KR102381307B1 - Photocurable resin composition - Google Patents

Abstract

The present invention relates to a photocurable resin composition, and more particularly, by including an acrylamide monomer, high-speed curing is possible, and has excellent coating properties, adhesion and acid resistance, so that it can be applied to a flexible display substrate. to the composition.

Description

Photocurable resin composition {PHOTOCURABLE RESIN COMPOSITION}

The present invention relates to a photocurable resin composition, and more particularly, to a photocurable resin composition comprising an acrylamide monomer capable of high-speed curing and excellent in coating properties, adhesion properties and acid resistance.

In the photolithography method used to implement fine patterns in the conventional LCD process or semiconductor process for display manufacturing, the circuit line width (or pattern line width) is determined by the wavelength of light used in the exposure process, so it depends on the material and equipment technology. There are many restrictions on the formation of micropatterns. In addition, since exposure, post-exposure bake, development, post-development bake, etching, and cleaning processes must be performed whenever a pattern is formed, it takes a long time and the process is very complicated. In addition, the cost of the expensive exposure machine used to improve the performance is also a problem.

Accordingly, as an alternative to solving these problems, printed electronics-based micro-pattern forming technology has emerged, and, for example, various methods using printing technology are being tried. Among these technologies, the technology using the roll process has a low production cost and can be manufactured on a flexible substrate such as a film, so it is possible to apply it to a flexible display. is gathering, and accordingly, research on materials for forming fine patterns suitable for printing technology is being actively conducted.

Printed electronics-based micropattern formation technology uses UV lamps or UV-LED lamps based on ultraviolet (UV, Ultra Violet) light sources for low-cost equipment and rapid productivity. Therefore, the resin composition for this purpose is basically photocurable. It should be the basis, and since it is made in a continuous process, a fast curing speed by light is essential. In addition, unlike the conventional photosensitive material for photolithography, since a solvent is not used, viscosity is one of the important factors when determining the composition of the composition. That is, the composition capable of forming a fine pattern in the printed electronic process is a photocurable solvent-free material, and in order to realize a fine pattern, a low material viscosity must be maintained, and excellent curing speed, adhesion and acid resistance characteristics are required.

Therefore. In order to be applicable to fine pattern formation while maintaining the advantages of the process, the development of a photocurable resin composition having excellent high-speed curing, low viscosity, adhesion, and acid resistance characteristics is required.

In order to solve the above problems, the present invention is a photocurable resin for fine pattern formation suitable for printed electronic processes that is capable of high-speed photocuring based on an acrylamide monomer and has excellent adhesion, acid resistance and peeling properties to alkali solvents. It aims to provide a composition.

In order to achieve the above object, the present invention

a) from 1 to 50% by weight of acrylamide monomer;

b) 1 to 40% by weight of an acrylic copolymer resin;

c) 10 to 60% by weight of an ethylenic monomer;

d) 1 to 60% by weight of a crosslinkable monomer having at least two or more ethylenic double bonds; and

e) 0.01 to 10% by weight of photopolymerization initiator

It provides a photocurable resin composition comprising a.

In addition, the present invention provides a method of forming a fine pattern, characterized in that the conductive composition is printed on a substrate and exposed to light.

In addition, the present invention provides a display manufactured by applying the method for forming a fine pattern.

Since the photocurable resin composition of the present invention contains an acrylamide monomer, it can be applied to a printed electronics-based process, thereby eliminating the need for the bake and development processes used in conventional photolithography. It is possible to reduce investment cost by using the UV curing machine of

In addition, the photocurable composition of the present invention enables high-speed photocuring through excellent curing for UV photocuring so as to maximize the advantages of the printing process, and exhibits excellent coating properties, adhesion and acid resistance to various base substrates. In addition to glass for LCD and OLED, it can also be applied to flexible displays.

The photocurable resin composition according to the present invention comprises a) an acrylamide monomer, b) an acrylic copolymer resin, c) an ethylenic monomer, d) a crosslinkable monomer having at least two ethylenic double bonds, and e) a photopolymerization initiator characterized in that

Hereinafter, each component will be described.

a) acrylamide monomer

The acrylamide monomer that can be used in the present invention is acrylamide, and includes acrylol morpholine of Formula 1 below, dimethyl acrylamide of Formula 2 (N,N-dimethyl acrylamide), and diethylacrylamide of Formula 3 (N,N). -diethyl acrylamide) and a monomer containing dimethylaminoethyl acrylate of Formula 4 (N,N-dimethylamino ethylacrylate), a monomer containing acrylamide commonly used in the art, and or an acrylate containing an amino group. It may be at least one selected from the group consisting of, and preferably, may be selected from monomers containing acrylamide represented by the following Chemical Formulas 1 to 4. In this case, it has superior high-speed photocuring, excellent adhesion, acid resistance and peeling properties to alkali solvents.

[Formula 1]

[Formula 2]

[Formula 3]

[Formula 4]

In the above, examples of the monomer containing acrylamide commonly used in the art include N,N-dimethylaminopropyl acrylamide, N-isopropyl acrylamide, diacetone acrylamide, isobutoxymethyl acrylamide, t-octyl and acrylamide, and examples of the acrylate containing an amino group include N,N-diethylaminoethyl acrylate and 7-amino-3,7-dimethyloctyl acrylate.

In the present invention, the acrylamide monomer may be used in an amount of 1 to 50% by weight, preferably 1 to 50% by weight, more preferably 5 to 30% by weight based on the total weight of the composition. . When the amount of the monomer used is less than 1% by weight, effects such as curing speed and adhesive strength cannot be seen, and when it exceeds 50% by weight, stability problems of the composition may be caused.

b) acrylic copolymer resin

The acrylic copolymer resin usable in the present invention is an epoxy acrylate resin, a urethane acrylate resin, a polyester acrylate resin, a silicone acrylate resin, an amino acrylate resin, an epoxy methacrylate resin, a urethane methacrylate resin, and a polyester. It may be at least one selected from the group consisting of methacrylate resins, silicone methacrylate resins, amino methacrylate resins, and the like, and the amount used thereof is 1 to 40% by weight, preferably 3 to 20% by weight, based on the total weight of the composition. It is recommended to use the amount in %. When the amount of the resin used is less than 1% by weight, the resin's inherent properties, such as adhesive strength and curing degree, cannot be expressed. there is.

c) ethylenic monomers

Ethylene-based monomers usable in the present invention are methyl acrylate, ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, tert-butyl acrylate, pentyl acrylate, isoamyl acrylate, hexyl acrylate, heptyl acrylate Rate, octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, nonyl acrylate, decyl acrylate, undecyl acrylate, dodecyl acrylate, tetrahydrofurfuryl acrylate, erythritol acrylate, butoxy Ethyl acrylate, ethoxydiethylene glycol acrylate, pentaerythritol acrylate, dierythritol acrylate, polyethylene glycol monoacrylate, polypropylene glycol monoacrylate, methoxyethylene glycol acrylate, methoxy polypropylene glycol acrylate, Phenoxy-2-methylethyl acrylate, 2-phenylphenoxy acrylate, 4-phenylphenoxyethyl acrylate, 3-(2-phenylphenyl)-2-hydroxypropyl acrylate, tricyclodecanyl acrylate Late, phenoxyethoxyethyl acrylate, isopropyl acrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dipentaerythritol acrylate, dicyclopentanyl acrylate, dicyclopentanyloxyethyl acrylate, iso Bornyl acrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, phenyl acrylate, 2-hydroxyethyl acrylate, isobutyl acrylate, caprolactone acrylate, O-phenylphenol ioacrylate, isodecyl acryl Rate, lauryl acrylate, alkyl acrylate, steacrylate, benzyl acrylate, 2-hydroxy acrylate, trimethoxybutyl acrylate, ethyl carbidol acrylate, phenoxyethyl acrylate, 4-hydroxy Butyl acrylate, phenoxy polyethylene glycol acrylate, tetrahydrofuryl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-acryloxyethyl-2-hydroxypropyl phthalate, 2-hydroxy -3-phenoxypropyl acrylate and methacrylates thereof; acrylates containing halogen compounds such as 3-fluoroethyl acrylate and 4-fluoropropyl acrylate and methacrylates thereof; acrylates containing a siloxane group such as triethylsiloxylethyl acrylate and methacrylates thereof; It may be at least one selected from the group consisting of olefins having an aromatic such as styrene-based, vinyl acetate-based, vinylpyridine-based, and the like.

The ethylene-based monomer is preferably used in an amount of 10 to 60% by weight, preferably 20 to 40% by weight, based on the total weight of the composition. When the amount of the ethylene-based monomer used is less than 10% by weight, the composition has a low viscosity and cannot be used as a printed electronic coating solution.

d) a crosslinkable monomer having at least two ethylenic double bonds

The cross-linkable monomers usable in the present invention include ethylene glycol diacrylate, traethylene glycol diacrylate, polyethylene glycol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate, and niophene. Tyl glycol diacrylate, 1,3-butylene glycol diacrylate, tris(2-hydroxyethyl) isocyanate diacrylate, erythritol diacrylate, pentaerythritol diacrylate, dierythritol diacrylate, diacrylate Pentaerythritol diacrylate, bis(hydroxymethyl)tricyclodecanediacrylate, bisphenol A diacrylate and derivatives, glycerin triacrylate, erythritol triacrylate, dierythritol triacrylate, pentaerythritol triacrylate, Dipentaerythritol triacrylate, tris(2-hydroxyethyl) isocyanate triacrylate, sorbitol triacrylate, trimethylpropane triacrylate, erythritol tetraacrylate, pentaesritol tetraacrylate, dierythritol tetraacrylate , dimethylpropane tetraacrylate, dipentaerythritol tetraacrylate, dierythritol pentaacrylate, dipentaerythritol pentaacrylate, dierythritol hexaacrylate, dipentaerythritol hexaacrylate and the group consisting of methacrylates thereof It may be one or more selected from.

The crosslinking monomer is preferably used in an amount of 1 to 60 wt%, preferably 5 to 30 wt%, based on the total weight of the composition. If the amount is less than 1% by weight, a decrease in curing speed and a decrease in strengthening due to weakening of the curing density may occur, and if the amount exceeds 60% by weight, high curing shrinkage and decrease in surface adhesion may occur.

e) photopolymerization initiator

The photopolymerization initiator usable in the present invention is 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylproliophenone, pt-butyltrichloroacetophenone, pt- Butyldichloroacetophenone, benzophenone, 4-chloroacetophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, 2,2 '-dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholino propan-1-one, 2-benzyl-2-dimethylamino-1- ( acetophenone compounds such as 4-morpholinophenyl)-butan-1-one; Benzophenone, benzoyl benzoate, methyl benzoyl benzoate, 4-phenyl benzophenone, hydroxy benzophenone, acrylated benzophenone, 4,4'-bis (dimethyl amino) benzophenone, 4,4'-bis (diethyl amino) benzo benzophenone compounds such as phenone; Thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropyl thioxanthone, 2,4-diethyl thioxanthone, 2,4-diisopropyl thioxanthone, 2-chloro thioxanthone thioxanthone-based compounds such as santhone; benzoin compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal; 2,4,6,-trichloro s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxy styryl)-4, 6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxy naphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxy phenyl )-4,6-bis(trichloromethyl)-s-triazine, 2-(p-triyl)-4,6-bis(trichloromethyl)-s-triazine, 2-phenyl 4,6-bis (trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl s-triazine, 2-(naphtho 1-yl)-4,6-bis(trichloromethyl)-s- Triazine, 2- (4-Methoxy naphtho 1-yl) -4,6-bis (trichloro methyl) -s-triazine, 2-4-trichloro methyl (piperonyl) -6-triazine , 2-4-trichloromethyl (4'-methoxy styryl)-6-triazine may be at least one selected from the group consisting of triazine-based compounds, etc., and preferably acetophenone has a cure margin. advantageous to obtain

The photopolymerization initiator is preferably used in an amount of 0.01 to 10% by weight, preferably 0.5 to 6% by weight, based on the total weight of the composition. When the amount of the photopolymerization initiator used is less than 0.1% by weight, photocuring is not achieved or is slow to obtain the desired curing rate, and when it exceeds 10% by weight, the coating film properties are deteriorated due to the reaction inhibitory effect, or the transmittance of the material is reduced. can happen

The composition of the present invention may also contain various additives, for example, antioxidants, UV absorbers for moisture, UV and heat resistance, excellent coating properties and adhesion to substrates, etc., depending on the intended use of the material. (UV absorber), light stabilizer, heat polymerization inhibitor, aging preventive, plasticizer, silane coupling agent, leveling agent, surface active agent ( Surfactant) and the like may be further included.

The present invention also provides a method for forming a fine pattern, characterized in that the photo-curable resin composition is printed on a substrate and then exposed to light.

In the present invention, the printing includes various printing processes commonly used in the art, for example, gravure off-set printing, gravure direct printing, screen printing, imprinting. and the like may be applied, and as the applicable substrate, all conventional substrates may be applied, for example, all glass substrates or plastic substrates may be applied.

As a light source used for exposure, ultraviolet rays, visible rays, red infrared rays, X-rays, electron beams, etc. may be used, and preferably, ultraviolet rays in a range of 190 to 450 nm may be used. In addition, a high-temperature heat treatment process may be performed thereafter to improve the use and properties of the film.

The photocurable composition containing the acrylamide monomer of the present invention can be applied to a printed electronics-based process, thereby eliminating the need for the bake and development processes used in conventional photolithography. It is possible to reduce investment cost by using a UV curing machine, and it has an advantage in manufacturing a flexible-based display because it can use a roll process.

In addition, the photocurable composition of the present invention is capable of high-speed photocuring through excellent UV photocuring to maximize the advantages of the printing process, and PET (Poly Ethylene Terephthalate) applicable to flexible displays in addition to the existing glass for LCD and OLED. ) Film, PC (Poly Carbonate) Film, PI (Poly Imide) Film, Cu (Capper) deposited on metal foil, ITO (Indium Tin OXxide), Al (Alumium), Mo (Moly), etc. It shows coatability, adhesion and acid resistance.

Hereinafter, preferred examples are presented to help the understanding of the present invention, but the following examples are only illustrative of the present invention and the scope of the present invention is not limited to the following examples.

Examples 1 to 3 and Comparative Example 1

According to the composition of Table 1 below, each component was mixed and uniformly mixed for at least 6 hours at room temperature to prepare a resin composition (unit: parts by weight).

At this time, each component used is as follows:

Acrylamide monomer: acrylmorpholine (ACMO, Acryloyl morpholine, manufactured by Kyojin, Japan) of Formula 1, dimethyl acrylamide of Formula 2 (DMAA, N,N-Dimethyl acrylamide, manufactured by Kyojin, Japan);

Acrylic copolymer resin: (polyester acrylate (PS420, Tetrafuntional Polyester acrylate, Miwon Specialty Chemicals, Korea);

Ethylene-based monomers: (Glycidyl metaacrylate (GMA, Sigma-Aldrich);

Cross-linkable monomers: pentaerythritol triacrylate (PETA, Pentaerythritol triacrylate, Miwon Special Chemicals, Korea), 1,4-butanediol diacrylate (HDDA, 1,4 butandiol diacrylate, Miwon Special Chemicals, Korea); and

Photoinitiator: Darocur TPO (Darocur TPO, Diphenyl (2,4,6-trimethylbenzoyl)-phosphine oxide, Ciba Special Chemicals).

acrylamide
monomer PS420 GMA PETA HDDA TPO Formula 1 Formula 2 Formula 3 Formula 4 Example 1 30 0 0 0 5 10 15 35 5 Example 2 0 30 0 0 5 10 15 35 5 Example 3 15 15 0 0 5 10 15 35 5 Example 4 0 0 30 0 5 10 15 35 5 Example 5 0 0 0 30 5 10 15 35 5 Example 6 0 0 15 15 5 10 15 35 5 Comparative Example 1 0 0 0 0 5 10 45 35 5 Comparative Example 2 0 0 0 0 10 10 40 35 5

Test Example 1

The physical properties of the photocurable resin compositions prepared in Examples 1 to 3 and Comparative Example 1 were measured as follows, and the results are shown in Table 2 below:

1) Curing speed

After applying the composition to a thickness of 0.5 to 5 μm on the cleaned substrate using a cleaning agent, bonding to the polymer mold, curing for each amount of light using a lamp having a wavelength of 365 nm, separating the polymer mold and coating the composition and mold release were performed. At this time, the curing degree of the composition was evaluated by checking the surface state of the cured composition. When the surface state was completely dried, the degree of hardening was evaluated based on the degree of stickiness of the material according to the following criteria:

A: No surface stickiness at all

B: Surface micro-stickiness

C: surface stickiness

D: uncured (liquid state)

2) Adhesion

After applying the composition to a thickness of 0.5 to 5 μm on the substrate cleaned using a cleaning agent, bonding with a polymer mold, curing using a lamp having a wavelength of 365 nm, separating the polymer mold and releasing the composition-coated substrate was carried out. Adhesive force evaluation was performed on the cured composition based on 100 cells through a cross cut method. The substrate used was evaluated according to the following criteria using a bare glass for LCD, a Cu-deposited substrate, an ITO-deposited substrate, and a Mo-deposited substrate on PI (Poly Imide) film, and 3M 610 tape was used for the adhesive evaluation tape:

A: More than 90% of cells remaining on the substrate

B: More than 75% of cells remaining on the substrate

C: 60% or more of cells remaining on the substrate

D: 45% or less of cells remaining on the substrate

3) acid resistance

After applying the composition to a thickness of 0.5 to 5 μm on the PI (Poly Imide) film on which ITO is deposited, and curing it using a lamp having a wavelength of 365 nm by bonding with the polymer mold, the polymer mold is separated and the composition is coated on the substrate and mold release were performed. The released substrate was subjected to an etching process using an ITO etchant. After the etching process, the degree of acid resistance was evaluated based on the degree of ITO damage as follows:

A: ITO damage within 1μm (Etch skew)

B: ITO damage 1μm or more (Etch skew)

C: floating of the cured composition

D: Total ITO damage

curing speed adhesion acid resistance Bare glass Cu Mo Example 1 A A A A B Example 2 B B A B B Example 3 A B A B B Example 4 B B A A B Example 5 B A A B B Example 6 B B A B B Comparative Example 1 C C B D C Comparative Example 2 C C C D C

As shown in Table 2, the photocurable resin composition according to the present invention has a fast curing rate and excellent acid resistance, and also has excellent adhesion to various substrates applicable to flexible displays as well as glass substrates. .

Claims (11)

a) at least one monomer selected from the group consisting of an acrylamide monomer of Formula 1, an acrylamide monomer of Formula 2, an acrylamide monomer of Formula 3, and a dimethylaminoethyl acrylate monomer of Formula 4;
b) an acrylic copolymer resin;
c) ethylenic monomers;
d) a crosslinkable monomer having at least two or more ethylenic double bonds; and
e) photopolymerization initiator
A photocurable resin composition comprising a.
[Formula 1]

[Formula 2]

[Formula 3]

[Formula 4]

According to claim 1,
a) 1 to 50 wt% of one or more monomers selected from the group consisting of acrylamide monomer of Formula 1, acrylamide monomer of Formula 2, acrylamide monomer of Formula 3, and dimethylaminoethyl acrylate monomer of Formula 4 ;
b) 1 to 40% by weight of an acrylic copolymer resin;
c) 10 to 60% by weight of an ethylenic monomer;
d) 1 to 50% by weight of a crosslinkable monomer having at least two or more ethylenic double bonds; and
e) 0.01 to 10% by weight of photopolymerization initiator
A photocurable resin composition comprising a. delete According to claim 1,
The acrylic copolymer resin is an epoxy acrylate resin, a urethane acrylate resin, a polyester acrylate resin, a silicone acrylate resin, an amino acrylate resin, an epoxy methacrylate resin, a urethane methacrylate resin, and a polyester methacrylate resin. , a photocurable resin composition, characterized in that at least one selected from the group consisting of a silicone methacrylate resin and an amino methacrylate resin. According to claim 1,
The ethylene-based monomer is methyl acrylate, ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, tert-butyl acrylate, pentyl acrylate, isoamyl acrylate, hexyl acrylate, heptyl acrylate, octyl acryl Rate, isooctyl acrylate, 2-ethylhexyl acrylate, nonyl acrylate, decyl acrylate, undecyl acrylate, dodecyl acrylate, tetrahydrofurfuryl acrylate, erythritol acrylate, butoxyethyl acrylate, Ethoxydiethylene glycol acrylate, pentaerythritol acrylate, dierythritol acrylate, polyethylene glycol monoacrylate, polypropylene glycol monoacrylate, methoxyethylene glycol acrylate, methoxy polypropylene glycol acrylate, phenoxy-2 -Methylethyl acrylate, 2-phenylphenoxy acrylate, 4-phenylphenoxyethyl acrylate, 3-(2-phenylphenyl)-2-hydroxypropyl acrylate, tricyclodecanyl acrylate, phenoxy Ethoxyethyl acrylate, isopropyl acrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dipentaerythritol acrylate, dicyclopentanyl acrylate, dicyclopentanyloxyethyl acrylate, isobornyl acrylate, Cyclohexyl acrylate, 2-methylcyclohexyl acrylate, phenyl acrylate, 2-hydroxyethyl acrylate, isobutyl acrylate, caprolactone acrylate, O-phenylphenol ioacrylate, isodecyl acrylate, lauryl Acrylate, alkyl acrylate, steacrylate, benzyl acrylate, 2-hydroxyacrylate, trimethoxybutyl acrylate, ethylcarbidol acrylate, phenoxyethyl acrylate, 4-hydroxybutyl acrylate, Phenoxy polyethylene glycol acrylate, tetrahydrofuryl acrylate, 2-hydroxyethyl acrylate, 2-hydroxypropyl acrylate, 2-acryloxyethyl-2-hydroxypropyl phthalate, 2-hydroxy-3-phenoxy cypropyl acrylate and methacrylates thereof; acrylates containing halogen compounds and methacrylates thereof; acrylates containing a siloxane group and methacrylates thereof; and at least one selected from the group consisting of olefins having aromaticity. According to claim 1,
The crosslinking monomer having at least two or more ethylene-based double bonds is ethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, 1,6-hexanediol diacrylate, 1,4-butanediol diacrylate. Acrylate, niopentyl glycol diacrylate, 1,3-butylene glycol diacrylate, tris(2-hydroxyethyl) isocyanate diacrylate, erythritol diacrylate, pentaerythritol diacrylate, dierythritol Diacrylate, dipentaerythritol diacrylate, bis(hydroxymethyl)tricyclodecanediacrylate, bisphenol A diacrylate and derivatives, glycerin triacrylate, erythritol triacrylate, dierythritol triacrylate, pentaeryth Ritol triacrylate, dipentaerythritol triacrylate, tris(2-hydroxyethyl) isocyanate triacrylate, sorbitol triacrylate, trimethylpropane triacrylate, erythritol tetraacrylate, pentaesritol tetraacrylate, Dierythritol tetraacrylate, dimethylpropane tetraacrylate, dipentaerythritol tetraacrylate, dierythritol pentaacrylate, dipentaerythritol pentaacrylate, dierythritol hexaacrylate, dipentaerythritol hexaacrylate and their methacrylates A photocurable resin composition, characterized in that at least one selected from the group consisting of According to claim 1,
The photopolymerization initiator is at least one selected from the group consisting of an acetophenone-based compound, a benzophenone-based compound, a thioxanthone-based compound, a benzoin-based compound, and a triazine-based compound. According to claim 1,
Antioxidant, UV absorber, Light stabilizer, Heat polymerization inhibitor, aging preventive, Plasticizer, Silane coupling agent, Leveling A photocurable resin composition, characterized in that it further comprises at least one additive selected from the group consisting of a leveling agent, and a surface active agent (Surfactant). [Claim 9] A method for forming a fine pattern, characterized in that the photocurable resin composition according to any one of claims 1 to 2 and 4 to 8 is printed on a substrate and exposed to light. A display manufactured by applying the method of forming a fine pattern of claim 9. 11. The method of claim 10,
The display, characterized in that the display is a flexible display.