KR102348514B1 - Shield for sputter and manufacturing method thereof - Google Patents

Abstract

Various embodiments of the present invention relate to a shield for sputtering and a method for manufacturing the same, and the technical problem to be solved is to densely form a plurality of metal structures on a base material using a three-dimensional printer, and also to form a high An object of the present invention is to provide a shield for sputtering that can increase the overall surface area and roughness of a base material by forming a metal coating layer having roughness, and a method for manufacturing the same.
To this end, the present invention provides a base material having a first surface and a second surface opposite to the first surface; a plurality of metal structures arranged on the first surface of the base material; and a metal coating layer covering the metal structure and the first surface outside the metal structure, a shield for sputtering and a method of manufacturing the same.

Description

Shield for sputter and manufacturing method thereof

Various embodiments of the present invention relate to a shield for sputtering and a method for manufacturing the same.

In general, a semiconductor device or a display device is completed through various processes such as thin film deposition, photolithography, and etching. Among them, thin film deposition is a chemical vapor deposition method that induces a radical chemical reaction on one side of a base material to cause the thin film particles to fall or adsorb the reaction product, and a physical vapor deposition method that directly collides and adsorbs thin film particles to the base material, that is, It can be classified as sputtering.

Here, sputtering is performed in a sputtering chamber, and at this time, a target formed of a thin film material, a backing plate to which the target is coupled, a magnet, a shield, and the like are provided in the sputtering chamber.

Briefly describing the thin film deposition principle and operation of sputtering, after the inside of the chamber is created in a vacuum, a sputtering gas such as argon (Ar) is injected into the vacuum region while applying a voltage to the backing plate. Then, the particles of the sputtering gas are ionized into a plasma state, and the ionized particles collide with the target. The sputtering phenomenon that comes out occurs.

Due to the influence of the magnetic fields of the N pole and S pole of the magnet located on the rear surface, the ionization probability of the ionized particles is increased, and thus the sputtering phenomenon occurs quickly.

Here, atoms emitted from the target that are not deposited on the base material may be deposited on the shield provided in the chamber. Accordingly, in order to prevent contamination inside the chamber, the shield needs a structure in which as many target atoms can be stably deposited as possible, and it is also required that the target atoms deposited on the shield once are not separated from the shield.

The above-described information disclosed in the background technology of the present invention is only for improving the understanding of the background of the present invention, and thus may include information that does not constitute the prior art.

An object to be solved according to various embodiments of the present invention is to provide a shield for sputtering and a method for manufacturing the same. As an example, the problem to be solved according to an embodiment of the present invention is to form a plurality of metal structures densely on a base material using, for example, a three-dimensional printer, and also a metal having high roughness on the base material and a plurality of metal structures An object of the present invention is to provide a shield for sputtering that can increase the overall surface area and roughness of a base material by forming a coating layer, and a method for manufacturing the same.

A shield for sputtering according to various embodiments of the present invention includes a base material having a first surface and a second surface opposite to the first surface; a plurality of metal structures arranged on the first surface of the base material; and a metal coating layer covering the metal structure and the first surface outside the metal structure.

The planar shape of the metal structure may be a circle, a triangle, a quadrangle, a pentagon, a hexagon, a polygon, a straight line, a curved line, or a ring shape.

The metal structure may have a triangular, quadrangular, trapezoidal or semicircular cross-sectional shape.

The three-dimensional shape of the metal structure may be a triangular pyramid, a quadrangular pyramid, a pentagonal pyramid, a hexagonal pyramid, a polygonal pyramid, or a cylindrical shape.

The metal structure may have a curved surface in a direction away from the first surface in a cross-sectional shape.

The radius of curvature R of the curved surface may be 0.1 mm to 10 mm.

A thickness (T1), a width (W1), or a pitch (P) of the metal structure may be 0.5 mm to 15 mm.

The average roughness (Ra) of the center line of the metal coating layer may be 500 μm to 5000 μm.

The metal structure or the metal coating layer may include aluminum, titanium, zirconium, silicon, tungsten, or an alloy thereof.

The density of the metal coating layer may be smaller than the density of the plurality of metal structures.

The plurality of metal structures and the metal coating layer may include the same or different metals.

A method of manufacturing a shield for sputtering according to various embodiments of the present invention comprises: preparing a base material having a first surface and a second surface opposite to the first surface; forming a plurality of metal structures arranged on the first surface of the base material; and forming a metal coating layer to cover the metal structure and the first surface outside the metal structure.

In the forming of the metal structure, the metal structure may be formed by a three-dimensional printer, an arc coating apparatus, a room temperature vacuum spray coating apparatus, a cold coating apparatus, a plasma spray coating apparatus, or a flame spray apparatus.

In the forming of the metal coating layer, the metal coating layer may be formed by a three-dimensional printer, an arc coating device, a room temperature vacuum spray coating device, a cold coating device, a plasma spray coating device, or a flame spray device.

Various embodiments of the present invention provide a shield for sputtering and a method of manufacturing the same. As an example, the embodiment of the present invention is, for example, by forming a plurality of metal structures densely on the base material using a three-dimensional printer, and also forming a metal coating layer having high roughness on the base material and the plurality of metal structures, To provide a shield for sputtering that can increase the surface area and roughness of the base material and a method for manufacturing the same. Therefore, during the sputtering process, the material separated from the target is easily deposited in a large amount on the surface of the shield having a large surface area and high roughness, and the material deposited on the surface of the shield is not easily separated.

1A is a cross-sectional view illustrating a shield for sputtering according to various embodiments of the present disclosure, FIG. 1B is an enlarged view illustrating a metal structure, and FIG. 1C is an enlarged view illustrating a metal coating layer.
2A to 2D are perspective views illustrating an example of a shield for sputtering according to various embodiments of the present invention.
3 is a flowchart illustrating a method of manufacturing a shield for sputtering according to various embodiments of the present invention.
4A and 4B are cross-sectional views illustrating a nozzle of a 3D printer for forming a metal structure and/or a metal coating layer in a method of manufacturing a shield for sputtering according to various embodiments of the present invention.
5 is a side view illustrating a nozzle of an arc coater for forming a metal structure and/or a metal coating layer in a method of manufacturing a shield for sputtering according to various embodiments of the present invention.
6 is a schematic diagram illustrating a room temperature vacuum spray coating apparatus for forming a metal structure and/or a metal coating layer in a method of manufacturing a shield for sputtering according to various embodiments of the present invention.
7 is a cross-sectional view illustrating a shield for sputtering according to various embodiments of the present invention.
8A and 8B are enlarged pictures illustrating a shield for sputtering according to various embodiments of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Examples of the present invention are provided to more completely explain the present invention to those of ordinary skill in the art, and the following examples may be modified in various other forms, and the scope of the present invention is as follows It is not limited to an Example. Rather, these examples are provided so that this disclosure will be more thorough and complete, and will fully convey the spirit of the invention to those skilled in the art.

In addition, in the following drawings, the thickness or size of each layer is exaggerated for convenience and clarity of description, and the same reference numerals in the drawings refer to the same elements. As used herein, the term “and/or” includes any one and all combinations of one or more of those listed items. In addition, in the present specification, "connected" means not only when member A and member B are directly connected, but also when member A and member B are indirectly connected with member C interposed between member A and member B. do.

The terminology used herein is used to describe specific embodiments, not to limit the present invention. As used herein, the singular form may include the plural form unless the context clearly dictates otherwise. Also, as used herein, “comprise, include” and/or “comprising, including” refer to the referenced shapes, numbers, steps, actions, members, elements, and/or groups thereof. It specifies the presence and does not exclude the presence or addition of one or more other shapes, numbers, movements, members, elements and/or groups.

Although the terms first, second, etc. are used herein to describe various members, parts, regions, layers and/or parts, these members, parts, regions, layers, and/or parts are limited by these terms so that they It is self-evident that These terms are used only to distinguish one member, component, region, layer or portion from another region, layer or portion. Accordingly, a first member, component, region, layer, or portion described below may refer to a second member, component, region, layer or portion without departing from the teachings of the present invention.

Space-related terms such as “beneath”, “below”, “lower”, “above”, and “upper” refer to an element or feature shown in the drawing It may be used to facilitate understanding of other elements or features. These space-related terms are for easy understanding of the present invention according to various process conditions or usage conditions of the present invention, and are not intended to limit the present invention. For example, if an element or feature in a figure is turned over, an element or feature described as "below" or "below" becomes "above" or "above". Accordingly, "lower" is a concept encompassing "upper" or "below".

Figure 1a is a cross-sectional view showing a shield 100 for sputtering according to various embodiments of the present invention, Figure 1b is an enlarged view showing the metal structure 120, Figure 1c is an enlarged view showing the metal coating layer (130) It is also

As shown in FIG. 1A , the shield 100 for sputtering according to an embodiment of the present invention may include a base material 110 , a plurality of metal structures 120 , and a metal coating layer 130 .

The base material 110 may include a substantially flat first surface 111 and an approximately flat second surface 112 as a surface opposite to the first surface 111 . In some examples, the base material 110 may have an approximately flat plate shape or a cylindrical shape. In some examples, the base material 110 may further include a plurality of intaglio grooves and/or embossed protrusions formed/arranged on the first surface 111 . The depth (or thickness), width and/or pitch of the plurality of intaglio grooves and/or embossing protrusions may be approximately 0.5 mm to 15 mm. In some examples, the first surface 111 of the base material 110 may have an average roughness Ra of 1500 μm to 5000 μm. In some examples, the first surface 111 of the base material 110 may be completely flat. In some examples, the base material 110 is aluminium, aluminum alloy, titanium, titanium alloy, zirconium, zirconium alloy, iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, molybdenum, molybdenum alloy, or their alloys may be included.

The plurality of metal structures 120 may be formed on the first surface 111 of the base material 110 to have a predetermined thickness T1, a predetermined width W1, and/or a predetermined pitch P. In some examples, the thickness, width and/or pitch of the metal structure 120 may be between approximately 0.5 mm and 15 mm. In some examples, the metal structure 120 may have a planar shape in the form of a circle, a triangle, a square, a pentagon, a hexagon, a polygon, a straight line, a curve, a closed ring, or an open ring. In some examples, the metal structure 120 may have a triangular, quadrangular, trapezoidal, or semicircular cross-sectional shape. In some examples, the metal structure may have a triangular shape, a quadrangular pyramid, a pentagonal pyramid, a hexagonal pyramid, a polygonal pyramid, or a cylindrical shape. In some examples, metal structure 120 may be formed of aluminum, aluminum alloy, titanium, titanium alloy, zirconium, zirconium alloy, silicon, silicon alloy, tungsten, tungsten alloy, iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, It may include molybdenum, a molybdenum alloy, or an alloy thereof.

The metal coating layer 130 may cover the metal structure 120 and the first surface 111 outside the metal structure 120 . In some examples, the thickness T2 of the metal coating layer 130 may be approximately 0.5 m to 15 mm. In some examples, the metal coating layer 130 may include a single layer or multiple layers. In some examples, the metal coating layer 130 is formed of aluminum, aluminum alloy, titanium, titanium alloy, zirconium, zirconium alloy, silicon, silicon alloy, tungsten, tungsten alloy, iron, iron alloy, nickel, nickel alloy, chromium, chromium alloy, It may include molybdenum, a molybdenum alloy, or an alloy thereof.

Here, the density of the metal coating layer 130 may be smaller than that of the metal structure 120 . In other words, the porosity of the metal coating layer 130 may be greater than that of the metal structure 120 . For example, the density of the metal structure 120 may be approximately 99%, and the density of the metal coating layer 130 may be approximately 70 to 90%. Therefore, the surface roughness of the metal coating layer 130 becomes higher, so that particles are better collected, and the metal coating layer 130 is easily removed compared to the metal structure 120 in the recycling process, so that the recycling process of the sputter shield 100 is easy. can get

In addition, the metal structure 120 and the metal coating layer 130 may include the same or different types of metal. For example, the metal structure 120 and the metal coating layer 130 may include the same type of aluminum. As another example, the metal structure 120 may include titanium having a relatively high Mohs hardness, and the metal coating layer 130 may include aluminum having a relatively low Mohs hardness. Accordingly, in the recycling process, the metal coating layer 130 is easily removed compared to the metal structure 120 , and accordingly, the recycling process of the sputter shield 100 can be facilitated.

As shown in FIG. 1B , the metal structure 120 of the shield 100 for sputtering according to an embodiment of the present invention may have an approximately square shape in cross-section. However, the metal structure 120 may have a rectangular shape in which a curved surface is formed in a direction away from the first surface 111 . In some examples, the curved surface may be formed in two opposing portions of the upper end of the metal structure 120 . That is, curved surfaces may be formed at both corners of the upper part of the square shape. The radius of curvature R of the curved surface may be approximately 0.1 mm to 10 mm. In some examples, the curved surface may be formed on one portion of the top of the metal structure 120 . That is, one curved surface may be formed on the upper part of the rectangular upper shape. In addition, as described above, the cross-sectional shape of the metal structure 120 may be a triangle, a trapezoid, or a semicircle, and the shape of the metal structure 120 is not limited in the present invention.

As shown in FIG. 1C , the metal coating layer 130 of the shield 100 for sputtering according to an embodiment of the present invention may have roughness. The average roughness Ra of the center line of the metal coating layer 130 may be approximately 500 μm to 5000 μm. In some examples, the roughness may be formed in a region corresponding to the metal structure 110 and a region corresponding to the first surface 111 of the base material 110 on the outside thereof.

In this way, various embodiments of the present invention provide a shield 100 for sputtering. For example, in the embodiment of the present invention, a plurality of metal structures 120 are densely formed on the base material 110 , and a metal coating layer 130 having high roughness on the base material 110 and the plurality of metal structures 120 is formed. By forming, the shield 100 for sputtering that can increase the overall surface area and roughness of the base material 110 is provided. Therefore, the material separated from the target during the sputtering process can be easily/mass deposited on the surface of the shield 100 having a large surface area and high roughness, and the material deposited once on the surface of the shield 100 is not easily separated does not In addition, various embodiments of the present invention may further increase the surface area and roughness by varying the density of the metal structure 120 and the metal coating layer 130 or using different materials, or to facilitate the recycling process. can do.

2A to 2D are perspective views illustrating an example of a shield 100 for sputtering according to various embodiments of the present invention.

As shown in FIG. 2A , in the shield for sputtering 100 , the metal structure 120 having an approximately circular shape may be arranged on the flat base material 110 having a predetermined thickness, a predetermined width and/or a predetermined pitch. The metal structure 120 and the base material 110 may be covered with a metal coating layer 130 .

As shown in Figure 2b, in the shield 100 for sputtering, the flat base material 110 has an approximately ring shape (or a closed donut shape or an open donut shape) metal structure 120 has a predetermined thickness, a predetermined width and / or may be arranged with a predetermined pitch. The metal structure 120 and the base material 110 may be covered with a metal coating layer 130 .

As shown in Fig. 2c, in the shield for sputtering 100, the flat base material 110 has an approximately straight (or curved) metal structure 120 having a predetermined thickness, a predetermined width and/or a predetermined pitch. can be arranged. The metal structure 120 and the base material 110 may be covered with a metal coating layer 130 . In some examples, the metal structure 120 may be formed in a line shape of a checkerboard or a chessboard.

As shown in FIG. 2D, the base material 110 in the shield 100 for sputtering may be formed in a cylindrical shape rather than a flat plate. In addition, various types of metal structures 120 as described above may be arranged on the inner surface of the cylindrical base material 110 having a predetermined thickness, a predetermined width and/or a predetermined pitch. The metal structure 120 and the base material 110 may be covered with a metal coating layer 130 .

3 is a flowchart illustrating a method of manufacturing the shield 100 for sputtering according to various embodiments of the present invention.

As shown in FIG. 3 , the method for manufacturing a shield 100 for sputtering according to various embodiments of the present invention includes a first surface 111 and a second surface 112 opposite to the first surface 111 . A step (S1) of preparing the base material 110 having Forming the metal coating layer 130 to cover the first surface 111 of the outside of the metal structure 120 may include (S3).

4A and 4B are a nozzle 200 of a 3D printer for forming the metal structure 120 and/or the metal coating layer 130 in the method of manufacturing the shield 100 for sputtering according to various embodiments of the present invention. It is a cross-sectional view shown.

As shown in Figures 4a and 4b, the metal structure 120 and / or the metal coating layer 130 (steps S2 and S3) of the manufacturing method of the shield 100 for sputtering according to an embodiment of the present invention is an example It may be formed through the 3D printer nozzle 200 . In some examples, the 3D printer nozzle 200 may include a nozzle body 201 and a powder supply conduit 202 coupled to the nozzle body 201 to provide metal powder. Of course, the body 201 of the 3D printer nozzle 200 includes a laser beam conduit 203 through which a laser beam passes in the center, and metal powder is supplied to this laser beam conduit 203 through a powder supply conduit 202. can be provided. The metal powder is melted by the energy of the laser beam, and the molten metal powder is attached to the base material 110 , thereby forming the above-described metal structure 120 and/or the metal coating layer 130 . The 3D printer nozzle 200 can easily implement a desired shape of the metal structure 120 and the thickness of the metal coating layer 130 by freely controlling the direction and position of the 3D printer nozzle 200 . Meanwhile, the nozzle 200 may further include an air conduit 204 (refer to FIG. 4B ) for supplying air so that the metal powder is not separated in an unwanted direction and the molten metal structure 120 can be cooled. Here, the formation of the metal structure 120 and/or the metal coating layer 130 by the 3D printer nozzle 200 may be performed in the atmosphere or in a vacuum.

5 is a side view illustrating a nozzle 300 of an arc coater for forming a metal structure 120 and/or a metal coating layer 130 in a method of manufacturing the shield 100 for sputtering according to various embodiments of the present invention. .

As shown in Figure 5, the metal structure 120 and / or the metal coating layer 130 (steps S2 and S3) of the manufacturing method of the shield 100 for sputtering according to an embodiment of the present invention is an arc coater nozzle as an example It can be formed through (300). In some examples, the arc coater nozzle 300 may include a plurality of wire rod supply units 301 capable of arc discharge, and a spray unit 302 for spraying the thermal sprayed wire material supplied from the wire rod supply unit 301 . The thermal sprayed wire supplied through the plurality of wire supply units 301 causes arc discharge while the ends are in contact with each other at one point, and the spraying unit 302 sprays the molten metal molten by the arc discharge to the base material 110 . The injection nozzle 302 may inject air or an inert gas that does not react with the molten metal at a high speed. Here, the formation of the metal structure 120 and/or the metal coating layer 130 by the arc coater nozzle 300 may be performed in the atmosphere or in a vacuum.

6 is a schematic diagram illustrating a room temperature vacuum spray coating apparatus 400 for forming a metal structure 120 and/or a metal coating layer 130 in a method of manufacturing a shield 100 for sputtering according to various embodiments of the present invention. to be.

As shown in FIG. 6 , the metal structure 120 and/or the metal coating layer 130 (steps S2 and S3) of the manufacturing method of the shield 100 for sputtering according to an embodiment of the present invention is vacuum spray coated at room temperature. (or vacuum aerosol deposition) may be formed through the device 400 . In some examples, the room temperature vacuum spray coating apparatus 400 transports the metal powder from the transport gas supply unit 401, the powder supply unit 402 for storing and supplying the metal powder, and the powder supply unit 402 using the transport gas at high speed. A nozzle 404 for coating / laminating or spraying the metal powder from the transfer pipe 403 on the base material 110, and the metal powder from the nozzle 404 on the surface of the base material 110 By collision and crushing, the metal structure 120 having a predetermined thickness, a predetermined width, and/or a predetermined pitch, and the metal coating layer 130 covering the metal structure 120 may be continuously formed. Here, the base material 110 and the nozzle 404 may be mounted inside the vacuum chamber 405 , and a vacuum unit 406 may be connected to the vacuum chamber 405 . Also, in some examples, “room temperature” may mean 0°C to 30°C.

In some examples, the metal structure 120 and/or the metal coating layer 130 may be formed by a cold coating (or spraying) device, a microwave coating (or spraying) device, a flame coating (or spraying) device, etc. In the present invention, the manufacturing method of the metal structure 120 and/or the metal coating layer 130 is not limited.

Here, the cold coating apparatus forms the metal structure 120 and/or the metal coating layer 130 by colliding the metal powder with the base material 110 at high speed in the atmosphere. Plasma spray coating apparatus transfers metal powder at high speed in vacuum or in the atmosphere, and at the same time applies a microwave to metal powder to melt the metal powder to form the metal structure 120 and/or the metal coating layer 130 on the base material 110 . do. The flame spray device transfers metal powder at high speed in vacuum or in the atmosphere, and at the same time provides a flame (flame by combustion gas) to the metal powder, so that the metal powder is melted and the metal structure 120 and/or the metal coating layer on the base material 110 form (130).

In this way, an embodiment of the present invention is, for example, a three-dimensional printer, an arc coating device, a room temperature vacuum spray coating device, a cold coating device, a plasma spray coating device or a plurality of metal structures on the base material using a flame spray device. To provide a shield for sputtering, which can increase the surface area and roughness of the base material as a whole, and a method for manufacturing the same by forming a dense layer and forming a metal coating layer having high roughness on the base material and a plurality of metal structures. Therefore, the material separated from the target during the sputtering process is easily/mass deposited on the surface of the shield having a large surface area and high roughness, and the material deposited on the surface of the shield is not easily separated.

In addition, in an embodiment of the present invention, the metal structure 120 is formed with a relatively high density (that is, formed with a relatively small porosity) three-dimensional printer, room temperature vacuum spray coating device or cold coating device to be formed. In addition, the metal coating layer 130 may be formed by an arc coating device, a plasma spray coating device, or a flame coating device having a relatively small density (ie, a relatively large porosity).

7 is a cross-sectional view illustrating a shield 200 for sputtering according to various embodiments of the present invention. The sputtering shield 200 shown in FIG. 7 is compared to the sputtering shield 100 shown in FIG. 1A , the metal structure 220 and the metal coating layer 230 have different densities (porosity) from each other. different from For example, the density of the metal coating layer 230 may be relatively smaller than that of the metal structure 220 . In other words, the porosity of the metal coating layer 230 may be relatively higher than that of the metal structure 220 . Accordingly, the surface area and surface roughness of the metal coating layer 230 may be further increased, and thus particle collection efficiency may be further increased. In addition, in the recycling process, only the metal coating layer 230 can be easily removed while the metal structure 220 remains. Therefore, only the metal coating layer 230 is newly formed in the recycling process, and the shield 200 for sputtering can be easily recycled.

8A and 8B are enlarged pictures showing a shield for sputtering according to various embodiments of the present invention.

As shown in FIG. 8A , a boundary between the base material and the metal structure among the sputtering shields may be vague or indistinguishable. However, a boundary may be distinguished between the metal structure and the metal coating layer or between the base material and the metal coating layer. Therefore, it can be seen that the adhesion between the base material and the metal structure is quite high. In other words, the adhesive force between the base material and the metal structure may be greater than the adhesive force between the metal structure and the metal coating layer or between the base material and the metal coating layer. Accordingly, the shield for sputtering can be recycled by leaving the metal structure as it is, and re-forming after removing only the metal coating layer.

In addition, it can be seen that the density of the metal structure is higher than that of the metal coating layer. That is, as shown in FIG. 8B , the metal coating layer formed on the surface of the base material and the metal structure among the sputtering shield has voids therein, and thus may have a lower density than that of the metal structure. Of course, due to the characteristics of the metal coating layer, the average roughness of the zoom core of the metal coating layer is considerably high, and thus particle collection efficiency can be improved.

What has been described above is only one embodiment for implementing the shield for sputtering and the manufacturing method thereof according to the present invention, and the present invention is not limited to the above-described embodiment, and as claimed in the claims below, the present invention Without departing from the gist of the invention, it will be said that the technical spirit of the present invention exists to the extent that various modifications can be made by anyone with ordinary knowledge in the field to which the invention pertains.

100; shield 110 for sputter; base material
111; first page 112; page 2
120; metal structure 130; metal coating layer

Claims (16)

a base material having a first surface and a second surface opposite to the first surface;
a plurality of metal structures arranged on the first surface of the base material; and
and a metal coating layer covering the first surface of the metal structure and the outside of the metal structure,
A shield for sputtering, wherein the density of the metal coating layer is small compared to the density of the plurality of metal structures. The method of claim 1,
The metal structure has a planar shape of a circle, a triangle, a square, a pentagon, a hexagon, a polygon, a straight line, a curved line or a ring shape, a shield for sputtering. The method of claim 1,
The metal structure is a triangular, quadrangular, trapezoidal or semicircular in the form of a cross-section, sputtering shield. The method of claim 1,
The metal structure has a three-dimensional shape of a triangular pyramid, a quadrangular pyramid, a pentagonal pyramid, a hexagonal pyramid, a polygonal pyramid or a cylindrical shape, a shield for sputtering. The method of claim 1,
The metal structure has a curved surface formed in a direction away from the first surface, sputtering shield. 6. The method of claim 5,
The radius of curvature (R) of the curved surface is 0.1 mm to 10 mm, sputtering shield. The method of claim 1,
The thickness (T1), width (W1) or pitch (P) of the metal structure is 0.5 mm to 15 mm, sputtering shield. The method of claim 1,
The average roughness (Ra) of the center line of the metal coating layer is 500 μm to 5000 μm, a shield for sputtering. The method of claim 1,
The metal structure or the metal coating layer comprises aluminum, titanium, zirconium, silicon, tungsten or an alloy thereof, for sputtering shield. delete The method of claim 1,
The plurality of metal structures and the metal coating layer include the same or different metals, sputtering shield. Preparing a base material having a first surface and a second surface opposite to the first surface;
forming a plurality of metal structures arranged on the first surface of the base material; and
Forming a metal coating layer to cover the first surface of the metal structure and the outside of the metal structure,
A method of manufacturing a shield for sputtering, wherein the density of the metal coating layer is small compared to the density of the plurality of metal structures. 13. The method of claim 12,
The step of forming the metal structure is a three-dimensional printer, arc coating apparatus, room temperature vacuum spray coating apparatus, cold coating apparatus, plasma spray coating apparatus or flame spray apparatus in which the metal structure is formed by a method of manufacturing a shield for sputtering. 13. The method of claim 12,
The step of forming the metal coating layer is a three-dimensional printer, an arc coating device, a room temperature vacuum spray coating device, a cold coating device, a plasma spray coating device or a flame spray device, wherein the metal coating layer is formed by a method of manufacturing a shield for sputtering. delete 13. The method of claim 12,
The plurality of metal structures and the metal coating layer include the same or different types of metal, a method of manufacturing a shield for sputtering.

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