JP2017136662A

JP2017136662A - Abrasive pad

Info

Publication number: JP2017136662A
Application number: JP2016018912A
Authority: JP
Inventors: 谷　泰弘; Yasuhiro Tani; 泰弘谷; 宙治桐野; Chuji Kirino; 信幸野村; Nobuyuki Nomura
Original assignee: KOKONOE DENKI KK; Ritsumeikan Trust; Crystal Optics Inc
Current assignee: KOKONOE DENKI KK; Ritsumeikan Trust; Crystal Optics Inc
Priority date: 2016-02-03
Filing date: 2016-02-03
Publication date: 2017-08-10

Abstract

PROBLEM TO BE SOLVED: To provide an abrasive pad capable of improving abrasive characteristic by generating irregularities patchily on the surface, while being pore-less.SOLUTION: There is provided a pore-less abrasive pad for abrading an abrading object, while supplying polishing slurry in which abrasive grains are dispersed between itself and the abrading object. The abrasive pad 1 has a sea-island structure constituted of a sea part and an island part having each different abrasion resistance.SELECTED DRAWING: Figure 1

Description

本発明は、被研磨物との間に、砥粒が分散された研磨スラリーを供給しながら被研磨物を研磨するための研磨パッドに関する。 The present invention relates to a polishing pad for polishing an object to be polished while supplying a polishing slurry in which abrasive grains are dispersed with the object to be polished.

従来、レンズ、半導体デバイス用シリコンウエハ、液晶ディスプレイ用ガラス基板、ハードディスク用ガラス基板、アルミ基板等の高度な平滑度及び平坦度が要求される被研磨物では、研磨パッドを用いた研磨加工が行われている。 Conventionally, polishing work using a polishing pad is performed on objects to be polished that require high smoothness and flatness, such as lenses, silicon wafers for semiconductor devices, glass substrates for liquid crystal displays, glass substrates for hard disks, and aluminum substrates. It has been broken.

これらの研磨加工を行うために用いる研磨パッドとしては、例えば、多数の気孔を有するウレタン樹脂製の多孔質の研磨パッド、繊維を絡合して構成した不織布の繊維基材にポリウレタン樹脂を含浸して硬化させたウレタン含浸不織布タイプの研磨パッド（例えば、特許文献１参照）、繊維により構成される不織布や樹脂フィルムからなる基材上にウレタン樹脂溶液を塗布し、これを凝固処理して多数の気泡を有する多孔質の銀面層を形成し、該銀面層の表面を研削して多孔質の研磨層であるナップ層を形成したスエードタイプの研磨パッド（例えば、特許文献２参照）等がこれまで用いられている。被研磨物の表面の研磨を行う際には、例えば、これらの研磨パッドを回転可能な研磨定盤の上に貼り付け、該研磨パッドに研磨ヘッドに保持された被研磨物を押し当てた状態で、研磨パッド上に研磨材である砥粒が分散された研磨スラリーを供給しながら、研磨定盤及び研磨ヘッドを相対的に回転させることにより研磨を行う。 As a polishing pad used for performing these polishing processes, for example, a porous polishing pad made of urethane resin having a large number of pores, a nonwoven fabric fiber base material formed by entanglement of fibers with a polyurethane resin is impregnated. A urethane-impregnated non-woven fabric type polishing pad (for example, see Patent Document 1), a urethane resin solution is applied onto a base material composed of a non-woven fabric or a resin film composed of fibers, and this is subjected to a solidification treatment. A suede-type polishing pad (for example, see Patent Document 2) in which a porous silver surface layer having bubbles is formed and the surface of the silver surface layer is ground to form a nap layer that is a porous polishing layer. It has been used so far. When polishing the surface of the object to be polished, for example, these polishing pads are stuck on a rotatable polishing surface plate and the object to be polished held by the polishing head is pressed against the polishing pad. Thus, polishing is performed by relatively rotating the polishing platen and the polishing head while supplying the polishing slurry in which the abrasive grains, which are abrasives, are dispersed on the polishing pad.

しかしながら、特許文献１のように不織布の繊維基材にポリウレタン樹脂を含浸して硬化させた不織布タイプの研磨パッドや特許文献２のように繊維基材上にウレタン樹脂で形成されるナップ層を設けたスエードタイプの研磨パッド等の従来の研磨パッドは、被研磨物との真実接触面積が狭く必ずしも研磨能率が高いとはいえなかった。 However, a non-woven fabric type polishing pad in which a non-woven fiber base material is impregnated with polyurethane resin and cured as in Patent Document 1 and a nap layer formed of urethane resin on a fiber base material as in Patent Document 2 are provided. The conventional polishing pad such as a suede type polishing pad has a narrow real contact area with an object to be polished and does not necessarily have a high polishing efficiency.

そこで、本発明者らは、研磨加工を行う際に使用する研磨材（砥粒）に対する滞留性を改善することにより研磨能率を向上させるために、エポキシ樹脂やポリイミド樹脂、又はそれらにウレタン樹脂を混合させた混合物で形成される多孔質の研磨パッドを発明した（例えば、特許文献３〜５参照）。 Therefore, the present inventors have added an epoxy resin, a polyimide resin, or a urethane resin to improve the retention efficiency with respect to the abrasive (abrasive grains) used when performing polishing. A porous polishing pad formed of a mixed mixture has been invented (see, for example, Patent Documents 3 to 5).

特開平１０−２４９７３７号公報Japanese Patent Laid-Open No. 10-249737 特開２０１０−１４９２５９号公報JP 2010-149259 A 特開２０１２−０８１５６５号公報JP 2012-081565 A 特開２０１２−１３９７３５号公報JP 2012-139735 A 特開２０１４−０８３６１７号公報Japanese Patent Application Laid-Open No. 2014-083617

しかしながら、従来の多孔質の研磨パッド等では、エポキシ樹脂等の主剤に対して１種類の硬化剤を用いているので、硬化速度に差が生じないため、でき上がった成形体の表面は、耐摩耗性が均一で凹凸がない平らなものになっていた。また、研磨材の滞留性を高めるために気孔が設けられていたが、この気孔が凝集粒子の発生でスクラッチの原因となるとともに、真実接触面積を減らし研磨能率を低下させる原因となっていた。事実、エポキシパッドでは気孔率を高めれば高めるほど、研磨能率が低下するという現象が生じていた。一方、無気孔の研磨パッドは表面に全く凹凸がないため、砥粒が加工域（被研磨物の下部）に侵入しにくく、研磨能率が向上しないという問題点を持っていた。 However, in the conventional porous polishing pad and the like, since one kind of curing agent is used for the main agent such as epoxy resin, there is no difference in curing speed. It was flat with no irregularities and unevenness. In addition, pores were provided in order to improve the retention of the abrasive, but these pores caused scratches due to the generation of aggregated particles, and also reduced the true contact area and reduced the polishing efficiency. In fact, the epoxy pad has a phenomenon that the polishing efficiency decreases as the porosity increases. On the other hand, since the non-porous polishing pad has no irregularities on its surface, it has a problem that the abrasive grains do not easily enter the processing area (below the object to be polished) and the polishing efficiency is not improved.

本発明は、上記のような課題に鑑みてなされたものであって、無気孔でありながら表面に斑状に凹凸を生じさせることによって、研磨特性を向上させることができる研磨パッドを提供することを目的とする。 The present invention has been made in view of the problems as described above, and provides a polishing pad capable of improving polishing characteristics by generating irregularities on the surface while being non-porous. Objective.

上記目的を達成するために、本発明に係る研磨パッドは、被研磨物との間に、砥粒が分散された研磨スラリーを供給しながら前記被研磨物を研磨するための無気孔の研磨パッドであって、耐摩耗性がそれぞれ異なる海部と島部とによって構成される海島構造を有していることを特徴としている。 In order to achieve the above object, a polishing pad according to the present invention is a non-porous polishing pad for polishing the object to be polished while supplying a polishing slurry in which abrasive grains are dispersed to the object to be polished. And it has the sea island structure comprised by the sea part and island part from which abrasion resistance differs, respectively.

また、本発明に係る研磨パッドは、熱硬化性樹脂の主剤と硬化速度の異なる２種類以上の硬化剤、又は、異なる２種類以上の熱硬化性樹脂の主剤と１種類以上の硬化剤を含有していることを特徴としている。 Further, the polishing pad according to the present invention contains two or more kinds of curing agents having different curing rates from the main ingredient of the thermosetting resin, or two or more different kinds of main ingredients of the thermosetting resin and one or more kinds of curing agents. It is characterized by that.

また、本発明に係る研磨パッドは、前記硬化速度の異なる２種類以上の硬化剤が、それぞれ単独で使用した場合の硬化温度での硬化時間が２０分以上離れていることを特徴としている。 In addition, the polishing pad according to the present invention is characterized in that the curing time at the curing temperature when the two or more kinds of curing agents having different curing rates are used alone is separated by 20 minutes or more.

また、本発明に係る研磨パッドは、前記熱硬化性樹脂の主剤が、エポキシ樹脂であり、前記２種類以上の硬化剤は、アミン価４００〜７００ｍｍｏｌ／ｇであるポリアミノアミド系硬化剤又は平均分子量が１００〜３００のアミン系硬化剤と、平均分子量が１５００〜２５００のアミン系硬化剤とを含むことを特徴としている。 In the polishing pad according to the present invention, the main component of the thermosetting resin is an epoxy resin, and the two or more types of curing agents are polyaminoamide type curing agents having an amine value of 400 to 700 mmol / g or an average molecular weight. Includes an amine curing agent having a molecular weight of 1500 to 2500 and an amine curing agent having a molecular weight of 1500 to 2500.

また、本発明に係る研磨パッドは、前記２種類以上の熱硬化性樹脂の主剤が、親水性樹脂と、疎水性樹脂とを含むことを特徴としている。 The polishing pad according to the present invention is characterized in that the main component of the two or more types of thermosetting resins contains a hydrophilic resin and a hydrophobic resin.

また、本発明に係る研磨パッドは、前記親水性樹脂が、エポキシ樹脂、ポリアミド樹脂、ポリイミド樹脂のいずれかであり、前記疎水性樹脂は、ウレタン樹脂又はアクリル樹脂であることを特徴としている。 In the polishing pad according to the present invention, the hydrophilic resin is any one of an epoxy resin, a polyamide resin, and a polyimide resin, and the hydrophobic resin is a urethane resin or an acrylic resin.

本発明に係る研磨パッドによれば、耐摩耗性がそれぞれ異なる海部と島部とによって構成される海島構造を有しているので、研磨加工が行われることで、耐摩耗性が低い部分が摩耗して凹部になることによって表面に斑状に凹凸が生じることにより、研磨特性を向上させることができる。 The polishing pad according to the present invention has a sea-island structure composed of a sea part and an island part having different wear resistances, so that a part with low wear resistance is worn by polishing. By forming concave portions on the surface, unevenness is generated on the surface, so that polishing characteristics can be improved.

また、本発明に係る研磨パッドによれば、熱硬化性樹脂の主剤に対して硬化速度の異なる２種類以上の硬化剤を含有させているので、硬化速度の最も速い硬化剤が最初に硬化することで、表面に耐摩耗性の低い島状の領域である島部が複数形成され、その後に、他の硬化剤が耐摩耗性の低い島部の間を埋めるように硬化して海部が形成されることで、表面に複数の耐摩耗性の低い凹状の島部と、複数の耐摩耗性の低い島部の間に当該島部よりも高く形成され、且つ、島部よりも耐摩耗性の高い海部とによって斑状に凹凸を有する海島構造が形成されることにより、研磨特性を向上させることができる。 Moreover, according to the polishing pad according to the present invention, since two or more kinds of curing agents having different curing rates are contained in the main component of the thermosetting resin, the curing agent having the fastest curing rate is cured first. As a result, a plurality of islands, which are island-like regions with low wear resistance, are formed on the surface, and then other curing agents are cured so as to fill the gaps between the islands with low wear resistance to form the sea part. As a result, the surface is formed between a plurality of low-wear-resistant concave island portions and a plurality of low-wear-resistant island portions higher than the island portion, and more wear-resistant than the island portions. By forming a sea-island structure having irregularities in a patchy shape with a high sea part, the polishing characteristics can be improved.

また、本発明に係る研磨パッドによれば、２種類以上の硬化剤は、それぞれ単独で使用した場合の硬化温度での硬化時間が２０分以上離れているので、表面により確実に凹凸を生じさせることができ、研磨特性をより効率的に向上させることができる。 In addition, according to the polishing pad of the present invention, the two or more kinds of curing agents are more reliably uneven on the surface because the curing time at the curing temperature when used alone is 20 minutes or more apart. And the polishing characteristics can be improved more efficiently.

また、本発明に係る研磨パッドによれば、熱硬化性樹脂の主剤は、エポキシ樹脂であるので、砥粒に対する保持力を高めることにより研磨能率を向上させることができる。また、硬化速度の異なる２種類以上の硬化剤は、アミン価４００〜７００ｍｍｏｌ／ｇであるポリアミノアミド系硬化剤又は平均分子量が１００〜３００のアミン系硬化剤と、平均分子量が１５００〜２５００のアミン系硬化剤とを含んでいるので、硬化速度の差を利用して表面に確実に凹凸を生じさせることができ、研磨特性をより向上させることができる。 Further, according to the polishing pad of the present invention, since the main component of the thermosetting resin is an epoxy resin, it is possible to improve the polishing efficiency by increasing the holding power against the abrasive grains. Further, two or more kinds of curing agents having different curing speeds include a polyaminoamide curing agent having an amine value of 400 to 700 mmol / g, an amine curing agent having an average molecular weight of 100 to 300, and an amine having an average molecular weight of 1500 to 2500. Since it contains a system curing agent, unevenness can be reliably generated on the surface by utilizing the difference in curing speed, and the polishing characteristics can be further improved.

また、本発明に係る研磨パッドによれば、２種類以上の熱硬化性樹脂に主剤は、親水性樹脂と、疎水性樹脂とを含んでいるので、砥粒に対する保持性が高い親水性樹脂が表面に露出することより、研磨パッド上の砥粒が保持されるため、被研磨物の研磨に有効に作用し、研磨特性を向上させることができる。また、本発明の研磨パッドでは、表面に形成される凹み部分に砥粒に対する保持性が低い疎水性樹脂が位置するので、凹みに入り込んだ砥粒は、研磨加工の際の動圧作用により生じるポンピング作用（掃き出し作用）によって凹みから容易に排出され、砥粒に対する保持性が高い親水性樹脂によって保持されるため、被研磨物の研磨に有効に作用し、研磨特性を向上させることができる。 Moreover, according to the polishing pad according to the present invention, since the main agent contains a hydrophilic resin and a hydrophobic resin in two or more types of thermosetting resins, a hydrophilic resin having a high retention property against abrasive grains is used. Since the abrasive grains on the polishing pad are held by being exposed to the surface, it effectively acts on the polishing of the object to be polished, and the polishing characteristics can be improved. Further, in the polishing pad of the present invention, since the hydrophobic resin having low retainability with respect to the abrasive grains is located in the recessed portion formed on the surface, the abrasive grains that have entered the recess are generated by the dynamic pressure action during the polishing process. Since it is easily discharged from the dent by the pumping action (sweeping action) and is retained by the hydrophilic resin having a high retainability with respect to the abrasive grains, it acts effectively on the polishing of the object to be polished, and the polishing characteristics can be improved.

また、本発明に係る研磨パッドによれば、親水性樹脂は、エポキシ樹脂、ポリアミド樹脂、ポリイミド樹脂のいずれかであり、疎水性樹脂は、ウレタン樹脂又はアクリル樹脂であるので、表面に形成される凹み部分に砥粒に対する保持性が低いウレタン樹脂又はアクリル樹脂が位置するため、凹みに入り込んだ砥粒は、研磨加工の際の動圧作用により生じるポンピング作用（掃き出し作用）によって凹みから容易に排出され、砥粒に対する保持性が高いエポキシ樹脂、ポリアミド樹脂、ポリイミド樹脂のいずれかによって保持されることで、被研磨物の研磨に有効に作用し、研磨特性をより向上させることができる。 Further, according to the polishing pad of the present invention, the hydrophilic resin is any one of an epoxy resin, a polyamide resin, and a polyimide resin, and the hydrophobic resin is a urethane resin or an acrylic resin, and thus is formed on the surface. Since urethane resin or acrylic resin, which has low retention of abrasive grains, is located in the recess, abrasive particles that enter the recess are easily discharged from the recess by the pumping action (sweeping action) generated by the dynamic pressure action during polishing. By being held by any one of an epoxy resin, a polyamide resin, and a polyimide resin having a high retention property against abrasive grains, it effectively acts on polishing of an object to be polished, and the polishing characteristics can be further improved.

本発明の実施形態に係る研磨パッドの一例を示す概略斜視図である。It is a schematic perspective view which shows an example of the polishing pad which concerns on embodiment of this invention. 本発明の実施形態に係る研磨パッドの表面の一部を模式的に示す拡大平面図である。It is an enlarged plan view showing typically a part of the surface of the polishing pad concerning the embodiment of the present invention. 本発明の実施形態に係る研磨パッドの製造方法の一例を示す製造工程図である。It is a manufacturing process figure which shows an example of the manufacturing method of the polishing pad which concerns on embodiment of this invention. 本発明の実施形態に係る研磨パッドの製造方法の他の一例を示す製造工程図である。It is a manufacturing process figure which shows another example of the manufacturing method of the polishing pad which concerns on embodiment of this invention. 本発明の他の実施形態に係る研磨パッドの一部を模式的に示す拡大側面断面図である。It is an expanded side sectional view showing typically a part of polishing pad concerning other embodiments of the present invention. 本発明に係る研磨パッドによる研磨特性の比較を示すグラフである。It is a graph which shows the comparison of the grinding | polishing characteristic by the polishing pad which concerns on this invention. 実施例１及び実施例２の研磨パッドの表面の走査型電子顕微鏡画像である。3 is a scanning electron microscope image of the surface of the polishing pad of Example 1 and Example 2. FIG.

以下、本発明に係る研磨パッドの実施形態について、図面を参照しつつ説明する。本発明に係る研磨パッド１は、例えば、回転可能な研磨定盤上に貼り付けて、研磨材（砥粒）が分散された研磨スラリーを供給しながら、研磨定盤及び被研磨物が保持されている研磨ヘッドを相対的に回転させることにより研磨を行うための無気孔の研磨パッドであって、図２に示すように、耐摩耗性がそれぞれ異なる海部３と島部４とによって構成される海島構造を有している。 Hereinafter, embodiments of a polishing pad according to the present invention will be described with reference to the drawings. The polishing pad 1 according to the present invention is, for example, affixed on a rotatable polishing platen and holds the polishing platen and the object to be polished while supplying a polishing slurry in which abrasives (abrasive grains) are dispersed. 2 is a non-porous polishing pad for performing polishing by relatively rotating a polishing head, and includes a sea part 3 and an island part 4 having different wear resistances as shown in FIG. It has a sea-island structure.

本発明の実施形態に係る研磨パッド１は、例えば、図１に示すように、熱硬化
性樹脂の主剤と、硬化速度の異なる２種類以上の硬化剤とを含有する薄形円柱状の基材２により構成されるものである。この研磨パッド１の基材２の表面２１は、図２に示すように、凹んで形成される耐摩耗性の低い複数の島部３と、複数の島部３の間に島部３よりも高く形成され、且つ、島部３よりも耐摩耗性の高い海部４とを有している。尚、図２は、図１の二点鎖線で囲ったＡ部を模式的に示す拡大平面図である。 A polishing pad 1 according to an embodiment of the present invention is, for example, as shown in FIG. 1, a thin cylindrical base material containing a main component of a thermosetting resin and two or more types of curing agents having different curing rates. 2. As shown in FIG. 2, the surface 21 of the base material 2 of the polishing pad 1 has a plurality of island portions 3 having a low wear resistance and formed between the plurality of island portions 3. It has a sea part 4 which is formed higher and has higher wear resistance than the island part 3. FIG. 2 is an enlarged plan view schematically showing an A portion surrounded by a two-dot chain line in FIG.

複数の島部３及び海部４は、図２に示すように、基材２の表面２１に斑状に形成されている。このような島部３及び海部４によって形成される表面２１の凹凸の平均間隔ＲＳｍとしては、研磨加工を行う際に使用される研磨スラリーに分散されている砥粒径の２０〜５０倍程度であることが好ましく、例えば、ＲＳｍは２０μｍ以上１００μｍ以下であることが好ましい。尚、ＲＳｍの値は、特に限定されるものではなく、使用される砥粒の大きさや研磨条件に応じて、表面２１にドレッシング等を施すことによってＲＳｍの値を適宜設定するようにしても良い。すなわち、島部３が２０〜１００μｍの間隔で存在することで、砥粒が適度に間隔をあけ存在し、効果的に研磨に作用する。 The plurality of island portions 3 and sea portions 4 are formed in spots on the surface 21 of the base material 2 as shown in FIG. The average interval RSm of the unevenness of the surface 21 formed by the island part 3 and the sea part 4 is about 20 to 50 times the abrasive particle size dispersed in the polishing slurry used when polishing. For example, the RSm is preferably 20 μm or more and 100 μm or less. Note that the value of RSm is not particularly limited, and the value of RSm may be appropriately set by performing dressing or the like on the surface 21 according to the size of the abrasive grains used or the polishing conditions. . That is, since the island portions 3 are present at intervals of 20 to 100 μm, the abrasive grains are present at an appropriate interval and effectively act on polishing.

このような研磨パッド１では、熱硬化性樹脂の主剤として、例えば、エポキシ樹脂を好適に用いることができる。このエポキシ樹脂の主剤としては、例えば、エポキシ当量が２３０〜２７０（ｇ／ｅｑ）、分子量が約４７０である基本液状タイプのＪＥＲ８３４（三菱化学社製）等を好適に用いることができる。 In such a polishing pad 1, for example, an epoxy resin can be suitably used as the main component of the thermosetting resin. As the main component of this epoxy resin, for example, a basic liquid type JER834 (manufactured by Mitsubishi Chemical Corporation) having an epoxy equivalent of 230 to 270 (g / eq) and a molecular weight of about 470 can be suitably used.

エポキシ樹脂の主剤に対する硬化速度の異なる２種類以上の硬化剤のうち硬化速度が最も速く（硬化時間が短く）分子量の小さい第１硬化剤には、例えば、アミン価４００〜７００ｍｍｏｌ／ｇであるポリアミノアミド系硬化剤又は平均分子量が１００〜３００のアミン系硬化剤等を用いることが好ましい。このような第１硬化剤であるポリアミノアミド系硬化剤としては、例えば、親水性の高いトーマイド２４５−Ｓ（富士化成工業社製）等を好適に用いることができる。また、第１硬化剤であるアミン系硬化剤としては、例えば、ジェファーミンＤ２３０（ハンツマン社製）等を好適に用いることができる。 Among the two or more types of curing agents having different curing rates with respect to the main component of the epoxy resin, the first curing agent having the fastest curing rate (short curing time) and a low molecular weight is, for example, a polyamino having an amine value of 400 to 700 mmol / g. It is preferable to use an amide curing agent or an amine curing agent having an average molecular weight of 100 to 300. As such a polyaminoamide type curing agent as the first curing agent, for example, highly hydrophilic tomide 245-S (manufactured by Fuji Kasei Kogyo Co., Ltd.) can be preferably used. Moreover, as an amine type hardening | curing agent which is a 1st hardening | curing agent, Jeffamine D230 (made by Huntsman) etc. can be used suitably, for example.

また、第１硬化剤よりも硬化速度が遅く（硬化時間が長く）分子量の大きい第２硬化剤としては、例えば、平均分子量が１５００〜２５００のアミン系硬化剤等を用いることが好ましい。このような第２硬化剤であるアミン系硬化剤としては、例えば、ジェファーミンＤ２０００（ハンツマン社製）等を好適に用いることができる。第１硬化剤と第２硬化剤の配合比としては、２：８〜８：２の範囲内であることが好ましい。尚、エポキシ樹脂の主剤に添加する第１硬化剤及び第２硬化剤は、これらに限定されるものではなく、それぞれ硬化速度が異なるものであれば良く、例えば、それぞれ単独で使用した場合の硬化温度での硬化時間が２０分以上離れているものを用いることが好ましい。また、ここでは、硬化速度の異なる２種類の硬化剤を用いる例を示しているが、硬化剤は２種類に限定されるものではなく、第１硬化剤よりも硬化速度が遅い複数の異なる第２硬化剤を配合するようにしても良い。 In addition, as the second curing agent having a slower curing speed (longer curing time) and a higher molecular weight than the first curing agent, for example, an amine curing agent having an average molecular weight of 1500 to 2500 is preferably used. For example, Jeffamine D2000 (manufactured by Huntsman) or the like can be suitably used as the amine-based curing agent that is such a second curing agent. The mixing ratio of the first curing agent and the second curing agent is preferably in the range of 2: 8 to 8: 2. In addition, the 1st hardening | curing agent and 2nd hardening | curing agent which are added to the main ingredient of an epoxy resin are not limited to these, What is necessary is just a thing with a different hardening rate, respectively, for example, hardening when each is used independently It is preferable to use one having a curing time at a temperature of 20 minutes or more. Also, here, an example is shown in which two types of curing agents having different curing rates are used, but the number of curing agents is not limited to two, and a plurality of different types of curing agents having a curing rate slower than that of the first curing agent. You may make it mix | blend 2 hardening | curing agents.

次に、このような研磨パッド１の製造方法の一例について図３を参照しつつ説明する。研磨パッド１の製造方法では、例えば、図３に示すように、エポキシ樹脂等の熱硬化性樹脂の主剤を加熱する第１加熱工程と、加熱された主剤に対して第１硬化剤及び第２硬化剤の各硬化剤を添加する硬化剤添加工程と、主剤と各硬化剤を撹拌し、脱泡する撹拌・脱泡工程と、撹拌及び脱泡が行われた後の主剤と各硬化剤の混合物を加熱する第２加熱工程とを経て無気孔の研磨パッド１が作製される。 Next, an example of a method for manufacturing such a polishing pad 1 will be described with reference to FIG. In the manufacturing method of the polishing pad 1, for example, as shown in FIG. 3, a first heating step of heating a main component of a thermosetting resin such as an epoxy resin, and a first curing agent and a second curing agent with respect to the heated main component. Curing agent addition step of adding each curing agent of the curing agent, stirring and defoaming step of stirring and defoaming the main agent and each curing agent, and the main agent and each curing agent after stirring and defoaming Through the second heating step of heating the mixture, the non-porous polishing pad 1 is produced.

第１加熱工程では、熱硬化性樹脂の主剤を所定温度（例えば、１５０℃）で所定時間（例えば、約１０分）加熱する。次に、硬化剤添加工程では、第１加熱工程で加熱された熱硬化性樹脂の主剤に対して、所定の配合比で第１硬化剤及び第２硬化剤を添加する。そして、撹拌・脱泡工程では、第１硬化剤及び第２硬化剤が添加された主剤に対して撹拌脱泡機等を用いて、撹拌と同時又は撹拌した後に脱泡処理を行う。 In the first heating step, the main component of the thermosetting resin is heated at a predetermined temperature (for example, 150 ° C.) for a predetermined time (for example, about 10 minutes). Next, in the curing agent addition step, the first curing agent and the second curing agent are added at a predetermined blending ratio with respect to the main component of the thermosetting resin heated in the first heating step. In the stirring / defoaming step, a defoaming process is performed simultaneously with stirring or after stirring using a stirring defoamer or the like for the main agent to which the first curing agent and the second curing agent are added.

第２加熱工程では、撹拌・脱泡工程で撹拌及び脱泡が行われた後の主剤と各硬化剤の混合物を金型に注型し、所定温度（例えば、１５０℃）で所定時間（例えば、約３時間）加熱して硬化させることにより研磨パッド１を作製する。この第２加熱工程では、硬化速度が速く分子量の小さい第１硬化剤が先に硬化することで、表面に耐摩耗性の低い島状の領域である島部３が複数形成される。その後、第１硬化剤よりも硬化速度が遅く分子量の大きい第２硬化剤が耐摩耗性の低い島部３の間を埋めるように硬化することで、図２に示すように、表面２１に複数の耐摩耗性の低い島部３と、複数の耐摩耗性の低い島部３の間に当該島部３よりも高く形成され、且つ、島部３よりも耐摩耗性の高い海部４とによって構成される海島構造を有する無気孔の研磨パッド１が作製される。尚、必要に応じて、表面２１にドレッシング等を施すようにしても良い。また、直径５０ｍｍを超える大型の被研磨物に対して研磨加工を行う場合には、砥粒の侵入及び研磨屑の排出のために研磨パッド１の表面に溝加工を施しておくことが有効である。また、第１加熱工程及び第２加熱工程での加熱温度及び加熱時間は、それぞれ使用される主剤や各硬化剤の種類や量等に応じて、適宜設定すれば良く、特に限定されるものではない。また、研磨パッド１では、製造工程において、数％以下の気孔が自然に含まれてしまう場合もあるが、このような研磨パッド１も本発明の技術的範囲に含まれるものである。 In the second heating step, the mixture of the main agent and each curing agent after stirring and defoaming in the stirring and defoaming step is poured into a mold, and at a predetermined temperature (for example, 150 ° C.) for a predetermined time (for example, , About 3 hours) The polishing pad 1 is prepared by heating and curing. In this second heating step, the first curing agent having a high curing speed and a low molecular weight is cured first, whereby a plurality of island portions 3 that are island-like regions having low wear resistance are formed on the surface. Thereafter, the second curing agent having a slower curing speed than the first curing agent and having a large molecular weight is cured so as to fill the gaps between the island portions 3 having low wear resistance. Between the island portion 3 having low wear resistance and the sea portion 4 formed higher than the island portion 3 between the plurality of island portions 3 having low wear resistance and having higher wear resistance than the island portion 3. A non-porous polishing pad 1 having a structured sea-island structure is produced. In addition, you may make it give the dressing etc. to the surface 21 as needed. In addition, when polishing a large workpiece having a diameter of more than 50 mm, it is effective to provide a groove on the surface of the polishing pad 1 in order to intrude abrasive grains and discharge polishing scraps. is there. Further, the heating temperature and heating time in the first heating step and the second heating step may be appropriately set according to the type and amount of the main agent and each curing agent used, and are not particularly limited. Absent. Further, in the polishing pad 1, pores of several percent or less may naturally be included in the manufacturing process, but such a polishing pad 1 is also included in the technical scope of the present invention.

また、第１硬化剤の硬化速度と第２硬化剤の硬化速度との差が小さい場合には、例えば、図４に示すように、熱硬化性樹脂の主剤を所定温度で所定時間加熱した後、先に分子量の小さい第１硬化剤のみを添加する。そして、第１硬化剤のみが添加された主剤に対して撹拌脱泡機等を用いて、撹拌と同時又は撹拌した後に脱泡処理を行う。その後、撹拌及び脱泡が行われた後の主剤と第１硬化剤の混合物を所定温度で所定時間（例えば、約２分）加熱する。 Further, when the difference between the curing rate of the first curing agent and the curing rate of the second curing agent is small, for example, as shown in FIG. 4, after heating the main component of the thermosetting resin at a predetermined temperature for a predetermined time. First, only the first curing agent having a small molecular weight is added. And a defoaming process is performed after stirring simultaneously with stirring using a stirring defoaming machine etc. with respect to the main ingredient to which only the 1st hardening | curing agent was added. Thereafter, the mixture of the main agent and the first curing agent after stirring and defoaming is heated at a predetermined temperature for a predetermined time (for example, about 2 minutes).

次に、加熱された主剤及び第１硬化剤の混合物に対して第１硬化剤よりも分子量の大きい第２硬化剤を添加する。そして、この第２硬化剤が添加された主剤及び第１硬化剤の混合物を撹拌脱泡機等を用いて、撹拌と同時又は撹拌した後に脱泡処理を行う。その後、撹拌及び脱泡が行われた後の主剤と各硬化剤の混合物を金型に注型し、所定温度（例えば、１５０℃）で所定時間（例えば、約３時間）加熱して硬化させることにより研磨パッド１を作製する。このように第１硬化剤の硬化速度と第２硬化剤の硬化速度との差が小さい場合でも、主剤に対して第１硬化剤を先に添加させて、第１硬化剤による硬化の開始を第２硬化剤よりも相対的に早めることによって、研磨パッド１の表面２１に耐摩耗性の低い島部３と、耐摩耗性の高い海部４とを有する海島構造を生じさせることできる。その他、所定温度（例えば、１５０℃）における第１硬化剤と第２硬化剤の硬化時間の差が小さい場合（例えば、２０分未満の場合）には、上記の所定温度をそれぞれの硬化剤の種類等に応じて、例えば、１２０℃や１００℃に下げることによって第１硬化剤と第２硬化剤の硬化時間の差を調整することも可能である。 Next, a second curing agent having a molecular weight higher than that of the first curing agent is added to the heated mixture of the main agent and the first curing agent. Then, the mixture of the main agent and the first curing agent to which the second curing agent is added is subjected to a defoaming process using a stirring defoamer or the like at the same time as or after stirring. Thereafter, the mixture of the main agent and each curing agent after stirring and defoaming is poured into a mold and cured by heating at a predetermined temperature (for example, 150 ° C.) for a predetermined time (for example, about 3 hours). Thereby, the polishing pad 1 is produced. Thus, even when the difference between the curing rate of the first curing agent and the curing rate of the second curing agent is small, the first curing agent is added to the main agent first, and the curing by the first curing agent is started. By making it relatively earlier than the second curing agent, a sea-island structure having an island portion 3 with low wear resistance and a sea portion 4 with high wear resistance on the surface 21 of the polishing pad 1 can be produced. In addition, when the difference between the curing times of the first curing agent and the second curing agent at a predetermined temperature (for example, 150 ° C.) is small (for example, less than 20 minutes), the above predetermined temperature is set for each curing agent. Depending on the type and the like, for example, the difference in curing time between the first curing agent and the second curing agent can be adjusted by lowering the temperature to 120 ° C. or 100 ° C.

尚、本実施形態の研磨パッド１では、熱硬化性樹脂の主剤を１種類だけ用いた場合について説明しているが、熱硬化性樹脂の主剤を２種類以上用いて、耐摩耗性がそれぞれ異なる海部と島部とによって構成される海島構造を有する研磨パッド１ａを作製するようにしても良い。熱硬化性樹脂の主剤を２種類用いる場合の研磨パッド１ａでは、熱硬化性樹脂の主剤として、疎水性樹脂及び親水性樹脂の２種類を用いることが好ましい。疎水性樹脂としては、耐摩耗性の低いものを用いることが好ましく、例えば、ウレタン樹脂又はアクリル樹脂等を好適に用いることができる。親水性樹脂としては、耐摩耗性の高いものを用いることが好ましく、例えば、エポキシ樹脂、ポリアミド樹脂、ポリイミド樹脂等を好適に用いることができる。 In addition, in the polishing pad 1 of this embodiment, although the case where only one kind of main ingredient of a thermosetting resin was used is demonstrated, abrasion resistance differs by using two or more kinds of main ingredients of a thermosetting resin. You may make it produce the polishing pad 1a which has the sea island structure comprised by the sea part and an island part. In the polishing pad 1a in the case where two types of main components of the thermosetting resin are used, it is preferable to use two types of resins, a hydrophobic resin and a hydrophilic resin, as the main components of the thermosetting resin. As the hydrophobic resin, it is preferable to use a resin having low wear resistance. For example, a urethane resin or an acrylic resin can be suitably used. As the hydrophilic resin, one having high wear resistance is preferably used. For example, an epoxy resin, a polyamide resin, a polyimide resin, or the like can be suitably used.

研磨パッド１ａでは、例えば、熱硬化性樹脂の主剤に疎水性樹脂として耐摩耗性の低いウレタン樹脂及び親水性樹脂として耐摩耗性の高いエポキシ樹脂を用いて、硬化速度の異なる硬化剤としてウレタン樹脂の主剤に対しては硬化速度が速く分子量の小さい第１硬化剤を使用し、エポキシ樹脂の主剤に対しては硬化速度が遅く分子量の大きい第２硬化剤を使用した場合には、図５に示すように、ウレタン樹脂が先に硬化することで、耐摩耗性の低いウレタン樹脂の塊であるウレタン樹脂部５が複数形成され、その後、耐摩耗性の高いエポキシ樹脂部６が複数のウレタン樹脂部５の間を埋めるように硬化する。これにより、研磨パッド１ａは、図５に示すように、表面２１ａの島部３ａが砥粒保持性が低く耐摩耗性の低いウレタン樹脂部５によって形成され、島部３ａよりも高く形成され、且つ、島部３ａよりも砥粒保持性が高く耐摩耗性の高い海部４ａがエポキシ樹脂部６によって形成されることになる。 In the polishing pad 1a, for example, a urethane resin having a low wear resistance as a hydrophobic resin and a epoxy resin having a high wear resistance as a hydrophilic resin are used as a main component of a thermosetting resin, and a urethane resin as a curing agent having a different curing rate is used. When the first curing agent having a high curing speed and a small molecular weight is used for the main agent of FIG. 5 and the second curing agent having a slow curing speed and a large molecular weight is used for the main component of the epoxy resin, FIG. As shown, a plurality of urethane resin portions 5 that are a lump of urethane resin having low wear resistance are formed by curing the urethane resin first, and thereafter, the epoxy resin portion 6 having high wear resistance is a plurality of urethane resins. It hardens so as to fill the space between the parts 5. Thereby, as shown in FIG. 5, the polishing pad 1 a is formed by the urethane resin portion 5 having a low abrasive grain retention property and a low abrasion resistance, and the island portion 3 a of the surface 21 a is formed higher than the island portion 3 a. Moreover, the sea part 4 a having higher abrasive grain retention and higher wear resistance than the island part 3 a is formed by the epoxy resin part 6.

このような研磨パッド１ａでは、疎水性樹脂からなるウレタン樹脂部５によって凹状の島部３ａは形成されるので、被研磨物の研磨加工が行われる際に供給される研磨スラリーに分散されている砥粒が島部３ａの凹部内に入り込んだ場合、被研磨物と研磨パッド１ａの相対的な回転によって、動圧作用により、ポンピング作用（掃き出し作用）が生じ、凹部から砥粒が排出される。そして、凹部から排出された砥粒は、凹部のエッジ付近の砥粒に対する保持性が高い親水性樹脂からなるエポキシ樹脂で形成されている海部４ａで保持される。従って、凹部のエッジ付近で保持された砥粒は、被研磨物の研磨に有効に作用するので、研磨特性をより向上させることができる。 In such a polishing pad 1a, since the concave island portion 3a is formed by the urethane resin portion 5 made of a hydrophobic resin, the polishing pad 1a is dispersed in a polishing slurry that is supplied when polishing of an object to be polished is performed. When the abrasive grains enter the recess of the island portion 3a, the relative rotation of the object to be polished and the polishing pad 1a causes a pumping action (sweeping action) due to the dynamic pressure action, and the abrasive grains are discharged from the recess. . And the abrasive grain discharged | emitted from the recessed part is hold | maintained by the sea part 4a formed with the epoxy resin which consists of hydrophilic resin with high retainability with respect to the abrasive grain of the edge vicinity of a recessed part. Therefore, the abrasive grains held in the vicinity of the edge of the recess effectively act on the polishing of the object to be polished, so that the polishing characteristics can be further improved.

尚、このような疎水性樹脂及び親水性樹脂の２種類の熱硬化性樹脂の主剤を用いる研磨パッド１ａの場合にも、１種類の熱硬化性樹脂の主剤を用いる研磨パッド１の製造方法と同様に、疎水性樹脂及び親水性樹脂を混合させた主剤に対して、疎水性樹脂用の硬化速度が速く分子量の小さい第１硬化剤及び親水性樹脂用の硬化速度が遅く分子量の大きい第２硬化剤をそれぞれ添加して硬化させれば良い。また、研磨パッド１ａでは、製造工程において、数％以下の気孔が自然に含まれてしまう場合もあるが、このような研磨パッド１ａも本発明の技術的範囲に含まれるものである。また、疎水性樹脂の硬化速度と親水性樹脂の硬化速度との差が小さい場合には、疎水性樹脂に対して先に第１硬化剤を添加し、少し硬化を進めておいてから親水性樹脂に対して第２硬化剤を添加するようにすれば良い。 In addition, in the case of the polishing pad 1a using two types of main ingredients of the thermosetting resin such as the hydrophobic resin and the hydrophilic resin, the manufacturing method of the polishing pad 1 using one type of the main ingredient of the thermosetting resin Similarly, the first curing agent having a high curing rate for the hydrophobic resin and a small molecular weight, and the second curing agent having a low curing rate and a large molecular weight for the hydrophilic resin, compared with the main agent obtained by mixing the hydrophobic resin and the hydrophilic resin. A curing agent may be added and cured. Further, in the polishing pad 1a, pores of several percent or less may naturally be included in the manufacturing process, but such a polishing pad 1a is also included in the technical scope of the present invention. In addition, when the difference between the curing rate of the hydrophobic resin and the curing rate of the hydrophilic resin is small, the first curing agent is added to the hydrophobic resin first and the curing is advanced for a while before the hydrophilic resin is cured. A second curing agent may be added to the resin.

また、２種類以上の熱硬化性樹脂の主剤を用いる場合に、それぞれの熱硬化性樹脂に対して硬化剤として機能する１種類の硬化剤だけを用いて、海島構造を有する研磨パッドを作製することも可能である。１種類の硬化剤だけを用いる場合でも、それぞれの熱硬化性樹脂の主剤に対する硬化時間が大きく異なるような場合には、それぞれの熱硬化性樹脂の主剤に対して１種類の硬化剤を添加して硬化させれば、研磨パッド１ａと同様に、耐摩耗性がそれぞれ異なる海部と島部とによって構成される海島構造を有する研磨パッドを作製することができる。また、２種類の熱硬化性樹脂の主剤と１種類の硬化剤を用いる場合において、それぞれの熱硬化性樹脂の硬化速度にほとんど差がないような場合には、例えば、一方の熱硬化性樹脂の主剤に対して硬化剤を添加し、先に所定時間加熱しておいてから、他方の熱硬化性樹脂を混ぜるようにすれば良い。例えば、熱硬化性樹脂の主剤に疎水性樹脂として耐摩耗性の低いウレタン樹脂及び親水性樹脂として耐摩耗性の高いエポキシ樹脂を用いる場合には、ウレタン樹脂の主剤に対して硬化剤を添加し、先に所定時間（例えば、１０〜２０分程度）加熱しておいてから、エポキシ樹脂の主剤を混ぜるようにすれば良い。これにより、研磨パッド１ａと同様に、耐摩耗性がそれぞれ異なる海部と島部とによって構成される海島構造を有する研磨パッドを作製することができる。 In addition, when two or more types of thermosetting resin main ingredients are used, a polishing pad having a sea-island structure is prepared using only one type of curing agent that functions as a curing agent for each thermosetting resin. It is also possible. Even when only one type of curing agent is used, when the curing time for the main component of each thermosetting resin is greatly different, one type of curing agent is added to the main component of each thermosetting resin. If cured, a polishing pad having a sea-island structure constituted by a sea part and an island part having different wear resistances can be produced in the same manner as the polishing pad 1a. In the case of using two types of main components of thermosetting resin and one type of curing agent, when there is almost no difference in the curing rate of each thermosetting resin, for example, one of the thermosetting resins A curing agent may be added to the main component, heated for a predetermined time, and then mixed with the other thermosetting resin. For example, when using a urethane resin with low wear resistance as a hydrophobic resin as a main component of a thermosetting resin and an epoxy resin with high wear resistance as a hydrophilic resin, a curing agent is added to the main component of the urethane resin. First, after heating for a predetermined time (for example, about 10 to 20 minutes), the main component of the epoxy resin may be mixed. Thereby, like the polishing pad 1a, a polishing pad having a sea-island structure constituted by a sea part and an island part having different wear resistances can be produced.

以上、説明してきた本発明の実施形態に係る研磨パッド１、１ａにおける被研磨物としては、例えば、レンズ、半導体デバイス用シリコンウエハ、液晶ディスプレイ用ガラス基板、ハードディスク用ガラス基板、アルミ基板、セラミックス、サファイア等が挙げられるが、特にこれらに限定されるものではなく、様々な被研磨物に対して適宜用いることができる。また、本発明の実施形態に係る研磨パッド１，１ａを用いて研磨加工を行う際に使用される砥粒としては、例えば、α−アルミナ、中間アルミナ、アルミナゾル、炭化ケイ素粒子、ダイヤモンド、酸化マグネシウム、酸化亜鉛、酸化セリウム、酸化ジルコニウム、コロイダルシリカ、ヒュームドシリカ等が挙げられ、被研磨物の種類に応じて、これらを１種以上使用することは、研磨速度を向上させる観点から好ましい。 As described above, the objects to be polished in the polishing pad 1, 1a according to the embodiment of the present invention described above include, for example, a lens, a silicon wafer for a semiconductor device, a glass substrate for a liquid crystal display, a glass substrate for a hard disk, an aluminum substrate, ceramics, Although sapphire etc. are mentioned, it is not specifically limited to these, It can use suitably with respect to various to-be-polished objects. Moreover, as an abrasive grain used when grind | polishing using the polishing pad 1 and 1a which concerns on embodiment of this invention, (alpha) -alumina, intermediate | middle alumina, an alumina sol, a silicon carbide particle, diamond, magnesium oxide, for example Zinc oxide, cerium oxide, zirconium oxide, colloidal silica, fumed silica, and the like can be used, and it is preferable to use one or more of them according to the type of the object to be polished from the viewpoint of improving the polishing rate.

以下、本発明の実施形態に係る研磨パッドの実施例と他の研磨パッドとの比較について説明する。 Hereinafter, a comparison between an example of a polishing pad according to an embodiment of the present invention and another polishing pad will be described.

（実施例１）
実施例１の研磨パッドは、図３の製造工程を経て作製した図１及び図２示すような研磨パッドであって、具体的には、１５０度で１０分間加熱したエポキシ樹脂の主剤ＪＥＲ８３４（三菱化学社製）に対して、第１硬化剤ジェファーミンＤ２３０（ハンツマン社製）及び第２硬化剤ジェファーミンＤ２０００（ハンツマン社製）を７１．４：２８．６の比率で添加し、撹拌・脱泡処理を行った後、金型に注型し、１５０度で３時間加熱を行って硬化させ、表面を粒度♯１００の電着ダイヤモンドリングによって約１５分間のドレッシングを施すことにより作製したものである。図７（ａ）は、この実施例１の研磨パッドの表面の走査型電子顕微鏡画像を示している。図７（ａ）の斑状に形成されている複数の白っぽい部分が耐摩耗性の低い凹状の島部３であり、その他の部分が耐摩耗性の高い海部４である。実施例１の研磨パッドの表面は、硬度（Asker-D）が５４、平均粗さＲａが１．２１μｍ、最大高さ粗さＲｚが１５．０７μｍ、凹凸の平均間隔ＲＳｍが３０．６４μｍである。そして、この研磨パッドを用いて、ソーダガラスの研磨加工を行った。研磨条件については、以下に示すような条件で研磨を行った。
（研磨条件）
研磨装置：片面ラッピング装置ＦＡＣＴ−２００（ナノファクタ社製）
定盤径：直径２００ｍｍ
ワーク：ソーダガラス（直径２０ｍｍ、厚さ１０ｍｍ、粗さ０．４μｍＲａ）
研磨スラリー：酸化セリウム砥粒SHOROX A-10（昭和電工社製）を３ｗｔ％水に懸濁したスラリー
スラリー供給量：２５ｍＬ／ｍｉｎ
研磨圧力：２０ｋＰａ
工作物・定盤回転数：９０ｒｐｍ
研磨時間：３０ｍｉｎ Example 1
The polishing pad of Example 1 is a polishing pad produced through the manufacturing process of FIG. 3 as shown in FIGS. 1 and 2, and specifically, an epoxy resin main agent JER834 (Mitsubishi) heated at 150 degrees for 10 minutes. The first curing agent Jeffamine D230 (manufactured by Huntsman) and the second curing agent Jeffamine D2000 (manufactured by Huntsman) are added at a ratio of 71.4: 28.6, and the mixture is stirred and removed. After foaming, it was cast in a mold and cured by heating at 150 degrees for 3 hours, and the surface was dressed with an electrodeposited diamond ring of particle size # 100 for about 15 minutes. is there. FIG. 7A shows a scanning electron microscope image of the surface of the polishing pad of Example 1. FIG. A plurality of whitish portions formed in the spots of FIG. 7A are concave island portions 3 having low wear resistance, and the other portions are sea portions 4 having high wear resistance. The surface of the polishing pad of Example 1 has a hardness (Asker-D) of 54, an average roughness Ra of 1.21 μm, a maximum height roughness Rz of 15.07 μm, and an average interval RSm of 30.64 μm. . And soda glass was polished using this polishing pad. Regarding the polishing conditions, polishing was performed under the following conditions.
(Polishing conditions)
Polishing machine: Single-sided lapping machine FACT-200 (manufactured by Nano Factor)
Surface plate diameter: 200mm diameter
Workpiece: Soda glass (diameter 20mm, thickness 10mm, roughness 0.4μmRa)
Polishing slurry: Slurry slurry supply amount in which cerium oxide abrasive SHOROX A-10 (manufactured by Showa Denko KK) is suspended in 3 wt% water: 25 mL / min
Polishing pressure: 20 kPa
Workpiece / plate rotation speed: 90rpm
Polishing time: 30 min

（実施例２）
また、実施例２の研磨パッドは、１５０度で１０分間加熱したエポキシ樹脂の主剤ＪＥＲ８３４（三菱化学社製）に対して、第１硬化剤トーマイド２４５−Ｓ（富士化成工業社製）及び第２硬化剤ジェファーミンＤ２０００（ハンツマン社製）を７：３の比率で添加し、撹拌・脱泡処理を行った後、金型に注型し、１５０度で３時間加熱を行って硬化させ、表面を粒度♯１００の電着ダイヤモンドリングによって約１５分間のドレッシングを施すことにより作製したものである。図７（ｂ）は、この実施例２の研磨パッドの表面の走査型電子顕微鏡画像を示している。図７（ｂ）の斑状に形成されている複数の白っぽい部分が耐摩耗性の低い凹状の島部３であり、その他の部分が耐摩耗性の高い海部４である。実施例２の研磨パッドの表面は、硬度（Asker-D）が４５、平均粗さＲａが１．６４μｍ、最大高さ粗さＲｚが２５．５４μｍ、凹凸の平均間隔ＲＳｍが４６．５７μｍである。そして、この実施例２の研磨パッドを用いて、実施例１と同様の条件にてソーダガラスの研磨を行った。 (Example 2)
In addition, the polishing pad of Example 2 was prepared by using a first curing agent tomide 245-S (manufactured by Fuji Kasei Kogyo Co., Ltd.) and a second one with respect to an epoxy resin main agent JER834 (manufactured by Mitsubishi Chemical Corporation) heated at 150 degrees for 10 minutes. The curing agent Jeffamine D2000 (manufactured by Huntsman) was added at a ratio of 7: 3, and after stirring and defoaming treatment, it was poured into a mold and cured by heating at 150 ° C. for 3 hours. Was prepared by applying a dressing for about 15 minutes with an electrodeposited diamond ring of grain size # 100. FIG. 7B shows a scanning electron microscope image of the surface of the polishing pad of Example 2. A plurality of whitish portions formed in the spots of FIG. 7B are concave island portions 3 having low wear resistance, and the other portions are sea portions 4 having high wear resistance. The surface of the polishing pad of Example 2 has a hardness (Asker-D) of 45, an average roughness Ra of 1.64 μm, a maximum height roughness Rz of 25.54 μm, and an average interval RSm of unevenness of 46.57 μm. . Then, using the polishing pad of this Example 2, soda glass was polished under the same conditions as in Example 1.

（比較例１）
比較例１では、従来の市販のウレタン樹脂研磨パッドＫＳＰ６６Ａ（九重電気社製）を用いて、実施例１と同様の条件にてソーダガラスの研磨を行った。 (Comparative Example 1)
In Comparative Example 1, soda glass was polished under the same conditions as in Example 1 using a conventional commercially available urethane resin polishing pad KSP66A (manufactured by Kuju Electric Co., Ltd.).

（比較例２）
比較例２では、従来の市販のエポキシ樹脂研磨パッドEPO０５（九重電気社製）を用いて、実施例１と同様の条件にてソーダガラスの研磨を行った。 (Comparative Example 2)
In Comparative Example 2, soda glass was polished under the same conditions as in Example 1 using a conventional commercially available epoxy resin polishing pad EPO05 (manufactured by Kuju Electric Co., Ltd.).

その結果、図６に示すように、実施例１及び実施例２の研磨パッドは、それぞれ従来の比較例１及び比較例２の研磨パッドよりも研磨能率が向上し、表面粗さも改善されていることがわかる。特に実施例２の研磨パッドについては、従来の研磨パッドに比べて研磨能率が大幅に向上している。また、実施例１の研磨パッドについては、従来の研磨パッドに比べて表面粗さが大幅に改善されている。 As a result, as shown in FIG. 6, the polishing pads of Example 1 and Example 2 have higher polishing efficiency and improved surface roughness than the conventional polishing pads of Comparative Example 1 and Comparative Example 2, respectively. I understand that. In particular, the polishing efficiency of the polishing pad of Example 2 is greatly improved as compared with the conventional polishing pad. In addition, the surface roughness of the polishing pad of Example 1 is greatly improved as compared with the conventional polishing pad.

尚、本発明の実施の形態は上述の形態に限るものではなく、本発明の思想の範囲を逸脱しない範囲で適宜変更することができる。 The embodiment of the present invention is not limited to the above-described embodiment, and can be appropriately changed without departing from the scope of the idea of the present invention.

本発明に係る研磨パッドは、レンズ、半導体デバイス用シリコンウエハ、液晶ディスプレイ用ガラス基板等の被研磨物の表面を研磨するための研磨パッドとして有効に利用することができる。 The polishing pad according to the present invention can be effectively used as a polishing pad for polishing the surface of an object to be polished such as a lens, a silicon wafer for a semiconductor device, or a glass substrate for a liquid crystal display.

１、１ａ研磨パッド
２基材
２１、２１ａ表面
３、３ａ島部
４、４ａ海部
５ウレタン樹脂部（疎水性樹脂部）
６エポキシ樹脂部（親水性樹脂部）
1, 1a Polishing pad 2 Base material 21, 21a Surface 3, 3a Island part 4, 4a Sea part 5 Urethane resin part (hydrophobic resin part)
6 Epoxy resin part (hydrophilic resin part)

Claims

A non-porous polishing pad for polishing the object to be polished while supplying a polishing slurry in which abrasive grains are dispersed with the object to be polished,
A polishing pad having a sea-island structure composed of a sea part and an island part having different wear resistances.

It contains two or more types of curing agents having different curing rates from the main component of the thermosetting resin, or two or more different types of main components of the thermosetting resin and one or more types of curing agents. 2. The polishing pad according to 1.

The polishing pad according to claim 2, wherein the two or more kinds of curing agents having different curing speeds are separated from each other by a curing time of 20 minutes or more at a curing temperature when used alone.

The main component of the thermosetting resin is an epoxy resin,
The two or more kinds of curing agents having different curing speeds include a polyaminoamide curing agent having an amine value of 400 to 700 mmol / g, an amine curing agent having an average molecular weight of 100 to 300, and an amine system having an average molecular weight of 1500 to 2500. The polishing pad according to claim 2, further comprising a curing agent.

The polishing pad according to claim 2, wherein the main component of the two or more types of thermosetting resins includes a hydrophilic resin and a hydrophobic resin.

The hydrophilic resin is one of an epoxy resin, a polyamide resin, and a polyimide resin,
The polishing pad according to claim 5, wherein the hydrophobic resin is a urethane resin or an acrylic resin.