KR102400344B1 - 패키지 기체 및 그것을 사용한 기밀 패키지 - Google Patents

패키지 기체 및 그것을 사용한 기밀 패키지 Download PDF

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Publication number
KR102400344B1
KR102400344B1 KR1020197017899A KR20197017899A KR102400344B1 KR 102400344 B1 KR102400344 B1 KR 102400344B1 KR 1020197017899 A KR1020197017899 A KR 1020197017899A KR 20197017899 A KR20197017899 A KR 20197017899A KR 102400344 B1 KR102400344 B1 KR 102400344B1
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KR
South Korea
Prior art keywords
package
glass
material layer
sealing material
frame portion
Prior art date
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KR1020197017899A
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English (en)
Korean (ko)
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KR20190118150A (ko
Inventor
마사유키 히로세
요시오 우마야하라
Original Assignee
니폰 덴키 가라스 가부시키가이샤
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Application filed by 니폰 덴키 가라스 가부시키가이샤 filed Critical 니폰 덴키 가라스 가부시키가이샤
Publication of KR20190118150A publication Critical patent/KR20190118150A/ko
Application granted granted Critical
Publication of KR102400344B1 publication Critical patent/KR102400344B1/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/06—Containers; Seals characterised by the material of the container or its electrical properties
    • H01L23/08—Containers; Seals characterised by the material of the container or its electrical properties the material being an electrical insulator, e.g. glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/562—Protection against mechanical damage
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/564—Details not otherwise provided for, e.g. protection against moisture

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Glass Compositions (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Control And Other Processes For Unpacking Of Materials (AREA)
KR1020197017899A 2017-02-27 2018-02-19 패키지 기체 및 그것을 사용한 기밀 패키지 KR102400344B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2017-034462 2017-02-27
JP2017034462A JP6913279B2 (ja) 2017-02-27 2017-02-27 気密パッケージ
PCT/JP2018/005716 WO2018155373A1 (ja) 2017-02-27 2018-02-19 パッケージ基体及びそれを用いた気密パッケージ

Publications (2)

Publication Number Publication Date
KR20190118150A KR20190118150A (ko) 2019-10-17
KR102400344B1 true KR102400344B1 (ko) 2022-05-20

Family

ID=63253701

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020197017899A KR102400344B1 (ko) 2017-02-27 2018-02-19 패키지 기체 및 그것을 사용한 기밀 패키지

Country Status (5)

Country Link
JP (1) JP6913279B2 (zh)
KR (1) KR102400344B1 (zh)
CN (1) CN110268516A (zh)
TW (1) TWI790223B (zh)
WO (1) WO2018155373A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10811581B2 (en) 2018-06-15 2020-10-20 Nichia Corporation Method of manufacturing semiconductor device
JP7369091B2 (ja) 2020-05-25 2023-10-25 京セラ株式会社 光学装置用蓋体、光学装置用パッケージ及び光学装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015029907A1 (ja) 2013-08-29 2015-03-05 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5111277A (en) * 1991-03-29 1992-05-05 Aegis, Inc. Surface mount device with high thermal conductivity
JP2905348B2 (ja) * 1992-11-03 1999-06-14 株式会社住友金属エレクトロデバイス セラミックス基板の製造方法
JP4706546B2 (ja) * 2006-04-14 2011-06-22 株式会社大真空 圧電振動デバイスの製造方法
WO2012117978A1 (ja) * 2011-02-28 2012-09-07 旭硝子株式会社 気密部材とその製造方法
JP6111022B2 (ja) * 2011-06-17 2017-04-05 株式会社半導体エネルギー研究所 封止体の作製方法および発光装置の作製方法
JP2013239609A (ja) 2012-05-16 2013-11-28 Asahi Glass Co Ltd 気密部材とその製造方法
JP2014236202A (ja) * 2013-06-05 2014-12-15 旭硝子株式会社 発光装置
TWI686968B (zh) * 2015-02-26 2020-03-01 日商日本電氣硝子股份有限公司 氣密封裝及其製造方法
JP6493798B2 (ja) * 2015-05-28 2019-04-03 日本電気硝子株式会社 気密パッケージの製造方法
CN105448956B (zh) * 2015-12-30 2019-01-25 昆山国显光电有限公司 一种有机发光显示装置及其制备方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015029907A1 (ja) 2013-08-29 2015-03-05 京セラ株式会社 電子部品収納用パッケージおよび電子装置
JP2016027610A (ja) * 2014-06-27 2016-02-18 旭硝子株式会社 パッケージ基板、パッケージ、および電子デバイス

Also Published As

Publication number Publication date
JP2018142568A (ja) 2018-09-13
TW201842594A (zh) 2018-12-01
JP6913279B2 (ja) 2021-08-04
TWI790223B (zh) 2023-01-21
CN110268516A (zh) 2019-09-20
WO2018155373A1 (ja) 2018-08-30
KR20190118150A (ko) 2019-10-17

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