KR102272069B1 - 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Download PDF

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Publication number
KR102272069B1
KR102272069B1 KR1020180024181A KR20180024181A KR102272069B1 KR 102272069 B1 KR102272069 B1 KR 102272069B1 KR 1020180024181 A KR1020180024181 A KR 1020180024181A KR 20180024181 A KR20180024181 A KR 20180024181A KR 102272069 B1 KR102272069 B1 KR 102272069B1
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KR
South Korea
Prior art keywords
substrate
imprint
composition
curing
mold
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Expired - Fee Related
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KR1020180024181A
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English (en)
Korean (ko)
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KR20180101217A (ko
Inventor
유지 사카타
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캐논 가부시끼가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/7035—Proximity or contact printers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
    • B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
    • B29C35/08—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould by wave energy or particle radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/002—Component parts, details or accessories; Auxiliary operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
    • B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
    • B29C59/026—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing of layered or coated substantially flat surfaces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
    • G03F7/70605—Workpiece metrology
    • G03F7/70616—Monitoring the printed patterns
    • G03F7/7065—Defects, e.g. optical inspection of patterned layer for defects
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70733—Handling masks and workpieces, e.g. exchange of workpiece or mask, transport of workpiece or mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70758—Drive means, e.g. actuators, motors for long- or short-stroke modules or fine or coarse driving
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2031/00—Other particular articles
    • B29L2031/34—Electrical apparatus, e.g. sparking plugs or parts thereof
    • B29L2031/3406—Components, e.g. resistors

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Toxicology (AREA)
  • Oral & Maxillofacial Surgery (AREA)
  • Thermal Sciences (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020180024181A 2017-03-03 2018-02-28 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Expired - Fee Related KR102272069B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2017-040920 2017-03-03
JP2017040920A JP6942487B2 (ja) 2017-03-03 2017-03-03 インプリント装置、インプリント方法、および物品製造方法

Publications (2)

Publication Number Publication Date
KR20180101217A KR20180101217A (ko) 2018-09-12
KR102272069B1 true KR102272069B1 (ko) 2021-07-05

Family

ID=63355407

Family Applications (1)

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KR1020180024181A Expired - Fee Related KR102272069B1 (ko) 2017-03-03 2018-02-28 임프린트 장치, 임프린트 방법, 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US10871710B2 (https=)
JP (1) JP6942487B2 (https=)
KR (1) KR102272069B1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12105417B2 (en) 2021-10-05 2024-10-01 Canon Kabushiki Kaisha Method of forming a photo-cured layer
US20230197462A1 (en) * 2021-12-21 2023-06-22 Canon Kabushiki Kaisha Method for inhibiting formable material evaporation, system for inhibiting evaporation, and method of making an article
TW202404789A (zh) * 2022-05-30 2024-02-01 日商佳能股份有限公司 成型設備、成型方法及物品製造方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009083172A (ja) 2007-09-28 2009-04-23 Hitachi Ltd 光インプリント方法
US20120141659A1 (en) 2010-12-02 2012-06-07 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method
JP2015231036A (ja) 2014-06-06 2015-12-21 キヤノン株式会社 リソグラフィ装置、および物品製造方法
WO2016120944A1 (en) 2015-01-30 2016-08-04 Canon Kabushiki Kaisha Adhesion layer-forming composition, method of manufacturing cured product pattern, method of manufacturing optical component, method of manufacturing circuit board, method of manufacturing imprinting mold, and device component
JP2016146468A (ja) * 2015-01-30 2016-08-12 キヤノン株式会社 密着層形成組成物、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、インプリント用モールドの製造方法、およびデバイス部品
JP2016149510A (ja) 2015-02-13 2016-08-18 キヤノン株式会社 インプリント装置及び物品の製造方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5065101B2 (ja) * 2008-03-05 2012-10-31 東洋合成工業株式会社 パターン形成方法
US20130126472A1 (en) * 2010-06-11 2013-05-23 Hoya Corporation Substrate with adhesion promoting layer, method for producing mold, and method for producing master mold
JP5827180B2 (ja) 2012-06-18 2015-12-02 富士フイルム株式会社 インプリント用硬化性組成物と基板の密着用組成物およびこれを用いた半導体デバイス
JP2015038579A (ja) * 2013-08-19 2015-02-26 ソニー株式会社 光学素子、光学系、撮像装置、光学機器、ならびに原盤およびその製造方法
JP2016164977A (ja) 2015-02-27 2016-09-08 キヤノン株式会社 ナノインプリント用液体材料、ナノインプリント用液体材料の製造方法、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、および電子部品の製造方法
US10578965B2 (en) * 2016-03-31 2020-03-03 Canon Kabushiki Kaisha Pattern forming method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009083172A (ja) 2007-09-28 2009-04-23 Hitachi Ltd 光インプリント方法
US20120141659A1 (en) 2010-12-02 2012-06-07 Canon Kabushiki Kaisha Imprint apparatus and article manufacturing method
JP2012134466A (ja) * 2010-12-02 2012-07-12 Canon Inc インプリント装置、及びそれを用いた物品の製造方法
JP2015231036A (ja) 2014-06-06 2015-12-21 キヤノン株式会社 リソグラフィ装置、および物品製造方法
WO2016120944A1 (en) 2015-01-30 2016-08-04 Canon Kabushiki Kaisha Adhesion layer-forming composition, method of manufacturing cured product pattern, method of manufacturing optical component, method of manufacturing circuit board, method of manufacturing imprinting mold, and device component
JP2016146468A (ja) * 2015-01-30 2016-08-12 キヤノン株式会社 密着層形成組成物、硬化物パターンの製造方法、光学部品の製造方法、回路基板の製造方法、インプリント用モールドの製造方法、およびデバイス部品
JP2016149510A (ja) 2015-02-13 2016-08-18 キヤノン株式会社 インプリント装置及び物品の製造方法
US20160236381A1 (en) 2015-02-13 2016-08-18 Canon Kabushiki Kaisha Imprint apparatus and method of manufacturing article

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Publication number Publication date
JP2018148001A (ja) 2018-09-20
US20180253001A1 (en) 2018-09-06
KR20180101217A (ko) 2018-09-12
US10871710B2 (en) 2020-12-22
JP6942487B2 (ja) 2021-09-29

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