KR102381412B1 - 기판 이송 장치 - Google Patents
기판 이송 장치 Download PDFInfo
- Publication number
- KR102381412B1 KR102381412B1 KR1020167022339A KR20167022339A KR102381412B1 KR 102381412 B1 KR102381412 B1 KR 102381412B1 KR 1020167022339 A KR1020167022339 A KR 1020167022339A KR 20167022339 A KR20167022339 A KR 20167022339A KR 102381412 B1 KR102381412 B1 KR 102381412B1
- Authority
- KR
- South Korea
- Prior art keywords
- drive
- arms
- axis
- arm
- power transmission
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 75
- 239000012636 effector Substances 0.000 claims abstract description 68
- 230000005540 biological transmission Effects 0.000 claims abstract description 58
- 238000012546 transfer Methods 0.000 claims description 138
- 238000000034 method Methods 0.000 claims description 41
- 238000012545 processing Methods 0.000 claims description 36
- 230000033001 locomotion Effects 0.000 claims description 25
- 230000009977 dual effect Effects 0.000 claims description 21
- 238000010586 diagram Methods 0.000 description 14
- 238000007789 sealing Methods 0.000 description 11
- 230000008569 process Effects 0.000 description 6
- 239000011553 magnetic fluid Substances 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000008878 coupling Effects 0.000 description 4
- 238000010168 coupling process Methods 0.000 description 4
- 238000005859 coupling reaction Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 235000012431 wafers Nutrition 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000000284 resting effect Effects 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J18/00—Arms
- B25J18/02—Arms extensible
- B25J18/04—Arms extensible rotatable
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J11/00—Manipulators not otherwise provided for
- B25J11/0095—Manipulators transporting wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/009—Gripping heads and other end effectors with pins for accurately positioning the object on the gripping head
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Robotics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Manipulator (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020227010326A KR20220044392A (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461928681P | 2014-01-17 | 2014-01-17 | |
| US61/928,681 | 2014-01-17 | ||
| PCT/US2015/011764 WO2015109189A1 (en) | 2014-01-17 | 2015-01-16 | Substrate transport apparatus |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020227010326A Division KR20220044392A (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20160107327A KR20160107327A (ko) | 2016-09-13 |
| KR102381412B1 true KR102381412B1 (ko) | 2022-03-31 |
Family
ID=53543480
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237021822A Ceased KR20230104993A (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
| KR1020227010326A Ceased KR20220044392A (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
| KR1020167022339A Active KR102381412B1 (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237021822A Ceased KR20230104993A (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
| KR1020227010326A Ceased KR20220044392A (ko) | 2014-01-17 | 2015-01-16 | 기판 이송 장치 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US11273558B2 (enExample) |
| JP (3) | JP6863744B2 (enExample) |
| KR (3) | KR20230104993A (enExample) |
| CN (2) | CN106103011A (enExample) |
| WO (1) | WO2015109189A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180308728A1 (en) * | 2017-02-07 | 2018-10-25 | Brooks Automation, Inc. | Method and apparatus for substrate transport |
| US11088004B2 (en) * | 2018-01-30 | 2021-08-10 | Brooks Automation, Inc. | Automatic wafer centering method and apparatus |
| TWI815869B (zh) | 2018-03-16 | 2023-09-21 | 美商布魯克斯自動機械美國公司 | 基板輸送裝置及用於基板輸送裝置之方法 |
| US11535460B2 (en) * | 2018-05-31 | 2022-12-27 | Brooks Automation Us, Llc | Substrate processing apparatus |
| US11545380B2 (en) * | 2018-11-01 | 2023-01-03 | Brooks Automation Us Llc | Transport apparatus with linear bearing |
| JP6522225B2 (ja) * | 2018-12-19 | 2019-05-29 | 日本たばこ産業株式会社 | 霧化ユニットの製造方法、非燃焼型香味吸引器、霧化ユニット及び霧化ユニットパッケージ |
| CN121011552A (zh) * | 2021-06-30 | 2025-11-25 | 北京屹唐半导体科技股份有限公司 | 传送装置和处理系统 |
| KR102638655B1 (ko) * | 2023-08-07 | 2024-02-20 | 에이피티씨 주식회사 | 멀티 층 efem을 포함하는 기판 이송 장치 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005125479A (ja) * | 2003-04-16 | 2005-05-19 | Daihen Corp | 直線移動機構およびこれを用いた搬送ロボット |
| KR101268111B1 (ko) * | 2013-03-14 | 2013-05-29 | 주식회사 티이에스 | 기판 이송 장치 |
| JP2014030328A (ja) | 2012-06-28 | 2014-02-13 | Ichinomiya Denki:Kk | モータ駆動システム |
Family Cites Families (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5135349A (en) * | 1990-05-17 | 1992-08-04 | Cybeq Systems, Inc. | Robotic handling system |
| JP2808826B2 (ja) * | 1990-05-25 | 1998-10-08 | 松下電器産業株式会社 | 基板の移し換え装置 |
| US5180276A (en) | 1991-04-18 | 1993-01-19 | Brooks Automation, Inc. | Articulated arm transfer device |
| JP2659676B2 (ja) * | 1993-11-02 | 1997-09-30 | シーケーディ株式会社 | ウェハ把持装置 |
| JPH11188670A (ja) * | 1997-12-26 | 1999-07-13 | Daihen Corp | 2アーム方式の搬送用ロボット装置 |
| JP3806272B2 (ja) * | 1999-09-13 | 2006-08-09 | 三菱重工業株式会社 | マルチチャンバ型真空処理システム及び基板搬送装置 |
| US7066707B1 (en) * | 2001-08-31 | 2006-06-27 | Asyst Technologies, Inc. | Wafer engine |
| CN1996552B (zh) * | 2001-08-31 | 2012-09-05 | 克罗辛自动化公司 | 晶片机 |
| US7891935B2 (en) | 2002-05-09 | 2011-02-22 | Brooks Automation, Inc. | Dual arm robot |
| US7837425B2 (en) * | 2003-07-16 | 2010-11-23 | Tokyo Electron Limited | Transportation apparatus and drive mechanism |
| JP4319504B2 (ja) | 2003-10-06 | 2009-08-26 | 東京エレクトロン株式会社 | 基板搬送装置および基板処理システム |
| US7797968B2 (en) | 2004-06-01 | 2010-09-21 | INVISTA North America S.à.r.l. | Method to make circular knit elastic fabric comprising spandex and hard yarns |
| JP2006240867A (ja) * | 2005-03-07 | 2006-09-14 | Hitachi Plant Technologies Ltd | 移載機におけるテレスコピックアームの旋回機構 |
| US8419341B2 (en) * | 2006-09-19 | 2013-04-16 | Brooks Automation, Inc. | Linear vacuum robot with Z motion and articulated arm |
| JP2008246644A (ja) * | 2007-03-30 | 2008-10-16 | Daihen Corp | 搬送装置 |
| US8267636B2 (en) * | 2007-05-08 | 2012-09-18 | Brooks Automation, Inc. | Substrate transport apparatus |
| WO2008140093A1 (ja) | 2007-05-15 | 2008-11-20 | Ulvac, Inc. | 搬送装置及びこれを用いた真空処理装置 |
| JP4766274B2 (ja) | 2007-07-18 | 2011-09-07 | 株式会社安川電機 | 基板搬送ロボット及びそれを備えた半導体製造装置 |
| JP4971063B2 (ja) * | 2007-07-27 | 2012-07-11 | 株式会社ダイヘン | 搬送装置 |
| JP4824645B2 (ja) | 2007-08-03 | 2011-11-30 | 株式会社アルバック | 基板搬送装置 |
| US8777547B2 (en) | 2009-01-11 | 2014-07-15 | Applied Materials, Inc. | Systems, apparatus and methods for transporting substrates |
| JP5304601B2 (ja) * | 2009-11-10 | 2013-10-02 | 株式会社安川電機 | アーム機構およびそれを備えた真空ロボット |
| CN201781112U (zh) | 2010-07-22 | 2011-03-30 | 番禺得意精密电子工业有限公司 | 电连接器 |
| KR101431460B1 (ko) | 2010-08-24 | 2014-08-20 | 울박, 인크 | 반송 장치 |
| JP6525499B2 (ja) * | 2010-10-08 | 2019-06-05 | ブルックス オートメーション インコーポレイテッド | 同軸駆動真空ロボット |
| KR102223624B1 (ko) * | 2010-11-10 | 2021-03-05 | 브룩스 오토메이션 인코퍼레이티드 | 기판 처리 장치 |
| JP2012152851A (ja) * | 2011-01-26 | 2012-08-16 | Sinfonia Technology Co Ltd | 搬送アーム装置 |
| US9188973B2 (en) * | 2011-07-08 | 2015-11-17 | Restoration Robotics, Inc. | Calibration and transformation of a camera system's coordinate system |
| JP2013084823A (ja) | 2011-10-11 | 2013-05-09 | Ulvac Japan Ltd | 搬送ロボット及び真空装置 |
| TW202203356A (zh) * | 2012-02-10 | 2022-01-16 | 美商布魯克斯自動機械公司 | 基材處理設備 |
| KR20130096072A (ko) * | 2012-02-21 | 2013-08-29 | 삼성전자주식회사 | 기판 반송 장치 |
| JP5663638B2 (ja) * | 2012-10-11 | 2015-02-04 | 株式会社ティーイーエス | 基板移送装置 |
| KR101246362B1 (ko) | 2012-10-11 | 2013-03-25 | 주식회사 티이에스 | 기판 이송 장치 |
-
2015
- 2015-01-16 KR KR1020237021822A patent/KR20230104993A/ko not_active Ceased
- 2015-01-16 WO PCT/US2015/011764 patent/WO2015109189A1/en not_active Ceased
- 2015-01-16 US US15/110,130 patent/US11273558B2/en active Active
- 2015-01-16 JP JP2016546929A patent/JP6863744B2/ja active Active
- 2015-01-16 KR KR1020227010326A patent/KR20220044392A/ko not_active Ceased
- 2015-01-16 KR KR1020167022339A patent/KR102381412B1/ko active Active
- 2015-01-16 CN CN201580014344.0A patent/CN106103011A/zh active Pending
- 2015-01-16 CN CN202110464317.0A patent/CN113270350A/zh active Pending
-
2021
- 2021-04-01 JP JP2021063106A patent/JP7280309B2/ja active Active
-
2022
- 2022-03-15 US US17/654,849 patent/US20220266460A1/en active Pending
-
2023
- 2023-05-11 JP JP2023078736A patent/JP2023100955A/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005125479A (ja) * | 2003-04-16 | 2005-05-19 | Daihen Corp | 直線移動機構およびこれを用いた搬送ロボット |
| JP2014030328A (ja) | 2012-06-28 | 2014-02-13 | Ichinomiya Denki:Kk | モータ駆動システム |
| KR101268111B1 (ko) * | 2013-03-14 | 2013-05-29 | 주식회사 티이에스 | 기판 이송 장치 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015109189A1 (en) | 2015-07-23 |
| US20220266460A1 (en) | 2022-08-25 |
| US20160325440A1 (en) | 2016-11-10 |
| US11273558B2 (en) | 2022-03-15 |
| JP2017504492A (ja) | 2017-02-09 |
| JP2021106288A (ja) | 2021-07-26 |
| KR20160107327A (ko) | 2016-09-13 |
| KR20220044392A (ko) | 2022-04-07 |
| JP2023100955A (ja) | 2023-07-19 |
| JP7280309B2 (ja) | 2023-05-23 |
| KR20230104993A (ko) | 2023-07-11 |
| CN106103011A (zh) | 2016-11-09 |
| CN113270350A (zh) | 2021-08-17 |
| JP6863744B2 (ja) | 2021-04-21 |
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| US11978651B2 (en) | Substrate transport apparatus | |
| US20230271792A1 (en) | Substrate processing apparatus | |
| TW202417359A (zh) | 真空基板運送設備 | |
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Legal Events
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|---|---|---|---|
| PA0105 | International application |
Patent event date: 20160816 Patent event code: PA01051R01D Comment text: International Patent Application |
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| PG1501 | Laying open of application | ||
| A201 | Request for examination | ||
| PA0201 | Request for examination |
Patent event code: PA02012R01D Patent event date: 20191231 Comment text: Request for Examination of Application |
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Comment text: Notification of reason for refusal Patent event date: 20210330 Patent event code: PE09021S01D |
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| PE0701 | Decision of registration |
Patent event code: PE07011S01D Comment text: Decision to Grant Registration Patent event date: 20211228 |
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| A107 | Divisional application of patent | ||
| GRNT | Written decision to grant | ||
| PA0104 | Divisional application for international application |
Comment text: Divisional Application for International Patent Patent event code: PA01041R01D Patent event date: 20220328 |
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| PR0701 | Registration of establishment |
Comment text: Registration of Establishment Patent event date: 20220328 Patent event code: PR07011E01D |
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Payment date: 20220329 End annual number: 3 Start annual number: 1 |
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