JP2018137360A - Imprint device and article manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an advantageous technique for deforming a mold to a target shape.SOLUTION: An imprint device forms a pattern on a substrate by bringing an imprint material on the substrate into contact with a mold and curing the imprint material. The imprint device includes a mold holding unit that holds the mold by adsorption, a measuring unit that detects position information of the mold held by the mold holding unit, a deforming mechanism that deforms the mold held by the mold holding unit, and a control unit that controls adsorption of the mold by the mold holding unit based on an output of the measuring unit.SELECTED DRAWING: Figure 2

Description

  The present invention relates to an imprint apparatus and an article manufacturing method.

  As a lithographic apparatus, a pattern of a mold is transferred to an imprint material by curing the imprint material in a state where the imprint material disposed on the substrate is in contact with the mold (also referred to as a mold or a template). An imprint apparatus that attracts attention is attracting attention. The imprint apparatus is superior in that the structure is simple compared to a conventional projection exposure apparatus.

  The imprint apparatus and the projection exposure apparatus are fundamentally different in the method for reducing the overlay error between the shot area of the substrate and the original. In the projection exposure apparatus, the overlay error can be reduced by adjusting the projection optical system or adjusting the scanning speed of the substrate and the original. On the other hand, in the imprint apparatus, since the imprint material is cured in a state where the original plate is in contact with the imprint material on the substrate, in order to reduce an overlay error, the shape of the substrate and / or the original plate is changed. There is a need. As a method for changing the shape of the substrate and / or the original plate, a method of applying a compressive force or heat to the substrate and / or the original plate can be considered. Patent Document 1 describes that a template is deformed by applying a force to the template (original).

Special table 2007-535121 gazette

  In the method of deforming a mold by applying a compressive force to the mold while the chuck is adsorbed by vacuum chucking, etc., the mold includes a space between the mold and the chuck (suction surface) in addition to the compressive force. The frictional force generated by is added. This frictional force can be an obstacle when the mold is deformed to the target shape by the compressive force. On the other hand, if the mold is deformed by a compressive force without adsorbing the mold by the chuck, the mold is bent by its own weight, which may cause distortion of the pattern.

  The present invention has been made with the above problem recognition as an opportunity, and an object thereof is to provide an advantageous technique for deforming a mold into a target shape.

  One aspect of the present invention relates to an imprint apparatus that forms a pattern on the substrate by bringing the imprint material on the substrate into contact with a mold and curing the imprint material. A mold holding unit that holds the mold by suction, a measurement unit that measures position information of the mold held by the mold holding unit, and a deformation mechanism that deforms the mold held by the mold holding unit, And a control unit that controls adsorption of the mold by the mold holding unit based on an output of the measurement unit.

  According to the present invention, an advantageous technique for deforming a mold into a target shape is provided.

The figure which shows the structure of the imprint apparatus of one Embodiment of this invention. The figure which shows the structure for controlling the details of the structure arrange | positioned at a mold holding part and its periphery, and the adsorption | suction of the mold | type by a mold holding part. The figure which shows typically the force added to a type | mold. The figure which shows operation | movement of the imprint apparatus of one Embodiment of this invention. The figure which illustrates the characteristic (suction pressure-position information) of a type. The figure which shows an article manufacturing method.

  Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

  FIG. 1 shows the configuration of an imprint apparatus IMP according to one embodiment of the present invention. The imprint apparatus IMP forms a pattern on the substrate 120 by bringing the imprint material IM on the substrate 120 into contact with the mold 30 and curing the imprint material IM. The imprint material IM is cured by applying energy for curing to the imprint material IM. When the imprint material IM is cured, a pattern of a cured product to which the uneven pattern of the mold 30 is transferred is formed.

  As the imprint material, a curable composition (which may be referred to as an uncured resin) that cures when energy for curing is applied is used. As the energy for curing, electromagnetic waves, heat, or the like can be used. The electromagnetic wave can be, for example, light having a wavelength selected from a range of 10 nm to 1 mm, for example, infrared rays, visible rays, ultraviolet rays, and the like. The curable composition may be a composition that is cured by light irradiation or by heating. Among these, the photocurable composition that is cured by light irradiation contains at least a polymerizable compound and a photopolymerization initiator, and may further contain a non-polymerizable compound or a solvent as necessary. The non-polymerizable compound is at least one selected from the group consisting of a sensitizer, a hydrogen donor, an internal release agent, a surfactant, an antioxidant, and a polymer component. The imprint material can be disposed on the substrate in the form of droplets or in the form of islands or films formed by connecting a plurality of droplets. The viscosity of the imprint material (viscosity at 25 ° C.) can be, for example, 1 mPa · s or more and 100 mPa · s or less. As the material of the substrate, for example, glass, ceramics, metal, semiconductor, resin, or the like can be used. If necessary, a member made of a material different from the substrate may be provided on the surface of the substrate. The substrate is, for example, a silicon wafer, a compound semiconductor wafer, or quartz glass.

  In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which a direction parallel to the surface of the substrate 120 is an XY plane. In the XYZ coordinate system, the directions parallel to the X, Y, and Z axes are the X, Y, and Z directions, respectively, and rotation around the X axis, rotation around the Y axis, and rotation around the Z axis are θX and θY, respectively. , ΘZ. The control or drive related to the X axis, Y axis, and Z axis means control or drive related to the direction parallel to the X axis, the direction parallel to the Y axis, and the direction parallel to the Z axis, respectively. The control or drive related to the θX axis, θY axis, and θZ axis relates to rotation around an axis parallel to the X axis, rotation around an axis parallel to the Y axis, and rotation around an axis parallel to the Z axis. Means control or drive. The position is information that can be specified based on the coordinates of the X axis, the Y axis, and the Z axis, and the posture is information that can be specified by the values of the θX axis, the θY axis, and the θZ axis. Positioning means controlling position and / or attitude. Alignment may include control of the position and / or attitude of at least one of the substrate 120 and the mold 30, and control of the shape of at least one of the substrate 120 and the mold 30.

  The imprint apparatus IMP may include a substrate holding unit 130 that holds the substrate 120, a substrate driving mechanism 135 that drives the substrate 120 by driving the substrate holding unit 130, and a support base 150 that supports the substrate driving mechanism 135. The imprint apparatus IMP includes a mold holding unit 10 that holds the mold 30, a mold driving mechanism 20 that drives the mold 30 by driving the mold holding unit 10, and a support structure 140 that supports the mold driving mechanism 20. sell. The substrate drive mechanism 135 and the mold drive mechanism 20 constitute a drive mechanism that drives at least one of the substrate 120 and the mold 30 so that the relative position between the substrate 120 and the mold 30 is adjusted. The adjustment of the relative position by the drive mechanism is performed by contacting the mold 30 (pattern portion thereof) with the imprint material IM on the substrate 120 and the pattern of the mold 30 (pattern of the cured product) from the cured imprint material (pattern of the cured product). Including a drive for separation of part). The substrate drive mechanism 135 moves the substrate 120 into a plurality of axes (for example, three axes of X axis, Y axis, and θZ axis, preferably six axes of X axis, Y axis, Z axis, θX axis, θY axis, and θZ axis). ). The mold drive mechanism 20 includes a mold 30 having a plurality of axes (for example, three axes of Z axis, θX axis, and θY axis, preferably six axes of X axis, Y axis, Z axis, θX axis, θY axis, and θZ axis). ).

  The imprint apparatus IMP may include a deformation mechanism 40 that deforms the mold 30 held by the mold holding unit 10. The deformation mechanism 40 can be configured to deform the mold 30 by applying a force to the side surface of the mold 30. Further, the imprint apparatus IMP may include a dispenser (supply unit) 160 that supplies and arranges the imprint material IM on the substrate 120. For example, the dispenser 160 discharges the imprint material IM in a state where the substrate 120 is driven by the substrate drive mechanism 135, so that the imprint material is formed on a region (for example, a shot region) on the substrate 120 where the pattern is to be formed. May be configured to deploy IM. Further, the imprint apparatus IMP cures the imprint material IM by supplying energy for curing to the imprint material IM in a state where the pattern 30 of the mold 30 is in contact with the imprint material IM on the substrate 120. The hardening part 180 to be made can be provided. In the following description, it is assumed that the energy for curing the imprint material IM is light energy such as ultraviolet rays. The imprint apparatus IMP may further include a scope 190 for detecting a relative position between the mark on the substrate 120 and the mark on the mold 30.

  Further, the imprint apparatus IMP may include a control unit 80 that controls the substrate holding unit 130, the substrate driving mechanism 135, the mold holding unit 10, the mold driving mechanism 20, the dispenser 160, the curing unit 180, and the scope 190. The control unit 80 is, for example, PLD (abbreviation of Programmable Logic Device) such as FPGA (abbreviation of Field Programmable Gate Array), or ASIC (abbreviation of Application Specific Integrated Circuit). It can be constituted by a computer or a combination of all or part of them.

  FIG. 2A shows details of the mold holding unit 10 and the structure disposed around it, and a configuration for controlling the adsorption of the mold 30 by the mold holding unit 10. The part enclosed by the dotted line in Fig.2 (a) is sectional drawing. FIG. 2B shows a state where the mold holding unit 10 is viewed from below. The mold 30 can be made of a material that transmits light energy such as ultraviolet rays as energy for curing the imprint material IM, for example, quartz. The mold 30 includes a first surface 31 and a second surface 32 that are opposite to each other, and a side surface 34 that connects the edge of the first surface 31 and the edge of the second surface 32. The first surface 31 is provided with a mesa portion 33 having a pattern portion on which a pattern to be transferred to the imprint material IM or the substrate 120 is formed. A cavity (concave portion) 35 is provided on the second surface 32. The edge of the first surface 31 and the edge of the second surface 32 may have a rectangular shape. The mesa portion 33 may also have a rectangular shape.

  The mold holding unit 10 can be configured to hold the mold 30 by suction. The mold holding unit 10 may be configured to suck the mold 30 by vacuum suction, but the mold holding unit 10 may be configured to suck the mold 30 by other suction methods such as electrostatic suction. Good. Of the mold holding unit 10, at least the optical path through which the light energy from the curing unit 180 should pass is made of a material that transmits the light energy.

  The mold holding unit 10 can be configured to suck the second surface 32 of the mold 30 (a region outside the cavity 35). The mold holding unit 10 may have a protrusion 12 having a contact surface that contacts a part of the second surface 32 of the mold 30 and supports the second surface 32. The protrusion 12 can be provided with a groove 14 for vacuum-sucking the mold 30. The protrusion 12 and the groove 14 may have a ring shape. A suction path 15 communicates with the groove 14. The suction path 15 is connected to a vacuum source 71 via a servo valve 51 for pressure adjustment. That is, the groove 14 is connected to the vacuum source 71 via the suction path 15 and the servo valve 51. The pressure in the groove 14 is detected by the pressure sensor 61, and the control unit 80 adjusts the pressure (vacuum pressure) for adsorbing the mold 30 by adjusting the servo valve 51 based on the output of the pressure sensor 61. Can do.

  The mold holding unit 10 includes a pressure adjustment path 16 for adjusting the pressure of the cavity 35 of the mold 10. The pressure adjustment path 16 is connected to a vacuum source 71 and a pressure source 72 via a servo valve 52 for pressure adjustment. The pressure of the pressure adjustment path 16 is detected by the pressure sensor 62, and the control unit 80 can adjust the pressure of the cavity 35 of the mold 30 by adjusting the servo valve 52 based on the output of the pressure sensor 62. . The servo valve 52 and the pressure sensor 52 constitute a pressure adjustment unit PR.

  Before the contact between the imprint material IM on the substrate 120 and the mold 30 starts, the pressure adjusting unit PR is configured so that the mold 30 swells toward the substrate 120 (to have a convex shape downward). ), Applying cavity pressure to the mold 30. As a result, the mesa portion 33 (pattern portion) also swells toward the substrate 120 side. Moreover, the pressure adjustment part PR gradually decreases the cavity pressure after the start of the contact. As a result, the mesa portion 33 (pattern portion) gradually becomes flat. By such an operation, after the central portion of the mesa portion 33 (pattern portion) contacts the imprint material IM, the contact area between the mesa portion 33 and the imprint material IM is gradually increased, and finally the mesa portion 33. Can be brought into contact with the imprint material IM.

  The imprint apparatus IMP may include a measurement unit 100 and an amplifier 90 that detect position information of the mold 30 held by the mold holding unit 10. The position information of the mold 30 can be detected with respect to a direction (Z-axis direction) orthogonal to the contact surface where the mold holding unit 10 contacts the mold 30. Further, the position information of the mold 30 can be detected as a distance between a predetermined reference position and a detection target portion of the mold 30. The output of the measurement unit 100 is amplified by the amplifier 90 and provided to the control unit 80. The amplifier 90 may be incorporated in the measurement unit 100. The control unit 80 can recognize the position of the mold 30 (the distance between the mold holding unit 10 (reference position) and the mold 30) based on the output of the measurement unit 100. The control unit 80 can be configured to control the mold drive mechanism 20, the deformation mechanism 40, and the servo valves 51 and 52 based on the outputs of the pressure sensors 61 and 62 and the measurement unit 100.

  The measuring unit 100 can be configured to detect the amount of displacement of the mold 30 as position information of the mold 30. The displacement amount can be detected as a change in the distance between the predetermined reference position and the detection target portion of the mold 30. The measuring unit 100 can be, for example, an interferometer, an eddy current sensor (when the surface of the mold 30 has conductivity), an electric micrometer, or an air sensor.

  The number of measuring units 100 may be one or plural. When a plurality of measuring units 100 are provided, the position information of the mold 30 can be obtained by processing the outputs of the plurality of measuring units 100. For example, the suction force of the mold 30 is controlled based on the calculation result of the average value of each output. Moreover, you may obtain | require the deformation | transformation and inclination of the type | mold 30 by calculating the difference of each output. The measurement part 100 may be arrange | positioned on the outer side of the protrusion part 12, may be arrange | positioned in the groove | channel 14, and may be arrange | positioned in another position.

  FIG. 3 schematically shows the force applied to the mold 30. Gravity Fg can be applied to the mold 30. The mold 30 can be applied with a suction force Fv by depressurizing the groove 14 of the mold holding unit 10. Further, a cavity pressure Fc can be applied to the mold 30 by the pressure adjusting unit PR. Further, a force Ef can be applied to the mold 30 by the deformation mechanism 40.

  FIG. 4 exemplarily shows the operation of the imprint apparatus IMP. This operation can be controlled by the control unit 80. First, in step S <b> 100, the mold 30 is transported to the mold holding unit 10 by a mold transport mechanism (not shown) and is held by suction by the mold holding unit 10. Here, the control unit 80 controls the servo valve 51 to reduce the pressure in the groove 14 to the first pressure sufficiently lower than the atmospheric pressure. Thereby, the first suction force Fv1 is applied to the mold 30 as the suction force Fv. Here, the force Ef is applied to the mold 30 so that the mold 30 is sandwiched by the mold deformation mechanism 40 at a stage before the pressure of the groove 14 (hereinafter referred to as suction pressure) is reduced to the first pressure (hereinafter referred to as first suction pressure). The mold 30 may be positioned by adding.

  In step S101, the thickness of the mold 30 can be measured by a thickness meter (not shown). In step 101, the measurement result of the thickness of the mold 30 made outside the imprint apparatus IMP may be acquired. In step S102, the characteristics of the mold 30 are measured. The characteristic of the mold 30 is, for example, a curve indicating the relationship between the suction pressure measured by the pressure gauge 61 and the position information (for example, the amount of displacement of the mold 30) of the mold 30 measured by the measuring unit 100. 5 is exemplified. The characteristics of the mold 30 can be obtained by measuring the suction pressure by the pressure sensor 61 and measuring the position information of the mold 30 by the measurement unit 100 while changing the suction pressure by controlling the servo valve 51. In order to prevent the mold 30 from falling, the characteristics of the mold 30 can be measured in a state where the hand of the mold transport mechanism is disposed below the mold 30.

  In the curve indicating the characteristics of the mold 30, the suction pressure (pressure of the groove 14) and the position information of the mold 30 are linear in the range from the vacuum pressure to a certain pressure. This linearity can be determined by the rigidity of the mold 30 and the rigidity of the protrusion 12 of the mold holding part 10. The point where the amount of deviation of the curve from the linearity reaches a predetermined amount can be called an inflection point.

  In step S <b> 103, the control unit 80 determines a target position of the mold 30 to be maintained when the mold 30 is deformed by the deformation mechanism 40 based on the characteristics of the mold 30. As an example, the position indicated by the position information of the mold 30 at the inflection point can be determined as the target position. The target position can be determined so as to be the position of the mold 30 in a state in which the mold holding unit 10 holds the mold 30 with a suction force that does not excessively restrain the mold 30. In one example, the target position may be determined such that the suction force acting on the mold 30 is within a range that is greater than the gravity Fg acting on the mold 30 but smaller than the force that deforms the protrusion 12. In step S104, the controller 80 controls the servo valve 51 to set the suction pressure to the first suction pressure.

  In step S <b> 105, the substrate 120 is transferred to the substrate holding unit 130 by the substrate transfer mechanism (not shown), and is held by suction by the substrate holding unit 130. In step S106, the thickness of the substrate 120 can be measured by a thickness meter (not shown). In step S106, the measurement result of the thickness of the substrate 120 made outside the imprint apparatus IMP may be acquired. In step S107, the control unit 180 makes contact between the imprint material IM on the substrate 120 and the die 30 (the mesa portion 33) based on the thickness of the die 30 and the substrate 120 measured in steps S101 and S106. The relative position between the substrate 120 and the mold 30 is determined. For example, when the mold 30 is brought into contact with the imprint material IM on the substrate 120 while driving the mold 30 in the Z-axis direction by the mold driving mechanism 20, the height of the mold 30 at the time of contact is determined as the relative position. Can be done.

  In step S <b> 108, the imprint material IM is placed by the dispenser 160 on the shot area of the substrate 120 on which the pattern is to be formed. In step S109, the cavity pressure Fc is adjusted by the pressure adjustment unit PR so that the mold 30 swells toward the substrate 120 side. This adjustment can be made, for example, by controlling the servo valve 52 while measuring the cavity pressure by the pressure sensor 62. In step S110, at least one of the substrate driving mechanism 135 and the mold driving mechanism 20 is controlled so that the mold 30 comes into contact with the imprint material IM on the shot region of the substrate 120 on which a pattern is to be formed. This control can be performed based on the relative position determined in step S107.

  In step S111, the control unit 80 starts position control of the mold 30. In the position control, during the period in which the deformation mechanism 40 deforms the mold 30, the mold 30 is based on the output value of the measuring unit 100 so that the position of the mold 30 is maintained within the allowable range of the target position determined in step S103. The suction force of the mold 30 by the holding unit 10 is controlled. The control of the suction force of the mold 30 by the mold holding unit 10 can be performed by the control unit 80 controlling the servo valve 51. In step 112, the cavity pressure Fc is reduced by the pressure adjusting unit PR, and the mesa unit 33 (pattern unit) becomes flat. As a result, the entire mesa portion 33 (pattern portion) comes into contact with the imprint material IM.

  In step S113, the alignment of the shot region and the mold 30 is performed while the relative scope between the mark of the shot region to be patterned on the substrate 120 and the mark of the mold 30 is detected by the alignment scope 190. This alignment includes the deformation of the mold 30 by the deformation mechanism 40 in addition to the control of the position and / or posture of at least one of the substrate 120 and the mold 30. The deformation of the mold 30 by the deformation mechanism 40 is performed in a state where position control of the mold 30 (control for maintaining the position of the mold 30 at the target position determined in step S103) is performed. Therefore, the mold 30 is deformed by the deformation mechanism 40 without being excessively restrained by the mold holding unit 30. Therefore, the mold 30 can be targeted with higher accuracy than when the mold 30 is deformed by the deformation mechanism 40 in a state where the mold 30 is excessively restrained by the mold holding unit 30 (for example, the first suction pressure or the maximum suction pressure). It can be transformed into a shape. In parallel with the alignment, the imprint material IM is filled in the concave portions constituting the pattern portion of the mold 30.

  In step S <b> 114, the imprint material IM between the substrate 120 and the mold 30 is cured by the curing unit 180. In step S115, the control unit 80 ends the position control of the mold 30, and sets the suction pressure to the first suction pressure by controlling the servo valve 51. This means that the suction force of the mold 30 by the mold holding unit 10 is increased. The first suction pressure is required for the mold holding unit 10 to hold the mold 30 with a force larger than the force required to separate the cured imprint material IM and the mold 30 on the substrate 120. Here, the operation of setting the suction pressure to the first suction pressure by ending the position control of the mold 30 and controlling the servo valve 51 may be performed before starting the curing (S114) or during the curing. May be made.

  In step S116, at least one of the substrate drive mechanism 135 and the mold drive mechanism 20 is controlled so that the cured imprint material IM and the mold 30 on the shot region of the pattern formation target of the substrate 120 are separated.

  In step S117, the control unit 80 determines whether or not there is a shot area (next shot area) in which a pattern is to be formed next. If there is a next shot area, the process returns to step S108 and the next shot area is determined. Steps S108 to S116 are executed. Next, in step S119, the substrate 120 is removed from the substrate holder 130 by the substrate transport mechanism (not shown).

  In step S119, the control unit 80 determines whether or not there is a substrate 120 (next substrate) on which a pattern is to be formed next. If there is a next substrate, the control unit 80 returns to step S105 to perform steps S106 to S106 for the next substrate. S118 is executed. Next, in step S120, the mold 30 is removed from the mold holding unit 10 by a mold transport mechanism (not shown).

  If the variation in the characteristics of the mold 30 is small, steps 102 and S103 can be omitted. In this case, a preset target position can be used.

  The contact surface where the mold holding unit 10 contacts the mold 30 is preferably configured so that the frictional force acting between the contact surface and the mold 30 is reduced. For example, the contact surface is preferably composed of PTFE: polytetrafluoroethylene material.

  The pattern of the cured product formed using the imprint apparatus is used permanently on at least a part of various articles or temporarily used when manufacturing various articles. The article is an electric circuit element, an optical element, a MEMS, a recording element, a sensor, or a mold. Examples of the electric circuit elements include volatile or nonvolatile semiconductor memories such as DRAM, SRAM, flash memory, and MRAM, and semiconductor elements such as LSI, CCD, image sensor, and FPGA. Examples of the mold include an imprint mold.

  The pattern of the cured product is used as it is as a constituent member of at least a part of the article or temporarily used as a resist mask. After etching or ion implantation or the like is performed in the substrate processing step, the resist mask is removed.

  Next, an article manufacturing method for manufacturing articles such as semiconductor devices will be described. As shown in FIG. 6A, a substrate 1z such as a silicon wafer on which a workpiece 2z such as an insulator is formed is prepared. Subsequently, the substrate 1z is formed on the surface of the workpiece 2z by an inkjet method or the like. A printing material 3z is applied. Here, a state is shown in which the imprint material 3z in the form of a plurality of droplets is applied on the substrate.

  As shown in FIG. 6B, the imprint mold 4z is opposed to the imprint material 3z on the substrate with the side with the concave / convex pattern formed thereon. As shown in FIG. 6C, the substrate 1 provided with the imprint material 3z is brought into contact with the mold 4z, and pressure is applied. The imprint material 3z is filled in a gap between the mold 4z and the workpiece 2z. In this state, when light is irradiated as energy for curing through the mold 4z, the imprint material 3z is cured.

  As shown in FIG. 6D, after the imprint material 3z is cured, when the mold 4z and the substrate 1z are separated, a pattern of a cured product of the imprint material 3z is formed on the substrate 1z. This cured product pattern has a shape in which the concave portion of the mold corresponds to the convex portion of the cured product, and the concave portion of the mold corresponds to the convex portion of the cured product, that is, the concave / convex pattern of the die 4z is transferred to the imprint material 3z. It will be done.

  As shown in FIG. 6 (e), when etching is performed using the pattern of the cured product as an etching resistant mask, a portion of the surface of the workpiece 2z where there is no cured product or remains thin is removed, and the grooves 5z and Become. As shown in FIG. 6F, when the pattern of the cured product is removed, an article in which the groove 5z is formed on the surface of the workpiece 2z can be obtained. Although the cured product pattern is removed here, it may be used as, for example, a film for interlayer insulation contained in a semiconductor element or the like, that is, a constituent member of an article without being removed after processing.

  As mentioned above, although preferable embodiment of this invention was described, this invention is not limited to these embodiment, A various deformation | transformation and change are possible within the range of the summary.

IMP: imprint apparatus, 10: mold holding unit, 12: protrusion, 14: groove, 15: suction path, 20: mold drive mechanism, 30: mold, 40: deformation mechanism, 80: control unit, 100: measurement unit , 120: substrate, 130: substrate holding part, 135: substrate driving mechanism, IM: imprint material

Claims (14)

An imprint apparatus for forming a pattern on the substrate by bringing the imprint material on the substrate into contact with a mold and curing the imprint material,
A mold holding unit for holding the mold by suction;
A measuring unit for detecting position information of the mold held by the mold holding unit;
A deformation mechanism for deforming the mold held by the mold holding unit;
A control unit for controlling adsorption of the mold by the mold holding unit based on an output of the measurement unit;
An imprint apparatus comprising: The deformation mechanism deforms the mold by applying a force to a side surface of the mold;
The imprint apparatus according to claim 1. The mold has a first surface and a second surface opposite to each other, a mesa portion having a pattern portion is provided on the first surface, and the side surface includes an edge of the first surface and the second surface. Connect the edge,
The mold holding part has a protrusion having a contact surface that contacts a part of the second surface and supports the second surface, and the protrusion is provided with a groove for vacuum adsorbing the mold. Being
The imprint apparatus according to claim 2. The measuring unit detects position information of the mold in a direction orthogonal to the contact surface;
The imprint apparatus according to claim 3. The control unit holds the mold based on the output of the measurement unit so that the position indicated by the position information of the mold is maintained within an allowable range of a target position during a period in which the deformation mechanism deforms the mold. Controlling the suction force of the mold by the part,
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. The control unit executes measurement for determining the target position;
The imprint apparatus according to claim 5. The control unit determines the target position based on characteristics indicating a relationship between the mold suction force by the mold holding unit and position information of the mold detected by the measurement unit.
The imprint apparatus according to claim 6. The control unit determines the target position based on an inflection point in a curve indicating the relationship.
The imprint apparatus according to claim 7. The control unit performs the measurement after the mold is held by the mold holding unit and before the process of forming a pattern on the substrate.
The imprint apparatus according to claim 6, wherein the imprint apparatus is any one of claims 6 to 8. Pressure adjustment that applies pressure to the mold so that the mold swells toward the substrate before the contact between the imprint material on the substrate and the mold, and reduces the pressure after the contact starts Further comprising
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. The deformation mechanism is configured so that the imprint material on the substrate and the mold are in contact with each other, and the mold holding unit is controlled by the mold holding unit based on the output of the measurement unit. Deforming the mold so that it is aligned with the mold;
The imprint apparatus according to claim 1, wherein the imprint apparatus is any one of claims 1 to 10. The control unit finishes the mold adsorption control by the mold holding unit based on the output of the measurement unit before the cured imprint material on the substrate and the mold are separated, and the mold Increasing the suction force of the mold by the holding part,
The imprint apparatus according to claim 1, wherein the imprint apparatus is any one of claims 1 to 11. The measurement unit detects displacement of the mold as the position information.
The imprint apparatus according to claim 1, wherein the apparatus is an imprint apparatus. Forming a pattern on a substrate by the imprint apparatus according to claim 1;
Processing the substrate on which the pattern is formed in the step;
An article manufacturing method comprising:

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