KR102320646B1 - 향상층(들)을 갖는 oled 디바이스 - Google Patents
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Abstract
Description
도 2는 별도의 전자 수송층을 갖지 않는 인버트형 유기 발광 디바이스를 도시한다.
도 3은 금속 막으로부터의 발광 물질의 거리의 함수로서 SPP 방식으로 인한 표면 플라즈몬 폴라리톤 (SPP) 방식으로 인한 방사성 붕괴 속도 상수 및 SPP 방식으로 인한 비-방사성 붕괴 속도 상수의 정성적 플롯을 도시한다. 또한, SPP 방식으로 인한 속도 상수에 의하여 좌우되는 금속 막으로부터 발광 물질의 거리의 함수로서 계에 대한 전체 방사성 대 비-방사성 속도 상수의 비를 플롯한다.
도 4a는 확인된 2개의 역치 거리를 갖는 금속 향상 막으로부터 발광 물질의 거리의 함수로서 양자 수율의 플롯을 도시한다.
도 4b는 플롯에서 확인된 역치 거리 2를 갖는 비-방사성 OLED에 대한 아웃커플링층이 존재하지 않을 경우 금속 향상 막으로부터 광 에미터의 거리의 함수로서 OLED의 온도의 개략도를 도시한다.
도 5는 3개의 유닛 셀로 이루어진 향상층의 예의 개략도이다.
도 6은 향상층을 포함하는 유닛 셀에 대한 예시의 설계의 개략도이다. 유닛 셀의 각각의 서브성분층은 제시한 바와 같은 상이한 물질로 이루어질 수 있다.
도 7은 예시의 향상층 설계의 개략도이다.
도 8a-8c는 향상층(들)을 갖는 OLED 디바이스의 예의 개략도를 도시한다. OLED 디바이스는 개개의 애노드 및 캐소드 접촉층을 특징으로 한다. OLED는 상부 또는 하부 발광일 수 있다.
도 9a-9e는 향상층(들)을 갖는 OLED 디바이스의 예의 개략도를 도시한다. 향상층(들)은 OLED 디바이스에 대한 접촉(들)으로서 작용한다. OLED는 상부 또는 하부 발광일 수 있다.
도 10은 한 실시양태에 의한 향상층 OLED 디바이스 구조의 예의 개략도이다.
도 11은 또 다른 실시양태에 의한 향상층 OLED 디바이스 구조의 예의 개략도이다.
도 12는 에미터의 피크 파장 및 전체 OLED 두께의 함수로서 광 에미터의 속도 상수의 향상 요인을 나타내는 플롯이다.
도 13a는 2D 패턴 형성된 향상층의 상면도이다.
도 13b는 3D 패턴 형성된 향상층의 상면도이다.
도 14a는 발광 속도 상수에서의 예측된 브로드밴드 증가를 입증하는 도 7에 도시된 바람직한 구조에 대한 발광 속도 상수 대 파장의 광학 모델링 데이타를 도시한다.
도 14b는 퓨어셀(Purcell) 효과로 인한 좁은 발광을 입증하는 구조 내의 녹색 에미터에 대한 발광 강도 대 파장의 광학 모델링 데이타를 도시한다.
도 14c는 각종 정공 수송층 두께에 대한 발광 대 파장의 아웃커플링된 분율에 대한 광학 모델링 데이타를 도시한다.
도 15는 각종 정공 수송층 두께에 대한 도 7에 도시된 실험으로 실현된 바람직한 구조로부터의 발광을 도시한다.
도 3, 4a, 4a, 12, 14a-c 및 15에 도시된 플롯 이외에, 모든 도면은 개략적으로 예시하며, 실제의 차원 또는 비율을 나타내고자 하는 것은 아니다. 본원에 언급되며 도면에 제시된 각종 OLED 예에 예시된 특정한 작용층 이외에, 본 개시내용에 의한 OLED는 OLED에서 종종 발견되는 임의의 기타 작용층을 포함할 수 있다.
Claims (61)
- 기판;
제1 전극;
전극 상에 배치된 유기 발광성 물질을 포함하는 유기 발광층;
유기 발광성 물질에 비-방사적으로 커플링되며, 발광성 물질로부터 비-방사성 방식의 표면 플라즈몬 폴라리톤까지 여기 상태 에너지를 전달하는 표면 플라즈몬 공명을 나타내는 플라즈몬성 물질을 포함하고, 제1 전극의 반대쪽에 유기 발광층 상에 배치되는 향상층으로서,
여기서 향상층은 유기 발광층과 접촉하거나, 또는 유기 발광층으로부터 역치 거리 이하의 거리 내에서 제공되며,
여기서 유기 발광성 물질이 향상층의 존재로 인하여 전체 비-방사성 붕괴 속도 상수 및 전체 방사성 붕괴 속도 상수를 가지며, 역치 거리는 전체 비-방사성 붕괴 속도 상수가 전체 방사성 붕괴 속도 상수와 동일한 거리인 향상층;
을 포함하는 디바이스로서,
향상층이 제2 전극이거나, 또는 디바이스는 유기 발광층 상에 배치되는 제2 전극을 더 포함하고,
기판은 향상층 상에 배치되거나, 또는 기판이 유기 발광층의 반대쪽에 제1 전극에 인접하게 배치되는 것인 디바이스. - 제1항에 있어서, 향상층 상에 배치되는 아웃커플링층으로서, 자유 공간에 광자로서 표면 플라즈몬 폴라리톤으로부터 에너지를 산란시키는 아웃커플링층을 더 포함하는 것인 디바이스.
- 제2항에 있어서, 향상층 및 아웃커플링층 사이에 배치된 개재층을 더 포함하며, 개재층이 1-10 ㎚의 두께 및 0.1 내지 4.0의 굴절률을 갖는 디바이스.
- 제1항에 있어서, 플라즈몬성 물질이 Ag, Au, Al, Pt, Ag, Au, Al, Pt의 임의의 조합의 합금, 도핑된 산화물 및 도핑된 질화물로 이루어진 군으로부터 선택된 금속인 디바이스.
- 제1항에 있어서, 향상층이 주기적, 준-주기적 또는 무작위적으로 정렬된 파장-사이징된 또는 서브-파장-사이징된 피쳐로 형성된 1개 이상의 세트의 그레이팅인 디바이스.
- 제5항에 있어서, 파장-사이징된 피쳐 및 서브-파장-사이징된 피쳐가 샤프한 엣지를 갖는 디바이스.
- 제6항에 있어서, 그레이팅이 주기적 패턴을 가지며, 파장-사이징된 또는 서브-파장-사이징된 피쳐가 10-90% 듀티 사이클로 100-2,000 ㎚의 피치로 한 방향을 따라 균일하게 정렬되는 디바이스.
- 제6항에 있어서, 향상층이 2개의 세트의 그레이팅으로 형성되며, 각각의 세트의 그레이팅에서, 파장-사이징된 또는 서브-파장-사이징된 피쳐가 10-90% 듀티 사이클로 100-2,000 ㎚의 피치로 한 방향을 따라 불균일하게 정렬되며, 각각의 세트의 그레이팅이 x-방향 및 y-방향에서 10-90% 듀티 사이클로 100-2,000 ㎚의 피치로 상이한 방향으로 배향되는 디바이스.
- 제3항에 있어서, 향상층이 플라즈몬성 물질층 및 유전성 물질층을 포함하는 적층체이며, 플라즈몬성 물질층이 Ag, Au, Al, Pt 및 이들 물질의 임의의 조합의 합금으로 이루어진 군으로부터 선택된 금속인 디바이스.
- 제1항에 있어서, 향상층이 플라즈몬성 물질층 및 접착 물질층을 포함하는 적층체이며, 플라즈몬성 물질이 Ag, Au, Al, Pt 및 이들 물질의 임의의 조합의 합금으로 이루어진 군으로부터 선택된 금속이며, 접착 물질이 Ni, Ti, Cr, Au, Ge, Si 및 이들 물질의 임의의 조합의 합금으로 이루어진 군으로부터 선택되는 디바이스.
- 제10항에 있어서, 플라즈몬성 물질이 Ag이며, 접착 물질이 Ge인 디바이스.
- 제10항에 있어서, 플라즈몬성 물질층이 0.2 내지 50 ㎚의 두께를 가지며, 접착 물질층이 0.1 내지 5 ㎚의 두께를 갖는 디바이스.
- 제2항에 있어서, 아웃커플링층이 절연 물질, 반도전성 물질, 금속 또는 그의 임의의 조합으로 이루어지며; 아웃커플링층이 향상층에 평행한 평면을 따라 상이한 굴절률의 2종의 물질로 이루어지며, 2종의 물질이 상이한 굴절률을 가지며, 굴절률의 실수부에서의 차이가 0.1 내지 3.0이거나; 또는 아웃커플링층이 주기적, 준-주기적 또는 무작위적으로 정렬된 파장-사이징된 또는 서브-파장-사이징된 피쳐로 형성된 1개 이상의 세트의 그레이팅인 디바이스.
- 제1항에 있어서, 향상층이 제2 전극인 디바이스.
- 제2항에 있어서, 디바이스가 개재층 및 아웃커플링층 사이에 배치된 제2 전극을 더 포함하는 디바이스.
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