through 3D printing;
Doedoe inserted into the intaglio 60, the LED package 20 and the LED driving element 30 installed on the conductive circuit pattern 40 in the intaglio 60; And
Is formed on the conductive circuit pattern 40, including a protective layer 50 formed through 3D printing,
LED lighting device, characterized in that the printed circuit board (PCB) is removed.
Preparing the heat dissipation member 100 in which the intaglio 60 is formed;
Forming an insulating layer 45 on the seating surface 101 in the intaglio 60;
Forming a conductive circuit pattern 40 through 3D printing, which is formed on the insulating layer 45 in the intaglio 60;
Inserting and installing the intaglio 60, but installing the LED package 20 and the LED driving element 30 on the conductive circuit pattern 40 in the intaglio 60; And
It is formed on the conductive circuit pattern 40, the method of manufacturing an LED lighting device comprising the step of forming a protective layer 50 through 3D printing.

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