KR102278771B1 - Barrel Type Plating Apparatus Having Circulating Portion For Of Plating Solution - Google Patents

Abstract

The present invention provides a barrel plating device, which can pump and supply a plating solution outside the barrel into the barrel to homogenize the concentration of the plating solution inside and outside the barrel. The present invention relates to a twin type barrel plating device having a plating solution circulating part which includes two barrels and has simple composition. The composition comprises: a barrel in the shape of a tube for providing a plating space capable of containing an object to be plated inside; a hanger for hanging the barrel on a transporting device for transporting and submerging the barrel inside a plating bath; a barrel support arranged below the hanger to support both ends of the barrel; and a plating solution circulating part for pumping and supplying a plating solution outside the barrel into the plating space inside the barrel. The plating solution circulating part includes: a pump installed inside or outside the plating bath to inhale the plating solution, which is outside the barrel, and discharge the plating solution forcibly to a discharge side; a plating solution supply pipe installed at the discharge side of the pump to extend into the plating bath; a nipple installed on the plating solution supply pipe to spray the plating solution vertically; an accommodation pipe combined with the nipple in a male and female manner to accommodate the plating solution sprayed from the nipple; and a spray pipeline arranged in the barrel support and a bushing member and opened toward the plating space to guide and spray the plating solution, which is introduced into the accommodation pipe, into the plating space of the barrel.

Description

Barrel Plating Apparatus Having Circulating Portion For Of Plating Solution

The present invention relates to a barrel plating apparatus, and more particularly, to a twin-type barrel plating apparatus having two barrels and a plating solution circulation part having a simple configuration.

Electroplating is a plating method in which a metal film is formed on the surface of the object by connecting the negative electrode to the object to be coated and the anode to the conductor while the object is immersed in the electrolyte so that the metal ions of the conductor are reduced on the surface of the object.

Electroplating basically requires supplying electricity to the object, but if the object such as screws, bolts, nuts, washers, coins, and small parts is too small to handle individually, it is impossible to hang the object on a rack or hold it with clamps. Therefore, it takes a method of plating after putting it in a barrel called a barrel, and this method is called a barrel plating device (refer to Korean Patent Registration Nos. 10-1279526 and 10-1291556).

The barrel is transported to the plating bath by a hanger device and then immersed in the plating solution, and rotated inside the plating bath by a rotating mechanism. As the barrel is rotated, the plating is performed while the object inside is in contact with the plating solution. Meanwhile, even if the barrel is immersed in the plating solution, there is a difference in the electrolyte concentration between the plating solution outside the barrel and the plating solution inside the barrel. Since plating proceeds actively inside the barrel, the concentration is generally lower than that outside the barrel. This means that it takes a lot of time for plating to be completed, which means a decrease in productivity.

In response to this problem, Korean Patent Registration No. 10-1087077 discloses a cylindrical barrel that is deposited in a plating bath and installed rotatably horizontally, and the shaft of the barrel so that the plating solution supplied therein is sprayed through a plurality of injection nipples installed at predetermined intervals. a branch pipe installed in the direction; a first pump for supplying the plating solution in the plating tank to the branch pipe; a cathode rod installed on a circumferential surface of one side of the cylindrical barrel; an anode rod installed to be deposited in the plating bath; A barrel plating apparatus including a power supply connected to an anode rod through respective lead wires, and a driving motor for rotationally driving the cylindrical barrel is proposed.

According to this, a system capable of uniformly supplying the plating solution from the outside of the barrel to the inside is provided. However, there is a problem in the method of supplying the plating solution. In other words, it is difficult to actually implement the branch pipe inside the barrel. Even if implemented, the structure is complicated, so the manufacturing cost increases and the risk of failure increases.

Korean Patent Registration No. 10-1279526 Korean Patent Registration No. 10-1291556 Korean Patent Registration No. 10-1087077

An object of the present invention is to provide a barrel plating apparatus capable of supplying a plating solution from the outside of the barrel to the inside of the barrel to uniformly match the concentration of the plating solution inside and outside the barrel.

More specifically, an object of the present invention is to provide a twin-type barrel plating apparatus capable of maximizing the productivity of plating without complicating the configuration of the barrel by providing a plating solution in a simple manner.

The above object, the barrel-shaped barrel to provide a plating space that can contain the object to be coated therein; a hanger for suspending the barrel on a transport device for transporting and immersing the barrel into the plating bath; Barrel support provided at the lower portion of the hanger for supporting both ends of the barrel; a plating solution circulation unit for pumping and supplying the plating solution outside the barrel to the plating space inside the barrel;

The plating solution circulation unit,

a pump installed inside or outside the plating tank, which sucks the plating solution outside the barrel and forcibly discharges the plating solution to the discharge side; a plating solution supply pipe installed on the discharge side of the pump and extending into the plating tank; a nipple installed in the plating solution supply pipe and configured to eject the plating solution in a vertical direction; a receiving tube for accommodating the plating solution ejected therefrom by being male and female coupled to the nipple; A plating solution circulation comprising a; a jet pipe provided in the barrel support and the bushing member, which is opened toward the plating space to guide and eject the plating solution flowing into the receiving pipe into the plating space of the barrel. This is achieved by a barrel plating apparatus having a negative portion.

According to another feature of the present invention, the jet pipe may be provided by hole processing in the longitudinal and transverse directions of the barrel support and the bushing member.

According to another feature of the present invention, two barrels are installed on the hanger;

The jet pipe is provided in each of the barrel supports for supporting each of the barrels;

The adjacent barrel supports are connected by a barrel connector;

By being installed in communication with the both ends of the jet pipe passage;

The plating solution may be simultaneously supplied to the two barrels through the plating solution supply pipe.

According to the present invention, there is provided a barrel plating apparatus capable of uniformly matching the plating solution concentration inside and outside the barrel by configuring the plating solution circulation unit. More specifically, in configuring the plating solution circulation unit, the configuration is simple, so the cost increase is not large, and the risk of failure is not large. Thereby, a barrel plating apparatus capable of contributing to productivity improvement and energy saving is provided. In particular, in a twin barrel plating apparatus composed of two barrels, a plating liquid can be supplied to both barrels through one plating liquid supply pipe, thereby providing a barrel plating apparatus capable of circulating and supplying a plating liquid more economically.

1 is a configuration diagram of a use state of a barrel plating apparatus having a plating solution circulation unit according to an embodiment of the present invention.
2 is a schematic perspective view of a barrel plating apparatus having a plating solution circulation unit according to an embodiment of the present invention.
3 is a cross-sectional configuration view of a main part of a barrel plating apparatus having a plating solution circulation part according to an embodiment of the present invention.
4 is a cross-sectional configuration view of a main part of a barrel plating apparatus having a plating solution circulation unit according to another embodiment of the present invention.

Hereinafter, the specific contents of the present invention will be described in detail with reference to the accompanying drawings 1 to 3 at the same time. Where necessary, it will be described while citing the rest of the drawings.

The barrel plating apparatus 1 having the plating solution circulation part according to the embodiment of the present invention is immersed in the plating bath 100 as shown in FIG. 1 . The barrel plating apparatus 1 in the present invention is a narrow barrel plating apparatus and is a part of the overall plating system. The entire plating system is equipped with several barrel plating devices (1). The barrel plating apparatus 1 is circulated and transported along each process of the plating system.

As shown in FIG. 1 , the plating of the object to be coated is in progress while the barrels 5 and 7 are immersed in the plating solution. The barrel plating devices 5 and 7 are transported to the plating tank 100 by a transport device not shown.

As shown, the barrels 5 and 7 are composed of two. That is, each drawing shows a twin type barrel plating apparatus 1 . Although the present invention uses the twin-type barrel plating apparatus 1 as a basic embodiment as described above, it goes without saying that it may consist of only one barrel. Hereinafter, the twin-type barrel plating apparatus 1 will be described as a basis.

The barrel plating apparatus 1 includes two barrels 5 and 7 , a hanger 3 , an electricity supply unit 4 , and a plating solution circulation unit 6 .

The barrels 5 and 7 are cylinders that provide a plating space (S, S') in which the objects to be coated (W, W') can be contained therein. The to-be-coated objects W and W' input to the barrels 5 and 7 may be the same or different.

The barrels 5 and 7 may be a cylindrical body or a prismatic body as shown. A plurality of through-holes 8 are perforated in the peripheral wall of the barrels 5 and 7 so that the plating solution can pass therethrough. Although not shown, a door may be provided on the barrels 5 and 7 . This is to open the door so that the objects to be coated (W, W') can be put in and discharged.

The hanger 3 is transported in horizontal and vertical directions by a transport device not shown. Barrels (5, 7) are suspended from this hanger (3). The hanger 3 includes a hanger plate 10 and a hanger bar 12 installed on the upper left and right sides of the hanger plate 10, and barrel supports 9, 9', 11 for supporting both ends of the barrels 5 and 7, 11').

Barrel support (9, 9', 11, 11') is a plate body fixed at a right angle to the bottom surface of the hanger plate (10). A bushing member 14 is interposed between the barrels 5 and 7 and the barrel supports 9, 9', 11 and 11' to allow relative rotation. The bushing member 14 is fixed and rotates while the barrels 5 and 7 are coupled to one side of the bushing member 14 . A wire insertion hole 31 for inserting the cathode ray 33 is drilled in the center of the bushing member 14 .

The barrels 5 and 7 are installed rotatably about a horizontal axis in a state in which they are installed on the barrel supports 9, 9', 11, and 11'. Gears 16 for rotating the barrels 5 and 7 are integrally installed on both sides of the barrels 5 and 7 .

A feature of the present invention resides in the plating liquid circulation section 6 described below. The plating solution circulation unit 6 is for pumping and supplying the plating solution outside the barrels 5 and 7 to the plating space S, S' inside the barrels 5 and 7, and This is to reduce the concentration deviation. That is, this is to compensate for the lowering of the electrolyte concentration inside the barrels 5 and 7 as plating proceeds.

According to the embodiment of the present invention, the plating solution circulation unit 6 includes a pump 15 , a plating solution supply pipe 17 , a nipple 19 , an accommodation pipe 21 , and a jet pipe 23 .

The pump 15 is installed inside or outside the plating bath 100 , sucks the plating solution outside the barrels 5 and 7 and forcibly discharges the plating solution to the discharge side. The pump 15 may be installed outside the plating bath 100 .

The plating solution supply pipe 17 has one end connected to the discharge side of the pump 15 and the other end extending into the plating bath 100 . The plating solution supply pipe 17 is installed adjacent to the bottom of the plating bath 100 .

A nipple (19) is installed at one point of the plating solution supply pipe (17). The nipple 19 is installed in the vertical direction so that the plating solution is ejected in the vertical direction. The upper end of the nipple 19 may be always open, or an adapter 25 or a valve may be installed.

On the other hand, on the hanger (3) side of the barrel plating apparatus, a receiving tube (21) for receiving the plating solution from the nipple (19) is installed. The receiving tube 21 is male and female coupled to the nipple 19 (docking). A conical cup 27 on which the adapter 25 can be seated may be installed at the end of the accommodating tube 21 . A watertight member such as a packing may be interposed between the adapter 25 and the cup 27 .

A barrel connection pipe 27 is connected to the upper end of the receiving pipe 21 in a “T” shape. One side of the barrel connection pipe 27 is connected to the inner barrel support 9 of one side, and the other side is connected to the inner barrel support 11 of the other side.

The inner barrel supports 9 and 11 are provided with ejection pipes 23 and 24 that provide a movement path of the supplied plating solution. The ejection pipes 23 and 24 may be provided by drilling holes in the barrel supports 9 and 11 and the bushing member 14 having a thickness. The ejection pipes 9 and 11 may include a longitudinal pipe and a transverse pipe, and are directly or indirectly opened toward the plating space S, S'. In particular, the bushing member 14 is provided with a conduit by drilling in an L-shape at a point avoiding the wire insertion hole 31 . In the end, the ends of the ejection pipes 23 and 24 are provided in the bushing member 14, and are opened toward the plating space S, S', so that the spray nozzle for spraying and supplying the plating solution to the inside of the barrels 5 and 7 (32) will play a role.

The cathode ray 33 of the electricity supply unit 4 extends into the barrels 5 and 7 through the wire insertion holes 31 provided on both left and right sides of the barrel. At the end of the cathode ray 33, the cathode rod 35 is suspended so as to be connected to the cathode while in contact with the objects W and W'. The positive electrode plate, not shown, is installed outside the barrels 5 and 7 in the plating bath 100 .

According to this configuration, when the transfer device lowers the barrels 5 and 7 from the original position of the plating bath 100 , the receiving tube 21 is docked with the nipple 19 . Thereafter, when the pump 15 is operated, the plating solution is jetted and supplied into the barrels 5 and 7 along the plating solution supply pipe 17 and the jetting pipes 23 and 24 .

The configuration shown and described above is merely a preferred embodiment based on the technical idea of the present invention. Those skilled in the art will be able to make various changes based on common technical knowledge, but it should be noted that these may be included in the protection scope of the present invention. Various combinations of the embodiments disclosed above are possible, and all possible combinations are within the scope of the present invention.

1: Barrel plating device having a plating solution circulation part
3: Hanger 5,7: Barrel
4: electricity supply part 6: plating solution circulation part
8: Through hole 9,9',11,11': Barrel support
10: hanger plate 13: hanger rod
14: bushing member 15: pump
17: plating solution supply pipe 19: nipple (nipple)
21: receiving pipe 23, 24: ejection pipe
25: adapter 27: cup
29: barrel connector 31: wire insertion hole
32: injection nozzle 33: cathode ray
35: cathode rod
S,S': Plating space W,W': Coated object

Claims (3)

A cylindrical barrel (5, 7) that provides a plating space (S, S') that can contain the object to be coated (W, W') inside (5, 7); a hanger (3) for suspending the barrels (5, 7) on a transport device for transporting and immersing the barrels (5, 7) to the inside of the plating bath; Barrel supports (9, 9', 11, 11') for supporting both ends of the barrel (5, 7) as provided in the lower part of the hanger (3); a plating solution circulation unit for pumping and supplying the plating solution outside the barrel (5,7) to the plating space (S,S′) inside the barrel (5,7);
The plating solution circulation unit,
a pump (15) installed inside or outside the plating tank, which sucks the plating solution outside the barrel (5, 7) and forcibly discharges it to the discharge side; a plating solution supply pipe 17 installed on the discharge side of the pump 15 and extending into the plating bath; a nipple (19) installed in the plating solution supply pipe (17) so that the plating solution is ejected in the vertical direction; a receiving tube 21 for accommodating the plating solution ejected from the nipple 19 and male and female coupling; As provided in the barrel supports (9, 9', 11, 11') and the bushing member 14, the plating solution flowing into the accommodation pipe 21 is guided into the plating space of the barrels 5, 7 and ejected. including; ejection pipes 23 and 24 that are opened toward the plating space to do so;
The ejection pipe lines 23 and 24 are formed in an L-shape by drilling the barrel supports 9, 9', 11, 11' and the bushing member 14 in the longitudinal and transverse directions using a drill. Barrel plating apparatus having a plating solution circulation part, characterized in that provided. According to claim 1,
A conical cup 27 is installed at the end of the receiving tube 21;
Barrel plating apparatus having a plating solution circulation part, characterized in that the nipple (19) is provided with an adapter (25) that is seated on the receiving tube (21). According to claim 1,
The hanger is equipped with two barrels (5,7);
The jet pipes 23 and 24 are respectively provided on the barrel supports 9, 9', 11 and 11' for supporting the barrels 5 and 7, respectively;
The adjacent barrel supports (9, 9', 11, 11') are connected by a barrel connector (29);
The ejection pipe lines 23 and 24 communicate with both ends of the barrel connection pipe 29;
A barrel plating apparatus having a plating solution circulation part, characterized in that the plating solution is simultaneously supplied to the two barrels (5,7) through the plating solution supply pipe (17).

Images