CN106459316B - Photocurable resin composition - Google Patents
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- CN106459316B CN106459316B CN201580031176.6A CN201580031176A CN106459316B CN 106459316 B CN106459316 B CN 106459316B CN 201580031176 A CN201580031176 A CN 201580031176A CN 106459316 B CN106459316 B CN 106459316B
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Abstract
The present invention relates to a photocurable resin composition, and more particularly, to a photocurable resin composition for forming a fine pattern, which can be rapidly cured by including an acrylamide monomer, has excellent coatability, adhesiveness, and acid resistance, and thus can be applied to a flexible display substrate.
Description
Technical Field
The present invention relates to a photocurable resin composition, and more particularly, to a photocurable resin composition which can be rapidly cured by including an acrylamide monomer and has excellent coatability, adhesiveness, and acid resistance.
Background
In a photolithography method used for realizing a fine pattern in a conventional LCD process or semiconductor process for manufacturing a display, a circuit line width (or a pattern line width) depends on a wavelength of light used in an exposure process, and thus, fine pattern formation is limited in many ways depending on materials and device technologies. Further, each time a pattern is formed, it is necessary to perform exposure, post-exposure baking, development, post-development baking, etching, washing processes, and the like, and thus there is a problem that it takes a long time and the processes are very complicated. In addition, since an expensive exposure apparatus or the like is used to improve the performance, the cost is also a problem.
As a countermeasure for solving such a problem, a fine pattern forming technique based on printed electronics has been developed, and various methods using a Printing (Printing) technique, for example, have been attempted. Among such techniques, a technique using a rolling process (roll process) has been actively studied as a fine pattern forming material suitable for a printing technique because it has advantages that a production cost is low, it can be manufactured based on a Flexible substrate such as a film (film), and it can be applied to a Flexible display (Flexible display).
In the technology of forming fine patterns based on printed electronics, UV lamps or UV-LED lamps based on Ultraviolet (UV) light sources are used for low-cost equipment and rapid productivity, and therefore, a resin composition for this purpose is fundamentally based on photocuring and is formed by a continuous process, and therefore, a rapid curing speed by light is required. In addition, unlike a conventional photosensitive material for lithography, since a solvent is not used, viscosity is also one of important factors in determining the components of the composition. That is, a composition capable of forming a fine pattern in a printed electronic process is used as a solvent-free material capable of being photo-cured, and in order to realize a fine pattern, it is necessary to maintain a low material viscosity, and excellent curing speed, adhesive strength, and acid resistance characteristics are required.
Accordingly, in order to form a fine pattern while maintaining the advantages of the process, development of a photocurable resin composition having rapid curing, low viscosity, and excellent adhesive strength and acid resistance is required.
Disclosure of Invention
Technical subject
In order to solve the above problems, an object of the present invention is to provide a photocurable resin composition for fine pattern formation suitable for a printed electronics process, which can realize rapid photocuring based on an acrylamide monomer and has excellent adhesion, acid resistance, and peeling characteristics in an alkaline solvent.
Means for solving the problems
In order to achieve the above object, the present invention provides a photocurable resin composition comprising: a) 1 to 50 wt% of an acrylamide monomer, b) 1 to 40 wt% of an acrylic copolymer resin, c) 10 to 60 wt% of a vinyl monomer, d) 1 to 60 wt% of a crosslinkable monomer having at least two or more vinyl double bonds, and e) 0.01 to 10 wt% of a photopolymerization initiator.
The present invention also provides a method for forming a fine pattern, which comprises printing the photocurable resin composition on a substrate and exposing the substrate to light.
Further, the present invention provides a display manufactured by the above fine pattern forming method.
Effects of the invention
The photocurable resin composition of the present invention can be applied to a basic process of printing electronics by including an acrylamide monomer, does not require a baking (Bake) and developing (development) process used in the conventional photolithography, can save investment costs by using a low-cost UV curing machine which is not an expensive exposure machine, and has an advantage of being advantageous for manufacturing a flexible display since a rolling process can be used.
Further, the photocurable composition of the present invention can realize rapid photocuring by virtue of an excellent curing degree for UV photocuring to maximize the advantages of a printing process, and exhibits excellent coatability, adhesive force and acid resistance to various base substrates, and thus can be applied to flexible displays in addition to conventional glasses for LCDs and OLEDs.
Detailed Description
The photocurable resin composition according to the present invention is characterized by comprising: a) an acrylamide monomer, b) an acrylic copolymer resin, c) a vinyl monomer, d) a crosslinkable monomer having at least two or more vinyl double bonds, and e) a photopolymerization initiator.
Hereinafter, each component will be described.
a) Acrylamide monomer
The acrylamide monomer that may be used in the present invention may be one or more selected from the group consisting of a monomer including acryloylmorpholine (acryloylmorpholine) of the following chemical formula 1, dimethylacrylamide (N, N-dimethylacrylamide) of the chemical formula 2, diethylacrylamide (N, N-diethylacrylamide) of the chemical formula 3 and dimethylaminoethylacrylate (N, N-dimethylacrylamide) of the chemical formula 4, a monomer including acrylamide and/or an acrylate including an amino group, which are generally used in the art, as acrylamide, and may be preferably selected from monomers including acrylamide of the following chemical formulae 1 to 4. In this case, the composition has more excellent rapid photocuring, excellent adhesion, acid resistance and peeling properties in an alkaline solvent.
[ chemical formula 1]
[ chemical formula 2]
[ chemical formula 3]
[ chemical formula 4]
Examples of the acrylamide-containing monomer generally used in the art include N, N-dimethylaminopropylacrylamide, N-isopropylacrylamide, diacetone acrylamide, isobutoxymethacrylamide, and tert-octylacrylamide, and examples of the amino-containing acrylate include N, N-diethylaminoethyl acrylate, and 7-amino-3, 7-dimethyloctyl acrylate.
In the present invention, the above acrylamide monomer may be used in an amount of 1 to 50% by weight, preferably 1 to 50% by weight, more preferably 5 to 30% by weight, relative to the total weight of the composition. When the amount of the monomer used is less than 1% by weight, the effects such as curing rate and adhesive strength cannot be obtained, and when it exceeds 50% by weight, there is a possibility that the stability of the composition may be deteriorated.
b) Acrylic copolymer resin
The acrylic copolymer resin usable in the present invention may be one or more selected from the group consisting of epoxy acrylate resin, urethane acrylate resin, polyester acrylate resin, silicone acrylate resin, amino acrylate resin, epoxy methacrylate resin, urethane methacrylate resin, polyester methacrylate resin, silicone methacrylate resin, amino methacrylate resin, etc., and is used in an amount of 1 to 40% by weight, more preferably 3 to 20% by weight, based on the total weight of the composition. When the amount of the resin used is less than 1% by weight, inherent properties of the resin such as adhesion and degree of curing of the resin cannot be exhibited, and when the amount exceeds 40% by weight, the viscosity increases and the fluidity decreases, and the resin may not function as a printed electronic coating material.
c) Vinyl monomer
The vinyl monomer usable in the present invention may be selected from the group consisting of methyl acrylate, ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, tert-butyl acrylate, pentyl acrylate, isopentyl acrylate, hexyl acrylate, heptyl acrylate, octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, nonyl acrylate, decyl acrylate, undecyl acrylate, dodecyl acrylate, tetrahydrofurfuryl acrylate, erythritol acrylate, butoxyethyl acrylate, ethoxydiglycol acrylate, pentaerythritol acrylate, dipentaerythritol acrylate, polyethylene glycol monoacrylate, polypropylene glycol monoacrylate, methoxypolyethylene glycol acrylate, methoxypolypropylene glycol acrylate, phenoxy-2-methylethylacrylate, 2-phenylphenoxy acrylate, methoxypolyethylene glycol acrylate, phenoxymethyl, 4-phenylphenoxyethyl acrylate, 3- (2-phenylphenyl) -2-hydroxypropyl acrylate, tricyclodecyl acrylate, phenoxyethoxyethyl acrylate, isopropyl acrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dipentaerythritol acrylate, dicyclopentyl acrylate, dicyclopentyloxyethyl acrylate, isobornyl acrylate, phenyl acrylate, 2-hydroxyethyl acrylate, isobutyl acrylate, caprolactone acrylate, isodecyl acrylate, lauryl acrylate, stearyl acrylate, benzyl acrylate, 2-hydroxy acrylate, trimethoxybutyl acrylate, ethyl carbitol acrylate, phenoxyethyl acrylate, 4-hydroxybutyl acrylate, phenoxypolyethylene glycol acrylate, tetrahydrofurfuryl acrylate, phenoxyethyl acrylate, and mixtures thereof, 2-hydroxypropyl acrylate, 2-acryloyloxyethyl-2-hydroxypropyl phthalate, 2-hydroxy-3-phenoxypropyl acrylate and methacrylates thereof; acrylates containing halogen compounds such as 3-fluoroethylacrylate and 4-fluoropropylacrylate, and methacrylates thereof; acrylates containing a siloxane group such as triethylsiloxanylethylacrylate and methacrylates thereof; olefins having aromatic functional groups such as styrene, vinyl acetate, and vinylpyridine.
The above-mentioned vinyl-based monomer is used in an amount of 10 to 60% by weight, preferably 20 to 40% by weight, relative to the total weight of the composition. When the amount of the vinyl monomer used is less than 10% by weight, the viscosity of the composition is low and the composition cannot be used as a printing electronic coating liquid, and when it exceeds 60% by weight, there is a possibility that the result is contrary to the material characteristics requiring a rapid curing degree.
d) Crosslinkable monomer having at least two or more vinyl double bonds
The crosslinkable monomer used in the present invention may be selected from the group consisting of ethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, 1, 6-hexanediol diacrylate, 1, 4-butanediol diacrylate, neopentyl glycol diacrylate, 1, 3-butanediol diacrylate, erythritol diacrylate, pentaerythritol diacrylate, dipentaerythritol diacrylate, bis (hydroxymethyl) tricyclodecane diacrylate, bisphenol A diacrylate and derivatives thereof, glycerol triacrylate, erythritol triacrylate, dipentaerythritol triacrylate, pentaerythritol triacrylate, dipentaerythritol triacrylate, sorbitol triacrylate, trimethylpropane triacrylate, erythritol tetraacrylate, and mixtures thereof, Pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dimethylpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and methacrylates thereof.
The crosslinkable monomer is used in an amount of 1 to 60% by weight, preferably 5 to 30% by weight, based on the total weight of the composition. When the amount is less than 1% by weight, the curing rate may be decreased and the curing density may be decreased to cause a decrease in reinforcement, and when the amount exceeds 60% by weight, high curing shrinkage and a decrease in surface adhesion may be caused.
e) Photopolymerization initiator
The photopolymerization initiator usable in the present invention may be one selected from the group consisting of 2,2 '-diethoxyacetophenone, 2' -dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, acetophenone-based compounds such as 4,4 '-dimethylaminobenzophenone, 4' -dichlorobenzophenone, 3 '-dimethyl-2-methoxybenzophenone, 2' -dichloro-4-phenoxyacetophenone, 2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropan-1-one, and 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butan-1-one; benzophenone-based compounds such as benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4 '-bis (dimethylamino) benzophenone, and 4,4' -bis (diethylamino) benzophenone; thioxanthone compounds such as thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2, 4-diethylthioxanthone, 2, 4-diisopropylthioxanthone and 2-chlorothioxanthone; benzoin-based compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzoin dimethyl ketal; 2,4, 6-trichloro-s-triazine, 2-phenyl-4, 6-bis (trichloromethyl) -s-triazine, 2- (3',4' -dimethoxystyryl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (4' -methoxynaphthyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (p-methoxyphenyl) -4, 6-bis (trichloromethyl) -s-triazine, 2- (p-tolyl) -4, 6-bis (trichloromethyl) -s-triazine, 2-phenyl-4, 6-bis (trichloromethyl) -s-triazine, bis (trichloromethyl) -6-styryl-s-triazine, 2- (naphthoyl 1-yl) -4, and 6-bis (trichloromethyl) -s-triazine, 2- (4-methoxy naphthoyl 1-yl) -4, 6-bis (trichloromethyl) -s-triazine, 2-4-trichloromethyl (piperonyl) -6-triazine, 2-4-trichloromethyl (4' -methoxy styryl) -6-triazine, and other triazine compounds, and preferably, acetophenone series is advantageous for ensuring the curing threshold (curing margin).
The above photopolymerization initiator is used in an amount of 0.01 to 10% by weight, preferably 0.5 to 6% by weight, relative to the total weight of the composition. When the amount of the photopolymerization initiator used is less than 0.1% by weight, photocuring does not proceed or is slowed, and a desired curing rate cannot be obtained, and when the amount exceeds 10% by weight, the reaction-inhibiting effect may cause a decrease in coating film characteristics or a decrease in material transmittance.
In addition, the composition of the present invention may further include various additives such as an antioxidant (antioxidant), an ultraviolet absorber (UV absorber), a Light stabilizer (Light stabilizer), a thermal polymerization inhibitor (Heat polymerization inhibitor), an anti-aging agent (aging preventive), a Plasticizer (Plasticizer), a Silane coupling agent (Silane coupling agent), a Leveling agent (Leveling agent), a Surfactant (Surfactant), and the like, for the purpose of resistance to moisture, UV, and Heat, excellent coatability to a substrate, adhesion, and the like, according to the use purpose of the material.
The present invention also provides a method for forming a fine pattern, which comprises printing the photocurable resin composition on a substrate and then exposing the substrate to light.
In the present invention, various printing processes generally used in the art may be applied to the above printing, for example, Gravure offset printing (Gravure direct) printing, Gravure direct printing (Gravure direct) printing, Screen printing (Screen) printing, imprinting, etc., and any substrate generally used may be used, for example, a glass substrate or a plastic substrate may be used.
As the light source for exposure, ultraviolet rays, visible rays, infrared rays, X-rays, electron beams, etc. can be used, and ultraviolet rays in the 190 to 450nm region can be preferably used. After that, a high-temperature heat treatment process may be performed to improve the use and properties of the film.
The photocurable composition including an acrylamide monomer according to the present invention can be applied to a printing electronic basic process without a baking (Bake) and developing (development) process, which has been conventionally used in photolithography, can save investment costs by using a low-priced UV curing machine, which is not an expensive exposure machine, and can be advantageously used for manufacturing a flexible display because a rolling process can be used.
The photocurable composition of the present invention can achieve rapid photocuring by virtue of its excellent degree of curing with respect to UV photocuring to maximize the advantages of the printing process, and exhibits excellent coatability, adhesion force, and acid resistance to various base substrates such as PET (polyethylene terephthalate) films, PC (polycarbonate) films, PI (polyimide) films, Cu (copper) deposited on metal foils, ITO (indium tin oxide), Al (aluminum), Mo (molybdenum), and the like, which can be applied to flexible displays, in addition to conventional glasses for LCDs and OLEDs.
Hereinafter, preferred examples are disclosed to aid understanding of the present invention, but the following examples are only illustrative of the present invention, and the scope of the present invention is not limited by the following examples.
Examples 1 to 6 and comparative examples 1 and 2
Resin compositions (unit: parts by weight) were prepared by mixing the components in the compositions shown in Table 1 and uniformly mixing them at room temperature for 6 hours or more.
In this case, the components used are as follows.
Acrylamide monomer: acryloylmorpholine (ACMO, product of Kyojin, japan), dimethylacrylamide (DMAA, N-Dimethyl acrylamide, product of Kyojin, japan) of chemical formula 2, diethylacrylamide (N, N-diethyl acrylamide) of chemical formula 3, and dimethylaminoethylacrylate (N, N-dimethylamino ethyl acrylate) of chemical formula 4;
acrylic copolymer resin: (Polyester acrylate (PS420, tetra functional Polyester acrylate, Miwon Specialty Chemical Co., Ltd., Korea);
vinyl monomer(s): (Glycidyl methacrylate (GMA, Glycidyl methacrylate, sigma aldrich);
crosslinking monomer: pentaerythritol triacrylate (PETA, Pentaerythritol triacrylate, Miwon Specialty Chemical Co., Korea), 1, 4-butanediol diacrylate (HDDA, 1,4-butandioldiacrylate, Miwon Specialty Chemical Co., Ltd.); and
photopolymerization initiator: darocur TPO (Diphenyl (2,4,6-trimethylbenzoyl) phosphine oxide, diphenylene (2,4,6-trimethylbenzoyl) -phosphine oxide, Ciba specialty Chemicals).
[ Table 1]
Test example 1
The physical properties of the photocurable resin compositions produced in examples 1 to 6 and comparative examples 1 and 2 were measured as follows, and the results are shown in table 2.
1) Speed of curing
The composition is applied to a substrate washed with a detergent in a thickness of 0.5 to 5 μm, and the substrate is bonded to a polymer mold, cured with different light amounts using a lamp having a wavelength of 365nm, and then separated from the polymer mold to release the substrate coated with the composition. At this time, the degree of curing of the composition was evaluated by confirming the surface state of the cured composition. The degree of curing was evaluated in accordance with the following criteria, based on the degree of tackiness of the material after the surface state was completely dried.
A: the surface is completely free from stickiness
B: slightly sticky on the surface
C: surface with viscosity
D: uncured (liquid)
2) Adhesion force
The composition is applied to a substrate washed with a detergent in a thickness of 0.5 to 5 μm, and the substrate is bonded to a polymer mold, cured by a lamp having a wavelength of 365nm, and then separated from the polymer mold to release the substrate coated with the composition. The cured composition was cut into 100 cells by a Cross cut (Cross cut) method, and adhesion evaluation was performed based on the cut. The substrates used were evaluated using bare glass (bare glass) for LCD, a substrate with Cu deposited on a PI (polyimide) film, a substrate with ITO deposited thereon, and a substrate with Mo deposited thereon, according to the following criteria, and the adhesive tape for adhesion evaluation was a 3M610 tape.
A, the number of remaining cells on the substrate is 90% or more
B, the residual unit cells on the substrate are more than 75 percent
C, the number of remaining cells on the substrate is 60% or more
D, the number of remaining cells on the substrate is 45% or less
3) Acid resistance
The composition is applied to a PI (polyimide) film deposited with ITO in a thickness of 0.5 to 5 μm, and the composition is joined to a polymer mold, cured using a lamp having a wavelength of 365nm, and then separated from the polymer mold to release the composition from a substrate. The substrate after the mold release was subjected to an Etching (Etching) step using an Etchant (Etchant). After the etching step, the acid resistance was evaluated based on the following ITO Damage (Damage) level.
A: ITO damage of 1 μm or less (Etch skew)
ITO damage greater than 1 μm (etch offset)
C cured composition lifting
Total damage of ITO
[ Table 2]
As shown in table 2, it was confirmed that the photocurable resin composition according to the present invention has not only a high curing speed and excellent acid resistance, but also excellent adhesion to various substrates that can be applied to flexible displays other than glass substrates.
Industrial applicability
The photocurable composition of the present invention, which contains an acrylamide monomer, can be applied to a printing electronic basic process without requiring a baking (Bake) and developing (development) process, which has been conventionally used in photolithography, can save investment costs by using a low-cost UV curing machine, which is not an expensive exposure machine, and can be advantageously used for manufacturing a flexible display because a rolling process can be used.
Claims (10)
1. A photocurable resin composition, comprising:
a) acrylamide monomer,
b) An acrylic copolymer resin,
c) A vinyl monomer,
d) Crosslinkable monomer having at least two or more ethylenic double bonds, and
e) a photopolymerization initiator,
the acrylamide monomer is one or more selected from the group consisting of compounds of the following chemical formulas 1 to 4,
[ chemical formula 1]
[ chemical formula 2]
[ chemical formula 3]
[ chemical formula 4]
2. The photocurable resin composition according to claim 1, comprising:
a) 1 to 50 wt% of acrylamide monomer,
b) 1 to 40% by weight of an acrylic copolymer resin,
c) 10 to 60% by weight of a vinyl monomer,
d) 1 to 50% by weight of a crosslinkable monomer having at least two or more ethylenic double bonds, and
e) 0.01 to 10 wt% of a photopolymerization initiator.
3. The photocurable resin composition according to claim 1, wherein the acrylic copolymer resin is one or more selected from the group consisting of an epoxy acrylate resin, a urethane acrylate resin, a polyester acrylate resin, a silicone acrylate resin, an amino acrylate resin, an epoxy methacrylate resin, a urethane methacrylate resin, a polyester methacrylate resin, a silicone methacrylate resin, and an amino methacrylate resin.
4. The photocurable resin composition according to claim 1, wherein the vinyl monomer is selected from the group consisting of methyl acrylate, ethyl acrylate, n-butyl acrylate, sec-butyl acrylate, tert-butyl acrylate, pentyl acrylate, isopentyl acrylate, hexyl acrylate, heptyl acrylate, octyl acrylate, isooctyl acrylate, 2-ethylhexyl acrylate, nonyl acrylate, decyl acrylate, undecyl acrylate, dodecyl acrylate, tetrahydrofurfuryl acrylate, erythritol acrylate, butoxyethyl acrylate, ethoxydiglycol acrylate, pentaerythritol acrylate, dipentaerythritol acrylate, polyethylene glycol monoacrylate, polypropylene glycol monoacrylate, methoxypolyethylene glycol acrylate, methoxypolypropylene glycol acrylate, phenoxy-2-methylethyl acrylate, polyoxyethylene glycol acrylate, polyoxyethylene-2-hydroxyethyl acrylate, polyoxyethylene glycol, 2-phenylphenoxyacrylate, 4-phenylphenoxyethyl acrylate, 3- (2-phenylphenyl) -2-hydroxypropyl acrylate, tricyclodecyl acrylate, phenoxyethoxyethyl acrylate, isopropyl acrylate, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, dipentaerythritol acrylate, dicyclopentyl acrylate, dicyclopentyloxyethyl acrylate, isobornyl acrylate, phenyl acrylate, 2-hydroxyethyl acrylate, isobutyl acrylate, caprolactone acrylate, isodecyl acrylate, stearyl acrylate, benzyl acrylate, 2-hydroxy acrylate, trimethoxybutyl acrylate, ethyl carbitol acrylate, phenoxyethyl acrylate, 4-hydroxybutyl acrylate, phenoxypolyethylene glycol acrylate, phenoxyethyl acrylate, phenoxy, 2-hydroxypropyl acrylate, 2-acryloyloxyethyl-2-hydroxypropyl phthalate, 2-hydroxy-3-phenoxypropyl acrylate and methacrylates thereof; acrylates containing halogen compounds and their methacrylates; silicone group-containing acrylates and their methacrylates; and olefins having aromatic functional groups.
5. The photocurable resin composition according to claim 1, wherein the crosslinkable monomer having at least two or more vinyl double bonds is selected from the group consisting of ethylene glycol diacrylate, triethylene glycol diacrylate, polyethylene glycol diacrylate, 1, 6-hexanediol diacrylate, 1, 4-butanediol diacrylate, neopentyl glycol diacrylate, 1, 3-butanediol diacrylate, erythritol diacrylate, pentaerythritol diacrylate, dipentaerythritol diacrylate, bis (hydroxymethyl) tricyclodecane diacrylate, bisphenol A diacrylate and derivatives thereof, glycerol triacrylate, erythritol triacrylate, dipentaerythritol triacrylate, pentaerythritol triacrylate, dipentaerythritol triacrylate, pentaerythritol triacrylate, and mixtures thereof, Sorbitol triacrylate, trimethylpropane triacrylate, erythritol tetraacrylate, pentaerythritol tetraacrylate, dipentaerythritol tetraacrylate, dimethylpropane tetraacrylate, dipentaerythritol pentaacrylate, dipentaerythritol hexaacrylate, and methacrylates thereof.
6. The photocurable resin composition according to claim 1, wherein the photopolymerization initiator is at least one selected from the group consisting of acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds and triazine compounds.
7. The photocurable resin composition according to claim 1, further comprising one or more additives selected from the group consisting of antioxidants, ultraviolet absorbers, light stabilizers, thermal polymerization inhibitors, aging inhibitors, plasticizers, silane coupling agents, leveling agents, and surfactants.
8. A method for forming a fine pattern, comprising printing the photocurable resin composition according to any one of claims 1 to 7 on a substrate and exposing the printed substrate to light.
9. A display manufactured by the fine pattern forming method according to claim 8.
10. The display of claim 9, wherein the display is a flexible display.
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| KR10-2014-0070666 | 2014-06-11 | ||
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| PCT/KR2015/005767 WO2015190799A1 (en) | 2014-06-11 | 2015-06-09 | Photo-curable resin composition |
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| US11795252B2 (en) | 2020-10-29 | 2023-10-24 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and Abbe number |
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| KR102024977B1 (en) * | 2016-03-31 | 2019-09-24 | 주식회사 엘지화학 | Solventless photosensitive resin composition, cured film manufactured by the same, conducting film comprising the cured film and method for manufacturing the conducting film |
| KR102018061B1 (en) | 2017-11-28 | 2019-09-04 | 주식회사 영우 | Pressure sensitive adhesive tape comprising an ultraviolet curable adhesive composition having a low hardening shrinkage |
| WO2020073149A1 (en) * | 2018-10-08 | 2020-04-16 | Henkel Ag & Co. Kgaa | Light curable composition |
| US11708440B2 (en) | 2019-05-03 | 2023-07-25 | Johnson & Johnson Surgical Vision, Inc. | High refractive index, high Abbe compositions |
| US11667742B2 (en) | 2019-05-03 | 2023-06-06 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and Abbe number |
| KR20200139426A (en) * | 2019-06-04 | 2020-12-14 | 주식회사 동진쎄미켐 | Photopolymer composition and cured film, display device using the same |
| KR102627351B1 (en) * | 2021-08-04 | 2024-01-18 | 박성원 | Coating composition for automotive surface protection |
| KR102379084B1 (en) | 2021-09-30 | 2022-03-24 | 윤미라 | (Ultraviolet curable resin composition and manufacturing method of UV curable laminate sheet comprising same |
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| CN102959679A (en) * | 2010-07-02 | 2013-03-06 | 株式会社德山 | Composition for photocurable imprint, and method for formation of pattern using the composition |
| CN103513512A (en) * | 2012-06-19 | 2014-01-15 | 奇美实业股份有限公司 | Photosensitive resin composition and application thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11795252B2 (en) | 2020-10-29 | 2023-10-24 | Johnson & Johnson Surgical Vision, Inc. | Compositions with high refractive index and Abbe number |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106459316A (en) | 2017-02-22 |
| KR102381307B1 (en) | 2022-03-31 |
| KR20150142617A (en) | 2015-12-22 |
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