KR102646656B1 - Transparent light-emitting diode film - Google Patents

Abstract

A transparent light emitting diode film is disclosed. The transparent light emitting diode film of the present invention includes a base, an electrode layer positioned on the base and on which at least one pattern is formed, a pad formed on at least one part of the electrode layer, a light emitting diode positioned on the pad, and at least another part of the electrode layer. It includes a formed adhesive layer, wherein the electrode layer includes at least one of a common electrode connected to the plurality of light emitting diodes and an individual electrode connected to the one light emitting diode, and is formed in a plurality of lines spaced apart from each other. According to the present invention, the driving voltage of the light emitting diode can be lowered and power loss can be improved by using the anode and cathode mode common electrode of the electrode layer.

Description

Transparent light-emitting diode film {TRANSPARENT LIGHT-EMITTING DIODE FILM}

The present invention relates to a transparent light emitting diode film, and more specifically, to a transparent light emitting diode film that can lower the driving voltage of the light emitting diode and improve power loss by using the anode and cathode mode common electrode of the electrode layer.

Digital Shinage is a communication tool that advertisers can use for marketing, advertising, training, etc. to induce customer experience. It provides not only syntactic broadcast content in public places such as airports, hotels, and hospitals, but also advertising content intended by advertisers. It is a digital imaging device. Not only does it have a built-in processor and memory, but it is also portable and can clearly express various contents, so it can be used for various purposes such as promotional, customer service, and information media in department stores, subways, and bus stops. In addition, only advertising content is not necessarily provided through Digital Shinage, and various content with purposes other than advertising may be provided.

Digital Shiny generally uses multiple LEDs. LEDs have a long lifespan and high luminous efficiency, so they are used to replace conventional fluorescent lights and incandescent light bulbs. Additionally, because it is smaller than conventional light sources, it is receiving more attention as a lighting device.

The present invention aims to solve the above-mentioned problems and other problems. Another purpose is to provide a transparent light-emitting diode film that can lower the driving voltage of the light-emitting diode and improve power loss.

According to one aspect of the present invention to achieve the above or other objects, a base, an electrode layer located on the base and formed with at least one pattern, a pad formed on at least a portion of the electrode layer, a light emitting diode located on the pad, It includes an adhesive layer formed on at least another portion of the electrode layer, wherein the electrode layer includes at least one of a common electrode connected to the plurality of light emitting diodes and an individual electrode connected to the one light emitting diode, and a plurality of lines spaced apart from each other. Provides a transparent light emitting diode film formed on.

At least one of the common electrodes may be connected to the light emitting diodes on the plurality of lines.

The light emitting diode may include a plurality of LED chips having different colors, and an IC chip that drives and/or controls the plurality of LED chips.

The electrode layer may further include a communication electrode connected to the IC chip of the plurality of light emitting diodes.

The common electrode may include a first common electrode connected to one end of the light emitting diode, and a second common electrode connected to the other end of the light emitting diode.

At least one of the first common electrodes may be connected to the light emitting diodes on the plurality of lines.

The first common electrode may be a cathode and the second common electrode may be an anode.

The electrode layer located on the at least one line may be connected to the electrode layer located on another adjacent line.

The plurality of lines include first to third lines sequentially spaced apart from each other, and a portion where the electrode layers of the first line and the second line are connected is the electrode layer of the second line and the third line. It may be located on the opposite side of this connecting part.

The effects of the display device according to the present invention will be described as follows.

According to at least one of the embodiments of the present invention, the driving voltage of the light emitting diode can be lowered and power loss can be improved by using the anode and cathode mode common electrode of the electrode layer.

Further scope of applicability of the present invention will become apparent from the detailed description that follows. However, since various changes and modifications within the spirit and scope of the present invention may be clearly understood by those skilled in the art, the detailed description and specific embodiments such as preferred embodiments of the present invention should be understood as being given only as examples.

1 to 3 are diagrams showing the formation process of a transparent light emitting diode film according to an embodiment of the present invention.
4 and 11 are diagrams showing the shape of an electrode layer according to an embodiment of the present invention.
Figures 12 to 15 are diagrams showing the formation process of a transparent light emitting diode film according to an embodiment of the present invention.
16 to 18 are diagrams showing a transparent light emitting diode film according to an embodiment of the present invention.
19 to 21 are diagrams showing a plurality of transparent light emitting diode films according to an embodiment of the present invention.

Hereinafter, embodiments disclosed in the present specification will be described in detail with reference to the attached drawings. However, identical or similar components will be assigned the same reference numbers regardless of reference numerals, and duplicate descriptions thereof will be omitted. The suffixes “module” and “part” for components used in the following description are given or used interchangeably only for the ease of preparing the specification, and do not have distinct meanings or roles in themselves. Additionally, in describing the embodiments disclosed in this specification, if it is determined that detailed descriptions of related known technologies may obscure the gist of the embodiments disclosed in this specification, the detailed descriptions will be omitted. In addition, the attached drawings are only for easy understanding of the embodiments disclosed in this specification, and the technical idea disclosed in this specification is not limited by the attached drawings, and all changes included in the spirit and technical scope of the present invention are not limited. , should be understood to include equivalents or substitutes.

1 to 3 are diagrams showing the formation process of a transparent light emitting diode film according to an embodiment of the present invention.

As shown in FIG. 1, the base 110 of the transparent light emitting diode film 100 according to the present invention may first be prepared. The base 110 may include a very thin transparent material. For example, the thickness of the base 110 may be 250 μm.

The base 110 may include an insulating material. Accordingly, the power used to drive the light emitting diode may not leak to the outside. For example, the base 110 may include a PET (Polyethylene Terephthalate) film. Heat resistance can be strengthened by adjusting the thickness of the base 110. A PET film with the above-mentioned thickness may not change its state even at temperatures above 200 degrees. Accordingly, during the manufacturing process of the transparent light emitting diode film 100, the base 110 can be maintained stably without changing its state.

As shown in FIG. 2, an electrode layer 120 may be formed on the base 110. The electrode layer 120 may be a part that drives the light emitting diode on the transparent light emitting diode film 100.

The electrode layer 120 may be coated on the base 110. The electrode layer 120 may include metal nanowires. For example, the electrode layer 120 may include silver nanowires (Ag Nano Wire). Silver nanowires have high conductivity and can have excellent permeability.

As shown in FIG. 3, the electrode layer 120 may be formed with at least one pattern. For example, at least one pattern may be formed by irradiating a laser to the electrode layer 120. However, the present invention is not limited to this, and the electrode layer 120 may be formed using a mask and etching process or another process.

Since the electrode layer 120 has excellent transparency, the area where the pattern is formed may not be easily visible. Accordingly, the user can feel that the transparent light emitting diode film 100 has a neat appearance.

4 and 11 are diagrams showing the shape of an electrode layer according to an embodiment of the present invention.

As shown in FIG. 4, the electrode layer 120 may include a common electrode 122 and an individual electrode 124. The common electrode 122 may extend in the first direction. The common electrode 122 may be connected to one side of the plurality of light emitting diodes 140. The plurality of light emitting diodes 140 may be connected to the common electrode 122 at regular intervals. The common electrode 122 may be an anode electrode. Since the common electrode 122, which is an anode electrode, is connected to a plurality of light emitting diodes 140, wiring resistance can be minimized by improving the area of the common electrode 122.

The individual electrode 124 may be connected to the other side of the light emitting diode 140. Each light emitting diode 140 may be connected to a different individual electrode 124. That is, each individual electrode 124 may be spaced apart from each other at a certain distance, like the light emitting diode 140. The individual electrode 124 may be a cathode electrode.

Each individual electrode 124 can be driven and/or controlled through a constant current circuit. That is, this means that each light emitting diode 140 can be driven and/or controlled separately.

The common electrode 122 and the individual electrodes 124 may be formed in a plurality of lines (L1-L8). Each line may be positioned spaced apart from each other. Each line may include one common electrode 122 and a plurality of individual electrodes 124. Each line can be driven independently from each other. That is, light emitting diodes 140 located on different lines may have different common electrodes 122 as well as individual electrodes 124 connected to each other.

As shown in Figure 5, the size of the transparent light emitting diode film 100 can be freely adjusted by the user. That is, as shown in the drawing, when the space between at least one line of the transparent light emitting diode film 100 and an adjacent line is cut, the common electrode 122 and the individual electrode 124 of the light emitting diode 140 Operation and/or control may be maintained. That is, the operation of the common electrode 122 and the individual electrodes 124 can still be maintained in the cut portion of the transparent light emitting diode film 100 that is connected to the external circuit.

For example, as shown in (a) of FIG. 5, when the transparent light emitting diode film 100 is cut in the second direction, the left light emitting diode 140 connected to the external circuit is maintained in operation and/or control. It can be. In addition, since the common electrode 122 and the individual electrode 124 of the light emitting diodes 140 on the right side are maintained, operation and/or control of the light emitting diode 140 can be maintained when connected to an external circuit.

As another example, as shown in (b) of FIG. 5, when the transparent light emitting diode film 100 is cut in the first direction, the upper light emitting diodes 140 and the lower light emitting diodes 140 connected to the external circuit are All may remain in operation and/or control.

As shown in FIG. 6, the common electrode 122 may be connected to the light emitting diodes 140 on a plurality of lines (L1-L8). For example, one common electrode 122 may be connected to the light emitting diodes 140 of the first and second lines L1 and L2 at the same time. In this case, the common electrode 122 may be located between the light emitting diode 140 located on the first line (L1) and the light emitting diode 140 located on the second line (L2). That is, the light emitting diode 140 located in at least one line may use the same common electrode 122 as the light emitting diode 140 located in another adjacent line. The common electrode 122 may be disposed on the third to eighth lines (L3-L8) in the same manner as the first and second lines (L1 and L2).

In the transparent light emitting diode film according to the present invention, the common electrode 122 may be connected to light emitting diodes (L1-L8) on a plurality of lines. Accordingly, the common electrode 122 can be connected to more light emitting diodes, thereby increasing the area of the common electrode 122. That is, the resistance of the wiring can be minimized by improving the area of the common electrode 122.

As shown in FIG. 7, the light emitting diode 140 may be a color LED package. The color LED package may include a plurality of LED chips 140a, 140b, and 140c, each having a different color. For example, the light emitting diode 140 may include a red LED chip 140a, a green LED chip 140b, and a blue LED chip 140c. In this case, in order to control each LED chip (140a, 140b, 140c), an individual electrode 124 may be connected to each LED chip (140a, 140b, 140c). Accordingly, even if the anode is made of the common electrode 122, it may be difficult to reduce the gap between the light emitting diodes 140.

As shown in FIG. 8, the light emitting diode 140 according to the present invention may further include an IC chip 140d. The IC chip 140d can drive and/or control the R, G, and B LED chips 140a, 140b, and 140c. That is, the light emitting diode 140 can be controlled by the IC chip 140d rather than individual electrodes.

In the present invention, not only the anode electrode but also the cathode electrode may be composed of the common electrode 122. The common electrode 122, which is an anode electrode, may be a first common electrode 122a, and the common electrode 122, which is a cathode electrode, may be a second common electrode 122b. In this case, the electrode layer 120 may further include a communication electrode 125 for controlling the IC chip 140d. The communication electrode 125 may be connected in series to the IC chip 140d of each light emitting diode 140.

For example, the first common electrode 122a, the second common electrode 122b, and the communication electrode 125 may be formed in a plurality of lines L1-L8. Each line may be positioned spaced apart from each other. Each line may include one first common electrode 122a, a second common electrode 122b, and a communication electrode 125. Each line can be driven individually. That is, the first and second common electrodes 122a and 122b and the communication electrode 125 of the light emitting diodes 140 located on different lines may be different from each other.

As shown in FIG. 9, the first common electrode 122a may be connected to the light emitting diodes 140 on the plurality of lines L1-L8. For example, one first common electrode 122a may be simultaneously connected to the light emitting diodes 140 of the first and second lines L1 and L2. In this case, the first common electrode 122a may be located between the light emitting diode 140 located on the first line L1 and the light emitting diode 140 located on the second line L2. That is, the light emitting diode 140 located in at least one line may use the same first common electrode 122a as the light emitting diode 140 located in another adjacent line. The first common electrode 122a may be disposed on the third to eighth lines (L3-L8) in the same manner as the first and second lines (L1 and L2). One second common electrode 122b and one communication electrode 125 may be used for each line.

In the transparent light emitting diode film according to the present invention, the first common electrode (122a) may be connected to the light emitting diodes (L1-L8) on a plurality of lines. Accordingly, the first common electrode 122a can be connected to more light emitting diodes, thereby increasing the area of the first common electrode 122a. That is, the resistance of the wiring can be minimized by improving the area of the first common electrode 122a.

As shown in FIG. 10, the electrode layer 120 located on at least one line may be connected to the electrode layer 120 located on another adjacent line. For example, the other end of the electrode layer 120 located on the first line L1 and the other end of the electrode layer 120 located on the second line L2 may be connected. Additionally, one end of the electrode layer 120 located on the second line L2 and one end of the electrode layer 120 located on the third line L3 may be connected. The portion where the electrode layers 120 of the first line (L1) and the second line (L2) are connected may be located opposite to the portion where the electrode layers of the second line (L2) and the third line (L3) are connected. That is, the electrode layer 120 may alternately connect one end and the other end of the plurality of lines L1 to L8. In this case, there is an advantage that all light emitting diodes 140 can be driven through one external circuit.

As shown in FIG. 11, the size of the transparent light emitting diode film 100 can be freely adjusted by the user. That is, as shown in the drawing, when the space between at least one line of the transparent light emitting diode film 100 and an adjacent line is cut, the first and second common electrodes 122a, 122b of the light emitting diode 140 and Operation and/or control of the communication electrode 125 may be maintained. That is, the operation of the first and second common electrodes 122a and 122b and the communication electrode 125 can still be maintained in the cut portion of the transparent light emitting diode film 100 that is connected to the external circuit.

For example, when the transparent light emitting diode film 100 is cut in the first direction, both the upper and lower light emitting diodes 140 connected to the external circuit can be operated and/or controlled. .

Figures 12 to 15 are diagrams showing the formation process of a transparent light emitting diode film according to an embodiment of the present invention.

As shown in FIG. 12, a pad 130 may be formed on at least one portion of the electrode layer 120. Pad 130 may include a highly conductive material. The pad 130 may be formed in a portion of the electrode layer 120 where the light emitting diode will be located. Pad 130 may be a part where a light emitting diode is attached. For example, the pad 130 may include silver (Ag).

As shown in FIG. 13, the light emitting diode 140 may be fixed on the pad 130. The light emitting diode 140 may be fixed on the pad 130 using a low-temperature SMT (Surface Mount Technology) process. A plurality of light emitting diodes 140 may be located. At least one of the light emitting diodes 140 may be spaced apart from the other light emitting diode 140.

Solder 135 may be printed on the pad 130. Solder 135 may help attach the light emitting diode 140 to the pad 130. Solder 135 may include epoxy. Epoxy can improve the strength of solder 135.

Solder 135 hardens when heated through a low-temperature reflow process and can fix parts. The low-temperature reflow process may be performed, for example, at 160 degrees for 300 seconds. Because the base 110, electrode layer 120, and pad 130 have high melting points, their states may not change in a low-temperature reflow process. In particular, the reflow process is performed at a low temperature, which can help ensure that the state of the base 110 does not change.

The FPCB 150 may be attached to the pad 130 located at one end of the transparent light emitting diode film 100. The FPCB 150 can electrically connect the electrode layer 120 and an external circuit. Accordingly, the FPCB 150 may assist in driving and/or controlling the light emitting diode 140.

As shown in FIG. 14 , the adhesive layer 160 may be located on at least another portion of the electrode layer 120 and the protective layer 170 may be covered on the adhesive layer 160 . The adhesive layer 160 may include an optical clear adhesive (OCA). For example, the adhesive layer 160 may include any one of silicone, acrylic, and combinations thereof. The adhesive layer 160 may have a strong bonding force between the upper and lower surfaces. The height of the adhesive layer 160 may be higher than the height of the light emitting diode 140. Accordingly, the light emitting diode 140 may not be in contact with the adhesive layer 160. The height of the adhesive layer 160 may be, for example, 500 μm or more and 800 μm or less.

The adhesive layer 160 may be located in a portion excluding the light emitting diode 140. That is, the adhesive layer 160 may have an opening 165 formed in a portion corresponding to the light emitting diode 140. The width (OWT) of the opening 165 may be larger than the width (DWT) of the light emitting diode 140. That is, the adhesive layer 160 may not be in contact with the light emitting diode 140. Accordingly, even if the adhesive layer 160 is attached on the electrode layer 120, no problem may occur in the operation of the light emitting diode 140.

A protective layer 170 may be positioned on the adhesive layer 160. The protective layer 170 may be located on the adhesive layer 160 to prevent the adhesive layer 160 from being exposed to the outside. Accordingly, the protective layer 170 can preserve the adhesive strength of the adhesive layer 160.

The protective layer 170 may be spaced at a certain height from the light emitting diode 140 so as not to interfere with the operation and/or control of the light emitting diode 140. Accordingly, the thickness of the adhesive layer 160 may be higher than the thickness of the light emitting diode 140.

The protective layer 170 can protect the transparent light emitting diode film 100 from external shock. In other words, this means that even when an external force is applied, less impact can be applied to the light emitting diode 140 due to the protective layer 170.

As shown in FIG. 15, the protective layer 170 may include first and second protective layers 170a and 170b. The first and second protective layers 170a and 170b may be attached to the upper and lower surfaces of the adhesive layer 160. The first and second protective layers 170a and 170b may help maintain the adhesion of the adhesive layer 160.

The second protective layer 170b may be separated from the adhesive layer 160 before the adhesive layer 160 is combined with the transparent light emitting diode film. Accordingly, the adhesive layer 160, which maintains adhesive force, is attached to the transparent light emitting diode film 100 to protect the light emitting diode.

The first protective layer 170a may be separated from the adhesive layer 160 later when the transparent light emitting diode film is attached to another location. Accordingly, the adhesive layer 160 can help attach the transparent light emitting diode film to other parts.

The transparent light emitting diode film according to the present invention may have a protective layer 170 located on both sides of the adhesive layer 160. Accordingly, the protective layer 170 can protect the adhesive layer 160 and maintain the adhesive force of the adhesive layer 160.

16 to 18 are diagrams showing a transparent light emitting diode film according to an embodiment of the present invention.

As shown in Figure 16, the transparent light emitting diode film can be attached to the skin contact surface 250. The above-described first protective layer (170a in FIG. 9) can be separated from the adhesive layer and a transparent light emitting diode film can be attached to the skin contact surface 250. The skin contact surface 250 may include a transparent material. The skin-contacting surface 250 may expose light emitted from the light emitting diode 140 to the outside. The skin contact surface 250 may be attached to the adhesive layer 160 of the transparent light emitting diode film. Since the thickness of the adhesive layer 160 is thicker than the thickness of the light-emitting diode 140, the skin-adhesive surface 250 may not be in contact with the light-emitting diode 140.

A sash 270 that secures the skin contact surface 250 may be located at an edge area of the skin contact surface 250. The sash 270 may be shaped to surround the edge area of the contact surface 250. The sash 270 may include a strong material to secure the contact surface 250. For example, chassis 270 may include aluminum, plastic, or metal.

At least one PCB 230 for driving and/or controlling the light emitting diode 140 may be attached to the chassis 270. At least one PCB 230 may be attached on the rear of chassis 270. At least one PCB (230) may be connected at one end to the FPCB (150). Accordingly, at least one PCB 230 can transmit an electrical signal to the light emitting diode 140.

At least one PCB 230 may include a power board 210 and a control board 220. The power board 210 may be fixed on the chassis 270. The power board 210 may be connected to the control board 220 at one end. The power board 210 can supply power to the transparent light emitting diode film. That is, the power board 21 can supply power to the light emitting diode 140. The power board 210 can change AC frequency to DC frequency. That is, the power board 210 can increase electrical efficiency by changing low frequencies to high frequencies.

Control board 220 may be fixed on chassis 270. One end of the control board 220 may be connected to the power board 210 and the other end may be connected to the FPCB (150). The control board 220 may transmit an input signal to the light emitting diode 140. That is, the control board 220 can transmit timing signals and video signals to the light emitting diode 140.

In the transparent light emitting diode film according to the present invention, at least one PCB 230 may be located on the rear of the chassis 270. Accordingly, at least one PCB 230 may not be noticeable when the screen of the transparent light emitting diode film is viewed from the front.

As shown in FIG. 17, the adhesive layer 160 of the transparent light emitting diode film according to the present invention may include first and second adhesive layers 160a and 160b. The first adhesive layer 160a and the second adhesive layer 160b may be sequentially stacked.

The first adhesive layer 160a may be located on at least a portion of the electrode layer 120. In detail, one surface of the first adhesive layer 160a may be in contact with the electrode layer 120, and the other surface facing the first adhesive layer 160a may be in contact with the support layer 160b. The first adhesive layer 160a may include silicon. The first adhesive layer 160a may be thicker than the second adhesive layer 160b. The first adhesive layer 160a may have higher adhesive strength than the second adhesive layer 160b. For example, the first adhesive layer 160a may have an adhesive force of 0.5kgf/25mm to 1kgf/25mm. Accordingly, when separating the bottle-resistant light emitting diode film from the adhered surface, the first adhesive layer 160a may not be separated from the electrode layer 120.

The second adhesive layer 160b may be located on the first adhesive layer 160a. The second adhesive layer 160b may include silicon. As described above, the second adhesive layer 160b may have lower adhesive strength than the first adhesive layer 160a. For example, the second adhesive layer 160b may have an adhesive force of 0.01kgf/25mm to 0.05kgf/25mm. Accordingly, the second adhesive layer 160b can be easily attached to or separated from the adhesive surface 250.

In the transparent light emitting diode film according to the present invention, the adhesive layer 160 may be divided into a plurality of layers with different adhesive strengths. Accordingly, the transparent light emitting diode film can be easily and quickly attached and separated from the skin contact surface 250.

As shown in FIG. 18, the adhesive layer 160 may include first and second adhesive layers 160a and 160b, and a support layer 160c. The support layer 160c may be located between the first and second adhesive layers 160a and 160b. That is, the first adhesive layer 160a, the support layer 160c, and the second adhesive layer 160b may be sequentially stacked.

The support layer 160c may be located on the first adhesive layer 160a. The support layer 160c may function to secure the first and second adhesive layers 160a and 160b. The support layer 160c may include PET film. The support layer 160c can fix the adhesive layer 160 so that it is not pushed during the perforation process of the adhesive layer 160. The support layer 160c can fix the first and second adhesive layers 160a and 160b so that there is no difference in thickness of the adhesive layer 160 even after the shape of the light emitting diode film is deformed.

19 to 21 are diagrams showing a plurality of transparent light emitting diode films according to an embodiment of the present invention.

As shown in Figure 19, the transparent light emitting diode film according to the present invention can be attached to a plurality of skin contact surfaces (250A-250D) to display one screen. That is, this means that one image can be divided and displayed on a plurality of skin contact surfaces 250A-250D.

A plurality of split images can be generated by dividing the video signal according to the screen splitting method set in at least one PCB. Afterwards, each divided image can be transmitted to each corresponding transparent light emitting diode film and output on the screen.

The display device according to the present invention can display a very large image on the screen because one screen is displayed on a plurality of transparent light emitting diode films.

As shown in FIG. 20, at least one end of the plurality of transparent light emitting diode films 100 may not be connected to the PCB 230. For example, one end of the first transparent light emitting diode film 100A may be connected to the other end of the second transparent light emitting diode film 100B through the FPCB 150. Additionally, one end of the third transparent light emitting diode film 100C may be connected to the other end of the fourth transparent light emitting diode film 100D through the FPCB 150. Accordingly, at least one PCB 230 is attached to the chassis 270 located at both ends, but at least one PCB 230 may not be located on the chassis 270 located at the center. Accordingly, at least one transparent light emitting diode film (100A-100D) may be delivered not only from at least one PCB (230) but also from at least another transparent light emitting diode film (100A-100D).

Part of the transparent light emitting diode 100 according to the present invention may not be connected to at least one PCB 230. Accordingly, the installation cost of the transparent light emitting diode 100 may be reduced.

As shown in FIG. 21, both ends of the plurality of transparent light emitting diode films 100 may be connected to the PCB 230. This means that the PCB 230 can be located on the rear of every chassis 270. In this case, even if one PCB 230 malfunctions, the transparent light emitting diode film 100 not connected to the PCB 230 can operate normally. Accordingly, even if one PCB 230 malfunctions, it is possible to quickly determine where the malfunction occurred.

Each embodiment and/or configuration of the present invention may be combined with each other. For example, this means that configuration A described in a particular embodiment and/or drawing may be combined with configuration B described in other embodiments and/or drawings. In other words, even if the combination between components is not directly explained, it means that combination is possible, except in cases where it is explained that combination is impossible. This point is obvious considering that the present invention relates to a display device.

The above detailed description should not be construed as restrictive in any respect and should be considered illustrative. The scope of the present invention should be determined by reasonable interpretation of the appended claims, and all changes within the equivalent scope of the present invention are included in the scope of the present invention.

Claims (9)

Base;
an adhesive layer located on one side of the base and having a plurality of openings arranged along a plurality of rows and a plurality of columns on the base;
an electrode layer positioned between the base and the adhesive layer;
a plurality of pads each disposed within the plurality of openings and electrically connected to the electrode layer; and
A plurality of light emitting diodes each disposed within the plurality of openings and each electrically connected to the plurality of pads.
Includes,
The electrode layer is,
An anode electrode connected to one end of the plurality of light emitting diodes arranged in one row, and a cathode electrode connected to the other end of the plurality of light emitting diodes arranged in one row,
At least one of the anode electrode and the cathode electrode is formed as a common electrode commonly connected to the plurality of light emitting diodes arranged in the one row,
A transparent light emitting diode film wherein the anode electrode and the cathode electrode are located in different lines with the plurality of light emitting diodes disposed in the one row interposed.
According to clause 1,
The common electrode is a transparent light-emitting diode film commonly connected to the plurality of light-emitting diodes arranged in different rows.
According to clause 1,
Each of the plurality of light emitting diodes is:
A plurality of LED chips having different colors; and
A transparent light emitting diode film including an IC chip that drives and/or controls the plurality of LED chips.
According to clause 3,
The electrode layer is,
A transparent light emitting diode film further comprising a communication electrode connected to the IC chip of the plurality of light emitting diodes arranged in the one row.
According to clause 3,
A transparent light emitting diode film wherein the cathode electrode is formed as a first common electrode, and the anode electrode is formed as a second common electrode.
According to clause 5,
A transparent light emitting diode film wherein at least one of the first common electrode and the second common electrode is commonly connected to the plurality of light emitting diodes arranged in different rows.
delete According to clause 1,
The anode electrode connected to the plurality of light emitting diodes arranged in the one row is connected to the anode electrode connected to the plurality of light emitting diodes arranged in another row adjacent to the one row, and the anode electrode arranged in the other row is connected to the plurality of light emitting diodes arranged in the row. A transparent light emitting diode film in which a cathode electrode connected to a plurality of light emitting diodes is connected to a cathode electrode connected to the plurality of light emitting diodes disposed in another row adjacent to the other row.
According to clause 8,
A transparent light emitting diode film where the portion connecting the anode electrodes is located on the opposite side from the portion connecting the cathode electrodes.