KR102341945B1 - Substrate processing apparatus - Google Patents

Abstract

The present invention relates to a substrate processing apparatus. The present invention, a frame; a stage provided on the frame and on which a substrate is loaded; a head unit support coupled to the frame; and a plurality of dispensing head units movably mounted on the head unit support in the X-axis direction, wherein at least one dispensing head unit among the plurality of dispensing head units is provided on at least one side of the head unit support. It provides a substrate processing apparatus, characterized in that the maintenance area for performing the maintenance work is formed.

Description

Substrate processing equipment {SUBSTRATE PROCESSING APPARATUS}

The present invention relates to a substrate processing apparatus. More specifically, the present invention includes a plurality of dispensing head units for dispensing a discharge material such as sealant to a substrate, and some of the plurality of dispensing head units perform a dispensing operation and some perform maintenance It is about a substrate processing apparatus.

In general, a flat panel display (FPD) is an image display device that is thinner and lighter than a TV or monitor employing a CRT. As flat panel displays, Liquid Crystal Display (LCD), Plasma Display Panel (PDP), Field Emission Display (FED), Organic Light Emitting Diodes (OLED) displays, etc. have been developed. has been and is being used.

In the manufacture of LCD or OLED, a sealant is applied to bond substrates together, a material for forming a spacer is applied to maintain a gap between substrates, liquid crystal is applied, various functional films, organic light emitting layers, or barrier ribs are formed. A dispensing device for applying a substance for the purpose is used.

As an example, Korean Patent Laid-Open Publication No. 10-2012-0077294 (published on July 10, 2012) discloses a stage on which a substrate is mounted, a head unit support frame installed on the upper part of the stage, and the head unit support frame installed on the Disclosed is a paste dispenser including a dispensing head unit through which paste is discharged.

However, in a substrate processing apparatus including a plurality of dispensing head units, there is a problem in that the operation of the substrate processing apparatus must be stopped in order to perform maintenance or calibration of the dispensing head unit.

In order to solve the above problems, the present invention provides a substrate processing apparatus capable of simultaneously performing tasks such as maintenance or calibration of some dispensing head units while continuously performing a dispensing operation on a substrate. aim to

The present invention, a frame; a stage provided on the frame and on which a substrate is loaded; a head unit support coupled to the frame; and a plurality of dispensing head units movably mounted on the head unit support in the X-axis direction, wherein at least one dispensing head unit among the plurality of dispensing head units is provided on at least one side of the head unit support. It provides a substrate processing apparatus, characterized in that the maintenance area for performing the maintenance work is formed.

In one embodiment, a structure for forming the maintenance area may be fixed to the head unit support.

The substrate processing apparatus may further include a syringe replacement robot configured to replace a syringe of a discharge material provided in the dispensing head unit.

In addition, the plurality of dispensing head units may be provided on one side of the head unit support, and the maintenance area may be formed on both sides of the head unit support, respectively.

In an embodiment, some of the plurality of dispensing head units are provided on one side of the head unit support to form a first dispensing head unit group, and the rest of the plurality of dispensing head units are the head unit support. It is provided on the other side of the second dispensing head unit group, and the maintenance area may be formed in only one place on one side of the head unit support.

In addition, the substrate processing apparatus may include: a main control unit; a first head unit control unit for controlling a first dispensing head unit group including a part of the plurality of dispensing head units; and a second head unit controller configured to control a second dispensing head unit group including the rest of the plurality of dispensing head units.

In an embodiment, the substrate processing apparatus is installed in an installation space, and an airflow may be formed from an upper portion of the stage toward the maintenance area in the installation space.

In addition, in the maintenance area, a replacement operation of the ejection material syringe mounted on the dispensing head unit, a dummy discharge operation of the dispensing head unit, a discharge state inspection operation of a dispensing nozzle of the dispensing head unit, and the dispensing operation At least one of a position alignment operation of the head unit may be performed.

The dispensing head unit may include a height measuring sensor for measuring the height between the dispensing nozzle and the discharge surface and a camera for acquiring the discharged image. In addition, the height measuring sensor, the discharge port of the dispensing nozzle, and the camera may be positioned to be aligned in a direction parallel to the X-axis.

In one embodiment, the dispensing head unit is formed with a syringe mounting part to which the dispensing material syringe is mounted, the discharging material discharging part of the discharging material syringe is formed in a narrow conical shape at the bottom, and the discharging material discharging part is coupled The mounting groove portion of the syringe mounting portion may be formed as a tapered surface corresponding to the discharge material discharge portion.

In addition, the bubbles remaining by being mounted to the mounting groove in a state in which the discharge material droplet D is formed at the tip of the discharge material discharge unit may be discharged between the discharge material discharge unit and the mounting groove.

According to the present invention, maintenance work such as replacement of the ejection material syringe and the ejection state correction for some dispensing head units is performed, while dispensing the ejection material for the substrate can be performed using another dispensing head unit. The substrate processing speed can be improved.

In addition, according to the present invention, there is an advantage in that the maintenance work of the dispensing head unit can be automated.

In addition, according to the present invention, it is possible to minimize the contamination of the substrate by transferring foreign substances that may be generated during maintenance of the dispensing head unit to the side of the substrate on which the dispensing operation is performed.

1 is a plan view of a substrate processing apparatus according to a preferred embodiment of the present invention.
2 is a front view of a substrate processing apparatus according to a preferred embodiment of the present invention.
3 is a diagram illustrating an airflow supply configuration inside a working space in a substrate processing apparatus according to a preferred embodiment of the present invention.
4 is a diagram illustrating a configuration of a substrate processing apparatus according to another preferred embodiment of the present invention.
5 is a diagram illustrating a configuration of a substrate processing apparatus according to another embodiment of the present invention.
FIG. 6 is a view illustrating discharging states of discharging materials of first to fourth dispensing head units belonging to the first dispensing head unit group in a maintenance area.
7 is a view for explaining the positional relationship between the dispensing nozzle, the height measuring sensor, and the camera provided in the dispensing head unit in the substrate processing apparatus according to the preferred embodiment of the present invention.
8 is a diagram illustrating a configuration of a dispensing head unit of a substrate processing apparatus according to a preferred embodiment of the present invention.
9 is a diagram illustrating a process of replacing a syringe of a discharge material in a dispensing head unit of a substrate processing apparatus according to a preferred embodiment of the present invention.
FIG. 10 is a view for explaining a state in which a syringe of a discharge material is mounted on a syringe mounting unit in a substrate processing apparatus according to a preferred embodiment of the present invention.
11 is a block diagram illustrating a configuration of a control unit of a substrate processing apparatus according to a preferred embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, it should be noted that in adding reference numerals to the components of each drawing, the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, preferred embodiments of the present invention will be described below, but the technical spirit of the present invention is not limited thereto and may be variously implemented by those skilled in the art without being limited thereto.

1 is a plan view of a substrate processing apparatus according to a preferred embodiment of the present invention, and FIG. 2 is a front view of the substrate processing apparatus according to a preferred embodiment of the present invention.

A substrate processing apparatus 1 according to a preferred embodiment of the present invention includes a frame 10 forming a lower structure, a stage 20 positioned above the frame on which a substrate to be processed is loaded, and the frame 10 . ), a head unit support 30 installed across the top, a plurality of dispensing head units 40 movably provided on the head unit support 30 in the X-axis direction, and the dispensing head unit ( 40) includes a syringe replacement robot 50 for replacing the ejection material syringe provided.

The head unit support 30 may include a guide rail for guiding the movement of the dispensing head unit 40 in the X-axis direction, and an X-axis driving motor for driving the dispensing head unit 40 in the X-axis direction. . In addition, each of the plurality of dispensing head units 40 may be provided to individually move in the X-axis direction.

The dispensing head unit 40 may include a dispensing nozzle, which will be described later, and a dispensing material syringe for supplying a dispensing material to be dispensed to the dispensing nozzle.

The substrate processing apparatus 1 may include an installation space 100 forming a space isolated from the outside. A predetermined working gas may be supplied to the installation space 100 . In one embodiment, purified nitrogen may be supplied into the installation space 100 . This is to prevent damage to electronic devices, etc. by moisture or oxygen in the atmosphere, and to prevent foreign substances from entering.

Meanwhile, at one side of the installation space 100 , anti-chambers 110a and 102b for connecting the inside and the outside of the installation space 100 may be provided. In an embodiment, the syringe of the discharge material before and after use may be exchanged through the anti-chambers 110a and 102b. When a new syringe of discharge material is supplied to the anti-chambers 110a and 102b by the operator from the outside, after closing the anti-chambers 110a and 102b from the outside, the air in the anti-chambers 110a and 102b is vented and the installation space ( After forming in the same environment as 100), a door between the anti-chambers 110a and 102b and the installation space 100 is opened to supply a new syringe of discharge material into the installation space 100 . The same process as described above may be performed even in the case of discharging the used discharge material syringe from the inside of the installation space 100 to the outside.

In the present invention, the head unit support 30 is extended to the outside of the frame 10, the outside of the frame 10 is formed with a maintenance area (60). In one embodiment, the maintenance area 60 includes a first maintenance area 60A provided on one side of the frame 10 and a second maintenance area 60B provided on an opposite side of the first maintenance area 60A. ) may be included. A structure for forming the first maintenance area 60A and the second maintenance area 60A may be coupled to a portion of the head unit support 30 extending outwardly of the frame 10 .

The dispensing head unit 40 includes a first dispensing head unit group 40A and a second dispensing head unit group 40B. The first dispensing head unit group 40A includes at least one dispensing head unit H1, H2, H3, and H4, and the second dispensing head unit group 40B includes at least one dispensing head unit ( H5, H6, H7, H8).

In one embodiment, the second group of dispensing headunits 40B is loaded onto the stage 20 while the first group of dispensing headunits 40A is moved to the first maintenance area 60A to perform maintenance work. Dispensing the ejected material to the finished substrate.

In addition, when the maintenance work on the first dispensing head unit group 40A is completed and the maintenance work on the second dispensing head unit group 40B is required, the second dispensing head unit group 40B becomes the second dispensing head unit group 40B. The maintenance work is performed by moving to the maintenance area 60B, and the first dispensing head unit group 40A is moved to the upper part of the stage 20 to dispense the discharged material.

Accordingly, the substrate processing apparatus 1 according to the present invention may perform a dispensing operation on a substrate by using the remaining dispensing head units while performing a maintenance operation on any one dispensing head unit group.

The maintenance work for the dispensing head unit 40 includes replacement of the ejection material syringe provided in the dispensing head unit 40 , adjustment of the height of the dispensing nozzle tip provided in the dispensing head unit 40 , and the dispensing head The discharge position or discharge amount of the discharge material discharged from the dispensing nozzle of the unit 40 may be corrected.

The syringe replacing robot 50 may include a first syringe replacing robot 50A and a second syringe replacing robot 50B. The first syringe replacing robot 50A and the second syringe replacing robot 50B may have the same configuration.

The syringe replacement robot 50 is configured to move between the anti-chamber 110 and the maintenance area 60 . A moving rail 58 may be provided on one side of the frame 10 to move the syringe replacement robot 50 . The syringe replacement robot 50 may include a main body 52 and a plurality of robot arms 54 having an end effector at an end and a plurality of robot arms 54 for three-dimensional driving of the end effector. The syringe replacement robot 50 may be provided with a syringe holder 56 . A syringe before use and a syringe after use may be stored in the syringe holder 56 . The syringe holder 56 may be composed of a first syringe holder 56A for storing a syringe before use and a second syringe holder 56B for storing a syringe after use.

The syringe replacement robot 50 may bring a syringe before use from the anti-chamber 110 and take the syringe out to the anti-chamber 110 after use. The syringe replacement robot 50 holds the syringe after use that was mounted on the dispensing head unit 40 and stores it in the syringe holder, and the syringe before use stored in the syringe holder can be mounted on the dispensing head unit 40 have.

3 is a diagram illustrating an airflow supply configuration inside a working space in a substrate processing apparatus according to a preferred embodiment of the present invention.

Maintenance of the dispensing head unit 40 is made in the first maintenance area 60A or the second maintenance area 60B. Foreign substances may be generated during maintenance of the dispensing head unit 40 . For example, a material discharged from the maintenance area 60 during a discharge inspection operation of the dispensing head unit 40 or a foreign material may occur during movement or operation of the syringe replacement robot 50 . When a material generated during maintenance of the dispensing head unit 40 moves toward the stage 20 , it may cause substrate processing defects.

In order to solve this problem, as shown in FIG. 3 , the airflow in the installation space 100 may be formed from the top of the stage 20 toward the side. In one embodiment, the working gas supply units 102A and 102B are provided at the upper portion of the installation space 100 , and the working gas discharge units 104A and 104B are provided at the lower side of the installation space 100 . The working gas supply units 102A and 102B supply the working gas toward the stage 20 . In order to direct the working gas downward, an airflow blocking wall 106 arranged to face downward from the ceiling of the installation space 100 may be formed on the side where the working gas supply units 102A and 102B are formed.

As the working gas is discharged through the working gas discharge units 104A and 104B, an airflow as shown in FIG. 3 may be formed.

4 is a diagram illustrating a configuration of a substrate processing apparatus according to another preferred embodiment of the present invention.

The substrate processing apparatus 1 shown in FIG. 4 includes a frame 10 , a stage 20 , and a head unit support 30 , and the head unit support 30 includes a dispensing head unit 40 . do.

In FIG. 1, all of the plurality of dispensing head units 40 are provided on one side of the head unit support 30, but in FIG. 4, the first dispensing head unit group ( 40A) is provided to be movable in the X-axis direction, and the second dispensing head unit group 40B is a head unit support ( 30) is provided.

In addition, in the substrate processing apparatus 1 shown in FIG. 4 , the maintenance area 60 is formed only on one side of the frame, and one syringe replacement robot 50 is provided.

The second dispensing headunit group 40B performs dispensing while the maintenance operation for the first dispensing headunit group 40A is performed in the maintenance area 60 . When maintenance of the second dispensing head unit group 40B is required, the first dispensing head unit group 40A moves to the upper part of the stage 20 and the second dispensing head unit group 40B moves to the maintenance area ( 60).

5 is a diagram illustrating a configuration of a substrate processing apparatus according to another embodiment of the present invention.

Referring to FIG. 5 , a plurality of head unit supports 30A and 30B are fixedly provided to the frame 10 . A 1-1 dispensing head unit group 40A1 and a 2-1 dispensing head unit group 40A2 are provided on the first head unit support 30A, and the 1-th dispensing head unit group 40A2 is provided on the second head unit support 30B. A second dispensing head unit group 40A2 and a second-second dispensing head unit group 40B2 are provided.

In addition, a 1-1 maintenance area 60A1 and a 2-1 maintenance area 60B1 are provided on both sides of the first head unit support 30A, and a 1-th maintenance area 60B1 is provided on both sides of the second head unit support 30B. A second maintenance area 60A2 and a 2-2 maintenance area 60B2 are provided.

Next, a maintenance operation for the dispensing head unit 40 in the maintenance area 60 will be described.

The syringe replacement robot 50 receives a new ejection material syringe from the anti-chamber 110 and moves to the maintenance area 60 . On the other hand, the dispensing head unit 40 requiring maintenance work is located in the maintenance area 60 by moving in the X-axis direction from the head unit support 30 .

The syringe replacement robot 50 detaches the dispensing material syringe that has been used from the dispensing head unit 40 and puts it on the syringe holder 56 , and holds a new dispensing material syringe in the syringe holder 56 , and the dispensing head unit (40) is installed.

After the replacement of the ejection material syringe is completed, the dispensing head unit 40 discharges the dummy through the dispensing nozzle. The dummy discharge is to discharge the remaining air bubbles after replacing the ejection material syringe and to normalize the ejected material in the ejection material syringe and dispensing nozzle.

After discharging the dummy is completed, the dispensing position of the dispensing head unit 40 is corrected. The dispensing head unit 40 is movable in the X-axis direction on the head unit support 30 , and the dispensing head unit 40 has a dispensing nozzle or a component including a dispensing nozzle for driving in the Z-axis direction. A Z-axis driving unit and a Y-axis driving unit driving in the Y-axis direction may be included. Accordingly, the Z-axis height and the Y-axis position of the dispensing nozzle may be adjusted. The operating range of the Y-axis driving unit may be several mm to several tens of mm.

The dispensing position correction may include correcting the height of the dispensing nozzle in the Z-axis direction. The dispensing head unit 40 is provided with a height measuring sensor for sensing the height between the dispensing nozzle and the dispensing surface on which the dispensing material is discharged and falls, and drives the Z-axis driving unit according to the sensing value of the height measuring sensor to dispense The height of the fencing head unit 40 can be corrected.

In addition, the Y-axis direction position of the dispensing head unit 40 may be adjusted through test discharge for the plurality of dispensing head units 40 located in the maintenance area 60 .

FIG. 6 is a view illustrating discharging states of discharging materials of first to fourth dispensing head units belonging to the first dispensing head unit group in a maintenance area.

It is assumed that the first dispensing head unit group 40A is located in the maintenance area 60 . The dispensing material is discharged by controlling the first to fourth dispensing head units H1, H2, H3, and H4 belonging to the first dispensing head unit group 40A. Discharge material while moving the first to fourth dispensing head units H1, H2, H3, and H4 in the X-axis direction, and the Y-axis of the first to fourth dispensing head units H1, H2, H3, H4 The dispensing nozzle is moved in the Y-axis direction by driving the driving unit to discharge the discharged material. As shown in FIG. 6 , the first to fourth discharging states 12a, 12b, 12c, and 12d appear by this discharging operation.

At least one of the first to fourth dispensing head units H1, H2, H3, and H4 is provided with a camera, and images for the first to fourth dispensing states 12a, 12b, 12c, and 12d are acquired using the camera. Thus, it is determined whether the first to fourth discharge states 12a, 12b, 12c, and 12d are normally discharged. If the positions of the first to fourth discharging states 12a, 12b, 12c, and 12d in the Y-axis direction are shifted, at least one of the Y-axis driving units provided in each of the first to fourth discharging states 12a, 12b, 12c, and 12d to adjust the position in the Y-axis direction.

Meanwhile, the '+'-shaped first to fourth discharging states 12a, 12b, 12c, 12d or the first to fourth dispensing head units H1, H2, H3, H4 are discharged while moving in the X-axis direction. The discharge condition of the first to fourth dispensing head units H1, H2, H3, and H4 may be adjusted until a desired discharge width is obtained by receiving the received state through the camera and measuring the discharge width.

7 is a view for explaining the positional relationship between the dispensing nozzle, the height measuring sensor, and the camera provided in the dispensing head unit in the substrate processing apparatus according to the preferred embodiment of the present invention.

Taking the fourth dispensing head unit H4 as an example, the dispensing head unit 40 is provided with a distance measuring sensor 42 for measuring the distance to the discharge surface and a camera 44 for capturing an image. . In an embodiment, the positions of the distance measuring sensor 42 , the camera 44 , and the nozzle outlet 46 are set to have the same distance in the Y-axis direction. This is to measure the state of application of the discharged material through the nozzle outlet 46 only by moving the dispensing head unit 40 in the X-axis direction on the head unit support 30 .

8 is a diagram illustrating a configuration of a dispensing head unit of a substrate processing apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 8 , each dispensing head unit 40 is provided with a dispensing nozzle 210 and a dispensing material syringe 220 .

The dispensing nozzle 210 receives the discharge material from the discharge material syringe 220 through the discharge material delivery passage 206 and discharges it. A screw is built in the dispensing nozzle 210 and may be configured to pressurize and discharge the discharge material as the screw rotates.

The ejection material syringe 220 may be mounted on the syringe mounting unit 204 provided in the dispensing head unit 40 .

9 is a diagram illustrating a process of replacing a syringe of a discharge material in a dispensing head unit of a substrate processing apparatus according to a preferred embodiment of the present invention.

Referring to FIG. 9 , the discharge material syringe 220 includes a discharge material accommodating part 222 for accommodating the discharge material, a lower coupling part 224 provided under the discharge material accommodating part 222 and the discharge material accommodation A cap portion 228 provided on the upper portion of the portion 222 may be included. An upper support part 230 for supporting the upper end of the ejection material syringe 220 may be provided at an upper portion of the cap part 228 . In one embodiment, the upper support portion 230 may include a configuration that communicates with the upper end of the cap portion 228 to transmit pneumatic pressure. This is to control the internal pressure of the ejection material syringe 222 by transmitting pneumatic pressure to the inside of the ejection material syringe 222 .

A discharge material discharge unit 226 is formed at an end of the lower coupling unit 224 . The lower coupling part 224 is mounted on the syringe mounting part 204 , and a sealing member 205 for sealing the lower coupling part 224 may be provided on the upper surface of the syringe mounting part 204 .

When the discharge material accommodated in the discharge material receiving part 222 of the discharge material syringe 220 is lower than the reference water level and needs to be replaced (FIG. 9 (a)), the dispensing head unit 40 moves to the maintenance area 60 do. In the maintenance area 60, the upper support part 230 supporting the upper end of the ejection material syringe 220 is removed, and the ejection material syringe 220 is detached from the syringe mounting unit 204 (FIG. 9(b)). A new discharge material syringe 220 is mounted on the syringe mounting part 204 (FIG. 9 (c)), and the upper support part 230 is located on the upper end of the discharge material syringe 220 (FIG. 9 (d)) . The replacement operation of the ejection material syringe 220 is performed by the syringe replacement robot 50 .

FIG. 10 is a view for explaining a state in which a syringe of a discharge material is mounted on a syringe mounting unit in a substrate processing apparatus according to a preferred embodiment of the present invention.

The discharge material discharge part 226 of the discharge material syringe 220 is mounted on the mounting groove 207 of the syringe mounting unit 204 . The discharge material discharge unit 226 is formed in a narrow conical shape at the bottom. The mounting groove portion 207 is formed with a tapered surface corresponding to the shape of the discharge material discharge portion 226 .

The tip of the discharge material discharge unit 226 is controlled to be in a state in which the discharge material droplets D are formed. When the discharge material discharge unit 226 is coupled to the mounting groove portion 207, the discharge material droplet (D) meets the discharge material (F) remaining in the existing mounting groove portion 207, and the bubbles discharge the discharge material It is to be discharged through between the portion 226 and the mounting groove portion (207).

11 is a block diagram illustrating a configuration of a control unit of a substrate processing apparatus according to a preferred embodiment of the present invention.

A substrate processing apparatus 1 according to a preferred embodiment of the present invention includes a main control unit 330 for controlling the overall operation of the apparatus, and a first head unit control unit 310 for controlling the first dispensing head unit group 40A. and a second head unit control unit 320 for controlling the second dispensing head unit group 40B.

When the maintenance work of the first dispensing head unit group 40A is required, the first head unit control unit 310 moves the first dispensing head unit group 40A to the maintenance area 60 and according to the progress of the maintenance work Controls the first dispensing head unit group 40A. In this case, the main control unit 300 controls the operation of the syringe replacing robot 50 according to the control state of the first dispensing head unit group 40A. Meanwhile, the second head unit controller 320 controls the second dispensing head unit group 40B to perform dispensing on the substrate loaded on the stage 20 .

Meanwhile, the main control unit 300 may set and allocate a dispensing head unit to be controlled by the first head unit control unit 310 and a dispensing head unit to be controlled by the second head unit control unit 320 . . That is, in FIG. 11 , the first head unit control unit 310 controls the dispensing head units H1, H2, H3, and H4, and the second head unit control unit 320 controls the dispensing head units H5, H6, H7, H8) is illustrated, but it is also possible to set the dispensing head unit H4 to be controlled by the second head unit control unit 320 by assignment of the main control unit 300 .

The above description is merely illustrative of the technical idea of the present invention, and various modifications, changes, and substitutions are possible within the range that does not depart from the essential characteristics of the present invention by those of ordinary skill in the art to which the present invention pertains. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are for explaining, not limiting, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments and the accompanying drawings . The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

10 : frame
20: Stage
30: head unit support
40: dispensing head unit
50: syringe replacement robot
60: maintenance area
100: installation space
102A, 102B: Working gas supply part
104A, 104B: Working gas discharge part
110: anti-chamber
106: airflow barrier
110: anti-chamber
210: dispensing nozzle
220: ejection material syringe
300: main fisherman
310: first head unit control unit
320: second head unit control unit

Claims (12)

frame;
a stage provided on the frame and on which a substrate is loaded;
a head unit support coupled to the frame; and
A plurality of dispensing head units movably mounted on the head unit support in the X-axis direction;
A maintenance area for performing maintenance on at least one of the plurality of dispensing head units is formed on at least one side of the head unit support,
main fisherman;
a first head unit control unit for controlling a first dispensing head unit group including a part of the plurality of dispensing head units; and
a second head unit control unit for controlling a second dispensing head unit group including the remainder of the plurality of dispensing head units;
The main control unit sets and allocates a dispensing head unit to be controlled by the first head unit control unit and a dispensing head unit to be controlled by the second head unit control unit from among the plurality of dispensing head units,
The dispensing head unit has a syringe mounting part on which a discharging material syringe is mounted, the discharging material discharging part of the discharging material syringe is formed in a narrow conical shape at the bottom, and the mounting groove portion of the syringe mounting part to which the discharging material discharging part is coupled The substrate processing apparatus, characterized in that the ejection material is formed in a tapered surface corresponding to the discharge portion, and the ejection material syringe is replaceable. The method of claim 1,
A substrate processing apparatus, characterized in that the structure for forming the maintenance area is fixed to the head unit support. The method of claim 1,
The substrate processing apparatus further comprising a syringe replacement robot for replacing the syringe of the discharge material provided in the dispensing head unit. The method of claim 1,
The plurality of dispensing head units are provided on one side of the head unit support, and the maintenance area is formed on both sides of the head unit support, respectively. The method of claim 1,
Some of the plurality of dispensing head units are provided on one side of the head unit support to form a first dispensing head unit group, and the rest of the plurality of dispensing head units are provided on the other side of the head unit support. 2 Forming a dispensing head unit group, and the maintenance area is formed in only one place on one side of the head unit support. delete The method of claim 1,
The substrate processing apparatus is installed in an installation space, and an airflow is formed from an upper portion of the stage toward the maintenance area in the installation space. The method of claim 1,
In the maintenance area, a replacement operation of the ejection material syringe mounted on the dispensing head unit, a dummy discharge operation of the dispensing head unit, a discharge state inspection operation of a dispensing nozzle of the dispensing head unit, and the dispensing head unit Substrate processing apparatus, characterized in that at least one of the position alignment operation of the performed. 9. The method of claim 8,
The dispensing head unit is equipped with a height measuring sensor for measuring the height between the dispensing nozzle and the discharge surface, and a camera for acquiring the discharged image. 10. The method of claim 9,
The height measuring sensor, the discharge port of the dispensing nozzle, and the camera are arranged and positioned in a direction parallel to the X-axis. frame;
a stage provided on the frame and on which a substrate is loaded;
a head unit support coupled to the frame;
a plurality of dispensing head units movably mounted on the head unit support in the X-axis direction; and
Including; a syringe replacement robot for replacing the syringe of the dispensing material provided in the dispensing head unit;
A maintenance area for performing maintenance on at least one of the plurality of dispensing head units is formed on at least one side of the head unit support,
The dispensing head unit is provided with a syringe mounting part to which the dispensing material syringe is mounted, the discharging material discharging part of the discharging material syringe is formed in a narrow conical shape at the bottom, and a mounting groove of the syringe mounting part to which the discharging material discharging part is coupled The substrate processing apparatus, characterized in that the portion is formed with a tapered surface corresponding to the discharge material discharge portion. 12. The method of claim 11,
The substrate processing apparatus, characterized in that the air bubbles remaining by being mounted on the mounting groove in a state in which the discharge material droplet (D) is formed at the tip of the discharge material discharge unit is discharged between the discharge material discharge unit and the mounting groove.

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