KR102406289B1 - Image management method of component mounting apparatus - Google Patents

Abstract

The present invention is an image management method for managing and taking action in conjunction with a component mounting device, comprising the steps of photographing and storing a component mounting process as an image, and synchronizing production information and equipment logs together with the stored image with the image and storing it as metadata, and when an error occurs in the component mounting process, separately storing an image including the point where the error occurred as an event image, and a timeline that enables movement from the current location to a specific point in time through a user interface and displaying the captured image and the metadata on a display together.
In addition, the image management method of the component mounting apparatus as described above may be implemented in various ways according to embodiments.

Description

Image management method of component mounting apparatus

The present invention relates to a method for managing an image of a component mounting apparatus, and for example, by making each component production facility and inspection facility in-line, a component capable of quickly acquiring information and solving it according to an error event occurrence It relates to an image management method of a mounted device.

The PCB assembly line refers to a manufacturing line that assembles small chip components such as resistors, capacitors, and transistors to large precision components such as various ICs and QFP (Quad Flat Package) components and connectors on the PCB. And there is a surface mount device (SMD) that attaches these parts to the surface instead of the existing insertion method.

A manufacturing line for assembling a surface mount type PCB is called an SMT (Surface Mounting Technology) in-line system. The PCB assembly process is a screen printer process that applies lead cream to the PCB surface, a chip mounter process that mounts parts on the PCB, and a reflower process that heats the lead cream applied to the PCB. can be classified into three processes.

In addition, inspection equipment such as SPI or Automatic Optical Inspection (AOI) may be installed between processes to detect defects in each process execution. In particular, the automatic optical inspection machine (AOI) is applied to inspect the component mounting state and solder state after the chip mount process or the reflow process.

After acquiring the PCB image, the Automatic Optical Inspection Machine (AOI) determines whether there is a defect and notifies the operator. The operator who receives the notice inquires the relevant mounting point in the Offline Programming System (OLP) and corrects the problem. If the problem cannot be identified, the installation point approaches the production facility and solves the problem by observing the actual production process. The main means for solving the problem are correcting the absorption coordinates, correcting the mounting point coordinates, changing the lighting value, changing the parts, and rechecking the screen print.

However, in such a component mounting device, there are inevitably some combinations that cannot be accurately confirmed in the detection method due to the lack of base image data in the problem analysis stage.

For example, suction failure due to the continuous failure of the pickup operation, insertion failure such as mounting failure such as flying, dropping, or erroneous installation of parts during the mounting process, or with previously mounted parts during the head movement or mounting process Defects that cannot be accurately checked for problems such as collisions between nozzles and parts, such as physical collisions between nozzles held by the head, or mechanical problems such as nozzle spring pressing, screw loosening, and collision with moving obstacles due to operator error during manual operation admit.

In addition, the component mounting device cannot perform convenient analysis through image data, and there is a problem in that it is easier to intuitively search for existing detectable defects.

Japanese Patent Registration No. 6243346 (Registration Date: 2017.11.17)

The technical problem to be achieved by the present invention is to provide an image management method of a component mounting device that can efficiently monitor the process line to ensure stability when operating a PCB production line composed of a chip mounter.

In addition, the technical problem to be achieved by the present invention is to solve the inconvenience of an operator having to visually observe the inside of the equipment from the outside or install a recording device, and to detect the normal and abnormal operation of the equipment and provide quick feedback thereto Through this, it is intended to provide an image management method of a component mounting device that can maximize productivity.

In addition, the technical problem to be achieved by the present invention is to provide a separate device module that can act independently of the chip mounter, so that the operator can record the screen at a desired location through an individual program, and the equipment status together with images and logs An object of the present invention is to provide an image management method of a component mounting device that enables accurate confirmation.

The problems to be solved by the present invention are not limited to the problems mentioned above, and other problems not mentioned will be clearly understood by those skilled in the art from the following description.

An image management method for managing and taking action images taken in conjunction with a component mounting device according to an embodiment of the present invention,

Recording and storing the component mounting process as an image;

synchronizing production information and equipment logs together with the stored images with the images and storing them as metadata;

When an error occurs in the component mounting process, separately storing an image including a point where the error occurs as an event image; and

The method may include executing a timeline that enables movement from a current location to a specific time point through a user interface, and displaying the captured image and the metadata on a display together.

The detection of the error may be obtained from a difference image between the image of the normal part/mounted part and the image of the problem part/mounted part.

The user interface allows only the event image to be searched and inquired by a user's command, and may further include transmitting necessary information to the outside (cloud, etc.) when the error is detected.

The details of other embodiments are included in the detailed description and drawings.

In the image management method of the component mounting apparatus according to the embodiment of the present invention as described above, real-time production information of the production line can be acquired while the component mounting apparatus is driven, and error information detected by the optical inspection machine during production is converted into an image. In addition to being able to acquire, check, and analyze, there is an advantage that the operator can take immediate action on the occurrence of an error through accurate error information, which can improve productivity.

In addition, the image management method of the component mounting apparatus according to the embodiment of the present invention has an advantage in that an operator can check an error that is difficult to confirm with the naked eye through a display, so that the error can be solved quickly.

In addition, the method for managing an image of a component mounting apparatus according to an embodiment of the present invention has an advantage in that accurate information for error resolution can be transmitted to a CS engineer, and accurate A/S can be received in various ways.

Effects of the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a diagram schematically showing a component mounting apparatus having an image storage and inquiry system in an image management method of a component mounting apparatus according to an embodiment of the present invention.
2 is a view showing, for example, display confirmation through an image storage and inquiry system in an image management method of a component mounting apparatus according to an embodiment of the present invention.
3 is a diagram illustrating an image of a defective part through an image storage and inquiry system in a component mounting apparatus according to an embodiment of the present invention.
4 is a schematic flowchart illustrating an image management method of a component mounting apparatus according to an embodiment of the present invention.
5 is a flowchart when a defect occurs in an image management method of a component mounting apparatus according to an embodiment of the present invention.

Advantages and features of the present invention and methods of achieving them will become apparent with reference to the embodiments described below in detail in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, and only these embodiments allow the disclosure of the present invention to be complete, and common knowledge in the art to which the present invention pertains It is provided to fully inform those who have the scope of the invention, and the present invention is only defined by the scope of the claims. Like reference numerals refer to like elements throughout.

Accordingly, in some embodiments, well-known process steps, well-known structures, and well-known techniques have not been specifically described in order to avoid obscuring the present invention.

The terminology used herein is for the purpose of describing the embodiments and is not intended to limit the present invention. In this specification, the singular also includes the plural unless specifically stated otherwise in the phrase. As used herein, includes and/or comprising refers to the presence or addition of one or more other components, steps, operations and/or elements other than the recited elements, steps, operations and/or elements. It is used in the sense of not being excluded. And, “and/or” includes each and every combination of one or more of the recited items.

Further, the embodiments described herein will be described with reference to cross-sectional and/or schematic diagrams that are ideal illustrative views of the present invention. Accordingly, the shape of the illustrative drawing may be modified due to manufacturing technology and/or tolerance. Accordingly, the embodiments of the present invention are not limited to the specific form shown, but also include changes in the form generated according to the manufacturing process. In addition, in each of the drawings shown in the present invention, each component may be enlarged or reduced to some extent in consideration of convenience of description. Like reference numerals refer to like elements throughout.

Hereinafter, the present invention will be described with reference to the drawings for explaining the component mounting apparatus 10 and an image management method thereof according to embodiments of the present invention.

1 is a diagram schematically showing a component mounting apparatus 10 having an image storage and inquiry system 12 in the image management method of the component mounting apparatus 10 according to an embodiment of the present invention. 2 is a view showing, for example, display confirmation through the image storage and inquiry system 12 in the image management method of the component mounting apparatus 10 according to an embodiment of the present invention.

1 and 2, the image management method of the component mounting apparatus 10 according to an embodiment of the present invention is an equipment monitoring system, and when operating the component production line 11 composed of a chip mounter, Efficiently monitor the inside to ensure stability. To this end, a system 12 (as the image storage and inquiry system 12, hereinafter referred to as 'system') configured separately from the component production line composed of a chip mounter may be configured by connecting it to the component production line 11 .

Specifically, the component mounting apparatus 10 according to an embodiment of the present invention may include a component production line 11 , an optical inspection machine 11a and an image storage and inquiry system 12 .

The part production line 11 may be configured with at least one configuration for mounting parts.

The optical inspector 11a may be installed between at least one process of the part production line 11 and detect whether there is a defect in the process execution of the part production line 11 . In particular, the optical inspector 11a may be applied to inspect a component mounting state and a solder state after a chip mount process or a reflow process.

The optical inspector 11a may determine whether there is a defect after acquiring an image of the component and provide the defect to the system 12 .

The image storage and inquiry system 12 (hereinafter, 'system') may be configured to be individually interlocked with the parts production line 11 and the optical inspection machine 11a, respectively. The system 12 may acquire and store real-time part production information of the parts production line 11 in the form of a real-time image. Here, the real-time production report may include all relevant information including the production video.

The system 12 may acquire the information acquired by the optical inspection device 11a as an image that can be analyzed and confirmed.

Specifically, when a problem occurs in the optical inspection machine 11a during component production in the component production line 11 , the system 12 can acquire and confirm information about it.

The information acquired from the optical inspector 11a is provided to the independently connected system 12, and after analyzing the information acquired through the system 12, that is, information on defects or errors, it can be confirmed through the provided display. can be displayed.

In addition, the acquired information may be classified for each process operation. For example, if the acquired information is a screen printer process, it is a screen printer job, if it is a chip mounter process, it is a chip mounter job, and if it is a buffer process, it is a buffer job. can be classified individually.

In addition, it is possible to immediately check the cause of the error or defect through the displayed image through the acquired information and take action immediately.

FIG. 3 is a view showing an image of confirmation of a defective part through the image storage and inquiry system 12 in the component mounting apparatus 10 according to an embodiment of the present invention.

Referring to FIG. 3 , the acquired information may be analyzed in the system 12 . Specifically, during the process of the component mounting device 10, errors or defects that are difficult for an operator to visually check may occur. The system 12 may compare such errors or defects that are difficult to confirm with the naked eye with a normal image and project the difference to be displayed on the display.

That is, the system 12 can acquire and store real-time production information through the optical inspection device 11a. The production information stored in the system 12 is a normal image, and when a defect or an error is detected in the optical limiting device, the resulting image (hereinafter referred to as an 'error image') can be compared with the normal image stored in real time. .

A difference can be derived by comparing the normal image and the error image, and an abnormal object tracking image can be provided to the operator while displaying or overlaying the part with the difference. The operator will be able to take immediate action on errors or defects by referring to the resolution guide through the provided abnormal object tracking image.

In addition, the information acquired from the system 12 may be linked with the CS system 13 (external system 13 or cloud, hereinafter referred to as 'CS system').

That is, as described above, the operator can solve the problem through the abnormal object tracking image according to the error or defect confirmed through the system 12. In case it is not possible, it can be interlocked to solve this problem by interworking with the CS system 13 .

Accordingly, an external CS engineer can check this through the interlocked CS system 13 and provide assistance to promptly solve the problem through a remote or direct visit.

In addition, as the system 12 is interlocked with the CS system 13 , the CS engineer can periodically review the image, so that the status of the part production line 11 can be checked in real time.

4 is a schematic flowchart illustrating an image management method of the component mounting apparatus 10 according to an embodiment of the present invention. 5 is a flowchart when a defect occurs in an image management method of the component mounting apparatus 10 according to an embodiment of the present invention.

4 and 5 , the image management method for managing and taking action images taken in conjunction with the component mounting apparatus 10 according to an embodiment of the present invention 3 includes a line driving step (S10), image capturing and It may be composed of a storage step (S20), a synchronization storage step (S30), an error determination step (S40), an error image storage step (S50), an error comparison step (S60), and an error display step (S70).

That is, the line may be driven according to the application of power (line driving step ( S10 )).

According to the driving of the line, each component mounting process of the component production line 11 described above may be captured and stored as a real-time image through the optical inspection machine 11a (image capturing and storing step S20 ). Specifically, in the step of taking the video and storing the video thereto, the step of synchronizing production information and equipment log with the video to be stored as metadata may be configured (synchronization saving step ( S30)).

Various errors may occur during the component mounting process, such as mechanical problems such as adsorption failure or mounting failure, collision between nozzles and components, screw loosening, and the like. The optical inspector 11a continuously detects this, and it is determined whether an error or defect has occurred in the component mounting step (error determination step S40).

In the normal mounting state, each of the above steps in the component mounting process, that is, an image capturing and storing step, a synchronized storing step, and an error determination step may be repeated continuously.

However, if an error occurs in at least one process during the component mounting process, it is necessary to manage it. The detection of the error may be obtained from a difference image between the image of the normal part/mounted part and the image of the problem part/mounted part. According to the occurrence of an error, the optical inspector 11a captures an image including the point where the error occurs in real time, and separately stores the real-time captured image as an event image (error image storage step (S50)).

The error image stored in the system 12 can be compared with the normal storage that is captured and stored in the system 12 in real time (error comparison step S60).

The comparison image may be displayed on a display together with the captured image and the metadata by executing a timeline that enables movement from the current location to a specific point in time through the user interface (error display step S70).

In addition, the user interface may allow to search and inquire only the event image according to a user's command. The user interface may further include transmitting necessary information to the external system 12 (cloud, etc.) upon detecting the error.

Specifically, after detecting the occurrence of an error (S41), when the image analyzed and confirmed by the system 12 is displayed on the display, the operator can proceed with various responses through the displayed error information (S91 to 93). It can be divided into a direct correspondence method (S91), a corresponding method through the system 12 (S92), and a correspondence through the CS system 13 linked with the system 12 through a user interface (S93). will be.

That is, after detecting the defect in the optical inspector 11a, the operator uses the result detected by the optical inspector 11a in the offline programming system 14 (Offline Programming System, OLP, hereinafter referred to as 'OLP'). can be checked The operator can check the faulty mounting point, part, and feeder through the OLP 14 . In addition, through the system 12, it is possible to inquire the image of the allocated equipment. The operator can check the error through the above process, and proceed to correct the error.

If a direct response due to an error fails, the image analysis function of the system 12 may be utilized or, together with this, a support request through the CS system 13 may be used.

That is, the result detected by the optical inspection device 11a can be checked with the OLP 14, and the mounting point and the component needle feeder where an error has occurred can be checked. In addition, through the system 12, it is possible to inquire the image of the allocated equipment. After viewing the image, the system 12 compares and analyzes the normal image stored by differentiating the image with the error image in which the problem occurs, and confirms the part of the problem through the display. After identifying the part of the problem, the operator can proceed with corrective action.

If the problem of the detected error cannot be confirmed in the state where the error is detected, or the error confirmation fails, or if confirmation is made but a/s is desired, the operator immediately interworks with the CS system 13 to solve the problem. You can get help.

The CS operator who has checked the CS system 13 may check the CS system 13 to immediately identify a problem and give feedback to the operator.

As described above, through the system 12, errors or defects that cannot be resolved by the operator can be reviewed, and problems can be solved through various responses to this, and immediate resolution can be implemented according to the reviewed errors.

Although embodiments of the present invention have been described with reference to the above and the accompanying drawings, those of ordinary skill in the art to which the present invention pertains can practice the present invention in other specific forms without changing its technical spirit or essential features. You can understand that there is Therefore, it should be understood that the embodiments described above are illustrative in all respects and not restrictive.

10: component mounting device
11a: optical inspection machine
11: Parts production line
12: system
13: CS system
14: OLP

Claims (3)

As an image management method for managing and taking action taken in conjunction with a component mounting device,
Taking and storing the component mounting process as an image through an optical inspection machine connected to the component production line;
The production information of real-time parts and the log of the equipment status of the parts mounting line are synchronized with the image together with the image stored in the image storage and inquiry system individually linked with the parts production line and the optical inspection system and stored as metadata to do;
In the component mounting process, when an error occurring between parts and equipment or an error occurring in equipment occurs, separately storing an image including a point where the error occurs as an event image;
In the event image stored in the image storage and inquiry system, a timeline that enables movement from a predetermined position of the image to a specific point in time when the event occurs through a user interface is executed, and is displayed on a display together with the captured image and the metadata. displaying; and
Including an error response proceeding step for responding to the error with respect to the occurrence of the error,
The error response progress step is,
A direct response step in which the operator directly checks and corrects the error location and equipment;
a response step of checking and correcting the location and equipment where the error occurred by utilizing the image analysis function of the image storage and inquiry system when the direct response is impossible; and
If the operator cannot check an error through the image storage and inquiry system, an error occurs through feedback from a CS engineer who reviews the image storage and inquiry system with an externally provided interlocking system to interwork with the image storage and inquiry system Including the step of verifying and correcting the location and equipment,
Video management method of component mounting device. According to claim 1,
The detection of the error is obtained from the difference image between the normal part / installation image and the problem part / installation image to be taken,
Video management method of component mounting device. According to claim 1,
The user interface allows only the event image to be searched and inquired by a user's command, and when the error is detected, further comprising the step of transmitting necessary information to the external linkage system linked with the image storage and inquiry system doing,
Video management method of component mounting device.

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