KR102316054B1 - Mould, imprint apparatus, method of manufacturing article - Google Patents

Abstract

The formwork of the present invention is a form in which a patterned thin plate part and a support part having an outer shape larger than that of the thin plate part on the patterned surface of the thin plate part are joined, and around the thin plate part joined to the support part, A member different from the thin plate part is disposed on the surface of the support part, and the height of the surface of the member is lower than the height of the surface of the pattern formed on the thin plate part.

Description

Formwork, imprint apparatus, and method of manufacturing an article {MOOLD, IMPRINT APPARATUS, METHOD OF MANUFACTURING ARTICLE}

The present invention relates to a formwork, an imprint apparatus, and a method for manufacturing an article.

DESCRIPTION OF RELATED ART As a method of manufacturing articles, such as a semiconductor device and MMS, the imprint technique which forms an imprint material pattern on a board|substrate using a formwork (mold) is known. In the imprint technique, an imprint material is supplied on a substrate, and the supplied imprint material and a mold are brought into contact (pressing). Then, after the imprint material is cured in a state in which the imprint material and the mold are in contact, the imprint material pattern is formed on the substrate by separating the mold from the cured imprint material (release).

A strong force is required to separate the form from the hardened imprint material. Therefore, at the time of releasing, there exists a possibility that the destruction of the imprint material pattern formed on the board|substrate, or the damage|damage of a formwork may arise. When the formwork is damaged, the imprint apparatus performs pattern formation by replacing it with a new formwork. Since the formwork is replaced with a new form every time it is damaged, the cost of the formwork increases in the imprint technique.

Therefore, Japanese Patent Laid-Open No. 2016-72403 proposes a form in which a hollow cylindrical base material (support portion) is joined to the surface opposite to the surface on which the pattern of the thin plate portion is formed. Accordingly, when the pattern is damaged, only the portion on which the pattern is formed of the formwork needs to be replaced, so that the cost of the formwork can be reduced.

In this way, when the thin plate part on which the pattern of the formwork is formed and the support part are joined, the thin plate part needs to be processed with high precision, so it is created from an expensive board with good precision. In order to reduce cost, the thin plate part with a pattern is made as small as possible, and since as many thin plate parts as possible are created from one board|substrate, a thin plate part is smaller than a support part.

When the thin plate portion smaller than the support portion and the support portion are joined in this way, a level difference occurs between the surface of the support portion and the surface of the thin plate portion around the pattern portion on which the pattern is formed. The formwork is supported and conveyed around the pattern portion in the imprint apparatus by a conveying hand. Therefore, if a level difference occurs on the surface around the pattern portion, there is a fear that the conveyance hand of the conveying apparatus configured in the imprint apparatus interferes with the step, and the formwork cannot be conveyed stably.

The formwork of the present invention is a form in which a patterned thin plate part and a support part having an outer shape larger than that of the thin plate part on the patterned surface of the thin plate part are joined, and around the thin plate part joined to the support part, A member different from the thin plate part is disposed on the surface of the support part, and the height of the surface of the member is lower than the height of the surface of the pattern formed on the thin plate part.

Further features of the present invention will become apparent from the following description of the embodiments (with reference to the accompanying drawings).

1 is a view showing an imprint apparatus according to a first embodiment.
2 is a view showing the formwork of the first embodiment.
3 is a view showing the formwork of the second embodiment.
Figure 4 is a view showing a conventional formwork.
5 is a view for explaining a method of manufacturing an article.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In addition, in each figure, the same reference number is attached|subjected about the same member, and overlapping description is abbreviate|omitted.

(Example 1)

(About imprint apparatus)

Fig. 1 is a diagram showing the configuration of an imprint apparatus 101 in the first embodiment. The configuration of the imprint apparatus 101 will be described with reference to FIG. 1 . Here, each axis is determined as shown in FIG. 1 , with a plane parallel to the plane on which the substrate 111 is disposed as an X-plane and a direction orthogonal thereto as a Z-direction. The imprint apparatus is an apparatus for forming a pattern of a cured product onto which the concavo-convex pattern of the die is transferred by bringing the imprint material supplied on the substrate into contact with a mold (mold) and applying energy for curing to the imprint material. The imprint apparatus 101 of FIG. 1 is used for manufacturing a device such as a semiconductor device as an article. Here, the imprint apparatus 101 employing the photocuring method will be described.

The imprint apparatus 101 includes a light irradiation unit 102 , a mold holding unit 103 , a substrate holding unit 104 , an application unit 105 , a control unit 106 , a measurement means 122 , and a housing. (123) is provided. Further, in the imprint apparatus 101 , a formwork deformation mechanism 130 for deforming the formwork 107 is arranged. The formwork deformation mechanism 130 may change the shape of the formwork 107 by applying a force or displacement to the side surface of the formwork 107 . Furthermore, the imprint apparatus 101 includes a formwork conveying apparatus 300 for conveying the formwork 107 to the formwork holding unit 103 , and a substrate conveying mechanism for conveying the substrate 111 to the substrate holding unit 104 (shown in the figure). not available) is provided.

The light irradiation unit 102 irradiates an ultraviolet ray 108 for curing the imprint material. The light irradiation unit 102 includes a light source 109 for irradiating ultraviolet rays 108 and an optical element 110 for correcting the ultraviolet rays 108 irradiated from the light source 109 to light suitable for imprinting. In addition, in the first embodiment, the light irradiation unit 102 is provided in order to employ the photocuring method. For example, in the case of employing the thermosetting method, the light irradiation unit 102 is replaced with a heat source for curing the imprint material. will install

The formwork holding part 103 has a formwork chuck 115 which pulls and holds the formwork 107 by an adsorption force or an electrostatic force, and a formwork chuck 115 and a formwork 107 held by the formwork chuck 115 . ) has a driving mechanism 116 for moving each die chuck. The die chuck 115 and the driving mechanism 116 have an opening region 117 (opening portion) at each central portion so that the ultraviolet 108 irradiated from the light source 109 of the light irradiation unit 102 is irradiated to the substrate 111 . ) has The driving mechanism 116 moves the mold 107 in the Z-axis direction in order to bring the mold 107 into contact with the imprint material 114 on the substrate 111 (pressing) or separating (release). As an actuator employable for this drive mechanism 116, there is a linear motor or an air cylinder, for example. In addition, in order to respond to highly accurate positioning of the formwork 107, the drive mechanism 116 may be comprised from several drive systems, such as a coarse motion drive system and a fine motion drive system. Further, it may be moved not only in the Z-axis direction but also in the X-axis direction or the Y-axis direction. Further, it may have a position correction function in the θ direction, which is the rotational direction around the Z-axis, a tilt function (rotational directions around the X-axis and the Y-axis) for correcting the inclination of the mold 107, and the like.

The substrate holding unit 104 includes a substrate chuck 119 that pulls and holds the substrate 111 by vacuum suction, and a substrate that holds the substrate chuck 119 by mechanical means and is held by the substrate chuck 119 . It has a substrate stage 120 that moves (111) in the X-plane. The substrate holding portion 104 aligns the mold 107 with the substrate 111 when the mold 107 and the imprint material 114 on the substrate 111 come into contact with each other. On the surface of the substrate chuck 119, a stage reference mark 121 used for aligning the mold 107 is provided. The stage reference mark 121 may be provided on the substrate stage 120 . As an actuator employable for the substrate stage 120 (substrate driving mechanism), there is, for example, a linear motor. In addition, the substrate stage 120 may be comprised by the some drive mechanism, such as a coarse motion drive mechanism and a fine motion drive mechanism. Further, a driving system for correcting the position of the substrate 111 in the Z-axis direction, a position correction function in the θ direction (the rotational direction around the Z-axis) of the substrate 111, and a tilt function for correcting the inclination of the substrate 111 You may have a back.

Further, each operation of pressing and releasing in the imprint apparatus 101 may be realized by moving the substrate 111 in the Z-axis direction by the substrate holding unit 104, and further, the mold 107 and the substrate ( 111) may be realized by relatively moving both sides.

The application unit 105 is a supply device that supplies the uncured imprint material 114 onto the substrate 111 . A plurality of discharge ports (nozzles) are formed in the application unit 105 , and droplets of the imprint material are supplied onto the substrate 111 from the discharge ports. The applicator 105 of the first embodiment uses the piezoelectric effect of the piezoelectric element to push the imprint material 114 from the discharge port. A control unit 106 to be described later generates a drive signal for driving the piezo element and drives the piezo element to deform into a shape suitable for ejection. A plurality of discharge ports of the application unit 105 are provided, and each can be independently controlled. The amount of the imprint material 114 supplied on the substrate 111 from the discharge port of the application unit 105 and the distribution of droplets depend on the thickness of the imprint material pattern formed on the substrate 111 and the density of the pattern formed. etc. are appropriately determined.

For the imprint material 114 , a curable composition (sometimes referred to as uncured resin) that is cured when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, or the like are used. As an electromagnetic wave, the wavelength is light, such as infrared rays, a visible light, and an ultraviolet-ray, which is selected from the range of 10 nm or more and 1 mm or less, for example.

A curable composition is a composition hardened|cured by irradiation of light or by heating. Among these, the photocurable composition hardened|cured by light contains a polymeric compound and a photoinitiator at least, and may contain a nonpolymerizable compound or a solvent as needed. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal addition type release agent, a surfactant, an antioxidant, and a polymer component.

The imprint material 114 is applied in the form of a film onto the substrate by a spin coater or a slit coater. Alternatively, a droplet shape or an island shape or a film shape formed by connecting a plurality of droplets may be provided on the substrate by the liquid jet head. The viscosity (viscosity at 25°C) of the imprint material is, for example, 1mPa·d or more and 100mPa·d or less.

For the substrate 111, glass, ceramic, metal, semiconductor, resin, or the like can be used, and if necessary, a member made of a material different from that of the substrate may be formed on the surface thereof. Specific examples of the substrate include silicon wafers, compound semiconductor wafers, quartz glass, and the like.

The measuring means 122 includes an alignment measuring device 127 and an imprint material observation means 128 as representative measuring instruments. The alignment measuring instrument 127 can detect the alignment mark formed on the substrate 111 and the alignment mark formed in the die 107 . In addition, the imprint material observation means 128 is, for example, an imaging device such as a CCD camera, and can image the contact state of the imprint material 114 supplied to the substrate 111 and the mold 107 . The imprint material observation means 128 can observe the state of the pressing process and the releasing process.

The formwork conveying mechanism 300 conveys the formwork 107 carried in the imprint apparatus 101 to the formwork holding unit 103 . In addition, the formwork conveying mechanism 300 conveys the formwork 107 from the formwork holding part 103 and carries out the formwork 107 from the imprint apparatus 101 . In addition, the formwork conveying mechanism 300 has the conveying hand 310, and conveys by the conveying hand 310 holding the formwork 107. As shown in FIG.

The control unit 106 may control the operation and correction of each component of the imprint apparatus 101 . The control unit 106 is constituted of, for example, a computer, and is connected to each component of the imprint apparatus 101 via a line, and can execute control of each component according to a program or the like. The control part 106 controls each operation|movement of the formwork holding|maintenance part 103, the board|substrate holding|maintenance part 104, and the application|coating part 105 based on the measurement result of the measuring means 122. The control unit 106 can measure the relative position of the mold 107 and the substrate 111 based on the detection result of the alignment measuring instrument 127 . For example, the alignment mark of the formwork 107 and the alignment mark of the board|substrate 111 X-axis direction and Y-axis direction shift are measured. Further, the control unit 106 can determine the quality of the pressing process or the releasing process based on the imaging result of the imprint material observation means 128 .

In addition, the control part 106 may be comprised integrally with the imprint apparatus 101, and may be comprised separately from the imprint apparatus 101. FIG. Further, instead of one computer, a plurality of computers may be configured.

The housing 123 includes a base platen 124 on which the substrate holding part 104 is placed, a bridge platen 125 for fixing the formwork holding part 103 , and a post 126 for supporting the bridge platen 125 . ) is provided.

(About the imprint method)

Next, an imprint method for forming an imprint material pattern on the substrate 111 using the imprint apparatus 101 will be described.

The control unit 106 places the substrate 111 loaded into the imprint apparatus 101 on the substrate chuck 119 of the substrate stage 120 by a substrate transfer mechanism, and holds it. The substrate holding portion 104 holding the substrate 111 moves to the application position of the application portion 105 . Then, the application unit 105 applies the imprint material 114 to a predetermined pattern formation region (shot region) on the substrate 111 (application step).

Next, the control unit 106 moves the substrate holding portion 104 so that the pattern forming region to which the imprint material is applied on the substrate 111 is located immediately below the pattern portion 204 formed on the mold 107 . The control unit 106 drives the driving mechanism 116 to bring the imprint material 114 on the substrate 111 into contact with the pattern portion 204 of the mold 107 (pressing process). At this time, the imprint apparatus 101 determines the alignment of the die 107 and the substrate 111 based on the detection result of the alignment marks of the die 107 and the substrate 111 detected by the alignment measuring instrument 127 . do Furthermore, the formwork deformation mechanism 130 can deform the formwork 107 based on the detection result of the alignment mark.

By this pressing step, the imprint material 114 fills the uneven portions formed in the pattern portion 204 of the mold 107 . In a state in which the imprint material 114 is filled in the pattern, the control unit 106 irradiates the light irradiation unit 102 with ultraviolet rays 108 from the upper surface of the mold 107 . The imprint material 114 is cured by the ultraviolet ray 108 transmitted through the mold 107 (curing step). Then, after the imprint material 114 is cured, the control unit 106 drives the driving mechanism 116 to separate the mold 107 from the cured imprint material 114 (release process).

Accordingly, a pattern of the imprint material 114 having a three-dimensional shape in which the concavo-convex portions formed in the pattern portion 204 of the mold 107 are inverted is formed in the pattern formation region on the substrate 111 . In this way, a series of imprint operations from the application process to the release process are performed a plurality of times while changing the pattern formation area by driving the substrate holding unit 104 , thereby forming a plurality of imprint materials 114 on one substrate 111 . pattern can be formed.

(About the formwork)

Next, the formwork 107 of the first embodiment will be described. 2A is a view showing a formwork 107 of the first embodiment.

The formwork 107 includes a support portion 201 , a thin plate portion 206 , and a contact portion 205 . A mesa 203 convex with respect to the substrate 111 is formed in the center of the thin plate portion 206, and a pattern outer peripheral portion 202 is formed around it. The mesa 203 is formed with an uneven pattern portion 204 . A circular opening is formed in the center of the support part 201 , and by joining the support part 201 and the thin plate part 206 , the opening of the support part 201 functions as a cavity (core out) of the formwork 107 . As shown in FIG. 2A , the formwork 107 of the present embodiment is joined to the support portion 201 and the thin plate portion 206 . The outer shape of the circular opening formed in the support part 201 is smaller than the outer shape of the thin plate part 206 . Moreover, it is preferable that the outer shape of the circular opening formed in the support part 201 is larger than the area|region of the pattern part 204. As shown in FIG.

A cavity (recessed portion) is formed in the formwork 107 , and the formwork holding unit 103 holds the formwork 107 and adjusts the pressure in the cavity to make it higher than the surrounding, thereby forming a pattern of the thin plate portion 206 . The portion 204 may be deformed into a convex shape toward the substrate 111 . By deforming the pattern portion 204 of the mold 107 in the pressing step, it is possible to contact the imprint material 114 from the center of the pattern portion 204 . Accordingly, it is possible to suppress the trapping of gas (air) between the pattern portion 204 and the imprint material 114 , and to fill the imprint material 114 up to the concave portions of the pattern portion 204 .

Since the support part 201 has a simple shape compared with the thin plate part 206, high processing precision is not required, and it is not an expensive member. On the other hand, in the thin plate part 206, mesa 203 and concave-convex pattern parts 204 are formed, and since the mesa 203 is a material through which ultraviolet rays pass, the thin plate part 206 is an expensive member. is used Since the thin plate part 206 is an expensive member, in the formwork 107 in which the thin plate part 206 and the support part 201 on which the pattern part 204 is formed are joined, the outer shape of the thin plate part 206 for cost reduction I want to make it as small as possible. Therefore, as shown in FIG. 2B , the size of the outer shape of the thin plate portion 206 in the X-plane is smaller than the size of the outer shape of the support portion 201 . Therefore, when the support part 201 and the thin plate part 206 are joined to form the formwork 107, the step difference between the surface of the pattern outer peripheral part 202 of the thin plate part 206 and the surface of the support part 201 is made. comes into being

Next, the case where the conventional formwork 307 is conveyed by the conveyance hand 310 of the formwork conveyance apparatus 300 is demonstrated using FIG. As for the conventional formwork 307 shown in FIG. 4, the mesa 303, the pattern part 304, and the cavity are integrally formed in the support part. In this way, a cavity (core out) having a circular concave shape is provided in the central portion of the formwork 307 . Providing the recessed part in the center of the formwork 307 has a problem that the difficulty of processing increases and manufacturing cost increases.

When conveying the conventional formwork 307 , the conveying hand 310 supports and conveys the outer side of the mesa 303 of the formwork 307 . When it is going to convey the formwork 107 which joined the thin plate part 206 and the support part 201 mentioned above using the conveyance hand 310 of the conventional formwork conveying apparatus 300, the pattern outer peripheral part 202 and the support part 201 ), the transfer hand 310 interferes with the step and cannot be stably supported.

Therefore, in order to stably transport the formwork 107 in which the support portion 201 and the thin plate portion 206 are joined by using the transfer hand 310 of the conventional formwork transfer apparatus 300, the formwork of the first embodiment ( As for the 107, the contact part 205 is arrange|positioned around the thin plate part 206. As shown in FIG. At the time of conveyance of the formwork 107, the support position 311 of the outer side of the mesa 203 of the formwork 107 is supported by the conveyance hand 310, and conveyance is performed. As shown in FIG. 2B , the contact portion 205 may be provided so as to surround the thin plate portion 206 , and at least the contact portion 205 at the supporting position 311 where the transfer hand 310 is in contact with the formwork 107 . It is good to have placed For example, the contact part 205 may be arrange|positioned so that the thin plate part 206 may be pinched|interposed.

The height of the substrate-side surface of the contact portion 205 is substantially the same as the substrate-side surface of the pattern outer peripheral portion 202 of the thin plate portion 206 . At least, the height of the surface of the contact portion 205 on the substrate side is lower than the height of the surface (pattern portion 204) of the mesa 203 of the thin plate portion 206 . In addition, the outer surface (outer end surface) of the contact portion 205 is on the same surface as the end surface of the support portion 201 or is disposed so as to be inward. By doing in this way, it is possible to support and transport the formwork 107 of the first embodiment without interfering with it by using the conveying hand 310 of the formwork conveying apparatus 300 used in the conventional formwork 307 .

Furthermore, there are cases where a mark for detecting the presence or absence of a formwork is provided on the formwork. Therefore, by providing a mark for detecting the presence or absence of a form in the contact part 205 of the form 107, the detection of a mark becomes possible using the same measurement system as the conventional formwork 307.

In addition, the formwork deformation mechanism 130 may deform the pattern portion 204 by applying a force to the side surface of the formwork 107 . In that case, compared to the case of using the same rigidity of the support part 201 with respect to the rigidity of the thin plate part 206, the case where the rigidity of the support part 201 is smaller than that of the thin plate part 206 is used, Power consumption of the mold deformation mechanism 130 can be suppressed. The contact part 205 provided in the support part 201 can minimize the increase in rigidity of the formwork 107 (support part 201) by arranging the contact part 205 by making the rigidity smaller than the support part 201. . For this reason, an increase in the power consumption of the form deformation mechanism 130 can be suppressed, and the influence of heat generation can be reduced.

In the formwork 107 of the first embodiment, the case where the contact portion 205 is joined to the support portion 201 as another member has been described, but the contact portion 205 may be formed integrally with the support portion 201 .

(Example 2)

(About the formwork)

Next, the formwork 407 of the second embodiment will be described. 3A is a view showing a formwork 407 of the second embodiment. The imprint apparatus 101 and imprint method in which the formwork 407 of the second embodiment is used is the same as that of the first embodiment, and therefore the description is omitted.

The formwork 407 includes a support portion 201 , a thin plate portion 206 , and a contact portion 205 . A mesa 203 convex with respect to the substrate 111 is formed in the center of the thin plate portion 206, and a pattern outer peripheral portion 202 is formed around it. The mesa 203 is formed with an uneven pattern portion 204 . A circular opening is formed in the center of the support part 201 , and when the support part 201 and the thin plate part 206 are joined, the opening of the support part 201 functions as a cavity (core out) of the formwork 107 . As shown in FIG. 3A, the formwork 407 of this embodiment is joined to the support part 201 and the thin plate part 206. As shown in FIG.

When air bubbles remain in the concave portion of the pattern portion 204 during the pressing process of bringing the imprint material 114 supplied on the substrate 111 into contact with the pattern portion 204 of the die 407, the substrate 111 A defect arises in the imprint material pattern created on the image. As a countermeasure, there is a method of filling the space between the pattern portion 204 and the substrate 111 with a specific gas. As the specific gas (substitution gas), an inert gas, such as helium or carbon dioxide, which is highly soluble in the imprint material 114 can be used.

In the case of the conventional formwork 307, as shown in FIG. 4B, a gas supply unit 411 (gas pipe) so that gas is supplied from the periphery of the formwork 307 toward the gap between the formwork 307 and the substrate 111. was arranged and a specific gas was blown into the gap. In this case, since the space between the gap between the formwork 307 and the substrate 111 is narrow and the area surrounding the pattern part 304 is wide, the gas easily escapes to the outside of the formwork 307, effectively replacing the gas Can not. Therefore, the usage-amount of a specific gas may increase and there exists a possibility of raising the running cost of an imprint apparatus.

In the formwork 407 of the second embodiment shown in FIG. 3A , the contact portion 205 is disposed so that a gap is formed between the contact portion 205 and the thin plate portion 206 . At this time, the range for narrowing the width of the contact portion 205 is configured not to deviate from the support position 311 by the transfer hand 310 of the above-described form transfer device 300 or interfere with the positioning mark position. By arranging the contact portion 205 to create a gap between the contact portion 205 and the thin plate portion 206, the space surrounded by the contact portion 205, the thin plate portion 206, the support portion 201, and the substrate 111 ( 402) is formed. Since the contact portion 205 is disposed to surround the thin plate portion 206 , the space 402 is formed to surround the thin plate portion 206 .

Further, a part of the contact portion 205 communicates the space 402 and the outer space of the formwork 307, and a hole or groove for supplying gas to the space 402 from the outside of the formwork 407 is a supply path ( 403) is installed. In the supply path 403 , a part of the contact portion 205 may be cut off, or a hole may be formed in the contact portion 205 . The groove serving as the supply path 403 may be provided between the support portion 201 and the contact portion 205 , or between the contact portion 205 and the substrate 111 , that is, on the lower surface of the contact portion 205 . The contact portion 205 may be divided and disposed around the thin plate portion 206 , and the space between the divided contact portions 205 may serve as a supply path 403 . A gas supply unit 401 (gas pipe) for supplying a specific gas to the supply path 403 is disposed in the vicinity of the supply path 403 . The specific gas supplied from the gas supply part 401 is supplied to the periphery of the thin plate part 206 through the space 402 with little resistance. Thereafter, the gas concentration in the space between the pattern portion 204 and the substrate 111 can be increased by diffusion of the specific gas.

By using the formwork 407 described in FIG. 3A , it becomes possible to efficiently substitute a specific gas between the pattern portion 204 of the formwork 407 and the substrate 111 . In addition, since it becomes possible to mainly supply the replacement gas to the space inside the contact portion 205, the amount of escape of the replacement gas around the formwork 407 can be reduced, and the consumption amount of the replacement gas can be reduced. .

Moreover, as shown in FIG. 3B, you may provide the opening (supply path 404) which communicates with the space 402 and the space outside the form in the support part 201. As shown in FIG. A gas supply unit 401 is connected to the supply path 404 , and a specific gas is supplied to the space 402 .

For example, the width of the space 402 between the contact portion 205 and the thin plate portion 206 may be 1 mm or less, preferably 0.5 mm or less. By substituting a specific gas between the formwork and the substrate using the formwork 407 of the second embodiment described above, as compared with the case of using the conventional formwork 307 shown in Fig. 4B, the formwork 407 and the substrate (111) can be easily replaced with a specific gas.

Moreover, as shown in FIG. 3C, the some contact part 205 may be arrange|positioned on the surface of the support part 201 so that the thin plate part 206 in which the mesa 203 was formed may be enclosed. By arranging the plurality of contact portions 205 to form gaps with each other, a supply path 403 for supplying a specific gas from the gas supply unit 401 to between the pattern portion 204 and the substrate 111 can be made.

In either embodiment, although the case where the formwork 107 and the formwork 407 are conveyed by the conveyance hand 310 of the formwork conveyance apparatus 300 equipped with the imprint apparatus 101 was demonstrated, this not limited Even when the form is conveyed by the conveying hand of the form conveying apparatus that conveys the form taken out from the imprint apparatus 101, the possibility that the conveying hand interferes with the step between the pattern outer periphery 202 and the support 201 can be reduced. can

(Manufacturing method of the article)

The pattern of the cured product formed by using the imprint apparatus is permanently used for at least a part of various articles or temporarily when various articles are manufactured. The article is an electric circuit element, an optical element, a MMS, a recording element, a sensor, or a mold. Examples of the electric circuit element include volatile or non-volatile semiconductor memories such as RDAS, SRMA, flash memory, and MRA; As a formwork, the mold for imprints, etc. are mentioned.

The pattern of the cured product is used as it is as a constituent member of at least a part of the article, or is temporarily used as a resist mask. After etching or ion implantation is performed in the processing step of the substrate, the resist mask is removed.

Next, a specific manufacturing method of the article will be described. As shown in Fig. 5A, a substrate 1z such as a silicon wafer on which a material to be processed such as an insulator 2z is formed on the surface is prepared, and then, an imprint material is printed on the surface of the material 2z by an inkjet method or the like. (3z) is given. Here, the pattern in which the imprint material 3z which became several droplet-shaped was provided on the board|substrate is shown.

As shown in Fig. 5B, the imprinting die 4z is made to face the imprint material 3z on the substrate with the side on which the concave-convex pattern is formed. As shown in Fig. 5C, the substrate 1 to which the imprint material 3z has been applied is brought into contact with the mold 4z, and a pressure is applied thereto. The imprint material 3z is filled in the gap between the formwork 4z and the material to be processed 2z. In this state, when light as energy for curing is irradiated by irradiating the mold 4z, the imprint material 3z is cured.

As shown in Fig. 5D, after curing the imprint material 3z, when the mold 4z and the substrate 1z are separated, a pattern of the cured product of the imprint material 3z is formed on the substrate 1z. As for the pattern of this cured product, the concave portion of the formwork has a shape corresponding to the convex portion of the cured product, and the concave portion of the die has a shape corresponding to the convex portion of the cured product. will become

As shown in Fig. 5E, when the pattern of the cured product is etched as an etching-resistant mask, a portion of the surface of the workpiece 2z without the cured product or thinly remaining is removed to form the grooves 5z. As shown in Fig. 5F, when the pattern of the cured product is removed, an article having grooves 5z formed on the surface of the material to be processed 2z can be obtained. Although the pattern of the cured product is removed here, it may be used as an interlayer insulating film included in, for example, a semiconductor device, for example, as a constituent member of an article without removing the pattern even after processing.

Although the present invention has been described with reference to embodiments, it will be understood that the invention is not limited to the embodiments disclosed above. The scope of the following claims should be construed broadly to include all modifications and equivalent structures and functions.

Claims (12)

An imprint apparatus for forming a composition on a substrate using a formwork, comprising:
and a formwork holding part for holding the formwork,
The formwork is
A form in which a patterned thin plate portion and a support portion having a larger outer shape than that of the thin plate portion on the patterned surface of the thin plate portion are joined,
Around the thin plate part joined to the support part, a member different from the thin plate part is arranged on the surface of the support part,
a hole or groove communicating with the space between the thin plate portion and the member;
The imprint apparatus according to claim 1, wherein said formwork holding portion has a pipe for supplying a gas to said space in said hole or groove of said formwork held in said formwork holding portion.
The method of claim 1,
The member is a periphery of the thin plate portion and is disposed so as to sandwich the thin plate portion on a surface of the support portion.
The method of claim 1,
The thin plate portion is formed with a pattern portion on which the pattern is formed, and a pattern outer peripheral portion surrounding the pattern portion with respect to the surface on which the pattern is formed,
The height of the surface of the outer peripheral portion of the pattern is lower than the height of the surface of the pattern portion,
The height of the surface of the member is between the surface of the pattern outer periphery and the surface of the pattern portion.
4. The method of claim 3,
The surface of the member is the same height as the height of the surface of the pattern outer peripheral portion of the thin plate portion imprint apparatus.
4. The method of claim 3,
The imprint apparatus according to claim 1, wherein an opening having an outer shape larger than the area of the pattern section and smaller than the outer shape of the thin plate section is formed in the support section, and a cavity provided in the mold is formed from the opening and the thin plate section.
The method of claim 1,
The imprint apparatus, characterized in that the width of the space between the thin plate portion and the member is 1 mm or less.
The method of claim 1,
The imprint apparatus according to claim 1, wherein the formwork has a hole or a groove which communicates with the space between the thin plate portion and the member.
The method of claim 1,
The imprint apparatus according to claim 1, wherein a plurality of the members are arranged around the thin plate part and on the surface of the support part in the formwork so that a gap is formed between the members and the members.
The method of claim 1,
The surface height of the member is lower than the surface height of the pattern formed on the thin plate portion imprint apparatus.
The method of claim 1,
The gas supplied from the pipe includes an inert gas.
The method of claim 1,
and a conveying hand for supporting the member of the formwork,
and a formwork conveying device for conveying the formwork.
A step of forming a pattern of an imprint material on the substrate using the imprint apparatus according to any one of claims 1 to 11;
A method of manufacturing an article, comprising a processing step of processing a substrate on which a pattern is formed by the above step, and manufacturing an article from the substrate processed by the processing step.

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