KR102398436B1 - Red light emitting device and lighting system - Google Patents

Abstract

The embodiment relates to a red light emitting device, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system.
The red light emitting device according to the embodiment includes a first conductive type first semiconductor layer 112 ; an active layer 114 on the first conductivity-type first semiconductor layer 112; a second conductivity-type second semiconductor layer 116 on the active layer 114; a second conductivity type third semiconductor layer 123 on the second conductivity type second semiconductor layer 116; A second conductivity type fifth semiconductor layer 125 may be included on the second conductivity type third semiconductor layer 123 .
The second conductivity type third semiconductor layer 123 includes an (Al _x Ga _1-x )InP layer (provided that 0≤x≤1), and in the second conductivity type third semiconductor layer 123 , Al composition may change.

Description

Red light emitting device and lighting device {RED LIGHT EMITTING DEVICE AND LIGHTING SYSTEM}

The embodiment relates to a red light emitting device, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system.

A light emitting diode (LED) is a p-n junction diode with a characteristic in which electric energy is converted into light energy, and can be generated by combining dopants of a semiconductor compound on the periodic table, and by controlling the composition ratio of the semiconductor compound, blue (Blue) Various colors such as a light emitting device, a green light emitting device, an ultraviolet (UV) light emitting device, or a red (RED) light emitting device can be implemented.

For example, there is an AlGaInP-based light emitting diode as a red light emitting device, which can convert injected electric energy into light having a wavelength within a range of about 570 nm to about 630 nm. The change in wavelength depends on the size of the band gap energy of the light emitting diode, and the size of the band gap can be adjusted by changing the composition ratio of Al and Ga, and the wavelength can be shortened as the composition ratio of Al is increased.

On the other hand, recently, AlGaInP-based red LEDs are being applied to high CRI (Color Rendering Index) lighting sources or vehicle light sources, and market competition is intensifying accordingly. is becoming

For example, according to the prior art, a doping element of a carrier is diffused into an active region according to a current injection to cause a decrease in the luminous flux.

In addition, according to the prior art, there is a problem in that the operating voltage Vf increases as the current is injected.

Embodiments are to provide a red light emitting device having high light output, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system.

In addition, the embodiment intends to provide a red light emitting device with high electrical reliability, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system.

The red light emitting device according to the embodiment includes a first conductive type first semiconductor layer 112 ; an active layer 114 on the first conductivity-type first semiconductor layer 112; a second conductivity-type second semiconductor layer 116 on the active layer 114; a second conductivity type third semiconductor layer 123 on the second conductivity type second semiconductor layer 116; A second conductivity type fifth semiconductor layer 125 may be included on the second conductivity type third semiconductor layer 123 .

The second conductivity type third semiconductor layer 123 includes an (Al _x Ga _1-x )InP layer (provided that 0≤x≤1), and in the second conductivity type third semiconductor layer 123 , Al composition may change.

The lighting system according to the embodiment may include a light emitting unit including the red light emitting device.

Embodiments may provide a red light emitting device having high light output, a method of manufacturing a light emitting device, a light emitting device package, and a lighting system.

In addition, the embodiment may provide a red light emitting device with high electrical reliability, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system.

1 is a cross-sectional view of a red light emitting device according to a first embodiment;
2A and 2B are operation voltage data of a red light emitting device according to Comparative Examples and Examples;
3 is a partially enlarged view of a red light emitting device according to an embodiment;
4 is SIMS data of a red light emitting device according to an embodiment;
5A and 5B are luminous flux change rate data during operation/lifetime tests of Comparative Examples and Examples, respectively.
6 is an operating voltage data of a red light emitting device according to a comparative example and an embodiment;
7 is luminous flux data of a red light emitting device according to Comparative Examples and Examples.
8 to 10 are process cross-sectional views of a method of manufacturing a red light emitting device according to an embodiment.
11 is a cross-sectional view of a red light emitting device according to a second embodiment.
12 is a cross-sectional view of a light emitting device package according to the embodiment;
13 is a cross-sectional view of a lighting device according to an embodiment;

In the description of the embodiment, each layer (film), region, pattern or structure is formed “on/over” or “under” the substrate, each layer, region, pad or pattern. When described as being, "above/above" and "below" include those formed "directly" or "via another layer." In addition, the reference for the upper / upper or lower of each layer will be described with reference to the drawings.

(Example)

1 is a cross-sectional view of a red light emitting device 100 according to a first embodiment.

The red light emitting device 100 according to the embodiment includes a first conductivity type first semiconductor layer 112 , an active layer 114 , a second conductivity type second semiconductor layer 116 , and a second conductivity type third semiconductor layer 123 . ), a second conductivity-type fourth semiconductor layer 124 and a second conductivity-type fifth semiconductor layer 125 .

For example, in the embodiment, a first conductivity type first semiconductor layer 112 , an active layer 114 on the first conductivity type first semiconductor layer 112 , and a second conductivity on the active layer 114 . A second semiconductor layer 116, a second conductivity type third semiconductor layer 123 on the second conductivity type second semiconductor layer 116, and a second conductivity type third semiconductor layer 123 on the second semiconductor layer 123 The second conductivity type fifth semiconductor layer 125 may be included.

In addition, the red light emitting device 100 according to the embodiment includes a first conductive type first semiconductor layer 112 , an active layer 114 on the first conductive type first semiconductor layer 112 , and the active layer 114 . A second conductivity type second semiconductor layer 116 is formed thereon, and a second conductivity type fourth semiconductor layer 124 and a second conductivity type fourth semiconductor layer are formed on the second conductivity type second semiconductor layer 116 . A second conductivity-type fifth semiconductor layer 125 may be formed on the 124 .

The second conductivity-type fourth semiconductor layer 124 may include a p-type GaP-based layer of a first concentration, and the fifth semiconductor layer 125 may include a p-type GaP-based layer of a second concentration. .

Unexplained reference numerals among the components shown in FIG. 1 will be described in the following manufacturing method.

Embodiments are to provide a red light emitting device having high light output, a method for manufacturing a light emitting device, a light emitting device package, and a lighting system. In an embodiment, a second conductivity type third semiconductor layer 123 may be included between the active layer 114 and the second conductivity type second semiconductor layer 122 .

The second conductivity type third semiconductor layer 123 may include an (Al _x Ga _1-x )InP layer (where 0≤x≤1).

A composition of Al in the second conductivity-type third semiconductor layer 123 may be changed.

For example, the composition of Al in the second conductivity type third semiconductor layer 123 may gradually increase in the direction of the second conductivity type fifth semiconductor layer 125 from the active layer 114 .

2A and 2B are operating voltage data of a red light emitting device according to a comparative example and an embodiment, respectively.

According to the embodiment, a second conductivity type third semiconductor layer 123 of which Al composition is gradually changed (grading) is inserted between the active layer 114 and the second conductivity type second semiconductor layer 122 to form a band gap. (Eg) A buffer layer can be formed.

As shown in FIG. 2A , in the comparative example, when the bandgap energy (Eg) buffer layer does not exist, that is, when the second conductivity type third semiconductor layer 123 is not present, the current is injected during the reliability life test ( Vf) increased.

On the other hand, as shown in FIG. 2B , when the second conductivity type third semiconductor layer 123 , which is an Eg buffer layer, exists between the active layer 114 and the second conductivity type second semiconductor layer 122 , the operating voltage Vf is The rate of change remained very stable.

3 is a partially enlarged view of the fifth semiconductor layer 125 of the second conductivity type of the red light emitting device according to the embodiment.

In an embodiment, the second conductivity type fifth semiconductor layer 125 may include a superlattice structure of a GaP layer 125a/In _x Ga _1-x P layer (provided that 0≤x≤1) (125b). there is.

The second conductivity-type fifth semiconductor layer 125 may include a third GaP layer 125c doped with a second conductivity-type dopant. The second conductivity-type dopant may be a p-type dopant, but is not limited thereto.

The second conductivity type fifth semiconductor layer 125 may be doped with a second conductivity type dopant at a first concentration, and the GaP layer 125a is doped with a second conductivity type dopant at a lower concentration than the first concentration level. can be The In _x Ga _1-x P layer (where 0≤x≤1) 125b may not be doped with a second conductivity type dopant.

For example, the second conductivity type fifth semiconductor layer 125 may be doped with Mg at a concentration of about 10× ^{10 18} , and the GaP layer 125a may be doped with Mg at a concentration of 10×10 ¹⁷ , and the In _x Ga ₁ The _-x P layer (however, 0≤x≤1) 125b may not be doped with a second conductivity type dopant, but is not limited thereto.

Accordingly, the second conductivity-type fifth semiconductor layer 125 may have a superlattice structure of GaP layer 125a/In _x Ga _1-x P layer (provided that 0≤x≤1) (125b). The In _x Ga _1-x P layer (where 0≤x≤1) 125b shows a low energy level, and the GaP layer 125a is an In _x Ga _1-x P layer (provided that 0≤x≤1) 1) It may represent a higher energy level than (125b).

Next, FIG. 4 is SIMS data of a red light emitting device according to an embodiment.

In an embodiment, the doping concentration of the second conductivity type element of the second conductivity type fourth semiconductor layer 124 may be lower than the doping concentration of the second conductivity type element of the second conductivity type fifth semiconductor layer 125 . .

For example, in the embodiment, the doping concentration of Mg, which is the second conductivity type element of the second conductivity type fourth semiconductor layer 124 , is the second conductivity type element of the second conductivity type fifth semiconductor layer 125 . It may be lower than the doping concentration of Mg.

For example, the second conductivity-type fourth semiconductor layer 124 is a GaP layer, may be doped with Mg as a p-type dopant, and has a concentration of 1X10 ¹⁶ ~ 5X10 ¹⁷ (atoms/cm ^-3 ) can be

For example, the second conductivity type fifth semiconductor layer 125 is a GaP layer, may be doped with Mg as a p-type dopant, and the concentration may be 5X10 ¹⁶ ~ 1X10 ¹⁸ atoms/cm ^-3 there is.

In addition, the doping concentration of the second conductivity type element of the second conductivity type fourth semiconductor layer 124 may be lower than the doping concentration of the second conductivity type element of the second conductivity type second semiconductor layer 122 .

For example, the doping concentration of Mg as the second conductivity type element of the second conductivity type fourth semiconductor layer 124 is the doping concentration of Mg as the second conductivity type element of the second conductivity type second semiconductor layer 122 . may be lower.

For example, the second conductivity type second semiconductor layer 122 is an AlGaInP layer, may be doped with Mg as a p-type dopant, and the concentration may be 5X10 ¹⁶ ~ 1X10 ¹⁸ atoms/cm ^-3 there is.

According to the prior art, the dopant of the second conductivity type fifth semiconductor layer 125, for example, Mg, is diffused into the active layer region according to current injection during the LED life test, causing a drop in the luminous flux. make it

In the embodiment, the doping concentration of Mg, which is the second conductivity type element of the second conductivity type fifth semiconductor layer 125 , in order to prevent a decrease in the luminous flux due to diffusion of the dopant in the second conductivity type fifth semiconductor layer 125 . A dopant that is diffused by interposing a lower second conductivity type fourth semiconductor layer 124 between the second conductivity type fifth semiconductor layer 125 and the second conductivity type second semiconductor layer 122, for example, For example, by trapping Mg, diffusion of the dopant is blocked, so that the luminous flux does not decrease, and the effect of maintaining the initial value can be seen.

5A and 5B are luminous flux change rate data during operation/lifetime tests of Comparative Examples and Examples, respectively. 1 to 9 refer to the sample numbers tested.

In FIG. 5A, the luminous flux deviates from a predetermined tolerance range (±10%) according to current injection (X-axis) during the LED life test.

On the other hand, in FIG. 5B , the luminous flux was maintained without departing from a predetermined tolerance range (±10%) according to current injection (X-axis) during the LED life test.

In an embodiment, the thickness of the fourth semiconductor layer 124 of the second conductivity type may be thinner than the thickness of the fifth semiconductor layer 125 of the second conductivity type. For example, the thickness of the second conductive type fourth semiconductor layer 124 may be about 1500 Å to 5000 Å, and the thickness of the second conductive type fifth semiconductor layer 125 may be 20,000 Å to 50,000 Å. .

In an embodiment, the thickness of the fifth semiconductor layer 125 of the second conductivity type may be greater than the thickness of the second semiconductor layer 122 of the second conductivity type.

For example, the thickness of the fifth semiconductor layer 125 of the second conductivity type may be about 10 times greater than the thickness of the second semiconductor layer 122 of the second conductivity type. Through this, the reliability of the red light emitting device according to the embodiment may be improved, and the luminous flux may be improved.

For example, the thickness of the second conductive type fifth semiconductor layer 125 may be 8,000 Å to 140,000 Å, and the thickness of the second conductive type second semiconductor layer 122 may be 2,000 Å to 6,000 Å. there is.

6 is an operating voltage data of a red light emitting device according to Comparative Examples and Examples, and FIG. 7 is luminous flux data of a red light emitting device according to Comparative Examples and Examples.

6 and 7, according to the embodiment, the thickness of the second conductivity type fifth semiconductor layer 125 serving as current spreading and window in the chip is the second conductivity type. The effect of improving the operating voltage Vf and improving the luminous flux can be seen as it increases by 10 times or more than that of the second semiconductor layer 122 .

In the embodiment, a DBR (Distributed Bragg-Reflector) as the semiconductor reflective layer 107 may be provided between the substrate 105 and the active layer 114 in order to direct the emission distribution in the light emitting device to the upper side.

The semiconductor reflective layer 107 may include a superlattice layer by alternately stacking one or more pairs of a first refractive layer having a first refractive index and a second refractive layer having a second refractive index greater than the first refractive index.

The semiconductor reflective layer 107 may include an AlAs layer (not shown)/AlGaAs layer (not shown), and the semiconductor reflective layer may be doped with a first conductivity type dopant, but is not limited thereto.

The Al composition of the AlAs layer may be higher than the Al composition of the AlGaAs layer, and the semiconductor reflective layer 115 having this structure may effectively reflect light of a wavelength in the red range.

Hereinafter, a method of manufacturing a red light emitting device according to an embodiment will be described with reference to FIGS. 8 to 10 .

First, the substrate 105 is prepared as shown in FIG. 8 . The substrate 105 may be formed of a material having excellent thermal conductivity, and may be a conductive substrate or an insulating substrate. For example, the substrate 105 may include at least one of GaAs, sapphire (Al ₂ O ₃ ), SiC, Si, GaN, ZnO, GaP, InP, Ge, and Ga ₂ 0 ₃ . A concave-convex structure P may be formed on the substrate 105 , but the present invention is not limited thereto. The substrate 105 may be wet-cleaned to remove impurities on the surface.

A buffer layer may be formed on the substrate 105 . The buffer layer may relieve a lattice mismatch between the material of the light emitting structure 110 and the substrate 105, and the material of the buffer layer may be a group III-5 compound semiconductor, for example, GaN, InN, AlN, InGaN, AlGaN, InAlGaN. , and may be formed of at least one of AlInN.

Thereafter, a semiconductor reflective layer 107 may be formed on the substrate 105 or the buffer layer.

The semiconductor reflective layer 107 may form a superlattice layer by alternately stacking one or more pairs of a first refractive layer having a first refractive index and a second refractive layer having a second refractive index greater than the first refractive index.

The semiconductor reflective layer 107 may be formed in situ in MOCVD together with the light emitting structure 110 to be formed later, but is not limited thereto.

In the embodiment, the reflection effect in the semiconductor reflective layer 107 is caused by constructive interference of light waves. The second refractive layer having a large refractive index is located in the outermost layer through which light enters, and the thickness of the second refractive layer having a large refractive index is determined by the refractive index. By making it thinner than the thickness of the small first refractive layer, the constructive interference can be made larger, so that the reflection effect is also increased and the light extraction efficiency can be increased.

The semiconductor reflective layer 107 may include an AlAs layer/AlGaAs layer, and the semiconductor reflective layer 55 may be doped with a first conductivity type dopant, but is not limited thereto.

Next, a light emitting structure 110 including a first conductivity type first semiconductor layer 112 , an active layer 114 , and a second conductivity type second semiconductor layer 116 is formed on the semiconductor reflective layer 107 . can be

The first conductivity type first semiconductor layer 112 may be implemented with a semiconductor compound, for example, a compound semiconductor such as Group III-5, Group II-6, and may be doped with a first conductivity-type dopant. . When the first conductivity-type first semiconductor layer 112 is an n-type semiconductor layer, the n-type dopant may include Si, Ge, Sn, Se, and Te, but is not limited thereto.

The first conductivity type first semiconductor layer 112 is In _x Al _y Ga _1-xy P (0≤x≤1, 0≤y≤1, 0≤x+y≤1) or In _x Al _y Ga ₁ It may include a semiconductor material having a compositional formula of _-xy N (0≤x≤1, 0≤y≤1, 0≤x+y≤1).

The first conductivity type first semiconductor layer 112 may be formed of at least one of AlGaP, InGaP, AlInGaP, InP, GaN, InN, AlN, InGaN, AlGaN, InAlGaN, AlInN, AlGaAs, InGaAs, AlInGaAs, and GaP. there is.

The first conductivity type first semiconductor layer 112 may be formed using a method such as chemical vapor deposition (CVD), molecular beam epitaxy (MBE), sputtering or hydroxide vapor phase epitaxy (HVPE), but is not limited thereto. it is not

Next, the active layer 114 is formed on the first conductivity type first semiconductor layer 112 .

In the active layer 114 , electrons injected through the first conductivity type first semiconductor layer 112 and holes injected through the second conductivity type second semiconductor layer 116 formed later meet each other to form an active layer (light emitting layer) material. A layer that emits light with an energy determined by an intrinsic energy band.

The active layer 114 may be formed of at least one of a single quantum well structure, a multi quantum well (MQW) structure, a quantum-wire structure, or a quantum dot structure.

The active layer 114 may include a well layer/barrier layer structure. For example, the active layer 114 may include any one or more pairs of GaInP/AlGaInP, GaP/AlGaP, InGaP/AlGaP, InGaN/GaN, InGaN/InGaN, GaN/AlGaN, InAlGaN/GaN, GaAs/AlGaAs, and InGaAs/AlGaAs. It may be formed in a structure, but is not limited thereto. The well layer may be formed of a material having a band gap lower than a band gap of the barrier layer.

Next, the second conductivity type second semiconductor layer 116 may be formed of a semiconductor compound. It may be implemented as a compound semiconductor such as Group III-5, Group II-6, or the like, and may be doped with a second conductivity-type dopant.

For example, the second conductivity type second semiconductor layer 116 may be In _x Al _y Ga _1-xy P (0≤x≤1, 0≤y≤1, 0≤x+y≤1) or In _x It may include a semiconductor material having a composition formula of Al _y Ga _1-xy N (0≤x≤1, 0≤y≤1, 0≤x+y≤1). When the second conductivity-type second semiconductor layer 116 is a p-type semiconductor layer, Mg, Zn, Ca, Sr, Ba, or the like may be included as a p-type dopant.

In an embodiment, the first conductivity type first semiconductor layer 112 may be an n-type semiconductor layer, and the second conductivity type second semiconductor layer 116 may be implemented as a p-type semiconductor layer, but is not limited thereto. For example, in an embodiment, the first conductivity-type first semiconductor layer 112 may be implemented as a p-type semiconductor layer, and the second conductivity-type semiconductor layer 116 may be implemented as an n-type semiconductor layer.

In addition, a semiconductor having a polarity opposite to that of the second conductivity type, for example, an n-type semiconductor layer (not shown) may be formed on the second conductivity type second semiconductor layer 116 . Accordingly, the light emitting structure 110 may be implemented as any one of an n-p junction structure, a p-n junction structure, an n-p-n junction structure, and a p-n-p junction structure.

Next, as shown in FIG. 9 , on the second conductivity type second semiconductor layer 116 , the second conductivity type third semiconductor layer 123 , the second conductivity type fourth semiconductor layer 124 , and the second conductivity type agent 5 A semiconductor layer 125 may be formed.

The second conductivity type third semiconductor layer 123 may include an (Al _x Ga _1-x )InP layer (where 0≤x≤1). A composition of Al in the second conductivity-type third semiconductor layer 123 may be changed.

For example, the composition of Al in the second conductivity type third semiconductor layer 123 may gradually increase in the direction of the second conductivity type fifth semiconductor layer 125 from the active layer 114 .

According to the embodiment, a second conductivity type third semiconductor layer 123 of which Al composition is gradually changed (grading) is inserted between the active layer 114 and the second conductivity type second semiconductor layer 122 to form a band gap. (Eg) A buffer layer can be formed.

In the comparative example, when the Eg buffer layer is not present, that is, when the second conductivity type third semiconductor layer 123 is not present, (Vf) is increased as the current is injected during the reliability life test.

On the other hand, in the embodiment, when the second conductivity type third semiconductor layer 123 serving as the Eg buffer layer is present between the active layer 114 and the second conductivity type second semiconductor layer 122 , the rate of change of the operating voltage Vf It has been kept very stable.

Next, the second conductivity-type fourth semiconductor layer 124 may include a p-type GaP-based layer of a first concentration, and the fifth semiconductor layer 125 includes a p-type GaP-based layer of a second concentration. can do.

In an embodiment, the doping concentration of the second conductivity type element of the second conductivity type fourth semiconductor layer 124 may be lower than the doping concentration of the second conductivity type element of the second conductivity type fifth semiconductor layer 125 . .

For example, in the embodiment, the doping concentration of Mg, which is the second conductivity type element of the second conductivity type fourth semiconductor layer 124 , is the second conductivity type element of the second conductivity type fifth semiconductor layer 125 . It may be lower than the doping concentration of Mg.

For example, the second conductivity-type fourth semiconductor layer 124 is a GaP layer, may be doped with Mg as a p-type dopant, and has a concentration of 1X10 ¹⁶ ~ 5X10 ¹⁷ (atoms/cm ^-3 ) can be

For example, the second conductivity type fifth semiconductor layer 125 is a GaP layer, may be doped with Mg as a p-type dopant, and the concentration may be 5X10 ¹⁶ ~ 1X10 ¹⁸ atoms/cm ^-3 there is.

In addition, the doping concentration of the second conductivity type element of the second conductivity type fourth semiconductor layer 124 may be lower than the doping concentration of the second conductivity type element of the second conductivity type second semiconductor layer 122 .

For example, the doping concentration of Mg as the second conductivity type element of the second conductivity type fourth semiconductor layer 124 is the doping concentration of Mg as the second conductivity type element of the second conductivity type second semiconductor layer 122 . may be lower.

For example, the second conductivity type second semiconductor layer 122 is an AlGaInP layer, may be doped with Mg as a p-type dopant, and the concentration may be 5X10 ¹⁶ ~ 1X10 ¹⁸ atoms/cm ^-3 there is.

According to the prior art, the dopant of the second conductivity type fifth semiconductor layer 125, for example, Mg, is diffused into the active layer region according to current injection during the LED life test, causing a drop in the luminous flux. make it

In the embodiment, the doping concentration of Mg, which is the second conductivity type element of the second conductivity type fifth semiconductor layer 125 , in order to prevent a decrease in the luminous flux due to diffusion of the dopant in the second conductivity type fifth semiconductor layer 125 . A dopant that is diffused by interposing a lower second conductivity type fourth semiconductor layer 124 between the second conductivity type fifth semiconductor layer 125 and the second conductivity type second semiconductor layer 122, for example, For example, by trapping Mg, diffusion of the dopant is blocked, so that the luminous flux does not decrease, and the effect of maintaining the initial value can be seen.

In an embodiment, the thickness of the fourth semiconductor layer 124 of the second conductivity type may be thinner than the thickness of the fifth semiconductor layer 125 of the second conductivity type. For example, the thickness of the second conductive type fourth semiconductor layer 124 may be about 1500 Å to 5000 Å, and the thickness of the second conductive type fifth semiconductor layer 125 may be 20,000 Å to 50,000 Å. .

In an embodiment, the thickness of the fifth semiconductor layer 125 of the second conductivity type may be greater than the thickness of the second semiconductor layer 122 of the second conductivity type.

For example, the thickness of the fifth semiconductor layer 125 of the second conductivity type may be about 10 times greater than the thickness of the second semiconductor layer 122 of the second conductivity type. Through this, the reliability of the red light emitting device according to the embodiment may be improved, and the luminous flux may be improved.

For example, the thickness of the second conductive type fifth semiconductor layer 125 may be 8,000 Å to 140,000 Å, and the thickness of the second conductive type second semiconductor layer 122 may be 2,000 Å to 6,000 Å. there is.

6 and 7 , according to the embodiment, the thickness of the second conductivity type fifth semiconductor layer 125 serving as current spreading and window in the chip is the second conductivity type. The effect of improving the operating voltage Vf and improving the luminous flux can be seen as it increases by 10 times or more than that of the second semiconductor layer 122 .

Meanwhile, as shown in FIG. 3 , in the embodiment, the second conductivity type fifth semiconductor layer 125 is a GaP layer 125a/In _x Ga _1-x P layer (provided that 0≤x≤1) (125b). It may include a superlattice structure.

The second conductivity-type fifth semiconductor layer 125 may include a third GaP layer 125c doped with a second conductivity-type dopant. The second conductivity-type dopant may be a p-type dopant, but is not limited thereto.

The second conductivity type fifth semiconductor layer 125 may be doped with a second conductivity type dopant at a first concentration, and the GaP layer 125a is doped with a second conductivity type dopant at a lower concentration than the first concentration level. can be The In _x Ga _1-x P layer (where 0≤x≤1) 125b may not be doped with a second conductivity type dopant.

For example, the second conductivity type fifth semiconductor layer 125 may be doped with Mg at a concentration of about 10× ^{10 18} , and the GaP layer 125a may be doped with Mg at a concentration of 10×10 ¹⁷ , and the In _x Ga ₁ The _-x P layer (however, 0≤x≤1) 125b may not be doped with a second conductivity type dopant, but is not limited thereto.

Accordingly, the second conductivity-type fifth semiconductor layer 125 may have a superlattice structure of GaP layer 125a/In _x Ga _1-x P layer (provided that 0≤x≤1) (125b). The In _x Ga _1-x P layer (where 0≤x≤1) 125b shows a low energy level, and the GaP layer 125a is an In _x Ga _1-x P layer (provided that 0≤x≤1) 1) It may represent a higher energy level than (125b).

Next, a light-transmitting electrode layer 140 may be formed on the second conductivity-type fifth semiconductor layer 125 .

The light-transmitting electrode layer 140 may include an ohmic layer, and may be formed by stacking a single metal, a metal alloy, or a metal oxide in multiple layers to efficiently inject holes.

For example, the light-transmitting electrode layer 140 may be formed of an excellent material that is in electrical contact with a semiconductor. For example, the light-transmitting electrode layer 140 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), or IGTO. (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IZON (IZO Nitride), AGZO (Al-Ga ZnO), IGZO (In-Ga ZnO), ZnO, IrOx, RuOx, NiO, RuOx/ITO, Ni/IrOx/Au, and Ni/IrOx/Au/ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt , Au, and may be formed including at least one of Hf, but is not limited to these materials.

Next, as shown in FIG. 10 , a second electrode 152 may be formed on the light-transmitting electrode layer 140 , and a first electrode 151 may be formed under the substrate 105 .

The second electrode 152 may be electrically connected to the light-transmitting electrode layer 140 . The second electrode 152 may include a contact layer (not shown), an intermediate layer (not shown), and an upper layer (not shown). The contact layer may implement an ohmic contact by including a material selected from Cr, V, W, Ti, Zn, and the like. The intermediate layer may be formed of a material selected from Ni, Cu, Al, and the like. The upper layer may include, for example, Au.

The first electrode 151 may be a conductive metal layer. For example, the first electrode 151 may be a semiconductor substrate (eg, Si, Ge, GaN, GaAs) implanted with Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, Cu-W or impurities. , ZnO, SiC, SiGe, etc.) may be formed of at least one.

11 is a cross-sectional view of a light emitting device according to a second embodiment.

The light emitting device according to the second embodiment may adopt the characteristics of the first embodiment, and the main features of the second embodiment will be mainly described below.

In the light emitting device according to the second embodiment, the second electrode layer 140 may be disposed under the light emitting structure 110 .

The second electrode layer 140 may include a second ohmic layer 141 , a metal reflective layer 142 , a bonding layer 144 , a support substrate 146 , and a lower electrode 148 .

The second ohmic layer 141 may partially contact the second conductivity-type fifth semiconductor layer 125 , and a non-directional reflective layer 132 may be disposed between the second ohmic layer 141 .

For example, the second ohmic layer 141 may be formed of an excellent material that is in electrical contact with the semiconductor. For example, the second ohmic layer 141 may include indium tin oxide (ITO), indium zinc oxide (IZO), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), or indium gallium zinc oxide (IGZO). , IGTO (indium gallium tin oxide), AZO (aluminum zinc oxide), ATO (antimony tin oxide), GZO (gallium zinc oxide), IZON (IZO Nitride), AGZO (Al-Ga ZnO), IGZO (In-Ga ZnO) ), ZnO, IrOx, RuOx, NiO, RuOx/ITO, Ni/IrOx/Au, and Ni/IrOx/Au/ITO, Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn , may be formed including at least one of Pt, Au, and Hf, but is not limited to these materials.

The non-directional reflective layer 132 may have a structure including a metal-based reflective layer (not shown) and an insulating low refractive index layer (not shown) formed on the metal-based reflective layer. The metal-based reflective layer may be Ag or Al, and the insulating low refractive index layer may be a transparent material such as SiO ₂ , Si ₃ N ₄ , or MgO, but is not limited thereto.

The metal reflective layer 142 may be formed of a material having excellent electrical contact and high reflectivity. For example, the metal reflective layer 142 may be formed of a metal or an alloy including at least one of Pd, Ir, Ru, Mg, Zn, Pt, Ag, Ni, Al, Rh, Au, and Hf.

The bonding layer 144 may be formed of nickel (Ni), titanium (Ti), gold (Au), or an alloy thereof, but is not limited thereto.

The support member 70 is, for example, a carrier wafer (eg, GaN, Si, Ge, GaAs, ZnO, SiGe, SiC, etc.), copper (Cu), gold (Au), copper alloy (Cu Alloy), nickel (Ni-nickel), copper-tungsten (Cu-W), and the like may be optionally included.

The lower electrode 148 may be formed of at least one of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, and Cu-W.

A predetermined light extraction pattern R may be formed on the light emitting structure 110 . For example, roughness is formed on the upper surface of the first conductivity-type first semiconductor layer 112 by a dry or wet etching process to form a light extraction pattern R to improve light extraction efficiency.

A pad electrode 174 may be formed on the first conductivity-type first semiconductor layer 112 .

In the embodiment, a branch electrode 172 is formed on the first conductivity type first semiconductor layer 112 with a third ohmic layer 171 interposed therebetween, and the pad electrode 174 is formed on the branch electrode 172 . ) can be formed.

The pad electrode 174 may be in contact with the first conductivity type second semiconductor layer 112 and the branch electrode 172 at the same time, and the pad electrode 174 may be in contact with the first conductivity type second semiconductor layer 112 . ) is not ohmic contact due to shocky contact, etc.

The third ohmic layer 171 may be formed of an excellent material that is in electrical contact with the semiconductor. For example, the third ohmic layer 171 is Ag, Ni, Cr, Ti, Al, Rh, Pd, Ir, Ru, Mg, Zn, Pt, Au, Hf, ITO (indium tin oxide), IZO ( indium zinc oxide), indium zinc tin oxide (IZTO), indium aluminum zinc oxide (IAZO), indium gallium zinc oxide (IGZO), indium gallium tin oxide (IGTO), aluminum zinc oxide (AZO), antimony tin oxide (ATO) , gallium zinc oxide (GZO), IZO Nitride (IZON), AGZO (Al-Ga ZnO), IGZO (In-Ga ZnO), ZnO, IrOx, RuOx, NiO, RuOx/ITO, Ni/IrOx/Au, and Ni It may be formed including at least one of /IrOx/Au/ITO, but is not limited to these materials.

The pad electrode 174 and the branch electrode 172 may be formed of at least one of Ti, Cr, Ni, Al, Pt, Au, W, Cu, Mo, and Cu-W, but is not limited thereto.

A first passivation layer 160 may be formed on an upper surface and a side surface of the light emitting structure 110 , and a second passivation layer 162 may be formed on a side surface and a portion of the upper surface of the pad electrode 174 .

The first passivation layer 160 and the second passivation layer 162 may be formed of an insulating material such as oxide or nitride, but are not limited thereto.

A plurality of red light emitting devices according to the embodiment may be arrayed on a substrate in the form of a package, and optical members such as a light guide plate, a prism sheet, a diffusion sheet, a fluorescent sheet, etc. may be disposed on a path of light emitted from the light emitting device package. .

12 is a view for explaining a light emitting device package 200 in which a red light emitting device is installed according to embodiments.

The light emitting device package 200 according to the embodiment includes a package body part 205 , a third electrode layer 213 and a fourth electrode layer 214 installed on the package body part 205 , and the package body part 205 . A molding member ( 240) may be included.

The third electrode layer 213 and the fourth electrode layer 214 are electrically isolated from each other, and the third electrode layer 213 serves to provide power to the red light emitting device 100 by a wire 230 . can In addition, the third electrode layer 213 and the fourth electrode layer 214 may serve to increase light efficiency by reflecting the light generated by the red light emitting device 100 , and in the red light emitting device 100 , It can also serve to dissipate the generated heat to the outside.

The red light emitting device 100 may be electrically connected to the third electrode layer 213 and/or the fourth electrode layer 214 by any one of a wire method, a flip chip method, and a die bonding method.

The red light emitting device according to the embodiment may be applied to a backlight unit, a lighting unit, a display device, an indicator device, a lamp, a street lamp, a vehicle lighting device, a vehicle display device, a smart watch, and the like, but is not limited thereto.

13 is an exploded perspective view of a lighting system according to an embodiment.

The lighting device according to the embodiment may include a cover 2100 , a light source module 2200 , a heat sink 2400 , a power supply unit 2600 , an inner case 2700 , and a socket 2800 . In addition, the lighting device according to the embodiment may further include any one or more of the member 2300 and the holder 2500 . The light source module 2200 may include a light emitting device or a light emitting device package according to an embodiment.

The light source module 2200 may include a light source unit 2210 , a connection plate 2230 , and a connector 2250 . The member 2300 is disposed on the upper surface of the heat sink 2400 and has guide grooves 2310 into which a plurality of light sources 2210 and a connector 2250 are inserted.

The holder 2500 blocks the receiving groove 2719 of the insulating part 2710 of the inner case 2700 . Accordingly, the power supply unit 2600 accommodated in the insulating unit 2710 of the inner case 2700 is sealed. The holder 2500 has a guide protrusion 2510 .

The power supply unit 2600 may include a protrusion part 2610 , a guide part 2630 , a base 2650 , and an extension part 2670 . The inner case 2700 may include a molding unit together with the power supply unit 2600 therein. The molding part is a part where the molding liquid is hardened, and allows the power supply unit 2600 to be fixed inside the inner case 2700 .

Features, structures, effects, etc. described in the above embodiments are included in at least one embodiment, and are not necessarily limited to only one embodiment. Furthermore, features, structures, effects, etc. illustrated in each embodiment can be combined or modified for other embodiments by those of ordinary skill in the art to which the embodiments belong. Accordingly, the contents related to such combinations and variations should be interpreted as being included in the scope of the embodiments.

In the above, the embodiment has been mainly described, but this is only an example and does not limit the embodiment, and those of ordinary skill in the art to which the embodiment belongs are provided with several examples not illustrated above in the range that does not deviate from the essential characteristics of the embodiment. It can be seen that variations and applications of branches are possible. For example, each component specifically shown in the embodiment can be implemented by modification. And the differences related to these modifications and applications should be interpreted as being included in the scope of the embodiments set forth in the appended claims.

a first conductivity type first semiconductor layer 112 ; active layer 114;
a second conductivity type second semiconductor layer 116 ; Second conductivity type third semiconductor layer 123
a second conductivity-type fourth semiconductor layer 124; a fifth semiconductor layer 125 of a second conductivity type;

Claims (9)

a first conductive type first semiconductor layer;
an active layer on the first conductivity type first semiconductor layer;
a second conductivity-type second semiconductor layer on the active layer;
a second conductivity type third semiconductor layer on the second conductivity type second semiconductor layer;
a second conductivity type fourth semiconductor layer on the second conductivity type third semiconductor layer;
a second conductivity type fifth semiconductor layer on the second conductivity type fourth semiconductor layer;
The second conductivity type third semiconductor layer includes an (Al _x Ga _1-x )InP layer (provided that 0≤x≤1),
The composition of Al in the second conductivity type third semiconductor layer is changed,
The doping concentration of the second conductivity type element of the second conductivity type fourth semiconductor layer is lower than the doping concentration of the second conductivity type element of the second conductivity type second semiconductor layer,
The second conductivity type fifth semiconductor layer includes a superlattice structure of a GaP layer/In _x Ga _1-x P layer (provided that 0≤x≤1) and outer GaP layers,
The outer GaP layers include a first outer GaP layer provided on the second conductivity-type fourth semiconductor layer, and a second outer GaP layer provided opposite the first outer GaP layer,
the second conductivity-type fifth semiconductor layer is doped with a second conductivity-type dopant having a first doping concentration, and the GaP layer is doped with a second conductivity-type dopant having a second doping concentration lower than the first doping concentration; ,
The In _x Ga _1-x P layer (provided that 0≤x≤1) is not doped with a second conductivity type dopant,
The GaP layer exhibits a higher energy level than the In _x Ga _1-x P layer (provided that 0≤x≤1),
The first and second outer GaP layers are a red light emitting device exhibiting a higher energy level than the GaP layer. delete delete According to claim 1,
The doping concentration of the second conductivity type element of the second conductivity type fourth semiconductor layer is
A red light emitting device having a lower doping concentration than the doping concentration of the second conductivity type element of the second conductivity type fifth semiconductor layer. delete 5. The method of claim 4,
The thickness of the second conductivity type fourth semiconductor layer is
A red light emitting device thinner than a thickness of the fifth semiconductor layer of the second conductivity type. 7. The method of claim 6,
The thickness of the fifth semiconductor layer of the second conductivity type is
A red light emitting device thicker than a thickness of the second conductive type second semiconductor layer. delete A lighting system comprising a light emitting unit having a red light emitting device according to any one of claims 1, 4, 6 and 7.

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