KR102342165B1 - Thermal Shock Test Equipment For Electronic Device Using Localized Air Current - Google Patents

Abstract

The present invention provides a chamber that provides an internal space blocked from the outside, a test bed installed in the internal space of the chamber, a first temperature controller for controlling the internal temperature of the chamber, and a local airflow in the internal space of the chamber to be seated on the test bed and a second temperature control unit for controlling the ambient temperature of the device under test. The second temperature control unit circulates the cooling air or the heating air through an independent air circulation path that is not connected to the first temperature control unit.

Description

Thermal Shock Test Equipment For Electronic Device Using Localized Air Current

The present invention relates to a thermal shock test apparatus of an electronic device using a local airflow, and more particularly, a thermal shock test of an electronic device by generating a local airflow into a chamber to differentially create a temperature distribution inside the chamber similar to the actual operating environment It relates to a thermal shock test device for electronic devices using a local airflow that can perform

In general, electronic devices such as smartphones are inspected to determine whether they operate and function normally after the manufacturing process is completed. The inspection process of these electronic devices is variously carried out depending on the product, such as thermal shock, drop shock, and life test. For example, the thermal shock test of electronic devices can check whether they operate normally under high-temperature or low-temperature conditions.

According to the patent literature (Korean Patent Registration No. 10-1207891), a thermal shock test is performed by putting a Device Under Test (DUT) in a chamber and adjusting the temperature to a suitable temperature.

In everyday life, electronic devices such as smartphones are carried and frequently used in vehicles. Therefore, for electronic devices used inside the vehicle, thermal shock tests must be performed under conditions similar to the actual operating environment to guarantee high-quality products. For example, in summer, the temperature conditions are created so that hot air surrounds the outside of the vehicle and relatively low air is distributed inside the vehicle. In contrast, in winter, cold air surrounds the outside of the vehicle and relatively high air inside the vehicle. It is necessary to create temperature conditions for distribution.

However, according to the prior art including the above patent document, the temperature of the chamber is controlled using a heater or a cooler, but only a technique for uniform temperature distribution inside the chamber is proposed, and the local area around the electronic device and other areas There is a problem in that the thermal shock test that simulates the actual operating environment cannot be performed because it is not possible to differentiate the temperature distribution by dividing it.

Korean Patent Registration No. 10-1207891 (Registered on November 28, 2012)

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The present invention has been devised to solve the above problems, and an object of the present invention is to generate a local airflow into the chamber to differentially create a temperature distribution inside the chamber similar to the actual operating environment to conduct a thermal shock test of electronic devices. An object of the present invention is to provide a thermal shock testing apparatus for electronic devices using a local airflow that can be performed.

In accordance with the present invention for achieving the above object, there is provided a thermal shock test apparatus for an electronic device using a local airflow, comprising: a chamber providing an internal space blocked from the outside; a test bed installed in the inner space of the chamber; a first temperature control unit for adjusting the internal temperature of the chamber; A second temperature control unit for controlling the ambient temperature of the device under test seated on the test bed by generating a local airflow in the internal space of the chamber; including, wherein the second temperature control unit is linked to the first temperature control unit It is characterized in that cooling air or heating air is circulated through an independent air circulation path that is not

In addition, the first temperature control unit is characterized in that it includes a heat exchange chamber formed on one side of the chamber, a first evaporator and a first blower fan installed in the heat exchange chamber, and a first heater installed on the inner surface of the chamber.

In addition, the second temperature controller may include an air conditioning chamber installed on the other side of the chamber, a second evaporator installed in the air conditioning chamber, a second blowing fan, and a second heater.

In addition, the air circulation flow path includes a discharge flow path and a suction flow path, the air conditioning chamber communicates with the discharge flow path and the suction flow path, respectively, and a local air flow is sucked into the air conditioning room through the suction flow path by the driving of the second blower fan. Cooling air heat-exchanged with the second evaporator or heated air heated by the second heater is characterized in that it circulates through the discharge passage.

In addition, a discharge nozzle is installed at an end of the discharge passage and a suction nozzle is installed at an end of the suction passage, and the discharge nozzle and the suction nozzle are installed to face each other on one side and the other side of the device under test, but the discharge nozzle includes It is characterized in that air is discharged toward the device under test at a position relatively higher than the suction nozzle.

In addition, the discharge nozzle includes a slit-shaped discharge port extending in the longitudinal direction to the pipe protruding into the chamber, and the suction nozzle includes a slit-shaped suction port extending in the longitudinal direction to the pipe protruding into the chamber characterized in that

In addition, it includes a support for supporting the test bed, the support is characterized in that the sliding movement along the guide rail installed on the inner surface of the chamber to enter and exit the inner space of the chamber.

In addition, a plurality of supports are installed vertically spaced apart from the inner space of the chamber, and the second temperature control unit is supported on the plurality of supports using a branch discharge flow and a branch suction flow branched from the air circulation flow path. It is characterized in that each local air flow is generated.

In addition, the inner space of the chamber is provided with a plurality of test rooms separated by a partition wall, and a plurality of second temperature control units are provided to independently control the temperature of the device under test installed on the mounting table of the plurality of test rooms.

In addition, the test bed has an open top and is formed as a box-shaped storage case to accommodate the device under test.

The present invention can control the ambient temperature of the device under test seated on the test bed by generating a local airflow in the internal space of the chamber, so that the thermal shock test that simulates the actual operating environment can be faithfully performed.

According to the present invention, when the test bed is installed in layers using supports installed spaced apart in the inner space of the chamber, local airflows can be simultaneously generated through the branch passages of the air circulation passages, so that thermal shock to many devices under test in a short time The test can be performed efficiently.

In the present invention, when a plurality of test rooms separated by a partition wall are provided in a single chamber, a local air flow can be generated in each test room to independently perform a thermal shock test on the device under test.

1 is a perspective view of a thermal shock test apparatus of an electronic device using a local airflow according to a first embodiment of the present invention;
2 is a cross-sectional view taken along line AA of FIG. 1;
3 is a cross-sectional view taken along line BB of FIG. 2;
4 is a block diagram of a thermal shock testing apparatus for an electronic device using a local airflow according to a first embodiment of the present invention;
5 is a cross-sectional view of a thermal shock testing apparatus for an electronic device using a local airflow according to a second embodiment of the present invention;
6 is a cross-sectional view of a thermal shock testing apparatus for an electronic device using a local airflow according to a third embodiment of the present invention;
7 is a cross-sectional view of a thermal shock testing apparatus for an electronic device using a local airflow according to a fourth embodiment of the present invention.

Hereinafter, the present invention will be described by describing embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in each figure indicate like elements. In addition, in describing the present invention, if it is determined that a detailed description of a related well-known function or configuration may unnecessarily obscure the gist of the present invention, the detailed description thereof will be omitted. Also, when a part "includes" a certain component, it means that other components may be further included, rather than excluding other components, unless otherwise stated.

(Example 1)

1 to 3, the thermal shock test apparatus 1 of an electronic device using a local airflow according to the present invention is provided with a sealed chamber 10 for testing a portable electronic device such as a smart phone. Here, the subject (sample) of the thermal shock test is not specifically limited, and may include the device under test to determine whether it operates and functions normally in high-temperature or low-temperature conditions. Electronic devices that require thermal shock testing in an actual operating environment, such as inside a vehicle, where the temperature distribution varies depending on the temperature, are more suitable.

The chamber 10 provides an internal space 11 blocked from the outside.

The heat exchange chamber 41 of the first temperature controller 40 may be formed in the upper portion of the chamber 10 , and the air conditioning chamber 51 of the second temperature controller 50 may be formed in the lower portion of the chamber 10 . In addition, the chamber door 21 for opening and closing the inner space 11 is rotatably coupled to one side of the chamber 10 . A packing member for airtight maintenance may be installed on the inner edge of the chamber door 21 .

At least one support 22 is installed in the chamber 10 . The support 22 is installed in a horizontal direction to cross the inner space 11 . Guide rails 23 fixed to the inner surfaces of both sides of the chamber 10 using the handles 22a attached to the front of the support 22 so that the operation of inserting or withdrawing the device under test (DUT) from the inside of the chamber 10 can be easily performed. It is preferable to apply a sliding movement method along the

The support 22 is formed in a flat plate shape and at least one test bed 24 may be installed on the upper surface. The test bed 24 may be designed differently depending on the type of the device under test (DUT), but may be designed to provide the same test environment to a plurality of devices under test (DUT) in common. In addition, the test bed 24 is installed to mechanically fix the device under test (DUT), supply appropriate power and test signals to the device under test (DUT), and extract test results from the device under test (DUT).

The thermal shock test apparatus 1 according to the embodiment may include a first temperature control unit 40 and a second temperature control unit 50 that can be independently controlled to adjust the temperature condition inside the chamber 10 . .

The first temperature control unit 40 includes a heat exchange chamber 41 , a first evaporator 42 , a first blowing fan 43 , a first heater 44 , and a first temperature sensor 45 .

The cooling air installed in the first blowing fan 43 between the heat exchange chamber 41 and the chamber 10 and heat-exchanged in the first evaporator 41 by the driving of the first blowing fan 43 is transferred to the inside of the chamber 10 . It flows into the space 11 to lower the temperature. At this time, the air in the inner space 11 of the chamber 10 is sucked through a suction port (not shown) and circulated to the heat exchange chamber 41 . By driving the first evaporator 41 and the first blowing fan 43 , the internal temperature of the chamber 10 may be decreased, and the internal temperature of the chamber 10 is measured by the first temperature sensor 45 .

Referring to FIG. 4 , when the temperature measured by the first temperature sensor 45 is lower than the temperature set through the input unit 101 , the control unit 100 drives the first heater 44 to heat the air to heat the chamber 10 ) can control the internal temperature.

In this way, the ambient temperature of the device under test (DUT) placed on the test bed 24 is adjusted in parallel with the operation of controlling the temperature of the internal space 11 of the chamber 10 using the first temperature controller 40 . In order to do this, the second temperature control unit 50 may be operated.

Referring to FIG. 2 , the second temperature control unit 50 includes an air conditioning chamber 51 , a second evaporator 52 , a second blowing fan 53 , a second heater 54 , a second temperature sensor 55 , An air circulation passage (56) is provided.

The entire area of the chamber 10 is controlled by the first temperature control unit 40 to increase or decrease the internal temperature. Only the second temperature controller 50 may supply cooling air or heating air to increase or decrease the ambient temperature of the device under test (DUT). This is a local airflow along the arrow direction in the internal space 11 of the chamber 10 using an independent air circulation path 56 in which the second temperature control unit 50 is not connected to the first temperature control unit 40 . is due to causing

The air circulation passage 56 includes a discharge passage 57 connecting one side of the air conditioning chamber 51 and the chamber 10 , and an intake passage 61 connecting the other side of the air conditioning chamber 51 and the chamber 10 .

A discharge nozzle 59 is formed at an end of the discharge passage 57 . The discharge nozzle 59 has a slit-shaped discharge port 60 extending in the longitudinal direction in the pipe protruding into the chamber as shown in FIG. 3 . In addition, a suction nozzle 63 is formed at the end of the suction passage 61 , and the suction nozzle 63 also includes a slit-shaped suction port 64 extending in the longitudinal direction in the pipe protruding into the chamber.

As shown in FIG. 2, the device under test (DUT) is positioned between the discharge nozzle 59 and the suction nozzle 63, and the discharge nozzle 59 and the suction nozzle 63 face each other and are installed to face each other. 59 discharges cooling air or heating air at a position relatively higher than the suction nozzle 63 .

The cooling air heat-exchanged in the second evaporator 52 by the driving of the second blowing fan 53 or the air heated by the second heater 54 passes through the discharge passage 57 connected to the air conditioning chamber 51 through the discharge nozzle. (59) is supplied. Air discharged from the discharge nozzle 59 toward the device under test (DUT) is supplied to the vicinity of the device under test (DUT). At this time, the suction nozzle 63 installed at a relatively low position sucks air flowing along the surface of the device under test (DUT), and the sucked air flows into the air conditioning chamber 51 via the suction flow path 61 .

The second temperature sensor 55 is installed on the test bed 24 to measure the ambient temperature of the device under test (DUT) and apply it to the control unit 100 . The control unit 100 controls the operations of the second blowing fan 53 , the second evaporator 52 , and the second heater 54 to satisfy the set temperature input through the input unit 101 . Accordingly, the cooling air heat-exchanged in the second evaporator 52 of the air conditioning chamber 51 or the air heated by the second heater 54 is discharged through the discharge passage 57, the device under test (DUT) in the internal space 11, It circulates through the suction passage 61 and the air conditioning chamber 51 in turn.

The user may set a temperature condition suitable for the thermal shock test through the input unit 101 . The control unit 100 may perform a thermal shock test by selectively or simultaneously operating and controlling the first and second temperature control units 40 and 50 in response to a set temperature condition. As shown in [Table 1], by designating any one of the preset operation modes, the thermal shock test on the device under test (DUT) can be performed according to the corresponding operation mode.

operation mode Total area inside the chamber
(first temperature control unit) Local area around the EUT
(Second temperature control unit) first test mode 60℃ 17℃ 2nd test mode 80℃ 25℃ 3rd test mode -5℃ 10℃

For example, when the first test mode is set, the controller 100 uses the first temperature controller 40 to reach 60° C. for the entire area of the internal space 11 of the chamber 10 by using the first heater ( 44) to control the operation. In parallel with this, the control unit 100 controls the operation of the second evaporator 52 and the second blowing fan 53 so that the ambient temperature of the device under test (DUT) reaches 17° C. using the second temperature control unit 50 . Control. Accordingly, the cooled air is discharged toward the device under test (DUT) through the discharge port 60 of the discharge nozzle 59 to lower the ambient temperature of the device under test (DUT). The local airflow by this cooling air is continuously made into an air circulation dll which is sucked into the suction port 64 of the suction nozzle 63 and flows into the air conditioning chamber 51 . When the measured temperature of the second temperature sensor 55 reaches 17° C., the control unit 100 stops the operation of the second evaporator 52 and the second blowing fan 53, and then when the ambient temperature rises again, the second The operation of the evaporator 52 and the second blowing fan 53 is resumed.

(Second embodiment)

In the first embodiment described above, the thermal shock test was performed on the device under test (DUT) by installing a single support 22 in the inner space 11 of the chamber 10, but as shown in FIG. 5, the second implementation In the example, a plurality of supports 22 are installed in layers in the inner space 11 of the chamber 10, and for a plurality of DUTs seated on the test bed 24 installed on the supports 22 of each floor. Thermal shock tests may be performed simultaneously and multiple times under the same conditions.

In the second embodiment, the first temperature controller 40 may have substantially the same configuration and function as in the first embodiment. In the second embodiment, the second temperature control unit 50 applies a modified air circulation passage (56a). The air circulation flow path 56a connects the discharge flow path 57 and the suction flow path 61 on both sides of the air conditioning chamber 51 to circulate the local airflow generated by the second temperature control unit 50, and discharge it together. The discharge branch flow path 58 and the suction branch flow path 62 branched from the flow path 57 and the suction flow path 61, respectively, are additionally configured.

A discharge nozzle 59 is formed at the ends of the discharge passage 57 and the branch discharge passage 58 , respectively, and the suction nozzle 63 is formed at the ends of the suction passage 61 and the branch suction passage 2 , respectively. The corresponding discharge nozzle 59 and the suction nozzle 63 discharge cooling air or heated air toward the corresponding device under test (DUT) seated on the test bed 24 of the support 22 installed in layers to prevent a local airflow. It is installed at intervals on both sides of the chamber 10 so that it can be generated.

The control unit 100 controls the operation of the second temperature control unit 50 according to the operation mode for the thermal shock test set as shown in [Table 1], and the local airflow generated by this is arranged in layers to form the test bed 24. The ambient temperature of the plurality of devices under test (DUT) seated in the unit will reach the set temperature.

(Example 3)

Although the method of performing the thermal shock test in the same experimental environment has been described in the first and second embodiments, the third embodiment may be applied when simultaneously testing the device under test (DUT) according to various experimental environments.

In the third embodiment, the chamber 10 is divided into a plurality of test rooms 12 and 13 separated by a partition wall 14, and a plurality of test rooms 12 and 13 are divided in order to set different experimental environments for each test room 12 and 13. The first and second temperature control units 40 and 50 may be installed. Here, the first temperature control unit 40 may use a single heat exchange chamber 41 and a single evaporator 42 in common.

The third embodiment can be tested by applying the first test mode of [Table 1] to one test room 12 and simultaneously applying the second test mode of [Table 1] to another test room 13. Simultaneous testing is possible according to various experimental environments.

(Example 4)

The fourth embodiment includes the same components as the first embodiment except that the test bed is modified so that the local airflow generated by the second temperature control unit 50 stays in the device under test (DUT). can be implemented by

In the fourth embodiment, the test bed 24a has an open top and is formed as a box-shaped storage case to accommodate the device under test (DUT). Since the test bed 24a is formed as a storage case having a side fence, a local airflow at a relatively low temperature stays in the test bed 24a and then flows. Accordingly, the ambient temperature of the device under test (DUT) can quickly reach the set temperature, and the test can be performed more stably when the ambient temperature reaches the set temperature.

The above description of the present invention is for illustration, and those of ordinary skill in the art to which the present invention pertains can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. That is, all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention.

1: thermal shock test apparatus 10: chamber
11: internal space 12, 13: test room
14: bulkhead 21: chamber door
22: support 23: guide rail
24, 24a: test bed 40: first temperature control unit
41: heat exchange chamber 42: first evaporator
43: first blowing fan 44: first heater
45: first temperature sensor 50: second temperature control unit
51: air conditioning room 52: second evaporator
53: second blowing fan 54: second heater
55: second temperature sensor 56: air circulation path
57: discharge flow path 58: discharge branch flow path
59: discharge nozzle 60: discharge port
61: suction flow path 62: suction branch flow path
63: suction nozzle 64: suction port

Claims (10)

a chamber providing an internal space blocked from the outside;
a test bed installed in the inner space of the chamber;
a first temperature control unit for adjusting the internal temperature of the chamber;
A second temperature control unit for controlling the ambient temperature of the device under test seated on the test bed by generating a local airflow in the internal space of the chamber;
The entire area of the chamber is controlled by the first temperature control unit, and a local area around the test bed is controlled by the second temperature control unit,
The second temperature control unit circulates cooling air or heating air through an independent air circulation path not linked to the first temperature control unit,
The air circulation flow path includes a discharge flow path provided with a discharge nozzle at an end and a suction flow path provided with a suction nozzle at the end, wherein the discharge nozzle and the suction nozzle are installed to face each other on one side and the other side of the device under test, The discharge nozzle discharges air toward the device under test at a position relatively higher than that of the suction nozzle. According to claim 1,
The first temperature control unit includes a heat exchange chamber formed on one side of the chamber, a first evaporator and a first blower fan installed in the heat exchange chamber, and a first heater installed on the inner surface of the chamber. Thermal shock test equipment for electronic devices. According to claim 1,
The second temperature controller includes an air conditioning chamber installed on the other side of the chamber, a second evaporator installed in the air conditioning chamber, a second blowing fan, and a second heater. 4. The method of claim 3,
The air conditioning chamber communicates with the discharge passage and the intake passage, respectively, and a local air flow is sucked into the air conditioning chamber through the intake passage by the driving of the second blowing fan. A thermal shock test apparatus for electronic devices using a local airflow, characterized in that heated heated air circulates through a discharge passage. delete 5. The method of claim 4,
The discharge nozzle includes a slit-shaped discharge port extending in the longitudinal direction to the pipe protruding into the chamber,
The suction nozzle is an electronic device thermal shock test apparatus using a local airflow, characterized in that it includes a slit-shaped suction port extending in the longitudinal direction to the pipe protruding into the chamber. According to claim 1,
It includes a support for supporting the test bed,
The support is a thermal shock test apparatus of an electronic device using a local airflow, characterized in that it slides in and out of the inner space of the chamber by sliding along the guide rail installed on the inner surface of the chamber. 8. The method of claim 7,
Installing a plurality of supports spaced apart in the vertical direction in the inner space of the chamber,
Thermal shock of an electronic device using a local air flow, characterized in that the second temperature control unit generates a local air flow for the test bed supported on the plurality of supports by using the discharge branch passage and the suction branch passage branched from the air circulation passage, respectively test device. According to claim 1,
The internal space of the chamber is provided with a plurality of test rooms separated by a partition wall,
A thermal shock testing apparatus for electronic devices using a local airflow, characterized in that it includes a plurality of second temperature control units to independently temperature-control the apparatus under test installed on the mounting table of a plurality of test rooms. According to claim 1,
The test bed has an open top and is formed in a box-shaped storage case to accommodate the device under test.

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