KR102408706B1 - Interior board - Google Patents

Abstract

The present invention relates to an interior board comprising an inorganic board, an adhesive layer, and an interior film layer in order, and having a peeling force of 1.5 kg/in or more.

Description

Interior board {INTERIOR BOARD}

The present invention relates to an interior board.

As an existing building interior finishing material, it is applied by performing exterior design treatment on magnesium, CFC (Cellulose Fiber Reinforced Cements) board, MDF (Medium Density Fiberboard), HDF (High Density Fiberboard), and vermiculite board through HPM and LPM processes.

This, the substrate is not suitable as an environment-friendly and non-combustible material, it is difficult to satisfy various environment-friendly and flame-retardant certification conditions that become more stringent.

On the other hand, for example, a painting treatment process using MDF goes through various processes such as MDF resin adhesive impregnation, sealing, polishing process, urethane spray, and adhesion, and the complexity of these processes is a cause of an increase in unit cost.
As a prior art document, there is Korean Patent Publication No. 10-2008-0017969 (title: dry flooring comprising a surface layer using printing and an inorganic board, publication date: February 27, 2008).

SUMMARY OF THE INVENTION An object of the present invention is to provide an interior board that is environmentally friendly and has excellent non-combustible performance, has price competitiveness, and is easy to apply design by enabling a simplified process.

The objects of the present invention are not limited to the above-mentioned objects, and other objects and advantages of the present invention that are not mentioned may be understood by the following description, and will be more clearly understood by the embodiments of the present invention. It will also be readily apparent that the objects and advantages of the present invention may be realized by the means and combinations thereof indicated in the appended claims.

The interior board of the present invention for solving the above problems is characterized in that the inorganic board includes an adhesive layer and an interior film layer in order, and the peeling force is 1.5 kg/in or more.

In addition, the inorganic board includes an adhesive-impregnated region containing the same adhesive as the adhesive included in the adhesive layer, and the adhesive-impregnated region is formed from the upper surface of the inorganic board to the penetration depth of the adhesive.

In addition, the thickness of the adhesive-impregnated region is characterized in that 0.005mm to 1mm.

In addition, the inorganic board includes voids, and the porosity is 30 to 90%.

In addition, the inorganic board is characterized in that the calcium silicate board, magnesium board or vermiculite board.

In addition, the inorganic board is characterized in that it is a calcium silicate board that has been treated with or not treated with hemp.

In addition, the adhesive is characterized in that the viscosity is 10 cps to 5000 cps at 25 ℃ to 150 ℃.

In addition, the adhesive is a solvent-free curable resin adhesive comprising one selected from the group consisting of a urethane-based adhesive, an epoxy-based adhesive, and a combination thereof.

In addition, the adhesive is characterized in that the moisture curing type hot melt polyurethane adhesive.

In addition, it is characterized in that the adhesive includes a urethane-based resin or an epoxy-based resin having a weight average molecular weight of 1,000 g/mol to 1,000,000 g/mol of the resin before curing.

In addition, the adhesive layer is characterized in that it has a single layer or a multilayer structure of at least two layers.

In addition, the adhesive layer is characterized in that 5㎛ to 300㎛.

In addition, the interior film layer is characterized in that it includes a PVC film.

In addition, the interior board is characterized in that the TVOC is 0.2 mg/m ² ·h or less.

The method for manufacturing an interior board of the present invention for solving the above-described problems comprises the steps of: forming an adhesive layer including an adhesive on the upper surface of the inorganic board including the pores; adjusting a temperature at which the adhesive has a viscosity of 10 cps to 5000 cps, and penetrating the adhesive from the upper surface of the inorganic board in the thickness direction to form an adhesive impregnation region; attaching an interior film layer on the adhesive layer to plywood; It is characterized in that it includes.

In addition, the step of forming a chemical crosslinking by the moisture in the air and the adhesive reacting in the adhesive layer; characterized in that it further comprises.

The interior board according to the present invention can be eco-friendly and have excellent non-combustible performance, and can have a price competitiveness because of a simplified process and can be easily applied to a design.

In addition to the above-described effects, the specific effects of the present invention will be described together while describing specific details for carrying out the invention below.

1 is a cross-sectional view of an interior board according to an embodiment of the present invention.

The above-described objects, features and advantages will be described below in detail with reference to the accompanying drawings, and accordingly, those of ordinary skill in the art to which the present invention pertains will be able to easily implement the technical idea of the present invention. In describing the present invention, if it is determined that a detailed description of a known technology related to the present invention may unnecessarily obscure the gist of the present invention, the detailed description will be omitted. Hereinafter, preferred embodiments according to the present invention will be described in detail with reference to the accompanying drawings. In the drawings, the same reference numerals are used to indicate the same or similar components.

In the following, that an arbitrary component is disposed on the "upper (or lower)" of a component or "upper (or below)" of a component means that any component is disposed in contact with the upper surface (or lower surface) of the component. Furthermore, it may mean that other components may be interposed between the component and any component disposed on (or under) the component.

In addition, when it is described that a component is “connected”, “coupled” or “connected” to another component, the components may be directly connected or connected to each other, but other components are “interposed” between each component. It should be understood that “or, each component may be “connected,” “coupled,” or “connected,” through another component.

Hereinafter, an interior board according to some embodiments of the present invention will be described.

1 schematically shows a cross-section of an interior board 100 according to an embodiment of the present invention.

The interior board 100 of the present invention is a product in which the interior film layer 30 is laminated on the inorganic board 10 and may be used as an interior finishing material.

In general, the interior film layer 30 is directly attached to the wall during construction, but since the interior film layer 30 is thin, construction difficulties may occur, and thus a problem of smoothness may occur, and an adhesive may be used in the field. When doing so, there may be a problem of foreign matter adhering. The interior board 100 does not attach the interior film layer 30 during construction, and the interior film layer 30 is already attached to the inorganic board 10, so it can be easily applied directly for interior wall finishing. It has the advantage of being easy to construct, easy to apply to various bends, and capable of cutting in the field.

The inorganic board 10 is an eco-friendly material and a non-combustible material, and the interior board 100 of the present invention including the same has eco-friendliness and excellent non-combustible performance. However, since it is made into a plate using a small amount of binder under high temperature and high pressure, there is a problem in that the bonding strength between inorganic particles is low.

According to the present invention, the adhesive force between the inorganic board 10 and the interior film layer 30 can be improved by forming the adhesive layer 20 between the inorganic board 10 and the interior film layer 30 using an adhesive. Furthermore, by allowing the adhesive to penetrate to a certain depth in the inorganic board 10 using a low-viscosity adhesive, the bonding force between inorganic particles can be improved, thereby improving durability and compensating for brittleness.

In one embodiment of the present invention, it provides an interior board 100 including the inorganic board 10, the adhesive layer 20, and the interior film layer 30 in order, and having a peeling force of 1.5 kg/in or more.

Since the interior board 100 is based on the inorganic board 10, it is implemented as a non-combustible material and an eco-friendly material.

The inorganic board 10 includes pores as a porous material. The porosity of the inorganic board 10 is preferably 30 to 90%. More preferably, it may be 60 to 62%. When the porosity is in the range of 30% to 90%, mechanical strength and adhesion are excellent, and lightness is improved. The inorganic board 10 may be a calcium silicate board, a magnesium board, or a vermiculite board.

In one embodiment, the inorganic board 10 may be a calcium silicate board with or without a hemp treatment.

The inorganic board 10 includes an adhesive-impregnated region 11 in which an adhesive has penetrated into the pores, and the adhesive-impregnated region 11 includes the same adhesive as the adhesive included in the adhesive layer 20 .

Since the inorganic board 10 is a porous material, when the adhesive layer 20 is formed by applying an adhesive to the upper surface of the inorganic board 10 , the adhesive penetrates into some of the pores of the inorganic board 10 . Specifically, the adhesive component of the adhesive layer 20 penetrates in the thickness direction from the upper surface of the inorganic board 10 to form the adhesive-impregnated region 11 of a predetermined thickness (d). That is, the adhesive-impregnated region 11 is formed over the penetration depth d of the adhesive from the upper surface of the inorganic board 10 . Accordingly, the thickness of the adhesive impregnated region 11 is equal to the penetration depth d of the adhesive starting from the upper surface of the inorganic board. The thickness of the adhesive-impregnated region 11 may be the same as or smaller than the thickness of the inorganic board 10 , and is preferably smaller than the thickness of the inorganic board 10 .

The thickness of the adhesive-impregnated region 11 is about 0.08% to about 20% of the thickness of the inorganic board. Preferably from about 0.1% to about 10%. More preferably, it is about 0.6 to about 1.5%. By forming the adhesive-impregnated region 11 to have a thickness within the above range, the adhesive force of the adhesive layer 20 to the inorganic board 10 can be improved, and the brittleness of the inorganic board 10 can be well compensated. As a result, even when an external impact is applied to the interior board 100 , the possibility of peeling and destruction of the inorganic board 10 is reduced.

The thickness of the inorganic board 10 may be about 1 mm to about 10 mm, but is not particularly limited and inorganic boards of various thicknesses may be used as needed.

The thickness d of the adhesive-impregnated region 11 may represent about 0.005 mm to about 1 mm. Preferably, it may be about 0.010 mm to about 1 mm. By forming the adhesive-impregnated region 11 to have a thickness within the above range, the adhesive force of the adhesive layer 20 to the inorganic board 10 can be improved, and the brittleness of the inorganic board 10 can be well compensated. As a result, even when an external impact is applied to the interior board 100 , the possibility of peeling and destruction of the inorganic board 10 is reduced.

In the present specification, the penetration depth d of the adhesive to the inorganic board 10 , that is, the thickness of the adhesive-impregnated region 11 can be measured in various ways.

First, by utilizing an optical microscope, a difference in refractive index occurs depending on the presence or absence of penetration, so the depth of penetration can be confirmed and a method of measuring the depth through Image Analyzer can be used.

Second, an electron microscope can be used, and at this time, through EDS, the penetration depth can be confirmed by the difference in the composition and density of the elements.

Third, the depth can be confirmed through an infrared spectrometer equipped with an optical microscope for more detailed measurement. Through the depth profiling of the cross-sectioned specimen, the intrinsic IR vibration peak of the adhesive can be checked, its presence can be checked, and the penetration depth can be clearly confirmed through the depth.

When the adhesive layer 20 is formed on the upper surface of the inorganic board 10 , the remaining adhesives other than the adhesive penetrating into the inorganic board 10 are laminated on the upper surface of the inorganic board 10 to form the adhesive layer 20 .

By allowing the adhesive forming the adhesive layer 20 to penetrate into the inorganic board 10 , the viscosity of the adhesive may be adjusted to form the adhesive-impregnated region 11 .

Specifically, the viscosity of the adhesive during the process should be in a state of exhibiting a viscosity (Brookfield viscometer LV) of about 10 cps to about 5,000 cps, more specifically, about 100 cps to about 4,000 cps. Viscosity is a variable that is usually affected by temperature. The adhesive may have a viscosity within the above range at a predetermined temperature, and if the predetermined temperature is a processable temperature, the adhesive impregnated region 11 may be formed.

By allowing the adhesive to have the viscosity range during the manufacturing process of the adhesive layer 20 , the adhesive can penetrate into the inorganic board 10 to form the adhesive-impregnated region 11 . During the manufacturing process of the adhesive layer 20 , by allowing the adhesive to have the above viscosity range, excellent adhesive properties can be realized and the brittleness of the inorganic board 10 can be well compensated. That is, by inducing the interfacial peeling of the inorganic board 10 and the adhesive layer 20 so that the adhesive has the above viscosity range, board destruction does not occur, and the adhesive and peeling strength can be excellent.

If the viscosity is lower than the above range, the penetrating power of the adhesive into the inorganic board 10 is increased, but the balance between the adhesive penetrating and non-penetrating regions in the inorganic board 10 may be broken, and the adhesive properties may be reduced. If the viscosity is higher than the above range, the permeability of the adhesive to the inorganic board 10 is lowered, so that the effect of improving the durability of the inorganic board 10 cannot be obtained, and the inorganic board 10 and the adhesive layer 20 interfacial delamination of , the inorganic board 10 may be destroyed.

The predetermined temperature may be determined in consideration of convenience in the process. For example, the adhesive may have a viscosity of about 10 cps to about 5000 cps at about 25° C. to about 150° C.

In one embodiment of the present invention, the adhesive may be a solvent-free curable resin adhesive comprising one selected from the group consisting of a urethane-based adhesive, an epoxy-based adhesive, and a combination thereof. For example, the adhesive may use polyurethane reactive adhesives that cure by urethane reaction. For example, as the adhesive, both a moisture curing adhesive and a heat curing adhesive may be used.

In addition, the adhesive may be a solvent-free hot melt adhesive. Hot-melt adhesives are not only capable of fast bonding, but also have excellent eco-friendliness because they do not contain toxic and volatile organic compounds (VOCs).

In addition, the adhesive may be a moisture curing hot melt adhesive. The moisture-curable hot-melt adhesive includes a moisture-curable polyurethane-based hot-melt adhesive, a moisture-curable epoxy-based hot-melt adhesive, and the like, and preferably a moisture-curable hot-melt polyurethane adhesive. Moisture-curing hot melt polyurethane adhesive can exhibit adhesion through heating and cooling, so it is easy to process and contains -NCO groups at the ends, so -NCO groups in the adhesive layer meet with moisture in the air after cooling and physically hardening By reacting or reacting with the active hydrogen compound on the bonding surface, it is chemically crosslinked in the physical hardening layer system to impart improved adhesion, water resistance and solvent resistance to the adhesive layer.

When the moisture-curable hot melt polyurethane adhesive is included in the adhesive layer 20 and the adhesive-impregnated region 11 of the present invention, both adhesive strength and durability are improved due to moisture curing. In addition, since the curing reaction rate can be controlled more slowly due to moisture curing, the coating property to the adhesive layer and processing stability are excellent.

The moisture-curable hot melt polyurethane adhesive exhibits a low viscosity, and the change in viscosity under a specific temperature condition is shown in Table 1 below. At about 100° C., it may be 2000 to 5000 cps, at about 130° C. it may be 1000.0 ± 200.0 cps, and at about 130° C., it may be 600.0 ± 200.0 cps.

viscosity
(cps) 100℃ 2500.40 130℃ 1000.50 150℃ 600.20

In one embodiment of the present invention, the weight average molecular weight of the resin before curing of the adhesive is from about 1,000 g/mol to about 1,000,000 g/mol, preferably from about 1,000 g/mol to about 50,000 g/mol of a urethane-based resin or It may include an epoxy-based resin.

In one embodiment of the present invention, the adhesive may be used by mixing a low molecular weight adhesive and a high molecular weight adhesive. A urethane-based resin or an epoxy-based resin having a weight average molecular weight of about 1,000 g/mol to about 50,000 g/mol before curing can be used as the low molecular weight adhesive, and the weight average molecular weight of the resin before curing with the high molecular weight adhesive is about From 500,000 g/mol to about 1,000,000 g/mol, a urethane-based resin or an epoxy-based resin may be used.

By mixing a small amount of the high molecular weight adhesive with a large amount of the low molecular weight adhesive, the viscosity of the adhesive can be controlled and durability can be improved.

An adhesive using a resin having a weight average molecular weight in the above range may implement a viscosity in the above range at a predetermined temperature within a processable temperature range.

If the adhesive can form the adhesive impregnated region 11 by performing the process at a viscosity in the above range during the process, it is limited to the specific properties of liquid adhesive, solid sheet form such as hot melt, B-stage sheet, etc. doesn't happen

For example, if a hot melt adhesive sheet is interposed between the inorganic board 10 and the interior film layer 30 and then heated, the viscosity of the hot melt adhesive sheet is lowered to realize the viscosity in the above range, and some adhesive components are added to the inorganic board Penetrating into (10), the adhesive impregnated region (11) is formed. Then, when the temperature is lowered, the viscosity of the hot melt adhesive sheet increases and the adhesive layer 20 is formed while the rigidity is realized.

For another example, in the case of using the adhesive in a liquid form, when the adhesive is applied to one surface of the inorganic board 10 in a state in which the adhesive has a viscosity in the above range at a predetermined temperature, the adhesive is applied to the inorganic board 10 is penetrated into However, if the temperature is out of the predetermined temperature during the process according to the process time, the viscosity is changed and out of the above range, and it may not be possible to form a penetration depth of a desired depth. Therefore, for a smoother process, the application of the adhesive may be performed in at least two steps.

Specifically, first, a first application step of thinly applying a liquid adhesive is performed, and then a second application step of applying a liquid adhesive relatively thick to implement a predetermined thickness of the adhesive layer 20 may be performed again. have. In the first application step, the adhesive-impregnated region 11 may be formed. In order to help the penetration of the adhesive in the first application step, a solvent-based adhesive may be used. The solvent-based adhesive can be either water-based or oil-based, but may include a water-based solvent in terms of environment-friendliness. When a solvent-type adhesive is used in the first application step, after the first application step, before performing the second application step, a drying step may be performed to volatilize the solvent. The drying step may use a drying oven or UV.

When the adhesive layer 20 is manufactured through this process, a multilayer structure in which the layer formed in the first application step and the interlayer interface formed in the second application step exist may be formed.

Accordingly, the adhesive layer 20 may be formed as a single layer or as a multilayer structure of at least two layers.

The adhesive layer 20 may have a thickness of about 5 μm to about 500 μm, specifically, a thickness of about 5 μm to about 200 μm. The adhesive layer 20 having the thickness range above a predetermined level of adhesion with the inorganic board 10, for example, about 1.5 kg/in or more, can implement excellent adhesion, and at the same time implement excellent non-combustible performance.

The inorganic board 10 is environmentally friendly and useful as a non-combustible material, but has a weak adhesive strength. The interior board 100 can implement excellent adhesion while including the inorganic board 10 as described above.

The interior board 100 is provided with various exterior designs by the interior film layer 30 .

The interior film layer 30 may be manufactured based on PVC including a PVC film, may be formed as a single layer, or may include a multi-layer structure including various functional layers.

In addition, the interior film layer 30 may be embossed to give a three-dimensional effect.

In one embodiment of the present invention, the interior film layer 30 may include a multi-layer structure including a transparent PVC film, a printing layer, and a colored PVC film sequentially.

Specifically, the PVC film may use a straight-chain PVC resin synthesized by suspension polymerization, and may have a hydroxyl value of about 50 to about 70 mg KOH. The PVC film may be manufactured by a method such as calendar processing, and by controlling the hydroxyl value within the above range, it is possible to implement excellent processability while securing mechanical properties (tensile strength, tear strength, etc.).

The PVC film may include a low molecular weight phthalate-based plasticizer and an ester-based polymeric plasticizer. The PVC film uses a polymer plasticizer to improve weather resistance when the interior board is applied to the outside. For example, the PVC film may contain a low molecular weight phthalate-based plasticizer in an amount ranging from about 10 to about 50 phr, and may have excellent calendar processability while securing mechanical properties within the content range.

The PVC film may contain about 1 to about 10 phr of an epoxy-based plasticizer and about 0.1 to about 10 phr of an inorganic thermal stabilizer to ensure thermal stability during processing.

The PVC film has its own flame retardancy due to the characteristics of PVC, but may further include an organic/inorganic flame retardant in order to secure a predetermined non-flammable/quasi-non-flammable performance. In order to further increase flame retardancy, the PVC film may further include flame-retardant silicate (eg, William-Blythe V300, the content of which is less than or equal to about 20 phr to improve flame-retardant performance).

The PVC film may contain MBS (Methacrylate Butadiene Styrene)-based processing aid in an amount of about 10 phr or less to reinforce calendar processability and impact strength.

The interior board 100 of the present invention has a structure including the inorganic board 10, and has TVOC 0.2 mg/m ² ·h or less eco-friendliness, KS F ISO 1182:2009 certification standard, non-combustible grade or higher, or KS F ISO It can satisfy the semi-non-combustible grade or higher of the 5660-1:2008 certification standard.

In the interior board 100 of the present invention, by forming the adhesive-impregnated region 11 , the adhesive force between the inorganic board 10 and the interior film layer 30 is improved, and the brittleness of the inorganic board 10 is supplemented. For example, the corners of the interior film layer 30 are easily peeled off. When the interior film layer 30 is peeled off in this way, the inorganic board 10 is exposed on the surface and is easily broken. In the interior board 100, the interior film layer 30 is not easily peeled off by the adhesive-impregnated region 11, and even if peeled, it is not easily broken because the adhesive-impregnated region 11 of the inorganic board 10 is exposed. It works.

In another embodiment of the present invention, the method comprising: forming an adhesive layer 20 including an adhesive on the upper surface of the inorganic board 10 including pores; adjusting the temperature at which the adhesive has a viscosity of 10 cps to 5000 cps, and penetrating the adhesive from the upper surface of the inorganic board 10 in the thickness direction to form an adhesive impregnated region 11; attaching the interior film layer 30 on the adhesive layer 20 to plywood; It provides a method of manufacturing an interior board comprising a.

In another embodiment of the present invention, the method may further include a step of forming chemical crosslinking by reacting moisture in the air with the adhesive in the adhesive layer 20 .

As the adhesive used to form the chemical crosslinking, it is preferable to use a moisture-curable hot melt polyurethane adhesive.

The above-described interior board may be manufactured by the method for manufacturing the interior board.

Each step of the method for manufacturing the interior board is not limited to the above-described order, and the order may be changed or proceeded simultaneously depending on the type of adhesive and the process method.

A detailed description of the adhesive forming the adhesive layer is the same as described above. The adhesive is not limited to specific properties such as liquid adhesive, solid sheet form such as hot melt, and B-stage sheet. The liquid adhesive can be applied by a method such as roll coating. An adhesive layer may be formed by applying a liquid adhesive on the inorganic board. Forming the adhesive layer may be performed by applying two or more times as described above. For example, forming the adhesive layer may include a first application step and a second application step. When the adhesive used in the first application step contains a solvent, after the first application step, before performing the second application step, a drying step may be performed to volatilize the solvent. The drying step may use a drying oven or UV.

The time for the adhesive due to the adhesive layer to penetrate into the inorganic board may be made within a few minutes at a temperature that implements the above-described viscosity range of the adhesive. For example, the adhesive layer may be contacted to the inorganic board for about 5 to about 60 minutes to achieve a possible depth of penetration.

Hereinafter, Examples and Comparative Examples of the present invention will be described. The following examples are only examples of the present invention, and the present invention is not limited to the following examples.

(Example)

Example 1

A moisture-curable hot melt polyurethane adhesive was applied to a thickness of 100 μm on a 6 mm thick calcium silicate board, and the temperature was raised to 120° C. and left for 30 minutes to allow a part of the adhesive to penetrate into the calcium silicate board, formed.

The adhesive contained a urethane resin having a weight average molecular weight of 10,000 g/mol, and it was confirmed that the adhesive had a viscosity of 1,500 cps at 120° C. by testing in advance. Viscosity was measured through a dynamic shear at each temperature using a rheometer (TA, ARES G2).

The adhesive of the adhesive layer was naturally cooled to become B-stage, and a separately prepared PVC film was laminated at a surface temperature of 50° C. or less to prepare an interior board.

Example 2

The adhesive was replaced with a moisture-curable hot melt polyurethane adhesive containing a urethane resin having a weight average molecular weight of 15,000 g/mol, and the adhesive was tested in advance to confirm that it had a viscosity of 3500 cps at 120°C. Viscosity was measured through a dynamic shear at each temperature using a rheometer (TA, ARES G2).

An interior board was manufactured in the same manner as in Example 1, except that the adhesive was replaced.

Example 3

The adhesive was replaced with a thermosetting hot melt polyurethane adhesive containing a urethane resin having a weight average molecular weight of 30,000 g/mol, and the adhesive was tested in advance to confirm that it had a viscosity of 3200 cps at 120°C. Viscosity was measured through a dynamic shear at each temperature using a rheometer (TA, ARES G2).

An interior board was manufactured in the same manner as in Example 1, except that the adhesive was replaced.

Comparative Example 1

The adhesive was replaced with a moisture-curing hot melt polyurethane adhesive containing a urethane resin having a weight average molecular weight of 10,000 g/mol, and the adhesive was tested in advance to confirm that it had a viscosity of 6000 cps at 80°C. Viscosity was measured through a dynamic shear at each temperature using a rheometer (TA, ARES G2).

An interior board was manufactured in the same manner as in Example 1, except that the adhesive was replaced.

Comparative Example 2

The adhesive was replaced with a moisture-curable hot melt polyurethane adhesive containing a urethane resin having a weight average molecular weight of 15,000 g/mol, and the adhesive was tested in advance to confirm that it had a viscosity of 10,000 cps at 80°C. Viscosity was measured through a dynamic shear at each temperature using a rheometer (TA, ARES G2).

An interior board was manufactured in the same manner as in Example 1, except that the adhesive was replaced.

Comparative Example 3

The adhesive was replaced with a thermosetting hot melt polyurethane adhesive containing a urethane resin having a weight average molecular weight of 30,000 g/mol, and the adhesive was tested in advance to confirm that it had a viscosity of 8,000 cps at 80°C. Viscosity was measured through a dynamic shear at each temperature using a rheometer (TA, ARES G2).

An interior board was manufactured in the same manner as in Example 1, except that the adhesive was replaced.

Comparative Example 4

An interior board was manufactured in the same manner as in Comparative Example 2, except that a moisture-curable hot melt polyurethane adhesive was applied to the calcium silicate board to a thickness of 350 µm.

Comparative Example 5

An interior board was manufactured in the same manner as in Example 1, except that the moisture-curable hot melt polyurethane adhesive of Example 1 was diluted by 50% in toluene solvent and applied.

(evaluation)

Experimental Example 1

For the interior boards prepared in Examples 1 to 3 and Comparative Examples 1 to 5, the penetration depth (d) of the adhesive, that is, the thickness of the adhesive-impregnated region was measured.

By utilizing an optical microscope, the refractive index difference occurred depending on the presence or absence of penetration, and the penetration depth was confirmed and the depth was measured through Image Analyzer.

The thickness (d, penetration depth) of the adhesive-impregnated region measured in Experimental Example 1 is as follows.

division Thickness of impregnated area (A) [mm] A/Weapon board thickness X100(%) Example 1 0.09 1.50 Example 2 0.07 1.17 Example 3 0.04 0.67 Comparative Example 1 0.004 0.067 Comparative Example 2 0.003 0.050 Comparative Example 3 0.001 0.017 Comparative Example 4 0.001 0.017 Comparative Example 5 0.08 1.33

Experimental Example 2: Whether the board is destroyed

Whether or not the board is broken is judged visually, and this is represented by a low value when measuring peel force. That is, it was visually observed whether the destruction of the inorganic board occurred during the peel force evaluation of Experimental Example 3 below.

*Board destruction- X: Weapon board is not destroyed, ○: Weapon board is destroyed.

Experimental Example 3: Peel force evaluation

For the interior boards prepared in Examples 1 to 3 and Comparative Examples 1 to 5, respectively, 180 Peel peel force was measured. Peel force measurement was measured using XP plus, TA (manufactured) according to ASTM 3330 regulations. Since curing occurs due to moisture or heat, the manufactured interior board was left at room temperature for 3 days, and then the sample was cut to a width of 25 mm, and then the strength was measured while biting the strip with a jig and pulling it at a speed of 300 mm/min.

Experimental Example 4: TVOC evaluation

For the interior boards prepared in Examples 1 to 3 and Comparative Examples 1 to 5, respectively, TVOC was evaluated by the small chamber method. Specifically, total volatile organic compounds (TVOC) were evaluated by the ASTM 5116-90 method, and HCHO was evaluated by the EPA-11A method. For reference, TVOC 0.2 mg/m ² ·h or less, toluene 0.08 mg/m ² ·h or less, and formaldehyde 0.015 mg/m ² ·h or less are commercial environmental certification standards.

Experimental Example 5: Evaluation of non-combustible authentication

For the interior boards prepared in Examples 1 to 3 and Comparative Examples 1 to 5, respectively, KS F ISO 1182:2009 test method (flame retardant performance and fire spread prevention structure of building finishing materials (Ministry of Land, Infrastructure and Transport Notification No. 2015-744)) The procedure was carried out according to the conditions of the certification as follows:

After the start of the heating test, the maximum temperature in the furnace must not rise above the final equilibrium temperature by 20K (Kelvin/℃) for 20 minutes (however, if equilibrium is not reached for 20 minutes, the average temperature for the last 1 minute is used as the final equilibrium temperature) , After heating, the mass reduction rate of the specimen should be 30% or less.

* When the non-flammable certification condition is satisfied, 'Non-flammable PASS' is displayed, and when the non-flammable certification condition is not satisfied, 'Non-flammable Fail' is displayed.

The evaluation results of Experimental Examples 2 to 5 are described in Table 3 below.

division destroy the board peel force TVOC
[mg/m ² h] Non-combustible certification Example 1 X 1.7kg/in 0.043 Non-flammable PASS Example 2 X 2.1 kg/in 0.067 Non-flammable PASS Example 3 X 1.9 kg/in 0.089 Non-flammable PASS Comparative Example 1 O 0.8 kg/in 0.052 Non-flammable PASS Comparative Example 2 O 1.1kg/in 0.067 Non-flammable PASS Comparative Example 3 O 0.9 kg/in 0.087 Non-flammable PASS Comparative Example 4 O 1.3kg/in 0.092 Non-combustible Fail Comparative Example 5 X 1.6 kg/in 0.223 Non-flammable PASS

From the above results, in the interior boards of Examples 1 to 3, the inorganic board was not destroyed during the peel force evaluation, and it could be confirmed that the brittleness of the inorganic board was improved due to the adhesive impregnated area, and the peel force test result showed excellent results of 1.5 kg/in or more It can be seen that the peeling force is excellent, and the adhesive force is excellent.

However, even if the adhesive penetrates the inorganic board, as in Comparative Examples 1 to 4, when the penetration depth (thickness of the adhesive impregnated region) of the adhesive is low, the inorganic board has the adhesive on the surface due to the low bonding force between the inorganic particles in the inorganic board. It showed a peeling phenomenon as it was destroyed.

In addition, it was confirmed that the interior boards of Examples 1 to 3 had excellent eco-friendliness by realizing all TVOC values of 0.2 mg/m ² ·h or less, and at the same time satisfied all non-flammable certification conditions to have excellent non-combustible performance. .

However, as in Comparative Example 5, when the toluene solvent was used, it was confirmed that the TVOC value was significantly higher than that of the Example.

As described above, the present invention has been described with reference to the illustrated drawings, but the present invention is not limited by the embodiments and drawings disclosed in this specification, and a variety of It is obvious that variations can be made. In addition, even if the effect of the configuration of the present invention is not explicitly described and described while describing the embodiment of the present invention, it is natural that the effect predictable by the configuration should also be recognized.

10: weapon board
11: Adhesive impregnated area
20: adhesive layer
30: interior film layer
100: interior board

Claims (16)

Including an inorganic board, an adhesive layer, and an interior film layer in order, the peel force is 1.5 kg/in or more,
The inorganic board includes an adhesive-impregnated region containing the same adhesive as the adhesive included in the adhesive layer, and the adhesive-impregnated region is formed from the upper surface of the inorganic board to the depth of penetration of the adhesive,
The thickness of the adhesive-impregnated region is 0.08% to 20% of the thickness of the inorganic board,
The thickness of the adhesive-impregnated region is 0.005 mm to 1 mm,
The inorganic board is a calcium silicate board, a magnesium board or a vermiculite board.
interior board.
delete delete The method according to claim 1, wherein the inorganic board includes voids, and the porosity is 30 to 90%.
interior board.
delete The method according to claim 1, wherein the inorganic board is a calcium silicate board with or without hemp treatment.
interior board.
The method according to claim 1, wherein the adhesive has a viscosity of 10 cps to 5000 cps at 25°C to 150°C.
interior board.
According to claim 1, wherein the adhesive is a solvent-free curable resin adhesive comprising one selected from the group consisting of a urethane-based adhesive, an epoxy-based adhesive, and a combination thereof.
interior board.
The adhesive according to claim 1, wherein the adhesive is a moisture-curable hot melt polyurethane adhesive.
interior board.
According to claim 1, wherein the weight average molecular weight of the resin before curing of the adhesive comprises a urethane-based resin or an epoxy-based resin having a weight average molecular weight of 1,000 g / mol to 1,000,000 g / mol
interior board.
The adhesive layer according to claim 1, wherein the adhesive layer is a single layer or a multilayer structure of at least two layers.
interior board.
The method of claim 1,
The adhesive layer is 5㎛ to 300㎛
interior board.
The method of claim 1,
The interior film layer includes a polyvinyl chloride (PVC) film
interior board.
The method according to claim 1, wherein the interior board has a total volatile organic compound (TVOC) of 0.2 mg/m ² ·h or less.
interior board.
forming an adhesive layer including an adhesive on the upper surface of the inorganic board including the pores;
adjusting the temperature at which the adhesive has a viscosity of 10 cps to 5000 cps, and penetrating the adhesive from the upper surface of the inorganic board in the thickness direction to form an adhesive impregnation region; and
attaching an interior film layer on the adhesive layer to plywood; including,
The thickness of the adhesive-impregnated region is 0.08% to 20% of the thickness of the inorganic board,
The thickness of the adhesive-impregnated region is 0.005 mm to 1 mm,
The inorganic board is a calcium silicate board, a magnesium board or a vermiculite board.
Method for manufacturing interior boards.
16. The method of claim 15, further comprising the step of forming a chemical cross-linkage by reacting the adhesive with moisture in the air in the adhesive layer.
Method for manufacturing interior boards.

Images