KR102403580B1 - 쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성 - Google Patents

쉬운 조립을 위한 초소형 또는 초박형 개별 컴포넌트의 구성 Download PDF

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KR102403580B1
KR102403580B1 KR1020217008078A KR20217008078A KR102403580B1 KR 102403580 B1 KR102403580 B1 KR 102403580B1 KR 1020217008078 A KR1020217008078 A KR 1020217008078A KR 20217008078 A KR20217008078 A KR 20217008078A KR 102403580 B1 KR102403580 B1 KR 102403580B1
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layer
substrate
release layer
handle
ultra
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KR20210033071A (ko
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발 마리노브
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쿨리케 & 소파 네덜란드 비.브이.
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    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/26—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with at least one layer which influences the bonding during the lamination process, e.g. release layers or pressure equalising layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • B32B37/02—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by a sequence of laminating steps, e.g. by adding new layers at consecutive laminating stations
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    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • B32B2307/40—Properties of the layers or laminate having particular optical properties
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    • B32B2310/0831—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation using UV radiation
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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Die Bonding (AREA)
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WO2016022528A1 (en) 2016-02-11
KR20170039281A (ko) 2017-04-10
US10529614B2 (en) 2020-01-07
CN113715458A (zh) 2021-11-30
JP2017528006A (ja) 2017-09-21
EP3177463A1 (en) 2017-06-14
KR102866272B1 (ko) 2025-10-02
KR20210033071A (ko) 2021-03-25
US20200135534A1 (en) 2020-04-30
US10937680B2 (en) 2021-03-02
US20210265191A1 (en) 2021-08-26
JP6480583B2 (ja) 2019-03-13
US20170365499A1 (en) 2017-12-21
CN107107600B (zh) 2021-07-27
CN107107600A (zh) 2017-08-29
US20230377936A1 (en) 2023-11-23
US12412772B2 (en) 2025-09-09
US11728201B2 (en) 2023-08-15
KR102240810B1 (ko) 2021-04-15
KR20220075241A (ko) 2022-06-07

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