KR102275927B1 - Shutoff element and shutoff element circuit - Google Patents

Abstract

Disclosed is a blocking element capable of supplying sufficient power to fuse a fusible conductor to a heating element even when mounted on a weak current path. The insulating substrate 10, the 1st and 2nd electrodes 11 and 12 which comprise the 1st circuit 2, and the 3rd - 5th electrodes 13-15 which comprise the 2nd circuit 3, and , The first soluble conductor 17 mounted between the first and second electrodes 11 and 12, and the heating element 18 connected between the third and fourth electrodes 13 and 14, and the fourth and fifth electrodes After providing the 2nd soluble conductor 19 mounted between (14, 15) and cutting the 1st soluble conductor 17 by melting with the heat of the heat generating body 18, the 2nd soluble conductor 19 is cut by melting.

Description

SHUTOFF ELEMENT AND SHUTOFF ELEMENT CIRCUIT

The present invention relates to a blocking device and a blocking device circuit for ensuring safety by electrically and physically blocking a power supply line or a signal line. This application claims priority on the basis of Japanese Patent Application No. 2013-177058 for which it applied in Japan on August 28, 2013, This application is used for this application by reference.

Many of the secondary batteries that can be repeatedly used by charging are processed into battery packs and provided to users. In particular, in a lithium ion secondary battery having a high weight energy density, in order to ensure the safety of users and electronic devices, in general, several protection circuits such as overcharge protection and overdischarge protection are built into the battery pack, It has a function to cut off the output of the battery pack.

In this type of cut-off element, there are some that perform an overcharge protection or an overdischarge protection operation of the battery pack by turning the output ON/OFF using a FET switch built into the battery pack. However, even if the FET switch is short-circuited and destroyed for some reason, a lightning surge, etc. is applied and an instantaneous large current flows, or the output voltage is abnormally reduced due to the life of the battery cell, or, conversely, even when an excessive abnormal voltage is output. , battery packs and electronic devices must be protected from accidents such as fire. Therefore, in order to safely cut off the output of the battery cell in any conceivable abnormal state, a blocking element composed of a fuse element having a function of blocking a current path by an external signal is used.

As shown in FIG. 17, as the interruption|blocking element 80 of such protection circuits, such as for lithium ion secondary batteries, the soluble conductor 83 spanned between the 1st and 2nd electrodes 81 and 82 connected on the electric current path|route. It is proposed to connect to form a part of the current path, and to cut the soluble conductor 83 on this current path by self-heating due to overcurrent or by the heating element 84 formed inside the interruption element 80 .

Specifically, the blocking element 80 includes an insulating substrate 85 , a heating element 84 laminated on the insulating substrate 85 and covered with the insulating member 86 , and a first formed at both ends of the insulating substrate 85 . , the second electrodes 81 and 82, the heating element lead-out electrode 88 stacked on the insulating member 86 so as to overlap the heating element 84, and both ends are connected to the first and second electrodes 81 and 82, respectively. It is connected and the central part is equipped with the soluble conductor 83 connected to the heat generating body extraction electrode 88.

18 is a circuit diagram of the blocking element 80 . That is, the interruption|blocking element 80 melts the soluble conductor 83 by heat-generating through the connection point of the soluble conductor 83 and the soluble conductor 83 connected in series via the heat generating body extraction electrode 88, It is a circuit structure which consists of the heating element 84. Moreover, in the interruption|blocking element 80, the soluble conductor 83 is connected in series on a charge/discharge current path|route, and the heat generating body 84 is connected with the current control element 87, for example. The current control element 87 is constituted by, for example, a field effect transistor (hereinafter, referred to as FET), and when the lithium ion secondary battery exhibits an abnormal voltage, the heating element 84 is interposed through the soluble conductor 83 . ) is controlled so that the current flows through it.

Thereby, the interruption|blocking element 80 cuts the soluble conductor 83 on a current path|route by heat_generation|fever of the heat generating body 84, and collects this molten conductor to the heat generating body lead-out electrode 88, The 1st and 2nd electrode ( By blocking the current path between the 81 and 82 , the charging/discharging path of the battery pack may be electrically and physically blocked.

Japanese Patent Laid-Open No. 2010-003665 Japanese Laid-Open Patent Publication No. 2004-185960 Japanese Patent Laid-Open No. 2012-003878

Here, in the interruption|blocking element 80 shown in FIG. 17, FIG. 18, although the electric power which heat-generates the heat generating body 84 is supplied through the soluble conductor 83, 1st electrode 81 - soluble conductor 83 - Since the current path spanning the 2nd electrode 82 is a charging/discharging path|route of a battery, also at the time of electricity supply of the heat generating body 84, sufficient calorie|heat quantity to make the heat generating body 84 cut the soluble conductor 83 by melting can be obtained.

However, when the blocking element 80 is used in a signal line through which a current weaker than that of the power supply line flows, the heating element 84 is supplied with enough power to obtain a sufficient amount of heat to cut the soluble conductor 83 by melting. Therefore, the use of the interruption element 80 was limited to the use of a large current.

Also, the current control element 87 for switching the current path to the heat generating element 84 side is also required to be improved in the same way as the current rating is improved. In addition, the high-rated current control element is generally expensive and disadvantageous also in terms of cost.

Therefore, an object of the present invention is to provide a breaking element and a breaking element circuit that can supply sufficient electric power to fuse a soluble conductor to a heating element even when mounted on a weak current path and can be used for all applications. .

In order to solve the above-mentioned problem, the blocking element which concerns on this invention is formed in the insulating substrate, the said insulating substrate, the 1st and 2nd electrodes which comprise a 1st circuit, and the said insulating substrate, The 3rd - 5th electrode which comprises 2nd circuit, the 1st soluble conductor mounted across the said 1st and 2nd electrode, the heat generating element connected between the said 3rd and 4th electrode, and the said 4th and 5th electrode A second soluble conductor mounted across the liver is provided, and a current is passed between the third to fifth electrodes to cut the first soluble conductor by melting the first soluble conductor by the heat generated by the heating element, and then the second soluble conductor is cut by melting will be.

Moreover, the interruption|blocking element circuit which concerns on this invention has a 1st circuit which has a 1st soluble conductor, and the 2nd soluble conductor formed electrically independently of the said 1st circuit, a heat generating body, and the one end of the said heat generating body connected A second circuit is provided, and the second soluble conductor is cut by melting the first soluble conductor by melting the first soluble conductor by the heat generated by the heating element by flowing an electric current through the second circuit and interrupting the first circuit. .

According to the present invention, since the first circuit and the second circuit for interrupting the first circuit are electrically independent, the first soluble conductor is formed with respect to the heating element regardless of the type of external circuit to which the first circuit is mounted. It is possible to supply power to obtain sufficient calorific value for fusing. Therefore, according to the present invention, as an external circuit to which the first circuit is mounted, it can also be applied to a digital signal circuit or the like that allows a weak current to flow.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the interruption|blocking element to which this invention was applied, (A) is a top view, (B) is AA' sectional drawing, (C) is sectional drawing.
2 : is a circuit diagram of the interruption|blocking element to which this invention was applied.
Fig. 3 is a circuit diagram of a blocking element circuit to which the present invention is applied.
4 : is a figure which shows the state by which the 1st soluble conductor of the interruption|blocking element to which this invention was applied was fused, (A) is a top view, (B) is a circuit diagram, (C) is sectional drawing.
5 : is a figure which shows the state by which the 2nd soluble conductor of the interruption|blocking element to which this invention was applied was fused, (A) is a top view, (B) is a circuit diagram, (C) is sectional drawing.
6 : is a figure which shows the application example of the interruption|blocking element to which this invention was applied, (A) shows before melting of a 1st, 2nd soluble conductor, (B) shows after melting.
7 is a view showing another blocking element to which the present invention is applied, (A) is a plan view, (B) is a cross-sectional view AA′.
8 is a view showing another blocking element to which the present invention is applied, (A) is a plan view, (B) is a cross-sectional view AA′.
9 is a view showing another blocking element to which the present invention is applied, (A) is a plan view, (B) is a cross-sectional view AA′.
10 is a view showing another blocking element to which the present invention is applied, (A) is a plan view, (B) is a cross-sectional view AA′.
11 is a perspective view showing a soluble conductor having a high-melting-point metal layer and a low-melting-point metal layer and having a covering structure, (A) is a high-melting-point metal layer as an inner layer and a low-melting-point metal layer shows a structure coated with a low melting point metal layer, (B) shows a structure in which a low-melting-point metal layer is used as an inner layer and a high-melting-point metal layer is covered.
12 : is a perspective view which shows the soluble conductor provided with the lamination|stacking structure of a high-melting-point metal layer and a low-melting-point metal layer, (A) shows the upper and lower two-layer structure, (B) shows the three-layer structure of an inner layer and an outer layer.
13 : is sectional drawing which shows the soluble conductor provided with the multilayer structure of a high-melting-point metal layer and a low-melting-point metal layer.
14 is a plan view showing a soluble conductor in which a linear opening is formed on the surface of a high-melting-point metal layer and the low-melting-point metal layer is exposed, (A) is an opening formed along the longitudinal direction, (B) is a width direction Accordingly, an opening is formed.
15 : is a top view which shows the soluble conductor in which the circular opening part is formed in the surface of the high-melting-point metal layer, and the low-melting-point metal layer is exposed.
16 : is a top view which shows the soluble conductor with which the circular opening part was formed in the high-melting-point metal layer, and the low-melting-point metal was filled inside.
Fig. 17 is a plan view showing a blocking element according to a reference example of the present invention.
Fig. 18 is a circuit diagram of a blocking element according to a reference example of the present invention.

Hereinafter, the blocking element and the blocking element circuit to which the present invention is applied will be described in detail with reference to the drawings. In addition, this invention is not limited only to the following embodiment, It goes without saying that various changes are possible within the range which does not deviate from the summary of this invention. In addition, the drawings are schematic, and the ratio of each dimension, etc. may differ from an actual thing. Specific dimensions and the like will have to be determined in consideration of the following description. In addition, it goes without saying that the drawings also contain portions having mutually different dimensional relationships and ratios.

[First form]

As shown in FIG. 1, the blocking element 1 to which this invention was applied is formed in the insulating substrate 10 and the insulating substrate 10, The 1st electrode 11 which comprises the 1st circuit 2, and The 2nd electrode 12, the 3rd electrode 13, the 4th electrode 14, and the 5th electrode 15 which are formed in the insulating substrate 10 and which comprise the 2nd circuit 3, and the 1st And the heating element 18 connected between the 1st soluble conductor 17 (fuse) mounted between the 2nd electrodes 11 and 12, and the 3rd and 4th electrodes 13 and 14, and the 4th and 5th A 2nd soluble conductor (fuse) 19 mounted across the electrodes 14 and 15 is provided. Fig. 1(A) is a plan view of the blocking element 1, Fig. 1(B) is a cross-sectional view taken along line A-A', and (C) is a cross-sectional view.

The insulating substrate 10 is formed of the member which has insulating properties, such as alumina, glass ceramics, mullite, and a zirconia, for example. In addition, although you may use the material used for printed wiring boards, such as a glass epoxy board|substrate and a phenol board|substrate, it is necessary to pay attention to the temperature at the time of fuse melting.

[First and Second Electrodes: First Circuit]

The 1st and 2nd electrodes 11 and 12 are laminated|stacked on the insulating member 21 mentioned later while being formed on the surface 10a of the insulating substrate 10. As shown in FIG. Moreover, the 1st and 2nd electrodes 11 and 12 are continuous with the external connection terminal formed in the back surface 10b of the insulating substrate 10 via the through-hole 20. As shown in FIG.

The 1st and 2nd electrodes 11 and 12 are electrically connected by the 1st soluble conductor 17 being mounted. Thereby, the interruption|blocking element 1 comprises the 1st circuit 2 from the 1st electrode 11 - the 1st soluble conductor 17 - the 2nd electrode 12, The 1st circuit 2, The blocking element 1 is mounted on a part of a circuit formed on a circuit board on which it is mounted.

The circuit to which the 1st circuit 2 is attached is a current line of the electronic device in which the interruption|blocking element 1 is mounted, for example, the charge/discharge circuit in the battery pack of a lithium ion secondary battery, and the power supply of various electronic devices. It can be applied to any circuit that requires blocking of a physical current path regardless of the strength or weakness of the current, such as a circuit or a digital signal circuit.

[Heating element]

The heat generating body 18 is laminated|stacked on the surface 10a of the insulating substrate 10, and is covered with the insulating member 21. As shown in FIG. The heat generating element 18 is a member having a conductivity that generates heat when energized with a relatively high resistance value, and is made of, for example, W, Mo, Ru or the like. It is formed by mixing these alloys, compositions, and powders of the compound with a resin binder or the like, forming a paste on the insulating substrate 10 using a screen printing technique to pattern-form, and then baking. The heat generating element 18 has one end connected to the third electrode 13 and the other end connected to the fourth electrode 14 .

An insulating member 21 is disposed so as to cover the heating element 18, and the first electrode 11, the second electrode 12, and the fourth electrode are overlapped with the heating element 18 via the insulating member 21. 14) and the fifth electrode 15 are stacked. As the insulating member 21, glass can be used, for example. In addition, in the interruption element 1, in order to transmit the heat|fever of the heat generating body 18 to the 1st soluble conductor 13 efficiently, also between the heat generating body 18 and the insulating substrate 10, an insulating member is laminated|stacked, and a heat generating body ( 18) may be provided inside the insulating member 21 formed on the surface of the insulating substrate 10 .

[Third to Fifth Electrodes: Second Circuit]

The 3rd electrode 13 is formed on the surface 10a of the insulating substrate 10, and is connected with the one end of the heat generating body 18. As shown in FIG. The 4th electrode 14 is laminated|stacked on the insulating member 21 while being connected with the other end of the heat generating body 18 by being formed on the surface 10a of the insulating substrate 10. As shown in FIG. The fifth electrode 15 is formed on the surface 10a of the insulating member 10 and laminated on the insulating member 21 . Moreover, the 3rd electrode 13 and the 5th electrode 15 are continuous with the external connection terminal formed in the back surface 10b of the insulated substrate 10 via the through-hole 20. As shown in FIG.

The 4th and 5th electrodes 14 and 15 are electrically connected by mounting the 2nd soluble conductor 19 on the insulating member 21. As shown in FIG. Thereby, the 3rd - 5th electrodes 13-15 comprise the 2nd circuit 3 electrically independent from the said 1st circuit 2 . The 2nd circuit 3 is a circuit for heating and fusion cutting the 1st soluble conductor 17 of the 1st circuit 2, and cut the 1st soluble conductor 17 by fusion and cut off the 1st circuit 2 After that, by cutting the 2nd soluble conductor 19 by melting, oneself also interrupts|blocks, and the electric power supply with respect to the heat generating body 18 is stopped.

[Soluble conductor]

The 1st, 2nd soluble conductors 17 and 19 can use any metal rapidly fused by heat_generation|fever of the heat generating body 18, For example, low-melting-point metals, such as Pb-free solder which has Sn as a main component. can be preferably used.

Moreover, the 1st, 2nd soluble conductors 17 and 19 may contain a low-melting-point metal and a high-melting-point metal. As the low melting point metal, it is preferable to use a solder such as a Pb-free solder, and as the high melting point metal, it is preferable to use Ag, Cu or an alloy having these as a main component. By containing a high-melting-point metal and a low-melting-point metal, in the case of reflow-mounting the blocking element 1, the reflow temperature exceeds the melting temperature of the low-melting-point metal, and even if the low-melting-point metal is melted, the low-melting-point metal in the inner layer The outflow to the outside can be suppressed and the shape of the 1st, 2nd soluble conductors 17 and 19 can be maintained. In addition, even at the time of fusion, melting of the low-melting-point metal causes melting (solder erosion) of the high-melting-point metal, thereby enabling rapid fusion cutting at a temperature below the melting point of the high-melting-point metal. In addition, the 1st - 3rd soluble conductors 21-23 can be formed with various structures so that it may demonstrate later.

The 1st, 2nd soluble conductors 17 and 19 can be comprised by making a low melting-point metal layer into an inner layer, and making a high-melting-point metal layer into an outer layer. Such 1st, 2nd soluble conductors 17 and 19 can be formed by forming a high-melting-point metal layer into a film on low-melting-point metal foil using a plating technique, Or another well-known lamination technique and film formation technique are used. can also be formed. Moreover, the 1st, 2nd soluble conductors 17 and 19 make a high-melting-point metal layer into an inner layer, and may make a low-melting-point metal layer into an outer layer, and may comprise it, and a low-melting-point metal layer and a high-melting-point metal layer were laminated|stacked alternately. It is good also as the above multilayer structure.

In addition, the 1st, 2nd soluble conductors 17 and 19 are connected using solder etc. on the 1st and 2nd electrodes 11 and 12, and on the 4th and 5th electrodes 14 and 15, have. Moreover, when applying the 1st circuit 2 to a digital signal circuit, it is preferable as an outer layer of the 1st soluble conductor 17 to form the favorable silver plating layer of a high frequency characteristic. Thereby, while the 1st soluble conductor 17 aims at the low resistance by surface effect, and improves a high frequency characteristic, even when an instantaneous large current flows, it flows through the silver plating layer which is an outer layer, and to prevent melting by self-heating Pulse resistance can be improved.

[Pre-melting of the first soluble conductor]

Here, the interruption|blocking element 1 is formed so that the 1st soluble conductor 17 of the 1st circuit 2 may cut by melting earlier than the 2nd soluble conductor 19 of the 2nd circuit 3 . It is because when the 2nd soluble conductor 19 is melt-cut before the 1st soluble conductor 17, electric power to the heat generating body 18 will be stopped and it will become impossible to cut the 1st soluble conductor 17 by melting.

Then, the interruption|blocking element 1 is formed so that when the heat generating body 18 heat|fever-generates, the 1st soluble conductor 17 may be cut by melting first. Concretely, the 1st soluble conductor 17 of the interruption|blocking element 1 is mounted in the position close|similar to the heat generating center of the heat generating body 18 rather than the 2nd soluble conductor 19.

Here, the heat generating center of the heat generating element 18 means the area|region which becomes the highest temperature in the stage of the initial stage of heat generation among the heat distributions expressed by the heat generating body 18 generating heat|fever. The heat emitted from the heating element 18 has the largest amount of heat dissipated from the insulating substrate 10, and when the insulating substrate 10 is formed of a ceramic material that is excellent in thermal shock resistance but also has high thermal conductivity, the insulating substrate 10 heat is diffused through Therefore, in the initial stage of heat generation when energization is started, the center furthest from the outer edge in contact with the insulating substrate 10 is the hottest, and the heat dissipates toward the outer edge in contact with the insulating substrate 10, and the temperature does not climb well.

Then, the interruption|blocking element 1 mounts the 1st soluble conductor 17 in the position close|similar to the heat generating center which becomes the highest temperature in the heat generation initial stage of the heat generating body 18 rather than the 2nd soluble conductor 19. 2 Heat is transferred faster than the fusible conductor (19), so that it is fused. Since the 2nd soluble conductor 19 is heated later than the 1st soluble conductor 17, after the 1st soluble conductor 17 cuts by melting, it is cut by melting.

Moreover, the interruption|blocking element 1 may make the 1st soluble conductor 17 cut by melting first by changing the shape of the 1st, 2nd soluble conductors 17 and 19. For example, the 1st, 2nd soluble conductors 17 and 19 are, so that melting becomes easy, so that a cross-sectional area is small, Therefore, the interruption|blocking element 1 uses the cross-sectional area of the 1st soluble conductor 17 as a 2nd soluble conductor ( By making it smaller than the cross-sectional area of 19), it can cut by melting earlier than the 2nd soluble conductor 19.

Moreover, the interruption|blocking element 1 forms the 1st soluble conductor 17 along the current path between the 1st, 2nd electrodes 11 and 12 narrowly and long, and forms the 2nd soluble conductor 19 The width may be wide and short along the current path between the fourth and fifth electrodes 14 and 15 . Thereby, the 1st soluble conductor 17 becomes the shape cut relatively well rather than the 2nd soluble conductor 19, and by heat_generation|fever of the heat generating body 18, it cuts before the 2nd soluble conductor 19.

Moreover, you may form the interruption|blocking element 1 as a material of the 1st soluble conductor 17 with a thing with melting|fusing point lower than the material of the 2nd soluble conductor 19. As shown in FIG. Also by this, by heat_generation|fever of the heat generating body 18, the 1st soluble conductor 17 is cut more easily than the 2nd soluble conductor 19, and the 1st soluble conductor 17 is surely more than the 2nd soluble conductor 19 You can cut it first.

In addition, the interruption|blocking element 1 forms a difference in melting|fusing point by changing the layer structure of the 1st soluble conductor 17 and the 2nd soluble conductor 19, Relatively the 1st soluble conductor 17 2nd You may make it melt-cut more easily than the soluble conductor 19, and by heat_generation|fever of the heat generating body 18, you may make it melt-cut the 1st soluble conductor 17 before the 2nd soluble conductor 19.

[etc]

Moreover, in order to improve the wettability at the time of the oxidation prevention of the 1st, 2nd soluble conductors 17 and 19, and melting of the 1st, 2nd soluble conductors 17 and 19, a 1st, 2nd soluble conductor A flux 22 is applied on (17, 19).

Moreover, the inside of the interruption|blocking element 1 is protected by the insulating substrate 10 being covered with the cover member 23. As shown in FIG. The cover member 23 is formed similarly to the said insulated substrate 10 using the member which has insulating properties, such as a thermoplastic plastics, ceramics, and a glass epoxy board|substrate, for example.

[Circuit configuration]

Next, the circuit structure of the interruption|blocking element 1 is demonstrated. The circuit diagram of the interruption|blocking element 1 is shown in FIG. An example of the interruption|blocking element circuit 30 to which the interruption|blocking element 1 was applied in FIG. 3 is shown. The interruption|blocking element 1 has the 1st circuit 2 formed by the 1st electrode 11 and the 2nd electrode 12 continuing through the 1st soluble conductor 17. As shown in FIG. The first circuit 2 is attached in series to various external circuits 31 such as a power supply circuit and a digital signal circuit by being connected in series on a current path of a circuit board on which the interrupting element 1 is mounted.

Moreover, the interruption|blocking element 1 has the 2nd circuit 3 by which the heat generating body 18 and the 2nd soluble conductor 19 were serially connected via the 4th electrode 14. The second circuit 3 is electrically independent of the first circuit 2 and thermally connectable. The heat generating element 18 has one end connected to the third electrode 13 and the other end connected to the fourth electrode 14 . Moreover, the 2nd soluble conductor 19 is mounted between the 4th electrode 14 and the 5th electrode 15. As shown in FIG. The third electrode 13 is connected to a current control element 25 that controls power supply to the second circuit 3 via an external connection terminal, and the fifth electrode 15 is connected via an external connection terminal. It is connected to the external power supply 26 .

The current control element 25 is a switch element that controls the power supply to the second circuit 3, is constituted by, for example, FET, and determines whether electrical and physical interruption of the first circuit 2 is required. It is connected to the detection circuit 27 which detects. The detection circuit 27 is a circuit which detects a situation in which it is necessary to cut off various circuits to which the first circuit 2 of the interruption element 1 is mounted, for example, in an abnormal voltage of a battery pack or a network communication device. The current control element 25 is operated when it is necessary to physically and irreversibly cut off the current path by blocking the first circuit 2, such as hacking or cracking of the software, or expiration of the license period of the software, etc. make it

Thereby, the electric power of the external power supply 26 is supplied to the 2nd circuit 3, and the 1st soluble conductor 17 is fusion-cut by the heat generating body 18 heat_generation|fever (FIG.4(A)(B)(C)) . The molten conductor of the 1st soluble conductor 17 is attracted|attracted on the 1st electrode 11 and the 2nd electrode 12 with high wettability. Therefore, the 1st soluble conductor 17 can interrupt the 1st circuit 2 reliably. Moreover, since the 1st soluble conductor 17 is cut by melting earlier than the 2nd soluble conductor 19, the 2nd circuit 3 supplies electricity to the heat generating body 18 reliably until the 1st circuit 2 is interrupted|blocked. Thus, it can generate heat.

Although the heat generating body 18 continues heat_generation|fever even after the melting of the 1st soluble conductor 17, when the 2nd soluble conductor 19 is also cut by melting following the 1st soluble conductor 17, the 2nd circuit 3 is also interrupted|blocked (Fig. 5(A)(B)(C)). Thereby, power supply to the heat generating element 18 is also stopped.

According to such an interruption|blocking element 1 and the interruption|blocking element circuit 30, the 1st circuit 2 attached to the external circuit 31, and the 2nd circuit 3 which interrupt|blocks a 1st circuit are electrically independent. Since it is made, the electric power which acquires the calorific value sufficient to melt the 1st soluble conductor 17 with respect to the heat generating body 18 can be supplied irrespective of the kind of the external circuit 31. Therefore, according to the blocking element 1 and the blocking element circuit 30, as the external circuit 31 to which the first circuit 2 is mounted, it can also be applied to a digital signal circuit through which a weak current flows.

For example, as shown in Fig. 6(A), the blocking element 1 and the blocking element circuit 30 connect the first circuit 2 to the data server 33 and the Internet line for the purpose of information security. (34), when hacking or cracking is detected by the detection circuit 27, the signal line is physically and irreversibly cut off by cutting off the first circuit 2, as shown in Fig. 6(B). By disconnecting from the Internet line 34, leakage of information can be prevented.

In addition, the blocking element 1 and the blocking element circuit 30 may be applied to revocation of physical license authentication of a device, to stop a function of a device remodeling action as a PL (Product Liability) countermeasure, and the like.

Moreover, according to the interruption|blocking element 1 and the interruption|blocking element circuit 30, since the 2nd circuit 3 is formed electrically independent of the 1st circuit 2, the electric current which controls the electric power supply to the heat generating element 18. The control element 25 can be selected according to the rating of the heating element 18 irrespective of the rating of the first circuit 2, and can be manufactured more inexpensively.

[Second form]

The blocking element forms the heating element 18 on the surface 10a in which the 1st - 5th electrodes 11-15 of the insulated substrate 10 are formed, as shown in FIG. 1, The 1st and 1st In addition to overlapping the 2 electrodes 11 and 12 and the 4th and 5th electrodes 14 and 15, as shown in FIG. 7, the 1st - 5th electrodes 11-15 of the insulated substrate 10 You may form in the back surface 10b on the opposite side to this formed surface 10a. Fig. 7(A) is a plan view of the blocking element 40 in which the heating element 18 is formed on the back surface of the insulating substrate 10, and Fig. 7(B) is a cross-sectional view taken along line A-A'. In addition, about the same member as the interruption|blocking element 1 mentioned above, the same code|symbol is attached|subjected and the detail is abbreviate|omitted.

The blocking element 40 is also formed at one end of the third electrode 13 and the fourth electrode 14 on the back surface 10b side of the insulating substrate 10 . The other end of the 4th electrode 14 is formed in the surface 10a of the insulating substrate 10, and the 2nd soluble conductor 19 is mounted between the 5th electrode 15. One end and the other end of the fourth electrode 14 are continuous through a through hole 20 .

The blocking element 40 forms the heating element 18 on the back surface 10b of the insulated substrate 10 so that the surface 10a of the insulated substrate 10 becomes flat, and the first and second electrodes 11 and 12 ) or the other end side of the fourth electrode 14 and the fifth electrode 15 can be formed by a simple process. Moreover, in this case, the insulating member 21 is formed on the heat generating body 18, and while aiming at the protection of the heat generating body 18, the insulation at the time of mounting of the interruption|blocking element 1 can be ensured.

Moreover, at this time, the heat generating body 18 and the 1st and 2nd electrodes 11 and 12 are superimposed, and the 1st soluble conductor 17 is closer to the heat generating center of the heat generating body 18 than the 2nd soluble conductor 19. It is preferable to place it in position. Moreover, you may make the heat generating body 18 and the 4th and 5th electrodes 14 and 15 overlap, and you may make it transmit the heat|fever of the heat generating body 18 also to the 2nd soluble conductor 19 efficiently.

[Third form]

Moreover, the interruption|blocking element may form the heat generating body 18 inside the insulated substrate 10, as shown in FIG. Fig. 8(A) is a plan view of the blocking element 50 in which the heating element 18 is formed inside the insulating substrate 10, and Fig. 8(B) is a cross-sectional view taken along line A-A'. In addition, about the same member as the interruption|blocking element 1 mentioned above, the same code|symbol is attached|subjected and the detail is abbreviate|omitted.

The blocking element 50 is, for example, when the insulating substrate 10 is formed of a ceramic material, after forming one end of the heating element 18 , the third electrode 13 , and the fourth electrode 14 on the surface By laminating the ceramic material further, the insulating substrate 10 in which the heating element 18 is formed can be obtained. Each end of the 3rd electrode 13 and the 4th electrode 14 is connected with the other end formed in the front surface 10a or the back surface 10b of the insulating substrate 10 via the through-hole 20, respectively.

As for the shielding element 50, also by forming the heat generating body 18 inside the insulating substrate 10, the surface 10a of the insulating substrate 10 becomes flat, and the 1st and 2nd electrodes 11 and 12 and , the other end side of the fourth electrode 14 and the fifth electrode 15 can be formed by a simple process. Moreover, in the interruption|blocking element 50, since the heat generating body 18 is formed in the inside of the insulating substrate 10, it is not necessary to form the insulating member 21. As shown in FIG.

Moreover, at this time, the heat generating body 18 and the 1st and 2nd electrodes 11 and 12 are superimposed, and the 1st soluble conductor 17 is closer to the heat generating center of the heat generating body 18 than the 2nd soluble conductor 19. It is preferable to place it in position. Moreover, you may make the heat generating body 18 and the 4th and 5th electrodes 14 and 15 overlap, and you may make it transmit the heat|fever of the heat generating body 18 also to the 2nd soluble conductor 19 efficiently.

[4th form]

Moreover, as shown in FIG. 9, the interruption|blocking element 1 is the 1st and 2nd electrodes 11 and 12, and the heat generating body 18 on the surface 10a of the insulating substrate 10. You may form in parallel with the 4th and 5th electrodes 14 and 15. 9(A) is a block diagram in which a heating element 18 is formed on the surface of the insulating substrate 10 in parallel with the first and second electrodes 11 and 12 and the fourth and fifth electrodes 14 and 15. It is a top view of the element 60, and FIG.9(B) is AA' sectional drawing. In addition, about the same member as the interruption|blocking element 1 mentioned above, the same code|symbol is attached|subjected and the detail is abbreviate|omitted.

It is preferable that the interruption|blocking element 60 arrange|positions the 1st soluble conductor 17 near the heat generating center of the heat generating body 18 rather than the 2nd soluble conductor 19. Moreover, as shown to FIG.10(A)(B), only the 1st and 2nd electrodes 11 and 12 are superimposed on the heat generating body 18 top via the insulating member 21, and the 1st soluble conductor 17 ) may be disposed overlapping only on the heating element 18 . Thereby, the 1st soluble conductor 17 can be arrange|positioned at the position close|similar to the heat generating body 18 rather than the 2nd soluble conductor 19, and can be cut by melting earlier than the 2nd soluble conductor 19.

[First, Second Soluble Conductor]

As mentioned above, any or all of the 1st, 2nd soluble conductors 17 and 19 may contain a low-melting-point metal and a high-melting-point metal. At this time, as for the 1st, 2nd soluble conductors 17 and 19, the high-melting-point metal layer 40 which consists of Ag, Cu, an alloy etc. which has these as a main component as an inner layer as an inner layer, as shown to FIG. 11(A) is formed, and As an outer layer, you may use the soluble conductor in which the low-melting-point metal layer 41 which consists of Pb-free solder etc. which has Sn as a main component was formed. In this case, the 1st, 2nd soluble conductors 17 and 19 are good also as a structure in which the whole surface of the high melting-point metal layer 40 was coat|covered with the low-melting-point metal layer 41, A pair of mutually opposing side surfaces It may be a covered structure except for it. The coating structure by the high-melting-point metal layer 40 or the low-melting-point metal layer 41 can be formed using well-known film-forming techniques, such as plating.

Moreover, as shown to FIG.11(B), as for the 1st, 2nd soluble conductors 17 and 19, the soluble conductor in which the low-melting-point metal layer 41 was formed as an inner layer, and the high-melting-point metal layer 40 was formed as an outer layer. may be used. Also in this case, as for the 1st, 2nd soluble conductors 17 and 19, the whole surface of the low-melting-point metal layer 41 is good also as a structure coat|covered with the high-melting-point metal layer 40, A pair of mutually opposing side surfaces It may be of a coated structure except for

Moreover, as shown in FIG. 12, the 1st, 2nd soluble conductors 17 and 19 are good also as a laminated structure in which the high-melting-point metal layer 40 and the low-melting-point metal layer 41 were laminated|stacked.

In this case, the 1st, 2nd soluble conductors 17 and 19 are 1st, 2nd electrodes 11 and 12, and 4th, 5th electrodes 14 and 15, as shown to FIG. 12(A). It is formed as a two-layer structure consisting of a lower layer mounted on and an upper layer laminated on the lower layer, and a low-melting-point metal layer 41 serving as an upper layer may be laminated on the upper surface of the high-melting-point metal layer 40 serving as the lower layer, and vice versa. You may laminate|stack the high-melting-point metal layer 40 used as an upper layer on the upper surface of the low-melting-point metal layer 41. As shown in FIG. Or the 1st, 2nd soluble conductors 17 and 19 may be formed as 3 layer structure which consists of an inner layer and the outer layer laminated|stacked on the upper and lower surfaces of an inner layer, as shown to FIG.12(B), The high melting point used as an inner layer A low-melting-point metal layer 41 serving as an outer layer may be laminated on the upper and lower surfaces of the metal layer 40, or a high-melting-point metal layer 40 serving as an outer layer may be laminated on the upper and lower surfaces of the low-melting-point metal layer 41 serving as an inner layer.

Moreover, as shown in FIG. 13, the 1st, 2nd soluble conductors 17 and 19 are good also as a multilayer structure of 4 or more layers in which the high-melting-point metal layer 40 and the low-melting-point metal layer 41 were laminated|stacked alternately. In this case, the 1st, 2nd soluble conductors 17 and 19 are good also as a structure covered with the metal layer which comprises outermost layer except the whole surface or a pair of mutually opposing side surfaces.

Moreover, the 1st, 2nd soluble conductors 17 and 19 may laminate|stack the high-melting-point metal layer 40 in stripe shape partially on the surface of the low-melting-point metal layer 41 which comprises an inner layer. 14 : is a top view of the 1st, 2nd soluble conductors 17 and 19. FIG.

The 1st, 2nd soluble conductors 17 and 19 shown to FIG. 14(A) are a predetermined space|interval in the width direction on the surface of the low-melting-point metal layer 41, and the linear high-melting-point metal layer 40 is a longitudinal direction. By forming two or more, the linear opening part 42 is formed along the longitudinal direction, and the low-melting-point metal layer 41 is exposed from this opening part 42. As shown in FIG. As for the 1st, 2nd soluble conductors 17 and 19, when the low melting-point metal layer 41 is exposed from the opening part 42, the contact area of the molten low-melting-point metal and high-melting-point metal increases, and the high-melting-point metal layer 40 ) can further accelerate the erosion action of the ) to improve the fusing ability. The opening 42 can be formed by, for example, performing partial plating of the metal constituting the high-melting-point metal layer 40 to the low-melting-point metal layer 41 .

Moreover, as shown to FIG. 14(B), the 1st, 2nd soluble conductors 17 and 19 are the predetermined space|interval in the longitudinal direction on the surface of the low-melting-point metal layer 41, The linear high-melting-point metal layer 40 ), you may form the linear opening part 42 along the width direction by forming two or more in the width direction.

Moreover, while the 1st, 2nd soluble conductors 17 and 19 form the high-melting-point metal layer 40 in the surface of the low-melting-point metal layer 41 as shown in FIG. 15, high-melting-point metal layer 40 A circular opening 43 is formed over the entire surface of the , and the low-melting-point metal layer 41 may be exposed through the opening 43 . The opening 43 can be formed by, for example, performing partial plating of the metal constituting the high-melting-point metal layer 40 to the low-melting-point metal layer 41 .

As for the 1st, 2nd soluble conductors 17 and 19, when the low melting-point metal layer 41 is exposed from the opening part 43, the contact area of the molten low-melting-point metal and high-melting-point metal increases, and the erosion action of a high-melting-point metal can be further promoted to improve the fusing property.

Moreover, as shown in FIG. 16, the 1st, 2nd soluble conductors 17 and 19 form many opening parts 44 in the high melting point metal layer 40 used as an inner layer, This high melting point metal layer 40 Then, the low-melting-point metal layer 41 may be formed into a film using a plating technique or the like, and may be filled in the opening portion 44 . Thereby, as for the 1st, 2nd soluble conductors 17 and 19, since the area in which the low-melting-point metal which melts contacts a high-melting-point metal increases, a low-melting-point metal can corrode a high-melting-point metal in a shorter time.

Moreover, it is preferable that the 1st, 2nd soluble conductors 17 and 19 form the volume of the low-melting-point metal layer 41 more than the volume of the high-melting-point metal layer 40. As shown in FIG. When the 1st, 2nd soluble conductors 17 and 19 are heated by the heat generating body 18, a low-melting-point metal melts, and a high-melting-point metal is corroded, and thereby, it can melt|melt and melt|fuse rapidly. Therefore, the 1st, 2nd soluble conductors 17 and 19 promote this erosion action by forming the volume of the low-melting-point metal layer 41 more than the volume of the high-melting-point metal layer 40, The 1st, Blocking between the second electrodes 11 and 12 and blocking between the fourth and fifth electrodes 14 and 15 can be implemented.

1, 40, 50, 60: blocking element
2: first circuit
3: second circuit
10: insulated substrate
10a: surface
10b: back side
11: first electrode
12: second electrode
13: third electrode
14: fourth electrode
15: fifth electrode
17: first soluble conductor
18: heating element
19: second soluble conductor
20: through hole
21: insulation member
22 : flux
23: cover member
25: current control element
26: external power
27: detection circuit
30: blocking element circuit
31: external circuit
33: data server
34: Internet line
40: high melting point metal layer
41: low melting point metal layer
42 to 44: opening

Claims (23)

an insulated substrate;
first and second electrodes formed on the insulating substrate and constituting a first circuit;
third to fifth electrodes formed on the insulating substrate and constituting a second circuit formed electrically independent of the first circuit;
a first soluble conductor mounted between the first and second electrodes;
a heating element connected between the third and fourth electrodes;
a second soluble conductor mounted between the fourth and fifth electrodes;
The interruption|blocking element which cuts a said 2nd soluble conductor by melting by melting by the heat which the said heat generating body heat|fever by passing an electric current between said 3rd - 5th electrode by melting by melting. The method of claim 1,
The said 1st soluble conductor is mounted in the position close|similar to the heat_generation|fever center of the said heat generating body rather than the said 2nd soluble conductor, The interruption|blocking element. 3. The method according to claim 1 or 2,
The cross-sectional area of a said 1st soluble conductor is smaller than the cross-sectional area of a said 2nd soluble conductor, The interruption|blocking element. 3. The method according to claim 1 or 2,
The length of a said 1st soluble conductor is longer than the length of a said 2nd soluble conductor, The interruption|blocking element. 3. The method according to claim 1 or 2,
The interruption|blocking element whose melting|fusing point of a said 1st soluble conductor is lower than melting|fusing point of a said 2nd soluble conductor. The method of claim 1,
An insulating layer is provided on the surface of the surface of the insulating substrate on which the first to fifth electrodes are formed,
The said heating element is formed between the said insulating substrate and the said insulating layer, or the inside of the said insulating layer, The interruption|blocking element. The method of claim 1,
The first to fifth electrodes are formed on the surface of the insulating substrate,
The said heating element is formed in the surface on the opposite side to the said surface of the said insulating substrate, The interruption|blocking element. The method of claim 1,
The said heating element is formed in the inside of the said insulating substrate, The interruption|blocking element. 7. The method of claim 6,
The heating element may overlap the first and second electrodes with the insulating layer or the insulating substrate interposed therebetween. 10. The method of claim 9,
The heating element may overlap the fourth and fifth electrodes with the insulating layer or the insulating substrate interposed therebetween. 3. The method according to claim 1 or 2,
An insulating layer is provided on the surface of the surface of the insulating substrate on which the first to fifth electrodes are formed,
The said heating element is formed between the said insulating substrate and the said insulating layer, and the said 1st and 2nd electrode, and the said 4th and 5th electrode are formed side by side, The blocking element. 9. The method of any one of claims 1, 2, and 6 to 8,
The said 1st soluble conductor and/or the said 2nd soluble conductor is a Pb-free solder which has Sn as a main component, The interruption|blocking element. 9. The method of any one of claims 1, 2, and 6 to 8,
A said 1st soluble conductor and/or a said 2nd soluble conductor contains a low-melting-point metal and a high-melting-point metal,
The blocking element, wherein the low-melting-point metal is melted by heating from the heating element, and erodes the high-melting-point metal. 14. The method of claim 13,
The low melting point metal is solder,
The high-melting-point metal is Ag, Cu, or an alloy containing Ag or Cu as a main component, the blocking element. 14. The method of claim 13,
As for the said 1st soluble conductor and/or the said 2nd soluble conductor, an inner layer is a high-melting-point metal, and the shielding element whose outer layer is a covering structure of a low-melting-point metal. 14. The method of claim 13,
The said 1st soluble conductor and/or the said 2nd soluble conductor is a shielding element whose inner layer is a low-melting-point metal, and the outer layer is a covering structure of a high-melting-point metal. 14. The method of claim 13,
The said 1st soluble conductor and/or the said 2nd soluble conductor is a laminated structure in which the low-melting-point metal and the high-melting-point metal were laminated|stacked, the interruption|blocking element. 14. The method of claim 13,
The said 1st soluble conductor and/or the said 2nd soluble conductor is a multilayer structure of 4 or more layers in which the low-melting-point metal and the high-melting-point metal were laminated|stacked alternately, the interruption|blocking element. 14. The method of claim 13,
As for the said 1st soluble conductor and/or the said 2nd soluble conductor, the opening part is formed in the high-melting-point metal formed in the surface of the low-melting-point metal which comprises an inner layer, The interruption|blocking element. 14. The method of claim 13,
The first soluble conductor and/or the second soluble conductor has a high-melting-point metal layer having a plurality of openings, and a low-melting-point metal layer formed on the high-melting-point metal layer, wherein the opening is filled with a low-melting-point metal. device. 14. The method of claim 13,
As for the said 1st soluble conductor and/or the said 2nd soluble conductor, the volume of a low-melting-point metal is larger than the volume of a high-melting-point metal, The interruption|blocking element. a first circuit having a first soluble conductor;
a second circuit formed electrically independent of the first circuit and having a heating element and a second soluble conductor connected to one end of the heating element;
A cut-off element circuit that cuts the second soluble conductor by melting the first soluble conductor by melting the first soluble conductor by the heat generated by the heating element by passing a current through the second circuit, and then cutting the second soluble conductor by melting. 23. The method of claim 22,
In the second circuit, the heating element and the second soluble conductor are connected to a power source and a switch element, and a current flows by driving the switch element.

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