KR102371938B1 - 기판 연마 장치 및 방법 - Google Patents

기판 연마 장치 및 방법 Download PDF

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Publication number
KR102371938B1
KR102371938B1 KR1020180076241A KR20180076241A KR102371938B1 KR 102371938 B1 KR102371938 B1 KR 102371938B1 KR 1020180076241 A KR1020180076241 A KR 1020180076241A KR 20180076241 A KR20180076241 A KR 20180076241A KR 102371938 B1 KR102371938 B1 KR 102371938B1
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South Korea
Prior art keywords
dresser
polishing
evaluation index
moving speed
abrasive member
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KR1020180076241A
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English (en)
Korean (ko)
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KR20190005119A (ko
Inventor
야스마사 히로
게이타 야기
Original Assignee
가부시키가이샤 에바라 세이사꾸쇼
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/005—Control means for lapping machines or devices
    • B24B37/013—Devices or means for detecting lapping completion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B24B37/105—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement
    • B24B37/107—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being actively moved by a drive, e.g. in a combined rotary and translatory movement in a rotary movement only, about an axis being stationary during lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/10—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means
    • B24B49/105—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving electrical means using eddy currents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/18—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation taking regard of the presence of dressing tools
    • H01L21/304—
    • H01L21/30625—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H10P52/40—Chemomechanical polishing [CMP]
    • H10P52/402—Chemomechanical polishing [CMP] of semiconductor materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
KR1020180076241A 2017-07-05 2018-07-02 기판 연마 장치 및 방법 Active KR102371938B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017131968A JP6971664B2 (ja) 2017-07-05 2017-07-05 基板研磨装置及び方法
JPJP-P-2017-131968 2017-07-05

Publications (2)

Publication Number Publication Date
KR20190005119A KR20190005119A (ko) 2019-01-15
KR102371938B1 true KR102371938B1 (ko) 2022-03-08

Family

ID=64903958

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020180076241A Active KR102371938B1 (ko) 2017-07-05 2018-07-02 기판 연마 장치 및 방법

Country Status (5)

Country Link
US (1) US10828747B2 (https=)
JP (1) JP6971664B2 (https=)
KR (1) KR102371938B1 (https=)
SG (1) SG10201805634WA (https=)
TW (1) TWI748097B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11389928B2 (en) * 2017-11-30 2022-07-19 Taiwan Semiconductor Manufacturing Co., Ltd. Method for conditioning polishing pad
CN113365981B (zh) 2019-01-30 2024-11-08 住友化学株式会社 吡啶酮化合物的制造方法
CN113767404A (zh) 2019-03-29 2021-12-07 圣戈班磨料磨具有限公司 高效研磨解决方案
JP7253458B2 (ja) * 2019-06-27 2023-04-06 株式会社荏原製作所 光学式膜厚測定装置の最適な動作レシピを決定する方法、装置、およびシステム
JP7637482B2 (ja) * 2020-08-11 2025-02-28 株式会社荏原製作所 基板処理装置及び研磨部材のドレッシング制御方法
CN112936085B (zh) * 2021-02-04 2022-09-16 华海清科股份有限公司 一种化学机械抛光控制方法及控制系统
JP7684058B2 (ja) * 2021-03-01 2025-05-27 株式会社荏原製作所 研磨装置および研磨方法
JP2024522493A (ja) * 2021-06-01 2024-06-21 アプライド マテリアルズ インコーポレイテッド パッド摩耗のモデリング及び制御方法
KR20230024626A (ko) 2021-08-12 2023-02-21 삼성전자주식회사 기판 연마 장치, 이를 이용한 기판 연마 방법 및 이를 포함하는 반도체 소자 제조 방법
JP7757903B2 (ja) * 2022-08-09 2025-10-22 株式会社Sumco ウェーハの片面研磨方法、ウェーハの製造方法、およびウェーハの片面研磨装置
TWI862986B (zh) * 2022-09-21 2024-11-21 中國砂輪企業股份有限公司 化學機械研磨修整器之再生方法及經再生之化學機械研磨修整器以及監測系統

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006043873A (ja) 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
US20080009231A1 (en) 2006-06-30 2008-01-10 Memc Electronic Materials, Inc. Dressing a Wafer Polishing Pad
JP2012254490A (ja) 2011-06-08 2012-12-27 Ebara Corp 研磨パッドのコンディショニング方法及び装置
JP2014161938A (ja) 2013-02-22 2014-09-08 Ebara Corp ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置
US20160184961A1 (en) 2014-12-26 2016-06-30 Ebara Corporation Polishing apparatus and controlling the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4658182B2 (ja) * 2007-11-28 2011-03-23 株式会社荏原製作所 研磨パッドのプロファイル測定方法
JP5415735B2 (ja) * 2008-09-26 2014-02-12 株式会社荏原製作所 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置
US9138860B2 (en) * 2010-04-20 2015-09-22 Applied Materials, Inc. Closed-loop control for improved polishing pad profiles
JP5896625B2 (ja) * 2011-06-02 2016-03-30 株式会社荏原製作所 研磨装置に使用される研磨パッドの研磨面を監視する方法および装置
JP5964262B2 (ja) * 2013-02-25 2016-08-03 株式会社荏原製作所 研磨装置に使用される研磨部材のプロファイル調整方法、および研磨装置
JP6444785B2 (ja) * 2015-03-19 2018-12-26 株式会社荏原製作所 研磨装置およびその制御方法ならびにドレッシング条件出力方法
DE102015008963A1 (de) * 2015-07-10 2017-01-12 Liebherr-Verzahntechnik Gmbh Verfahren zum Abrichten eines Werkzeuges
DE102015009287A1 (de) * 2015-07-10 2017-01-12 Liebherr-Verzahntechnik Gmbh Verfahren zur Herstellung eines Werkstückes mit gewünschter Verzahnungsgeometrie

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006043873A (ja) 2004-07-09 2006-02-16 Ebara Corp 研磨プロファイル又は研磨量の予測方法、研磨方法及び研磨装置、プログラム、記憶媒体
US20080009231A1 (en) 2006-06-30 2008-01-10 Memc Electronic Materials, Inc. Dressing a Wafer Polishing Pad
JP2012254490A (ja) 2011-06-08 2012-12-27 Ebara Corp 研磨パッドのコンディショニング方法及び装置
JP2014161938A (ja) 2013-02-22 2014-09-08 Ebara Corp ドレッサの研磨部材上の摺動距離分布の取得方法、ドレッサの研磨部材上の摺動ベクトル分布の取得方法、および研磨装置
US20160184961A1 (en) 2014-12-26 2016-06-30 Ebara Corporation Polishing apparatus and controlling the same

Also Published As

Publication number Publication date
US10828747B2 (en) 2020-11-10
JP6971664B2 (ja) 2021-11-24
US20190009385A1 (en) 2019-01-10
TWI748097B (zh) 2021-12-01
TW201906688A (zh) 2019-02-16
JP2019013999A (ja) 2019-01-31
SG10201805634WA (en) 2019-02-27
KR20190005119A (ko) 2019-01-15

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