KR102274347B1 - Lithography apparatus and article manufacturing method - Google Patents

Abstract

An advantageous technique is provided for reducing the difference in internal temperature between a plurality of treatments. A plurality of processing units each performing a process of forming a pattern on a substrate, a conveying unit conveying a substrate to each of the plurality of processing units, and a control unit for controlling an internal temperature of each of the plurality of processing units, the control unit comprising: The conveying unit has a temperature sensor provided in a portion inserted into the processing unit when the substrate is conveyed to each of the plurality of processing units, and the control unit includes a temperature sensor obtained at the time of conveying the substrate by the conveying unit. Based on the detection result, the internal temperature of each of the plurality of processing units is controlled so that the difference in internal temperature between the plurality of processing units is reduced.

Description

Lithographic apparatus and method of manufacturing an article {LITHOGRAPHY APPARATUS AND ARTICLE MANUFACTURING METHOD}

The present invention relates to a lithographic apparatus and a method of manufacturing an article.

In order to improve productivity, a lithographic apparatus used for manufacturing a semiconductor device or the like has a so-called cluster type having a plurality of processing units that perform a process for forming a pattern on a substrate (see Patent Document 1).

Japanese Patent Laid-Open No. 2011-210992

In a cluster type lithographic apparatus, when a difference in internal temperature occurs between a plurality of processing units, a difference occurs in thermal deformation of the substrate due to the difference in the internal temperature, so that the precision of forming a pattern on the substrate may differ between the plurality of processing units. have.

Therefore, an object of the present invention is to provide an advantageous technique for reducing the difference in internal temperature between a plurality of processing units.

In order to achieve the above object, a lithographic apparatus as one aspect of the present invention includes: a plurality of processing units each performing a process for forming a pattern on a substrate; a conveying unit conveying a substrate to each of the plurality of processing units; a control unit for controlling an internal temperature of each processing unit, wherein the conveying unit has a temperature sensor installed in a portion inserted into the processing unit when the substrate is conveyed to each of the plurality of processing units; controls the internal temperature of each of the plurality of processing units such that a difference in internal temperature between the plurality of processing units is reduced based on a detection result of the temperature sensor obtained when the substrate is conveyed by the conveying unit. characterized in that

Another object or other aspect of the present invention will be clarified by preferred embodiments described below with reference to the accompanying drawings.

According to the present invention, it is possible to provide an advantageous technique for, for example, reducing the difference in internal temperature between a plurality of treatments.

1 is a schematic diagram showing an imprint apparatus according to a first embodiment.
Fig. 2 is a diagram showing the configuration of a processing unit.
Fig. 3 is a diagram showing a state in which the substrate is transferred onto the substrate stage by the transfer unit.
4 is a flowchart showing a method of controlling the internal temperature of each processing unit.
5 is a schematic diagram showing an imprint apparatus according to a third embodiment.
6 is a diagram illustrating a method for manufacturing an article.

EMBODIMENT OF THE INVENTION Hereinafter, with reference to an accompanying drawing, preferred embodiment of this invention is described. In addition, in each figure, about the same member thru|or element, the same reference number is attached|subjected, and overlapping description is abbreviate|omitted. In addition, in the following embodiment, although the imprint apparatus which forms the pattern of an imprint material on a board|substrate using a mold as a lithographic apparatus is used and demonstrated, it is not limited to this. For example, the present invention can also be applied to a lithographic apparatus such as an exposure apparatus that exposes a substrate to transfer a pattern of a mask onto the substrate, or a drawing apparatus that forms a pattern on the substrate by irradiating the substrate with a charged particle beam. .

The imprint apparatus is an apparatus for forming a pattern of a cured product onto which the concavo-convex pattern of the die is transferred by bringing the imprint material supplied on a substrate into contact with a die and applying curing energy to the imprint material. That is, the imprint apparatus is used for manufacturing a semiconductor device or the like, and performs an imprint process for forming a pattern on an imprint material supplied on a substrate by using a mold in which an uneven pattern is formed. For example, the imprint apparatus hardens the imprint material in a state in which the mold on which the pattern is formed is brought into contact with the imprint material on the substrate. Then, the imprint apparatus can form a pattern on the imprint material by widening the distance between the mold and the substrate and peeling (release) the mold from the cured imprint material.

As the imprint material, a curable composition (sometimes referred to as uncured resin) that is cured by applying curing energy is used. As the curing energy, electromagnetic waves, heat, and the like are used. As an electromagnetic wave, the wavelength is light, such as infrared rays, a visible light, and an ultraviolet-ray, selected from the range of 10 nm or more and 1 mm or less, for example.

A curable composition is a composition hardened|cured by irradiation of light or by heating. Among these, the photocurable composition hardened|cured by light contains a polymeric compound and a photoinitiator at least, and may contain a nonpolymerizable compound or a solvent as needed. The nonpolymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal addition type mold release agent, a surfactant, an antioxidant, and a polymer component.

The imprint material is applied in the form of a film onto the substrate by a spin coater or a slit coater. Alternatively, the liquid jet head may give a droplet shape or an island shape or a film shape formed by connecting a plurality of droplets to be provided on the substrate. The viscosity of the imprint material (viscosity at 25°C) is, for example, 1 mPa·s or more and 100 mPa·s or less.

<First embodiment>

The imprint apparatus 100 of the first embodiment according to the present invention will be described. The imprint apparatus 100 of the present embodiment is a so-called cluster type imprint apparatus having a plurality of processing units 10 that respectively perform imprint processing. 1 is a schematic diagram showing an imprint apparatus 100 of the present embodiment. The imprint apparatus 100 includes, for example, a plurality of processing units 10 (six processing units 10a to 10f in FIG. 1 ), a second processing unit 20 (pre-processing unit), a conveying unit 30 , A control unit 40 may be included.

Each of the plurality of processing units 10 performs an imprint process for forming a pattern of the imprint material 3 on the substrate using the mold 1 . The configuration of the processing unit 10 will be described later. The second processing unit 20 pre-processes the substrate 2 on which the imprint processing is performed. The pre-processing performed in the second processing unit 20 may include, for example, a process of forming an adhesion layer on the substrate for improving adhesion between the substrate 2 and the imprint material 3 supplied thereon. The conveyance unit 30 conveys the substrate 2 pre-processed by the second processing unit 20 to each of the plurality of processing units 10 . The transfer unit 30 includes, for example, a hand 31 holding the substrate 2 , a transfer path 32 on which the hand 31 moves, and a temperature control unit ( ) for temperature-regulating the transfer path 32 . 33) may be included. The temperature control unit 33 temperature-regulates the conveyance path 32 by, for example, flowing the temperature-controlled gas into the conveyance path 32 . The control unit 40 is constituted by, for example, a computer having a CPU or a memory, and controls each unit of the imprint apparatus 100 .

Next, the structure of the processing part 10 is demonstrated, referring FIG. 2 is a schematic diagram showing the configuration of one processing unit 10 . The processing unit 10 includes, for example, an imprint head 11 , a substrate stage 12 , a curing unit 13 , a measurement unit 14 , and a supply unit 15 , and uses the mold 1 . Thus, an imprint process for forming a pattern of the imprint material 3 on the substrate is performed.

The mold 1 is usually made of a material capable of transmitting ultraviolet rays such as quartz, and in a part of the surface on the substrate side (pattern region 1a), the imprint material 3 supplied on the substrate is applied. An uneven pattern for transferring is formed. As the substrate 2, glass, ceramics, metal, semiconductor, resin, or the like is used, and a member made of a material different from that of the substrate may be formed on the surface thereof if necessary. As the substrate 2, specifically, a silicon wafer, a compound semiconductor wafer, quartz glass, etc. are mentioned. In addition, before provision of the imprint material, if necessary, an adhesion layer may be formed in order to improve the adhesion between the imprint material and the substrate.

The imprint head 11 holds the mold 1 by vacuum suction force or the like, and drives the mold 1 in the Z direction so as to bring the mold 1 into contact with or peel off the imprint material 3 on the substrate. . The substrate stage 12 is configured to be movable on the surface plate 16 while holding the substrate 2 . Specifically, the substrate stage 12 includes a chuck 12a that holds the substrate 2 by vacuum suction force or the like, and a movement that mechanically holds the chuck 12a and moves the top of the platen 16 in the XY direction. It may include a portion 12b. The hardening part 13 irradiates light (for example, ultraviolet rays) to the imprint material 3 in a state where the mold 1 and the imprint material 3 on the substrate are in contact, and the imprint material 3 is formed. harden The measurement unit 14 detects the mark provided on the mold 1 and the mark provided on the substrate 2 , and measures the relative position between the pattern region 1a of the mold 1 and the shot region of the substrate 2 . . The supply unit 15 supplies (discharges) the imprint material accommodated in the tank 15a onto the substrate.

Further, in the processing unit 10 , the imprint head 11 , the substrate stage 12 , the curing unit 13 , the measuring unit 14 , and the supply unit 15 are accommodated in the chamber 17 , and the control unit 40 . ), the internal temperature of the chamber 17 (the internal temperature of the processing unit 10) is controlled. For example, the processing unit 10 may include temperature sensors 18a and 18b (second temperature sensor) for detecting the internal temperature of the chamber 17 , and supplying a temperature-controlled gas to the inside of the chamber 17 . It may include a temperature control unit (19a, 19b) for adjusting the internal temperature of (17). And, based on the detection result of the temperature sensor 18a, the control part 40 controls the temperature control part 19a so that the internal temperature of the chamber 17 may become a target temperature. Similarly, based on the detection result of the temperature sensor 18b, the control part 40 controls the temperature control part 19b so that the internal temperature of the chamber 17 may become a target temperature.

In such a processing unit 10, in order to form the pattern of the mold 1 on the imprint material 3 on the substrate with high precision, it is preferable to control the internal temperature of the chamber 17 with high precision. For example, when a silicon wafer is used as the substrate 2, since the coefficient of linear expansion of the silicon wafer is 2.6 µm/mK, when the temperature of the substrate 2 changes by 0.01°C, the wafer with a diameter of 300 mm is heated by 7.8 nm. will transform In recent years, when precision of several nm is required in a wafer process, even when such a minute thermal deformation of the substrate occurs, the required precision for forming a pattern on the substrate may not be satisfied. Therefore, in the processing unit 10, as the temperature sensors 18a and 18b, for example, a high-precision temperature sensor having a resolution of about 0.01°C can be used.

However, in a high-precision temperature sensor having a resolution of about 0.01°C, a change with time of about 0.01°C/year may occur, and this change with time may be different for each temperature sensor. That is, in the cluster type imprint apparatus 100 having the plurality of processing units 10 , the temporal change of the temperature sensor is different between the plurality of processing units, and a difference in internal temperature occurs between the plurality of processing units. When a difference in internal temperature occurs between the plurality of processing units in this way, a difference occurs in the thermal deformation of the substrate due to the difference in the internal temperature, and the precision of forming a pattern on the substrate differs between the plurality of processing units. In addition, it is complicated to calibrate the temperature sensors in each of the plurality of processing units 10 because the number of temperature sensors is large, and since it is necessary to stop the imprint process at the time of calibration of the temperature sensors, it is also in terms of productivity. can be detrimental Therefore, the transfer unit 30 in the imprint apparatus 100 of the present embodiment is located at a portion inserted into the processing unit 10 when the substrate 2 is conveyed to each of the plurality of processing units 10 . It has a temperature sensor 34 installed. Then, based on the detection result of the temperature sensor 34 obtained at the time of conveying the substrate 2 by the conveying unit 30 , the control unit 40 is configured to reduce the difference in internal temperature between the plurality of processing units. Controls the internal temperature in each of the processing units 10 of

Hereinafter, in the imprint apparatus 100 of this embodiment, the method of controlling the internal temperature in each of the some processing part 10 is demonstrated. Here, the detection result of the temperature sensor 34 obtained when the substrate 2 is transferred by the transfer unit 30 on the substrate stage 12 arranged at the transfer position of the substrate 2 in the processing unit. Based on , an example of controlling the internal temperature of each processing unit 10 will be described. FIG. 3 is a diagram showing a state in which the substrate 2 is transferred onto the substrate stage 12 by the transfer unit 30 . Fig. 3(a) is a view of the state viewed from above (Z direction), and Fig. 3(b) is a view of the state viewed from the side (-X direction).

The transfer unit 30 holds the substrate 2 preprocessed by the second processing unit 20 in the hand 31, and the hand 31 in front of the processing unit 10 to transfer (carry in) the substrate 2 ) is moved along the conveying path 32 . Then, as shown in FIG. 3 , the transfer unit 30 inserts the hand 31 holding the substrate 2 into the processing unit 10 (chamber 17 ), and the substrate stage 12 . The substrate 2 is transferred onto the pins 12c protruding from the (chuck 12a). After the substrate 2 is transferred onto the pin 12c, the substrate stage 12 reduces the amount of protrusion of the pin 12c from the chuck 12a, and the substrate 2 and the chuck 12a The substrate 2 is held by the chuck 12a in a contact state.

Here, the hand 31 is provided with a temperature sensor 34 as shown in FIG. 3 , and when the substrate 2 is transported to the processing unit 10 , the hand 31 is placed inside the processing unit 10 . In the inserted state, the internal temperature of the processing unit 10 (chamber 17) is detected by the temperature sensor 34 . In the example shown in FIG. 3 , the temperature sensor 34 is provided in the hand 31 , but it is not limited thereto, and the inside of the processing unit 10 is not limited thereto when the substrate 2 is transported to the processing unit 10 . What is necessary is just to provide the temperature sensor 34 in the part to be inserted into. In addition, it is preferable that the temperature sensor 34 detects the temperature of the gas supplied from the temperature control unit 19 of the processing unit 10 (eg, the temperature control unit 19b that ejects the gas in the horizontal direction). Therefore, what is necessary is just to install in the conveyance part 30 (hand 31) so that the said base|substrate may come in direct contact. In addition, since the temperature sensor 34 can detect the temperature of the substrate 2 when it comes into contact with the substrate 2 held by the hand 31 , when installed so as not to contact the substrate 2 , do. Similarly, what is necessary is just to provide so that it may not contact the substrate stage 12 at the time of delivery of the board|substrate 2 to the board|substrate stage 12. As shown in FIG.

In this way, the detection of the internal temperature of the processing unit 10 by the temperature sensor 34 provided in the conveying unit 30 (hand 31) is performed when the substrate 2 is conveyed to each of the plurality of processing units 10 . can be done on That is, in the present embodiment, the internal temperature of each of the plurality of processing units can be detected by the common temperature sensor 34 provided in the hand 31 . Thereby, based on the information indicating the respective internal temperatures of the plurality of processing units 10 detected by the temperature sensor 34 , the control unit 40 controls the plurality of processing units to reduce the difference in internal temperature between the plurality of processing units. It is possible to control the internal temperature of each of the processing units 10 of the . For example, the control unit 40 corrects the detection results of the temperature sensors 18a and 18b provided in each of the plurality of processing units 10 based on the information, and the detection results of the corrected temperature sensors 18a and 18b Controls the temperature control units 19a and 19b in each of the plurality of processing units 10 based on the . Thereby, the difference in internal temperature between a plurality of processing units can be reduced.

4 is a flowchart illustrating a method of controlling the internal temperature of each processing unit 10 in the imprint apparatus 100 of the present embodiment. The flowchart shown in FIG. 4 is based on the detection result of the temperature sensor 34 obtained when carrying in the board|substrate 2 preprocessed by the 2nd processing part 20 into each processing part 10, each processing part 10 ) shows an example of controlling the internal temperature of Each process in the flowchart may be controlled by the controller 40 .

In S11 , the control unit 40, among the plurality of processing units 10 , the processing unit 10 (hereinafter, the target processing unit 10 ) to which the substrate 2 that has been pre-processed by the second processing unit 20 is transferred is configured. to decide For example, the control unit 40 may determine the target processing unit 10 based on information indicating the status of the imprint process in each of the plurality of processing units 10 . In S12 , the control unit 40 holds the substrate 2 in the hand 31 , and moves the hand 31 along the conveyance path 32 to the front of the target processing unit 10 , the conveying unit 30 . ) to control In S13, the control unit 40 inserts the hand 31 holding the substrate 2 into the target processing unit 10, and loads the substrate 2 into the target processing unit 10 ( For example, the transfer unit 30 is controlled (to transfer the substrate 2 onto the substrate stage). In S14 , the control unit 40 controls the transfer unit 30 to pull out the hand 31 from the target processing unit 10 .

In S15 , the control unit 40 determines the detection result of the internal temperature of the target processing unit 10 obtained during the step S13 by the temperature sensor 34 of the hand 31 , and the temperature sensor 18 of the target processing unit 10 . ), the detection result of the internal temperature of the target processing unit 10 obtained at the time of the step S13 is acquired. Then, the difference (temperature difference ΔT) between the detection results is calculated. In S16, the control unit 40 determines whether the temperature difference ΔT obtained in S15 is equal to or greater than a threshold value. If the temperature difference ΔT is equal to or greater than the threshold value, the process proceeds to S17, and if the temperature difference ΔT is smaller than the threshold value, the process proceeds to S18.

In S17, based on the temperature difference ΔT, the control unit 40 controls the target processing unit ( ) so that the detection result of the temperature sensor 18 of the target processing unit 10 approximates the detection result of the temperature sensor 34 of the hand 31 . 10) Calibrate the temperature sensor 18. In S18 , the control unit 40 determines whether there is a new substrate 2 (the next substrate) that has been pre-processed by the second processing unit 20 . If there is a next board|substrate, it returns to S11. In this case, since the next substrate can be transferred to another processing unit 10 , the processes S11 to S17 can be performed with respect to the other processing unit 10 . Therefore, the control unit 40 can calibrate the temperature sensor 18 provided in each of the plurality of processing units 10 by using the temperature sensor 34 provided in the hand 31 in common. Thereby, the control part 40 can control the internal temperature in each of the some processing part 10 so that the difference of the internal temperature between the some processing part may be reduced.

As described above, in the imprint apparatus 100 of the present embodiment, the substrate 2 for each of the plurality of processing units 10 by the temperature sensor 34 provided in the hand 31 of the conveying unit 30 . The internal temperature in each of the plurality of processing units 10 is detected at the time of conveyance. Then, based on the information indicating the internal temperature of each of the plurality of processing units 10 detected by the temperature sensor 34 , the plurality of processing units 10 is configured such that the difference in internal temperature between the plurality of processing units is reduced. control the internal temperature in each of the Thereby, the difference in the formation precision of the pattern resulting from the difference in the internal temperature between several process part can be reduced.

In addition, since the temperature sensor 34 of the conveyance part 30 (hand 31) also causes a change with time, periodic calibration is required, but the number of the temperature sensors 34 of the conveyance part 30 is plural. Since it is less than the total number of the temperature sensors 18 in the processing part 10, the time required for calibration can be shortened. That is, since the time for stopping the imprint process for calibrating the temperature sensor can be shortened, it can be advantageous also in terms of productivity.

Here, in this embodiment, based on the detection result of the temperature sensor 34 obtained at the time of carrying in the board|substrate 2 with respect to each of the some processing part 10, the inside in each of the some processing part 10. An example of controlling the temperature has been described. However, it is not limited thereto, and based on the detection result of the temperature sensor 34 obtained at the time of carrying out the substrate 2 from each of the plurality of processing units 10 , in each of the plurality of processing units 10 , may control the internal temperature of That is, "at the time of conveyance of a board|substrate" can include at least one of the time of carrying in a board|substrate, and the time of carrying out a board|substrate.

<Second embodiment>

An imprint apparatus of a second embodiment according to the present invention will be described. The apparatus configuration of the imprint apparatus of the second embodiment is the same as that of the imprint apparatus 100 of the first embodiment. In the second embodiment, the control unit 40 sets the temperature of the conveyance path 32 to a target temperature based on the detection result of the temperature sensor 34 during the movement of the hand 31 along the conveyance path 32 . The temperature control unit 33 is controlled so as to be (controls the temperature of the conveyance path 32). It is preferable that the target temperature of the conveyance path 32 is set like the target temperature of the internal temperature in each of the some process part 10, for example. In this way, by controlling the internal temperature in each of the plurality of processing units 10 and the temperature of the transport path 32 based on the detection result by the common temperature sensor 34 , the internal temperature and the transport path 32 are controlled. ) and the temperature difference can be reduced. That is, the thermal deformation of the substrate 2 caused by the temperature difference between the transfer path 32 and the inside of each processing unit 10 can be reduced.

<Third embodiment>

A third embodiment according to the present invention will be described. 5 : is a figure which shows the imprint apparatus 300 of 3rd Embodiment, except for the structure of the conveyance part 30, it is the same as that of the imprint apparatus 100 (FIG. 1) of 1st Embodiment. In the imprint apparatus 300 of the third embodiment, the conveyance path 32 is divided into a plurality of regions, and a temperature control unit 33 is provided in each of the plurality of regions. In the example shown in FIG. 5 , the conveying path 32 is divided into three regions 32a to 32c, a temperature control unit 33a for temperature-regulating the region 32a, and a temperature control for the region 32b. A temperature control unit 33b for temperature control and a temperature control unit 33c for temperature control of the region 32c are provided.

The control unit 40 controls each region 32a to 32c of the conveyance path 32 based on the detection result of the temperature sensor 34 while the hand 31 is moving along the conveyance path 32 . Each temperature controller 33a to 33c is controlled so that the temperature becomes a target temperature. Specifically, the control unit 40 determines that the temperature of the region 32a is adjusted based on the detection result of the temperature sensor 34 when the hand 31 is moving in the region 32a of the conveyance path 32 . The temperature control unit 33a is controlled to reach the target temperature. Similarly, the control unit 40 controls the area 32b (area 32c) of the conveyance path 32 based on the detection result of the temperature sensor 34 when the hand 31 is moving the area 32b. ) (region 32c) controls the temperature control unit 33b (temperature control unit 33c) so that the temperature becomes the target temperature. By individually controlling each temperature of a plurality of regions in the conveyance path 32 in this way, the temperature of the conveyance path 32 can be controlled with high precision.

<Embodiment of manufacturing method of article>

The method for manufacturing an article according to an embodiment of the present invention is suitable for manufacturing an article such as a micro device such as a semiconductor device or an element having a microstructure, for example. The manufacturing method of the article of the present embodiment includes a step of forming a pattern on an imprint material applied to a substrate using the imprint apparatus (a step of performing an imprint process on the substrate), and a step of processing the substrate on which the pattern is formed in this step includes In addition, this manufacturing method includes other well-known processes (oxidation, film-forming, vapor deposition, doping, planarization, etching, resist peeling, dicing, bonding, packaging, etc.). The manufacturing method of the article of the present embodiment is advantageous compared to the conventional method in at least one of performance, quality, productivity, and production cost of the article.

The pattern of the hardened|cured material shape|molded by the imprint apparatus is used permanently for at least a part of various articles|goods, or temporarily when manufacturing various articles|goods. The article is an electric circuit element, an optical element, MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. As a type|mold, the mold for imprints, etc. are mentioned.

The pattern of the cured product is used as a constituent member of at least a part of the article as it is, or is temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed.

Next, a specific manufacturing method of the article will be described. As shown in Fig. 6(a), a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed on the surface is prepared, and then the surface of the workpiece 2z is performed by an inkjet method or the like. An imprint material 3z is applied thereto. Here, the state in which the imprint material 3z in the shape of a plurality of droplets is provided on the board|substrate is shown.

As shown in Fig. 6(b), the imprint mold 4z faces the side on which the concave-convex pattern is formed toward the imprint material 3z on the substrate. As shown in FIG.6(c), the board|substrate 1z to which the imprint material 3z was provided and the mold 4z are brought into contact, and pressure is applied. The imprint material 3z is filled in the gap between the mold 4z and the material to be processed 2z. In this state, when light is transmitted through the mold 4z as curing energy and irradiated, the imprint material 3z is cured.

As shown in Fig. 6(d), after curing the imprint material 3z, when the mold 4z and the substrate 1z are separated, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. is formed The pattern of this cured product is such that the concave portion of the mold has a shape corresponding to the convex portion of the cured product and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave-convex pattern of the mold 4z is transferred to the imprint material 3z. do.

As shown in FIG. 6E , when etching is performed using the pattern of the cured product as an etching mask, a portion without the cured product or thinly remaining on the surface of the material 2z to be processed is removed, and the groove 5z ) becomes As shown in Fig. 6(f), when the pattern of the cured product is removed, an article in which the grooves 5z are formed on the surface of the workpiece 2z can be obtained. Although the pattern of the cured product is removed here, it may be used as a structural member of a film for interlayer insulation included in, for example, a semiconductor element, ie, an article without removing the pattern even after processing.

As mentioned above, although preferred embodiment of this invention was described, this invention is not limited to these embodiment, It goes without saying that various modifications and changes are possible within the scope of the summary.

10: processing unit
20: second processing unit
30: transfer unit
31: hand
32: return path
33: temperature control unit
34: temperature sensor
40: control unit
100: imprint device

Claims (9)

a plurality of processing units each performing a process of forming a pattern on the substrate;
a transfer unit for transferring the substrate to each of the plurality of processing units;
A control unit for controlling the internal temperature of each of the plurality of processing units
including,
The transfer unit has a first temperature sensor installed in a portion inserted into the processing unit when the substrate is conveyed to each of the plurality of processing units,
Each of the plurality of processing units has a temperature control unit for adjusting the internal temperature,
The control unit controls the temperature control unit so that a difference in internal temperature between the plurality of processing units is reduced based on a detection result of the first temperature sensor obtained when the substrate is conveyed by the conveying unit to control the plurality of processing units. A lithographic apparatus characterized by controlling an internal temperature in each of the processing units. delete According to claim 1,
Each of the plurality of processing units includes a second temperature sensor for detecting an internal temperature,
The control unit may include, based on a detection result of the second temperature sensor corrected by a detection result of the first temperature sensor obtained at the time of conveyance of the substrate to each of the plurality of processing units by the conveying unit, the plurality of the plurality of processing units. A lithographic apparatus, characterized in that it controls the temperature control unit in each of the processing units. According to claim 1,
The transfer unit has a hand for holding the substrate,
The lithographic apparatus, wherein the first temperature sensor is provided in the hand. 5. The method of claim 4,
The lithographic apparatus according to claim 1, wherein the first temperature sensor is provided in the hand so as not to contact the substrate held by the hand. According to claim 1,
The conveying unit includes a conveying path for conveying the substrate to each of the plurality of processing units,
The lithographic apparatus, wherein the control unit controls the temperature of the conveyance path based on a detection result of the first temperature sensor. 7. The method of claim 6,
The conveyance path is divided into a plurality of areas,
The lithographic apparatus, wherein the control unit controls the respective temperatures of the plurality of regions in the conveyance path based on a detection result of the first temperature sensor. According to claim 1,
Further comprising a second processing unit for pre-processing the substrate,
The lithographic apparatus, wherein the conveying unit conveys a substrate from the second processing unit to each of the plurality of processing units. A forming step of forming a pattern on a substrate using the lithographic apparatus according to claim 1 ;
A processing process of processing the substrate on which the pattern is formed in the forming process
including,
A method of manufacturing an article, characterized in that the article is produced from the substrate processed in the machining process.

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