KR102305796B9 - Wafer polishing pad apparatus and manufacturing method thereof - Google Patents

Wafer polishing pad apparatus and manufacturing method thereof

Info

Publication number
KR102305796B9
KR102305796B9 KR1020200013622A KR20200013622A KR102305796B9 KR 102305796 B9 KR102305796 B9 KR 102305796B9 KR 1020200013622 A KR1020200013622 A KR 1020200013622A KR 20200013622 A KR20200013622 A KR 20200013622A KR 102305796 B9 KR102305796 B9 KR 102305796B9
Authority
KR
South Korea
Prior art keywords
manufacturing
polishing pad
wafer polishing
pad apparatus
wafer
Prior art date
Application number
KR1020200013622A
Other languages
Korean (ko)
Other versions
KR20210099808A (en
KR102305796B1 (en
Inventor
안진우
장수천
Original Assignee
에스케이실트론 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 에스케이실트론 주식회사 filed Critical 에스케이실트론 주식회사
Priority to KR1020200013622A priority Critical patent/KR102305796B1/en
Priority to CN202080095684.1A priority patent/CN115087519A/en
Priority to PCT/KR2020/006076 priority patent/WO2021157781A1/en
Priority to US17/783,059 priority patent/US20230040654A1/en
Priority to JP2022535856A priority patent/JP2023506029A/en
Publication of KR20210099808A publication Critical patent/KR20210099808A/en
Application granted granted Critical
Publication of KR102305796B1 publication Critical patent/KR102305796B1/en
Publication of KR102305796B9 publication Critical patent/KR102305796B9/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B24D11/001—Manufacture of flexible abrasive materials
    • B24D11/003—Manufacture of flexible abrasive materials without embedded abrasive particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
    • B24D18/0027—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for by impregnation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1020200013622A 2020-02-05 2020-02-05 Wafer polishing pad, apparatus and manufacturing method thereof KR102305796B1 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
KR1020200013622A KR102305796B1 (en) 2020-02-05 2020-02-05 Wafer polishing pad, apparatus and manufacturing method thereof
CN202080095684.1A CN115087519A (en) 2020-02-05 2020-05-08 Polishing pad for wafer polishing device, and apparatus and method for manufacturing the same
PCT/KR2020/006076 WO2021157781A1 (en) 2020-02-05 2020-05-08 Polishing pad for wafer polishing device, and apparatus and method for manufacturing same
US17/783,059 US20230040654A1 (en) 2020-02-05 2020-05-08 Polishing pad for wafer polishing device, and apparatus and method for manufacturing same
JP2022535856A JP2023506029A (en) 2020-02-05 2020-05-08 Polishing Pad for Wafer Polishing Machine and its Manufacturing Apparatus and Manufacturing Method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020200013622A KR102305796B1 (en) 2020-02-05 2020-02-05 Wafer polishing pad, apparatus and manufacturing method thereof

Publications (3)

Publication Number Publication Date
KR20210099808A KR20210099808A (en) 2021-08-13
KR102305796B1 KR102305796B1 (en) 2021-09-28
KR102305796B9 true KR102305796B9 (en) 2022-01-17

Family

ID=77200097

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020200013622A KR102305796B1 (en) 2020-02-05 2020-02-05 Wafer polishing pad, apparatus and manufacturing method thereof

Country Status (5)

Country Link
US (1) US20230040654A1 (en)
JP (1) JP2023506029A (en)
KR (1) KR102305796B1 (en)
CN (1) CN115087519A (en)
WO (1) WO2021157781A1 (en)

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4511605A (en) * 1980-09-18 1985-04-16 Norwood Industries, Inc. Process for producing polishing pads comprising a fully impregnated non-woven batt
JPH074769B2 (en) * 1991-10-11 1995-01-25 ロデール・ニッタ株式会社 Polishing cloth
JPH10249737A (en) * 1997-03-14 1998-09-22 Nikon Corp Polishing pad of substrate for magnetic recording medium and polishing method
JP2001001270A (en) * 1999-06-17 2001-01-09 Sumitomo Osaka Cement Co Ltd Polishing pad
JP4754921B2 (en) * 2005-09-30 2011-08-24 富士紡ホールディングス株式会社 Polishing cloth
JP2008155358A (en) * 2006-11-30 2008-07-10 Toray Ind Inc Abrasive cloth for glass texture and manufacturing method thereof
JP5061694B2 (en) * 2007-04-05 2012-10-31 信越半導体株式会社 Polishing pad manufacturing method, polishing pad, and wafer polishing method
JP2012056032A (en) * 2010-09-09 2012-03-22 Fujibo Holdings Inc Foamed sheet material
WO2012117789A1 (en) * 2011-02-28 2012-09-07 東レコーテックス株式会社 Polishing pad
JP2012223875A (en) * 2011-04-22 2012-11-15 Toray Coatex Co Ltd Polishing pad
JP2014193518A (en) * 2013-02-26 2014-10-09 Crystal Kogaku:Kk Abrasive pad production method
JP2015096286A (en) * 2013-11-15 2015-05-21 株式会社ツールバンク Polishing pad
JP6654357B2 (en) * 2015-04-02 2020-02-26 富士紡ホールディングス株式会社 Polishing pad, method for manufacturing polishing pad and polishing method
JP2017136662A (en) * 2016-02-03 2017-08-10 株式会社クリスタル光学 Abrasive pad
JP2018122427A (en) * 2017-02-03 2018-08-09 学校法人立命館 Method for producing polishing pad
KR101986110B1 (en) * 2017-07-24 2019-09-03 주식회사 덕성 Polishing pad for curved window glass and manufacturing method thereof
JP6951895B2 (en) * 2017-07-25 2021-10-20 ニッタ・デュポン株式会社 Abrasive cloth

Also Published As

Publication number Publication date
KR20210099808A (en) 2021-08-13
WO2021157781A1 (en) 2021-08-12
US20230040654A1 (en) 2023-02-09
CN115087519A (en) 2022-09-20
KR102305796B1 (en) 2021-09-28
JP2023506029A (en) 2023-02-14

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Legal Events

Date Code Title Description
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
G170 Re-publication after modification of scope of protection [patent]