SG10202007379PA - Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device - Google Patents

Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device

Info

Publication number
SG10202007379PA
SG10202007379PA SG10202007379PA SG10202007379PA SG10202007379PA SG 10202007379P A SG10202007379P A SG 10202007379PA SG 10202007379P A SG10202007379P A SG 10202007379PA SG 10202007379P A SG10202007379P A SG 10202007379PA SG 10202007379P A SG10202007379P A SG 10202007379PA
Authority
SG
Singapore
Prior art keywords
semiconductor device
processing apparatus
manufacturing semiconductor
substrate
substrate processing
Prior art date
Application number
SG10202007379PA
Inventor
Kenichi Suzaki
Original Assignee
Kokusai Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kokusai Electric Corp filed Critical Kokusai Electric Corp
Publication of SG10202007379PA publication Critical patent/SG10202007379PA/en

Links

SG10202007379PA 2019-07-31 2020-08-03 Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device SG10202007379PA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019140606 2019-07-31
JP2020125259A JP7016920B2 (en) 2019-07-31 2020-07-22 Substrate processing equipment, substrate support, semiconductor device manufacturing method and substrate processing method

Publications (1)

Publication Number Publication Date
SG10202007379PA true SG10202007379PA (en) 2021-02-25

Family

ID=74662514

Family Applications (1)

Application Number Title Priority Date Filing Date
SG10202007379PA SG10202007379PA (en) 2019-07-31 2020-08-03 Substrate processing apparatus, substrate support, and method of manufacturing semiconductor device

Country Status (3)

Country Link
JP (1) JP7016920B2 (en)
SG (1) SG10202007379PA (en)
TW (1) TWI817029B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20240037956A (en) * 2021-08-25 2024-03-22 가부시키가이샤 코쿠사이 엘렉트릭 Manufacturing method of substrate support, substrate processing device, and semiconductor device

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL8303602A (en) * 1983-10-19 1985-05-17 Johannes Hendrikus Leonardus H PLASMA-STIMULATED CHEMICAL VAPOR DEVICE, IN PARTICULAR A SUBSTRATE SUPPORT AND ELECTRODE ARRANGEMENT FOR IT AND ITS COMPONENTS.
JP3503710B2 (en) * 1994-06-28 2004-03-08 東京エレクトロン株式会社 Mounting jig for heat treatment of semiconductor wafer and heat treatment apparatus
TW502299B (en) * 2000-09-20 2002-09-11 Tokyo Electron Ltd Vertical heat-processing apparatus and fastening member used in the same
JP2002324830A (en) * 2001-02-20 2002-11-08 Mitsubishi Electric Corp Holding tool for substrate heat treatment, substrate heat treating equipment method for manufacturing semiconductor device, method for manufacturing the holding tool for substrate heat treatment and method for deciding structure of the holding tool for substrate heat treatment
JP6038043B2 (en) * 2011-11-21 2016-12-07 株式会社日立国際電気 Substrate processing apparatus, semiconductor device manufacturing method, and program
JP6523119B2 (en) * 2015-09-28 2019-05-29 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ Semiconductor device manufacturing method, substrate processing apparatus and program

Also Published As

Publication number Publication date
TW202121534A (en) 2021-06-01
TWI817029B (en) 2023-10-01
JP7016920B2 (en) 2022-02-07
JP2021027342A (en) 2021-02-22

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