CN111341199B - Light source assembly, method for reducing working current of backlight module and display device - Google Patents
Light source assembly, method for reducing working current of backlight module and display device Download PDFInfo
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- CN111341199B CN111341199B CN201910783285.3A CN201910783285A CN111341199B CN 111341199 B CN111341199 B CN 111341199B CN 201910783285 A CN201910783285 A CN 201910783285A CN 111341199 B CN111341199 B CN 111341199B
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/34—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters by control of light from an independent source
- G09G3/3406—Control of illumination source
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Abstract
The embodiment of the invention belongs to the technical field of display, and provides a light source assembly, a method for reducing the working current of a backlight module and a display device.
Description
Technical Field
The embodiment of the invention belongs to the technical field of display, and particularly relates to a light source assembly, a method for reducing the working current of a backlight module and a display device.
Background
In the backlight or direct-view display technology, LEDs are common light sources, the operating voltage of a single LED is usually about 2-3V, and for a large display screen, in order to ensure that the backlight has sufficient brightness, the LED chips in each partition of the backlight module need to be driven by higher current, and the operating current of the backlight module can reach up to tens of amperes.
However, the backlight module has a large working current, which causes several problems, for example, the large working current causes the power consumption of the system to increase, and the energy utilization efficiency is reduced; secondly, the large current causes the system to generate heat, which causes the heat dissipation problem; thirdly, if the LED light source is fabricated on the TFT backplane, because the resistance of the backplane transmission line is large, a large voltage drop on the line resistance is caused by a large current, which affects the circuit working state, and imposes a severe requirement on the system design.
Disclosure of Invention
The embodiment of the invention provides a light source assembly, a method for reducing the working current of a backlight module and a display device, and aims to solve the problem that the working current of the conventional backlight module is too large.
Embodiments provide a light source assembly, comprising: k light-emitting elements, K is not less than 2 and is an integer;
a first light source pad; and
a second light source pad;
the K light-emitting elements are sequentially connected in series to form a lamp string, the first end of the lamp string is connected with the first light source bonding pad, and the second end of the lamp string is connected with the second light source bonding pad.
Optionally, the light source assembly further comprises:
and the packaging body is used for packaging the K light-emitting elements, and the K light-emitting elements are connected in series in the packaging body to form the lamp string.
Optionally, the K light emitting elements are arranged at intervals, and the K light emitting elements are located on the same horizontal plane.
Optionally, the K light emitting elements are disposed between the first light source pad and the second light source pad.
Optionally, the light source assembly further includes a circuit board and 2K-2 light source pads, where the 2K-2 light source pads, the first light source pad, and the second light source pad form K light source pad pairs;
be equipped with on the circuit board with K the K circuit board pad pair of light emitting component one-to-one, wherein, each two poles of the earth of light emitting component are connected two light source pads that correspond the light source pad pair respectively, two circuit board pads that correspond the circuit board pad pair are connected respectively to two light source pads, and a circuit board pad of the I circuit board pad pair is connected with a circuit board pad of the I-1 circuit board pad pair, another circuit board pad of the I circuit board pad pair is connected with a circuit board pad of the I +1 circuit board pad pair, I is greater than or equal to 2, and I is less than or equal to K-1.
Optionally, each of the light emitting elements is a high voltage LED chip.
Optionally, the light emitting element is a Mini-LED chip or a Micro-LED chip.
Optionally, the K light emitting elements are integrated in a high voltage LED chip.
The embodiment of the present application further provides a method for reducing a working current of a backlight module, where the backlight module includes a plurality of light source modules arranged in sequence, and the method includes:
the light source assembly is set to be a lamp string formed by connecting K light-emitting elements in series, wherein K is more than or equal to 2 and is an integer;
and arranging a first light source bonding pad and a second light source bonding pad in the light source component so that the lamp string is connected with a driving circuit for driving the backlight module through the first light source bonding pad and the second light source bonding pad respectively.
Optionally, the method further includes:
setting 2K-2 light source bonding pads to form K light source bonding pad pairs together with the first light source bonding pad and the second light source bonding pad;
set up on the circuit board with K the K circuit board pad pair of light emitting component one-to-one, wherein, each two poles of the earth of light emitting component are connected two light source pads that correspond the light source pad pair respectively, two circuit board pads in corresponding circuit board pad pair are connected respectively to two light source pads, and a circuit board pad of the first circuit board pad pair is connected with a circuit board pad of the first circuit board pad pair, another circuit board pad of the first circuit board pad pair is connected with a circuit board pad of the (I + 1) th circuit board pad pair, I is greater than or equal to 2, and I is less than or equal to K-1.
An embodiment of the present application further provides a display device, including:
the display panel comprises a plurality of light source components which are arranged in sequence, wherein the light source components are as described in any one of the above items; and
and the driving circuit is electrically connected with the display panel and drives the display panel to display the display picture according to the received driving current signal.
In the light source assembly, the method for reducing the working current of the backlight module and the display device provided by the embodiment of the invention, the K light-emitting elements are connected in series to form the lamp string and are respectively connected with the driving circuit for driving the light source assembly through the first light source bonding pad and the second light source bonding pad, so that the current density in the lamp string is consistent with the current density of the light-emitting chips when each light source assembly is lightened, the effect of sending the same luminous brightness by 1/K of the driving current of the light-emitting chips is achieved, the large driving current caused by the fact that the backlight module adopts one light-emitting chip in each partition is avoided, and the problem caused by the overlarge working current of the conventional backlight module is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic diagram illustrating an equivalent structure of each light emitting unit in a display panel according to an embodiment of the present application;
FIG. 2 is a schematic view of a light source module according to one embodiment of the present disclosure;
FIG. 3 is a schematic structural diagram of a light-emitting device according to an embodiment of the present invention
FIG. 4 is a schematic view of a light source module according to another embodiment of the present invention;
FIG. 5 is a schematic view of a light source module according to another embodiment of the present invention;
FIG. 6 is a schematic view of a light source module according to another embodiment of the present invention;
fig. 7 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the technical solutions in the embodiments of the present invention will be clearly described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The terms "comprises" and "comprising," and any variations thereof, in the description and claims of this invention and the above-described drawings are intended to cover non-exclusive inclusions. For example, a process, method, or system, article, or apparatus that comprises a list of steps or elements is not limited to only those steps or elements listed, but may alternatively include other steps or elements not listed, or inherent to such process, method, article, or apparatus. Furthermore, the terms "first," "second," and "third," etc. are used to distinguish between different objects and are not used to describe a particular order.
The discrete electronic component in the embodiment of the present invention refers to an electronic component that functions as an independent circuit and constitutes a basic unit of a circuit, for example, a resistor, a capacitor, an inductor, an electromechanical element (a connector, a switch, a relay, or the like), an electroacoustic device, an optoelectronic device, a sensitive component, a display device, a piezoelectric device, or the like.
Fig. 1 is a schematic diagram of an equivalent structure of each light emitting unit in a display panel, and referring to fig. 1, a control circuit is connected in series with a light emitting chip and is respectively connected to a power supply anode and a voltage reference point to receive a driving current signal output by the driving circuit, and the control circuit controls on and off of a current flowing through the light emitting chip according to a control signal, wherein the control signal is from an external signal source. Because the light-emitting chip, the control circuit, the power supply anode and the voltage reference point are all connected by the circuit wiring, parasitic resistors exist among the connection points, for example, as shown in fig. 1, a parasitic resistor 1 exists between the power supply anode and the light-emitting chip, and a parasitic resistor 2 exists between the control circuit and the voltage reference point, and if the light-emitting chip, the control circuit, the power supply anode and the voltage reference point are arranged in the TFT backplane and wired by the TFT backplane, the parasitic resistors can reach tens of ohms, even hundreds of ohms. If the required brightness of the display panel is high, and in order to make the light emitting chip achieve the required brightness, the driving circuit needs to output a high driving current signal so as to make the light emitting chip achieve the required brightness, at this time, the parasitic resistance may increase the voltage difference on the line, thereby causing a large influence on the working state of the display circuit.
In order to reduce the output current of the driving circuit, the present embodiment provides a light source assembly, which is shown in fig. 2 and includes: k light-emitting elements, K is not less than 2 and is an integer; a first light source pad; and a second light source pad; k light-emitting components connect in series in proper order and form the lamp cluster, the first end of lamp cluster with first light source pad is connected, the second end of lamp cluster with the second light source pad is connected.
In this embodiment, in the same light source module, K light emitting elements are sequentially connected in series to form a light string, a first end of the light string is connected to the first light source pad, a second end of the light string is connected to the second light source pad, specifically, the K light emitting elements are connected end to end, a first end of a first light emitting element is connected to the first light source pad, a first end of a second light emitting element is connected to a second end of the first light emitting element, and so on, a first end of a K-th light emitting element is connected to a second end of a K-1-th light emitting element, and a second end of the K-th light emitting element is connected to the second light source pad. For example, when the light emitting element is a light emitting diode, an anode of the light emitting diode may be used as a first end thereof, and a cathode of the light emitting diode may be used as a second end thereof, at this time, K light emitting diodes in the light source assembly are connected in series to form a string, an anode of the first light emitting diode is connected to the first light source pad, a cathode of the first light emitting diode is connected to an anode of the second light emitting diode, a cathode of the second light emitting diode is connected to an anode of the third light emitting diode, and so on, an anode of the kth light emitting diode is connected to a cathode of the kth-1 light emitting diode, a cathode of the kth light emitting diode is connected to the second light source pad, and when the light source assembly is turned on, the first light source pad is connected to an anode port of the working power supply, and the second.
In this embodiment, the K light emitting elements having the same total area emit light with the same intensity as that of the single light emitting chip, for example, if the current flowing through the K light emitting elements is i, the light emitting intensity of the K light emitting elements at this time is substantially the same as that of the light emitting chip having the operating current K × i. Therefore, the driving current under the same luminous intensity can be reduced to 1/K of the original driving current by replacing the luminous chip with the light string formed by connecting the K luminous elements in series, and the driving voltage can be the sum of the working voltages of the K luminous elements, so that the problems of low energy utilization efficiency, difficult heat dissipation, large voltage drop and the like of the display panel due to large current are solved by improving the voltage of the driving system and reducing the current of the driving system.
In an embodiment, the K light emitting elements are disposed at intervals, and the K light emitting elements are located on the same horizontal plane, as shown in fig. 3, light emitting element 1, light emitting element 2 … …, and light emitting element K are disposed at intervals on the same horizontal plane, for example, light emitting element 1, light emitting element 2 … …, light emitting element K-1, and light emitting element K may be disposed on the same surface of the same planar substrate, the K light emitting elements are connected in series, when a driving current flows through the string, each light emitting element is turned on, at this time, the K light emitting elements may emit light on the same light emitting surface when turned on, so that the light emitting intensity achieves the effect of superposition enhancement, the light intensity of the K light emitting elements is the same as the light intensity of independent light emitting chips with the same area turned on under the driving current of K times, and the light rays of the light emitting elements are less blocked when disposed on the same horizontal plane (for a five-sided LED core Five sides in the case of a sheet refer to the sides other than the bottom side, in which case the LED chip has a rectangular structure), or so that the light of the light emitting element is not blocked (for LED chips that emit light only from the top side).
In one embodiment, K of the light emitting elements are disposed between the first light source pad and the second light source pad.
In this embodiment, referring to fig. 3, K light emitting elements such as light emitting element 1 and light emitting element 2 … …, light emitting element K, and the like, are disposed between the first light source pad and the second light source pad at an interval, specifically, light emitting element K-1 is disposed between light emitting element K and light emitting element K-2, n is greater than or equal to 3, light emitting element K is disposed between the second light source pad and light emitting element K-1, light emitting element 1 is disposed between the first light source pad and light emitting element 2, and electrode layers at two ends of each light emitting element are respectively electrically connected to an electrode layer of an adjacent light emitting element or an adjacent light source pad.
In one embodiment, referring to fig. 4, the light source assembly further comprises: and the packaging body is used for packaging the K light-emitting elements, and the K light-emitting elements are connected in series in the packaging body to form the lamp string.
In this embodiment, K light emitting elements are arranged inside the package body, each light emitting element includes an anode and a cathode, the K light emitting elements are sequentially connected in series, two adjacent light emitting elements are electrically connected through a routing wire or a circuit board inside the package body, at this time, the anode of the first light emitting element is electrically connected with the first light source pad, the cathode of the first light emitting element is connected with the anode of the second light emitting element, and so on, the anode of the kth light emitting element is connected with the cathode of the kth light emitting element, and the cathode of the kth light emitting element is connected with the second light source pad. The first light source bonding pad and the second light source bonding pad are respectively connected with a driving circuit on the circuit board so as to receive a driving current signal.
In one embodiment, referring to fig. 5, K light emitting devices are formed on the same substrate and are sequentially connected in series through 2K electrodes to form the light string.
In this embodiment, the K light emitting elements may be sequentially disposed on the same substrate by forming a PN junction, and at this time, each light emitting element is manufactured by a semiconductor process, and the adjacent light emitting elements are electrically connected through an electrode on the substrate, wherein a positive electrode of a first light emitting element is connected to the first light source pad through the electrode, and a negative electrode of a kth light emitting element is connected to the second light source pad through the electrode, and the connection may be any one of welding, eutectic welding, and conductive adhesive bonding.
For example, in fig. 5, a PN junction is formed between a P-type semiconductor material and an N-type semiconductor material, so as to form a light emitting element on a substrate, where P in fig. 4 is a P-type semiconductor material, N is an N-type semiconductor material, an electrode 1P is connected to a positive electrode of a first light emitting element, the positive electrode of the first light emitting element is connected to a first light source pad through an electrode 1P, and an electrode 1N is connected to a negative electrode of the first light emitting element, a negative electrode of the first light emitting element is connected to an electrode 2P through an electrode 1N, the electrode 2P is connected to a positive electrode of a second light emitting element, a negative electrode of the second light emitting element is connected to an electrode 2N, and so on, the positive electrode of a kth light emitting element is connected to an electrode KP, and the negative electrode of the kth light emitting element is connected to a second light source pad through an electrode KN. In one embodiment, the light string forms a high voltage light emitting chip, each light emitting element in the light string may be a sub light emitting chip, and in this embodiment, K light emitting sub chips are sequentially connected in series to form a high voltage light emitting chip.
In one embodiment, referring to fig. 6, the light source assembly further includes a circuit board and 2K-2 light source pads, wherein 2K-2 light source pads, a first light source pad, and a second light source pad form K light source pad pairs; be equipped with on the circuit board with K the K circuit board pad pair of light emitting component one-to-one, wherein, each two poles of the earth of light emitting component are connected two light source pads that correspond the light source pad pair respectively, two circuit board pads that correspond the circuit board pad pair are connected respectively to two light source pads, and a circuit board pad of the I circuit board pad pair is connected with a circuit board pad of the I-1 circuit board pad pair, another circuit board pad of the I circuit board pad pair is connected with a circuit board pad of the I +1 circuit board pad pair, I is greater than or equal to 2, and I is less than or equal to K-1.
In this embodiment, 2K-2 the light source pads, the first light source pads and the second light source pads are all located in the light source assembly, and K light source pad pairs are formed, K circuit board pad pairs are arranged on the circuit board, each circuit pad pair comprises two circuit board pads, the K circuit board pad pairs are matched with the K light source pad pairs in a one-to-one correspondence manner, two circuit board pads in each circuit board pad pair are respectively electrically connected with two light source pads in the corresponding light source pad pair, the K light source pad pairs are matched with the K light emitting elements in a one-to-one correspondence manner, two light source pads in each light source pad pair are electrically connected with two ends of the corresponding light emitting elements, two adjacent circuit board pads in the adjacent circuit board pad pair are electrically connected, so that the K light emitting elements are connected in series according to the order to form a light.
Specifically, two poles of the two poles of each light-emitting element are respectively connected with two light source pads corresponding to the light source pad pairs, the two light source pads are respectively connected with two circuit board pads corresponding to the circuit board pad pairs, one circuit board pad of the I-th circuit board pad pair is connected with one circuit board pad of the I-1-th circuit board pad pair, the other circuit board pad of the I-th circuit board pad pair is connected with one circuit board pad of the I + 1-th circuit board pad pair, I is more than or equal to 2, and I is less than or equal to K-1. For example, referring to FIG. 6, two ends of a light emitting element 1 are respectively connected to a light source pad 1-1 and a light source pad 1-2, a light source pad 1-1 and a light source pad 1-2 are respectively connected to a circuit board pad 1-1 and a circuit board pad 1-2, two ends of a light emitting element 2 are respectively connected to a light source pad 2-1 and a light source pad 2-2, a circuit board pad 1-2 is connected to a circuit board pad 2-1, a light source pad 2-1 and a light source pad 2-2 are respectively connected to a circuit board pad 2-1 and a circuit board pad 2-2, and so on, two ends of a light emitting element K are respectively connected to a light source pad K-1 and a light source pad K-2, a light source pad K-1 and a light source pad K-2 are respectively connected to a circuit board pad K-1 and a circuit, so that the K light-emitting elements are sequentially connected in series to form the lamp string.
In one embodiment, the light source pad 1-1 may be the first light source pad in the above-described embodiment, and the light source pad K-2 may be the second light source pad in the above-described embodiment.
In this embodiment, each light emitting element is connected with the corresponding circuit board pad on the circuit board through the corresponding light source pad, and the first end and the second end in each light emitting element are electrically connected with the circuit board pad on the circuit board, so that each light emitting element can be tested in the light string manufacturing process, and the stability and the yield of the light string are improved. In this embodiment, the light string may be a high voltage LED chip, and each light emitting element may be a sub-light emitting chip within the high voltage LED chip.
In one embodiment, each of the light emitting elements is a high voltage LED chip.
In one embodiment, the light emitting element is a Mini-LED chip or a Micro-LED chip.
In one embodiment, K of the light emitting elements are integrated in a high voltage LED chip.
In this embodiment, the light emitting elements may be Mini-LED chips or Micro-LED chips, and when the K light emitting elements are connected in series, one high voltage LED chip may be formed, for example, when the K Mini-LED chips are connected in series, one high voltage LED chip may be formed, at this time, the illumination intensity of the high voltage LED chip when receiving the driving current with the current i may be the same as the illumination intensity of the LED chip with the same area when the driving current is Ni, so as to reduce the driving current with the same illumination intensity to the original 1/K, and the driving voltage may be the sum of the working voltages of the K light emitting elements, so as to increase the voltage of the driving system and reduce the current of the driving system, thereby avoiding the problems of low energy utilization efficiency, difficult heat dissipation, large voltage drop, and the like of the display panel due to the large current.
The embodiment of the present application further provides a method for reducing a working current of a backlight module, where the backlight module includes a plurality of light source modules arranged in sequence, and the method includes:
the light source assembly is set to be a lamp string formed by connecting K light-emitting elements in series, wherein K is more than or equal to 2 and is an integer;
and arranging a first light source bonding pad and a second light source bonding pad in the light source component so that the lamp string is connected with a driving circuit for driving the backlight module through the first light source bonding pad and the second light source bonding pad respectively.
Referring to fig. 2, in this embodiment, K light emitting elements are sequentially connected in series to form a light string disposed in the same light source assembly, a first end of the light string is connected to the first light source pad, a second end of the light string is connected to the second light source pad, specifically, the K light emitting elements are connected end to end, a first end of a first light emitting chip is connected to the first light source pad, a second end of a second light emitting chip is connected to a second end of the first light emitting chip, and so on, a first end of a kth light emitting element is connected to a second end of a K-1 th light emitting element, and a second end of the kth light emitting element is connected to the second light source pad.
In this embodiment, the intensity of light emitted from the K light emitting elements and the light emitting chips having the same total area is the same, and for example, if the current flowing through the K light emitting elements is i, the light emitting intensity of the K light emitting elements at this time is substantially the same as the light emitting intensity of the light emitting chip having the operating current Ni. Therefore, the driving current under the same luminous intensity can be reduced to 1/K of the original driving current by replacing the luminous chip with the light string formed by connecting the K luminous elements in series, and the driving voltage can be the sum of the working voltages of the K luminous elements, so that the problems of low energy utilization efficiency, difficult heat dissipation, large voltage drop and the like of the display panel due to large current are solved by improving the voltage of the driving system and reducing the current of the driving system.
In one embodiment, K light emitting elements may be disposed at intervals, and K light emitting elements are located on the same horizontal plane, as shown in fig. 3, light emitting element 1, light emitting element 2 … …, and light emitting element K are disposed at intervals on the same horizontal plane, for example, light emitting element 1, light emitting element 2 … …, and light emitting element K may be disposed on the same surface of the same planar substrate, K light emitting elements are connected in series, when a driving current flows through the string, each light emitting element is turned on, at this time, K light emitting elements may emit light on the same light emitting surface when turned on, so that the light emitting intensity achieves the effect of superposition enhancement, the light intensity of K light emitting elements is the same as the light intensity of independent light emitting chips with the same area turned on under the driving current of K times, the arrangement on the same horizontal plane can reduce the light of the light-emitting element from being blocked (for a five-surface light-emitting LED chip, the five surfaces refer to the surfaces other than the bottom surface, and at this time, the LED chip has a rectangular structure), or prevent the light of the light-emitting element from being blocked (for an LED chip with only a top surface emitting light).
In one embodiment, K of the light emitting elements are disposed at intervals between the first light source pad and the second light source pad.
In this embodiment, referring to fig. 3, the light emitting element 1, k light emitting elements such as light emitting element 2 … … light emitting element K are disposed between the first light source pad and the second light source pad at an interval, specifically, light emitting element K-1 is disposed between light emitting element K and light emitting element K-2, n is greater than or equal to 3, light emitting element K is disposed between the second light source pad and light emitting element K-1, light emitting element 1 is disposed between the first light source pad and light emitting element 2, and electrode layers at two ends of each light emitting element are electrically connected to an electrode layer of an adjacent light emitting element or an adjacent light source pad, further, the electrode layer of each light emitting element may be a transparent electrode, when the light source assembly works, the K light emitting elements are lit under the same driving current driving effect, and light emitted by the K light emitting elements may achieve an overlapping and enhancing effect.
In one embodiment, the light source assembly is provided as a light string formed by connecting K light-emitting elements in series, and comprises: and packaging the K light-emitting elements by adopting a packaging body, and connecting the K light-emitting elements in series in the packaging body to form the lamp string.
Referring to fig. 4, in this embodiment, K light emitting elements are arranged inside the package, each light emitting element includes an anode and a cathode, the K light emitting elements are sequentially connected in series, two adjacent light emitting elements are electrically connected through a wire bonding or a circuit board inside the package, at this time, the anode of the first light emitting element is electrically connected to the first light source pad, the cathode of the first light emitting element is connected to the anode of the second light emitting element, and so on, the anode of the kth light emitting element is connected to the cathode of the kth light emitting element, and the cathode of the kth light emitting element is connected to the second light source pad. The first light source bonding pad and the second light source bonding pad are respectively connected with a driving circuit on the circuit board so as to receive a driving current signal.
Referring to fig. 5, in this embodiment, K light emitting elements are sequentially formed on a same substrate, and 2K electrodes are sequentially connected in series on the substrate to form the light string, at this time, each light emitting element is prepared by a semiconductor process, and adjacent light emitting elements are electrically connected through the electrode on the surface of the substrate, wherein a positive electrode of a first light emitting element is connected with a first light source pad through the electrode on the surface of the substrate, and a negative electrode of a kth light emitting element is connected with a second light source pad through the electrode on the surface of the substrate, and the connection may be any one of soldering, eutectic soldering, and conductive adhesive bonding.
In one embodiment, the light string forms a high voltage LED chip, each light emitting element in the light string may be a sub-light emitting chip, and the sub-light emitting chips may be light emitting diodes.
In one embodiment, the method further comprises: setting 2K-2 light source bonding pads to form K light source bonding pad pairs together with the first light source bonding pad and the second light source bonding pad;
set up on the circuit board with K the K circuit board pad pair of light emitting component one-to-one, wherein, each two poles of the earth of light emitting component are connected two light source pads that correspond the light source pad pair respectively, two circuit board pads in corresponding circuit board pad pair are connected respectively to two light source pads, and a circuit board pad of the first circuit board pad pair is connected with a circuit board pad of the first circuit board pad pair, another circuit board pad of the first circuit board pad pair is connected with a circuit board pad of the (I + 1) th circuit board pad pair, I is greater than or equal to 2, and I is less than or equal to K-1.
Referring to fig. 6, in this embodiment, 2K-2 light source pads, a first light source pad, and a second light source pad are all disposed in the light source assembly, and K light source pad pairs are formed, where K circuit board pad pairs are disposed on the circuit board, each circuit board pad pair includes two circuit board pads, the K circuit board pads are matched with the K light source pad pairs in a one-to-one correspondence manner, two circuit board pads in each circuit board pad pair are respectively electrically connected with two light source pads in the corresponding light source pad pair, the K light source pad pairs are matched with the K light emitting elements in a one-to-one correspondence manner, two light source pads in each light source pad pair are electrically connected with two ends of the corresponding light emitting elements, and two adjacent circuit board pads in adjacent circuit board pad pairs are electrically connected, so that the K light emitting elements are sequentially connected in series to form a light string.
In this embodiment, each light emitting element is connected with the corresponding circuit board pad on the circuit board through the corresponding light source pad, and the first end and the second end in each light emitting element are electrically connected with the circuit board pad on the circuit board, so that each light emitting element can be tested in the light string manufacturing process, and the stability and the yield of the light string are improved. In this embodiment, the light string may be integrated into a high voltage chip, and each light emitting element may be a sub-light emitting chip within the high voltage chip.
An embodiment of the present application further provides a display device, including:
the display panel comprises a plurality of light source components which are arranged in sequence, wherein the light source components are as described in any one of the above items; and
and the driving circuit is electrically connected with the display panel and drives the display panel to display the display picture according to the received driving current signal.
Referring to fig. 7, the display panel in this embodiment includes a plurality of light source modules arranged in sequence, and the light source modules are arranged in an array, wherein each light source module is electrically connected to the driving circuit, and performs corresponding display by receiving the driving current signal output by the driving circuit.
In the light source assembly, the method for reducing the working current of the backlight module and the display device provided by the embodiment of the invention, the K light-emitting elements are connected in series to form the lamp string and are respectively connected with the driving circuit for driving the light source assembly through the first light source bonding pad and the second light source bonding pad, so that the current density in the lamp string is consistent with the current density of the light-emitting chips when each light source assembly is lightened, the effect of sending the same luminous brightness by 1/K of the driving current of the light-emitting chips is achieved, the large driving current caused by the fact that the backlight module adopts one light-emitting chip in each partition is avoided, and the problem caused by the overlarge working current of the conventional backlight module is solved.
The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.
Claims (9)
1. A light source assembly, characterized in that it comprises: k light-emitting elements, K is not less than 2 and is an integer;
a first light source pad; and
a second light source pad;
the K light-emitting elements are connected in series to form a lamp string, the first end of the lamp string is connected with the first light source bonding pad, and the second end of the lamp string is connected with the second light source bonding pad;
the luminous intensity of the K luminous elements working at the current i is the same as that of a single luminous chip working at the current K x i;
the light source assembly further comprises a circuit board and 2K-2 light source bonding pads, wherein K light source bonding pad pairs are formed by the 2K-2 light source bonding pads, the first light source bonding pad and the second light source bonding pad;
be equipped with on the circuit board with K the K circuit board pad pair of light emitting component one-to-one, wherein, each two poles of the earth of light emitting component are connected two light source pads that correspond the light source pad pair respectively, two circuit board pads that correspond the circuit board pad pair are connected respectively to two light source pads, and a circuit board pad of the I circuit board pad pair is connected with a circuit board pad of the I-1 circuit board pad pair, another circuit board pad of the I circuit board pad pair is connected with a circuit board pad of the I +1 circuit board pad pair, I is greater than or equal to 2, and I is less than or equal to K-1.
2. The light source assembly of claim 1, further comprising:
and the packaging body is used for packaging the K light-emitting elements, and the K light-emitting elements are connected in series in the packaging body to form the lamp string.
3. The light source module as recited in claim 1, wherein K light emitting elements are spaced apart and located on a same horizontal plane.
4. The light source assembly of claim 3, wherein K of the light-emitting elements are disposed between the first light source pad and the second light source pad.
5. The light source assembly according to claim 1 or 3, wherein each of the light emitting elements is a high voltage LED chip.
6. The light source assembly of claim 1, wherein the light emitting elements are Mini-LED chips or Micro-LED chips.
7. The light source module as recited in claim 1, wherein K light emitting elements are integrated into a high voltage LED chip.
8. A method for reducing the working current of a backlight module, wherein the backlight module comprises a plurality of light source components arranged in sequence, the method comprising:
the light source assembly is set to be a lamp string formed by connecting K light-emitting elements in series, wherein K is more than or equal to 2 and is an integer;
a first light source bonding pad and a second light source bonding pad are arranged in the light source component, so that the lamp string is connected with a driving circuit for driving the backlight module through the first light source bonding pad and the second light source bonding pad respectively;
the luminous intensity of the K luminous elements working at the current i is the same as that of a single luminous chip working at the current K x i;
the method further comprises the following steps:
setting 2K-2 light source bonding pads to form K light source bonding pad pairs together with the first light source bonding pad and the second light source bonding pad;
set up on the circuit board with K the K circuit board pad pair of light emitting component one-to-one, wherein, each two poles of the earth of light emitting component are connected two light source pads that correspond the light source pad pair respectively, two circuit board pads in corresponding circuit board pad pair are connected respectively to two light source pads, and a circuit board pad of the first circuit board pad pair is connected with a circuit board pad of the first circuit board pad pair, another circuit board pad of the first circuit board pad pair is connected with a circuit board pad of the (I + 1) th circuit board pad pair, I is greater than or equal to 2, and I is less than or equal to K-1.
9. A display device, comprising:
a display panel comprising a plurality of light source modules as claimed in any one of claims 1-7 arranged in sequence; and
and the driving circuit is electrically connected with the display panel and drives the display panel to display the display picture according to the received driving current signal.
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| CN102646694A (en) * | 2012-04-20 | 2012-08-22 | 华南师范大学 | High-voltage direct-current light-emitting diode and preparation method thereof |
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| US6635902B1 (en) * | 2002-05-24 | 2003-10-21 | Para Light Electronics Co., Ltd. | Serial connection structure of light emitting diode chip |
| CN201885038U (en) * | 2010-10-26 | 2011-06-29 | 惠州市寰宇光电科技有限公司 | Novel high-voltage patch LED (light-emitting diode) lamp strip |
| CN102255011B (en) * | 2011-07-15 | 2013-07-03 | 上海蓝光科技有限公司 | Manufacturing method of high-voltage direct current (DC) light-emitting diode (LED) chip |
| CN204927337U (en) * | 2015-09-02 | 2015-12-30 | 罗宇杰 | Luminous AC COB LED light source of full chip |
| CN206610806U (en) * | 2017-04-15 | 2017-11-03 | 大理滇威节能灯具有限公司 | A kind of high-voltage LED lamp bead of integration packaging |
| CN207181893U (en) * | 2017-08-21 | 2018-04-03 | 信利半导体有限公司 | A kind of backlight module |
| CN109654386A (en) * | 2018-08-21 | 2019-04-19 | 广东三彩实业有限公司 | A kind of new structural high-voltage LED light bar |
| CN109346460A (en) * | 2018-09-28 | 2019-02-15 | 晶能光电（江西）有限公司 | MiniLED preparation method |
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